CN117601287A - Quick clamping jig for groove cutting of quartz silicon wafer carrier - Google Patents
Quick clamping jig for groove cutting of quartz silicon wafer carrier Download PDFInfo
- Publication number
- CN117601287A CN117601287A CN202311433850.6A CN202311433850A CN117601287A CN 117601287 A CN117601287 A CN 117601287A CN 202311433850 A CN202311433850 A CN 202311433850A CN 117601287 A CN117601287 A CN 117601287A
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- China
- Prior art keywords
- groove
- clamping
- plate
- positioning
- wafer carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 50
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 50
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 47
- 239000010703 silicon Substances 0.000 title claims abstract description 47
- 238000005520 cutting process Methods 0.000 title claims abstract description 19
- 230000003139 buffering effect Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a quick clamping jig for groove cutting of a quartz silicon wafer carrier, and aims to solve the defects of inconvenient machining and positioning of groove teeth of the quartz silicon wafer carrier and low working efficiency. The invention comprises a base and a vertical plate arranged on the base, wherein the quartz silicon wafer carrier comprises a side plate, an upper ditch plate and a lower ditch plate which are arranged on the side plate, a groove is arranged on the side plate, and a lug matched with the groove is arranged on the vertical plate; an upper ditch plate positioning assembly and a lower ditch plate positioning assembly are arranged on the base, the upper ditch plate positioning assembly comprises a positioning clamping strip, and the side edge of the upper ditch plate is abutted against the side edge of the positioning clamping strip; the lower ditch plate positioning assembly comprises two clamping strips, a clamping groove is formed between the two clamping strips, and the clamping groove clamps and positions the lower ditch plate. The quartz silicon wafer carrier is fixed on the jig for grooving, so that accurate machining of groove teeth is completed, and the production efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a quick clamping jig for groove cutting of a quartz silicon wafer carrier.
Background
The quartz silicon wafer carrier is used for loading the quartz silicon wafer, a plurality of groove teeth are arranged on the quartz silicon wafer carrier, and the groove teeth are used for loading and positioning the quartz silicon wafer, so that groove cutting operation is needed in the processing process of the quartz silicon wafer carrier. The product is fixed by using a wax sticking mode, the time for melting and adjusting the wax and solidifying is long, and the time for waiting about 60 minutes before and after the solidification is needed, so that the production efficiency is low.
Disclosure of Invention
In order to overcome the defects, the invention provides the quick clamping jig for the groove cutting of the quartz silicon wafer carrier, the quartz silicon wafer carrier is fixed on the jig for groove cutting, the accurate machining of groove teeth is completed, and the production efficiency is greatly improved.
In order to solve the technical problems, the invention adopts the following technical scheme: the quick clamping jig for groove cutting of the quartz silicon wafer carrier comprises a base and a vertical plate arranged on the base, wherein the quartz silicon wafer carrier comprises a side plate, an upper groove plate and a lower groove plate which are arranged on the side plate, a groove is arranged on the side plate, and a lug matched with the groove is arranged on the vertical plate; an upper ditch plate positioning assembly and a lower ditch plate positioning assembly are arranged on the base, the upper ditch plate positioning assembly comprises a positioning clamping strip, and the side edge of the upper ditch plate is abutted against the side edge of the positioning clamping strip; the lower ditch plate positioning assembly comprises two clamping strips, a clamping groove is formed between the two clamping strips, and the clamping groove clamps and positions the lower ditch plate.
When the quartz silicon wafer carrier is subjected to groove tooth processing, the whole quartz silicon wafer carrier is firstly mounted on the clamping jig, the side plates of the quartz silicon wafer carrier are close to the vertical plates, and the bumps on the vertical plates and the grooves on the side plates are correspondingly inserted to realize accurate positioning of the quartz silicon wafer carrier. The side edge of the upper groove plate on the quartz silicon wafer carrier is leaned against the side edge of the positioning clamping strip, and the lower groove plate is clamped in the clamping groove between the two clamping strips, so that the reliable positioning of the whole quartz silicon wafer carrier is realized. And then fixing the whole clamping jig on a machine tool to process the fluted teeth.
The quartz silicon wafer carrier is fixed on the jig for grooving, so that accurate machining of groove teeth is completed, and the production efficiency is greatly improved.
Preferably, the positioning clamping strip is of an L-shaped structure.
The L-shaped positioning clamping strip is convenient to install.
Preferably, the base is provided with cushion blocks corresponding to the positioning clamping strips, the positioning clamping strips are provided with a plurality of strip-shaped mounting holes, and fastening screws are connected between the mounting holes and the cushion blocks.
The installation of locating card strip has been made things convenient for in the setting of cushion. And the mounting hole is rectangular structure, is convenient for adjust the mounted position of location card strip, ensures that go up the ditch board and can lean on together with the location card strip and realize reliable location.
Preferably, the upper surface of the clamping strip is obliquely arranged in a direction away from the clamping groove.
The upper surface of the clamping strip is obliquely arranged, so that interference phenomenon between the upper surface of the clamping strip and a cutter is avoided when the lower groove plate is subjected to groove tooth processing, and the quick discharge of chips is facilitated.
Preferably, the clamping strip is provided with a waist round hole, and a locking screw is connected between the waist round hole and the base.
The waist round hole is arranged to be convenient for adjust the mounting position of the clamping strip, so that the width of the clamping groove is adjusted to adapt to the clamping of the lower ditch plate with different widths.
Preferably, the vertical plate is detachably connected with a mounting bar, and the protruding block is arranged on the mounting bar.
The lug is arranged on the mounting strip, so that the mounting strip is convenient to detach and replace.
Preferably, the upper side and the lower side of the mounting strip on the vertical plate are respectively provided with a convex table surface, and the mounting strip and the convex table surfaces are respectively attached to the side plates of the quartz silicon wafer carrier.
The convex table surface is attached to the side plate, and the convex table surfaces are arranged on the upper side and the lower side of the mounting strip, so that after the convex blocks are inserted into the grooves on the side plate, the reliable positioning of the quartz silicon wafer carrier is realized.
Preferably, a plurality of magnetic supporting bars are arranged at the bottom of the base.
The supporting strip has magnetism, can be directly attracted to a machine tool, and is convenient to install and fix.
Preferably, a positioning slide block which is movably arranged is arranged on the base, an upper groove plate positioning groove and a lower groove plate positioning groove are formed in the positioning slide block, the end part of the upper groove plate is adaptively inserted into the upper groove plate positioning groove, and the end part of the lower groove plate is adaptively inserted into the lower groove plate positioning groove.
After the quartz silicon wafer carrier is loaded to the clamping jig, the positioning slide block is moved, so that the end part of the upper groove plate is adaptively inserted into the positioning groove of the upper groove plate, the end part of the lower groove plate is adaptively inserted into the positioning groove of the lower groove plate, and then the positioning slide block is locked, so that the positioning of the end parts of the upper groove plate and the lower groove plate is realized, when the upper groove plate and the lower groove plate are subjected to groove tooth processing, the positioning groove of the upper groove plate and the positioning groove of the lower groove plate are used as stress points, the stress of the upper groove plate and the stress of the lower groove plate are balanced, and the damage of the upper groove plate and the lower groove plate caused by uneven stress is avoided.
Preferably, a clamping strip of the lower ditch plate positioning assembly is movably arranged on the base, and a positioning spring is arranged between the clamping strip and the base; the clamping strip is provided with a clamping pad capable of buffering deformation, a push rod for pushing the clamping strip to move is arranged on the clamping strip, a pre-tightening spring is arranged between the push rod and the clamping strip, and a positioning sliding block is movably propped against the push rod to push the clamping pad to move so that the clamping pad is propped against the lower ditch plate.
After the lower ditch plate is clamped to the clamping groove, the clamping strip is reliably attached to the lower ditch plate under the action of the positioning spring, and the clamping strip is locked. Then, moving the positioning slide block to enable the end part of the upper ditch plate to be adaptively inserted into the positioning groove of the upper ditch plate, and enabling the end part of the lower ditch plate to be adaptively inserted into the positioning groove of the lower ditch plate; meanwhile, the positioning slide block is movably propped against the push rod to push the clamping pad to move, so that the clamping pad is propped against the lower ditch plate, and reliable clamping of the lower ditch plate is realized.
Compared with the prior art, the invention has the beneficial effects that: (1) The quartz silicon wafer carrier is fixed on the jig for grooving, so that accurate machining of groove teeth is completed, and the production efficiency is greatly improved; (2) After the quartz silicon wafer carrier is loaded to the clamping jig, the positioning slide blocks position the end parts of the upper groove plate and the lower groove plate, so that the stress of the upper groove plate and the lower groove plate is balanced, and the damage of the upper groove plate and the lower groove plate caused by uneven stress is avoided; (3) After the clamping strip clamps the lower ditch plate, the clamping pad is triggered to move when the positioning slide block moves, so that the clamping pad is propped against the lower ditch plate, and the clamping of the lower ditch plate is more reliable.
Drawings
FIG. 1 is a schematic view of the use of the present invention;
FIG. 2 is an exploded view of the present invention in use;
FIG. 3 is a schematic view of a positioning slider according to embodiment 2 of the present invention;
FIG. 4 is a top view of embodiment 2 of the present invention;
FIG. 5 is a partial cross-sectional view of embodiment 2 of the present invention;
FIG. 6 is a cross-sectional view of a clip strip of embodiment 2 of the present invention;
in the figure: 1. the base, 2, the riser, 3, the connecting plate, 4, the deep floor, 5, the curb plate, 6, the upper ditch board, 7, the lower ditch board, 8, the recess, 9, the lug, 10, the location clip strip, 11, the cushion, 12, the mounting hole, 13, the clip strip, 14, the clamping groove, 15, the waist round hole, 16, the mounting strip, 17, the boss face, 18, the sink groove, 19, the support bar, 20, the location slider, 21, the spout, 22, the slide rail, 23, the locking screw, 24, the upper ditch board constant head tank, 25, the lower ditch board constant head tank, 26, the location spring, 27, the guide rail, 28, the clamping strip, 29, the clamping pad, 30, the push rod, 31, the pretension spring, 32, the extension post, 33, the push-pull post, 34, the push block, 35, the retraction section, 36, the push-pull section, 37, the extension section, 38, and the socket.
Detailed Description
The technical scheme of the invention is further specifically described by the following specific embodiments with reference to the accompanying drawings:
example 1: the utility model provides a quartz silicon chip carrier ditch cuts uses quick clamping tool (see figure 1, figure 2), includes base 1 and setting up riser 2 on the base, and the riser lower extreme sets up connecting plate 3, sets up deep floor 4 between riser both sides and the connecting plate, and the riser passes through connecting plate fastening connection on the base. The quartz silicon wafer carrier comprises a side plate 5, two upper ditch plates 6 and two lower ditch plates 7 which are arranged on the side plate, and a groove 8 is arranged on the side plate. The vertical plate is provided with a convex block 9 which is matched with the groove; two upper ditch board locating components and two lower ditch board locating components are arranged on the base, and the two lower ditch board locating components are arranged between the two upper ditch board locating components. The upper ditch plate positioning component comprises a positioning clamping strip 10, and the side edge of the upper ditch plate is leaned against the side edge of the positioning clamping strip; the positioning clamping strip is of an L-shaped structure. The base is provided with a cushion block 11 corresponding to the positioning clamping strip, the cushion block is of a rectangular frame-shaped structure, the positioning clamping strip is provided with a plurality of strip-shaped mounting holes 12, and fastening screws are connected between the mounting holes and the cushion block. The lower ditch plate positioning assembly comprises two clamping strips 13, a clamping groove 14 is formed between the two clamping strips, and the clamping groove clamps and positions the lower ditch plate. The upper surface of the clamping strip is obliquely arranged in a direction away from the clamping groove. The clamping strip is provided with a waist round hole 15, and a locking screw is connected between the waist round hole and the base.
The vertical plate is detachably connected with a mounting strip 16, and the convex block is arranged on the mounting strip. The upper side and the lower side of the mounting strip on the vertical plate are respectively provided with a boss surface 17, and the mounting strip and the boss surfaces are respectively attached to the side plates of the quartz silicon wafer carrier. The side plate and the boss are provided with sinking grooves 18 at corresponding positions, and the mounting strip and the boss are attached to the bottom of the sinking grooves. A plurality of magnetic supporting bars 19 are arranged at the bottom of the base.
When the quartz silicon wafer carrier is subjected to groove tooth processing, the whole quartz silicon wafer carrier is firstly mounted on the clamping jig, the side plates of the quartz silicon wafer carrier are close to the vertical plates, and the bumps on the vertical plates and the grooves on the side plates are correspondingly inserted to realize accurate positioning of the quartz silicon wafer carrier. The side edge of the upper groove plate on the quartz silicon wafer carrier is leaned against the side edge of the positioning clamping strip, and the lower groove plate is clamped in the clamping groove between the two clamping strips, so that the reliable positioning of the whole quartz silicon wafer carrier is realized. And then fixing the whole clamping jig on a machine tool to process the fluted teeth.
Example 2: the quick clamping jig for groove cutting of the quartz silicon wafer carrier (see fig. 3 to 6) has a structure similar to that of the embodiment 1, and is mainly characterized in that a positioning slide block 20 which is movably arranged on a base is arranged in the embodiment, a slide groove 21 is arranged on the bottom surface of the positioning slide block, a slide rail 22 is correspondingly arranged on the base and is connected with the slide rail in an adaptive manner, a locking screw 23 is connected on the positioning slide block, and the end part of the locking screw is abutted against the slide rail to realize locking of the positioning slide block. The positioning slide block is provided with an upper groove plate positioning groove 24 and a lower groove plate positioning groove 25, the end part of the upper groove plate is adaptively inserted into the upper groove plate positioning groove, and the end part of the lower groove plate is adaptively inserted into the lower groove plate positioning groove.
A clamping strip of the lower ditch plate positioning assembly is movably arranged on the base, and a positioning spring 26 is arranged between the clamping strip and the base; the base is provided with a guide rail 27 corresponding to the clamping strip, the bottom of the clamping strip is provided with a guide groove, and the guide groove is connected with the guide rail in an adaptive manner. The movable clamping strip 28 is arranged on the side face of the other clamping strip, the clamping strip is provided with a clamping pad 29 capable of buffering deformation, the clamping strip is provided with a push rod 30 for pushing the clamping strip to move, a pre-tightening spring 31 is arranged between the push rod and the clamping strip, and the positioning sliding block is movably propped against the push rod to push the clamping pad to move so that the clamping pad is propped against the lower ditch plate. The clamping bar is provided with two extending columns 32, the extending columns are provided with push-pull columns 33, push rods and the push-pull columns are correspondingly provided with push blocks 34, pre-tightening springs are arranged between the push blocks and the clamping bar, the push blocks are provided with push-pull grooves, the push-pull columns are inserted into the push-pull grooves, the push-pull grooves comprise retracting sections 35, push-pull sections 36 and extending sections 37, and the positioning sliding blocks move and push the push rods to push the push-pull columns from the retracting sections to the extending sections through the push-pull sections in the moving process of the push rods, so that the clamping bar moves outwards, and the clamping pad is tightly abutted to the lower ditch plate. The upper edges of the opposite surfaces of the two clamping strips are provided with inclined guide surfaces, a socket 38 with the width gradually decreasing downwards is formed between the two guide surfaces, and the lower ditch plate is inserted between the two clamping strips from the socket. Other structures are the same as those of embodiment 1.
After the lower ditch plate is clamped to the clamping groove, the clamping strip is reliably attached to the lower ditch plate under the action of the positioning spring, and the clamping strip is locked. Then, moving the positioning slide block to enable the end part of the upper ditch plate to be adaptively inserted into the positioning groove of the upper ditch plate, and enabling the end part of the lower ditch plate to be adaptively inserted into the positioning groove of the lower ditch plate; meanwhile, the positioning slide block is movably propped against the push rod to push the clamping pad to move, so that the clamping pad is propped against the lower ditch plate, and reliable clamping of the lower ditch plate is realized.
The above-described embodiments are merely preferred embodiments of the present invention, and the present invention is not limited in any way, and other variations and modifications may be made without departing from the technical aspects set forth in the claims.
Claims (10)
1. The quick clamping jig for the groove cutting of the quartz silicon wafer carrier is characterized by comprising a base and a vertical plate arranged on the base, wherein the quartz silicon wafer carrier comprises a side plate, an upper groove plate and a lower groove plate which are arranged on the side plate, a groove is arranged on the side plate, and a lug matched with the groove is arranged on the vertical plate; an upper ditch plate positioning assembly and a lower ditch plate positioning assembly are arranged on the base, the upper ditch plate positioning assembly comprises a positioning clamping strip, and the side edge of the upper ditch plate is abutted against the side edge of the positioning clamping strip; the lower ditch plate positioning assembly comprises two clamping strips, a clamping groove is formed between the two clamping strips, and the clamping groove clamps and positions the lower ditch plate.
2. The rapid clamping jig for groove cutting of a quartz silicon wafer carrier of claim 1, wherein the positioning clamping strip is of an L-shaped structure.
3. The quick clamping jig for groove cutting of the quartz silicon wafer carrier according to claim 1, wherein the base is provided with a cushion block corresponding to the positioning clamping strip, the positioning clamping strip is provided with a plurality of strip-shaped mounting holes, and fastening screws are connected between the mounting holes and the cushion block.
4. The rapid clamping jig for groove cutting of the quartz silicon wafer carrier according to claim 1, wherein the upper surface of the clamping strip is obliquely arranged in a direction away from the clamping groove.
5. The rapid clamping jig for groove cutting of the quartz silicon wafer carrier of claim 1, wherein the clamping strip is provided with a waist round hole, and a locking screw is connected between the waist round hole and the base.
6. The quick clamping jig for groove cutting of the quartz silicon wafer carrier of claim 1, wherein the vertical plate is detachably connected with a mounting bar, and the protruding block is arranged on the mounting bar.
7. The quick clamping jig for groove cutting of the quartz wafer carrier of claim 6, wherein the upper side and the lower side of the mounting bar on the vertical plate are respectively provided with a convex table surface, and the mounting bar and the convex table surfaces are respectively attached to the side plates of the quartz wafer carrier.
8. The quick clamping jig for groove cutting of the quartz silicon wafer carrier of claim 1, wherein a plurality of magnetic supporting bars are arranged at the bottom of the base.
9. The rapid clamping jig for quartz wafer carrier groove cutting according to any one of claims 1 to 8, wherein a positioning slide block which is movably arranged is arranged on the base, an upper groove plate positioning groove and a lower groove plate positioning groove are arranged on the positioning slide block, the end part of the upper groove plate is adapted to be inserted into the upper groove plate positioning groove, and the end part of the lower groove plate is adapted to be inserted into the lower groove plate positioning groove.
10. The rapid clamping jig for quartz silicon wafer carrier groove cutting according to claim 9, wherein a clamping strip of the lower groove plate positioning assembly is movably arranged on the base, and a positioning spring is arranged between the clamping strip and the base; the clamping strip is provided with a clamping pad capable of buffering deformation, a push rod for pushing the clamping strip to move is arranged on the clamping strip, a pre-tightening spring is arranged between the push rod and the clamping strip, and a positioning sliding block is movably propped against the push rod to push the clamping pad to move so that the clamping pad is propped against the lower ditch plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311433850.6A CN117601287A (en) | 2023-10-30 | 2023-10-30 | Quick clamping jig for groove cutting of quartz silicon wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311433850.6A CN117601287A (en) | 2023-10-30 | 2023-10-30 | Quick clamping jig for groove cutting of quartz silicon wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117601287A true CN117601287A (en) | 2024-02-27 |
Family
ID=89958641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311433850.6A Pending CN117601287A (en) | 2023-10-30 | 2023-10-30 | Quick clamping jig for groove cutting of quartz silicon wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117601287A (en) |
-
2023
- 2023-10-30 CN CN202311433850.6A patent/CN117601287A/en active Pending
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