CN117594450A - Sealing method for package and package - Google Patents

Sealing method for package and package Download PDF

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Publication number
CN117594450A
CN117594450A CN202311036013.XA CN202311036013A CN117594450A CN 117594450 A CN117594450 A CN 117594450A CN 202311036013 A CN202311036013 A CN 202311036013A CN 117594450 A CN117594450 A CN 117594450A
Authority
CN
China
Prior art keywords
power electronics
electronics module
bracket
cooling fluid
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311036013.XA
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Chinese (zh)
Inventor
R·保尔
金亨洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US18/364,330 external-priority patent/US20240064944A1/en
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Publication of CN117594450A publication Critical patent/CN117594450A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Abstract

The invention relates to a sealing method for a package and a package. The package includes a power electronics module disposed between the first and second brackets such that the power electronics module covers the opening in the first bracket and the opening in the second bracket. A leak-proof joint is formed between a surface of the power electronics module and a surface of the first bracket and a surface of the second bracket. The first bent cap is disposed on and bonded to the first bracket to enclose a first cooling fluid channel for flowing a cooling fluid over the power electronics module. The second bent cap is disposed on and bonded to the second bracket to enclose a second cooling fluid channel for flowing a cooling fluid over the power electronics module. The package includes an end connector having an input port and an output port for flowing a cooling fluid through the first cooling fluid channel and the second cooling fluid channel.

Description

Sealing method for package and package
Technical Field
The present disclosure relates to a sealing method for a package and a package.
Background
In many applications (e.g., in electric vehicles), efficient thermal management of power electronics components or packages is required to increase power density and improve reliability. The power electronics assembly may include heat generating semiconductor devices (e.g., insulated Gate Bipolar Transistors (IGBTs) and Fast Recovery Diodes (FRDs)) assembled in a power electronics module. The power electronics module is housed in a sealed container (e.g., a cooling fluid jacket). The cooling fluid flowing through the sealed container may be used to extract heat generated by the semiconductor device from the sealed container. The compact packaging of power electronics components presents thermal management challenges to be addressed for power-intensive systems.
Disclosure of Invention
In one general aspect, a method includes: arranging the power electronic device module on the bracket so that one side of the power electronic device module covers an opening in the bracket; and bonding a surface of the power electronics module to the bracket around a perimeter of the opening in the bracket to form a leak-proof bond between the power electronics module and the bracket. The method further comprises the steps of: a capping beam is arranged above the power electronic device module arranged on the bracket; and joining the bent cap and the bracket together along the length of the bracket. The capping beams and the brackets form a frame surrounding cooling fluid channels for flowing a cooling fluid over the power electronics module. The method further comprises the steps of: an end connector is attached to the frame. The end connector includes an input port and an output port for a cooling fluid passage in the frame.
In one general aspect, a method includes: disposing the power electronics module between the first and second brackets such that a first side of the power electronics module covers the opening in the first bracket and an opposite second side of the power electronics module covers the opening in the second bracket; bonding a surface of the first side of the power electronics module to the first bracket along a perimeter of the opening in the first bracket to form a leak-proof bond between the power electronics module and the first bracket; and bonding a surface of an opposing second side of the power electronics module to the second bracket along a perimeter of the opening in the second bracket to form a leak-proof bond between the power electronics module and the second bracket. The method further comprises the steps of: a first capping beam is disposed over the power electronics module on the first support, and a second capping beam is disposed over the power electronics module on the second support. The method further comprises the steps of: the first cap beam and the first bracket are joined together along a length of the first bracket to form a first frame surrounding a first cooling fluid channel for flowing cooling fluid over the power electronics module, and the second cap beam and the second bracket are joined together along a length of the second bracket to form a second frame surrounding a second cooling fluid channel for flowing cooling fluid over the power electronics module. The method further comprises the steps of: an end connector is attached to the first frame and the second frame. The end connection includes an input port and an output port for a first cooling fluid channel in the first frame and an input port and an output port for a second cooling fluid channel in the second frame.
In one general aspect, a method includes: forming a cooling fluid channel in the frame; forming an opening in a wall of the frame to a cooling fluid passage; and covering the opening in the wall of the frame with a power electronics module. The method further comprises the steps of: providing a bead comprising an adhesive sealant between a surface of the power electronics module and a surface of the frame along a perimeter of the opening; and curing the bead containing the viscous sealant at a curing temperature of the viscous sealant.
In one general aspect, a package includes: a power electronics module disposed between the first and second brackets such that a first side of the power electronics module covers the opening in the first bracket and an opposite second side of the power electronics module covers the opening in the second bracket; a junction disposed between a surface of the first side of the power electronics module and the first bracket along a perimeter of the opening in the first bracket; and a junction disposed between a surface of the opposing second side of the power electronics module and the second bracket along a perimeter of the opening in the second bracket. The first bent cap is arranged on the first bracket and above the power electronic device module, and the second bent cap is arranged on the second bracket and above the power electronic device module. The package further includes: a first joint disposed between the first capping beam and the first bracket along a length of the first bracket, and a second joint disposed between the second capping beam and the second bracket along a length of the second bracket. The first capping beam and the first bracket form a first frame surrounding a first cooling fluid channel for flowing a cooling fluid over the power electronics module. The second capping beam and the second bracket form a second frame surrounding a second cooling fluid channel for flowing a cooling fluid over the power electronics module. The end connections attached to the first and second frames include input and output ports for the first cooling fluid channel in the first frame and input and output ports for the second cooling fluid channel in the second frame.
Drawings
Fig. 1A schematically illustrates removal of heat from a plurality of power electronics modules in an integrated power electronics package by a flow of cooling fluid flowing across surfaces of the power electronics modules, in accordance with principles of the present disclosure.
Fig. 1B shows a front side of an exemplary power electronics module in a perspective view.
Fig. 1C shows a perspective view of the back side of the exemplary power electronics module of fig. 1B.
Fig. 2 illustrates an exploded view of an exemplary integrated power electronics package.
Fig. 3A shows an integrated power electronics package.
Fig. 3B illustrates an exploded view of the exemplary integrated power electronics package of fig. 3A.
Fig. 3C shows a view of the interior of the exemplary integrated power electronics package of fig. 3A with a portion of the capping beam removed.
Fig. 4 illustrates an exemplary method for forming a leak-proof bond in an integrated power electronics package.
Fig. 5 illustrates an exemplary method for forming a plurality of leak-proof joints in an integrated power electronics package.
Fig. 6 illustrates another exemplary method for forming a leak-proof bond in an integrated power electronics package.
Fig. 7 illustrates another exemplary method for forming a plurality of leak-proof joints in an integrated power electronics package.
In the drawings, which are not necessarily drawn to scale, the same reference numerals and/or alphanumeric designations may designate the same and/or similar components (elements, structures, etc.) in different views. The drawings illustrate by way of example, and not by way of limitation, various implementations discussed in the present disclosure. The reference symbols and/or alphanumeric designations in one of the figures may not be repeated for identical and/or similar elements in the associated views in other figures. Repeated reference characters and/or alphanumeric identifiers in the various figures may not be discussed specifically with respect to each of these figures, but are provided to facilitate cross-referencing between related views. Moreover, when multiple instances of an element are described, not all similar elements in the drawings are referred to in detail using reference signs and/or alphanumeric identifiers.
Detailed Description
The present disclosure is directed to a thermal management system for a power electronics package. The power electronics package (e.g., an integrated power electronics package) may be modular and may include a plurality of power electronics modules (or sub-packages).
For example, the power electronics module (or sub-package) may include power electronics (e.g., a Silicon Controlled Rectifier (SCR), an Insulated Gate Bipolar Transistor (IGBT), a Field Effect Transistor (FET), a silicon carbide (SiC) power transistor, etc.) to provide AC power to the load. The power electronics may be silicon-based semiconductors, silicon carbide-based semiconductors, or other Wide Bandgap (WBG) -based semiconductors. Power electronics can generate heat that must be removed to maintain the device at an acceptable operating temperature. For high power density applications (e.g., at a power density of 240kW or greater than 240 kW), the need for efficient heat dissipation may be more stringent.
In an exemplary implementation, the power electronics module may include at least a semiconductor chip (e.g., an IGBT and/or an FRD). The semiconductor chip may be mounted on a top surface of a substrate (e.g., a printed circuit board, a Direct Bond Metal (DBM) substrate, a Direct Bond Copper (DBC) substrate, etc.). One or more semiconductor chips may be packaged (e.g., encased in molding compound), for example, as a single-sided direct cooling (SSDC) power electronics module or a double-sided direct or indirect cooling (DSC) power electronics module, with signal pins and power terminals extending from the module. The power electronics module may have a Width (WM) and a Height (HM) along the surface of the substrate, and a Thickness (TM) perpendicular (substantially perpendicular) to the substrate (along the direction of the semiconductor chip mounted on the top surface of the substrate). In an exemplary implementation, for an exemplary IGBT power electronics module, the height HM and width WM may be measured in centimeters, while the thickness TM may be in the range of a few millimeters or less.
Heat generated by the one or more semiconductor chips flows vertically through the substrate and is dissipated from the bottom surface of the substrate. In some cases, a heat sink (e.g., a base plate, or a base plate with fins) may be attached to the bottom surface of the substrate to help dissipate heat generated in the power electronics module. The finned base plate may include pin fins (i.e., fins shaped like pins). The power electronics module may be further configured with forced air and liquid cooling options to remove heat generated in the power electronics module.
In an exemplary implementation, the integrated power electronics package may be modular, and multiple power electronics modules (or sub-packages) may be included in a single integrated power electronics package for various applications (e.g., three-phase inverters, DC/DC converters, choppers, half or full bridges, and power supply applications, etc.). For example, integrated power electronics packages for many automotive applications may integrate up to six IGBT modules in a 6 pack configuration or a 3 pack configuration. Multiple power electronics modules (or sub-packages) (e.g., six or three IGBT modules) may be placed in electrical parallel.
In an exemplary implementation, the integrated power electronics package may include (or be integrated with) a thermal management system. The thermal management system may utilize a cooling fluid (e.g., water, or a water-glycol mixture) to remove heat generated in the integrated power electronics package. The thermal management system may include at least a manifold or jacket (e.g., a pipe or vessel) that includes cooling fluid flow channels or passages. A plurality of power electronics modules of the integrated power electronics package may be disposed on a side of the cooling fluid channel that is in contact with the cooling fluid. In an exemplary implementation, the manifold or sheath may have a rectangular cylindrical shape with a length L between the input end and the output end, and a width W and a height H in a cross-section perpendicular to the length (e.g., a rectangular cross-section). The manifold or jacket comprising the cooling fluid channels may be formed in a three-dimensional rectangular frame (hollow rectangular frame) with the input and output ports provided in opposite end connections of the frame. The frame may include openings (e.g., also referred to as windows (e.g., rectangular openings)) in the side walls of the frame. The power electronics module may be placed over the opening such that one side of the power electronics module is exposed to the cooling fluid in the cooling fluid channel.
The flow of cooling fluid may enter the manifold through an input port, pass through a side of the plurality of power electronics modules along a cooling fluid channel in the manifold that is placed over an opening or window in a side wall of the frame (e.g., a top side) to remove heat generated by the power electronics modules, and exit the manifold through an output port. The opposite end connectors of the frame, including the input port and the output port, may be attached to the frame using an adhesive sealant. The cooling fluid flow may be driven by a recirculation pump (not shown).
A plurality of power electronics modules placed in a row in turn may be supported on the frame. The frame may extend in the row direction and have windows (openings) so that the bottom surface of the substrate (on the front surface of the substrate, the semiconductor chip is mounted in the power electronics module) is exposed to the interior of the frame (i.e., the cooling fluid channels). The power electronics module may be placed over the opening to cover, close, or seal the opening (window) in the side wall of the frame, thereby confining the cooling fluid to the cooling fluid channel within the three-dimensional rectangular frame.
If a base plate (e.g., a base plate with pin fins) is attached to the bottom surface of the substrate, the base plate may protrude outside the frame through the opening (window) (at least the pin fins protrude outside the frame).
The power terminals and signal pins of each of the plurality of power electronics modules disposed in the manifold may extend outside of the manifold/integrated power electronics package.
In an exemplary implementation (e.g., in a double-sided cooled integrated power electronics package), the cooling fluid channel may be a first cooling fluid channel (e.g., a top cooling fluid channel) and the jacket surrounding the first cooling fluid channel may be a first jacket (e.g., a top jacket).
In a double-sided cooled integrated power electronics package, the substrate pin fins of the power electronics modules placed in rows may also be exposed to a flow of cooling fluid flowing through another cooling fluid channel (e.g., a bottom cooling fluid channel). The bottom cooling fluid channel may be included in a second manifold or jacket (e.g., bottom jacket) in the power electronics module. As with the first sheath, the second sheath may be formed in a three-dimensional rectangular frame (second frame) with the input and output ports disposed in opposite end connections of the frame. The opposing end connectors of the second frame, including the input port and the output port, may be attached to the frame using an adhesive sealant. The second frame may include an opening or window (e.g., a rectangular opening) in a side wall of the second frame. The power electronics module may be placed over the opening (window) to close or seal the opening (window) in the side wall of the second frame, thereby confining the cooling fluid into the bottom cooling fluid channel within the second frame.
The cooling fluid flow may enter the second enclosure through the input port, pass along cooling fluid channels in the second enclosure through the side of the plurality of power electronics modules placed over the opening (window) in the side wall of the second frame (e.g., the bottom side) to remove heat generated by the power electronics modules, and exit the second enclosure through the output port. In an exemplary implementation, the first sheath and the second sheath may have a common input port and a common output port.
In accordance with the principles of the present disclosure, in an integrated power electronics package, a leak-proof bond is formed between a surface of a power electronics module and a surface of a frame surrounding a cooling fluid channel.
The power electronics module is placed over an opening (window) in a frame (e.g., a three-dimensional rectangular frame), alongside the cooling fluid channel, and attached (sealed) to the frame to confine cooling fluid flowing in the cooling fluid channel within the frame.
In some exemplary implementations, the leak-proof joint between the power electronics module and the frame is made of an adhesive sealant disposed along the periphery or perimeter of the opening (window). The adhesive encapsulant may be provided as beads of encapsulant-containing material along the periphery of the opening (window) in the frame (e.g., in a groove along the periphery of the opening in the frame, or on the periphery of the surface of a heat sink or substrate attached to the substrate of the power electronic device module).
In some example implementations, the leak-proof joint between the power electronics module and the frame may be, for example, a fusion joint (e.g., a solder joint). The leak-proof joint may be formed along the periphery or perimeter of the opening (window), for example by fusing or welding a metal surface of the frame at the periphery or perimeter of the opening (window) to a metal surface of a substrate of the power electronics module, for example, or to a surface of a heat sink or substrate attached to the substrate of the power electronics module. In an exemplary implementation, the joint may be a fusion joint, a laser welded joint, or a friction stir welded joint.
FIG. 1A is a schematic diagram illustrating heat removal from a plurality of power electronics modules by a flow of cooling fluid flowing across the surfaces of the power electronics modules. In some implementations, the power electronics module may be, for example, a single-sided direct cooling (SSDC) power electronics module having a surface (e.g., a substrate surface) for dissipating heat generated by devices in the power electronics module to the outside of the module. In the case of direct cooling, the cooling medium (e.g., a 50/50 water/glycol mixture) is in direct contact with the power module. In some implementations, the power electronics module may be, for example, a double-sided indirect-cooled power electronics module that provides indirect or direct cooling to both sides of the module. In the case of indirect cooling, the module is attached to a sealed heat sink that is actively cooled with a cooling fluid.
As shown in fig. 1A, a plurality of power electronics modules (e.g., power electronics module 200A, see fig. 1B and 1C) may be sequentially arranged in rows (e.g., row R1) between a first cooling fluid channel 155-1 enclosed in a first rectangular frame 140-1 and a second cooling fluid channel 155-2 enclosed in a second rectangular frame 140-2. The power electronics modules (e.g., power electronics module 200A, see fig. 2) disposed in row R1 may have a metallized front surface S1 (e.g., a substrate surface) and a metallized back surface S2 (e.g., a heat sink surface or a substrate surface). The front surfaces (e.g., front surface S1) of the plurality of power electronics modules may be exposed to the cooling fluid in the cooling fluid channel 155-1 through the window w1 in the first rectangular frame 140-1 to dissipate heat. The rear surfaces (e.g., rear surface S2) of the plurality of power electronics modules may be exposed to the cooling fluid in the cooling fluid channel 155-2 through the window w2 in the second rectangular frame 140-2 for heat dissipation.
The first cooling fluid flow may flow sequentially through the heat generating (heat dissipating) front surfaces (e.g., front surface S1) of the plurality of power electronics modules in a straight flow path through cooling fluid channel 155-1, and the second cooling fluid flow may flow sequentially through the heat generating (heat dissipating) rear surfaces (e.g., rear surface S2) of the plurality of power electronics modules in a straight flow path through cooling fluid channel 155-2.
In accordance with the principles of the present disclosure, the leak-proof joints may be used to join or attach surfaces (e.g., front surface S1, back surface S2) of a plurality of power electronics modules to surfaces of frames 140-1 and 140-2 to seal windows w1 and w2, respectively. The leak-proof bond (e.g., adhesive sealant bond 240) may extend around the perimeter of the windows (e.g., windows w1 and w 2) and may hermetically seal the windows to prevent leakage of cooling fluid from the cooling fluid channel 155-1 and cooling fluid channel 155-2, respectively, around the edges of the windows.
In some example implementations, the leak-proof joint may be an adhesive sealant joint (e.g., adhesive sealant joint 240) made of, for example, a high temperature adhesive sealant (e.g., a polymer, epoxy, or silicone material) (e.g., elatosil RT 723A/B sold by Wacker Chemie AG). In some example implementations, the leak-proof joint may be a welded joint (e.g., a laser welded joint).
Fig. 1B and 1C illustrate an exemplary power electronics module 200A that may be used in the integrated power electronics package 100 of fig. 1A. Fig. 1B shows a front side view of power electronics module 200A, and fig. 1C shows a rear side view of power electronics module 200A.
For example, the power electronics module 200A may include a power semiconductor chip (e.g., an IGBT) (not shown) mounted on a top surface of a substrate (e.g., a Direct Bonded Copper (DBC) substrate) (e.g., substrate 220) and packaged (encapsulated) in an encapsulation 210 (e.g., as an SSDC package). The power electronics module 200A may have a wrapping portion (wrapping 210) having a width WM, a height HM, and a thickness TM. The power terminals 212 and the signal terminals 214 of the power electronics module 200A may extend from the encapsulation portion (encapsulation 210). As shown in fig. 1C, a heat sink (e.g., substrate 230) may be attached to a rear surface (e.g., surface S) of a substrate 220 (e.g., a thermally conductive substrate) to help dissipate heat generated by power semiconductor devices mounted on a top surface (not shown) of the substrate 220. In an exemplary implementation, an array of fins (e.g., pin fins 232) may extend outwardly (e.g., vertically) from the base plate 230.
Fig. 2 illustrates an exploded view of various structural components of an integrated power electronics package 200, for example, in accordance with the principles of the present disclosure, wherein rows of power electronics modules (e.g., power electronics module 200A) are double-sided cooled.
In the package 200, rows of power electronics modules (e.g., three power electronics modules 200A) may be cooled by a first flow of cooling fluid flowing across a top side of the power electronics modules and a second flow of cooling fluid flowing across a bottom side of the power electronics modules. Fig. 2 illustrates an integrated power electronics package 200 in a disassembled state prior to forming a leak-proof joint between a power electronics module and a frame surrounding a cooling fluid channel.
As shown in fig. 2, the integrated power electronics package 200 includes two rectangular frames (e.g., frame 140-1, frame 140-2) that include cooling fluid channels (e.g., cooling fluid channel 155-1 and cooling fluid channel 155-2, see fig. 1A) for flowing cooling fluid over a top side (e.g., front surface S1) and a bottom side (e.g., back surface S2) of a row of power electronics modules (e.g., power electronics module 200A), respectively. The integrated power electronics package 200 also includes end connections (e.g., input port 122 and output port 124) that can receive and output cooling fluid through cooling fluid channels (e.g., cooling fluid channel 155-1 and cooling fluid channel 155-2, see fig. 1A) in the frame 140-1 and frame 140-2.
The frame 140-1 may include a window w1 (not visible in fig. 2), the frame 140-2 may include a window (e.g., window w 2), and a power electronics module (e.g., power electronics module 200A) disposed over the window may be exposed to cooling fluid flowing through cooling fluid channels (e.g., cooling fluid channel 155-1 and cooling fluid channel 155-2, see fig. 1A) in the frame 140-1 and the frame 140-2 through the window w1 and the window w 2.
As shown in fig. 2, a bead containing an adhesive sealant 250 (e.g., a temperature curable epoxy or polymer) may be deposited on a frame (e.g., frame 140-2) along the perimeter of a window (e.g., window w 2). The melting temperature of the viscous encapsulant 250 can be much higher (e.g., at least 10% higher) than the maximum operating temperature of the integrated power electronic device package 200.
When the integrated power electronic device package 200 is assembled, a power module (e.g., power electronic device module 200A) may be sandwiched between the frame 140-1 and the frame 140-2 using a compressive force, the frame 140-1 and the frame 140-2 having beads of adhesive sealant (adhesive sealant 250) deposited along the perimeter of the windows (e.g., windows w1 and w 2). For example, a bead containing a viscous sealant (viscous sealant 250) may be disposed in a groove along the perimeter of the window.
The assembly may be placed in a curing oven and heated to a curing temperature. The curing temperature may be below the maximum operating temperature of the integrated power electronic device package 200. After curing, the adhesive encapsulant 250 may form a leak-proof bond (e.g., adhesive encapsulant bond 240, see fig. 1A) between the perimeter of the windows (e.g., window w1 and window w 2) and the top and bottom surfaces of the power module (e.g., power electronics module 200A).
In some example implementations, various structural components (e.g., cap beams, end connectors, fluid input ports, fluid output ports, etc.) of the integrated power electronics package 100 may be assembled using, for example, nut and bolt assemblies (e.g., nut and bolt assemblies 130). In some example implementations, the various structural components of the integrated power electronic device package 100 may also be assembled using adhesives, O-ring and groove arrangements, or other coupling members (not shown in fig. 1A).
In the exemplary integrated power electronic device package 100 described above (e.g., with reference to fig. 1A-2), the leak-proof bond (adhesive sealant bond 240, see fig. 1A) in the integrated power electronic device package is made of an adhesive sealant. As previously mentioned in some example implementations, the leak-proof joint may be a joint formed, for example, by welding or fusing a metalized surface of a power module (e.g., power electronics module 200A) to a surface of a frame surrounding cooling fluid channels (e.g., cooling fluid channel 155-1 and cooling fluid channel 155-2, see fig. 1A).
In an exemplary implementation, where a fusion or welding scheme (e.g., a laser welding scheme) is used for the leak-proof joint, the frames (e.g., frame 140-1, frame 140-2) surrounding the cooling fluid channels may be composed of a metal bracket having openings or windows (e.g., window w1 and window w 2) and a cap beam. For example, the brackets may be flat sheet metal or I-beams, etc. The brackets may form walls (e.g., side walls) of the frame (e.g., frame 140-1, frame 140-2, see fig. 1A, 3A). For example, the cover beam may be a C-shaped or U-shaped channel beam having a C-shaped or U-shaped cross-section (e.g., perpendicular to the length of the cover beam), respectively.
A power electronics module (e.g., power electronics module 200A) may be placed over the opening in the rack. A metal surface of the power electronics module (e.g., a surface of a power electronics module substrate, or a surface of a substrate to which a heat sink or substrate is attached) may be soldered to the mount using a laser beam that passes through the opening. A metal capping beam (e.g., a U-shaped or C-shaped beam) may then be placed over and welded to the brackets to form a jacket that includes cooling fluid channels.
Fig. 3A, 3B, and 3C illustrate aspects of an exemplary integrated power electronics package 300 including a laser welded leak-proof joint between a power electronics module and a frame surrounding a cooling fluid channel. Fig. 3A shows an external perspective view of an integrated power electronics package 300. Fig. 3B shows an exploded view of an exemplary integrated power electronics package 300 at a stage of construction. Fig. 3C shows a view of the interior of an exemplary integrated power electronics package 300 (fig. 3A) with a portion of the capping beam removed.
As shown in fig. 3A-3C, the integrated power electronics package 300 may include a row of power electronics modules (e.g., three power electronics modules 200A) disposed between the frame 140-1 and the frame 140-2 (fig. 1A). The power electronics module is located inside the package and is not fully visible in fig. 3A. In fig. 3A, only the power terminals 212 and signal terminals 214 of the power electronics module (e.g., power electronics module 200A) included in the integrated power electronics package 300 are visible.
As shown in fig. 3A, the frames (e.g., frame 140-1 and frame 140-2) may be formed by joining (e.g., welding or fusing) edges of the U-shaped or C-shaped channel beams (e.g., cover beams 320-1, 320-2) to the brackets (e.g., brackets 310-1, 310-2). The cover beams (e.g., cover beam 320-1, cover beam 320-2) may have a U-shaped or C-shaped cross-section perpendicular to their length. The joining (e.g., welding or fusing) of the edges may be performed by applying heat and/or pressure (e.g., by welding). In fig. 3A, the engagement of the edge of the bent cap (e.g., bent cap 320-2) with the bracket (e.g., bracket 310-2) is depicted as a welded joint (e.g., welded joint 360) extending along the length of the bent cap between the input port 122 and the output port 124. The cover beam (e.g., cover beam 320-2) may have a U-shaped cross-section (cross-section 322, see fig. 3B). The U-shaped cross-section of the bent cap and the surface of the bracket may define rectangular cooling fluid channels (e.g., cooling fluid channel 155-1 and cooling fluid channel 155-2, see fig. 1A) through which cooling fluid may flow between the input port 122 and the output port 124.
As shown in fig. 3B, the brackets (e.g., bracket 310-1, bracket 310-2) may include openings or windows (e.g., window w1 and window w 2). A power electronics module (e.g., power electronics module 200A) may be disposed in the integrated power electronics package 300 to cover (close, seal) the window such that cooling fluid flowing between the input port 122 and the output port 124 flows across the surface of the power electronics module (e.g., power electronics module 200A) exposed by the window. A leak-proof bond (e.g., laser welded bond 350, see fig. 3C) may be formed around the perimeter of the window between the surface of the carrier and the surface of the power electronics module covering (closing, sealing) the window (e.g., front surface S1, back surface S2). In an exemplary implementation, the power electronics module may be soldered to the bracket by directing a laser beam (laser beam 30) through a window in the bracket before a bent cap (e.g., bent cap 320) is placed over the bracket and soldered to the bracket.
Fig. 3C shows a view of the interior of an exemplary integrated power electronics package 300 (fig. 3A) with a portion of a capping beam 320. As shown in fig. 3C, a leak-proof bond (e.g., laser welded bond 350) is formed between surface S2 of power electronics module 200A and the surface of bracket 310-2 along the perimeter of window w2 in the bracket.
The previously described adhesive sealant joints (e.g., adhesive sealant joint 240) and laser welded joints (e.g., laser welded joint 350) may be robust and capable of preventing leakage of coolant (e.g., in automotive applications) over the operating temperature range of the integrated power electronic package. Further, the viscous sealant joints and laser welded joints described herein can be used to robustly seal cooling fluid passages against surfaces of power electronics modules having dimensions in the hundreds of millimeters or more (e.g., perimeter dimensions of 100 millimeters or more).
While in the examples discussed above, the adhesive sealant joint and laser weld joint are described in the context of forming a leak-proof joint in applications involving a double-sided cooled power electronic module (both sides of which are cooled by two streams of cooling fluid), it should be understood that the adhesive sealant joint and/or laser weld joint may be used to form a leak-proof joint in applications involving a single-sided cooled power electronic module (one side of which is cooled by a stream of cooling fluid).
Fig. 4 illustrates an exemplary method 400 for forming a leak-proof joint between a surface of a power electronics module and a surface of a frame surrounding a cooling fluid channel in an integrated power electronics package. The power electronics module may cover an opening (window) in a side wall of the frame, which opening (window) opens into the cooling fluid channel in the frame, and the power electronics module may be exposed to the cooling fluid flowing in the cooling fluid channel through the opening (window).
The method 400 includes forming a cooling fluid passage (410) in the frame, and forming a window in a wall of the frame, the window opening into the cooling fluid passage (420). The method further includes covering a window (430) leading to the cooling fluid channel with the power electronics module, and disposing a bead (440) containing an adhesive sealant between a surface of the power electronics module and a surface of the frame along a perimeter of the window.
Covering 430 windows in the walls of the frame with power electronics modules may expose surfaces (e.g., heat sink or substrate surfaces) to cooling fluid channels. The bead containing the viscous encapsulant may form a joint between the surface of the power electronics module and the surface of the frame extending along the perimeter of the window.
In some example implementations, disposing 440 the bead of viscous sealant may include disposing the bead of viscous sealant on an outside surface of the frame along a perimeter of the window (e.g., in a groove along the perimeter of the window) prior to covering the window with the power electronics module. In some other exemplary implementations, disposing 440 the bead including the viscous sealant may include disposing the bead including the viscous sealant on a surface of the power electronics module prior to covering the window with the power electronics module. In an exemplary implementation, the adhesive sealant may be, for example, a high temperature adhesive sealant (e.g., silicone rubber, epoxy, or other polymeric material). The curing temperature of the viscous encapsulant may be within or below the safe operating temperature range of the power electronics module. In some implementations, the curing temperature may be, for example, 175 ℃. In some other implementations, the curing temperature may be, for example, 200 ℃. The viscous encapsulant may have a melting temperature that is above the operating temperature range of the power electronics module. In some implementations, the melting temperature of the viscous sealant can be about 350 ℃ or higher.
The method 400 further includes curing the viscous sealant-containing bead at a curing temperature of the viscous sealant (450).
The curing may form a robust joint that is leak-proof over the operating temperature range of the power electronics module. The method 400 may also include attaching an end connector to the frame using an adhesive sealant, the end connector including an input port and an output port for a cooling fluid passage in the frame.
Fig. 5 illustrates an exemplary method 500 for forming a leak-proof joint between a surface of a double-sided cooled power electronics module and a surface of a first frame surrounding a first cooling fluid channel and a surface of a second frame surrounding a second cooling fluid channel in an integrated power electronics package.
The method 500 includes forming a first cooling fluid passage in a first frame (510). The first frame has an opening (window) in a wall of the first frame leading to a first cooling fluid channel in the first frame. The method 500 further includes forming a second cooling fluid passage in the second frame (520). The second frame has an opening (window) in a wall of the second frame leading to a second cooling fluid channel in the second frame.
The method 500 further includes disposing the power electronics module between the first frame and the second frame such that a first side of the power electronics module covers a first opening in the first frame and an opposing second side of the power electronics module covers a second opening in the second frame (530). The method 500 further includes disposing a first bead of the viscous sealant along a perimeter of the first opening between a first side of the power electronics module and a surface of the first frame (540), and disposing a second bead of the viscous sealant along a perimeter of the second opening between an opposing second side of the power electronics module and a surface of the second frame (550).
In an exemplary implementation, the adhesive sealant may be a silicone material. The method 500 further includes curing (560) the first bead containing the viscous sealant and the second bead containing the viscous sealant at a curing temperature of the viscous sealant. In the case where the viscous sealant is provided as a bead containing the viscous sealant on the first frame (bottom frame) and the second frame (top frame), a compressive force may be applied to form an assembly of the power electronics module sandwiched between the two frames. In alternative implementations, the adhesive sealant may be provided as beads on the front and back side surfaces of the power electronics module, and then compressive force may be applied to form an assembly of the power electronics module sandwiched between two frames.
The assembly may be placed in a curing oven at a curing temperature below the maximum allowable temperature for the power electronics module.
In some exemplary implementations, the curing temperature may be, for example, a temperature of 175 ℃ or less. In some other exemplary implementations, the curing temperature may be, for example, a temperature of 200 ℃ or less.
In some example implementations, the method 500 may further include attaching an end connector to the first frame and the second frame, the end connector including an input port and an output port for a first cooling fluid channel in the first frame and an input port and an output port for a second cooling fluid channel in the second frame. The end connectors may be attached to the first and second frames using an adhesive sealant.
Fig. 6 illustrates an exemplary method 600 for forming a leak-proof joint between a surface of a power electronics module and a surface of a frame surrounding a cooling fluid channel in an integrated power electronics package. The power electronics module may cover an opening (window) in a wall of the frame, which opening (window) opens into the cooling fluid channel in the frame, and the power electronics module may be exposed to the cooling fluid flowing in the cooling fluid channel through the window. In an exemplary implementation, the wall of the frame surrounding the cooling fluid channel may be a bracket (e.g., sheet metal, i-beam, etc.) having an opening (window) in the wall. The frame is formed by attaching a cover beam (e.g., a C-shaped channel beam or a U-shaped channel beam) to the bracket. The cooling fluid channel is formed by the space between the cover beam (e.g., a C-shaped channel beam or a U-shaped channel beam) and the bracket.
The method 600 includes disposing the power electronics module on the support such that one side of the power electronics module covers an opening in the support (610). The method 600 further includes bonding a surface of the power electronics module to the support around a perimeter of the opening in the support to form a leak-proof bond (620) between the power electronics module and the support. Such joining (e.g., fusing or welding) may form a leak-proof joint between the power electronics module and the support. In an exemplary implementation, the surface of the power electronics module may be a metallized surface of a substrate (e.g., a DBC substrate), or a surface of a heat sink or substrate attached to one side of the power electronics module. In some example implementations, the bonding 620 may include laser welding. In some other exemplary implementations, the joint 620 may include friction stir welding.
The method 600 further includes disposing a capping beam over the power electronics module disposed on the rack (630), and fusing the capping beam and the rack together along a length of the rack (640). The cover beams and brackets may form a frame surrounding cooling fluid channels for flowing cooling fluid over the power electronics module. The capping beam may be a U-channel beam or a C-channel beam (in other words, a beam having a U-shape or a C-shape in cross section perpendicular to its length). The space between the capping beam and the bracket forms a cooling fluid channel for flowing a cooling fluid over the power electronics module.
The method 600 may further include attaching an end connector to the frame (650). The end connections may include an input port and an output port for cooling fluid channels in the frame. In an exemplary implementation, the end connectors may be attached to the frame using an adhesive sealant, or by joining (e.g., by fusion or welding) the end connectors and the frame.
Fig. 7 illustrates an exemplary method 700 for forming a leak-proof joint between a surface of a double-sided cooled power electronics module and a surface of a first frame surrounding a first cooling fluid channel and a surface of a second frame surrounding a second cooling fluid channel in an integrated power electronics package.
The method 700 includes disposing the power electronics module between the first and second brackets such that a first side of the power electronics module covers the opening in the first bracket and an opposite second side of the power electronics module covers the opening in the second bracket (710). The method 700 further includes bonding a surface of the first side of the power electronics module to the first bracket along a perimeter of the opening in the first bracket to form a leak-proof bond (720) between the power electronics module and the first bracket, and bonding a surface of the second side of the power electronics module to the second bracket along a perimeter of the opening in the second bracket to form a leak-proof bond (730) between the power electronics module and the second bracket.
In an exemplary implementation, the surface on the first side of the power electronics module may be a metallized surface of a substrate (e.g., a DBC substrate), or a surface of a heat sink or substrate attached to the first side of the power electronics module. Similarly, the surface on the second side of the power electronics module may be a metallized surface of a substrate (e.g., a DBC substrate), or a surface of a heat sink or substrate attached to the second side of the power electronics module.
In some example implementations, joining 720 the surface of the first side of the power electronics module may include one of fusing, soldering, and friction stir welding. Similarly, joining 730 the surface of the second side of the power electronics module may include one of fusion, laser welding, and friction stir welding.
The method 700 further includes disposing a first capping beam over the power electronics module on the first support and disposing a second capping beam over the power electronics module on the second support (740). The first and second capping beams may be U-channel beams or C-channel beams (in other words, beams having a U-shape or C-shape in cross section perpendicular to the length thereof).
The method 700 further includes joining together the first cap beam and the first bracket along a length of the first bracket to form a first frame surrounding a first cooling fluid channel for flowing cooling fluid over the power electronics module, and joining together the second cap beam and the second bracket along a length of the second bracket to form a second frame surrounding a second cooling fluid channel for flowing cooling fluid over the power electronics module (750). The space between the first capping beam and the first bracket forms a first cooling fluid channel for flowing a cooling fluid in the first frame over the power electronics module. The space between the second capping beam and the second bracket forms a second cooling fluid channel for flowing a cooling fluid in the second frame over the power electronics module.
The method 700 may further include attaching end connectors to the first and second frames (760). The end connection may include an input port and an output port for a first cooling fluid channel in the first frame and an input port and an output port for a second cooling fluid channel in the second frame. In an exemplary implementation, the end connectors may be attached to the frame using an adhesive sealant or by joining (e.g., fusing or welding) the end connectors and the frame.
In some exemplary implementations of the foregoing methods, the first cover beam and/or the second cover beam is a U-shaped channel beam or a C-shaped channel beam.
In some exemplary implementations of the foregoing methods, attaching the end connector to the first frame and/or the second frame includes attaching the end connector using an adhesive sealant or by welding.
In some exemplary implementations of the methods described herein, the adhesive sealant is a silicone material.
In some exemplary implementations of the methods described herein, the curing temperature of the viscous sealant is a temperature of 175 ℃ or less.
In some exemplary implementations of the methods described herein, the curing temperature of the adhesive sealant is a temperature of 200 ℃ or less.
The various implementations described herein are presented by way of example only and for illustrative purposes only. For the purposes of this disclosure, it will be understood that when an element such as a layer, region, component, or substrate is referred to as being on, mechanically connected to, electrically connected to, coupled to, or electrically coupled to another element, it can be directly on, connected to, or coupled to the other element or one or more intervening elements may be present. In contrast, when an element is referred to as being directly on, directly connected to, or directly coupled to another element or layer, there are no intervening elements or layers present. Although the terms "directly on … …," directly connected to … …, "or" directly coupled to … … "may not be used throughout the detailed description, elements shown as directly on … …," "directly connected … …," or "directly coupled … …" may be so called. The claims of the present application may be modified to enumerate the exemplary relationships described in the specification and/or shown in the drawings.
As used in this specification, the singular forms may include the plural unless the context indicates otherwise. Spatially relative terms (e.g., above … …, above … …, above … …, below … …, below … …, below, etc.) are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. In some implementations, the relative terms "above … …" and "below … …" may include "vertically above … …" and "vertically below … …," respectively. In some implementations, the term "adjacent" may include laterally adjacent to … … or horizontally adjacent to … ….
Some implementations may be implemented using various semiconductor processing and/or packaging techniques. Some implementations may be implemented using various types of semiconductor processing techniques associated with semiconductor substrates including, but not limited to, for example, silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), and the like.
While certain features of the described implementations have been illustrated as described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the scope of the implementations. It is to be understood that the present implementations have been presented by way of example only, and not limitation, and various changes in form and details may be made. Any of the portions of the apparatus and/or methods described herein may be combined in any combination, except mutually exclusive combinations. Implementations described herein may include various combinations and/or sub-combinations of the functions, components, and/or features of the different implementations described.

Claims (11)

1. A sealing method for a package, comprising:
arranging a power electronics module on a support such that one side of the power electronics module covers an opening in the support;
bonding a surface of the power electronics module to the mount around a perimeter of the opening in the mount to form a leak-proof bond between the power electronics module and the mount;
a capping beam is arranged above the power electronic device module arranged on the bracket;
joining the cover beam and the bracket together along a length of the bracket, the cover beam and the bracket forming a frame surrounding a cooling fluid channel for flowing a cooling fluid over the power electronics module; and
an end connector is attached to the frame, the end connector including an input port and an output port for the cooling fluid channel in the frame.
2. The method of claim 1, wherein the bonding the surface of the power electronics module to the mount around the perimeter of the opening in the mount comprises at least one of fusion, laser welding, and friction stir welding.
3. The method of claim 1, wherein the side of the power electronics module that covers an opening in the bracket comprises a substrate attached to the power electronics module.
4. A sealing method for a package, comprising:
disposing a power electronics module between a first bracket and a second bracket such that a first side of the power electronics module covers an opening in the first bracket and an opposing second side of the power electronics module covers an opening in the second bracket;
bonding a surface of the first side of the power electronics module to the first mount along a perimeter of the opening in the first mount to form a leak-proof bond between the power electronics module and the first mount;
bonding a surface of the opposing second side of the power electronics module to the second mount along a perimeter of the opening in the second mount to form a leak-proof bond between the power electronics module and the second mount;
a first capping beam is arranged on the first bracket and above the power electronic device module, and a second capping beam is arranged on the second bracket and above the power electronic device module;
Joining the first cap beam and the first bracket together along a length of the first bracket to form a first frame surrounding a first cooling fluid channel for flowing cooling fluid over the power electronics module, and joining the second cap beam and the second bracket together along a length of the second bracket to form a second frame surrounding a second cooling fluid channel for flowing cooling fluid over the power electronics module; and
attaching end connectors to the first and second frames, the end connectors including input and output ports for the first cooling fluid channels in the first frame and input and output ports for the second cooling fluid channels in the second frame.
5. The method of claim 4, wherein bonding a surface of the first side of the power electronics module to the first bracket and bonding a surface of the opposing second side of the power electronics module to the second bracket comprises at least one of fusion, laser welding, and friction stir welding.
6. The method of claim 4, wherein the first side of the power electronics module covering the opening in the first bracket comprises a substrate attached to the power electronics module.
7. A sealing method for a package, comprising:
forming a cooling fluid channel in the frame;
forming an opening in a wall of the frame to the cooling fluid passage;
covering the opening in the wall of the frame with a power electronics module;
providing a bead comprising an adhesive sealant between a surface of the power electronics module and a surface of the frame along a perimeter of the opening; and
the adhesive sealant-containing bead is cured at the curing temperature of the adhesive sealant.
8. The method of claim 7, further comprising: an end connector is attached to the frame using the viscous sealant, the end connector including an input port and an output port for the cooling fluid passage in the frame.
9. A package, comprising:
a power electronics module disposed between the first and second brackets such that a first side of the power electronics module covers the opening in the first bracket and an opposite second side of the power electronics module covers the opening in the second bracket;
A junction disposed between a surface of the first side of the power electronics module and the first mount along a perimeter of the opening in the first mount;
a junction disposed between a surface of the opposing second side of the power electronics module and the second mount along a perimeter of the opening in the second mount;
a first capping beam and a second capping beam, the first capping beam being disposed on the first bracket over the power electronics module, the second capping beam being disposed on the second bracket over the power electronics module;
a first junction disposed between the first capping beam and the first bracket along a length of the first bracket, the first capping beam and the first bracket forming a first frame surrounding a first cooling fluid channel for flowing a cooling fluid over the power electronics module;
a second junction disposed between the second capping beam and the second bracket along a length of the second bracket, the second capping beam and the second bracket forming a second frame surrounding a second cooling fluid channel for flowing a cooling fluid over the power electronics module; and
An end connector attached to the first and second frames, the end connector including an input port and an output port for the first cooling fluid channel in the first frame and an input port and an output port for the second cooling fluid channel in the second frame.
10. The package of claim 9, wherein the first and second joints comprise at least one of a laser welded joint and a friction stir welded joint.
11. The package of claim 9, wherein the first side of the power electronics module covering the opening in the first bracket comprises a substrate attached to the power electronics module.
CN202311036013.XA 2022-08-17 2023-08-16 Sealing method for package and package Pending CN117594450A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63/371,700 2022-08-17
US18/364,330 2023-08-02
US18/364,330 US20240064944A1 (en) 2022-08-17 2023-08-02 Sealing method for direct liquid cooled power electronics package

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CN117594450A true CN117594450A (en) 2024-02-23

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