CN117589097B - Ultrasonic wave multiple measurement system and method - Google Patents
Ultrasonic wave multiple measurement system and method Download PDFInfo
- Publication number
- CN117589097B CN117589097B CN202410073980.1A CN202410073980A CN117589097B CN 117589097 B CN117589097 B CN 117589097B CN 202410073980 A CN202410073980 A CN 202410073980A CN 117589097 B CN117589097 B CN 117589097B
- Authority
- CN
- China
- Prior art keywords
- unit
- module
- probe
- channel
- ultrasonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 67
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000000523 sample Substances 0.000 claims abstract description 127
- 238000002955 isolation Methods 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 230000000087 stabilizing effect Effects 0.000 claims description 11
- 238000000691 measurement method Methods 0.000 claims description 8
- 230000002457 bidirectional effect Effects 0.000 claims description 6
- 230000030279 gene silencing Effects 0.000 claims description 6
- 238000013519 translation Methods 0.000 claims description 5
- 238000004458 analytical method Methods 0.000 claims description 3
- 230000006641 stabilisation Effects 0.000 claims description 2
- 238000011105 stabilization Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 43
- 238000010586 diagram Methods 0.000 description 20
- 230000005284 excitation Effects 0.000 description 14
- 239000003973 paint Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000011247 coating layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000011185 multilayer composite material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses an ultrasonic wave multiple measurement system and method, which relate to the technical field of measurement and comprise a host module and a probe module, wherein the host module is connected with the probe module; the probe module is used for transmitting an ultrasonic pulse signal and receiving an ultrasonic feedback signal, and converting the ultrasonic feedback signal into A scanning waveform data for display after being input into the host module, and the probe module comprises one probe or a plurality of probes. By arranging a plurality of channels capable of independently adjusting configuration parameters and waveform adjusting parameters, each channel can be provided with different probes to test different workpieces, which is equivalent to the operation of a plurality of independent instruments. The cost is greatly saved. The parameters of each channel are all independently adjustable, the parameters of a plurality of channels can be stored in a standard configuration, and parameters which are required to be set in the measurement of sound velocity, probe type, and the like are not required to be reconfigured each time when the system is used, so that the consistency of the measurement is ensured, and the efficiency is improved.
Description
Technical Field
The invention relates to the technical field of measurement, in particular to an ultrasonic multiple measurement system and method.
Background
The ultrasonic thickness gauge is used for measuring thickness according to the ultrasonic pulse reflection principle, when an ultrasonic pulse signal emitted by the probe reaches a material interface through a measured object, the pulse signal is reflected back to the probe, and the thickness of the measured material is determined by accurately measuring the propagation time of ultrasonic waves in the material. Various materials that enable ultrasonic waves to propagate inside them at a constant velocity can be measured using this principle.
Currently, the following problems exist with the ultrasonic thickness measuring systems on the market: 1. the multi-layer or multi-channel function of the existing product often does not have independent A scanning waveform data of each layer or each channel to display, and corresponding waveform adjustment parameters and configuration parameters cannot be independently adjusted, so that the method is very inconvenient and inflexible for testing; 2. even if the multichannel detection module is provided, parameters of the channels can be independently adjusted, the multichannel detection module also needs to rely on an upper computer for displaying waveforms and thickness values and adjusting the parameters; 3. one instrument of the ultrasonic thickness gauge in the market can only be matched with one probe, when a plurality of points need to be measured, workers need to measure the points next to each other or a plurality of instruments need to be used for measuring the points, and the ultrasonic thickness gauge is inconvenient to use.
Disclosure of Invention
The invention solves the technical problems that: 1. the multi-layer or multi-channel function of the existing product often does not have independent A scanning waveform data of each layer or each channel to display, and corresponding waveform adjustment parameters and configuration parameters cannot be independently adjusted, so that the method is very inconvenient and inflexible for testing; 2. even if the multichannel detection module is provided, parameters of the channels can be independently adjusted, the multichannel detection module also needs to rely on an upper computer for displaying waveforms and thickness values and adjusting the parameters; 3. one instrument of the ultrasonic thickness gauge in the market can only be matched with one probe, when a plurality of points need to be measured, workers need to measure the points next to each other or a plurality of instruments need to be used for measuring the points, and the ultrasonic thickness gauge is inconvenient to use.
In order to solve the technical problems, the invention provides the following technical scheme: an ultrasonic multiple measurement system comprises a host module and a probe module, wherein the host module is connected with the probe module; the probe module is used for transmitting an ultrasonic pulse signal and receiving an ultrasonic feedback signal, and converting the ultrasonic feedback signal into A scanning waveform data for display after being input into the host module, and the probe module comprises one probe or a plurality of probes.
As a preferred scheme of the ultrasonic multiple measurement system, the host module comprises a display unit, a singlechip unit, a key unit, an FPGA chip unit, a storage unit, an ADC acquisition unit, an amplifier unit and a power supply unit, wherein the amplifier unit is electrically connected with the ADC acquisition unit, amplifies a received input signal and inputs an amplified differential signal into the ADC acquisition unit, the ADC acquisition unit is electrically connected with the FPGA chip unit in a bidirectional manner, the ADC acquisition unit inputs acquired data into the FPGA chip unit for analysis and identification, the FPGA chip unit is electrically connected with the singlechip unit in a bidirectional manner, the FPGA chip unit inputs the analyzed and identified A scanning waveform data into the singlechip unit, and the singlechip unit inputs the A scanning waveform data into the display unit for displaying the A scanning waveform data.
As a preferable scheme of the ultrasonic multiple measurement system, the key unit comprises a plurality of keys and a key circuit, and the key circuit is electrically connected with the singlechip unit.
As a preferable scheme of the ultrasonic multiple measurement system, the singlechip unit is electrically connected with the amplifier unit, and the singlechip unit controls the gain value of the amplifier unit by controlling the signal of the amplifier unit and adjusting the gain of the amplifier unit.
As a preferable scheme of the ultrasonic multiple measurement system, the ultrasonic multiple measurement system further comprises a power supply module, wherein the power supply module comprises a first direct-current boost conversion power supply chip unit, a second direct-current boost conversion power supply chip unit and a direct-current buck conversion power supply chip unit, and the first direct-current boost conversion power supply chip unit controls the main power supply of the whole instrument to supply power;
the second direct-current boost converting power supply chip unit is electrically connected with the direct-current buck converting power supply chip unit, and the second direct-current boost converting power supply chip unit provides basic voltage for the LC oscillating high-voltage output circuit.
As a preferable scheme of the ultrasonic multi-measurement system, the host module is connected with the probe module through the multi-channel expansion module, the multi-channel expansion module comprises a multi-channel analog switch unit, a linear voltage reduction and stabilization unit, a first isolation voltage boosting unit, a second isolation voltage boosting unit, a non-isolation voltage boosting unit, a filter circuit, a four-core connector, a single-core connector and a power input unit, the single-chip unit is electrically connected with the four-core connector through a four-core shielded control signal wire, then the four-core connector is electrically connected with a control port of the multi-channel analog switch unit in the multi-channel expansion module, and the multi-channel analog switch unit is electrically connected with the probe module;
the single chip microcomputer unit is electrically connected with the single-core connector through a single-core shielded radio frequency signal wire, and the single-core connector is communicated with an opened channel of the multi-channel analog switch unit in the multi-channel expansion module;
the power input unit is electrically connected with the linear buck-voltage stabilizing unit, the first isolation boosting unit and the second isolation boosting unit respectively, the second isolation boosting unit is electrically connected with the non-isolation boosting unit, and the linear buck-voltage stabilizing unit, the first isolation boosting unit and the non-isolation boosting unit are electrically connected with the multichannel analog switch unit through the filter circuit.
As a preferable scheme of the ultrasonic wave multiple measurement system, the multichannel analog switch unit selects the number of opened channels and channel numbers according to the control signals sent by the singlechip unit, and simultaneously displays a plurality of thickness values and A scanning waveform data of the currently selected channel on the display unit according to the selected channel number;
the A scanning waveform data of the channels displayed on the display unit are switched one by one through the key unit, and the displayed scanning waveform is the measuring signal of the current channel.
As a preferable scheme of the ultrasonic multiple measurement system, control information is input through keys, the control information is input into the single chip microcomputer unit through a key circuit, then the single chip microcomputer unit adjusts waveform parameters and configuration parameters of each channel based on the control information, wherein the waveform parameters comprise gain, range, translation, noise reduction, echo noise reduction, gate, polarity 1, polarity 2, type, phase and multiple;
configuration parameters include probe type, probe frequency, measurement mode, speed of sound, unit and resolution;
and respectively and independently setting waveform parameters and configuration parameters of the channels.
As a preferred scheme of the ultrasonic multiple measurement system, the host module further comprises a storage unit, wherein the storage unit is electrically connected with the singlechip unit, and after waveform parameters and configuration parameters of a plurality of channels are set, waveform adjustment parameters and configuration parameters of the channels are stored in the storage unit according to a storage key;
the singlechip unit invokes the waveform parameters and the configuration parameter information in the storage unit, and adjusts the waveform parameters and the configuration parameters of each channel based on the waveform parameters and the configuration parameter information in the storage unit.
As a preferable scheme of the ultrasonic wave multiple measurement method, the host module sends high-voltage pulse signals to the multi-channel expansion module through a single-core shielded radio frequency signal wire, and the high-voltage pulse signals are divided into single high-voltage pulse signals and multiple high-voltage pulse signals;
the host module transmits a single high-voltage pulse signal to excite the probe module, the probe module is connected with a probe, the host module receives a single ultrasonic feedback signal returned by a single probe, and single A scanning waveform data is displayed after being processed by the host module;
the host module transmits a plurality of high-voltage pulse signals to excite the probe module, the probe module is connected with a probe, the host module receives a plurality of ultrasonic feedback signals returned by a single probe, and a plurality of A scanning waveform data are displayed after being processed by the host module;
the host module transmits a control instruction to the multi-channel expansion module through the four-core shielded signal line for channel selection, transmits a pulse signal to the multi-channel expansion module through the single-core shielded radio frequency signal line, and transmits the pulse signal to the probe module through an analog switch in the multi-channel expansion module, wherein the probe module is connected with a plurality of probes;
the host module transmits a plurality of high-voltage pulse signals, single high-voltage pulse signals in a plurality of times are respectively transmitted to single probes in a plurality of probes through an analog switch in the pulse expansion module, the host module receives a plurality of ultrasonic feedback signals generated by the plurality of probes, and a plurality of A scanning waveform data are displayed after being processed by the host module.
The invention has the beneficial effects that: by arranging a plurality of channels capable of independently adjusting configuration parameters and waveform adjusting parameters, each channel can be provided with different probes to test different workpieces, which is equivalent to the operation of a plurality of independent instruments. The cost is greatly saved.
The parameters of each channel are all independently adjustable, the parameters of a plurality of channels can be stored in a standard configuration, and parameters which are required to be set in the measurement of sound velocity, probe type, and the like are not required to be reconfigured each time when the system is used, so that the consistency of the measurement is ensured, and the efficiency is improved.
The device has the advantages that an independent instrument can be connected with a plurality of probes in an external mode through the multichannel expansion module, the plurality of probes are expanded into a plurality of independent instruments, the upper computer is not required to cooperate, a plurality of thickness values and the A scanning waveform data of the current selected channel can be displayed at the display unit according to the number of the selected channels, the A scanning waveform data of the channels displayed on the display unit are switched one by one through the key unit, the displayed scanning waveform is the measuring signal of the current channel, the parameters of the plurality of channels can be adjusted, the working flow is simplified, the trouble and the instability caused by communication with the upper computer are not required to be considered, the cost is reduced, the modularized management is used in the device, the size is small, the integration level is high, the external interference shielding effect of the all-metal shell is good, the device is convenient to carry, the use is convenient, the channel interface and the control signal are expanded through the reserved expansion port on the basis of not changing the measuring function of the original ultrasonic thickness meter host computer module, the external device is required to be portable, the external device is easy to use, the external device is not interfered by external signal and the power consumption is low.
Drawings
Fig. 1 is a schematic structural diagram of a host module and a multi-channel expansion module of an ultrasonic multi-measurement system according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a host module of an ultrasonic multiple measurement system according to an embodiment of the invention.
Fig. 3 is a schematic diagram of a single chip microcomputer unit of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Fig. 4 is a schematic circuit connection diagram of FPGA chip units of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Fig. 5 is a circuit diagram of an ADC acquisition unit of an ultrasonic multiple measurement system according to an embodiment of the invention.
Fig. 6 is a circuit diagram of an amplifier unit of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Fig. 7 is a partial circuit diagram (1.5V) of a power supply unit of an ultrasonic multiple measurement system according to an embodiment of the present invention.
FIG. 8 is a partial circuit diagram (3.3V and 5V) of a power supply unit of an ultrasonic multiple measurement system according to one embodiment of the present invention
Fig. 9 is a circuit diagram of a control port of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Fig. 10 is a circuit diagram of a display unit and a key unit of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Fig. 11 is a schematic diagram of a multi-channel expansion module of an ultrasonic multi-measurement system according to an embodiment of the invention.
Fig. 12 is a circuit diagram of a linear buck voltage stabilizing unit, a first isolated voltage boosting unit, a second isolated voltage boosting unit and a non-isolated voltage boosting unit of an ultrasonic multiple measurement system according to an embodiment of the present invention.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Example 1
Referring to fig. 1-12, for one embodiment of the present invention, an ultrasonic multiple measurement system is provided, comprising a host module connected to a probe module;
the probe module is used for transmitting ultrasonic pulse signals and receiving ultrasonic feedback signals, the ultrasonic feedback signals are input into the host module and then converted into A scanning waveform data to be displayed, and the probe module comprises one probe or a plurality of probes.
In some embodiments, the host module, when used alone, is directly electrically connected to a probe. At the moment, the host module directly transmits a high-voltage pulse signal to the probe, the high-voltage pulse signal is excited to the piezoelectric wafer, the piezoelectric wafer vibrates to generate an ultrasonic pulse signal, the ultrasonic pulse signal is transmitted through the probe, the host module receives multiple ultrasonic feedback signals returned by a single probe, and a plurality of A scanning waveform data are displayed after being processed by the host module.
When the host module transmits a single high-voltage pulse signal to excite the probe, one A scanning waveform data is returned, the same waveform is used for each layer, the range, translation, noise reduction, echo noise reduction, gate, polarity 1, polarity 2, type, phase and multiple of waveform adjustment parameters can be independently adjusted in each layer to adapt to different testing conditions, but the gain is required to be the same for each layer, because the same waveform is used in a single high-voltage pulse signal mode, and the amplification amplitude of the same waveform cannot be different. When the host module transmits high-voltage pulse signals for exciting the probe for a plurality of times, different waveforms are used for each layer, so that all waveform adjustment parameters including gain are independently adjustable for each layer, and the problems in some multi-layer measurement applications can be solved. Specifically, the block steel plate with the paint layer on the bottom surface has high echo of the bottom surface of the coating and relatively low echo of the bottom surface of the base material when the thickness of the paint layer and the thickness of the steel plate are measured simultaneously. When the high-voltage pulse signal mode is used for a plurality of times, the gain of each layer is required to be consistent, the gain needs to be reduced when the coating layer is used for measuring the coating layer, the echo of the substrate is too low to obtain a reading when the substrate layer is switched to the substrate layer for measuring the substrate after the gain is reduced, and the coating layer cannot be accurately measured because the gain is too high after the substrate layer is used for increasing the gain. When the high-voltage pulse signals are excited for a plurality of times, each layer has independent A scanning waveform data, and the gain of each layer is independently adjustable, so that the problem can be well solved. Multilayer measurements can be used to measure and display the thickness of each layer simultaneously on a workpiece with a coating on the surface and a workpiece made of a multilayer composite material. The A scanning waveform data of each layer can be displayed independently, waveform adjustment parameters are independently adjustable, and partial configuration parameters are independently adjustable. If the automobile body that the multilayer sprays paint is measured, can show the paint thickness of each layer respectively to and the thickness of metal automobile body, the paint layer is very thin, can use unit um to show thickness, and the metal automobile body is thicker, can use mm to show thickness, and the independent adjustable of parameter lets the measurement become very nimble.
The host module comprises a display unit, a singlechip unit, a key unit, an FPGA chip unit, a storage unit, an ADC acquisition unit, an amplifier unit and a power supply unit, wherein the amplifier unit is electrically connected with the ADC acquisition unit, amplifies a received input signal and inputs an amplified differential signal into the ADC acquisition unit, the ADC acquisition unit is electrically connected with the FPGA chip unit in a bidirectional mode, the ADC acquisition unit inputs acquired data into the FPGA chip unit for analysis and identification, the FPGA chip unit is electrically connected with the singlechip unit in a bidirectional mode, the FPGA chip unit inputs the analyzed and identified A scanning waveform data into the singlechip unit, and the singlechip unit inputs the A scanning waveform data into the display unit for displaying the A scanning waveform data.
The key unit comprises a plurality of keys and a key circuit, and the key circuit is electrically connected with the singlechip unit. The pressing or lifting action of the key can be monitored by the singlechip unit.
In some embodiments, the display unit preferably uses a 2.4 inch IPS liquid crystal screen, the single-chip microcomputer unit preferably uses an enzhi (NXP) LPC2000 series single-chip microcomputer, the FPGA chip unit preferably uses an INTEL (INTEL) cyclonii series FPGA, the ADC acquisition unit preferably uses a 10 bit ADC, and referring to fig. 5, the ADC acquisition unit converts the analog differential signal output by the variable gain amplifier into a digital signal recognizable by the FPGA; referring to fig. 6, the amplifier unit preferably adopts an AD ultra low noise preamplifier of ADI, and the amplifier unit performs gain amplification on the input small signal according to the voltage of the gain control pin and transmits the small signal to the ADC acquisition chip through a differential signal. Referring to fig. 4, the fpga chip unit is configured to implement a programmable gate array, and implement high-frequency clock signal output, data acquisition and processing, and data communication with the MCU.
Referring to fig. 10, a circuit diagram of a display unit and a key unit, where the key unit includes a plurality of keys and a key circuit, and the key circuit is electrically connected to the single-chip microcomputer unit.
The singlechip unit is electrically connected with the amplifier unit, and controls the gain value of the amplifier unit by controlling the signal of the amplifier unit and performing gain adjustment on the amplifier unit.
The power supply module comprises a first direct-current boost conversion power supply chip unit, a second direct-current boost conversion power supply chip unit and a direct-current buck conversion power supply chip unit, wherein the first direct-current boost conversion power supply chip unit controls main power supply of the whole instrument;
the second direct-current boost converting power supply chip unit is electrically connected with the direct-current buck converting power supply chip unit, and the second direct-current boost converting power supply chip unit provides basic voltage for the LC oscillating high-voltage output circuit.
The FPGA chip unit needs 1.5V and 3.3V, the display unit, the singlechip unit and the ADC acquisition unit need 3.3V, and the amplifier unit needs 5V.
The power input unit is respectively and electrically connected with the control port, the linear buck-voltage stabilizing unit, the first isolation boosting unit and the second isolation boosting unit, the second isolation boosting unit is electrically connected with the non-isolation boosting unit, and the linear buck-voltage stabilizing unit, the first isolation boosting unit and the non-isolation boosting unit are electrically connected with the multi-channel expansion module through the filter circuit.
Referring to fig. 7, a partial circuit diagram of a power supply unit for converting a 3.3V voltage to a 1.5V voltage is shown.
Referring to fig. 8, which is a partial circuit diagram of the power supply unit, the battery voltage may be converted into 3.3V and 5V.
The single-chip microcomputer unit is electrically connected with the multichannel expansion module through the single-core shielded radio frequency signal wire and the single-core connector, the multichannel expansion module is electrically connected with the probe module, the single-chip microcomputer unit is electrically connected with the multichannel expansion module through the four-core shielded control signal wire to conduct channel selection, the host module is electrically connected with the multichannel expansion module through the single-core shielded radio frequency signal wire and is used for transmitting an ultrasonic pulse signal to the probe module from the selected channel, and then the ultrasonic feedback signal received by the probe module is transmitted back to the amplifier unit.
Referring to fig. 9, a control port circuit diagram is shown to implement data transfer bridging.
Referring to fig. 12, U02 represents a circuit diagram of the first isolated boost unit, converting 5V to 12V; u04 denotes a circuit diagram of the second isolated boost unit converting 5V to 24V; u03 represents a circuit diagram of the linear buck voltage stabilizing unit, converting 5V into 3.3V; u05 represents a circuit diagram of a non-isolated boost unit converting 12V to-150V.
Referring to fig. 12, the multi-channel expansion module is used for selecting to turn on or off a desired channel switch according to a control signal of the microcontroller and transmitting a pulse signal.
In some embodiments, the host module is connected to the probe module through a multi-channel expansion module, the multi-channel expansion module includes a multi-channel analog switch unit, a linear buck voltage stabilizing unit, a first isolated boost unit, a second isolated boost unit, a non-isolated boost unit, a filter circuit, a four-core connector, a single-core connector and a power input unit, the single-chip unit is electrically connected to the four-core connector through a four-core shielded control signal line, then the four-core connector is electrically connected to a control port of the multi-channel analog switch unit in the multi-channel expansion module, and the multi-channel analog switch unit is electrically connected to the probe module;
the single chip microcomputer unit is electrically connected with the single-core connector through a single-core shielded radio frequency signal wire, and the single-core connector is communicated with an opened channel of the multi-channel analog switch unit in the multi-channel expansion module;
the power input unit is electrically connected with the linear buck-voltage stabilizing unit, the first isolation boosting unit and the second isolation boosting unit respectively, the second isolation boosting unit is electrically connected with the non-isolation boosting unit, and the linear buck-voltage stabilizing unit, the first isolation boosting unit and the non-isolation boosting unit are electrically connected with the multichannel analog switch unit through the filter circuit.
In some embodiments, when the host module needs to connect multiple probes simultaneously, the host module connects multiple probes simultaneously through the multi-channel expansion module. At this time, the host module transmits a high-voltage pulse signal to the probe module through the multi-channel expansion module, the high-voltage pulse signal is excited to the piezoelectric wafer, the piezoelectric wafer vibrates to generate an ultrasonic pulse signal, and the ultrasonic pulse signal is transmitted through the probe.
In some embodiments, the host module is electrically connected to the multi-channel expansion module through a four-core and shielded control signal line, and a single chip microcomputer unit in the host module sends a channel control instruction to the multi-channel expansion module to control the selection, opening or closing of channels in the multi-channel expansion module.
In some embodiments, the host module transmits a high-voltage pulse signal to the probe module through the multi-channel expansion module, the probe has a piezoelectric wafer which is a key component, the high-voltage pulse signal is excited on the piezoelectric wafer, and the piezoelectric wafer vibrates to generate an ultrasonic pulse signal.
In some embodiments, the host module firstly starts the multi-channel function, selects a channel number to be started from the multi-channel setting options, connects the multi-channel module through the four-core shielding wire, starts corresponding channels of the multi-channel expansion module according to the channel options which are started in advance, and sends pulse signals to probes of the corresponding channels through the single-core shielding radio frequency signal wire when the corresponding channels are started, and converts signals returned by the probes into A scanning waveform data after processing, and displays the A scanning waveform data through the display unit. The parameter settings among the channels are not interfered with each other, and the parameter settings are stored in the storage units corresponding to the channels by the host module.
In some embodiments, the multi-channel expansion module is configured to select the number of channels and the number of channels to be opened, and display the a-scan waveform data of the plurality of channels and the scan waveform of the currently selected channel on the display unit according to the selected number of channels;
inputting control information through keys, inputting the control information into a single chip microcomputer unit through a key circuit, and then adjusting waveform parameters and configuration parameters of each channel by the single chip microcomputer unit based on the control information, wherein the waveform parameters comprise gain, range, translation, silencing, echo silencing, gate, polarity 1, polarity 2, type, phase and multiple;
configuration parameters include probe type, probe frequency, measurement mode, speed of sound, unit and resolution;
and respectively and independently setting waveform parameters and configuration parameters of the channels.
The host module further comprises a storage unit, wherein the storage unit is electrically connected with the singlechip unit, and after the waveform parameters and the configuration parameters of the channels are set, the waveform adjustment parameters and the configuration parameters of the channels are stored in the storage unit by pressing a storage key;
the singlechip unit invokes the waveform parameters and the configuration parameter information in the storage unit, and adjusts the waveform parameters and the configuration parameters of each channel based on the waveform parameters and the configuration parameter information in the storage unit.
The parameters of each channel are all independently adjustable, the parameters of a plurality of channels can be stored in a standard configuration, and parameters which are required to be set in the measurement of sound velocity, probe type, and the like are not required to be reconfigured each time when the system is used, so that the consistency of measurement is ensured, and the efficiency is greatly improved.
By arranging a plurality of channels capable of independently adjusting configuration parameters and waveform adjusting parameters, each channel can be provided with different probes to test different workpieces, which is equivalent to the operation of a plurality of independent instruments. The cost is greatly saved.
The device has the advantages that an independent instrument can be connected with a plurality of probes in an external mode through the multichannel expansion module, the plurality of probes are expanded into a plurality of independent instruments, the upper computer is not required to cooperate, a plurality of thickness values and the A scanning waveform data of the current selected channel can be displayed at the display unit according to the number of the selected channels, the A scanning waveform data of the channels displayed on the display unit are switched one by one through the key unit, the displayed scanning waveform is the measuring signal of the current channel, the parameters of the plurality of channels can be adjusted, the working flow is simplified, the trouble and the instability caused by communication with the upper computer are not required to be considered, the cost is reduced, the modularized management is used in the device, the size is small, the integration level is high, the external interference shielding effect of the all-metal shell is good, the device is convenient to carry, the use is convenient, the channel interface and the control signal are expanded through the reserved expansion port on the basis of not changing the measuring function of the original ultrasonic thickness meter host computer module, the external device is convenient to use, the external device is not interfered by external signal and the external device and has low power consumption.
Example 2
The embodiment is based on the previous embodiment, and is different from the previous embodiment in that an ultrasonic multiple measurement method is provided, which includes that a host module sends a high-voltage pulse signal to a multi-channel expansion module through a single-core shielded radio frequency signal wire, and the high-voltage pulse signal is divided into a single high-voltage pulse signal and a plurality of high-voltage pulse signals;
the host module transmits a single high-voltage pulse signal to excite the probe module, the probe module is connected with a probe, the host module receives a single ultrasonic feedback signal returned by a single probe, and single A scanning waveform data is displayed after being processed by the host module;
the host module transmits a plurality of high-voltage pulse signals to excite the probe module, the probe module is connected with a probe, the host module receives a plurality of ultrasonic feedback signals returned by a single probe, and a plurality of A scanning waveform data are displayed after being processed by the host module;
the host module transmits a control instruction to the multi-channel expansion module through the four-core shielded signal line for channel selection, transmits a pulse signal to the multi-channel expansion module through the single-core shielded radio frequency signal line, and transmits the pulse signal to the probe module through an analog switch in the multi-channel expansion module, wherein the probe module is connected with a plurality of probes;
the host module transmits a plurality of high-voltage pulse signals, single high-voltage pulse signals in a plurality of times are respectively transmitted to single probes in a plurality of probes through an analog switch in the pulse expansion module, the host module receives a plurality of ultrasonic feedback signals generated by the plurality of probes, and a plurality of A scanning waveform data are displayed after being processed by the host module.
In some embodiments, the multiple measurement method is divided into a single high voltage pulse signal excitation and multiple high voltage pulse signal excitations in an excitation manner.
The excitation means that the host module transmits a high-voltage pulse signal, the high-voltage pulse signal is applied to the probe, the piezoelectric wafer on the probe vibrates to generate ultrasonic waves, the probe contacts the test workpiece, reflection is generated after the ultrasonic pulse signal propagates to the bottom surface of the workpiece, the piezoelectric wafer in the probe receives the reflected ultrasonic waves, the inverse piezoelectric effect is generated, the ultrasonic waves are converted into electric signals, and the electric signals are received by the host module and processed into A scanning waveform data and displayed.
The single high-voltage pulse signal excitation comprises that the main module machine transmits a single high-voltage pulse signal excitation probe, and is applied to a single-point single-layer measurement scene and a single-point multi-layer measurement scene. The multi-time high-voltage pulse signal excitation refers to that the host module transmits the multi-time high-voltage pulse signal excitation probe, and the probe is applied to a single-point single-layer measurement scene, a single-point multi-layer measurement scene and a multi-point measurement scene. The multi-point (multi-channel) measurement scene can only be excited by using multiple high-voltage pulse signals, the multi-point (multi-channel) measurement scene is characterized in that a host module transmits multiple high-voltage pulse signal excitation, the high-voltage pulse signal excitation is transmitted to a multi-channel expansion module through a single-core shielded signal wire, after each channel of the multi-channel expansion module receives one single high-voltage pulse signal excitation signal excited by the multiple high-voltage pulse signal excitation, a probe connected to the channel is excited, each probe transmits an ultrasonic pulse signal, the ultrasonic pulse signal is transmitted to the bottom surface of a workpiece to generate reflection, a piezoelectric wafer in the probe receives the reflected ultrasonic wave to generate inverse piezoelectric effect, the ultrasonic wave is converted into an electric signal, and the electric signal is received by the host module and processed into A-scanning waveform data and displayed.
In some embodiments, the application scenarios of the multiple measurement method are divided into three types, namely single-point single-layer measurement, single-point multi-layer measurement and multi-point (multi-channel) measurement;
the single-point single-layer measurement is specifically as follows: only one probe needs to be equipped with the host module, and when the host module transmits a single high-voltage pulse signal to excite the probe, one piece of A scanning waveform data is returned, which is a conventional measurement method. When the host module transmits high-voltage pulse signals for multiple times to excite the probe, a plurality of A scanning waveform data are returned, and because waveform adjustment parameters of each waveform are independently adjustable, the single-point single-layer thickness accuracy can be verified by setting different observation ranges for each A scanning waveform data, and realizing regional amplified observation of single-point measurement and using different measurement modes for a plurality of waveforms.
The single-point multilayer measurement is specifically: when the host module transmits a single high-voltage pulse signal to excite the probe, the probe returns an A scanning waveform data, each layer uses the same waveform, and the range, translation, silencing, echo silencing, gate, polarity 1, polarity 2, type, phase and multiple of waveform adjusting parameters can be independently adjusted in each layer to adapt to different testing conditions, but the gain is the same in each layer, because the same waveform is used in the single high-voltage pulse signal mode, and the amplification amplitude of the same waveform cannot be different. Using multiple high voltage pulse signal patterns, each layer uses a different waveform, so all waveform adjustment parameters, including gain, are independently adjustable for each layer, which can solve the problems in some multi-layer measurement applications. Specifically, the block steel plate with the paint layer on the bottom surface has high echo of the bottom surface of the coating and relatively low echo of the bottom surface of the base material when the thickness of the paint layer and the thickness of the steel plate are measured simultaneously. When the high-voltage pulse signal mode is used for a plurality of times, the gain of each layer is required to be consistent, the gain needs to be reduced when the coating layer is used for measuring the coating layer, the echo of the substrate is too low to obtain a reading when the substrate layer is switched to the substrate layer for measuring the substrate after the gain is reduced, and the coating layer cannot be accurately measured because the gain is too high after the substrate layer is used for increasing the gain. When the high-voltage pulse signals are excited for a plurality of times, each layer has independent A scanning waveform data, and the gain of each layer is independently adjustable, so that the problem can be well solved. Multilayer measurements can be used to measure and display the thickness of each layer simultaneously on a workpiece with a coating on the surface and a workpiece made of a multilayer composite material. The A scanning waveform data of each layer can be displayed independently, waveform adjustment parameters are independently adjustable, and partial configuration parameters are independently adjustable. If the automobile body that the multilayer sprays paint is measured, can show the paint thickness of each layer respectively to and the thickness of metal automobile body, the paint layer is very thin, can use unit um to show thickness, and the metal automobile body is thicker, can use mm to show thickness, and the independent adjustable of parameter lets the measurement become very nimble.
The multipoint (multichannel) measurement is specifically: the multi-channel expansion module is connected with a plurality of probes, and the probes are used for measuring a plurality of points. It should be noted that the multipoint measurement can only be excited by using a plurality of high-voltage pulse signals, and the working procedure is as follows: the host module transmits multiple high-voltage pulse signals, the multiple high-voltage pulse signals are transmitted to the multi-channel expansion module through a single-core shielded radio frequency signal line, after each channel of the multi-channel expansion module receives one single high-voltage pulse signal excitation signal of the multiple high-voltage pulse signals, a probe connected to the channel is excited, each probe returns an ultrasonic signal, and each channel generates a piece of A scanning waveform data. Because the multi-point (multi-channel) measurement adopts multiple high-voltage pulse signal excitation, each channel has independent A scanning waveform data, and all waveform adjustment parameters are independently adjustable. Multipoint (multichannel) measurement is widely applied, for example, the measurement of the thickness of a pipeline at multiple points is needed to be respectively carried out at the positions of 12 points, 3 points, 6 points and 9 points of the pipeline. If the common thickness gauge is required to realize the measurement of four points at the same time, four instruments are required to be used, or 1 instrument is used for respectively measuring the four points, so that the application of simultaneous measurement cannot be realized. The method can realize multi-point simultaneous measurement of multiple probes by using only one instrument, which is equivalent to the operation of multiple independent instruments. The cost is greatly saved.
It should be appreciated that embodiments of the invention may be implemented or realized by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer readable memory. The methods may be implemented in a computer program using standard programming techniques, including a non-transitory computer readable storage medium configured with a computer program, where the storage medium so configured causes a computer to operate in a specific and predefined manner, in accordance with the methods and drawings described in the specific embodiments. Each program may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) can be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language. Furthermore, the program can be run on a programmed application specific integrated circuit for this purpose.
It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered in the scope of the claims of the present invention.
Claims (3)
1. An ultrasonic multiplex measurement method, comprising:
the host module sends a high-voltage pulse signal to the multi-channel expansion module through a single-core shielded radio frequency signal wire, and the high-voltage pulse signal is divided into a single high-voltage pulse signal and a plurality of high-voltage pulse signals;
the host module transmits a single high-voltage pulse signal to excite the probe module, the probe module is connected with a probe, the host module receives a single ultrasonic feedback signal returned by a single probe, and single A scanning waveform data is displayed after being processed by the host module;
the host module transmits a plurality of high-voltage pulse signals to excite the probe module, the probe module is connected with a probe, the host module receives a plurality of ultrasonic feedback signals returned by a single probe, and a plurality of A scanning waveform data are displayed after being processed by the host module;
the host module transmits a control instruction to the multi-channel expansion module through the four-core shielded signal line for channel selection, transmits a pulse signal to the multi-channel expansion module through the single-core shielded radio frequency signal line, and transmits the pulse signal to the probe module through an analog switch in the multi-channel expansion module, wherein the probe module is connected with a plurality of probes;
the host module transmits a plurality of high-voltage pulse signals, single high-voltage pulse signals in a plurality of times are respectively transmitted to single probes in a plurality of probes through an analog switch in the pulse expansion module, the host module receives a plurality of ultrasonic feedback signals generated by the plurality of probes, and a plurality of A scanning waveform data are displayed after being processed by the host module;
an ultrasonic multiple measurement system based on the method comprises:
the host module is connected with the probe module;
the probe module is used for transmitting ultrasonic pulse signals and receiving ultrasonic feedback signals, and converting the ultrasonic feedback signals into A scanning waveform data for display after being input into the host module, and the probe module comprises one probe or a plurality of probes;
the host module comprises a display unit, a singlechip unit, a key unit, an FPGA chip unit, a storage unit, an ADC acquisition unit, an amplifier unit and a power supply unit, wherein the amplifier unit is electrically connected with the ADC acquisition unit, amplifies a received input signal, inputs an amplified differential signal into the ADC acquisition unit, the ADC acquisition unit is electrically connected with the FPGA chip unit in a bidirectional manner, inputs acquired data into the FPGA chip unit for analysis and identification, the FPGA chip unit is electrically connected with the singlechip unit in a bidirectional manner, the FPGA chip unit inputs the analyzed and identified A scanning waveform data into the singlechip unit, and the singlechip unit inputs the A scanning waveform data into the display unit for displaying the A scanning waveform data;
the key unit comprises a plurality of keys and a key circuit, and the key circuit is electrically connected with the singlechip unit;
the singlechip unit is electrically connected with the amplifier unit, and controls the gain value of the amplifier unit by controlling the signal of the amplifier unit and performing gain adjustment on the amplifier unit;
the power supply module comprises a first direct-current boost conversion power supply chip unit, a second direct-current boost conversion power supply chip unit and a direct-current buck conversion power supply chip unit, wherein the first direct-current boost conversion power supply chip unit controls main power supply of the whole instrument;
the second direct-current boost converting power supply chip unit is electrically connected with the direct-current buck converting power supply chip unit, and the second direct-current boost converting power supply chip unit provides basic voltage for the LC oscillating high-voltage output circuit;
the system comprises a host module, a probe module, a multi-channel expansion module, a multi-channel analog switch unit, a linear voltage reduction and stabilization unit, a first isolation boosting unit, a second isolation boosting unit, a non-isolation boosting unit, a filter circuit, a four-core connector, a single-core connector and a power input unit, wherein the host module is connected with the probe module through the multi-channel expansion module;
the single chip microcomputer unit is electrically connected with the single-core connector through a single-core shielded radio frequency signal wire, and the single-core connector is communicated with an opened channel of the multi-channel analog switch unit in the multi-channel expansion module;
the power input unit is respectively and electrically connected with the linear buck-voltage stabilizing unit, the first isolation boosting unit and the second isolation boosting unit, the second isolation boosting unit is electrically connected with the non-isolation boosting unit, and the linear buck-voltage stabilizing unit, the first isolation boosting unit and the non-isolation boosting unit are electrically connected with the multichannel analog switch unit through the filter circuit;
the multi-channel analog switch unit selects the number of the opened channels and the channel number according to the control signal sent by the singlechip unit, and simultaneously displays a plurality of thickness values and A scanning waveform data of the currently selected channel on the display unit according to the selected number of the channels;
the A scanning waveform data of the channels displayed on the display unit are switched one by one through the key unit, and the displayed scanning waveform is the measuring signal of the current channel.
2. The ultrasonic multiplex measurement method according to claim 1, wherein:
inputting control information through keys, inputting the control information into a single chip microcomputer unit through a key circuit, and then adjusting waveform parameters and configuration parameters of each channel by the single chip microcomputer unit based on the control information, wherein the waveform parameters comprise gain, range, translation, silencing, echo silencing, gate, polarity 1, polarity 2, type, phase and multiple;
configuration parameters include probe type, probe frequency, measurement mode, speed of sound, unit and resolution;
and respectively and independently setting waveform parameters and configuration parameters of the channels.
3. The ultrasonic multiplex measurement method according to claim 2, wherein:
the host module further comprises a storage unit, wherein the storage unit is electrically connected with the singlechip unit, and after the waveform parameters and the configuration parameters of the channels are set, the waveform adjustment parameters and the configuration parameters of the channels are stored in the storage unit by pressing a storage key;
the singlechip unit invokes the waveform parameters and the configuration parameter information in the storage unit, and adjusts the waveform parameters and the configuration parameters of each channel based on the waveform parameters and the configuration parameter information in the storage unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410073980.1A CN117589097B (en) | 2024-01-18 | 2024-01-18 | Ultrasonic wave multiple measurement system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410073980.1A CN117589097B (en) | 2024-01-18 | 2024-01-18 | Ultrasonic wave multiple measurement system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117589097A CN117589097A (en) | 2024-02-23 |
| CN117589097B true CN117589097B (en) | 2024-04-05 |
Family
ID=89915392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410073980.1A Active CN117589097B (en) | 2024-01-18 | 2024-01-18 | Ultrasonic wave multiple measurement system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117589097B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106468538A (en) * | 2015-08-23 | 2017-03-01 | 李福霞 | Multi-channel electromagnetic ultrasonic thickness measurement system |
| CN109781861A (en) * | 2017-11-10 | 2019-05-21 | 国核电站运行服务技术有限公司 | The primary/secondary multichannel ultrasonic acquisition system of electronic switch type and electronic equipment |
| CN109781841A (en) * | 2017-11-10 | 2019-05-21 | 国核电站运行服务技术有限公司 | Primary/secondary channel ultrasonic detection system and electronic equipment |
| CN110045017A (en) * | 2019-04-26 | 2019-07-23 | 中国计量大学 | The underwater ultrasound phased array fault detection system of wireless data transmission and method of detection |
| CN110687407A (en) * | 2019-09-30 | 2020-01-14 | 南澳电气(武汉)有限公司 | Automatic positioning system for detecting and analyzing ultrasonic waves of eight-channel partial discharge tester |
| CN111257412A (en) * | 2020-02-05 | 2020-06-09 | 天津大学 | Array type ultrasonic scanning imaging system for multiphase flow measurement |
| CN114813942A (en) * | 2022-04-13 | 2022-07-29 | 北京工业大学 | Multipurpose modularization multichannel ultrasonic detection system |
| CN115856094A (en) * | 2022-11-25 | 2023-03-28 | 北京工业大学 | Multi-channel ultrasonic guided wave detection system based on embedded computer module |
| CN117054522A (en) * | 2023-08-17 | 2023-11-14 | 沈阳理工大学 | Online ultrasonic detection device for horizontal continuous casting copper tube blank |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8001841B2 (en) * | 2005-10-14 | 2011-08-23 | Olympus Ndt | Ultrasonic fault detection system using a high dynamic range analog to digital conversion system |
-
2024
- 2024-01-18 CN CN202410073980.1A patent/CN117589097B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106468538A (en) * | 2015-08-23 | 2017-03-01 | 李福霞 | Multi-channel electromagnetic ultrasonic thickness measurement system |
| CN109781861A (en) * | 2017-11-10 | 2019-05-21 | 国核电站运行服务技术有限公司 | The primary/secondary multichannel ultrasonic acquisition system of electronic switch type and electronic equipment |
| CN109781841A (en) * | 2017-11-10 | 2019-05-21 | 国核电站运行服务技术有限公司 | Primary/secondary channel ultrasonic detection system and electronic equipment |
| CN110045017A (en) * | 2019-04-26 | 2019-07-23 | 中国计量大学 | The underwater ultrasound phased array fault detection system of wireless data transmission and method of detection |
| CN110687407A (en) * | 2019-09-30 | 2020-01-14 | 南澳电气(武汉)有限公司 | Automatic positioning system for detecting and analyzing ultrasonic waves of eight-channel partial discharge tester |
| CN111257412A (en) * | 2020-02-05 | 2020-06-09 | 天津大学 | Array type ultrasonic scanning imaging system for multiphase flow measurement |
| CN114813942A (en) * | 2022-04-13 | 2022-07-29 | 北京工业大学 | Multipurpose modularization multichannel ultrasonic detection system |
| CN115856094A (en) * | 2022-11-25 | 2023-03-28 | 北京工业大学 | Multi-channel ultrasonic guided wave detection system based on embedded computer module |
| CN117054522A (en) * | 2023-08-17 | 2023-11-14 | 沈阳理工大学 | Online ultrasonic detection device for horizontal continuous casting copper tube blank |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117589097A (en) | 2024-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7155957B2 (en) | Apparatus and methods for testing acoustic probes and systems | |
| CN105406611B (en) | Determined the device and method of metallic walls ultrasound wireless energy transfer CHANNEL OPTIMIZATION frequency | |
| CN103575806B (en) | Low-power consumption ultrasonic phase array R-T unit | |
| CN107449475B (en) | Ultrasonic flowmeter | |
| CN209858640U (en) | Ultrasonic transducer multi-resonance-point characteristic parameter measuring device | |
| CN105675725A (en) | Ultrasonic pulse transmitting-receiving system based on FPGA control | |
| US7278289B2 (en) | Apparatus and methods for testing acoustic systems | |
| CN114813942B (en) | Multipurpose modularization multichannel ultrasonic detection system | |
| CN114755311B (en) | Method and measuring device for detecting consistency of array elements of ultrasonic probe | |
| CN117589097B (en) | Ultrasonic wave multiple measurement system and method | |
| CN111374696A (en) | Ultrasonic diagnostic apparatus and ultrasonic imaging method | |
| CN106770647B (en) | Fat content measuring system and method | |
| US6928856B2 (en) | Apparatus and methods for interfacing acoustic testing apparatus with acoustic probes and systems | |
| CN102944288A (en) | Ultrasonic liquid level meter with multi-range adaptive function | |
| CN211627456U (en) | Ultrasonic flaw detection instrument | |
| CN110531344B (en) | Special integrated circuit for ultrasonic multi-channel phased array detection automatic resonance and directional receiving | |
| CN202956167U (en) | Ultrasonic level meter with function of multi-range adaption | |
| CN210774331U (en) | Combined sound velocity measuring equipment | |
| CN113138425B (en) | Logging-while-drilling electromagnetic wave data acquisition method and device | |
| CN211785317U (en) | Calibration system for sand production monitoring array transducer of oil and gas well | |
| RU2723058C1 (en) | Method and device for compensation of heterogeneity of connection at ultrasonic test | |
| CN205049531U (en) | Ultrasonic probe testing device | |
| CN217083794U (en) | Program-controlled linear array acoustic array sensitivity testing system | |
| CN112730985A (en) | Special spectrum analyzer for surface wave marine environment surveying equipment | |
| CN220473443U (en) | Electromagnetic ultrasonic detection system for surface defects of antenna wheel rail |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |