CN117580261A - Method and equipment for manufacturing flexible copper-clad plate - Google Patents
Method and equipment for manufacturing flexible copper-clad plate Download PDFInfo
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- CN117580261A CN117580261A CN202311670402.8A CN202311670402A CN117580261A CN 117580261 A CN117580261 A CN 117580261A CN 202311670402 A CN202311670402 A CN 202311670402A CN 117580261 A CN117580261 A CN 117580261A
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- copper
- layer
- clad
- substrate
- flexible
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 81
- 229910052802 copper Inorganic materials 0.000 claims abstract description 81
- 239000010949 copper Substances 0.000 claims abstract description 81
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 238000004140 cleaning Methods 0.000 claims abstract description 51
- 238000007747 plating Methods 0.000 claims abstract description 43
- 238000004544 sputter deposition Methods 0.000 claims abstract description 36
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 28
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000001035 drying Methods 0.000 claims abstract description 26
- 238000009713 electroplating Methods 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 19
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 18
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 18
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 239000011265 semifinished product Substances 0.000 claims abstract description 12
- 239000000047 product Substances 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 230000003647 oxidation Effects 0.000 claims description 22
- 238000007254 oxidation reaction Methods 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000007731 hot pressing Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 230000003064 anti-oxidating effect Effects 0.000 claims description 4
- 150000001722 carbon compounds Chemical class 0.000 claims description 4
- 150000001845 chromium compounds Chemical class 0.000 claims description 4
- 150000002697 manganese compounds Chemical class 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 150000002816 nickel compounds Chemical class 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 150000003377 silicon compounds Chemical class 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229910052748 manganese Inorganic materials 0.000 claims description 3
- 239000011572 manganese Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 79
- 230000000052 comparative effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a method and equipment for manufacturing a flexible copper-clad plate, and relates to the technical field of copper-clad plate manufacturing. The manufacturing method of the flexible copper-clad plate comprises the following steps: taking a flexible substrate, and cleaning and drying the flexible substrate; depositing a connecting layer on the surfaces of two sides of the substrate through a sputtering process; depositing a copper seed layer on the two side surfaces of the connecting layer through a sputtering process; attaching liquid crystal polymer films on two sides of a copper seed layer, and sending the liquid crystal polymer films into a heating roller together for hot press molding to obtain a copper-clad layer; electroplating the two sides of the copper-clad layer through a continuous electroplating process to form a copper-clad layer; cleaning the copper plating layer, and placing the copper plating layer in antioxidant liquid to form a copper plating layer coated with an antioxidant film; cleaning the copper coating again, and drying to obtain a semi-finished product; cutting the semi-finished product, and sequentially carrying out baking treatment and flattening treatment to obtain the flexible copper-clad plate finished product. The invention can enable the copper layer to be tightly attached to the flexible substrate, and is not easy to fall off.
Description
Technical Field
The invention relates to the technical field of copper-clad plate manufacturing, in particular to a flexible copper-clad plate manufacturing method and device.
Background
With the gradual miniaturization and weight reduction of electronic devices such as notebook computers, mobile phones, personal digital assistants, cameras, electronic notebooks, flexible printed circuit boards suitable for tape automated bonding, flip chip, etc., are increasingly demanded. Therefore, the demand for manufacturing flexible copper clad laminates is also increasing.
Printed circuit boards (Printed Circuit Board, abbreviated as PCBs) serve as a key connection and support function in electronic components, while Flexible Copper Clad Laminate (FCCL) is a base material for circuit boards, and thus have wide application in numerous electronic products.
In the process of electroplating the flexible substrate in the process of producing the flexible copper-clad plate, namely, electroplating a layer of copper on the surface layer of the flexible substrate, the flexible substrate is placed in electroplating liquid for electroplating in the traditional manufacturing method to obtain the flexible copper-clad plate, however, the bonding force between the substrate and the copper layer in the flexible copper-clad plate obtained by the manufacturing method is insufficient, so that the copper layer is easy to separate, and the quality of a product is affected. Therefore, the existing flexible copper-clad plate manufacturing method has the problem of low product quality.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a method and equipment for manufacturing a flexible copper-clad plate, which solve the problem of low product quality.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: a manufacturing method of a flexible copper-clad plate comprises the following steps:
step one: processing a substrate:
taking a flexible substrate, cleaning the flexible substrate, and drying the flexible substrate to remove redundant water;
step two: primary sputtering:
depositing a connecting layer on the two side surfaces of the substrate through a sputtering process;
step three: and (3) secondary sputtering:
depositing a copper seed layer on the two side surfaces of the connecting layer through a sputtering process;
step four: hot press molding:
providing a liquid crystal polymer film, attaching the liquid crystal polymer film to two sides of the copper seed layer, and sending the liquid crystal polymer film and the copper seed layer into a heating roller together for hot press molding to obtain a copper-clad layer;
step five: continuous electroplating:
electroplating the two sides of the copper-clad layer respectively through a continuous electroplating process to form a copper-clad layer;
step six: and (3) coating an antioxidation film:
cleaning the copper plating layer, and placing the copper plating layer in antioxidant liquid to generate antioxidant films on the surfaces of two sides of the copper plating layer, so as to form a copper plating layer coated with the antioxidant films;
step seven: preparing a semi-finished product:
cleaning the copper plating layer coated with the antioxidant film again, and drying to obtain a flexible copper-clad plate semi-finished product;
step eight: preparing a flexible copper-clad plate finished product:
cutting the semi-finished flexible copper clad laminate, and sequentially carrying out baking treatment and flattening treatment to obtain the finished flexible copper clad laminate.
Preferably, in the first step, the substrate is made of one or two polymers of liquid crystal high molecular polymer and polytetrafluoroethylene.
Preferably, in the first step and the seventh step, the cleaning mode is as follows: carrying out microwave cleaning on the substrate by adopting deionized water; the drying mode is as follows: and heating the substrate by microwaves in a vacuum environment.
Preferably, the temperature of the microwave cleaning is 30-40 ℃, and the time of the microwave cleaning is 10-30min; the microwave frequency of the microwave heating is 300MHz-300GHz, and the time of the microwave heating is 10-20min.
Preferably, in the second step, the connection layer is one or more of nickel, nickel compound, chromium compound, aluminum compound, carbon compound, silicon compound, manganese, and manganese compound.
Preferably, in the fourth step, the temperature of the heating roller is 150-200 ℃.
Preferably, in the sixth step, the antioxidant solution is an organic solvent containing methylbenzotriazole.
Preferably, in the eighth step, the baking treatment is performed in the following manner: baking in a high-temperature tunnel furnace at 290-330 deg.c for 30-100s; the flattening treatment mode is as follows: flattening by adopting a low-temperature hot pressing plate, wherein the temperature of flattening treatment is 100-160 ℃, the pressure is 5-20Mpa, and the time is 50-200s.
The invention further discloses a flexible copper-clad plate manufacturing device, which comprises:
the substrate cleaning device comprises a cleaning tank and a drying furnace, wherein the cleaning tank is used for cleaning the substrate by microwaves, and the drying furnace is used for heating the substrate by microwaves;
the first DC sputtering device is used for depositing a connecting layer on the two side surfaces of the substrate;
the second DC sputtering device is used for depositing a copper seed layer on the two side surfaces of the connecting layer;
the heating roller is used for hot-pressing the liquid crystal polymer film and the copper seed layer to form a copper-clad layer;
plating bath for electroplating two sides of the copper-clad layer to form copper-clad layer;
an oxidation resisting liquid pool, wherein oxidation resisting films are formed on the surfaces of two sides of the copper plating layer through oxidation resisting liquid in the oxidation resisting liquid pool, and the copper plating layer covered with the oxidation resisting films is formed;
the cutting device is used for cutting the semi-finished product of the flexible copper-clad plate;
the high-temperature tunnel furnace and the low-temperature hot pressure plate are used for baking and flattening the semi-finished flexible copper-clad plate to obtain the finished flexible copper-clad plate.
(III) beneficial effects
The invention provides a method and equipment for manufacturing a flexible copper-clad plate. The beneficial effects are as follows:
1. through carrying out the secondary sputtering to flexible substrate, can effectively improve the effect of attaching to copper, cooperate hot pressing and electroplating again, can make copper layer and flexible substrate closely laminate, be difficult for droing.
2. The copper plating layer is cleaned and placed in the antioxidant liquid to be coated with the antioxidant film, so that the antioxidant capacity of the flexible copper-clad plate is enhanced, and the quality of the manufactured product is greatly improved.
3. The product has lower dielectric constant and better dielectric property, so that the electric signal is rapidly transmitted.
Drawings
FIG. 1 is a schematic flow chart of a manufacturing method of the present invention;
fig. 2 is a simplified schematic structure of the present invention.
1, cleaning a tank; 2. a drying furnace; 3. a first DC sputtering device; 4. a second DC sputtering device; 5. a heating roller; 6. plating bath; 7. an antioxidant liquid pool; 8. a cutting device; 9. a high temperature tunnel furnace; 10. low temperature thermal platen.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
as shown in fig. 2, an embodiment of the present invention provides a flexible copper clad laminate manufacturing apparatus, including:
a cleaning tank 1 and a drying oven 2, wherein the cleaning tank 1 is used for cleaning the substrate by microwave, and the drying oven 2 is used for heating the substrate by microwave;
a first DC sputtering device 3 for depositing a connection layer on both side surfaces of the substrate;
a second DC sputtering device 4 for depositing a copper seed layer on both side surfaces of the connection layer;
a heating roller 5 for hot-pressing the liquid crystal polymer film and the copper seed layer to form a copper-clad layer;
plating tanks 6 for plating both sides of the copper-clad layer to form a copper-clad layer;
an antioxidant liquid pool 7, wherein antioxidant films are generated on the surfaces of two sides of the copper plating layer through antioxidant liquid in the antioxidant liquid pool 7, so that the copper plating layer covered with the antioxidant films is formed;
the cutting device 8 is used for cutting the semi-finished flexible copper-clad plate;
the high-temperature tunnel furnace 9 and the low-temperature hot pressure plate 10 are used for baking and flattening the semi-finished flexible copper-clad plate to obtain the finished flexible copper-clad plate.
With reference to fig. 1, the manufacturing method of the flexible copper-clad plate is obtained by the manufacturing equipment, and comprises the following steps:
step one: processing a substrate:
taking a flexible substrate which is a liquid crystal high polymer, placing the substrate in a cleaning tank 1, and carrying out microwave cleaning on the substrate by adopting deionized water, wherein the temperature of the microwave cleaning is 30 ℃, and the time of the microwave cleaning is 10min; then placing the substrate in a drying furnace 2, and carrying out microwave heating and drying on the substrate in a vacuum environment, wherein the microwave frequency of microwave heating is 300MHz, the microwave heating time is 10min, and redundant water is removed;
step two: primary sputtering:
depositing a connecting layer on the two side surfaces of the substrate by using a first DC sputtering device 3 through a sputtering process, wherein the connecting layer is a mixture of nickel, nickel compound, chromium compound, aluminum compound, carbon compound, silicon compound, manganese and manganese compound;
step three: and (3) secondary sputtering:
depositing a copper seed layer on both side surfaces of the connection layer through a sputtering process using a second DC sputtering device 4;
step four: hot press molding:
providing a liquid crystal polymer film, attaching the liquid crystal polymer film to two sides of the copper seed layer, and sending the liquid crystal polymer film and the copper seed layer into a heating roller 5 for hot press molding, wherein the temperature of the heating roller is 150 ℃ to obtain a copper-clad layer;
step five: continuous electroplating:
electroplating both sides of the copper-clad layer by using an electroplating bath 6 through a continuous electroplating process to form a copper-clad layer;
step six: and (3) coating an antioxidation film:
placing the copper plating layer in a cleaning tank 1, cleaning the copper plating layer, placing the copper plating layer in an oxidation resisting liquid pool 7, wherein the oxidation resisting liquid pool 7 contains oxidation resisting liquid, and the oxidation resisting liquid is an organic solvent containing methylbenzotriazole so as to generate oxidation resisting films on the surfaces of two sides of the copper plating layer and form the copper plating layer covered with the oxidation resisting films;
step seven: preparing a semi-finished product:
sequentially placing the copper plating layers in a cleaning tank 1 and a drying furnace 2, cleaning the copper plating layers coated with the antioxidant films again, and drying to obtain a flexible copper-clad plate semi-finished product;
step eight: preparing a flexible copper-clad plate finished product:
cutting the semi-finished flexible copper clad laminate by a cutting device 8, baking by a high-temperature tunnel furnace 9 at 290 ℃ for 30s, and flattening by a low-temperature hot pressing plate 10 at 100 ℃ under 5Mpa for 50s to obtain the finished flexible copper clad laminate.
Embodiment two:
as shown in fig. 2, an embodiment of the present invention provides a flexible copper clad laminate manufacturing apparatus, including:
a cleaning tank 1 and a drying oven 2, wherein the cleaning tank 1 is used for cleaning the substrate by microwave, and the drying oven 2 is used for heating the substrate by microwave;
a first DC sputtering device 3 for depositing a connection layer on both side surfaces of the substrate;
a second DC sputtering device 4 for depositing a copper seed layer on both side surfaces of the connection layer;
a heating roller 5 for hot-pressing the liquid crystal polymer film and the copper seed layer to form a copper-clad layer;
plating tanks 6 for plating both sides of the copper-clad layer to form a copper-clad layer;
an antioxidant liquid pool 7, wherein antioxidant films are generated on the surfaces of two sides of the copper plating layer through antioxidant liquid in the antioxidant liquid pool 7, so that the copper plating layer covered with the antioxidant films is formed;
the cutting device 8 is used for cutting the semi-finished flexible copper-clad plate;
the high-temperature tunnel furnace 9 and the low-temperature hot pressure plate 10 are used for baking and flattening the semi-finished flexible copper-clad plate to obtain the finished flexible copper-clad plate.
With reference to fig. 1, the manufacturing method of the flexible copper-clad plate is obtained by the manufacturing equipment, and comprises the following steps:
step one: processing a substrate:
taking a flexible substrate, wherein the substrate is polytetrafluoroethylene, placing the substrate in a cleaning tank 1, and carrying out microwave cleaning on the substrate by adopting deionized water, wherein the temperature of the microwave cleaning is 40 ℃, and the time of the microwave cleaning is 30min; then placing the substrate in a drying furnace 2, and carrying out microwave heating and drying on the substrate in a vacuum environment, wherein the microwave frequency of microwave heating is 300GHz, the microwave heating time is 20min, and redundant water is removed;
step two: primary sputtering:
depositing a connecting layer on the two side surfaces of the substrate by using a first DC sputtering device 3 through a sputtering process, wherein the connecting layer is a mixture of nickel, nickel compound, chromium compound, aluminum compound, carbon compound, silicon compound, manganese and manganese compound;
step three: and (3) secondary sputtering:
depositing a copper seed layer on both side surfaces of the connection layer through a sputtering process using a second DC sputtering device 4;
step four: hot press molding:
providing a liquid crystal polymer film, attaching the liquid crystal polymer film to two sides of the copper seed layer, and sending the liquid crystal polymer film and the copper seed layer into a heating roller 5 for hot press molding, wherein the temperature of the heating roller is 200 ℃ to obtain a copper-clad layer;
step five: continuous electroplating:
electroplating both sides of the copper-clad layer by using an electroplating bath 6 through a continuous electroplating process to form a copper-clad layer;
step six: and (3) coating an antioxidation film:
placing the copper plating layer in a cleaning tank 1, cleaning the copper plating layer, placing the copper plating layer in an oxidation resisting liquid pool 7, wherein the oxidation resisting liquid pool 7 contains oxidation resisting liquid, and the oxidation resisting liquid is an organic solvent containing methylbenzotriazole so as to generate oxidation resisting films on the surfaces of two sides of the copper plating layer and form the copper plating layer covered with the oxidation resisting films;
step seven: preparing a semi-finished product:
sequentially placing the copper plating layers in a cleaning tank 1 and a drying furnace 2, cleaning the copper plating layers coated with the antioxidant films again, and drying to obtain a flexible copper-clad plate semi-finished product;
step eight: preparing a flexible copper-clad plate finished product:
cutting the semi-finished flexible copper clad laminate by a cutting device 8, baking by a high-temperature tunnel furnace 9 at 330 ℃ for 100s, and flattening by a low-temperature hot pressing plate 10 at 160 ℃ under 20Mpa for 200s to obtain the finished flexible copper clad laminate.
Comparative example:
a manufacturing method of a flexible copper-clad plate comprises the following steps:
step one: processing a substrate:
taking a flexible substrate, wherein the substrate is polytetrafluoroethylene, and the substrate is subjected to microwave cleaning by adopting deionized water, wherein the temperature of the microwave cleaning is 40 ℃, and the time of the microwave cleaning is 30min; carrying out microwave heating and drying on the substrate in a vacuum environment, wherein the microwave frequency of microwave heating is 300GHz, the time of microwave heating is 20min, and redundant water is removed;
step two: sputtering:
depositing a copper seed layer on the two side surfaces of the substrate by using sputtering equipment through a sputtering process;
step three: electroplating:
and electroplating the two sides of the substrate respectively through an electroplating process to form a copper coating, thus obtaining the flexible copper-clad plate.
Experimental example:
the flexible copper clad laminate prepared in the first, second and comparative examples was subjected to performance test, and the results are shown in the following table:
| examples | Peel strength (N/mm) | Dielectric constant (DK) | Current Density (ASD) |
| Example 1 | 0.83 | 2.51 | 2.5 |
| Example two | 0.85 | 2.47 | 2.5 |
| Comparative example | 0.58 | 3.25 | 2.0 |
In conclusion, the flexible copper-clad plate prepared by the method has higher peeling strength and lower dielectric constant, namely, the stability is stronger, the dielectric property is better, and the electric signal is rapidly transmitted.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A manufacturing method of a flexible copper-clad plate is characterized in that: the method comprises the following steps:
step one: processing a substrate:
taking a flexible substrate, cleaning the flexible substrate, and drying the flexible substrate to remove redundant water;
step two: primary sputtering:
depositing a connecting layer on the two side surfaces of the substrate through a sputtering process;
step three: and (3) secondary sputtering:
depositing a copper seed layer on the two side surfaces of the connecting layer through a sputtering process;
step four: hot press molding:
providing a liquid crystal polymer film, attaching the liquid crystal polymer film to two sides of the copper seed layer, and sending the liquid crystal polymer film and the copper seed layer into a heating roller together for hot press molding to obtain a copper-clad layer;
step five: continuous electroplating:
electroplating the two sides of the copper-clad layer respectively through a continuous electroplating process to form a copper-clad layer;
step six: and (3) coating an antioxidation film:
cleaning the copper plating layer, and placing the copper plating layer in antioxidant liquid to generate antioxidant films on the surfaces of two sides of the copper plating layer, so as to form a copper plating layer coated with the antioxidant films;
step seven: preparing a semi-finished product:
cleaning the copper plating layer coated with the antioxidant film again, and drying to obtain a flexible copper-clad plate semi-finished product;
step eight: preparing a flexible copper-clad plate finished product:
cutting the semi-finished flexible copper clad laminate, and sequentially carrying out baking treatment and flattening treatment to obtain the finished flexible copper clad laminate.
2. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the first step, the substrate is made of one or two polymers of liquid crystal high molecular polymer and polytetrafluoroethylene.
3. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the first and seventh steps, the cleaning mode is as follows: carrying out microwave cleaning on the substrate by adopting deionized water; the drying mode is as follows: and heating the substrate by microwaves in a vacuum environment.
4. A method of manufacturing a flexible copper clad laminate according to claim 3, wherein: the temperature of the microwave cleaning is 30-40 ℃, and the time of the microwave cleaning is 10-30min; the microwave frequency of the microwave heating is 300MHz-300GHz, and the time of the microwave heating is 10-20min.
5. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the second step, the connection layer is one or more of nickel, nickel compound, chromium compound, aluminum compound, carbon compound, silicon compound, manganese and manganese compound.
6. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the fourth step, the temperature of the heating roller is 150-200 ℃.
7. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the sixth step, the antioxidant liquid is an organic solvent containing methyl benzotriazol.
8. The method for manufacturing a flexible copper-clad plate according to claim 1, wherein: in the eighth step, the baking treatment mode is as follows: baking in a high-temperature tunnel furnace at 290-330 deg.c for 30-100s; the flattening treatment mode is as follows: flattening by adopting a low-temperature hot pressing plate, wherein the temperature of flattening treatment is 100-160 ℃, the pressure is 5-20Mpa, and the time is 50-200s.
9. The utility model provides a flexible copper-clad plate manufacture equipment which characterized in that: comprising the following steps:
the substrate cleaning device comprises a cleaning tank and a drying furnace, wherein the cleaning tank is used for cleaning the substrate by microwaves, and the drying furnace is used for heating the substrate by microwaves;
the first DC sputtering device is used for depositing a connecting layer on the two side surfaces of the substrate;
the second DC sputtering device is used for depositing a copper seed layer on the two side surfaces of the connecting layer;
the heating roller is used for hot-pressing the liquid crystal polymer film and the copper seed layer to form a copper-clad layer;
plating bath for electroplating two sides of the copper-clad layer to form copper-clad layer;
an oxidation resisting liquid pool, wherein oxidation resisting films are formed on the surfaces of two sides of the copper plating layer through oxidation resisting liquid in the oxidation resisting liquid pool, and the copper plating layer covered with the oxidation resisting films is formed;
the cutting device is used for cutting the semi-finished product of the flexible copper-clad plate;
the high-temperature tunnel furnace and the low-temperature hot pressure plate are used for baking and flattening the semi-finished flexible copper-clad plate to obtain the finished flexible copper-clad plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311670402.8A CN117580261A (en) | 2023-12-07 | 2023-12-07 | Method and equipment for manufacturing flexible copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311670402.8A CN117580261A (en) | 2023-12-07 | 2023-12-07 | Method and equipment for manufacturing flexible copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117580261A true CN117580261A (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311670402.8A Pending CN117580261A (en) | 2023-12-07 | 2023-12-07 | Method and equipment for manufacturing flexible copper-clad plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN117580261A (en) |
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- 2023-12-07 CN CN202311670402.8A patent/CN117580261A/en active Pending
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