CN117577759B - Intelligent control method and system for LED packaging equipment - Google Patents
Intelligent control method and system for LED packaging equipment Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 631
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000000084 colloidal system Substances 0.000 claims abstract description 258
- 238000004458 analytical method Methods 0.000 claims abstract description 52
- 230000008439 repair process Effects 0.000 claims abstract description 39
- 230000007547 defect Effects 0.000 claims description 43
- 238000005538 encapsulation Methods 0.000 claims description 32
- 238000012858 packaging process Methods 0.000 claims description 10
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009450 smart packaging Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 83
- 230000001276 controlling effect Effects 0.000 description 32
- 238000012536 packaging technology Methods 0.000 description 9
- 230000002159 abnormal effect Effects 0.000 description 7
- 239000002699 waste material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012706 support-vector machine Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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Abstract
The invention relates to the technical field of LED production equipment control, in particular to an intelligent control method and system for LED packaging equipment. Comparing and analyzing the image information of the actual packaging area with the image information of the standard packaging area, analyzing to obtain final packaging parameters for packaging the packaging area, controlling packaging equipment to package the target product based on the final packaging parameters, comparing and analyzing the sub-actual packaging colloid three-dimensional model of the subarea with the corresponding sub-standard packaging colloid three-dimensional model, and controlling the packaging equipment to continuously package the next subarea according to a first analysis result; controlling the packaging equipment to stop packaging the target product according to the second analysis result; and controlling the packaging equipment to repair the subarea according to the third analysis result, and then continuously packaging the next subarea. The intelligent packaging device can intelligently package products, effectively improves the yield and the precision level of the products, effectively saves the scrapping cost, improves the output efficiency of the products and improves the economic benefit.
Description
Technical Field
The invention relates to the technical field of LED production equipment control, in particular to an intelligent control method and system for LED packaging equipment.
Background
The LED integrated packaging technology is to directly package a plurality of LED chips on a high heat conduction substrate to serve as a lighting module and directly dissipate heat through the high heat conduction substrate. Besides the integrated packaging technology, the packaging mode related to the LED in the prior art also comprises an SMD (surface mounted device) patch packaging technology and a high-power packaging technology, and compared with the SMD patch packaging technology or the high-power packaging technology, the integrated packaging technology has the advantages of simplifying the manufacturing process, saving the cost, reducing the heat resistance and heat dissipation and being capable of being subjected to personalized design, so that the LED integrated packaging technology becomes a packaging mode pushed by current illumination enterprises. At present, the phenomenon of over-high rejection rate of the LED products packaged by the integrated packaging technology generally exists, such as disqualification of color saturation and color uniformity of the LED lamp. Through analysis, the technical problems of poor packaging colloid, poor wire bonding and the like caused by the control precision of the LED packaging equipment are main reasons for scrapping products.
Disclosure of Invention
The invention solves the problem of over-high rejection rate of packaged LED products in the prior art, and provides an intelligent control method and system for LED packaging equipment.
The technical scheme adopted by the invention for achieving the purpose is as follows:
The first aspect of the invention discloses an intelligent control method for LED packaging equipment, which comprises the following steps:
acquiring actual packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information with standard packaging area image information to obtain final packaging parameters for packaging the packaging area, and controlling packaging equipment to package the target product based on the final packaging parameters;
in the actual packaging process, after a certain subarea in the packaging area is packaged, comparing and analyzing a subarea sub-actual packaging colloid three-dimensional model with a corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the subarea sub-actual packaging colloid three-dimensional model and the corresponding subarea sub-standard packaging colloid three-dimensional model is larger than a preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the subarea according to the repairing scheme, and then continuously packaging the next subarea.
Further, in a preferred embodiment of the present invention, the actual packaging area image information of the packaging area in the target product is obtained, the actual packaging area image information is compared with the standard packaging area image information, the final packaging parameters are obtained by analysis, and the packaging equipment is controlled to package the target product based on the final packaging parameters, specifically:
acquiring actual packaging area image information of a packaging area in a target product, and acquiring standard packaging area image information of the packaging area in the target product;
introducing a cosine similarity algorithm, and calculating the similarity between the image information of the actual packaging area and the image information of the standard packaging area based on the cosine similarity algorithm;
comparing the similarity of the actual packaging area image information and the standard packaging area image information with a preset similarity;
and if the similarity between the actual packaging area image information and the standard packaging area image information is greater than the preset similarity, taking the preset packaging parameters as final packaging parameters, and controlling packaging equipment to package the target product based on the final packaging parameters.
Further, in a preferred embodiment of the present invention, the method further comprises the steps of:
acquiring various historical packaging schemes when packaging equipment packages defects of different types of packaging areas through a big data network, and acquiring product rejection rates of the defects of the corresponding types of packaging areas after the defects are packaged by the various historical packaging schemes;
constructing a sorting table, importing product rejection rates of corresponding types of packaging region defects after packaging by various historical packaging schemes into the sorting table for sorting to obtain a sorting result, acquiring a historical packaging scheme corresponding to the lowest product rejection rate from the sorting result, and calibrating the historical packaging scheme corresponding to the lowest product rejection rate as an optimal packaging scheme for packaging the corresponding types of packaging region defects to obtain an optimal packaging scheme for packaging different types of packaging region defects;
acquiring characteristic three-dimensional models corresponding to defects of different types of packaging areas through a big data network; constructing a knowledge graph, and importing a characteristic three-dimensional model corresponding to the optimal packaging scheme for packaging the defects of the packaging regions of different types and the defects of the packaging regions of different types into the knowledge graph; updating the knowledge graph regularly;
If the similarity between the actual packaging area image information and the standard packaging area image information is not greater than the preset similarity, constructing an actual packaging area three-dimensional model based on the actual packaging area image information; extracting three-dimensional models of all features from the knowledge graph;
introducing a Euclidean distance algorithm, and calculating the matching degree between the three-dimensional model of the actual packaging area and the three-dimensional model of each feature according to the Euclidean distance algorithm;
acquiring a characteristic three-dimensional model with highest matching degree, and searching the knowledge graph based on the characteristic three-dimensional model with highest matching degree to obtain an optimal packaging scheme for packaging the actual packaging region three-dimensional model;
extracting historical packaging parameters of the packaging equipment from the retrieved optimal packaging scheme, taking the historical packaging parameters as final packaging parameters, and controlling the packaging equipment to package the target product based on the final packaging parameters.
Further, in a preferred embodiment of the present invention, comparing and analyzing the sub-actual packaging colloid three-dimensional model of the sub-area with the corresponding sub-standard packaging colloid three-dimensional model, if the overlap ratio between the sub-actual packaging colloid three-dimensional model of the sub-area and the corresponding sub-standard packaging colloid three-dimensional model is greater than the preset overlap ratio, generating a first analysis result, and controlling the packaging device to continue packaging the next sub-area, specifically:
Dividing a packaging area in a target product into a plurality of subareas, obtaining a standard packaging colloid three-dimensional model of the target product after packaging, and obtaining sub-standard packaging colloid three-dimensional models corresponding to the subareas according to the standard packaging colloid three-dimensional model;
after the encapsulation equipment encapsulates a certain subarea, acquiring actual encapsulation working condition image information of the subarea, and constructing a subarea sub-actual encapsulation colloid three-dimensional model according to the actual encapsulation working condition image information;
calculating the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model through Euclidean distance algorithm; comparing the coincidence ratio between the sub-entity encapsulation colloid three-dimensional model of the subarea and the corresponding sub-standard encapsulation colloid three-dimensional model with a preset coincidence ratio;
if the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, a first analysis result is generated, the subarea packaging process is normal, and the packaging equipment is controlled to continue packaging the next subarea.
Further, in a preferred embodiment of the present invention, if the overlap ratio between the sub-actual packaging colloid three-dimensional model of the sub-area and the corresponding sub-standard packaging colloid three-dimensional model is not greater than the preset overlap ratio, further analyzing and processing the sub-actual packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of the first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, which specifically includes:
If the degree of coincidence between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset degree of coincidence, respectively defining the sub-actual packaging colloid three-dimensional model with the degree of coincidence not more than the preset degree of coincidence and the corresponding sub-standard packaging colloid three-dimensional model as a first model and a second model;
constructing a three-dimensional grid system, wherein the three-dimensional grid system consists of a plurality of grids with unit volumes; inputting the first model and the second model into the three-dimensional grid system, and carrying out pairing treatment on the first model and the second model in the three-dimensional grid system based on an ICP algorithm;
after the pairing is completed, eliminating the model parts of the first model and the second model which are mutually overlapped in a three-dimensional grid system to obtain a packaging colloid difference model;
if the model part of the first model exists in the model of the packaging colloid difference model, a second analysis result is generated, packaging equipment is controlled to stop packaging the target product, and scrapping treatment is carried out on the target product.
Further, in a preferred embodiment of the present invention, if a model part of the first model does not exist in the model of the encapsulation colloid difference model, a third analysis result is generated, a repair scheme is formulated, and the encapsulation device is controlled to repair the sub-area according to the repair scheme, and then the next sub-area is encapsulated continuously, specifically:
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, acquiring coordinate information of a central point of the packaging colloid difference model in the three-dimensional grid system, and determining position information of the packaging colloid difference model according to the coordinate information; marking the position of the packaging colloid difference model as a to-be-repaired reset area;
calculating the model volume of the packaging colloid difference model in the three-dimensional grid system, and searching in a big data network according to the model volume of the packaging colloid difference model to obtain the colloid repair quantity required by repairing the position area to be repaired;
making a repairing scheme according to the position information of the packaging colloid difference model and the colloid repairing amount required by repairing the position area to be repaired, and controlling packaging equipment to repair the target product according to the repairing scheme;
and after the repair is finished, controlling the packaging equipment to continuously package the next subarea.
The invention discloses an intelligent control system of LED packaging equipment, which comprises a memory and a processor, wherein an intelligent control method program of the LED packaging equipment is stored in the memory, and when the intelligent control method program of the LED packaging equipment is executed by the processor, the following steps are realized:
Acquiring actual packaging area image information and standard packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information and the standard packaging area image information to obtain final packaging parameters, and controlling packaging equipment to package the target product based on the final packaging parameters;
comparing and analyzing the sub-actual packaging colloid three-dimensional model of a certain subarea in the packaging area with the corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the target product according to the repairing scheme.
The invention solves the technical defects existing in the background technology, and has the following beneficial effects:
comparing and analyzing the image information of the actual packaging area with the image information of the standard packaging area to obtain final packaging parameters for packaging the packaging area, and controlling packaging equipment to package the target product based on the final packaging parameters; comparing and analyzing the sub-entity packaging colloid three-dimensional model of the subarea with the corresponding sub-standard packaging colloid three-dimensional model, and if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, controlling packaging equipment to continue packaging the next subarea; if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model, and if a model part of a first model exists in the model of the packaging colloid difference model, controlling packaging equipment to stop packaging the target product; if the model part of the first model does not exist in the model of the packaging colloid difference model, a repair scheme is formulated, and packaging equipment is controlled to repair the subarea according to the repair scheme, and then the next subarea is continuously packaged. Whether defects exist in the packaging area or not can be judged rapidly, so that the intelligent control packaging equipment can package products in a targeted manner, and the product yield and the precision level can be improved effectively; and the semi-finished product which is already the waste product can be scrapped in time, so that the situation that the semi-finished product which is already the waste product is continuously packaged is avoided, the scrapping cost is effectively saved, the product output efficiency is improved, and the economic benefit is improved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other embodiments of the drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an overall method flow diagram of an intelligent control method for an LED package device;
FIG. 2 is a partial method flow diagram of a method for intelligent control of an LED package device;
fig. 3 is a system block diagram of an intelligent control system for an LED package device.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
As shown in fig. 1, the first aspect of the present invention discloses an intelligent control method for an LED packaging device, which includes the following steps:
s102: acquiring actual packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information with standard packaging area image information to obtain final packaging parameters for packaging the packaging area, and controlling packaging equipment to package the target product based on the final packaging parameters;
s104: in the actual packaging process, after a certain subarea in the packaging area is packaged, comparing and analyzing a subarea sub-actual packaging colloid three-dimensional model with a corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the subarea sub-actual packaging colloid three-dimensional model and the corresponding subarea sub-standard packaging colloid three-dimensional model is larger than a preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
s106: if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
S108: if the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the subarea according to the repairing scheme, and then continuously packaging the next subarea.
As shown in fig. 2, in a further preferred embodiment of the present invention, the actual packaging area image information of the packaging area in the target product is obtained, the actual packaging area image information is compared with the standard packaging area image information, the final packaging parameters are obtained by analysis, and the packaging equipment is controlled to package the target product based on the final packaging parameters, specifically:
s202: acquiring actual packaging area image information of a packaging area in a target product, and acquiring standard packaging area image information of the packaging area in the target product;
s204: introducing a cosine similarity algorithm, and calculating the similarity between the image information of the actual packaging area and the image information of the standard packaging area based on the cosine similarity algorithm;
s206: comparing the similarity of the actual packaging area image information and the standard packaging area image information with a preset similarity;
S208: and if the similarity between the actual packaging area image information and the standard packaging area image information is greater than the preset similarity, taking the preset packaging parameters as final packaging parameters, and controlling packaging equipment to package the target product based on the final packaging parameters.
It should be noted that, defects such as pits and bumps may be generated in the process of processing, producing, storing and transporting the thermally conductive substrate, and these defects are generally and irregularly found, so that a certain difference exists between the packaging area in the target product and the ideal state, and when defects such as pits and bumps exist in the packaging area, after the packaging area is sealed, the glue after the sealing is caused to be uneven, even the size is not compliant, so that before the target product is packaged by the packaging device, whether defects such as pits and bumps exist in the packaging area needs to be analyzed. And if the similarity between the actual packaging area image information and the standard packaging area image information is greater than the preset similarity, the defect does not exist in the packaging area of the target product, and the target product is packaged directly through preset packaging parameters.
Further, in a preferred embodiment of the present invention, the method further comprises the steps of:
acquiring various historical packaging schemes when packaging equipment packages defects of different types of packaging areas through a big data network, and acquiring product rejection rates of the defects of the corresponding types of packaging areas after the defects are packaged by the various historical packaging schemes;
constructing a sorting table, importing product rejection rates of corresponding types of packaging region defects after packaging by various historical packaging schemes into the sorting table for sorting to obtain a sorting result, acquiring a historical packaging scheme corresponding to the lowest product rejection rate from the sorting result, and calibrating the historical packaging scheme corresponding to the lowest product rejection rate as an optimal packaging scheme for packaging the corresponding types of packaging region defects to obtain an optimal packaging scheme for packaging different types of packaging region defects;
acquiring characteristic three-dimensional models corresponding to defects of different types of packaging areas through a big data network; constructing a knowledge graph, and importing a characteristic three-dimensional model corresponding to the optimal packaging scheme for packaging the defects of the packaging regions of different types and the defects of the packaging regions of different types into the knowledge graph; updating the knowledge graph regularly;
If the similarity between the actual packaging area image information and the standard packaging area image information is not greater than the preset similarity, constructing an actual packaging area three-dimensional model based on the actual packaging area image information; extracting three-dimensional models of all features from the knowledge graph;
introducing a Euclidean distance algorithm, and calculating the matching degree between the three-dimensional model of the actual packaging area and the three-dimensional model of each feature according to the Euclidean distance algorithm;
acquiring a characteristic three-dimensional model with highest matching degree, and searching the knowledge graph based on the characteristic three-dimensional model with highest matching degree to obtain an optimal packaging scheme for packaging the actual packaging region three-dimensional model;
extracting historical packaging parameters of the packaging equipment from the retrieved optimal packaging scheme, taking the historical packaging parameters as final packaging parameters, and controlling the packaging equipment to package the target product based on the final packaging parameters.
It should be noted that, various historical packaging schemes when the packaging equipment packages defects in different types of packaging areas are obtained through the big data network, for example, various historical packaging schemes when the packaging equipment packages defects with pits in a certain position in the packaging area are obtained, and the historical packaging schemes comprise packaging parameters of the packaging equipment and the like; the historical packaging scheme corresponding to the lowest product rejection rate is calibrated to be an optimal packaging scheme for packaging the defects of the corresponding type of packaging area; acquiring characteristic three-dimensional models corresponding to defects of different types of packaging areas through a big data network, such as characteristic three-dimensional models corresponding to concave defects with a certain shape and size in a certain position in the packaging area; thus constructing and obtaining the knowledge graph. In addition, it should be noted that the knowledge graph may be updated periodically to obtain a better packaging scheme.
If the similarity between the image information of the actual packaging area and the image information of the standard packaging area is not greater than the preset similarity, the defect in the packaging area of the target product is indicated, an actual packaging area three-dimensional model is built based on the image information of the actual packaging area, then an optimal packaging scheme for packaging the actual packaging area three-dimensional model is obtained by rapid pairing in a knowledge graph according to the actual packaging area three-dimensional model, historical packaging parameters of packaging equipment are extracted from the retrieved optimal packaging scheme, the historical packaging parameters are used as final packaging parameters, and the packaging equipment is controlled to package the target product based on the final packaging parameters, so that the phenomenon of non-uniform growth of the packaging adhesive caused by the defect is avoided, intelligent packaging is realized, and the product yield and the precision level can be effectively improved.
In summary, before packaging the target product, whether the defect exists in the packaging area is judged rapidly, so that the intelligent control packaging equipment can package the product in a targeted manner, the product yield and the precision level can be effectively improved, the algorithm is simple and easy to implement, and the system robustness can be effectively improved.
Further, in a preferred embodiment of the present invention, comparing and analyzing the sub-actual packaging colloid three-dimensional model of the sub-area with the corresponding sub-standard packaging colloid three-dimensional model, if the overlap ratio between the sub-actual packaging colloid three-dimensional model of the sub-area and the corresponding sub-standard packaging colloid three-dimensional model is greater than the preset overlap ratio, generating a first analysis result, and controlling the packaging device to continue packaging the next sub-area, specifically:
dividing a packaging area in a target product into a plurality of subareas, obtaining a standard packaging colloid three-dimensional model of the target product after packaging, and obtaining sub-standard packaging colloid three-dimensional models corresponding to the subareas according to the standard packaging colloid three-dimensional model;
after the encapsulation equipment encapsulates a certain subarea, acquiring actual encapsulation working condition image information of the subarea, and constructing a subarea sub-actual encapsulation colloid three-dimensional model according to the actual encapsulation working condition image information;
calculating the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model through Euclidean distance algorithm; comparing the coincidence ratio between the sub-entity encapsulation colloid three-dimensional model of the subarea and the corresponding sub-standard encapsulation colloid three-dimensional model with a preset coincidence ratio;
If the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, a first analysis result is generated, the subarea packaging process is normal, and the packaging equipment is controlled to continue packaging the next subarea.
The standard encapsulation colloid three-dimensional model represents an ideal shape and size model diagram of the colloid after encapsulation is carried out on the encapsulation area.
It should be noted that, in the actual packaging process, after packaging a certain subarea in the packaging area, if the overlap ratio between the subarea sub-actual packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model is greater than the preset overlap ratio, a first analysis result is generated, which indicates that after the subarea is packaged, the difference between the colloid shape size and the ideal state is not great, which indicates that the subarea packaging process is normal, and then the packaging equipment is controlled to continue packaging the next subarea.
Further, in a preferred embodiment of the present invention, if the overlap ratio between the sub-actual packaging colloid three-dimensional model of the sub-area and the corresponding sub-standard packaging colloid three-dimensional model is not greater than the preset overlap ratio, further analyzing and processing the sub-actual packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of the first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, which specifically includes:
If the degree of coincidence between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset degree of coincidence, respectively defining the sub-actual packaging colloid three-dimensional model with the degree of coincidence not more than the preset degree of coincidence and the corresponding sub-standard packaging colloid three-dimensional model as a first model and a second model;
constructing a three-dimensional grid system, wherein the three-dimensional grid system consists of a plurality of grids with unit volumes; inputting the first model and the second model into the three-dimensional grid system, and carrying out pairing treatment on the first model and the second model in the three-dimensional grid system based on an ICP algorithm;
after the pairing is completed, eliminating the model parts of the first model and the second model which are mutually overlapped in a three-dimensional grid system to obtain a packaging colloid difference model;
if the model part of the first model exists in the model of the packaging colloid difference model, a second analysis result is generated, packaging equipment is controlled to stop packaging the target product, and scrapping treatment is carried out on the target product.
It should be noted that, if the overlap ratio between the sub-actual packaging colloid three-dimensional model of the sub-area and the corresponding sub-standard packaging colloid three-dimensional model is not greater than the preset overlap ratio, it is described that after the sub-area is sealed, the difference between the colloid shape size and the ideal state is greater, further analysis processing is performed on the colloid specification condition of the sub-area, specifically, the sub-actual packaging colloid three-dimensional model with the overlap ratio not greater than the preset overlap ratio and the corresponding sub-standard packaging colloid three-dimensional model are respectively defined as a first model and a second model, and an industrial drawing software is utilized to construct a three-dimensional grid system, wherein the three-dimensional grid system is composed of a plurality of grids with unit volumes, then the first model and the second model in the three-dimensional grid system are combined for pairing processing, after pairing is completed, the model part where the first model and the second model overlap mutually is eliminated, meanwhile, the model part where the first model and the second model do not overlap mutually is reserved, and the remaining model part is the packaging colloid difference model. If a model part of a first model exists in the model of the packaging colloid difference model, the fact that the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model are not more than the preset overlap ratio is indicated, the fact that the subarea completely covers the standard packaging colloid three-dimensional model is indicated that the size specification of the colloid after packaging is bigger than smaller is indicated, the fact belongs to the condition that the colloid cannot be repaired, packaging equipment is controlled to stop packaging the target product at the moment, packaging is not carried out on the next subarea, and scrapping treatment is carried out on the target product. The semi-finished product which is already the waste product can be scrapped in time in the mode, the situation that the semi-finished product which is already the waste product is continuously packaged is avoided, and therefore scrapping cost is effectively saved, product output efficiency is improved, and economic benefit is improved.
Further, in a preferred embodiment of the present invention, if a model part of the first model does not exist in the model of the encapsulation colloid difference model, a third analysis result is generated, a repair scheme is formulated, and the encapsulation device is controlled to repair the sub-area according to the repair scheme, and then the next sub-area is encapsulated continuously, specifically:
if the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, acquiring coordinate information of a central point of the packaging colloid difference model in the three-dimensional grid system, and determining position information of the packaging colloid difference model according to the coordinate information; marking the position of the packaging colloid difference model as a to-be-repaired reset area;
calculating the model volume of the packaging colloid difference model in the three-dimensional grid system, and searching in a big data network according to the model volume of the packaging colloid difference model to obtain the colloid repair quantity required by repairing the position area to be repaired;
making a repairing scheme according to the position information of the packaging colloid difference model and the colloid repairing amount required by repairing the position area to be repaired, and controlling packaging equipment to repair the target product according to the repairing scheme;
And after the repair is finished, controlling the packaging equipment to continuously package the next subarea.
If the model part of the first model does not exist in the model of the packaging colloid difference model, it is indicated that on the basis that the contact ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not larger than the preset contact ratio, the sub-entity packaging colloid three-dimensional model does not cover the situation of the standard packaging colloid three-dimensional model, it is indicated that the size specification of the colloid of the subarea after packaging is smaller, but not larger, the situation belongs to the repairable situation, a repair scheme is formulated according to the position information of the packaging colloid difference model and the colloid repair amount required when the position area to be repaired, the packaging equipment is controlled to repair the target product according to the repair scheme, and after repair is completed, the packaging equipment is controlled to continue packaging the next subarea. By the method, the packaging colloid in the unqualified subarea can be repaired in time, the subsequent time for returning can be saved, integrated intelligent control is realized, the rejection rate of products can be effectively reduced, and the production efficiency of the products can be improved.
Furthermore, the method comprises the following steps:
continuously acquiring driving parameters of the packaging equipment in a preset time period, and conveying the acquired driving parameters to the cloud platform;
after the acquisition is finished, introducing a support vector machine algorithm, and clustering driving parameters in a cloud platform based on the support vector machine algorithm to obtain various driving parameter sets;
introducing a Markov chain, calculating state transition probability values of each driving parameter set through the Markov chain, and comparing the state transition probability values of each driving parameter set with preset probability values;
marking a driving parameter set with a state transition probability value larger than a preset probability value as an abnormal parameter set, and marking a driving parameter set with a state transition probability value not larger than the preset probability value as a normal parameter set;
and acquiring parameter type information corresponding to each abnormal parameter set, retrieving the big data network according to the parameter type information corresponding to each abnormal parameter set to obtain corresponding regulation measures, and transmitting the regulation measures to the control terminal so that the control terminal regulates and controls the driving parameters of the packaging equipment based on the regulation measures.
Wherein the driving parameters include voltage parameters, current parameters, operating frequency, temperature range, signal level, output power, voltage saturation, etc.
It should be noted that, in the operation process of the packaging device, after one or more driving parameters of the packaging device are abnormal, serious faults may further occur in the packaging device, for example, when voltage parameters are continuously abnormal, the interior of the packaging device may be caused to continuously generate heat, so that serious thermal faults are caused, the shutdown maintenance time of the device is increased, and the production efficiency of the product is reduced, so that whether the driving parameters of the packaging device are abnormal or not can be predicted in advance through the step, thereby regulating and controlling the abnormal driving parameters in advance, reducing the occurrence probability of faults, and ensuring that the device is effectively operated.
Furthermore, the method comprises the following steps:
after the target product is packaged by the LED packaging equipment, the packaging colloid area is scanned by the X-ray detector to obtain X-ray data fed back by the packaging colloid area;
performing feature extraction on the X-ray data to obtain air hole feature data information in the packaging colloid region, and constructing an air hole three-dimensional model of the packaging colloid region according to the air hole feature data information;
performing finite element analysis on all the air hole three-dimensional models to obtain internal stress of air holes in the packaging colloid area; judging whether the internal stress is larger than a preset internal stress or not;
If the internal stress is larger than the preset internal stress, judging the target product as waste, and acquiring the position information of the air holes in the packaging colloid area; based on a Bayesian network, carrying out fault tracing analysis on each piece of sub-equipment in the packaging equipment according to the position information of the air holes in the packaging colloid area to obtain fault sub-equipment, and outputting the fault sub-equipment;
if the internal stress is not greater than the preset internal stress, the internal stress is further compared with a first threshold value;
if the internal stress is larger than a first threshold value, defining the target product as a class of products; and if the internal stress is not greater than a first threshold value, defining the target product as a class II product.
It should be noted that the air holes may cause a decrease in stability of the encapsulation material, so that the LED is vulnerable to intrusion of moisture, dust, etc. under various environmental conditions, thereby decreasing reliability and durability of the LED. The method can further judge whether the inside of the packaged colloid is normal or not, and can further analyze the fault position of the sub-equipment causing the air hole defect.
As shown in fig. 3, the second aspect of the present invention discloses an intelligent control system for an LED package device, the intelligent control system for an LED package device includes a memory 41 and a processor 42, the memory 41 stores an intelligent control method program for an LED package device, and when the intelligent control method program for an LED package device is executed by the processor 42, the following steps are implemented:
Acquiring actual packaging area image information and standard packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information and the standard packaging area image information to obtain final packaging parameters, and controlling packaging equipment to package the target product based on the final packaging parameters;
comparing and analyzing the sub-actual packaging colloid three-dimensional model of a certain subarea in the packaging area with the corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
if the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the target product according to the repairing scheme.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of the units is only one logical function division, and there may be other divisions in practice, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units; can be located in one place or distributed to a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present invention may be integrated in one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the above-described integrated units of the present invention may be stored in a computer-readable storage medium if implemented in the form of software functional modules and sold or used as separate products. Based on such understanding, the technical solutions of the embodiments of the present invention may be embodied in essence or a part contributing to the prior art in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods of the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code.
The foregoing is merely illustrative embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present invention, and the invention should be covered. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (4)
1. The intelligent control method of the LED packaging equipment is characterized by comprising the following steps of:
acquiring actual packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information with standard packaging area image information to obtain final packaging parameters for packaging the packaging area, and controlling packaging equipment to package the target product based on the final packaging parameters;
in the actual packaging process, after a certain subarea in the packaging area is packaged, comparing and analyzing a subarea sub-actual packaging colloid three-dimensional model with a corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the subarea sub-actual packaging colloid three-dimensional model and the corresponding subarea sub-standard packaging colloid three-dimensional model is larger than a preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
If the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
if the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the subarea according to the repairing scheme, and then continuously packaging the next subarea;
comparing and analyzing the sub-actual packaging colloid three-dimensional model of the subarea with the corresponding sub-standard packaging colloid three-dimensional model, if the contact ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset contact ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea, wherein the method specifically comprises the following steps of:
Dividing a packaging area in a target product into a plurality of subareas, obtaining a standard packaging colloid three-dimensional model of the target product after packaging, and obtaining sub-standard packaging colloid three-dimensional models corresponding to the subareas according to the standard packaging colloid three-dimensional model;
after the encapsulation equipment encapsulates a certain subarea, acquiring actual encapsulation working condition image information of the subarea, and constructing a subarea sub-actual encapsulation colloid three-dimensional model according to the actual encapsulation working condition image information;
calculating the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model through Euclidean distance algorithm; comparing the coincidence ratio between the sub-entity encapsulation colloid three-dimensional model of the subarea and the corresponding sub-standard encapsulation colloid three-dimensional model with a preset coincidence ratio;
if the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, generating a first analysis result, indicating that the subarea packaging process is normal, and controlling packaging equipment to continuously package the next subarea;
if the overlap ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset overlap ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, wherein the method specifically comprises the following steps:
If the degree of coincidence between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset degree of coincidence, respectively defining the sub-actual packaging colloid three-dimensional model with the degree of coincidence not more than the preset degree of coincidence and the corresponding sub-standard packaging colloid three-dimensional model as a first model and a second model;
constructing a three-dimensional grid system, wherein the three-dimensional grid system consists of a plurality of grids with unit volumes; inputting the first model and the second model into the three-dimensional grid system, and carrying out pairing treatment on the first model and the second model in the three-dimensional grid system based on an ICP algorithm;
after the pairing is completed, eliminating the model parts of the first model and the second model which are mutually overlapped in a three-dimensional grid system to obtain a packaging colloid difference model;
if the model part of the first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, and performing scrapping treatment on the target product;
if the model part of the first model does not exist in the model of the packaging colloid difference model, a third analysis result is generated, a repair scheme is formulated, packaging equipment is controlled to repair the subarea according to the repair scheme, and then the next subarea is continuously packaged, specifically:
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, acquiring coordinate information of a central point of the packaging colloid difference model in the three-dimensional grid system, and determining position information of the packaging colloid difference model according to the coordinate information; marking the position of the packaging colloid difference model as a to-be-repaired reset area;
calculating the model volume of the packaging colloid difference model in the three-dimensional grid system, and searching in a big data network according to the model volume of the packaging colloid difference model to obtain the colloid repair quantity required by repairing the position area to be repaired;
making a repairing scheme according to the position information of the packaging colloid difference model and the colloid repairing amount required by repairing the position area to be repaired, and controlling packaging equipment to repair the target product according to the repairing scheme;
and after the repair is finished, controlling the packaging equipment to continuously package the next subarea.
2. The intelligent control method of an LED package device according to claim 1, wherein the method comprises obtaining actual package region image information of a package region in a target product, comparing and analyzing the actual package region image information with standard package region image information to obtain final package parameters, and controlling the package device to package the target product based on the final package parameters, specifically comprises:
Acquiring actual packaging area image information of a packaging area in a target product, and acquiring standard packaging area image information of the packaging area in the target product;
introducing a cosine similarity algorithm, and calculating the similarity between the image information of the actual packaging area and the image information of the standard packaging area based on the cosine similarity algorithm;
comparing the similarity of the actual packaging area image information and the standard packaging area image information with a preset similarity;
and if the similarity between the actual packaging area image information and the standard packaging area image information is greater than the preset similarity, taking the preset packaging parameters as final packaging parameters, and controlling packaging equipment to package the target product based on the final packaging parameters.
3. The intelligent control method of an LED package device according to claim 2, further comprising the steps of:
acquiring various historical packaging schemes when packaging equipment packages defects of different types of packaging areas through a big data network, and acquiring product rejection rates of the defects of the corresponding types of packaging areas after the defects are packaged by the various historical packaging schemes;
constructing a sorting table, importing product rejection rates of corresponding types of packaging region defects after packaging by various historical packaging schemes into the sorting table for sorting to obtain a sorting result, acquiring a historical packaging scheme corresponding to the lowest product rejection rate from the sorting result, and calibrating the historical packaging scheme corresponding to the lowest product rejection rate as an optimal packaging scheme for packaging the corresponding types of packaging region defects to obtain an optimal packaging scheme for packaging different types of packaging region defects;
Acquiring characteristic three-dimensional models corresponding to defects of different types of packaging areas through a big data network; constructing a knowledge graph, and importing a characteristic three-dimensional model corresponding to the optimal packaging scheme for packaging the defects of the packaging regions of different types and the defects of the packaging regions of different types into the knowledge graph; updating the knowledge graph regularly;
if the similarity between the actual packaging area image information and the standard packaging area image information is not greater than the preset similarity, constructing an actual packaging area three-dimensional model based on the actual packaging area image information; extracting three-dimensional models of all features from the knowledge graph;
introducing a Euclidean distance algorithm, and calculating the matching degree between the three-dimensional model of the actual packaging area and the three-dimensional model of each feature according to the Euclidean distance algorithm;
acquiring a characteristic three-dimensional model with highest matching degree, and searching the knowledge graph based on the characteristic three-dimensional model with highest matching degree to obtain an optimal packaging scheme for packaging the actual packaging region three-dimensional model;
extracting historical packaging parameters of the packaging equipment from the retrieved optimal packaging scheme, taking the historical packaging parameters as final packaging parameters, and controlling the packaging equipment to package the target product based on the final packaging parameters.
4. The intelligent control system of the LED packaging equipment is characterized by comprising a memory and a processor, wherein the memory stores an intelligent control method program of the LED packaging equipment, and when the intelligent control method program of the LED packaging equipment is executed by the processor, the following steps are realized:
acquiring actual packaging area image information of a packaging area in a target product, comparing and analyzing the actual packaging area image information with standard packaging area image information to obtain final packaging parameters for packaging the packaging area, and controlling packaging equipment to package the target product based on the final packaging parameters;
in the actual packaging process, after a certain subarea in the packaging area is packaged, comparing and analyzing a subarea sub-actual packaging colloid three-dimensional model with a corresponding sub-standard packaging colloid three-dimensional model, if the coincidence ratio between the subarea sub-actual packaging colloid three-dimensional model and the corresponding subarea sub-standard packaging colloid three-dimensional model is larger than a preset coincidence ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea;
If the coincidence ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset coincidence ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, and controlling packaging equipment to stop packaging the target product;
if the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, formulating a repairing scheme, and controlling packaging equipment to repair the subarea according to the repairing scheme, and then continuously packaging the next subarea;
comparing and analyzing the sub-actual packaging colloid three-dimensional model of the subarea with the corresponding sub-standard packaging colloid three-dimensional model, if the contact ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset contact ratio, generating a first analysis result, and controlling packaging equipment to continuously package the next subarea, wherein the method specifically comprises the following steps of:
Dividing a packaging area in a target product into a plurality of subareas, obtaining a standard packaging colloid three-dimensional model of the target product after packaging, and obtaining sub-standard packaging colloid three-dimensional models corresponding to the subareas according to the standard packaging colloid three-dimensional model;
after the encapsulation equipment encapsulates a certain subarea, acquiring actual encapsulation working condition image information of the subarea, and constructing a subarea sub-actual encapsulation colloid three-dimensional model according to the actual encapsulation working condition image information;
calculating the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model through Euclidean distance algorithm; comparing the coincidence ratio between the sub-entity encapsulation colloid three-dimensional model of the subarea and the corresponding sub-standard encapsulation colloid three-dimensional model with a preset coincidence ratio;
if the coincidence ratio between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is larger than the preset coincidence ratio, generating a first analysis result, indicating that the subarea packaging process is normal, and controlling packaging equipment to continuously package the next subarea;
if the overlap ratio between the sub-entity packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset overlap ratio, further analyzing and processing the sub-entity packaging colloid three-dimensional model and the corresponding sub-standard packaging colloid three-dimensional model to obtain a packaging colloid difference model, and if a model part of a first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, wherein the method specifically comprises the following steps:
If the degree of coincidence between the sub-actual packaging colloid three-dimensional model of the subarea and the corresponding sub-standard packaging colloid three-dimensional model is not more than the preset degree of coincidence, respectively defining the sub-actual packaging colloid three-dimensional model with the degree of coincidence not more than the preset degree of coincidence and the corresponding sub-standard packaging colloid three-dimensional model as a first model and a second model;
constructing a three-dimensional grid system, wherein the three-dimensional grid system consists of a plurality of grids with unit volumes; inputting the first model and the second model into the three-dimensional grid system, and carrying out pairing treatment on the first model and the second model in the three-dimensional grid system based on an ICP algorithm;
after the pairing is completed, eliminating the model parts of the first model and the second model which are mutually overlapped in a three-dimensional grid system to obtain a packaging colloid difference model;
if the model part of the first model exists in the model of the packaging colloid difference model, generating a second analysis result, controlling packaging equipment to stop packaging the target product, and performing scrapping treatment on the target product;
if the model part of the first model does not exist in the model of the packaging colloid difference model, a third analysis result is generated, a repair scheme is formulated, packaging equipment is controlled to repair the subarea according to the repair scheme, and then the next subarea is continuously packaged, specifically:
If the model part of the first model does not exist in the model of the packaging colloid difference model, generating a third analysis result, acquiring coordinate information of a central point of the packaging colloid difference model in the three-dimensional grid system, and determining position information of the packaging colloid difference model according to the coordinate information; marking the position of the packaging colloid difference model as a to-be-repaired reset area;
calculating the model volume of the packaging colloid difference model in the three-dimensional grid system, and searching in a big data network according to the model volume of the packaging colloid difference model to obtain the colloid repair quantity required by repairing the position area to be repaired;
making a repairing scheme according to the position information of the packaging colloid difference model and the colloid repairing amount required by repairing the position area to be repaired, and controlling packaging equipment to repair the target product according to the repairing scheme;
and after the repair is finished, controlling the packaging equipment to continuously package the next subarea.
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| CN116560327A (en) * | 2023-07-07 | 2023-08-08 | 深圳市百思泰科技有限公司 | Electric tool production control method and system based on Internet of things |
| CN116943995A (en) * | 2023-09-20 | 2023-10-27 | 深圳正实自动化设备有限公司 | High-precision dispensing machine evaluation method and system based on data analysis |
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| CN112735969A (en) * | 2021-04-02 | 2021-04-30 | 惠州高视科技有限公司 | LED semiconductor packaging glue dispensing defect detection method, electronic equipment and storage medium |
| CN116560327A (en) * | 2023-07-07 | 2023-08-08 | 深圳市百思泰科技有限公司 | Electric tool production control method and system based on Internet of things |
| CN116943995A (en) * | 2023-09-20 | 2023-10-27 | 深圳正实自动化设备有限公司 | High-precision dispensing machine evaluation method and system based on data analysis |
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