CN117577716A - Photovoltaic module and manufacturing method thereof - Google Patents
Photovoltaic module and manufacturing method thereof Download PDFInfo
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- CN117577716A CN117577716A CN202410061109.XA CN202410061109A CN117577716A CN 117577716 A CN117577716 A CN 117577716A CN 202410061109 A CN202410061109 A CN 202410061109A CN 117577716 A CN117577716 A CN 117577716A
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- grid line
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- main grid
- film
- electrode main
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 239000003292 glue Substances 0.000 claims description 32
- 238000003466 welding Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims description 3
- 230000032683 aging Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 8
- 238000001723 curing Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 3
- -1 Polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QKAJPFXKNNXMIZ-UHFFFAOYSA-N [Bi].[Ag].[Sn] Chemical compound [Bi].[Ag].[Sn] QKAJPFXKNNXMIZ-UHFFFAOYSA-N 0.000 description 2
- KHZAWAWPXXNLGB-UHFFFAOYSA-N [Bi].[Pb].[Sn] Chemical compound [Bi].[Pb].[Sn] KHZAWAWPXXNLGB-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009421 internal insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Abstract
The application relates to the field of photovoltaics and discloses a photovoltaic module and a manufacturing method thereof, wherein the photovoltaic module comprises a back substrate, a back packaging layer, a battery piece layer, a front packaging layer and a front substrate which are sequentially stacked from bottom to top; the battery piece layer comprises a plurality of battery strings, and each battery string comprises a plurality of back contact battery pieces, a connecting piece, a conductive connecting part, a first insulating bearing film and a bonding pad; the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line, bonding pads are distributed on the anode main grid line and the cathode main grid line, and a conductive connecting part is arranged on the bonding pads; the connecting piece is connected with the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line; adjacent two back contact battery pieces are connected by a connecting piece; the first insulating bearing film is arranged between the adjacent bonding pads. This application is through setting up first insulating carrier film, increases the insulating nature between connecting piece and positive, negative pole main grid, plays the effect of filling the gap simultaneously, avoids photovoltaic module to appear ageing layering, bubble scheduling problem.
Description
Technical Field
The application relates to the field of photovoltaics, in particular to a photovoltaic module and a manufacturing method thereof.
Background
The back contact photovoltaic module has the advantages that the front surface of the battery piece is not shielded by the grid line, so that the power is increased, and the back contact photovoltaic module becomes an industrial research hot spot. At present, when manufacturing a back contact photovoltaic module, the welding process comprises high-temperature welding and low-temperature welding. When soldering is performed at low temperature, the solder tape is pre-fixed with low Wen Xigao and then bonded to the solder paste on the pads during lamination. Because pre-fixing is not firm, a specific low-fluidity packaging adhesive film is usually used on the back of a battery piece, but the situation that the packaging adhesive film cannot be effectively filled in local areas such as gaps between the packaging adhesive film and a welding strip can occur, and further the problems of ageing and layering of components, bubbles, bulge of a back plate and the like occur. In addition, under the pressure action and the heating process in the lamination process, the insulating adhesive film positioned at the tail end of the thin grid line is deformed by the welding strip in a pressing mode, so that the effective insulating thickness is reduced, and a failure mode of short circuit occurs between the welding strip and the grid line in the opposite polarity direction.
Therefore, how to solve the above technical problems should be of great interest to those skilled in the art.
Disclosure of Invention
The purpose of the application is to provide a photovoltaic module and a manufacturing method thereof, so as to avoid the problems of ageing layering, bubbles, backboard bulge, short circuit and the like of the photovoltaic module.
For solving the technical problem, the application provides a photovoltaic module, including: a back substrate, a back packaging layer, a battery piece layer, a front packaging layer and a front substrate which are sequentially stacked from bottom to top; the battery piece layer comprises a plurality of battery strings, and each battery string comprises a plurality of back contact battery pieces, a connecting piece, a conductive connecting part, a first insulating bearing film and a bonding pad;
the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line, the bonding pads are distributed on the anode main grid line and the cathode main grid line, and the conductive connecting part is arranged on the bonding pads;
the connecting piece is connected with the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line; two adjacent back contact battery pieces are connected by the connecting piece;
the first insulating bearing film is arranged between the adjacent bonding pads.
Optionally, the method further comprises:
and the second insulating bearing films are arranged on one side or two sides of the bonding pad.
Optionally, the back contact battery piece further comprises an anode thin grid line and a cathode thin grid line, wherein the anode thin grid line is connected with the anode main grid line and disconnected at the cathode main grid line, and the cathode thin grid line is connected with the cathode main grid line and disconnected at the anode main grid line;
the edge of the second insulating bearing film far away from the bonding pad is in contact with the edge of the insulating adhesive and is not overlapped, or is overlapped with the insulating adhesive; the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
Optionally, the back contact battery piece further comprises an anode thin grid line and a cathode thin grid line, wherein the anode thin grid line is connected with the anode main grid line and disconnected at the cathode main grid line, and the cathode thin grid line is connected with the cathode main grid line and disconnected at the anode main grid line;
the edges of the first insulating bearing film, which are parallel to the positive electrode main grid line and the negative electrode main grid line, are in contact with the edges of the insulating glue and are not overlapped, or are overlapped with the insulating glue; the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
Optionally, the back contact battery piece further comprises an anode thin grid line and a cathode thin grid line, and the photovoltaic module further comprises insulating glue;
the positive thin grid line is connected with the positive main grid line and disconnected at the negative main grid line, and the negative thin grid line is connected with the negative main grid line and disconnected at the positive main grid line; further comprises:
the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
Optionally, the edges of the first insulating carrier film perpendicular to the positive electrode main grid line and the negative electrode main grid line are in contact with the edges of the bonding pads and are not overlapped, or are overlapped with the bonding pads.
Optionally, the width of the first insulating carrier film is 3-5 times of the width of the connecting piece.
Optionally, the conductive connection part is low-temperature solder paste or tin-lead system solder paste.
Optionally, the method further comprises:
and the third insulating bearing film is arranged between the adjacent back contact battery pieces.
The application also provides a manufacturing method of the photovoltaic module, which comprises the following steps:
preparing a back contact battery piece, wherein the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line;
manufacturing bonding pads on the positive electrode main grid line and the negative electrode main grid line, and manufacturing conductive connecting parts on the bonding pads;
fixing a first insulating bearing film on the substrate, fixing a connecting piece on the first insulating bearing film and the conductive connecting part, and connecting a plurality of back contact battery pieces through the connecting piece to form a battery string; the first insulating bearing film is positioned between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
sequentially paving a front packaging layer, the battery strings, a back packaging layer and a back substrate on the surface of the front substrate to form a component to be processed;
and laminating the component to be treated to obtain the photovoltaic component.
Optionally, when the conductive connection portion is a low-temperature solder paste, fixing a first insulating carrier film on the substrate, and fixing a connection member on the first insulating carrier film and the conductive connection portion, including:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
heating the first insulating carrier film to pre-fix the first insulating carrier film on the substrate;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and heating the connecting piece and the first insulating bearing film so that the connecting piece is pre-fixed on the first insulating bearing film and the conductive connecting part.
Optionally, when the conductive connection portion is a low-temperature solder paste, fixing a first insulating carrier film on the substrate, and fixing a connection member on the first insulating carrier film and the conductive connection portion, including:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and heating the connecting piece and the first insulating bearing film so as to enable the first insulating bearing film to be pre-fixed on the substrate, and enable the connecting piece to be pre-fixed on the first insulating bearing film and the conductive connecting part.
Optionally, when the conductive connection portion is a tin-lead system solder paste, fixing the first insulating carrier film on the substrate, and fixing the connection piece on the first insulating carrier film and the conductive connection portion includes:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and welding the connecting piece and the conductive connecting part.
Optionally, after the first insulating carrier film is fixed on the substrate, the method further includes:
and arranging a second insulating bearing film on one side or two sides of the bonding pad, and fixing the second insulating bearing film on the substrate.
Optionally, after the first insulating carrier film is fixed on the substrate, the method further includes:
and arranging a third insulating bearing film between the adjacent back contact battery pieces, and fixing the third insulating bearing film on the substrate.
The application provides a photovoltaic module, include: a back substrate, a back packaging layer, a battery piece layer, a front packaging layer and a front substrate which are sequentially stacked from bottom to top; the battery piece layer comprises a plurality of battery strings, and each battery string comprises a plurality of back contact battery pieces, a connecting piece, a conductive connecting part, a first insulating bearing film and a bonding pad; the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line, the bonding pads are distributed on the anode main grid line and the cathode main grid line, and the conductive connecting part is arranged on the bonding pads; the connecting piece is connected with the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line; two adjacent back contact battery pieces are connected by the connecting piece; the first insulating bearing film is arranged between the adjacent bonding pads.
It can be seen that photovoltaic module in this application includes back base plate, back encapsulation layer, battery piece layer, front encapsulation layer and front base plate, and the battery cluster in the battery piece layer includes back contact battery piece, connecting piece, electrically conductive connecting portion, first insulating carrier film, pad. The first insulating bearing film is arranged between adjacent bonding pads on the positive electrode main grid line and between adjacent bonding pads on the negative electrode main grid line, namely, the first insulating bearing film is arranged between the connecting piece and the positive electrode main grid line and between the connecting piece and the negative electrode main grid line, the insulativity between the connecting piece and the positive electrode main grid line and between the connecting piece and the negative electrode main grid line is improved, the first insulating bearing film plays a role of filling gaps below the connecting piece, and the problems of aging layering, bubbles, backboard bulge and the like of the photovoltaic module are avoided. In addition, when the insulating film exists at the tail end of the thin grid line, the deformation of the insulating film during lamination can be reduced due to the existence of the first insulating bearing film, so that a failure mode of short circuit is avoided.
In addition, the application also provides a manufacturing method with the advantages.
Drawings
For a clearer description of embodiments of the present application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description that follow are only some embodiments of the present application, and that other drawings may be obtained from these drawings by a person of ordinary skill in the art without inventive effort.
Fig. 1 is a schematic cross-sectional view of a photovoltaic module according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a back contact battery sheet according to an embodiment of the present application;
fig. 3 is a schematic diagram of a conductive connection portion provided in an embodiment of the present application disposed on a back contact battery piece;
fig. 4 is a schematic view illustrating an arrangement of a first insulating carrier film according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating an arrangement of an insulating adhesive according to an embodiment of the present application;
fig. 6 is a schematic view illustrating arrangement of a first insulating carrier film and a second insulating carrier film according to an embodiment of the present disclosure;
fig. 7 is a schematic view illustrating arrangement of a first insulating carrier film, a second insulating carrier film and a third insulating carrier film according to an embodiment of the present disclosure;
fig. 8 is a schematic diagram illustrating an arrangement of a connecting member according to an embodiment of the present disclosure;
fig. 9 is a flowchart of a method for manufacturing a photovoltaic module according to an embodiment of the present application;
in the figure, 1, a front substrate, 2, a front packaging layer, 3, a battery sheet layer, 4, insulating glue, 5, a conductive connecting part, 6, a first insulating bearing film, 7, a connecting piece, 8, a back packaging layer, 9, a back substrate, 10, a second insulating bearing film, 11, a third insulating bearing film, 31, a negative electrode main grid line, 32, a positive electrode main grid line, 33, a negative electrode thin grid line, 34, a positive electrode thin grid line, 35, a bonding pad, 36 and a substrate.
Detailed Description
In order to provide a better understanding of the present application, those skilled in the art will now make further details of the present application with reference to the drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, the packaging adhesive film in the current back contact photovoltaic module cannot effectively fill the gaps, so that the problems of module aging delamination, bubbles, back plate bulge and the like occur, and a failure mode of short circuit also occurs.
In view of this, the present application provides a photovoltaic module, please refer to fig. 1 to 5, including:
a back substrate 9, a back packaging layer 8, a battery piece layer 3, a front packaging layer 2 and a front substrate 1 which are sequentially stacked from bottom to top; the battery sheet layer 3 comprises a plurality of battery strings, and each battery string comprises a plurality of back contact battery sheets, a connecting piece 7, a conductive connecting part 5, a first insulating bearing film 6 and a bonding pad 35;
the back contact battery piece comprises a substrate 36, an anode main grid line 32 and a cathode main grid line 31, the bonding pads 35 are distributed on the anode main grid line 32 and the cathode main grid line 31, and the conductive connecting parts 5 are arranged on the bonding pads 35;
the connecting piece 7 is connected with the conductive connecting parts 5 on the positive electrode main grid line 32 and the negative electrode main grid line 31; adjacent two back contact battery pieces are connected by the connecting piece 7;
the first insulating carrier film 6 is disposed between adjacent bonding pads 35 on the positive electrode main gate line 32 and the negative electrode main gate line 31.
The back contact battery piece further comprises a positive electrode thin grid line 34 and a negative electrode thin grid line 33, wherein the positive electrode thin grid line 34 is connected with the positive electrode main grid line 32 and is disconnected at the negative electrode main grid line 31, and the negative electrode thin grid line 33 is connected with the negative electrode main grid line 31 and is disconnected at the positive electrode main grid line 32.
The positive electrode main grid line 32 and the negative electrode main grid line 31 are distributed on the back surface of the substrate 36 at intervals, and the extending directions of the connecting piece 7 and the positive electrode main grid line 32 and the negative electrode main grid line 31 are the same.
The main printed material of the negative electrode main grid line 31 is silver paste, and the main printed material of the positive electrode main grid line 32 is aluminum paste. The widths of the positive electrode main grid line 32 and the negative electrode main grid line 31 can be 5mm, the number can be 5-19, and the number is odd.
The height of the positive thin grid line 34 can be 20+/-5 mu m, and the width can be 30+/-5 mu m; the height of the negative thin grid line 33 can be 5+/-2 mu m, and the width is 10+/-5 mu m; the lengths of the negative thin gate line 33 and the positive thin gate line 34 may be 8mm, and may be adjusted according to the pitch.
The positive electrode main gate line 32 and the negative electrode main gate line 31 are provided with pads 35, respectively, as shown in fig. 2. The conductive connecting part 5 can be solder paste, the connecting piece 7 can be a welding strip, the conductive connecting part 5 ensures that the connecting piece 7 is effectively combined with the positive electrode main grid line 32 and the negative electrode main grid line 31, so that the current collecting capacity of the connecting piece 7 is ensured, and the photo-generated current generated by the back contact battery piece is collected and led out.
The conductive connection portion 5 may have a length and a width ranging from 0.6 to 1.0mm and a thickness ranging from 100 to 200 μm.
The conductive connection part 5 can be low-temperature solder paste or tin-lead system solder paste.
The low-temperature solder paste can be a conventional tin-lead-bismuth system solder paste or a tin-bismuth-silver system solder paste, wherein the content of bismuth (Bi) is 14-29%, and the melting temperature is 130 ℃. The tin-lead system solder paste is conventional solder paste, preferably Sn 60 Pb 40 。
The welding strip comprises, but is not limited to, a cylindrical welding strip and a flat welding strip, wherein for the cylindrical welding strip, the circular diameter range of the section can be 0.20 mm-0.3 mm, and for the flat welding strip, the width range of the section of the welding strip can be 0.6-1 mm, and the height range can be 0.25-0.4 mm.
When the welding strip is a flat welding strip, the contact area between the welding strip and the conductive connecting part 5 is larger, and the combination effect is better. In the conventional welding process, the welding strip system can be a tin-lead system, and after the pre-fixing, infrared and laser welding are carried out to achieve interconnection. The low-temperature welding can be a tin bismuth lead and tin bismuth silver system, wherein the bismuth content can be 14-29%, and interconnection is achieved in lamination after pre-fixing.
A negative thin gate line 33 for collecting a negative current is provided near the positive main gate line 32, and a positive thin gate line 34 for collecting a positive current is provided near the negative main gate line 31.
In order to smoothly draw current and avoid short circuit, as an embodiment, the method further comprises: and the insulating glue 4 is positioned at the tail ends of the positive thin grid line 34 and the negative thin grid line 33. The insulating adhesive 4 covers the end of the positive thin gate line 34 and the end of the negative thin gate line 33, and the length ranges from 0.3mm to 0.5mm.
As shown in fig. 5, the end of the positive thin gate line 34 near the negative main gate line 31 is provided with an insulating paste 4, and the end of the negative thin gate line 33 near the positive main gate line 32 is provided with an insulating paste 4.
The insulating paste 4 may be a UV (Ultraviolet) curable system insulating paste 4 or a thermosetting system insulating paste 4.
The front substrate 1 may be a glass substrate, and the back substrate 9 may be glass, a back plate, or the like.
The back side encapsulation layer 8, the front side encapsulation layer 2 include, but are not limited to, POE (Poly (ethylene-1-ocene) film layer, EVA (Ethylene Vinyl Acetate, ethylene-vinyl acetate copolymer) film layer, PVB (polyvinyl butyral ) film layer, EPE (Expandable Polyethylene, expandable polyethylene) film layer.
The first insulating carrier film 6 may be a film of a polyolefin system, such as PVB film, POE film, EVA film, etc. The thickness of the first insulating carrier film 6 may be in the range of 80 to 140 μm.
When the first insulating carrier film 6 is a POE film or an EVA film, the insulating effect of the POE film or the EVA film is good, and the insulating glue 4 may not be disposed at the ends of the positive thin gate line 34 and the negative thin gate line 33, so as to reduce the cost.
In this application, the arrangement of the first insulating carrier film 6 between the adjacent pads 35 is not limited. The first insulating carrier film 6 may be disposed at any region between adjacent pads 35 on the positive electrode main gate line 32, and at any region between adjacent pads 35 on the negative electrode main gate line 31.
In order to enhance the adhesion effect of the first insulating carrier film 6 to the connection member 7, the edges of the first insulating carrier film 6 perpendicular to the positive electrode main gate line 32 and the negative electrode main gate line 31 are in contact with the edges of the bonding pads 35 without overlapping or overlap with the bonding pads 35.
The edges of the first insulating carrier film 6 perpendicular to the positive and negative electrode main gate lines 32, 31 are in contact with the edges of the pads 35 and do not overlap, i.e., the length of the first insulating carrier film 6 between adjacent pads 35 is equal to the distance between adjacent pads 35.
The edges of the first insulating carrier film 6 perpendicular to the positive electrode main gate line 32 and the negative electrode main gate line 31 overlap the pads 35, i.e., the length of the first insulating carrier film 6 between adjacent pads 35 is longer than the distance between adjacent pads 35, and the first insulating carrier film 6 partially covers the pads 35. The length of the first insulating carrier film 6 between the adjacent pads 35 may be in the range of 0.1 to 0.3mm beyond the distance between the adjacent pads 35.
As an implementation manner, the width of the first insulating carrier film 6 is 3-5 times that of the connecting piece 7, and the width of the first insulating carrier film 6 ranges from 1.2mm to 5mm, so that the bottom of the connecting piece 7 (the side where the connecting piece 7 contacts with the first insulating carrier film 6) is completely contacted with the first insulating carrier film 6, and the contact area is the largest, thereby enhancing the pre-fixing and insulating effects on the connecting piece 7.
When the photovoltaic module comprises the insulating glue 4, the edges of the first insulating carrier film 6 parallel to the positive electrode main grid line 32 and the negative electrode main grid line 31 are in contact with the edges of the insulating glue 4 and are not overlapped, or are overlapped with the insulating glue 4; the insulating glue 4 is located at the ends of the positive thin grid line 34 and the negative thin grid line 33, so as to improve the insulativity between the connecting piece 7 and the positive main grid line 32 and the negative main grid line 31.
When the parallel edges of the first insulating carrier film 6 and the positive electrode main grid line 32 and the negative electrode main grid line 31 overlap with the insulating glue 4, that is, the edges of the first insulating carrier film 6 are covered on the insulating glue 4, the length of the first insulating carrier film 6 covered on the insulating glue 4 may be 0.1 mm-0.5 mm.
The edges of the first insulating carrier film 6 parallel to the positive electrode main grid line 32 and the negative electrode main grid line 31 are in contact with the edges of the insulating glue 4 and do not overlap, i.e. the edges of the first insulating carrier film 6 are just in contact with the edges of the insulating glue 4.
The photovoltaic module in this embodiment includes a back substrate 9, a back encapsulation layer 8, a battery sheet layer 3, a front encapsulation layer 2, and a front substrate 1, and the battery string in the battery sheet layer 3 includes a back contact battery sheet, a connecting member 7, a conductive connecting portion 5, a first insulating carrier film 6, and a bonding pad 35. The first insulating bearing film 6 is arranged between adjacent bonding pads 35 on the positive electrode main grid line 32 and between adjacent bonding pads 35 on the negative electrode main grid line 31, namely, the first insulating bearing film 6 is arranged between the connecting piece 7 and the positive electrode main grid line 32 and between the connecting piece 7 and the negative electrode main grid line 31, the insulativity between the connecting piece 7 and the positive electrode main grid line 32 and between the connecting piece 7 and the negative electrode main grid line 31 is improved, the first insulating bearing film 6 plays a role of filling gaps below the connecting piece 7, and the problems of ageing layering, bubbles, backboard bulge and the like of the photovoltaic module are avoided. Moreover, when the insulating film exists at the tail end of the thin grid line, the deformation of the insulating film during lamination can be reduced due to the existence of the first insulating bearing film 6, so that a failure mode of short circuit is avoided.
Referring to fig. 6, in an embodiment of the present application, on the basis of the above embodiment, the photovoltaic module may further include:
and a second insulating carrier film 10 provided on one side or both sides of the pad 35.
The second insulating carrier film 10 may be a polyolefin film, such as PVB film, POE film, EVA film, etc. The thickness of the second insulating carrier film 10 may be in the range of 80 to 140 μm.
When the second insulating carrier film 10 is disposed on a single side of the pad 35, it is not limited in the scope of the present application, and it may be disposed on either the left side of the pad 35 or the right side of the pad 35.
Through setting up second insulating carrier film 10, can play the effect of filling connecting piece 7 below gap on the one hand, avoid photovoltaic module to appear ageing layering, bubble and backplate swell scheduling problem, on the other hand, can also increase the insulating nature between connecting piece 7 and positive pole main grid line 32, negative pole main grid line 31, avoid appearing the failure mode of short circuit.
It should be noted that, when the photovoltaic module includes the insulating adhesive 4, the arrangement condition of the edges of the second insulating carrier film 10 and the insulating adhesive 4 is not limited in this application.
As an embodiment, the back contact battery piece further includes a positive thin gate line 34 and a negative thin gate line 33, the positive thin gate line 34 is connected to the positive main gate line 32 and disconnected at the negative main gate line 31, and the negative thin gate line 33 is connected to the negative main gate line 31 and disconnected at the positive main gate line 32;
the edge of the second insulating carrier film 10 far from the bonding pad 35 is in contact with the edge of the insulating glue 4 and has no overlap, i.e. the edge of the second insulating carrier film 10 is just in contact with the edge of the insulating glue 4. Wherein the insulating glue 4 is positioned at the tail ends of the positive thin grid line 34 and the negative thin grid line 33.
As another embodiment, the edge of the second insulating carrier film 10 away from the pad 35 overlaps the insulating glue 4, that is, the edge of the second insulating carrier film 10 is mounted on the insulating glue 4, and the length of the second insulating carrier film 10 covered on the insulating glue 4 may range from 0.1mm to 0.5mm. Wherein the insulating glue 4 is positioned at the tail ends of the positive thin grid line 34 and the negative thin grid line 33.
Referring to fig. 7 and 8, in one embodiment of the present application, on the basis of any one of the above embodiments, the photovoltaic module may further include:
and a third insulating carrier film 11 disposed between adjacent back contact battery pieces.
The third insulating carrier film 11 may be a polyolefin film, such as PVB film, POE film, EVA film, etc. The thickness of the third insulating carrier film 11 may be in the range of 80 to 140 μm.
In this embodiment, the third insulating carrier film 11 is disposed between the back contact battery cells, so that on one hand, the gap of the photovoltaic module is filled, and the insulation between the connecting piece 7 and the positive electrode main grid line 32 and the negative electrode main grid line 31 is increased, and on the other hand, the gap between the back contact battery cells is stabilized and fixed.
The application further provides a method for manufacturing a photovoltaic module, please refer to fig. 9, including:
step S101: and preparing a back contact battery piece, wherein the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line.
Step S102: and manufacturing bonding pads on the positive electrode main grid line and the negative electrode main grid line, and manufacturing conductive connecting parts on the bonding pads.
The conductive connection may be a solder paste, which may be a low temperature solder paste or a tin-lead system solder paste (conventional solder paste).
Solder paste can be manufactured on the bonding pads in a screen printing mode.
For low Wen Xigao, after screen printing, baking in a low-temperature oven at a temperature lower than 80-100 ℃ or irradiating by an infrared lamp box for about 3s, so as to ensure the pre-curing of the solder paste. The pre-curing ensures that the solder paste is not solidified (soldering flux still remains) in the solder tape laying process, so that the solder tape is ensured to be primarily adhered on the positive electrode main grid line and the negative electrode main grid line.
As an embodiment, before the conductive connection portion is made on the pad, the method may further include:
and manufacturing insulating glue at the tail ends of the positive thin grid line and the negative thin grid line.
The insulating paste may be a UV curable system insulating paste or a thermally curable system insulating paste.
The UV curing system insulating adhesive can be printed by adopting modes such as screen printing, ink-jet printing and the like, then UV light irradiation is carried out, and after 2-3 s of curing time, the insulating adhesive is solidified to form the insulating adhesive, for example, the insulating adhesive with the length ranging from 1mm to 3mm, the width ranging from 1mm and the thickness ranging from 20 mu m to 50 mu m is formed.
After screen printing, the thickness of the insulating adhesive printing coating can be 20-50 mu m, and the insulating adhesive is cured in a hot drying furnace at 100-150 ℃ for 3-6 s, wherein the specific curing time can be determined according to the temperature in the furnace, the belt rotating speed and the like. The method for determining whether the curing effect is qualified is that the multimeter tests the state that the insulation and the internal insulation glue is cured after the surface curing layer is scratched.
Step S103: fixing a first insulating bearing film on the substrate, fixing a connecting piece on the first insulating bearing film and the conductive connecting part, and connecting a plurality of back contact battery pieces through the connecting piece to form a battery string;
the first insulating bearing film is positioned between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line.
The connector may be a solder strip.
After the solder paste is pre-fixed, first insulating bearing films are laid between adjacent bonding pads on the positive electrode main grid line and between adjacent bonding pads on the negative electrode main grid line, then bonding strips are laid, and after bonding pads and the middle part of the interval are pressed by using a pressing tool, heating and fixing are carried out; in the heating process, the molecules of the first insulating bearing film are subjected to crosslinking reaction, and the silane coupling agent in the components of the first insulating bearing film promotes the two sides of the film to be respectively bonded with the substrate and the welding strip, so that the fixing effect is achieved.
The process of fixing the first insulating carrier film and the connecting piece is different according to the different solder paste types, and the following description is respectively made.
As one embodiment, when the conductive connection portion is a low temperature solder paste, fixing the first insulating carrier film on the substrate, and fixing the connection member on the first insulating carrier film and the conductive connection portion includes:
step S103a1: and laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line.
Step S103a2: and heating the first insulating bearing film so as to enable the first insulating bearing film to be pre-fixed on the substrate.
Step S103a3: and laying connecting pieces on the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film.
Step S103a4: and heating the connecting piece and the first insulating bearing film so that the connecting piece is pre-fixed on the first insulating bearing film and the conductive connecting part.
In this embodiment, after the first insulating support film is laid, the first insulating support film is first heated once and pre-fixed. After the connecting piece is laid, the heating is carried out again, so that the connecting piece is pre-fixed.
As another embodiment, when the conductive connection portion is a low temperature solder paste, fixing the first insulating carrier film on the substrate, and fixing the connection member on the first insulating carrier film and the conductive connection portion includes:
step S103b1: and laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line.
Step S103b2: and laying connecting pieces on the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film.
Step S103b3: and heating the connecting piece and the first insulating bearing film so as to enable the first insulating bearing film to be pre-fixed on the substrate, and enable the connecting piece to be pre-fixed on the first insulating bearing film and the conductive connecting part.
In this embodiment, after the first insulating support film and the connecting member are laid, the first insulating support film and the connecting member are pre-fixed by heating once.
When the conductive connection is a low temperature solder paste, an alloy bond between the connection and the low temperature solder paste is formed during lamination.
As another embodiment, when the conductive connection portion is a tin-lead system solder paste, fixing the first insulating carrier film on the substrate, and fixing the connection member on the first insulating carrier film and the conductive connection portion includes:
step S103c1: and laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line.
Step S103c2: and laying connecting pieces on the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film.
Step S103c3: and welding the connecting piece and the conductive connecting part.
When the conductive connection part is tin-lead system solder paste, the alloy combination between the tin-lead system solder paste and the connection piece needs to be welded separately.
Step S104: and paving a front packaging layer, the battery strings, the back packaging layer and the back substrate on the surface of the front substrate in sequence to form a component to be processed.
Step S105: and laminating the component to be treated to obtain the photovoltaic component.
It should be noted that, after lamination, components such as the junction box and the frame need to be assembled, and specific processes may refer to related technologies, and will not be described in detail herein.
The photovoltaic module manufactured in this embodiment includes a back substrate, a back packaging layer, a battery sheet layer, a front packaging layer and a front substrate, and a battery string in the battery sheet layer includes a back contact battery sheet, a connecting piece, a conductive connecting portion, a first insulating bearing film and a bonding pad. The first insulating bearing film is arranged between adjacent bonding pads on the positive electrode main grid line and between adjacent bonding pads on the negative electrode main grid line, namely, the first insulating bearing film is arranged between the connecting piece and the positive electrode main grid line and between the connecting piece and the negative electrode main grid line, so that the insulativity between the connecting piece and the positive electrode main grid line and between the connecting piece and the negative electrode main grid line is improved, the first insulating bearing film plays a role in filling gaps, and the problems of aging layering, bubbles, backboard bulge and the like of the photovoltaic module are avoided. In addition, when the insulating film exists at the tail end of the thin grid line, the deformation of the insulating film during lamination can be reduced due to the existence of the first insulating bearing film, so that a failure mode of short circuit is avoided.
On the basis of the above embodiment, in one embodiment of the present application, after the first insulating carrier film is fixed on the substrate, further comprising:
and arranging a second insulating bearing film on one side or two sides of the bonding pad, and fixing the second insulating bearing film on the substrate.
The second insulating support film is fixed in the same manner as the first insulating support film.
On the basis of any one of the above embodiments, in one embodiment of the present application, after the first insulating carrier film is fixed on the substrate, the method further includes:
and arranging a third insulating bearing film between the adjacent back contact battery pieces, and fixing the third insulating bearing film on the substrate.
The fixing of the third insulating support film is the same as the fixing of the first insulating support film.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other.
The photovoltaic module and the manufacturing method thereof provided by the application are described in detail. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. It should be noted that it would be obvious to those skilled in the art that various improvements and modifications can be made to the present application without departing from the principles of the present application, and such improvements and modifications fall within the scope of the claims of the present application.
Claims (15)
1. A photovoltaic module, comprising: a back substrate, a back packaging layer, a battery piece layer, a front packaging layer and a front substrate which are sequentially stacked from bottom to top; the battery piece layer comprises a plurality of battery strings, and each battery string comprises a plurality of back contact battery pieces, a connecting piece, a conductive connecting part, a first insulating bearing film and a bonding pad;
the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line, the bonding pads are distributed on the anode main grid line and the cathode main grid line, and the conductive connecting part is arranged on the bonding pads;
the connecting piece is connected with the conductive connecting parts on the positive electrode main grid line and the negative electrode main grid line; two adjacent back contact battery pieces are connected by the connecting piece;
the first insulating bearing film is arranged between the adjacent bonding pads.
2. The photovoltaic module of claim 1, further comprising:
and the second insulating bearing films are arranged on one side or two sides of the bonding pad.
3. The photovoltaic assembly of claim 2, wherein the back contact cell further comprises a positive thin-gate line connected to the positive main-gate line and disconnected at the negative main-gate line, and a negative thin-gate line connected to the negative main-gate line and disconnected at the positive main-gate line;
the edge of the second insulating bearing film far away from the bonding pad is in contact with the edge of the insulating adhesive and is not overlapped, or is overlapped with the insulating adhesive; the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
4. The photovoltaic assembly of claim 1, wherein the back contact cell further comprises a positive thin-gate line connected to the positive main-gate line and disconnected at the negative main-gate line, and a negative thin-gate line connected to the negative main-gate line and disconnected at the positive main-gate line;
the edges of the first insulating bearing film, which are parallel to the positive electrode main grid line and the negative electrode main grid line, are in contact with the edges of the insulating glue and are not overlapped, or are overlapped with the insulating glue; the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
5. The photovoltaic module of claim 1, wherein the back contact cell further comprises a positive thin-grid line and a negative thin-grid line, the photovoltaic module further comprising an insulating gel;
the positive thin grid line is connected with the positive main grid line and disconnected at the negative main grid line, and the negative thin grid line is connected with the negative main grid line and disconnected at the positive main grid line;
the insulating glue is positioned at the tail ends of the positive thin grid line and the negative thin grid line.
6. The photovoltaic module of claim 1, wherein an edge of the first insulating carrier film perpendicular to the positive and negative main grid lines is in contact with an edge of the bonding pad without overlapping or overlaps the bonding pad.
7. The photovoltaic module of claim 1, wherein the first insulating carrier film has a width 3 to 5 times the width of the connector.
8. The photovoltaic module of claim 1, wherein the conductive connection is a low temperature solder paste or a tin-lead system solder paste.
9. The photovoltaic module of any one of claims 1 to 8, further comprising:
and the third insulating bearing film is arranged between the adjacent back contact battery pieces.
10. A method of manufacturing a photovoltaic module, comprising:
preparing a back contact battery piece, wherein the back contact battery piece comprises a substrate, an anode main grid line and a cathode main grid line;
manufacturing bonding pads on the positive electrode main grid line and the negative electrode main grid line, and manufacturing conductive connecting parts on the bonding pads;
fixing a first insulating bearing film on the substrate, fixing a connecting piece on the first insulating bearing film and the conductive connecting part, and connecting a plurality of back contact battery pieces through the connecting piece to form a battery string; the first insulating bearing film is positioned between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
sequentially paving a front packaging layer, the battery strings, a back packaging layer and a back substrate on the surface of the front substrate to form a component to be processed;
and laminating the component to be treated to obtain the photovoltaic component.
11. The method of claim 10, wherein when the conductive connection is a low temperature solder paste, fixing the first insulating carrier film on the substrate and fixing the connection member on the first insulating carrier film and the conductive connection comprises:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
heating the first insulating carrier film to pre-fix the first insulating carrier film on the substrate;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and heating the connecting piece and the first insulating bearing film so that the connecting piece is pre-fixed on the first insulating bearing film and the conductive connecting part.
12. The method of claim 10, wherein when the conductive connection is a low temperature solder paste, fixing the first insulating carrier film on the substrate and fixing the connection member on the first insulating carrier film and the conductive connection comprises:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and heating the connecting piece and the first insulating bearing film so as to enable the first insulating bearing film to be pre-fixed on the substrate, and enable the connecting piece to be pre-fixed on the first insulating bearing film and the conductive connecting part.
13. The method of claim 10, wherein when the conductive connection portion is a tin-lead solder paste, fixing the first insulating carrier film on the substrate and fixing the connection member on the first insulating carrier film and the conductive connection portion comprises:
laying a first insulating bearing film between adjacent bonding pads on the positive electrode main grid line and the negative electrode main grid line;
laying a connecting piece on the conductive connecting part on the positive electrode main grid line and the negative electrode main grid line and the first insulating bearing film;
and welding the connecting piece and the conductive connecting part.
14. The method of claim 10, further comprising, after the first insulating carrier film is affixed to the substrate:
and arranging a second insulating bearing film on one side or two sides of the bonding pad, and fixing the second insulating bearing film on the substrate.
15. The method of manufacturing a photovoltaic module according to any one of claims 10 to 14, further comprising, after fixing the first insulating carrier film to the substrate:
and arranging a third insulating bearing film between the adjacent back contact battery pieces, and fixing the third insulating bearing film on the substrate.
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| CN202410061109.XA CN117577716A (en) | 2024-01-16 | 2024-01-16 | Photovoltaic module and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN216958062U (en) * | 2022-03-03 | 2022-07-12 | 浙江爱旭太阳能科技有限公司 | Back contact solar cell string, cell module and photovoltaic system |
| CN116995109A (en) * | 2023-08-29 | 2023-11-03 | 正泰新能科技有限公司 | Low-temperature welded back contact photovoltaic module and preparation method thereof |
| CN117219702A (en) * | 2023-09-05 | 2023-12-12 | 晶科能源(海宁)有限公司 | Manufacturing method of photovoltaic module and photovoltaic module |
| CN117334793A (en) * | 2023-11-03 | 2024-01-02 | 晶澳（扬州）太阳能科技有限公司 | Back contact solar cell processing method, solar cell structure and photovoltaic module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN216958062U (en) * | 2022-03-03 | 2022-07-12 | 浙江爱旭太阳能科技有限公司 | Back contact solar cell string, cell module and photovoltaic system |
| CN116995109A (en) * | 2023-08-29 | 2023-11-03 | 正泰新能科技有限公司 | Low-temperature welded back contact photovoltaic module and preparation method thereof |
| CN117219702A (en) * | 2023-09-05 | 2023-12-12 | 晶科能源(海宁)有限公司 | Manufacturing method of photovoltaic module and photovoltaic module |
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