CN117577598B - Handling device based on-chip processor and handling method thereof - Google Patents
Handling device based on-chip processor and handling method thereof Download PDFInfo
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- CN117577598B CN117577598B CN202311617776.3A CN202311617776A CN117577598B CN 117577598 B CN117577598 B CN 117577598B CN 202311617776 A CN202311617776 A CN 202311617776A CN 117577598 B CN117577598 B CN 117577598B
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000004519 grease Substances 0.000 claims abstract description 12
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 12
- 239000007771 core particle Substances 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 29
- 229910052710 silicon Inorganic materials 0.000 claims description 27
- 239000010703 silicon Substances 0.000 claims description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 25
- 239000008188 pellet Substances 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000004364 calculation method Methods 0.000 claims description 8
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- 238000001179 sorption measurement Methods 0.000 abstract description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
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- 239000003292 glue Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
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- 238000005336 cracking Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a loading and unloading device based on an on-chip processor, which utilizes a through hole on a base to enable a supporting rod of a second supporting device to be relatively easy to be attached to a supporting area of the on-chip processor, and when the on-chip processor is arranged in a groove of the base, the on-chip processor is prevented from being broken due to friction or stress generated between the edge of the on-chip processor and the inner wall of the groove of the base by controlling the precise movement of a lifting device in the vertical direction and the horizontal direction; in the process of detaching the on-chip processor from the groove of the base, as the through holes are arranged below the supporting area of the lower surface of the on-chip processor, the area of the vacuum area between the base and the on-chip processor is reduced, the on-chip processor is subjected to multi-point uniform supporting force by utilizing the supporting rods in the detaching process, and further the viscosity of the heat conduction silicone grease and the vacuum adsorption force of the lower surface of the on-chip processor and the base are overcome, so that the on-chip processor is completely separated from the groove of the base. The invention also discloses a loading and unloading method based on the on-chip processor.
Description
Technical Field
The invention belongs to the technical field of semiconductors, and particularly relates to a loading and unloading device and a loading and unloading method based on an on-chip processor.
Background
With the continuous improvement of the demands of chip computing power and processing capacity in the fields of deep learning, large-scale data exchange and the like, a single processor cannot meet all the scenes for large-scale data processing, and the traditional server cluster has the defects of large volume, high power consumption, low energy efficiency ratio and the like, so that the on-chip system is proposed with the advantages of extremely high interconnection bandwidth, power density and ultra-high energy efficiency ratio.
The system on chip (SOW) has been proposed to solve the problem that moore's law is not sustainable, and the system on chip integrates a plurality of isomorphic or heterogeneous processor computing cores on a large-size silicon Wafer or similar high-speed medium, and each core is interconnected with each other by a high-speed bus in the medium, so that the interconnection density, the interconnection energy efficiency and the interconnection bandwidth are greatly improved, the interconnection delay is reduced, and an ultra-large transistor-scale on-chip processor cluster is realized.
The core computing component of the on-chip system is an on-chip processor, which is composed of a large number of computing Die (KGD, know Good Die, known as normally available Die) bonded to a passive or active large-size silicon substrate to form a "large chip", and the height of the TSV inside the silicon substrate is typically about 100um, so the silicon substrate needs to be thinned from 775um to about 100um to ensure that the TSV can penetrate both sides of the silicon substrate.
Thus, the on-die processor may have the following problems: the on-die handler requires disassembly, handling and installation of the on-die handler from the base during debugging, testing and use, such as detecting cracks in the silicon substrate in the on-die handler, replacing thermally conductive silicone grease on the die in the on-die handler, and replacing bad die in the on-die handler, but currently there is no standardized or universal means and apparatus for installation, fixing and disassembly of the on-die handler due to the fragile nature of the ultra-thin silicon substrate of the on-die handler.
Therefore, for the on-chip system, a method and apparatus for mounting, dismounting and fixing the on-chip processor are needed to be designed, so that the risk of cracking of the silicon substrate in the on-chip processor due to uneven stress in the mounting and dismounting processes is reduced under the condition of minimizing the stress to the silicon substrate of the on-chip processor.
Disclosure of Invention
The invention provides a loading and unloading device based on an on-chip processor, which can reduce the risk of crushing the on-chip processor in the process of mounting and dismounting.
The embodiment of the invention provides a loading and unloading device based on an on-chip processor, which comprises the following components:
The device comprises an on-chip processor, a plurality of support areas and a runner attaching area, wherein the support areas are distributed on the lower surface of the on-chip processor, the support areas comprise a calculation core particle support area positioned at the center and a Dummy core particle support area positioned at the edge, and heat conduction silicone grease is smeared in other areas except the support area on the lower surface of the on-chip processor;
the base is internally provided with a through hole corresponding to the supporting area and a liquid cooling runner corresponding to the runner attaching area, and the surface of the base is provided with a groove;
The first supporting device is positioned at the bottom of the base and used for supporting the base;
the second supporting device comprises a plurality of supporting rods and supporting plates, one ends of the supporting rods are fixed on the supporting plates, and the other ends of the supporting rods penetrate through holes of the base and are attached to corresponding supporting areas to support the on-chip processor;
and the lifting device is positioned at the bottom of the supporting disc and is used for lifting and translating the second supporting device so as to align and install the on-chip processor on the groove or detach the on-chip processor from the groove.
Further, the device also comprises a tension control device, wherein the tension control device is in adsorption connection with the Dummy core particle supporting area on the lower surface of the on-chip processor through a through hole of the base, and is used for fixing the on-chip processor in a groove of the base by applying tension to the Dummy core particle supporting area on the lower surface of the on-chip processor after the on-chip processor is installed on the base and the first supporting device, the second supporting device and the lifting device are removed, and controlling the warping degree of the edge of the on-chip processor.
Further, the tension control device includes a plurality of force transmission members and a control member:
One end of each force transmission component is adsorbed to the Dummy core particle supporting area through a through hole of the base, and the other end of each force transmission component is connected with the control component;
The control component is used for controlling the pulling force applied to the Dummy core particle supporting area so that the on-chip processor is fixed in the groove, and adjusting the warping degree of the edge of the on-chip processor.
Further, the force transmission component comprises a fixed arm, a pulley, a tension line, a tension rod and a vacuum chuck:
one end of the fixed arm is connected with the control part, and the other end of the fixed arm is connected with the pulley;
One end of the tension line is connected with the control component, the other end of the tension line is connected with one end of the tension rod through the fixed arm and the pulley, the other end of the tension rod is connected with one end of the vacuum chuck, the other end of the vacuum chuck is adsorbed on the Dummy core particle supporting area, and the control component can control the tension applied to the Dummy core particle supporting area through the tension line.
Further, the on-chip processor comprises a core particle layer and a silicon substrate positioned on the core particle layer, wherein the core particle layer comprises a calculation core particle positioned in a central area and a Dummy core particle surrounding the calculation core particle;
The calculating core particle supporting area and the runner attaching area are both positioned on the lower surface of the calculating core particle, and the runner attaching area avoids the calculating core particle supporting area;
The Dummy core particle support region is located on the Dummy core particle lower surface.
Further, the calculated pellet support region is located at the intersection of four calculated pellets, and the dimension of the Dummy pellet support region is smaller than the dimension of the Dummy pellets.
Further, the lifting device comprises a lifting tray and a base, and the lifting tray is positioned on the base;
The lifting tray is provided with a second supporting device, and can move vertically or horizontally;
The base and the second supporting device are positioned on the same horizontal plane.
The embodiment of the invention also provides a method for installing the on-chip processor by using the loading and unloading device based on the on-chip processor, which comprises the following steps:
placing the lifting device and the first supporting device on the same horizontal plane, placing the base on the first supporting device, and placing the second supporting device on the lifting device;
The supporting rod of the second supporting device passes through the through hole of the base and is attached to the supporting area of the lower surface of the on-chip processor, so that the on-chip processor is fixed on the second supporting device;
The on-chip processor fixed on the second supporting device is lowered into the groove of the base through the lifting device, and the supporting area of the lower surface of the on-chip processor is aligned with the corresponding through hole through the optical alignment lens in the lowering process of the on-chip processor, so that the on-chip processor can be aligned and installed in the groove of the base.
The embodiment of the invention also provides a method for fixing the on-chip processor by using the loading and unloading device based on the on-chip processor, which comprises the following steps:
removing the first supporting device, the second supporting device and the lifting device after the on-chip processor is arranged on the base;
The vacuum sucker and the tension rod are fixed together, the tension rod with the vacuum sucker passes through the through hole of the base to be attached to the corresponding Dummy core particle supporting area, and the vacuum sucker can be adsorbed and fixed on the Dummy core particle supporting area by vacuumizing a pipeline in the tension rod;
The control part with the fixed arm is connected with the tension rod through the tension line, the fixed arm and the tension rod are in a fixed angle through the pulley, tension is applied to the Dummy core particle supporting area through the control part, so that the on-chip processor is fixed in the groove of the base, and meanwhile the warping degree of the edge of the on-chip processor is controlled.
The embodiment of the invention also provides a method for disassembling the on-chip processor by using the loading and unloading device based on the on-chip processor, which comprises the following steps:
Releasing the pulling force applied to the Dummy core particle supporting area by using the control part, then removing the control part with the fixed arm, the pulling line and the pulley, filling air into the vacuum chuck through a pipeline in the pulling rod, and then removing the pulling rod with the vacuum chuck;
The first supporting device is arranged below the base and used for supporting the base, the second supporting device is arranged on the lifting device, the first supporting device and the lifting device are arranged on the same horizontal plane, a plurality of supporting rods of the second supporting device are aligned to corresponding supporting areas through holes of the base and keep a set distance with the corresponding supporting areas, the supporting rods are lifted through the lifting device, and the crystal processor is taken out from the grooves of the base through the supporting rods.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the through holes on the base are utilized, so that the supporting rods of the second supporting device are relatively easy to be attached to the corresponding supporting areas of the on-chip processor, and during the process that the on-chip processor is arranged in the groove of the base, the on-chip processor is prevented from being broken due to friction or stress generated between the edge of the on-chip processor and the inner wall of the groove of the base by controlling the precise movement of the lifting device in the vertical direction and the horizontal direction; in the process of detaching the on-chip processor from the groove of the base, as the through holes are arranged below the supporting area of the lower surface of the on-chip processor, the area of the vacuum area between the base and the on-chip processor is reduced, the on-chip processor is subjected to multi-point uniform supporting force by utilizing the supporting rods in the detaching process, the viscosity of heat conduction silicone grease and the vacuum adsorption force of the lower surface of the on-chip processor and the base are overcome, and the purpose of separating the on-chip processor from the groove of the base is achieved completely.
Drawings
FIG. 1 is a schematic diagram of a handling device based on an on-chip processor according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a core distribution of an on-chip processor according to an embodiment of the present invention;
FIG. 3 is a diagram showing distribution of a plurality of support regions and flow channel bonding regions on the lower surface of an on-wafer processor according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a fixing device based on an on-chip processor according to an embodiment of the present invention;
FIG. 5 is a flowchart of an on-die processor-based mounting method according to an embodiment of the present invention;
FIG. 6 is a flowchart of a method for on-die processor-based fixing according to an embodiment of the present invention;
Fig. 7 is a flowchart of a detachment method based on an on-chip processor according to an embodiment of the present invention.
The on-chip handler 100, the pellet layer 110, the dummy pellets 111, the calculated pellets 112, the support area 113, the dummy pellet support area 113A, the calculated pellet support area 113B, the flow passage bonding area 114, the liquid cooling flow passage inlet bonding area 114A, the liquid cooling flow passage outlet bonding area 114B, the silicon substrate 120, the heat conductive silicone grease 130, the base 200, the through holes 210, the liquid cooling flow passage 220, the groove 230, the first supporting device 300, the second supporting device 400, the supporting plate 410, the supporting rod 420, the lifting device 500, the lifting tray 510, the base 520, the tension control device 600, the control part 610, the force transmission part 620, the fixing arm 621, the pulley 622, the tension line 623, the tension rod 624, the vacuum chuck 625, the wafer connector 700, the pcb base 800, the high-speed connector 900, the on-chip handler power supply system 10000, and the horizontal line 11000.
Detailed Description
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In order to reduce the risk of breakage in the process of mounting and dismounting the on-chip processor, the support rod penetrates through the through hole of the base, so that the support rod can be attached to a corresponding support area of the on-chip processor relatively easily, meanwhile, the on-chip processor can be embedded into the groove of the base by means of precise movement in the vertical direction and the horizontal direction of the lifting device, friction and collision with the groove are avoided, so that the on-chip processor is broken, in the dismounting process, the heat conduction silicone grease is not smeared in the support area, the through hole is arranged below the support area, and therefore the vacuum adsorption area of the on-chip processor and the groove of the base is reduced, then the on-chip processor is subjected to multi-point support force through the support rod, so that the on-chip processor can be completely separated from the groove of the base, and breakage is avoided, and the method is specifically described below.
An embodiment of the present invention provides a loading and unloading device based on an on-chip processor, as shown in fig. 1, including an on-chip processor 100, a base 200, a first supporting device 300, a second supporting device 400, and a lifting device 500.
According to the embodiment of the invention, the lower surface of the on-chip processor 100 is provided with the plurality of support areas 113 and the runner attaching area 114, the plurality of support areas 113 comprise the central calculated core particle support area 113B and the marginal Dummy core particle support area 113A, the heat conduction silicone grease is smeared on other areas except the support areas 113 on the lower surface of the on-chip processor 100, the temperature of the calculated core particles 112 is transferred to the liquid cooling runner 220 through the heat conduction silicone grease, and meanwhile, the viscosity of the heat conduction silicone grease is utilized, in the installation process, the lower surface of the on-chip processor and the grooves of the base can be adhered to form a certain vacuum area so as to play a role of primary fixing, and meanwhile, the heat conduction silicone grease is not smeared on the support areas, so that the support bars are removed easily to avoid the breakage of the on-chip processor in the removal process.
In one embodiment, the on-chip processor 100 provided in the embodiment of the present invention includes a core layer 110 and a silicon substrate 120, as shown in fig. 2, where the core layer 110 includes a computing core 112 in a central area and a Dummy core 111 at an edge, the computing core 112 is a core that is designed for operation, as shown in fig. 3, a computing core supporting area 113B and a runner bonding area 114 are disposed on a lower surface of the computing core 112, and an area where the runner bonding area 114 is located is a heating area in the center of the computing core 112 and is bonded to a liquid cooling runner 220 disposed on the base 200, so that the liquid cooling runner 220 is close to the heating area of the computing core 112, and the liquid cooling runner 220 is separated from the on-chip processor 100 while efficiently transferring heat to facilitate detachment and installation, and the runner bonding area 114 includes a liquid cooling runner inlet bonding area 114A and a liquid cooling runner outlet bonding area 114B. The Dummy core particle 111 is a blank core particle, and a Dummy core particle supporting region 113A is provided under the Dummy core particle 111.
In one implementation, as shown in fig. 2, 184 cores are arranged on a 12-inch silicon substrate, each core has a size of 15.3×15.3mm 2, a spacing between the cores is 1mm, 44 202-Dummy cores are arranged around the periphery, 140 cores in the central area are tested calculated cores, and four edges of the silicon substrate are cut along the outer edges of the Dummy cores to reduce the overall warpage. In fig. 1, the thickness of the silicon substrate of the on-chip processor after thinning is 100um, the thickness of the die and Dummy die is calculated to be 775um before thinning, and the height of the bump on the die for bonding to the silicon substrate is 85um, so the overall thickness of the on-chip processor is about 960um.
Further, the calculated core particle supporting area 113B provided in the embodiment of the present invention is located at the junction of the four calculated core particles 112, and the dimension of the Dummy core particle supporting area 113A provided in the embodiment is smaller than the dimension of the Dummy core particle 111, so as to avoid influencing the calculated core particle 112 in the process of applying the tensile force to the Dummy core particle supporting area 113A.
The base 200 provided in the embodiment of the present invention is provided with a through hole 210 corresponding to the supporting area and a liquid cooling flow channel 220 corresponding to the flow channel attaching area, and the surface of the base is provided with a groove 230. Mounting, fixing and dismounting of the on-chip handler is accomplished by the support bar 420 and the tension bar 624 through the through-holes 210.
In a specific embodiment, the base 200 provided in this embodiment is made by combining and welding two copper metal materials with liquid cooling flow channel grooves up and down, the upper and lower grooves form a closed liquid cooling flow channel 220, and a groove 230 with the same size as the on-chip processor 100 is milled on the upper surface of the base 200.
In a specific embodiment, the base 200 provided in this embodiment is an integral body containing liquid cooling channels formed by electric welding two copper materials, the external dimension of the base 200 is 240×240×30mm 3, as shown in fig. 4, the upper surface of the base is washed out with a groove for embedding an on-chip processor and a wafer connector, the external dimension of the groove is the same as that of the on-chip processor, the depth is the sum of the thickness of the on-chip processor and the thickness of the wafer connector, as shown in fig. 3 and 4, two liquid cooling channels are contained in the base 200, the width of the channels is 18mm, the depth is 10mm, the liquid cooling channels cover the central heating area (liquid cooling channel corresponding area in the on-chip processor) of each calculation core particle, the liquid cooling channels keep a distance of more than 2mm from the through holes in the base, and each channel contains a liquid cooling channel inlet and a liquid cooling channel outlet. The on-die processor base contains 49 through holes with coordinate positions corresponding to the support and suction cup suction areas on the 204-Dummy die and the support areas in the 205-calculation die in fig. 3, respectively, wherein the support and suction cup suction areas on the 24 204-Dummy die are positioned on the back of the Dummy die, the support areas in the 25 205-calculation dies are positioned at the corner intersections of the four calculation dies with the diameter of 12mm, and the diameter of 8mm, and the through holes are used for supporting the on-die processor through support columns or correcting the warpage of the on-die processor through suction cups when the on-die processor is mounted, fixed and dismounted.
The first supporting device 300 provided in the embodiment of the present invention is located at the bottom of the base 200 for supporting the base 200, so that the supporting rod 420 on the lifting tray 510 for supporting the on-chip processor 100 for mounting and dismounting can support the on-chip processor 100 for flexible lifting and moving. The first supporting device 300 is made of rigid material.
In a specific embodiment, the first supporting device 300 provided in this embodiment is 4 square columns made of stainless steel, the height of each column is 50mm, the length and width of each column are 25mm, and four columns are installed at four corners of the bottom of the 101-on-chip processor base to support the 101-on-chip processor base to be stable.
The second support device 400 provided in this embodiment of the present invention includes a plurality of support rods 420 and a support plate 410, wherein the support plate 410 has a very low warpage, one end of the support rod 420 is fixed on the support plate 410, the other end passes through the through hole 210 of the base and is attached to the corresponding support area 113 to support the on-chip processor 100, the size of the support rod 420 is slightly smaller than that of the through hole 210, and the height of the support rod 420 is higher than that of the base 200 by more than 5mm when the on-chip processor 100 is started to be installed.
In a specific embodiment, in the second support device 400 provided in this embodiment, a stainless steel plate with a thickness of 5mm and an external dimension identical to that of the silicon substrate 120 is used as the rigid support plate 410, a copper column with a diameter of 6mm and a height of 35mm is used as the 102-rigid support column 420, and the 49 support columns 420 are fixed to the rigid support plate 410 by using ultraviolet curing glue according to the coordinates of the through holes in the base of the on-chip processor, so as to form a whole to obtain the second support device 400.
The lifting device 500 provided in the embodiment of the present invention is located at the bottom of the support plate 410 for lifting and translating the second support device 400 to align the on-chip handler 100 on the recess 230 or to detach the on-chip handler 100 from the recess 230. The elevating device 500 and the first supporting device 300 are positioned at the same horizontal line 11000.
In a specific embodiment, the lifting device 500 provided in this embodiment includes a lifting tray 510 and a base 520, where the lifting tray 510 is located on the base 520; the second supporting device 400 is placed on the lifting tray 510, and the lifting tray 510 can move vertically or horizontally, so that fine adjustment can be performed to align the supporting area of the lower surface of the on-chip handler with the through hole, so as to avoid the on-chip handler 100 from being broken due to friction and extrusion between the on-chip handler 100 and the groove 230.
In a specific embodiment, the length and width of the lifting device 500 provided in this embodiment are smaller than 190×190mm 2, and the height of the lifting device can be raised from 25mm to 35mm, as shown in fig. 1, when the on-chip handler is installed and removed, the base 520 of the lifting device 500 is fixed on a flat and hard plane, the second support device 400 is installed on the lifting tray 510 of the lifting device 500, and the lifting tray 510 moves with nanometer precision and steps.
There are two problems due to: 1. the silicon substrate of the on-chip processor is thinned, and the whole warp is larger, so that a large number of high-density small-size PADs on the silicon substrate cannot be accurately butted with auxiliary systems (including an on-chip power supply system, an external high-speed communication interface, a clock input interface, a configuration interface and the like); 2. when the on-chip processor is in butt joint with the auxiliary system and is installed, stress on each part of the silicon substrate is uneven due to warpage, so that the part with high warpage of the silicon substrate is easy to crack due to overlarge stress, and the embodiment of the invention provides the tension control device 600 for fixing the on-chip processor 100.
The tension control device 600 provided in the embodiment of the present invention is in adsorptive connection with the Dummy core supporting area 113A on the lower surface of the on-chip handler 100 through the through hole 230 of the base 200, and is used for fixing the on-chip handler 100 in the groove 230 of the base 200 by applying tension to the Dummy core supporting area 113A on the lower surface of the on-chip handler 100 after the on-chip handler 100 is mounted on the base 200 and the first supporting device 300, the second supporting device 400 and the lifting device 500 are removed, and controlling the warpage of the edge of the on-chip handler 100. Since the thinner on-die processor 100 generally warps in the edge region and in order to avoid affecting the calculated core during the pull-down process, embodiments of the present invention apply a pulling force to the Dummy core support region 113A on the lower surface of the on-die processor 100 at the edge region to adjust.
In a specific embodiment, the tension control device 600 provided in this embodiment includes a plurality of force transmission components 620 and a control component 610: wherein one end of each force transfer member 620 is adsorbed to the Dummy pellet supporting region 113A through the through-hole 230 of the base 200, and the other end is connected to the control member 610; the control unit 610 is used to control the tension applied by the force transfer unit 620 to the Dummy core support region 113A so that the on-die handler 100 is secured within the recess 230 and to adjust the warpage of the edge of the on-die handler 100.
In one embodiment, the force transfer member 620 provided in this embodiment includes a stationary arm 621, a pulley 622, a tension line 623, a tension rod 624, and a vacuum chuck 625:
Wherein one end of the fixed arm 621 is connected to the control member 610, and the other end of the fixed arm 621 is connected to the pulley 622; one end of the tension wire 623 is connected to the control member 610, and the other end is connected to one end of the tension rod 624 via the fixing arm 621 and the pulley 622, the other end of the tension rod 624 is connected to one end of the vacuum chuck 625, and the other end of the vacuum chuck 625 is adsorbed on the Dummy pellet support area 113A, so that the control member 610 can control the tension applied to the Dummy pellet support area 113A by the tension wire 623.
Further, the number of the pull rods 624 and the number of the vacuum chucks 625 provided in the present embodiment are the same as the number of the through holes 210 of the base 200, the diameters of the vacuum chucks 625 and the pull rods 624 are smaller than the size of the through holes 210 of the base 200, the pull rods 624 include pipes for extracting and injecting air to the vacuum chucks 625, and the bottom of the pull rods 624 includes a horizontal through hole for installing a pull line.
Further, for the array that vacuum chuck and pulling force stick are constituteed, contain 24 vacuum chuck and 24 pulling force sticks, vacuum chuck's diameter is 10mm, and pulling force stick's diameter is 6mm, and the inside pipeline of pulling force stick can cooperate outside air suction in with the sucking disc or for sucking disc injection air, and then with sucking disc adhesion at Dummy pellet back or detach from Dummy pellet back.
Further, the control unit 610 provided in this embodiment is installed below the base 200, and is used for controlling the pulling force of the vacuum chuck attached to the back surface of the Dummy pellet 111, so as to improve the warpage of the on-chip handler 100, and includes a number of pulling force detecting and controlling channels equal to the number of the vacuum chuck 625 and the pulling force rod 624, each channel can independently control and detect the pulling force of the corresponding vacuum chuck 625 on the Dummy pellet supporting area 113A, each channel horizontally extends out of a fixing arm 621 with a pulley 622 on the side wall around the device, and the outer edge of the pulley 622 is tangent to the central extension line of the pulling force rod 624.
Further, the control unit 610 according to this embodiment is provided with a housing having flat upper and lower surfaces, the lower part of which is mounted on a flat plane, and the upper part of which is mounted with the base 200. The side wall of the control part 610 comprises 24 pulleys and corresponding fixed arms, one end of a tension line on each pulley is connected to a hole of the tension line at the tail end of a tension rod, the other end of the tension line is connected with a servo motor in the control part 610, each servo motor is used for precisely controlling the tension on a tension rope in a stepping manner, monitoring the torque on the tension rope while controlling the tension, and feeding back the torque to a display screen of a tension detection and control device or a remote control console outside a crystal system for display and monitoring through an electric signal.
In one embodiment, the wafer connector 700 provided in the present embodiment is used for connecting the on-chip processor 100 with an external auxiliary system (including a power supply system, an external high-speed connector, etc.), the wafer connector 700 is embedded into a supporting base made of hard material by an elastic connector to form an elastic connector array, and then a plurality of elastic connector arrays are combined and bonded to form the wafer connector 700 with the same size as the on-chip processor 100, and the elastic connector is a button.
Further, the dimension of the wafer connector 700 in the horizontal direction is the same as the dimension of the on-chip processor, the height is 2mm, an LCP material is used as a supporting structure and is embedded into miniature hair buttons with the length of 2mm and the diameter of 0.254mm, the whole wafer connector 700 is formed by 184 small hair button arrays through ultraviolet curing glue into a hair button array with the same dimension as the on-chip processor 100, and the wafer connector is connected with a power supply system, a high-speed connector for external communication and the on-chip processor.
In an embodiment, the power supply system 10000 of the on-chip processor provided in this embodiment receives a high voltage input from outside the system, converts the high voltage input into a voltage required by a core of the on-chip processor 100, and supplies power to the on-chip processor 100, wherein the bottom of the power supply system is a high-speed PCB substrate 800, high-speed connectors 900 for interconnecting and communicating the on-chip processor 100 with external devices are arranged around the PCB substrate 800, and PADs below the PCB substrate 800 are in butt joint with the wafer connectors 700.
Further, for the on-chip processor power supply system 10000, the bottom is the PCB bottom plate 800, the PCB bottom plate 800 is mounted on the on-chip processor 100 and is in butt joint with the wafer connector 700, and the power supply system includes a plurality of voltage conversion modules therein to convert the dc voltage of 48V outside the system into the low level voltage (e.g. 0.8V, 1.2V, 1.8V, etc.) required by the core particle in the on-chip processor 100.
The invention further provides an installation, fixing and disassembly method based on the on-chip processor, and the method can be used for avoiding the on-chip processor from being broken in the installation, fixing and disassembly processes under the condition of reducing the stress on the silicon substrate of the on-chip processor as much as possible.
The embodiment of the invention provides a method for installing an on-chip processor by using a loading and unloading device based on the on-chip processor, which comprises the following steps:
(1) Manufacturing an on-chip processor: 184 core particles were bonded to a 12-inch 201-silicon substrate, and the edge portion of the 201-silicon substrate was cut. The back surface of the computing core particle in the on-chip processor or the groove on the upper surface of the base is then coated with heat-conducting silicone grease, but avoids the supporting area of the on-chip processor.
Manufacturing a second supporting device: the second support means 400 was formed by adhering 49 copper support columns to a rigid support plate of stainless steel material with ultraviolet curable glue according to the Dummy core support area and calculating the coordinates of the core support area.
(2) The lifting device and the first supporting device are arranged on a horizontal plane, the second supporting device on the crystal is placed on the lifting tray of the lifting device, the first supporting device is used for supporting the base, the supporting rod penetrates through the through hole of the base and is attached to the supporting area of the lower surface of the crystal processor, and the crystal processor is fixed on the second supporting device.
(3) The on-chip processor fixed on the second supporting device is lowered onto the base groove through the lifting device, and the supporting area of the lower surface of the on-chip processor is aligned with the corresponding through hole through the optical alignment lens in the lowering process of the on-chip processor, so that the on-chip processor can be aligned and installed on the base.
In one embodiment, the tray of the lifting device is lifted, the supporting rod is higher than the upper surface of the base, the on-chip processor is horizontally placed on the supporting rod, the groove of the base corresponds to the position vertically, then the lifting tray is lowered, the relative position of the on-chip processor and the groove is checked by using the optical alignment lens, if deviation exists, the lifting tray is adjusted to move in the horizontal direction, and the first supporting device, the second supporting device and the lifting device are removed after the on-chip processor is completely embedded into the groove of the base.
The embodiment of the invention provides a method for fixing an on-chip processor by using a loading and unloading device based on the on-chip processor, which comprises the following steps:
(1) After the on-chip processor is mounted on the base, the first supporting device, the second supporting device and the lifting device are removed.
(2) The vacuum sucker and the tension rod are fixed together, the tension rod with the vacuum sucker passes through the through hole of the base to be attached to the corresponding Dummy core particle supporting area, and the vacuum sucker is adsorbed and fixed on the Dummy core particle supporting area by vacuumizing a pipeline in the tension rod.
In one embodiment, the vacuum chuck and the tension rods are assembled together, then 24 tension rods with chucks extend into the through holes of the base, the vacuum chuck and the back surface of the Dummy core particle are pumped to dry air and form vacuum, and the vacuum chuck and the tension rods are fixed on the back surface of the Dummy core particle of the on-chip processor.
(3) The control part with the fixed arm is connected with the tension rod through the tension line, the fixed arm and the tension rod are in a fixed angle through the pulley, tension is applied to the Dummy core particle supporting area through the control part, so that the on-chip processor is fixed in the groove of the base, and meanwhile the warping degree of the edge of the on-chip processor is controlled.
In a specific embodiment, the control member is mounted below the base, the fixed arms and pulleys of the device are adjusted to be at a 90 degree right angle to the suction cup attached tension bars, and each tension bar is connected to a servo motor inside the control member using a tension wire through the pulleys.
The tensile force of each path of tension lines is controlled by a servo motor of the control part, so that the initial tensile force is kept consistent, then the warp degree of the upper plane of the on-chip processor is detected by using a warp degree detecting instrument, the warp of the standard on-chip processor is in a shape with a concave middle and two warped sides, and the whole warp degree of the on-chip processor is reduced until the warp degree is smaller than 0.1mm by continuously fine-adjusting the tensile force value of each path of tension lines.
The embodiment of the invention provides a method for fixing an on-chip processor by using a loading and unloading device based on the on-chip processor, which further comprises the following steps:
(4) Embedding the on-chip connector into an on-chip processor base, attaching the on-chip connector onto a silicon substrate of an on-chip processor, enabling the on-chip connector to be flush with the upper surface of the on-chip processor base, finally installing a PCB base plate and an on-chip processor power supply system, and fixing the power supply system and the PCB base plate on the on-chip processor base by using screws.
The embodiment of the invention provides a method for disassembling an on-chip processor by using a loading and unloading device based on the on-chip processor, which comprises the following steps:
(1) The tension applied to the Dummy pellet support area is released by the control member, and then the control member with the fixed arm, tension line, pulley are removed, and the vacuum chuck is inflated by inflating the tube within the tension rod, and then the tension rod with the vacuum chuck is removed.
In one embodiment, the tension force of each path of tension lines connected with the control component is reduced at a constant speed until the tension force of all the tension lines is zero, then the tension lines and the control component are removed, an inflator is used for filling air into all the vacuum suction cups through the pipelines in the tension rod, and then all the vacuum suction cups and the tension rod adsorbed on the Dummy core particle are removed one by one.
(2) The first supporting device is arranged below the base and used for supporting the base, the second supporting device is arranged on the lifting device, the first supporting device and the lifting device are arranged on the same horizontal plane, the lifting device is lowered to the lowest point, a plurality of supporting rods of the second supporting device are aligned to corresponding supporting areas through holes of the base, the supporting rods and the on-chip processor keep a gap of more than 3mm, the supporting rods are lifted through the lifting device, and the on-chip processor is taken out from a groove of the base through the supporting rods.
When the on-chip processor is further fixed with a wafer connector, a PCB base plate and a high-speed connector, the embodiment of the invention provides a method for disassembling the on-chip processor by using a loading and unloading device based on the on-chip processor, which comprises the following steps:
(1) The tension applied to the Dummy pellet support area is released by the control member, and then the control member with the fixed arm, tension line, pulley are removed, and the vacuum chuck is inflated by inflating the tube within the tension rod, and then the tension rod with the vacuum chuck is removed.
In one embodiment, the tension force of each path of tension lines connected with the control component is reduced at a constant speed until the tension force of all the tension lines is zero, then the tension lines and the control component are removed, an inflator is used for filling air into all the vacuum suction cups through the pipelines in the tension rod, and then all the vacuum suction cups and the tension rod adsorbed on the Dummy core particle are removed one by one.
(2) And removing the fixing screws between the power supply system and the base of the on-chip system, and removing the power supply system and the PCB bottom plate.
(3) The first supporting device is arranged below the base and used for supporting the base, the second supporting device is arranged on the lifting device, the first supporting device and the lifting device are arranged on the same horizontal plane, the lifting device is lowered to the lowest point, a plurality of supporting rods of the second supporting device are aligned to corresponding supporting areas through holes of the base, the supporting rods and the on-chip processor keep a gap of more than 3mm, the supporting rods are lifted through the lifting device, and the on-chip processor is taken out from a groove of the base through the supporting rods.
The method and the device for mounting, dismounting and fixing the on-chip processor are described in detail in the embodiment, the on-chip processor is mounted, fixed and dismounted in a mode of applying multipoint tensile force and supporting force on the back surface of the core particle in the on-chip processor, stress is uniformly distributed on a plurality of core particles with the thickness of 775um, and the problem that the 12 inch ultrathin silicon substrate with the thickness of 100um is directly subjected to stress to cause the breakage is avoided.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A loading and unloading device based on an on-chip processor, comprising:
The device comprises an on-chip processor, a plurality of support areas and a runner attaching area, wherein the support areas are distributed on the lower surface of the on-chip processor, the support areas comprise a calculation core particle support area positioned at the center and a Dummy core particle support area positioned at the edge, and heat conduction silicone grease is smeared in other areas except the support area on the lower surface of the on-chip processor;
the base is internally provided with a through hole corresponding to the supporting area and a liquid cooling runner corresponding to the runner attaching area, and the surface of the base is provided with a groove;
The first supporting device is positioned at the bottom of the base and used for supporting the base;
the second supporting device comprises a plurality of supporting rods and supporting plates, one ends of the supporting rods are fixed on the supporting plates, and the other ends of the supporting rods penetrate through holes of the base and are attached to corresponding supporting areas to support the on-chip processor;
The lifting device is positioned at the bottom of the supporting disc and used for lifting and translating the second supporting device so as to align and install the on-chip processor on the groove or detach the on-chip processor from the groove;
The device comprises a base, a first supporting device, a second supporting device, a lifting device, a tension control device, a bending degree control device and a control device, wherein the lower surface of the base is provided with a through hole;
the tension control device comprises a plurality of force transmission components and a control component:
One end of each force transmission component is adsorbed to the Dummy core particle supporting area through a through hole of the base, and the other end of each force transmission component is connected with the control component;
The control component is used for controlling the pulling force applied to the Dummy core particle supporting area to fix the on-chip processor in the groove and adjust the warping degree of the edge of the on-chip processor;
the force transmission component comprises a fixed arm, a pulley, a tension line, a tension rod and a vacuum chuck:
one end of the fixed arm is connected with the control part, and the other end of the fixed arm is connected with the pulley;
One end of the tension line is connected with the control component, the other end of the tension line is connected with one end of the tension rod through the fixed arm and the pulley, the other end of the tension rod is connected with one end of the vacuum chuck, the other end of the vacuum chuck is adsorbed on the Dummy core particle supporting area, and the control component can control the tension applied to the Dummy core particle supporting area through the tension line.
2. The on-die processor-based handling device of claim 1, wherein the on-die processor comprises a core layer and a silicon substrate on the core layer, wherein the core layer comprises a calculated core particle in a central region and a Dummy core particle surrounding the calculated core particle;
The calculating core particle supporting area and the runner attaching area are both positioned on the lower surface of the calculating core particle, and the runner attaching area avoids the calculating core particle supporting area;
The Dummy core particle support region is located on the Dummy core particle lower surface.
3. The on-die processor-based handling device of claim 2, wherein the calculated pellet support area is located at the intersection of four calculated pellets, the Dummy pellet support area having a size that is less than the size of the Dummy pellets.
4. The on-die processor-based handling device of claim 1, wherein the lifting device comprises a lifting tray and a base, the lifting tray being located on the base;
The lifting tray is provided with a second supporting device, and can move vertically or horizontally;
The base and the second supporting device are positioned on the same horizontal plane.
5. A method of handling an on-die processor using an on-die processor-based handling device according to any of claims 1-4, comprising:
placing the lifting device and the first supporting device on the same horizontal plane, placing the base on the first supporting device, and placing the second supporting device on the lifting device;
The supporting rod of the second supporting device passes through the through hole of the base and is attached to the supporting area of the lower surface of the on-chip processor, so that the on-chip processor is fixed on the second supporting device;
The on-chip processor fixed on the second supporting device is lowered into the groove of the base through the lifting device, and the supporting area of the lower surface of the on-chip processor is aligned with the corresponding through hole through the optical alignment lens in the lowering process of the on-chip processor, so that the on-chip processor can be aligned and installed in the groove of the base;
removing the first supporting device, the second supporting device and the lifting device after the on-chip processor is arranged on the base;
The vacuum sucker and the tension rod are fixed together, the tension rod with the vacuum sucker passes through the through hole of the base to be attached to the corresponding Dummy core particle supporting area, and the vacuum sucker can be adsorbed and fixed on the Dummy core particle supporting area by vacuumizing a pipeline in the tension rod;
The control part with the fixed arm is connected with the tension rod through the tension line, the fixed arm and the tension rod are in a fixed angle through the pulley, tension is applied to the Dummy core particle supporting area through the control part, so that the on-chip processor is fixed in the groove of the base, and meanwhile the warping degree of the edge of the on-chip processor is controlled.
6. The method of loading and unloading an on-die processor from an on-die processor-based loading and unloading device of claim 5, comprising:
Releasing the pulling force applied to the Dummy core particle supporting area by using the control part, then removing the control part with the fixed arm, the pulling line and the pulley, filling air into the vacuum chuck through a pipeline in the pulling rod, and then removing the pulling rod with the vacuum chuck;
The first supporting device is arranged below the base and used for supporting the base, the second supporting device is arranged on the lifting device, the first supporting device and the lifting device are arranged on the same horizontal plane, a plurality of supporting rods of the second supporting device are aligned to corresponding supporting areas through holes of the base and keep a set distance with the corresponding supporting areas, the supporting rods are lifted through the lifting device, and the crystal processor is taken out from the grooves of the base through the supporting rods.
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