CN117572941A - Computing device - Google Patents

Abstract

Embodiments of the present application provide a computing device, wherein the computing device includes: the shell is internally provided with a first air channel with a first air inlet and a first air outlet; the circuit board is arranged in the first air duct; the fan assembly is arranged in the first air duct and along the air direction in the first air duct, the circuit board is located in the upwind direction, the fan assembly is located in the downwind direction, the fan assembly comprises a drivable impeller, and the circuit board is located at one side of the impeller in the radial direction. According to the technical scheme, the problem of wind channeling can be avoided, so that the heat dissipation performance of the computing equipment can be improved, the arrangement quantity of the air duct pieces in the first air duct can be reduced, and the structure is simpler.

Description

Computing device

Technical Field

The present application relates to the field of electronic devices, and in particular, to a computing device.

Background

In the related art, an electronic device such as a computing device is generally provided with an air duct inside. When wind flows through the air duct, heat generated by working elements in the electronic equipment can be taken away. However, wind is easy to generate a wind channeling phenomenon in the process of flowing in the air duct, so that the heat dissipation performance of the electronic equipment is affected.

Disclosure of Invention

Embodiments of the present application provide a computing device to solve or mitigate one or more technical problems in the prior art.

As one aspect of the present embodiments, the present embodiments provide a computing device, comprising: the shell is internally provided with a first air channel with a first air inlet and a first air outlet; the circuit board is arranged in the first air duct; the fan assembly is arranged in the first air duct and along the air direction in the first air duct, the circuit board is located in the upwind direction, the fan assembly is located in the downwind direction, the fan assembly comprises a drivable impeller, and the circuit board is located at one side of the impeller in the radial direction.

In one embodiment, the first air inlet is arranged on any side plate of the shell, and the first air outlet is arranged on the top plate of the shell.

In one embodiment, the housing includes a top plate and a bottom plate that are disposed opposite to each other, two first side plates that are disposed opposite to each other, and two second side plates that are disposed opposite to each other, the first side plates being located in an axial direction of the fan assembly, wherein the first air inlet is disposed in one of the two second side plates, and the first air outlet is disposed in the top plate.

In one embodiment, the fan assembly further comprises a driver drivingly connected to one end of the impeller in the axial direction.

In one embodiment, the fan assembly includes a fan housing defining a second air duct therein having a second air inlet and a second air outlet, the second air inlet being disposed opposite the circuit board, the second air outlet being disposed opposite the first air outlet.

In one embodiment, a fan assembly includes a fan housing, an impeller positioned within the fan housing, and a drive mounted to the fan housing.

In one implementation, a computing device further includes: and the control module is electrically connected with the fan assembly and the circuit board and is arranged at one axial end of the fan assembly.

In one embodiment, the driver of the fan assembly is electrically connected to the control module.

In one embodiment, the control module includes a power connector, a reset controller, and a switch controller; the power connector corresponds to a power interface arranged on the shell, the reset controller corresponds to a reset interface arranged on the shell, and the switch controller corresponds to a switch interface arranged on the shell.

In one embodiment, the power interface, reset interface and switch interface are disposed on a top plate of the housing.

In one embodiment, the circuit board includes a first surface and a second surface that are disposed opposite to each other, and a plurality of heat generating components arranged in an array are disposed on the first surface.

In one embodiment, the plurality of heat generating components have equal areas and/or the plurality of heat generating components have the same device type.

In one implementation, the computing device further includes a heat sink disposed on the first surface and/or the second surface.

In one embodiment, the radiator comprises a liquid cooling tube and a plurality of radiating fins arranged at intervals, the extending direction of each radiating fin is the same as the wind direction in the first air duct, and the liquid cooling tube penetrates through the plurality of radiating fins along the arrangement direction of the plurality of radiating fins.

In one embodiment, the heat sink includes a first heat sink and a second heat sink, the first heat sink is disposed on the first surface, the second heat sink is disposed on the second surface, and a size of the second heat sink is larger than a size of the first heat sink along an arrangement direction of the plurality of heat dissipation fins.

In one embodiment, the heat sink further includes a heat dissipating substrate, and the plurality of heat dissipating fins are disposed on the heat dissipating substrate, and the heat dissipating substrate is connected to the circuit board.

In one embodiment, at least a portion of the first heat dissipating fins have a smaller dimension than the remaining at least a portion of the heat dissipating fins along a direction of the wind in the first wind tunnel; the first radiating fins are radiating fins corresponding to the connecting areas of the radiating base plate and the circuit board.

In one embodiment, the second heat sink is connected to the housing by a fastener.

In one embodiment, the second heat sink is used for supporting the weight of the circuit board and the first heat sink.

In one embodiment, the top of the first air inlet is flush with the top of the heat sink, and the bottom of the first air inlet is flush with the bottom of the heat sink.

In one embodiment, the distance between two adjacent heat radiating fins is 3mm to 6mm.

In one embodiment, the housing includes a mounting location in which the display assembly is mounted.

In one embodiment, the first air outlet is in communication with a heat recovery system.

According to the embodiment of the application, the problem of wind channeling can be avoided by adopting the technical scheme, so that the heat dissipation performance of the computing equipment can be improved, the arrangement quantity of the air duct pieces in the first air duct can be reduced, and the structure is simpler.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

FIG. 1 illustrates a top schematic view of a computing device according to an embodiment of the present application;

FIG. 2 shows a cross-sectional view along line A-A of FIG. 1;

FIGS. 3 and 4 illustrate exploded views of a computing device according to an embodiment of the present application;

FIG. 5 shows a partial structural schematic of a housing according to an embodiment of the present application;

FIG. 6 illustrates a partial structural schematic diagram of a computing device according to an embodiment of the present application;

FIG. 7 illustrates an exploded view of the computing device shown in FIG. 6.

Reference numerals illustrate:

10: a computing device;

100: a housing; 110: a top plate; 111: a first air outlet; 120: a bottom plate; 130: a first side plate; 140: a second side plate; 141: a first air inlet; 150: a mounting hole; 160: a pressing plate; 170: a display assembly; 10a: a power interface; 10b: resetting an interface; 10c: a switch interface; 200: a circuit board; 210: a first surface; 211: a heating element; 220: a second surface; 300: a fan assembly; 310: an impeller; 320: a driver; 330: a fan housing; 331: a second air inlet; 332: a second air outlet; 400: a heat sink; 410: a first heat sink; 420: a second heat sink; 430: a liquid-cooled tube; 440: a heat radiation fin; 450: a heat-dissipating substrate; 500: a control module; 510: a power supply connector; 520: resetting the controller; 530: and a switch controller.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

A computing device according to an embodiment of the present application is described below in conjunction with fig. 1-7.

FIG. 1 illustrates a top schematic view of a computing device 10 according to an embodiment of the present application; FIG. 2 shows a cross-sectional view along line A-A of FIG. 1; fig. 3 and 4 illustrate exploded views of computing device 10 according to embodiments of the present application. As shown in fig. 1-4, the computing device 10 includes a housing 100, a circuit board 200, and a fan assembly 300.

Specifically, the housing 100 defines a first air duct having a first air inlet 141 and a first air outlet 111 therein. The circuit board 200 is disposed in the first air duct. The fan assembly 300 is disposed in the first air duct, and along the wind direction in the first air duct, the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction. The fan assembly 300 includes a drivable impeller 310, with the circuit board 200 being located radially to one side of the impeller 310.

It should be noted that "in the wind direction in the first wind channel, the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction" means that in the wind direction in the first wind channel, the circuit board 200 is located in the upwind direction relative to the fan assembly 300, and the fan assembly 300 is located in the downwind direction relative to the circuit board 200. That is, as the wind in the wind tunnel flows, the wind passes through the circuit board 200 and then the fan assembly 300.

Wherein "upwind direction" and "downwind direction" are to be understood in the broad sense in this application, and "up" and "down" are not related to "up" and "down" in physical orientation, but refer to relative positional relationship in the direction of the wind within the first wind tunnel. For example: in the first wind tunnel, if the wind flows from left to right, the left side of the first wind tunnel may be described as upwind and the right side of the first wind tunnel as downwind. At this time, "the circuit board 200 is located in an upwind direction and the fan assembly 300 is located in a downwind direction" means that the circuit board 200 is located at the left side of the fan assembly 300 and the fan assembly 300 is located at the right side of the circuit board 200. If the wind is flowing from bottom to top, the underside of the first wind tunnel may be described as upwind and the upper side of the tunnel as downwind. At this time, "the circuit board 200 is located in an upwind direction and the fan assembly 300 is located in a downwind direction" means that the circuit board 200 is located at a lower side of the fan assembly 300 and the fan assembly 300 is located at an upper side of the circuit board 200.

Illustratively, the fan assembly 300 may further include a driver 320 drivingly connected to an axial end of the impeller 310 for driving the impeller 310 to rotate. For example: the driver 320 may be a driving motor, where the driver 320 may include a driving body and a power output shaft disposed on the driving body, where the power output shaft is rotatable relative to the driving body. The power take-off shaft may be in driving connection with the impeller 310. Alternatively, the material of the impeller 310 may be a metal such as an aluminum alloy, or may be a plastic, which is not limited in this application. In the case where the driver 320 operates, the driver 320 drives the impeller 310 to rotate. Under the action of the impeller 310, cold air enters the first air channel from the first air inlet 141 and then flows through the circuit board 200 to exchange heat with the circuit board 200, so that heat generated in the working process of the circuit board 200 is taken away. The hot wind flowing through the circuit board 200 enters the fan assembly 300 from the air inlet of the fan assembly 300, then flows from the air outlet of the fan assembly 300 to the first air outlet 111, and finally flows out of the first air outlet 111.

In this embodiment, since the circuit board 200 is located in the upwind direction, the fan assembly 300 is located in the downwind direction, and the fan assembly 300 is of an exhaust type, the problem of wind channeling can be avoided, so that the heat dissipation performance of the computing device 10 can be improved, the number of the air duct pieces in the first air duct can be reduced, and the structure is simpler. In addition, since the circuit board 200 is located at one side of the impeller 310 in the radial direction, hot air flowing through the circuit board 200 enters from the impeller 310 in the radial direction, and the fan assembly 300 is a cross-flow fan, the limitation of the air outlet size of the fan assembly 300 is not required to be considered while the high efficiency, energy saving, silence, easy maintenance and installation of the fan assembly 300 are ensured, and thus the space utilization of the computing device 10 can be improved.

For example, the first air outlet 111 may be in communication with a heat recovery system. In this way, the hot air output by the first air outlet 111 can be reused, so that the energy efficiency can be improved, the carbon emission can be reduced, and the energy cost can be reduced.

Alternatively, the mounting position of the fan assembly 300 may be provided with a rubber mat structure to absorb vibration and shock generated during the operation of the fan assembly 300.

Illustratively, the first air outlet 111 may communicate with the indoor space or the in-vehicle space through a heat recovery system, thereby raising the indoor or in-vehicle air temperature by using the hot air output from the first air outlet 111 to achieve a heating function. Compared with a heating mode by using a heater, the electric quantity can be saved, the resource utilization efficiency is improved, and the negative influence on the environment is reduced.

It should be noted that "heat recovery system" is to be understood in the broad sense herein to refer to a system for recovering heat energy. For example: in the case that the first air outlet 111 is directly communicated with the indoor space to warm by using the hot air outputted from the first air outlet 111, the heat recovery system is a house.

In one embodiment, the first air inlet 141 may be provided at any one side plate of the housing 100, and the first air outlet 111 may be provided at a top plate of the housing 100. Therefore, under the condition that the hot air output by the first air outlet 111 is used for heating, the first air outlet 111 arranged on the top plate can be prevented from being blocked by furniture, curtains or other objects, so that the circulation of the hot air can be ensured, and the heating requirement of a user can be fully met.

Fig. 5 shows a partial structural schematic diagram of the housing 100 according to an embodiment of the present application. In one embodiment, referring to fig. 2, 3 and 5, the housing 100 may include a top plate 110 and a bottom plate 120 disposed opposite to each other, two first side plates 130 disposed opposite to each other, and two second side plates 140 disposed opposite to each other, the first side plates 130 being located in an axial direction of the fan assembly 300, wherein the first air inlet 141 is disposed in one of the two second side plates 140, and the first air outlet 111 is disposed in the top plate 110. Therefore, the shell 100 is simple in structure and convenient to process, and can effectively improve the assembly and disassembly efficiency.

For example, referring to fig. 2, 3 and 5, the case 100 may be formed generally in a rectangular parallelepiped structure. The two first side plates 130 may be a first left side plate and a first right side plate, respectively. The two second side plates 140 may be a second front side plate and a second rear side plate, respectively. The fan assembly 300 is disposed adjacent to the second front side plate and the circuit board 200 is disposed adjacent to the second rear side plate. The first air inlet 141 may be provided at the second rear side plate. The top plate 110, the two first side plates 130, and the two second side plates 140 may be an upper case integral structure to facilitate assembly and disassembly.

In one embodiment, as shown in fig. 2 and 3, the fan assembly 300 may further include a fan housing 330, wherein the fan housing 330 defines a second air duct having a second air inlet 331 and a second air outlet 332, the second air inlet 331 is disposed opposite to the circuit board 200, and the second air outlet 332 is disposed opposite to the first air outlet 111. The second air inlet 331 is an air inlet of the fan assembly 300; the second air outlet 332 is the air outlet of the fan assembly 300.

In this embodiment, the fan housing 330 may define a second air duct, so as to play a role in effectively guiding air, so that hot air flowing through the circuit board 200 may enter from the second air inlet 331, flow along the second air duct, and finally flow from the second air outlet 332 to the first air outlet 111, thereby effectively improving the efficiency of the fan assembly 300 and reducing energy waste.

In one embodiment, the fan assembly 300 may further include a fan housing 330, the impeller 310 being located within the fan housing 330, and the driver 320 being mounted to the fan housing 330. For example, in the case where the driver 320 is a driving motor, the driving body may be fixedly connected to the blower housing 330. In the case of operation of the driver 320, the power take-off shaft drives the impeller 310 in rotation. Under the action of the impeller 310, cold air enters the first air channel from the first air inlet 141 and then flows through the circuit board 200 to exchange heat with the circuit board 200, so that heat generated in the working process of the circuit board 200 is taken away. The hot air flowing through the circuit board 200 enters the second air duct from the second air inlet 331, then flows from the second air outlet 332 to the first air outlet 111, and finally flows out from the first air outlet 111.

In this embodiment, the fan housing 330 may perform an effective protection function to prevent the impeller 310 from being damaged due to foreign objects or impurities entering the impeller 310, thereby extending the service life of the entire fan assembly 300. In addition, the fan housing 330 may also improve operational safety and reduce noise generated when the impeller 310 rotates.

In one embodiment, the surfaces of the top plate 110, the bottom plate 120, the first side plate 130, and the second side plate 140 may all be planar. Where the surface is planar, it is understood that the area of the surface where no features or holes are located is planar. For example: the surface of the top plate 110 being planar means that a region of the surface of the top plate 110 where the first air outlet 111 is not provided is planar.

In this embodiment, the portion of the top plate 110 corresponding to the fan assembly 300 and the portion of the top plate 110 corresponding to the circuit board 200 may be flush and in the same plane; the portion of the bottom plate 120 corresponding to the fan assembly 300 and the portion of the bottom plate 120 corresponding to the circuit board 200 may be flush and in the same plane; the portion of the first side plate 130 corresponding to the fan assembly 300 and the portion of the first side plate 130 corresponding to the circuit board 200 may be flush and in the same plane; the portion of the second side plate 140 corresponding to the fan assembly 300 and the portion of the second side plate 140 corresponding to the circuit board 200 may be flush and located in the same plane, so that the stepped structure formed on the surfaces of the top plate 110, the bottom plate 120, the first side plate 130 and the second side plate 140 may be avoided, and the flatness of the outer shape and the space utilization of the housing 100 may be improved, thereby improving the integrity of the computing device 10.

FIG. 6 illustrates a partial structural schematic diagram of computing device 10 according to an embodiment of the present application; fig. 7 illustrates an exploded view of computing device 10 shown in fig. 6. In one embodiment, as shown in fig. 2, 6 and 7, the circuit board 200 may include a first surface 210 and a second surface 220 disposed opposite to each other, where a plurality of heat generating components 211 are disposed on the first surface 210 in an array arrangement to implement a computing function of the computing device. Illustratively, the areas of the plurality of heat generating components 211 may be equal and/or the device types of the plurality of heat generating components 211 may be the same to facilitate the arrangement of the heat generating components 211 on the circuit board 210. For example, the plurality of heat generating components 211 may be chips.

In one implementation, computing device 10 may also include a heat sink 400. The heat sink 400 is disposed on the first surface 210 and/or the second surface 220. That is, it may be that the first surface 210 of the circuit board 200 is provided with the heat sink 400, and the second surface 220 of the circuit board 200 is not provided with the heat sink 400; or the second surface 220 of the circuit board 200 is provided with a heat sink 400, and the first surface 210 of the circuit board 200 is provided with no heat sink 400; it is also possible that both the first surface 210 and the second surface 220 of the circuit board 200 are provided with a heat sink 400.

Thus, heat generated during operation of the heat generating components 211 on the circuit board 200 can be transferred to the heat sink 400. In the case of operation of the fan assembly 300, external cold air may flow into the first air duct from the first air inlet 141 and then flow through the heat sink 400, thereby taking away heat from the heat sink 400, effectively reducing the temperature of the circuit board 200, and achieving normal operation of the heat generating components 211.

Illustratively, in the case where the number of heat sinks 400 is one, the heat sinks 400 may be disposed on the first surface 210 of the circuit board 200 or may be disposed on the second surface 220 of the circuit board 200. In the case that the number of the heat sinks 400 is plural, the plural heat sinks 400 may be disposed on the first surface 210 of the circuit board 200; alternatively, the plurality of heat sinks 400 are disposed on the second surface 220 of the circuit board 200; it is also possible that a part of the plurality of heat sinks 400 is disposed on the first surface 210 of the circuit board 200, and another part of the plurality of heat sinks 400 is disposed on the second surface 220 of the circuit board 200. In the case where the heat sink 400 is disposed on the first surface 210 of the circuit board 200, the heat sink 400 may be in direct contact with the heat generating component 211, or may be in indirect contact with the heat generating component 211 through a heat conducting material (e.g., silicone grease). The base plate 120 may be provided with a rivet nut post, and the heat sink 400 may be fixedly coupled to the rivet nut post by a fastener such as a bolt, thereby achieving the installation of the heat sink 400.

In one embodiment, referring to fig. 2, 6 and 7, the radiator 400 includes a liquid cooling tube 430 and a plurality of heat dissipation fins 440 arranged at intervals, the extending direction of each heat dissipation fin 440 is the same as the wind direction in the first air duct, and the liquid cooling tube 430 penetrates the plurality of heat dissipation fins 440 along the arrangement direction of the plurality of heat dissipation fins 440. In the description of the present application, the meaning of "plurality" is two or more.

For example, the heat dissipation fins 440 may be perpendicular to the first surface 210 and the second surface 220 of the circuit board 200. A heat dissipation path may be defined between two adjacent heat dissipation fins 440. Since the extending direction of each heat dissipation fin 440 is the same as the wind direction in the first wind channel, the extending direction of the heat dissipation channel is the same as the wind direction in the first wind channel. The liquid cooling pipe 430 is provided therein with a cooling liquid such as water. The heat generated in the working process of the heating element 211 can be conducted to the heat dissipation fins 440, and because the liquid cooling tube 430 penetrates through the plurality of heat dissipation fins 440, the heat dissipation fins 440 can conduct part of the heat to the cooling liquid in the liquid cooling tube 430, so that the heat exchange with the cooling liquid is realized. In the case that the fan assembly 300 operates, external cool air may flow into the first air duct from the first air inlet 141 and then flow through the heat dissipation channel, thereby achieving heat exchange with the heat sink 400, reducing the temperature of the heat sink 400 and the circuit board 200, and achieving normal operation of the heat generating components 211. The heat-exchanged hot air may flow out of the first air outlet 111 under the action of the fan assembly 300.

In this embodiment, since the extending direction of the heat dissipating fin 440 is the same as the wind direction in the first air duct, the cold air can better take away heat when passing through the heat dissipating fin 440, thereby effectively improving the heat dissipating efficiency. In addition, by arranging the liquid cooling pipe 430, the cooling liquid in the liquid cooling pipe 430 has better heat conducting property, so that heat can be absorbed and transferred more quickly, and the heat dissipation efficiency is further improved. By locating both the circuit board 200 and the fan assembly 300 within the duct, the internal structure of the computing device 10 is made more compact, space utilization within the housing 100 is increased, and the external shape of the computing device 10 is made more regular, while the safety of user heating can be increased.

In one embodiment, referring to fig. 2, 6 and 7, the heat sink 400 includes a first heat sink 410 and a second heat sink 420, the first heat sink 410 is disposed on the first surface 210, and the second heat sink 420 is disposed on the second surface 220, wherein, along an arrangement direction of the plurality of heat dissipation fins 440, a size of the second heat sink 420 is larger than a size of the first heat sink 410. Illustratively, two heat sinks 400 are shown in fig. 6 and 7, a first heat sink 410 and a second heat sink 420, respectively.

In this embodiment, by providing the first heat sink 410 and the second heat sink 420, the heat of the first surface 210 of the circuit board 200 can be effectively transferred to the first heat sink 410, the heat of the second surface 220 of the circuit board 200 can be effectively transferred to the second heat sink 420, and the heat of the first heat sink 410 and the second heat sink 420 can be effectively taken away during the process of blowing the air from the first air inlet 141 to the first air outlet 111 of the first air duct, thereby realizing the effective heat dissipation of the circuit board 200. In addition, since the first surface 210 of the circuit board 200 is generally provided with a functional module (such as a sensor) with a larger height, the first heat sink 410 with a smaller size can perform an effective avoiding function by making the size of the second heat sink 420 larger than that of the first heat sink 410, which is beneficial to the overall installation of the computing device 10; meanwhile, the second radiator 420 with larger size has better radiating effect, so that the temperature of the heating element 211 can be effectively reduced, the normal operation of the heating element 211 is ensured, and the service life is prolonged.

In one embodiment, referring to fig. 2, 6 and 7, the heat sink 400 may further include a heat dissipation substrate 450, a plurality of heat dissipation fins 440 are disposed on the heat dissipation substrate 450, and the heat dissipation substrate 450 is connected to the circuit board 200; wherein, along the wind direction in the first air duct, at least part of the first heat dissipation fins 440 have a smaller size than the rest of the first heat dissipation fins 440; the first heat dissipation fins 440 are heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200.

Note that, the "heat dissipation fins 440 corresponding to the connection region between the heat dissipation substrate 450 and the circuit board 200" refers to the heat dissipation fins 440 corresponding to the connection region between the heat dissipation substrate 450 and the circuit board 200 in the wind direction in the first wind channel.

Wherein, the above-mentioned "the size of at least part of the first heat dissipation fins 440 is smaller than the size of the remaining at least part of the heat dissipation fins 440" may include the following four cases: first kind: the size of each first heat radiating fin 440 is smaller than the sizes of all the remaining heat radiating fins 440; second kind: the size of each first heat dissipation fin 440 is smaller than the size of the rest of the heat dissipation fins 440; second kind: the size of part of the first heat radiating fins 440 is smaller than the size of all the remaining heat radiating fins 440; fourth kind: a portion of the first heat radiating fins 440 has a smaller size than the remaining portion of the heat radiating fins 440.

For example, computing device 10 may also include a first fastener, such as a bolt. The first fastener may be connected with the heat dissipation substrate 450 of the second heat sink 420 after passing through the heat dissipation substrate 450 of the first heat sink 410 and the circuit board 200 in sequence, or connected with the second fastener after passing through the heat dissipation substrate 450 of the first heat sink 410, the circuit board 200, and the heat dissipation substrate 450 of the second heat sink 420 in sequence. The second fastener may be a nut.

In this embodiment, by making the size of at least part of the first heat dissipation fins 440 smaller than the size of the rest of the first heat dissipation fins 440 along the wind direction in the first air duct, the first heat dissipation fins 440 can perform an effective avoiding function, so that the connection area between the heat dissipation substrate 450 and the circuit board 200 can be used for arranging fasteners, thereby realizing the assembly of the first heat sink 410, the circuit board 200 and the second heat sink 420.

In one embodiment, the second heat sink 420 may be coupled to the housing 100 by fasteners. In this way, the second heat sink 420 may be used to support the weight of the circuit board 200 and the first heat sink 410. Since the second heat sink 420 is larger in size than the first heat sink 410, the second heat sink 420 has a larger support area, thereby helping to distribute the weight of the circuit board 200 and the first heat sink 410, achieve uniform distribution of load, reduce the risk of single point concentrations, and help to increase the load carrying and anti-vibration capabilities of the overall computing device 10. Moreover, since the second heat sink 420 is typically made of strong metal or other strong material, use as a support structure can provide better structural stability. In addition, the second heat sink 420 serves as a supporting structure to effectively reduce stress when the circuit board 200 is subjected to mechanical shock or vibration, and to relieve stress load thereof, thereby extending the service life of the circuit board 200.

In one embodiment, the top of the first air inlet 141 is flush with the top of the heat sink 400, and the bottom of the first air inlet 141 is flush with the bottom of the heat sink 400. For example, the top of the first air inlet 141 may be flush with the top of the first heat sink 410, and the bottom of the first air inlet 141 may be flush with the bottom of the second heat sink 420. In this way, the air flowing from the first air inlet 141 to the first air outlet 111 can flow through the radiator 220, so as to effectively dissipate heat of the circuit board 200, and reduce the risk that the air flows into the gap between the radiator 220 and the housing 100, and avoid air leakage and air channeling.

What needs to be stated is: in the above-mentioned scheme, the flush is relative to the case of having a significant height drop, for example, the drop of two faces is more than 2 cm. Flush here can be understood as: the top of the first air inlet 141 and the top of the radiator 400 are in a plane or have a certain deviation distance, but the visual effect is nearly flush, and the bottom of the first air inlet 141 and the bottom of the radiator 400 are in a plane or have a certain deviation distance, but the visual effect is nearly flush; it will be appreciated by those skilled in the art that the first air inlet 141 and the heat sink 400 in the above-described embodiments may be not strictly flush due to screws, a protective layer structure, a reinforcing structure, or paint, but are all within the scope of protection defined by "flush" in the present application as long as they are substantially flush.

In an alternative embodiment, the distance between two adjacent heat dissipating fins 440 may be 3mm to 6mm (inclusive). Illustratively, the distance between adjacent two heat dissipation fins 440 may be 3mm or 6mm, but is not limited thereto. Specifically, for example, when the distance between the adjacent two heat dissipation fins 440 is less than 3mm, the distance between the adjacent two heat dissipation fins 440 is too small, so that the density of the heat dissipation fins 440 is too large, the heat dissipation space between the adjacent two heat dissipation fins 440 is too small, the wind resistance is too large, and the dust accumulation is serious; when the distance between the adjacent two heat dissipation fins 440 is greater than 6mm, the distance between the adjacent two heat dissipation fins 440 is excessively large, reducing the total surface area of the heat dissipation fins 440, affecting the heat dissipation effect.

In this embodiment, by making the distance between two adjacent heat dissipating fins 440 between 3mm and 6mm, the wind resistance can be reduced, the ventilation amount can be increased, the dust accumulation can be improved, and the heat dissipating area of the heat dissipating fins 440 is relatively large, so that the heat generated in the operation process of the plurality of heat generating components 211 can be effectively dissipated.

In one embodiment, as shown in fig. 3, 6 and 7, the computing device 10 may further include a control module 500, where the control module 500 is electrically connected to both the fan assembly 300 and the circuit board 200, and the control module 500 is disposed at one end of the fan assembly 300 in an axial direction. For example, when installed, the control module 500 may be first attached to the fan assembly 300 by fasteners such as screws, then the heat sink 400 may be attached to the base plate 120 by fasteners such as screws, and the fan assembly 300 may be attached to the base plate 120 by fasteners such as screws. Finally the upper shell unitary structure is mounted by fasteners such as screws.

In this embodiment, by providing the control module 500, the control module 500 can control the circuit board 200 and the fan assembly 300 to work, so as to ensure the heat dissipation effect and improve the reliability and long-term stability of the computing device 10 while realizing the computing function. In addition, by arranging the control module 500 at one axial end of the fan assembly 300, the arrangement of the control module 500 is more reasonable, and the distance between the control module 500 and the fan assembly 300 and the circuit board 200 is closer, so as to control the wiring between the control module 500 and the fan assembly 300 and between the control module 500 and the circuit board 200.

In one embodiment, the driver 320 of the fan assembly 300 is electrically connected to the control module 500. Thus, the control module 500 may control the operation of the driver 320, so that the driver 320 drives the impeller 310 to rotate, and wind may flow in a direction from the first air inlet 141 to the first air outlet 111. Illustratively, the control module 500 may include a fan interface coupled to the fan assembly 300 to enable the control board to control the operation of the fan assembly 300. For example: the fan interface may be coupled to a driver 320 of the fan assembly 300. The circuit board 200 may be provided with a first signal socket, and the control module 500 may include a second signal socket, and the first signal socket is connected with the second signal socket, so that the control module 500 can control the operation of the circuit board 200.

In one embodiment, as shown in fig. 3 and 4, the control module 500 may include a power connector 510, a reset controller 520, and a switch controller 530. Wherein, the power connector 510 corresponds to the power interface 10a provided on the housing 100, the reset controller 520 corresponds to the reset interface 10b provided on the housing 100, and the switch controller 530 corresponds to the switch interface 10c provided on the housing 100. So configured, a user may control the reset controller 520 through the reset interface 10b on the housing 100, so as to control the reset of the computing device 10, and ensure the normal operation of the computing device 10. Similarly, a user may manipulate the switch controller 530 through the switch interface 10c on the housing 100, thereby enabling the computing device 10 to be powered on when the computing device 10 is powered off, and enabling the computing device 10 to be powered off when the computing device 10 is powered on. In addition, the user can also connect the power connector 510 through the power interface 10a, so that the transmission of electric power can be realized. Illustratively, the power connector 510 may be a Type-C interface, but is not limited thereto.

In one embodiment, the power interface 10a, the reset interface 10b, and the switch interface 10c may be provided at a top plate of the housing 100. In this way, a user may find and perform corresponding operations directly on the top panel, for example, may more conveniently plug a power cord through the power interface 10a, perform a reset operation through the reset interface 10b, and control the switching of the computing device 10 through the switch interface 10c, saving time and effort. Furthermore, the power interface 10a, the reset interface 10b and the switch interface 10c are disposed on the top plate of the housing 100, so that the risk of misoperation can be reduced, the user can more clearly observe the positions of the power interface 10a, the reset interface 10b and the switch interface 10c, and the wrong insertion of fingers or other objects into the wrong positions can be avoided, thereby improving the safety and reliability of the computing device 10. In addition, the centralized placement of the power interface 10a, reset interface 10b, and switch interface 10c on the top plate helps to enhance the aesthetic appearance of the computing device 10.

In one embodiment, the housing 100 may further include a mounting location in which the display assembly 170 is mounted.

Illustratively, the display component 170 can be utilized to cycle through information such as internet protocol (Internet Protocol, IP), inlet air temperature, outlet air temperature, calculation power, power consumption, and the like. Wherein, the pressing plate 160 may be elongated.

In one example, referring to fig. 4 and 5, the mounting location may be a through mounting hole 150, and the display assembly 170 is exposed through the mounting hole 150 so that the user can view the image information or the text information displayed on the display assembly 170 from the outside. For example, the mounting hole 150 may penetrate the top plate of the housing 100 in the wall thickness direction of the housing 100. At least a portion of the display assembly 170 is positioned within the first air chute.

In another example, the mounting location may also be a mounting slot (not shown) within which the display assembly 170 is located. At this time, the user can also observe the image information or the text information displayed on the display unit 170 from the outside. For example, the mounting groove may be recessed inward from a portion of the housing 100. The display assembly 170 may be located outside the first air duct.

In one embodiment, the computing device 10 may further include a platen 160, the platen 160 being fixedly connected to the housing 100, the display assembly 170 being pressed between the platen 160 and an inner wall of the housing 100. For example, the platen 160 may be formed in a racetrack-shaped structure. Computing device 10 may include a third fastener. When installed, a third fastener may be fixedly coupled to the top plate of the housing 100 through the pressure plate 160. Further, there may be two third fasteners, and the two third fasteners may be respectively located at both ends of the pressing plate 160. In this embodiment, through the above arrangement, the structural stability and reliability of the display assembly 170 can be ensured while ensuring that the user can observe the information displayed by the display assembly 170 from the outside.

In this embodiment, through the above arrangement, the structure of the display assembly 170 is made more stable and reliable while ensuring that the user can observe the information displayed by the display assembly 170 from the outside.

Other configurations of the computing device 10 of the above-described embodiments may be employed in various ways that will be known to those of ordinary skill in the art now and in the future, and will not be described in detail herein.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the present application. The components and arrangements of specific examples are described above in order to simplify the disclosure of this application. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the present application, and these should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (23)

1. A computing device, comprising:

the shell is internally provided with a first air channel with a first air inlet and a first air outlet;

the circuit board is arranged in the first air duct;

the fan assembly is arranged in the first air duct and along the air direction in the first air duct, the circuit board is located in the upper air direction, the fan assembly is located in the lower air direction, the fan assembly comprises a drivable impeller, and the circuit board is located at one side of the impeller in the radial direction.

2. The computing device of claim 1, wherein the first air inlet is disposed at any side plate of the housing and the first air outlet is disposed at a top plate of the housing.

3. The computing device of claim 2, wherein the housing comprises a top plate and a bottom plate disposed opposite each other, two first side plates disposed opposite each other, and two second side plates disposed opposite each other, the first side plates being located in an axial direction of the fan assembly, wherein the first air inlet is disposed in one of the two second side plates, and the first air outlet is disposed in the top plate.

4. The computing device of claim 1, wherein the fan assembly further comprises a driver drivingly connected to one end of the impeller in an axial direction.

5. The computing device of claim 1, wherein the fan assembly comprises a fan housing defining a second air duct therein having a second air inlet disposed opposite the circuit board and a second air outlet disposed opposite the first air outlet.

6. The computing device of claim 4, wherein the fan assembly comprises a fan housing, the impeller being located within the fan housing, the drive being mounted to the fan housing.

7. The computing device of claim 1, further comprising:

the control module is electrically connected with the fan assembly and the circuit board, and is arranged at one axial end of the fan assembly.

8. The computing device of claim 7, wherein a driver of the fan assembly is electrically connected to the control module.

9. The computing device of claim 7, wherein the control module comprises a power connector, a reset controller, and a switch controller; the power connector corresponds to a power interface arranged on the shell, the reset controller corresponds to a reset interface arranged on the shell, and the switch controller corresponds to a switch interface arranged on the shell.

10. The computing device of claim 9, wherein the power interface, the reset interface, and the switch interface are disposed on a top plate of the housing.

11. The computing device of claim 1, wherein the circuit board comprises a first surface and a second surface disposed opposite one another, the first surface having a plurality of heat-generating components arranged in an array disposed thereon.

12. The computing device of claim 11, wherein the plurality of heat generating components are equal in area and/or the plurality of heat generating components are the same in device type.

13. The computing device of claim 11, further comprising a heat sink disposed at the first surface and/or the second surface.

14. The computing device of claim 13, wherein the heat sink comprises a liquid cooling tube and a plurality of heat dissipation fins arranged at intervals, an extension direction of each heat dissipation fin is the same as a wind direction in the first air duct, and the liquid cooling tube penetrates the plurality of heat dissipation fins along an arrangement direction of the plurality of heat dissipation fins.

15. The computing device of claim 14, wherein the heat sink comprises a first heat sink and a second heat sink, the first heat sink disposed on a first surface and the second heat sink disposed on a second surface, wherein a size of the second heat sink is greater than a size of the first heat sink along an arrangement direction of the plurality of heat sink fins.

16. The computing device of claim 15, wherein the heat sink further comprises a heat sink substrate, the plurality of heat sink fins being disposed on the heat sink substrate, the heat sink substrate being connected to the circuit board.

17. The computing device of claim 16, wherein at least a portion of the first heat fins have a smaller size than a remaining at least a portion of the heat fins along a direction of the wind within the first wind tunnel; the first radiating fins are radiating fins corresponding to the connecting areas of the radiating base plate and the circuit board.

18. The computing device of claim 15, wherein the second heat sink is connected to the housing by a fastener.

19. The computing device of claim 18, wherein the second heat sink is to hold a weight of the circuit board and the first heat sink.

20. The computing device of claim 13, wherein a top of the first air inlet is flush with a top of the heat sink and a bottom of the first air inlet is flush with a bottom of the heat sink.

21. The computing device of claim 14, wherein a distance between two adjacent heat dissipating fins is 3mm to 6mm.

22. The computing device of claim 1, wherein the housing comprises a mounting location having a display assembly mounted therein.

23. The computing device of any of claims 1-22, wherein the first air outlet is in communication with a heat recovery system.