CN117571824A - Ultrasonic detection mechanism and method in small-caliber pipeline - Google Patents
Ultrasonic detection mechanism and method in small-caliber pipeline Download PDFInfo
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- CN117571824A CN117571824A CN202311513866.8A CN202311513866A CN117571824A CN 117571824 A CN117571824 A CN 117571824A CN 202311513866 A CN202311513866 A CN 202311513866A CN 117571824 A CN117571824 A CN 117571824A
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- 238000001514 detection method Methods 0.000 title claims abstract description 52
- 230000007246 mechanism Effects 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 73
- 239000000523 sample Substances 0.000 claims abstract description 20
- 230000007547 defect Effects 0.000 claims abstract description 18
- 238000007689 inspection Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 238000002604 ultrasonography Methods 0.000 claims description 4
- 238000003491 array Methods 0.000 abstract description 6
- 230000005284 excitation Effects 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/043—Analysing solids in the interior, e.g. by shear waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
Abstract
The invention discloses an ultrasonic detection mechanism and method in a small-caliber pipeline, comprising a probe main body, wherein a wafer group is arranged on the probe main body, and the wafer group comprises: the first array comprises a plurality of wafers uniformly distributed along the circumferential direction of the pipeline, and ultrasonic waves excited by the wafers of the first array are perpendicular to the inner wall of the pipeline; the second array comprises a plurality of groups of wafers uniformly distributed along the circumferential direction of the pipeline, each group of wafers comprises a plurality of wafers uniformly distributed along the axial direction of the pipeline, and each group of wafers of the second array is subjected to sector scanning detection at-30 degrees. This application distributes through setting up array formula wafer to through the setting of the distribution direction of the ultrasonic wave of first array, second array excitation, two arrays are mainly surveyed circumference, axis direction's defect respectively, make detection mechanism can effectively cover the whole region of pipeline, and the detection of two arrays has certain overlap nature simultaneously, effectively promotes under the mutually supporting and surveys the precision.
Description
Technical Field
The invention relates to the technical field of pipeline detection, in particular to an ultrasonic detection mechanism and method in a small-caliber pipeline.
Background
After the thermal power generating unit in service runs for a period of time, a new pipeline needs to be replaced aiming at the corrosion-thinned metal pipeline. Before a new pipeline is assembled and replaced, the pipeline needs to be detected, so that the defect-free inside the pipeline is ensured. Currently, rotary ultrasound and pulsed eddy current detection methods are widely used.
Pulsed eddy current detection is a non-destructive detection method, which utilizes a high-frequency alternating current magnetic field to induce surface eddy current of a detected material, thereby finding defects in a target area. The pulsed eddy current probe consists of a coil and a magnetic core, and when an alternating current power supply is added into the coil, the magnetic core gathers the magnetic field of the coil to generate high-density magnetic flux. During operation of the pulsed eddy current probe, the magnetic field produces a rapid change that causes eddy currents to pass through the eddy current sensor and then feed defects back into the inspection apparatus. By the pulse eddy current detection principle, various types of defects such as cracks, holes, bubbles, impurities and the like can be detected, and meanwhile, the conductivity and the magnetism of metal can be detected.
Rotational ultrasonic testing is a non-destructive testing method that uses a rotational ultrasonic probe to test a material. The method is generally used for identifying internal defects and foreign matters of metal materials such as steel, aluminum alloy and the like. In the detection process, the rotary ultrasonic probe rotates at a certain speed, simultaneously transmits ultrasonic waves into the material, receives the reflected ultrasonic waves, and then analyzes the signals to identify defects and foreign matters.
The detection effect of the method for detecting the thin-wall pipeline is good whether the method is rotary ultrasonic detection or pulsed eddy current detection, but the detection effect of the thick-wall pipeline is poor, and the detection progress of the two methods can be seriously influenced along with the increase of the thickness of the pipeline wall. However, most of the pipe diameters and thicknesses of the metal pipes in the thermal power generating unit exceed the technical range of rotary ultrasonic and eddy current detection, so that a new detection process method needs to be developed to detect the internal defects of the thick-wall metal pipes.
Disclosure of Invention
The technical problems solved by the invention are as follows: most pipe diameters and thicknesses of metal pipes in the thermal power generating unit exceed the technical range of rotary ultrasonic and eddy current detection, so that a new detection process method needs to be developed to detect internal defects of thick-wall metal pipes.
The aim of the invention can be achieved by the following technical scheme:
the utility model provides an ultrasonic detection mechanism in small-bore pipeline, includes the probe main part, be provided with the wafer group on the probe main part, the wafer group includes:
the first array comprises a plurality of wafers uniformly distributed along the circumferential direction of the pipeline, and ultrasonic waves excited by the wafers of the first array are perpendicular to the inner wall of the pipeline;
the second array comprises a plurality of groups of wafers which are uniformly distributed along the circumferential direction of the pipeline, each group of wafers comprises a plurality of wafers which are uniformly distributed along the axial direction of the pipeline, and the ultrasonic wave propagation mode excited by the wafers of the second array is as follows: each group of wafers is subjected to sector scanning detection of-30 DEG to 30 deg.
In one aspect of the invention: the wafer group is connected to the probe body through a flexible wedge block.
In one aspect of the invention: the number of wafers in the first array is not less than 16.
In one aspect of the invention: the center-to-center spacing of the wafers in the first array is pi R/N, where R is the inner diameter of the tube and N is the number of wafers.
In one aspect of the invention: the wafers in the second array are arranged along the circumference of the pipeline in at least five groups.
In one aspect of the invention: the number of wafers in the same group is at least 8 along the axis direction of the pipeline.
In one aspect of the invention: the center-to-center spacing between adjacent wafers in the same group is not less than 0.3mm.
The method based on the ultrasonic detection mechanism in the small-caliber pipeline comprises the following steps:
selecting a corresponding detection mechanism according to the thickness and the inner diameter of the pipeline to be detected;
placing the detection mechanism inside the pipeline, and setting an initial point;
starting equipment, wherein the detection mechanism moves at a constant speed in the pipeline, and collecting data information in the pipeline through the wafer group;
and forming a detection image according to the data information, and judging whether a defect exists in the pipeline according to the image.
According to the invention, the ultrasonic detection mechanism and method in the small-caliber pipeline have at least one of the following technical effects:
this application distributes through setting up array formula wafer to through the setting of the distribution direction of the ultrasonic wave of first array, second array excitation, two arrays are mainly surveyed circumference, axis direction's defect respectively, make detection mechanism can effectively cover the whole region of pipeline, and the detection of two arrays has certain overlap nature simultaneously, effectively promotes under the mutually supporting and surveys the precision.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of the structure of the present invention disposed inside a pipe;
FIG. 2 is a schematic view of the structure of the probe body with wafer assembly of the present invention;
FIG. 3 is a schematic view of the first sequence of wafer unwind arrangements of the present invention;
FIG. 4 is a schematic diagram of the first sequence of ultrasound propagation modes of the present invention;
FIG. 5 is a schematic diagram of the structure of a second sequence wafer unwind arrangement of the present invention;
fig. 6 is a schematic structural diagram of a second sequence of ultrasound propagation modes of the present invention.
In the figure: 1. a probe body; 2. a wafer group; 3. a first array; 4. a second array; 5. a pipeline.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1-6, the invention relates to an ultrasonic detection mechanism in a small-caliber metal pipeline 5, which comprises a probe main body 1, wherein a wafer group 2 is arranged on the probe main body 1, the wafer group 2 comprises a first array 3 and a second array 4 which are respectively formed by arranging a plurality of wafers in a certain mode, and the first array 3 and the second array 4 can be arranged at intervals. The wafer group 2 is connected to the probe body 1 by a flexible wedge. The flexible wedge is used for coupling and beam deflection. The surface of the flexible wedge block and the surface of the workpiece are wetted by the oil-based coupling agent, so that contact is ensured.
Referring to fig. 3-4, in one embodiment of the present invention, the first array 3 may include a plurality of wafers uniformly distributed along the circumference of the pipe 5, that is, a plurality of wafers uniformly distributed around the probe body 1 (the pipe 5 is wound), and the plurality of wafers form an annular array parallel to the inner wall of the pipe 5. The number of the wafers is not less than 16, the center-to-center spacing of the wafers is pi R/N, wherein R is the inner diameter (inner wall diameter) of the pipeline 5, and N is the number of the wafers. In this embodiment, the ultrasonic waves excited by the wafers of the first array 3 are perpendicular to the inner wall of the pipeline 5, so as to perform the circumferential scanning detection of the pipeline 5, and mainly detect the axial defects (defects parallel to the horizontal direction of the pipeline 5) of the pipeline 5.
Referring to fig. 5-6, in one embodiment of the present invention, the second array 4 includes a plurality of groups of wafers uniformly distributed along the circumference of the pipe 5, and in the second array 4, at least five groups of wafers uniformly distributed along the circumference of the pipe 5 are provided. The center-to-center spacing between adjacent wafers in the circumferential direction is pi R/N, where R is the inner diameter (inner wall diameter) of the tube 5 and N is the number of wafers. The number of wafers uniformly distributed along the axial direction of the pipe 5 is a group, the number of wafers in a group is at least 8, the center-to-center spacing between adjacent wafers in the same group (i.e., the circumferential direction of the pipe 5) is not less than 0.3mm, and the specific number of wafers and the center-to-center spacing between wafers increase according to the increase in the thickness and length of the pipe. The ultrasonic wave propagation mode of the wafer excitation of the second array 4 is as follows: the wafers are grouped by the axial direction of the pipeline 5, and each group of wafers is subjected to sector scanning detection of-30 degrees to 30 degrees. The ultrasonic beams excited by the second array 4 are mainly used for detecting circumferential defects of the pipeline 5.
The working principle of the invention is as follows:
based on the detection method of the ultrasonic detection mechanism in the small-caliber pipeline 5, firstly, selecting a corresponding detection mechanism, such as the diameter size of a probe body, the number of wafer groups 2 of the first array 3 and the second array 4, and the like, according to the thickness and the inner diameter of the metal pipeline 5 to be detected; placing a detection mechanism inside the pipeline 5, and setting and marking an initial point; starting equipment, wherein a detection mechanism moves in the pipeline 5 at a constant speed, and the detection mechanism moves from the end part of the pipeline 5 to the other end to finish the detection of the whole pipeline 5 material, and in the process, the data information in the pipeline 5 is collected through the wafer group 2; then, a detection image is formed based on the data information, and it is judged whether or not there is a defect in the pipe 5 based on the image. When the detection image is formed, image information with time/length as a transverse axis can be formed, and the set initial point is used as a reference point or an origin, so that the defect position of the pipeline 5 can be positioned according to the length data or the time and moving speed data when the image is analyzed, and the recheck can be conveniently carried out or the reference can be provided for making countermeasures. The method is mainly used for detecting the raw materials of the pipeline 5, and can not detect the welded joint and the abnormal structure of the connecting pipeline 5. Mainly for detecting surface and internal defects of the pipe 5. This application distributes through setting up array formula wafer to through the setting of the distribution direction of the ultrasonic wave of first array 3, the excitation of second array 4, two arrays are mainly surveyed circumference, axis direction's defect respectively, make detection mechanism can effectively cover pipeline 5's whole region, and the detection of two arrays has certain overlap simultaneously, effectively promotes under the mutually supporting and surveys the precision.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All such equivalent changes and modifications as come within the scope of the following claims are intended to be embraced therein.
Claims (8)
1. The utility model provides an ultrasonic detection mechanism in small-bore pipeline (5), includes probe main part (1), its characterized in that is provided with wafer group (2) on probe main part (1), wafer group (2) include:
the ultrasonic probe comprises a first array (3), wherein the first array (3) comprises a plurality of wafers uniformly distributed along the circumferential direction of a pipeline (5), and ultrasonic waves excited by the wafers of the first array (3) are perpendicular to the inner wall of the pipeline (5);
the second array (4), the second array (4) includes the wafer that multiunit along pipeline (5) circumference evenly laid, and every wafer of group includes a plurality of wafers that evenly lay along pipeline (5) axis direction, and the ultrasonic wave propagation mode that the wafer of second array (4) was stimulated is: each group of wafers is subjected to sector scanning detection of-30 DEG to 30 deg.
2. An in-line ultrasonic testing mechanism for small diameter pipes (5) according to claim 1, wherein the wafer assembly (2) is attached to the probe body (1) by flexible wedge wrapping.
3. An in-line ultrasonic inspection mechanism for small diameter pipes (5) according to claim 1 wherein the number of wafers in the first array (3) is not less than 16.
4. A small diameter pipeline (5) internal ultrasound inspection mechanism as claimed in claim 3 wherein the wafer center-to-center spacing in the first array (3) is pi R/N, where R is the pipeline (5) internal diameter and N is the number of wafers.
5. An in-line ultrasonic testing device according to claim 1, wherein the second array (4) comprises at least five sets of wafers arranged circumferentially around the pipe (5).
6. An in-line ultrasonic inspection mechanism for small diameter pipelines (5) according to claim 5, characterized in that the number of wafers in the same group is at least 8 along the axis of the pipeline (5).
7. An in-line ultrasonic inspection mechanism for small-bore pipes (5) according to claim 6, characterized in that the center-to-center spacing between adjacent wafers in the same group is not less than 0.3mm.
8. A method of an ultrasonic testing mechanism in a small bore pipeline (5) according to any one of claims 1 to 7, comprising the steps of:
selecting a corresponding detection mechanism according to the thickness and the inner diameter of the pipeline (5) to be detected;
placing the detection mechanism inside the pipeline (5) and setting an initial point;
starting equipment, wherein a detection mechanism moves in a pipeline (5) at a constant speed, and collecting data information in the pipeline (5) through a wafer group (2);
a detection image is formed based on the data information, and it is judged whether or not a defect exists in the pipe (5) based on the image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311513866.8A CN117571824A (en) | 2023-11-14 | 2023-11-14 | Ultrasonic detection mechanism and method in small-caliber pipeline |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311513866.8A CN117571824A (en) | 2023-11-14 | 2023-11-14 | Ultrasonic detection mechanism and method in small-caliber pipeline |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117571824A true CN117571824A (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311513866.8A Pending CN117571824A (en) | 2023-11-14 | 2023-11-14 | Ultrasonic detection mechanism and method in small-caliber pipeline |
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| Country | Link |
|---|---|
| CN (1) | CN117571824A (en) |
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2023
- 2023-11-14 CN CN202311513866.8A patent/CN117571824A/en active Pending
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