CN1175613A - Ordinary temp. setting heat-resistant adhesive - Google Patents
Ordinary temp. setting heat-resistant adhesive Download PDFInfo
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- CN1175613A CN1175613A CN 96118332 CN96118332A CN1175613A CN 1175613 A CN1175613 A CN 1175613A CN 96118332 CN96118332 CN 96118332 CN 96118332 A CN96118332 A CN 96118332A CN 1175613 A CN1175613 A CN 1175613A
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- resistant adhesive
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- zinc oxide
- aliphatic epoxy
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Abstract
A temp. -resistant adhesive solidifying at ordinary temp is prepared from aliphatic epoxy resin, polyurethane ,baypren, acrylonitrile butadiene (liquid), boronphenolic resin, polyisocyanate, magentsium oxide, zinc oxide, antiagenig agent and alcohol as catalyst, and features high toughness, high-temp performance and adhesion.
Description
Ambient cure heat-resistant adhesive of the present invention belongs to a kind of normal temperature cured type tackiness agent.
Traditional transport tape joint connects normal riveted joint, the hot vulcanization process of adopting and does not only time-consuming consumption but also big and to connect effect bad like this, and product is not durable.Patent documentation CN1063120A has proposed a kind of cold glue normal temperature adhesive sheet, but this sheet is thermo-labile, and intensity is not high yet.
The ambient cure heat-resistant adhesive that the purpose of this invention is to provide a kind of high-toughness high-strength, this glue can be successfully applied to the particularly heat-resisting joint connection of pierce tap of various transport tapes, also can be applied to the stickup of heat insulation and wear resistance ceramics.
To achieve the above object of the invention, the glue system that the present invention proposes is by aliphatic epoxy resin, urethane, chloroprene rubber, paracril (liquid), boron bakelite resin, compositions such as polyisocyanates, magnesium oxide, zinc oxide, anti-aging agent and non-water catalyzer, mixed formulated with suitable composition by weight.Wherein aliphatic epoxy resin, urethane resin shared composition by weight in prescription is respectively 45-90 part and 20-40 part; Chloroprene rubber and paracril (liquid) shared composition by weight in prescription is respectively 30-42 part and 40-50 part; Boron bakelite resin and polyisocyanates shared composition by weight in prescription is respectively 20-35 part and 10-18 part; Magnesium oxide and zinc oxide shared composition by weight in prescription is respectively 15-20 part and 8-10 part; Anti-aging agent and non-water catalyzer ethanol shared composition by weight in prescription are respectively 1-3 part and 2 parts.
What play heat-resisting function in this adhesive formulation is boron bakelite resin and aliphatic epoxy resin; The composition that plays toughening effect is urethane chloroprene rubber and paracril; Magnesium oxide, zinc oxide and polyisocyanates play sulfuration and solidification respectively.
Adopt the boron bakelite resin heat decomposition temperature to reach more than 500 ℃ among the present invention, thermotolerance is fabulous, and contains a large amount of methylols (* 3) group in the molecule, to fine by sticking material sticking power; The aliphatic epoxy resin working viscosity is low, and contains a large amount of epoxy an aromatic plant metioned in ancient books group in the molecule, to good by sticking material sticking power; The polyurethane molecular chain is pliable and tough and good to being glued material sticking power; Chloroprene rubber and paracril have toughening effect, and after system was solidified, they formed rubber disperse phase not of uniform size, play toughness reinforcing enhancement; Magnesium oxide and zinc oxide play sulfuration to rubbery system.
When preparing glue of the present invention, at first with chloroprene rubber, paracril (liquid), magnesium oxide, zinc oxide, boron phenolic aldehyde, anti-aging agent and catalyzer on mixing roll mixing 20 times, add urethane and aliphatic epoxy resin afterwards successively and carry out three rollers and grind 20 times, glue.Before the use, add polyisocyanates.
This glue has good toughness, characteristics such as good heat resistance and bonding strength height, and can ambient cure, easily enforcement.Can be widely used in the particularly heat-resisting joint connection of pierce tap of various transport tapes, can also be applied to the outer thermal insulation ceramics sheet of spacecraft and paste.
Embodiment 1
45 parts of aliphatic epoxy resins
20 parts of urethane
30 parts of chloroprene rubbers
40 parts of paracrils (liquid)
20 parts of boron bakelite resins
10 parts of polyisocyanates
15 parts in magnesium oxide
8 parts in zinc oxide
1 part in anti-aging agent
2 parts of non-water catalyzer ethanol
Embodiment 2:
Aliphatic epoxy resin: 90 parts
Urethane: 40 parts
42 parts of chloroprene rubbers
50 parts of paracrils
35 parts of boron bakelite resins
18 parts of polyisocyanates
20 parts in magnesium oxide
10 parts in zinc oxide
3 parts in anti-aging agent
2 parts of non-water catalyzer ethanol
Embodiment 3: 65 parts of polyurethane of aliphatic epoxy resin: 2 parts of glue for above-mentioned three example prescriptions of 2 parts of non-water catalyst ethanol of 9 parts of age resistor of 17 parts of zinc oxide of 14 parts of magnesia of 27 parts of polyisocyanates of 45 parts of boron bakelite resins of 30 parts of 36 parts of acrylonitrile-butadiene rubbers of neoprene (liquid) carry out properties and detect, and it the results are shown in Table shown in 1.
Table 1: the performance of three routine Example formulations
Test event | Testing method | Test result | ||
Example 1 | Example 2 | Example 3 | ||
Outward appearance | GB1721-79 | The even glue of inclusion-free | With a left side | With a left side |
Viscosity (mpa.s) | DIN53015 | 45000 | 56000 | 48000 |
Adhesive shear strength (Mpa) | GB7124-86 | 13.4 | 15.6 | 14.9 |
150 ℃ of adhesive shear strengths (Mpa) | GB7124-86 | 9.4 | 10.5 | 11.2 |
Shock strength (kj/m 2) | 1S0/R179 | 56.7 | 72.1 | 65.3 |
100 ℃/30min water regain (%) | 1S0/R117 | 0.1 | 0.15 | 0.13 |
Claims (1)
1, a kind of ambient cure heat-resistant adhesive, it is characterized in that it is a raw material with aliphatic epoxy resin, urethane, chloroprene rubber, paracril (liquid), boron bakelite resin, multi isohydrocyanic ether, magnesium oxide, zinc oxide, anti-aging agent and non-water catalyzer ethanol, successively by 45-90: 20-40: 30-42: 40-50: 20-35: 10-18: 15-20: 8-10: 1-3: 2 composition by weight compatibilities are mixed to form.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 96118332 CN1175613A (en) | 1996-09-05 | 1996-09-05 | Ordinary temp. setting heat-resistant adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 96118332 CN1175613A (en) | 1996-09-05 | 1996-09-05 | Ordinary temp. setting heat-resistant adhesive |
Publications (1)
Publication Number | Publication Date |
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CN1175613A true CN1175613A (en) | 1998-03-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 96118332 Pending CN1175613A (en) | 1996-09-05 | 1996-09-05 | Ordinary temp. setting heat-resistant adhesive |
Country Status (1)
Country | Link |
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CN (1) | CN1175613A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101497773B (en) * | 2009-01-24 | 2012-01-11 | 黑龙江省科学院石油化学研究院 | Undercoat adhesive for bonding hot vulcanization and preparation thereof |
CN101679579B (en) * | 2007-06-20 | 2012-05-30 | 陶氏环球技术公司 | Crash durable epoxy adhesives with very low sensitivity to temperature variations |
CN101528799B (en) * | 2006-10-24 | 2013-06-05 | Sika技术股份公司 | Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
CN103173135A (en) * | 2013-02-26 | 2013-06-26 | 安徽明珠颜料科技有限公司 | High temperature resistant epoxy resin adhesive |
CN103254862A (en) * | 2013-05-17 | 2013-08-21 | 黑龙江省科学院石油化学研究院 | Sandwich adhesive for high-strength aramid fibre paper honeycomb and preparation method thereby |
CN104962040A (en) * | 2015-07-13 | 2015-10-07 | 江苏中鹏新材料股份有限公司 | Method for improving glass transition temperature of epoxy resin compounds |
CN108485555A (en) * | 2018-04-17 | 2018-09-04 | 武汉理工大学 | A kind of high temperature resistance phenolic aldehyde carrier adhesive and preparation method thereof |
CN108546533A (en) * | 2018-03-28 | 2018-09-18 | 江苏瑞和磨料磨具有限公司 | Adhesive and preparation method thereof for coated abrasive tool |
CN113403017A (en) * | 2020-09-30 | 2021-09-17 | 丁建利 | Adhesive for bonding metal and plastic |
CN114246396A (en) * | 2021-12-29 | 2022-03-29 | 广州大草原鞋业有限公司 | Molding process of finished shoes |
-
1996
- 1996-09-05 CN CN 96118332 patent/CN1175613A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101528799B (en) * | 2006-10-24 | 2013-06-05 | Sika技术股份公司 | Heat-curable epoxy resin composition comprising a blocked polyurethane prepolymer |
CN101679579B (en) * | 2007-06-20 | 2012-05-30 | 陶氏环球技术公司 | Crash durable epoxy adhesives with very low sensitivity to temperature variations |
CN101497773B (en) * | 2009-01-24 | 2012-01-11 | 黑龙江省科学院石油化学研究院 | Undercoat adhesive for bonding hot vulcanization and preparation thereof |
CN103173135A (en) * | 2013-02-26 | 2013-06-26 | 安徽明珠颜料科技有限公司 | High temperature resistant epoxy resin adhesive |
CN103254862A (en) * | 2013-05-17 | 2013-08-21 | 黑龙江省科学院石油化学研究院 | Sandwich adhesive for high-strength aramid fibre paper honeycomb and preparation method thereby |
CN104962040A (en) * | 2015-07-13 | 2015-10-07 | 江苏中鹏新材料股份有限公司 | Method for improving glass transition temperature of epoxy resin compounds |
CN108546533A (en) * | 2018-03-28 | 2018-09-18 | 江苏瑞和磨料磨具有限公司 | Adhesive and preparation method thereof for coated abrasive tool |
CN108485555A (en) * | 2018-04-17 | 2018-09-04 | 武汉理工大学 | A kind of high temperature resistance phenolic aldehyde carrier adhesive and preparation method thereof |
CN113403017A (en) * | 2020-09-30 | 2021-09-17 | 丁建利 | Adhesive for bonding metal and plastic |
CN114246396A (en) * | 2021-12-29 | 2022-03-29 | 广州大草原鞋业有限公司 | Molding process of finished shoes |
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