CN103173135A - High temperature resistant epoxy resin adhesive - Google Patents
High temperature resistant epoxy resin adhesive Download PDFInfo
- Publication number
- CN103173135A CN103173135A CN201310060003XA CN201310060003A CN103173135A CN 103173135 A CN103173135 A CN 103173135A CN 201310060003X A CN201310060003X A CN 201310060003XA CN 201310060003 A CN201310060003 A CN 201310060003A CN 103173135 A CN103173135 A CN 103173135A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy resin
- chloroprene rubber
- resistant epoxy
- sizing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 25
- 239000000853 adhesive Substances 0.000 title abstract description 9
- 230000001070 adhesive Effects 0.000 title abstract description 9
- 229920001084 poly(chloroprene) Polymers 0.000 claims abstract description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N acetic acid ethyl ester Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000915 polyvinyl chloride Polymers 0.000 claims abstract description 7
- 239000004800 polyvinyl chloride Substances 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- UPMLOUAZCHDJJD-UHFFFAOYSA-N Diphenylmethane p,p'-diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 5
- WEAPVABOECTMGR-UHFFFAOYSA-N triethyl 2-acetyloxypropane-1,2,3-tricarboxylate Chemical compound CCOC(=O)CC(C(=O)OCC)(OC(C)=O)CC(=O)OCC WEAPVABOECTMGR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- 238000004513 sizing Methods 0.000 claims description 19
- 235000002918 Fraxinus excelsior Nutrition 0.000 claims description 13
- 239000002956 ash Substances 0.000 claims description 13
- -1 dimethyl dimercapto 2-ethyl hexyl ethanoate tin Chemical compound 0.000 claims description 9
- 239000012467 final product Substances 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 8
- 238000006011 modification reaction Methods 0.000 claims description 8
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2S)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L Calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- KTWOOEGAPBSYNW-UHFFFAOYSA-N Ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 claims description 6
- 230000003712 anti-aging Effects 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- SVPXDRXYRYOSEX-UHFFFAOYSA-N Bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L Calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N Oleic acid Natural products CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 3
- 239000005642 Oleic acid Substances 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- 210000003135 Vibrissae Anatomy 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000000498 ball milling Methods 0.000 claims description 3
- 235000013539 calcium stearate Nutrition 0.000 claims description 3
- 239000008116 calcium stearate Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (Z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 230000002401 inhibitory effect Effects 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000001264 neutralization Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000000047 product Substances 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 239000011863 silicon-based powder Substances 0.000 claims description 3
- 239000011780 sodium chloride Substances 0.000 claims description 3
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N tributyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004073 vulcanization Methods 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- LQZZUXJYWNFBMV-UHFFFAOYSA-N Dodecanol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 2
- KUAZQDVKQLNFPE-UHFFFAOYSA-N Thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 claims description 2
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 claims description 2
- 239000005543 nano-size silicon particle Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 238000003860 storage Methods 0.000 abstract description 2
- DFRHTHSZMBROSH-UHFFFAOYSA-N ferrocene Chemical compound C12C3C4C5C1[Fe]16782345C2C7C6C1C82 DFRHTHSZMBROSH-UHFFFAOYSA-N 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 150000000211 1-dodecanols Chemical class 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention discloses a high temperature resistant epoxy resin adhesive. The adhesive is prepared from the following raw materials in parts by weight: 100-120 parts of styrene, 100-150 parts of ethyl acetate, 20-25 parts of an epoxy resin adhesive, 15-20 parts of dimethyl benzene, 1-2 parts of 4, 4'-diphenyl-methane-diisocyanate, 8-12 parts of polyisobutene, 2-3 parts of 3-aminopropyltrimethoxysilane, 2-3 parts of polyoxytertramethylene glycol, 3-5 parts of SG-2 type polyvinyl chloride (PVC) resin, 1-2 parts of ferrocen, 10-15 parts of bonding type chloroprene rubber CR2442, 5-10 parts of chloroprene rubber CR121, 3-5 parts of triethyl O-acetylcitrate and the like. The adhesive has the advantages of excellent heat resistance, high adhesive strength, water resistance, moisture proofness, good storage stability, small quantity of volatile matters in a solidification process, good environment friendliness, good use effect, convenience and wide application scope.
Description
Technical background
The present invention relates to a kind of sizing agent, be specifically related to a kind of high-temperature-resistant epoxy resin sizing agent.
Background technology
Liquid or the solid-state sizing agent that epoxy adhesive is comprised of epoxy resin, solidifying agent, promotor, properties-correcting agent etc. is because epoxy resin contains various polarity group and active very large epoxy group(ing), thereby has very strong cohesive force with various polarity materials such as metal, glass, cement, timber, plastics, the cohesive strength of curable epoxide thing is also very large simultaneously, so the very high epoxy resin adhesive of consolidation strength is widely used in industry and sphere of life with its excellent over-all properties.The development of the modern science and technology such as automobile, electronics is had higher requirement to the temperature tolerance of sizing agent.For example, some significant points of Generator Set Nuclear power plants will be used the insulation sizing agent of heatproof 180-200 ℃; The cementing needs of vehicular clutch friction plate, brake strap can be at the structural adhesive of 250-300 ℃ of work.
Summary of the invention
The objective of the invention is for the deficiencies in the prior art, a kind of high-temperature-resistant epoxy resin sizing agent is provided.
The technical solution used in the present invention is as follows:
a kind of high-temperature-resistant epoxy resin sizing agent is made by the raw material of following weight part: vinylbenzene 100-120, ethyl acetate 100-150, epoxy resin glue 20-25, dimethylbenzene 15-20, 4,4 '-diphenylmethanediisocyanate 1-2, polyisobutene 8-12, 3-aminopropyl trimethoxysilane 2-3, PTMG 2-3, SG-2 type polyvinyl chloride resin 3-5, ferrocene 1-2, binding type chloroprene rubber CR2442 10-15, chloroprene rubber CR121 5-10, acetyl triethyl citrate 3-5, dibutyl maleate 2-5, n-BMA 3-5, zinc oxide 2-3, magnesium oxide 2-3, calcium stearate 1-2, dimethyl dimercapto 2-ethyl hexyl ethanoate tin 0.5-1, modified alta-mud 50-60, nano silicon 60-70, sec.-propyl two oleic acid acyloxy (dioctyl phosphoric acid acyloxy) titanic acid ester 1-2, Silane coupling agent KH550 1-2, oxidation inhibitor 1035 2-3, anti-aging agent OD 1-2, anti-aging agent ODA 1-2, altax 3-4, Vulcanization accelerator TMTD 1-2, acceterator TE TD 1-2, modification trees ashes 1-2.
Described modified alta-mud is made by following methods: the raw material that takes off the row weight part: 5-10 part wilkinite, 4-6 part calcium sulfate crystal whiskers, 2-3 part silicon powder, 1-2 part silane resin acceptor kh-550,4-8 part lauryl alcohol, put into ball mill ball milling 4-6h under 1000-1200r/min, oven dry, pulverizing grinds to form 200-300 order powder and gets final product.
Described modification trees ashes are made by following methods: first use 10-15% salt acid soak trees ashes 3-4h, deionized water wash is clean, soak 3-4h with the 10-12% sodium hydroxide solution again, extremely neutral with deionized water wash again, oven dry adds the sodium laurylsulfate, the paregal O of 1-2%, the tributyl citrate of 2-3%, the 3-5% aluminum oxide that are equivalent to trees ashes weight 2-3%, and high speed 1200-1500r/min stirs 1-2h, oven dry, pulverizing grinds to form ultrafine powder and gets final product.
The preparation method of high-temperature-resistant epoxy resin sizing agent comprises the following steps:
(1) with epoxy resin glue, dimethylbenzene, 4,4 '-diphenylmethanediisocyanate, polyisobutene, 3-aminopropyl trimethoxysilane, PTMG, SG-2 type polyvinyl chloride resin, ferrocene, binding type chloroprene rubber CR2442, chloroprene rubber CR121 mix, and react 1-2h under 100-120 ℃;
(2) other material is mixed with reactant, stir 30-40min, obtain finished product, packing gets final product.
Beneficial effect of the present invention:
The present invention can improve thermostability, tensile shear strength, chemical resistance and the oil-proofness of sizing agent by wilkinite is carried out modification.By the trees ashes are carried out modification, improved it at the dispersing uniformity in the sizing agent component, thereby can obviously improve bonding strength and the water tolerance of epoxy resin adhesive, and it is low to have a cost, the characteristics that effect is good.Sizing agent of the present invention has good thermotolerance, cohesive strength is high, water-fast protection against the tide, and excellent storage stability, in solidification process, volatile matter is few, and the feature of environmental protection is good, and result of use is good and convenient, applied range.
Embodiment
The present invention is further illustrated below in conjunction with specific embodiment.
Embodiment
a kind of high-temperature-resistant epoxy resin sizing agent is made by the raw material of following weight part: 120 parts of vinylbenzene, 140 parts of ethyl acetate, 25 parts of epoxy resin glues, 18 parts of dimethylbenzene, 4,2 parts of 4 '-diphenylmethanediisocyanates, 10 parts of polyisobutene, 2.5 parts of 3-aminopropyl trimethoxysilane, 3 parts of PTMG, 4 parts of SG-2 type polyvinyl chloride resins, 2 parts of ferrocene, 12 parts of binding type chloroprene rubber CR2442, 10 parts of chloroprene rubber CR121, 4 parts of acetyl triethyl citrate, 4 parts of dibutyl maleates, 5 parts of n-BMAs, 2 parts, zinc oxide, 3 parts, magnesium oxide, 1 part of calcium stearate, 1 part, dimethyl dimercapto 2-ethyl hexyl ethanoate tin, 55 parts of modified alta-muds, 65 parts of nano silicons, 1.2 parts of sec.-propyl two oleic acid acyloxy (dioctyl phosphoric acid acyloxy) titanic acid ester, 1.6 parts of Silane coupling agent KH550s, 1,035 2 parts, oxidation inhibitor, 1 part of anti-aging agent OD, 2 parts of anti-aging agent ODA, 3 parts of altaxs, 2 parts of Vulcanization accelerator TMTDs, 2 parts of acceterator TE TD, 2 parts, modification trees ashes.
Wherein, described modified alta-mud is made by following methods: the raw material that takes off the row weight part: 8 parts of wilkinites, 5 parts of calcium sulfate crystal whiskers, 3 parts of silicon powders, 1.8 parts of silane resin acceptor kh-550s, 8 parts of lauryl alcohols, put into ball mill ball milling 5h under 1200r/min, oven dry, pulverizing grinds to form 200 order powder and gets final product.
Described modification trees ashes are made by following methods: first use 15% salt acid soak trees ashes 4h, deionized water wash is clean, soak 4h with 12% sodium hydroxide solution again, extremely neutral with deionized water wash again, oven dry adds the sodium laurylsulfate that is equivalent to trees ashes weight 3%, 2% paregal O ,-3% tributyl citrate, 3% aluminum oxide, and high speed 1500r/min stirs 2h, oven dry, pulverizing grinds to form ultrafine powder and gets final product.
The preparation method of high-temperature-resistant epoxy resin sizing agent comprises the following steps:
(1) with epoxy resin glue, dimethylbenzene, 4,4 '-diphenylmethanediisocyanate, polyisobutene, 3-aminopropyl trimethoxysilane, PTMG, SG-2 type polyvinyl chloride resin, ferrocene, binding type chloroprene rubber CR2442, chloroprene rubber CR121 mix, and react 2h under 120 ℃;
(2) other material is mixed with reactant, stir 40min, obtain finished product, packing gets final product.
The salient features of the high-temperature-resistant epoxy resin sizing agent that the present embodiment makes such as following table 1.
Table 1
Water-fast, to soak 12 months in water, stripping strength descends 5%.
Claims (4)
1. a high-temperature-resistant epoxy resin sizing agent, is characterized in that, made by the raw material of following weight part: vinylbenzene 100-120, ethyl acetate 100-150, epoxy resin glue 20-25, dimethylbenzene 15-20, 4,4 '-diphenylmethanediisocyanate 1-2, polyisobutene 8-12, 3-aminopropyl trimethoxysilane 2-3, PTMG 2-3, SG-2 type polyvinyl chloride resin 3-5, ferrocene 1-2, binding type chloroprene rubber CR2442 10-15, chloroprene rubber CR121 5-10, acetyl triethyl citrate 3-5, dibutyl maleate 2-5, n-BMA 3-5, zinc oxide 2-3, magnesium oxide 2-3, calcium stearate 1-2, dimethyl dimercapto 2-ethyl hexyl ethanoate tin 0.5-1, modified alta-mud 50-60, nano silicon 60-70, sec.-propyl two oleic acid acyloxy (dioctyl phosphoric acid acyloxy) titanic acid ester 1-2, Silane coupling agent KH550 1-2, oxidation inhibitor 1035 2-3, anti-aging agent OD 1-2, anti-aging agent ODA 1-2, altax 3-4, Vulcanization accelerator TMTD 1-2, acceterator TE TD 1-2, modification trees ashes 1-2.
2. high-temperature-resistant epoxy resin sizing agent according to claim 1, it is characterized in that, described modified alta-mud is made by following methods: the raw material that takes off the row weight part: 5-10 part wilkinite, 4-6 part calcium sulfate crystal whiskers, 2-3 part silicon powder, 1-2 part silane resin acceptor kh-550,4-8 part lauryl alcohol, put into ball mill ball milling 4-6h under 1000-1200r/min, oven dry, pulverizing grinds to form 200-300 order powder and gets final product.
3. high-temperature-resistant epoxy resin sizing agent according to claim 1, it is characterized in that, described modification trees ashes are made by following methods: first use 10-15% salt acid soak trees ashes 3-4h, deionized water wash is clean, soak 3-4h with the 10-12% sodium hydroxide solution again, extremely neutral with deionized water wash again, oven dry, add the sodium laurylsulfate, the paregal O of 1-2%, the tributyl citrate of 2-3%, the 3-5% aluminum oxide that are equivalent to trees ashes weight 2-3%, high speed 1200-1500r/min stirs 1-2h, oven dry, pulverizing grinds to form ultrafine powder and gets final product.
4. the preparation method of a high-temperature-resistant epoxy resin sizing agent as claimed in claim 1 is characterized in that comprising the following steps:
(1) with epoxy resin glue, dimethylbenzene, 4,4 '-diphenylmethanediisocyanate, polyisobutene, 3-aminopropyl trimethoxysilane, PTMG, SG-2 type polyvinyl chloride resin, ferrocene, binding type chloroprene rubber CR2442, chloroprene rubber CR121 mix, and react 1-2h under 100-120 ℃;
(2) other material is mixed with reactant, stir 30-40min, obtain finished product, packing gets final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310060003.XA CN103173135B (en) | 2013-02-26 | 2013-02-26 | High temperature resistant epoxy resin adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310060003.XA CN103173135B (en) | 2013-02-26 | 2013-02-26 | High temperature resistant epoxy resin adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103173135A true CN103173135A (en) | 2013-06-26 |
| CN103173135B CN103173135B (en) | 2014-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310060003.XA Active CN103173135B (en) | 2013-02-26 | 2013-02-26 | High temperature resistant epoxy resin adhesive |
Country Status (1)
| Country | Link |
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| CN (1) | CN103173135B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107033791A (en) * | 2016-10-18 | 2017-08-11 | 铜陵市肆得科技有限责任公司 | A kind of epoxy anticorrosive metal binding agent and preparation method thereof |
| CN107586525A (en) * | 2017-06-10 | 2018-01-16 | 合肥聚合辐化技术有限公司 | A kind of chemical rubber metal fever vulcanizing adhesive and preparation method thereof |
| CN107974226A (en) * | 2017-12-21 | 2018-05-01 | 王春望 | A kind of low content of free formaldehyde timber polyvinyl chloride base adhesive and preparation method thereof |
| CN108192554A (en) * | 2017-12-28 | 2018-06-22 | 宁波凯耀电器制造有限公司 | A kind of thermostable transparent glue and preparation method thereof |
| CN113462337A (en) * | 2021-07-09 | 2021-10-01 | 武汉梓强生态科技有限公司 | Grouting type high-molecular binder crack repairing adhesive |
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| JP2007009042A (en) * | 2005-06-30 | 2007-01-18 | Sanko Kagaku Kogyo Kk | Antistatic polymer composition, method for producing the same, molding using the same and polymerizable compound |
| CN101717557A (en) * | 2008-10-09 | 2010-06-02 | 北京印刷学院 | Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
| CN102027084A (en) * | 2008-04-09 | 2011-04-20 | 泽菲罗斯公司 | Improvements in or relating to structural adhesives |
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| CN1175613A (en) * | 1996-09-05 | 1998-03-11 | 中国人民解放军国防科学技术大学 | Ordinary temp. setting heat-resistant adhesive |
| JP2007009042A (en) * | 2005-06-30 | 2007-01-18 | Sanko Kagaku Kogyo Kk | Antistatic polymer composition, method for producing the same, molding using the same and polymerizable compound |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107033791A (en) * | 2016-10-18 | 2017-08-11 | 铜陵市肆得科技有限责任公司 | A kind of epoxy anticorrosive metal binding agent and preparation method thereof |
| CN107586525A (en) * | 2017-06-10 | 2018-01-16 | 合肥聚合辐化技术有限公司 | A kind of chemical rubber metal fever vulcanizing adhesive and preparation method thereof |
| CN107974226A (en) * | 2017-12-21 | 2018-05-01 | 王春望 | A kind of low content of free formaldehyde timber polyvinyl chloride base adhesive and preparation method thereof |
| CN108192554A (en) * | 2017-12-28 | 2018-06-22 | 宁波凯耀电器制造有限公司 | A kind of thermostable transparent glue and preparation method thereof |
| CN108192554B (en) * | 2017-12-28 | 2020-07-28 | 宁波凯耀电器制造有限公司 | High-temperature-resistant transparent adhesive and preparation method thereof |
| CN113462337A (en) * | 2021-07-09 | 2021-10-01 | 武汉梓强生态科技有限公司 | Grouting type high-molecular binder crack repairing adhesive |
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| Publication number | Publication date |
|---|---|
| CN103173135B (en) | 2014-04-30 |
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