CN117560912A

CN117560912A - Controller and vehicle

Info

Publication number: CN117560912A
Application number: CN202311777036.6A
Authority: CN
Inventors: 潘宏伟
Original assignee: Weilai Automobile Technology Anhui Co Ltd
Current assignee: Weilai Automobile Technology Anhui Co Ltd
Priority date: 2023-12-21
Filing date: 2023-12-21
Publication date: 2024-02-13

Abstract

The invention relates to the technical field of controllers, in particular to a controller and a vehicle, and aims to solve the problems that the size of the controller is large, and chips corresponding to downstream areas of a heat dissipation air duct cannot dissipate heat rapidly. The controller comprises a circuit board and a metal radiator, wherein one side of the circuit board is provided with a plurality of chips, the metal radiator comprises a substrate and radiating structures which are distributed on a first side face of the substrate and extend in a direction away from the substrate, a second side face of the substrate is in contact with the chips, an air duct coaming is arranged on the second side face of the substrate, the air duct coaming and the substrate enclose a radiating air duct which is parallel to the circuit board and extends in a first direction, a radiating fan is arranged in the radiating air duct so as to drive air to flow in the first direction, and the chips are distributed in a staggered mode in the first direction. By the arrangement, the volume of the controller is reduced, and the heat dissipation effect of the chip positioned in the downstream area of the heat dissipation air duct is enhanced.

Description

Controller and vehicle

Technical Field

The invention relates to the technical field of controllers, and particularly provides a controller and a vehicle.

Background

Currently, with the continuous development of technology, electrically driven new energy vehicles are one of the main types of home vehicle markets. In an electrically driven new energy vehicle, a controller is one of important parts, and the controller is in communication connection with a driving system, a battery management system, a cabin system and the like of the new energy vehicle.

In general, the controller has a plurality of chips for calculating and processing data of a driving system, a battery management system, and a cabin system of the new energy vehicle, respectively, which are typically disposed on a plurality of different circuit boards, which are communicatively connected to each other. The controller also comprises a radiator, the radiator comprises a substrate and a plurality of fins arranged on the first side face of the substrate, the second side face of the substrate is in contact with the chip on one side of the circuit board, an air duct coaming is further arranged on the second side face of the substrate, the air duct coaming and the substrate enclose a radiating air duct which is parallel to the circuit board and extends along the direction from the first end to the second end of the substrate, a radiating fan is arranged in the radiating air duct, and the radiating of the fins is accelerated by driving airflow of the radiating fan, so that the rapid radiating of the chip is realized. The chips are orderly arranged along the direction from the first end to the second end of the substrate. Therefore, the integration level of the chip is lower, the volume of the controller is larger, the manufacturing procedures of the controller are more, the manufacturing period is longer, the air flowing through the upstream of the heat dissipation air duct absorbs the heat transferred by the fins of the chip in the area and becomes air with higher temperature, and the air with higher temperature cannot quickly dissipate heat of the fins in the area when flowing through the fins in the downstream area along the heat dissipation air duct, so that the chips corresponding to the area cannot quickly dissipate heat.

Accordingly, there is a need in the art for a new solution to the above-mentioned problems.

Disclosure of Invention

The invention aims to solve the technical problems that the size of a controller is large, and chips corresponding to the downstream area of a heat dissipation air duct cannot dissipate heat rapidly.

In a first aspect, the invention provides a controller, the controller includes a circuit board and a metal radiator, one side of the circuit board is provided with a plurality of chips, the metal radiator includes a substrate and a heat dissipation structure distributed on a first side of the substrate and extending away from the substrate, a second side of the substrate contacts with the plurality of chips, a wind channel coaming is arranged on the second side of the substrate, the wind channel coaming and the substrate enclose a heat dissipation wind channel parallel to the circuit board and extending along a first direction, a heat dissipation fan is arranged in the heat dissipation wind channel so as to drive air to flow along the first direction in the heat dissipation wind channel, and the plurality of chips are distributed in a staggered manner in the first direction.

In the preferred technical solution of the controller, the chips are staggered along the first direction in order from the highest junction temperature to the highest junction temperature.

In the preferred technical scheme of the controller, the chips are distributed in a staggered manner along the first direction according to the order of the heating power from small to large on the basis that the chips are distributed in a staggered manner along the first direction according to the order of the highest junction temperature from small to large.

In the preferred embodiment of the controller, the area of the non-layout area surrounding each chip on the circuit board is positively correlated with the heat generating power of the chip.

In a preferred embodiment of the above controller, the plurality of chips are staggered in the first direction in order of decreasing frequency of use.

In the preferred embodiment of the controller, the area of the non-layout area surrounding each chip on the circuit board is positively correlated with the frequency of use of the chip.

In the above preferred technical solution of the controller, the heat dissipation area of the heat dissipation structure opposite to each chip is positively correlated with the heat generation power of the chip.

In the above preferred technical solution of the controller, the heat dissipation area of the heat dissipation structure opposite to each chip is positively correlated with the frequency of use of the chip.

In the preferred technical scheme of the controller, the controller comprises a shell, the shell comprises a base plate, a panel opposite to the base plate and a coaming arranged between the base plate and the panel and respectively connected with the base plate and the panel, the base plate, the panel and the coaming enclose a cavity for accommodating the circuit board, the circuit board is arranged in the cavity, and the heat dissipation structure is arranged outside the shell.

Under the condition of adopting the technical scheme, the controller comprises a circuit board and a metal radiator, one side of the circuit board is provided with a plurality of chips, the metal radiator comprises a substrate and a radiating structure which is distributed on a first side face of the substrate and extends towards a direction far away from the substrate, a second side face of the substrate is in contact with the chips, an air channel coaming is arranged on the second side face of the substrate, the air channel coaming and the substrate enclose a radiating air channel which is parallel to the circuit board and extends along the first direction, a radiating fan is arranged in the radiating air channel so as to drive air to flow along the first direction in the radiating air channel, and the chips are distributed in a staggered mode in the first direction.

Through the arrangement, the chips of the controller are integrated on the circuit board, so that the situations of large volume and more manufacturing procedures of the controller caused by the fact that the chips are distributed on different circuit boards and are in communication connection with the circuit boards are avoided, the integration level of the chips is improved, the volume of the controller is reduced, the manufacturing procedures of the controller are simplified, and the manufacturing cost is reduced. The chips are distributed in a staggered manner along the flow direction of air in the heat dissipation air duct, so that the influence of heat generated by the chips located in the upstream area of the heat dissipation air duct on heat dissipation of the chips located in the downstream area of the heat dissipation air duct is weakened, the heat dissipation effect of the chips located in the downstream area of the heat dissipation air duct is enhanced, and the reliability of normal operation of the chips is ensured.

Preferably, the plurality of chips are staggered in the first direction in order of the highest junction temperature from small to large.

Because the temperature of the air flowing through the downstream area in the heat dissipation air duct is higher, compared with the heat dissipation structure of the upstream area, the heat dissipation effect of the heat dissipation structure of the downstream area is relatively poor, and the chips are distributed in a staggered manner along the first direction according to the order from the highest junction temperature to the largest, so that the risk of damage of the chips due to the fact that the temperature exceeds the highest junction temperature can be reduced, and the reliability of normal operation of the chips is improved.

Preferably, the plurality of chips are alternately distributed in the first direction in the order of the heating power from the small to the large on the basis that the plurality of chips are alternately distributed in the first direction in the order of the highest junction temperature from the small to the large.

Through such setting, the chip that generates heat power is less, and it is close to the upstream end in heat dissipation wind channel more, can slow down the temperature rise of the air of the regional upstream of heat dissipation wind channel of flowing through like this, and then weakens the influence of the air after the temperature rise of the regional upstream of flowing through in the heat dissipation wind channel to the heat dissipation of the chip that is located the regional downstream of heat dissipation wind channel, has further strengthened the radiating effect of the regional chip of downstream of heat dissipation wind channel, has guaranteed the reliability of the normal operating of chip.

Preferably, the area of the circuit board surrounding the non-layout area of each chip is positively correlated with the heat generation power of the chip.

Through such setting, can be on the invariable basis of total area of circuit board for the chip of different heating power all has the heat dissipation space rather than the adaptation, guarantees that different chips all have sufficient heat dissipation space, avoids the distance between the adjacent chip less and influences the heat dissipation of chip, makes every chip all reach better radiating effect.

Preferably, the plurality of chips are staggered in the first direction in order of the frequency of use from small to large.

Since the higher the frequency of use of the chip, the more heat it generates over a period of time. The chips are distributed in a staggered manner along the first direction according to the order of the use frequency from small to large, so that the influence of the heated air flowing through the upstream area in the heat dissipation air duct on the heat dissipation of the chips positioned in the downstream area of the heat dissipation air duct can be weakened, the heat dissipation effect of the chips positioned in the downstream area of the heat dissipation air duct is further enhanced, and the reliability of the normal operation of the chips is ensured.

Preferably, the area of the circuit board surrounding the non-layout area of each chip is positively correlated to the frequency of use of the chip.

Since the higher the frequency of use of the chip, the more heat it generates over a period of time. The area of the non-layout area surrounding each chip on the circuit board is set to be positively correlated with the use frequency of the chip, so that the chips with different use frequencies can all have heat dissipation spaces matched with the chips on the basis of unchanged total area of the circuit board, different chips are guaranteed to have sufficient heat dissipation spaces, heat dissipation of the chips is prevented from being influenced due to the fact that the distance between adjacent chips is small, and good heat dissipation effect is achieved for each chip.

Preferably, the heat dissipation area of the heat dissipation structure opposite to each chip is positively correlated with the heat generation power of the chip.

The higher the heating power of the chip is, the more heat is generated in a short time, and the heat dissipation structure opposite to the chip needs to emit more heat outwards to avoid the situation that the temperature of the chip is too high. The heat dissipation area of the heat dissipation structure opposite to each chip is set to be positively correlated with the heat generation power of the chip, so that the heat dissipation structures opposite to the chips with different heat generation powers all have heat dissipation areas matched with the heat generation power of the chips, the heat dissipation requirements of the chips are met by the heat dissipation structures opposite to the different chips, and each chip has a good heat dissipation effect.

Preferably, the heat dissipation area of the heat dissipation structure opposite to each chip is positively correlated with the frequency of use of the chip.

As the use frequency of the chip is higher, more heat is generated in a certain period of time, and more heat is required to be emitted outwards by the heat dissipation structure opposite to the chip to avoid the situation that the temperature of the chip is too high, and the heat dissipation requirement of the chip can be better met only when the heat dissipation area of the heat dissipation structure opposite to the chip is larger for the chip with higher use frequency. The radiating area of the radiating structure opposite to each chip is set to be positively correlated with the using frequency of the chip, so that the radiating structures opposite to the chips with different using frequencies all have radiating areas matched with the using frequency of the chip, the radiating structures opposite to the different chips are ensured to meet the radiating requirement of the chip, and each chip achieves a good radiating effect.

Preferably, the controller comprises a housing including a base plate, a panel facing the base plate, and a surrounding plate disposed between the base plate and the panel and connected with the base plate and the panel, respectively, the base plate, the panel, and the surrounding plate enclose a cavity for accommodating the circuit board, the circuit board is disposed in the cavity, and the heat dissipation structure is disposed outside the housing.

Through such setting, can play the guard action to the circuit board to reduce the manufacturing materials of the casing of controller, make things convenient for the assembly of controller, further reduce manufacturing cost.

In a second aspect, the invention also provides a vehicle comprising a controller according to any one of the above technical solutions.

It should be noted that the vehicle has all the technical effects of the controller described in any one of the above technical solutions, and will not be described herein again.

Drawings

Preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a controller according to an embodiment of the present invention;

fig. 2 is an exploded view of a controller according to one embodiment of the present invention.

List of reference numerals:

1. a housing; 11. a bottom panel; 12. coaming plate; 121. a connector; 2. a circuit board; 21. a whole vehicle control chip; 22. a gateway chip; 23. an intelligent driving chip; 24. a cabin control chip; 25. a communication chip; 31. a substrate; 32. a fin; 4. an air duct coaming; 41. a side plate; 411. an air inlet; 42. a cover plate; 5. a heat radiation fan; 6. conductive foam.

Detailed Description

First, it should be understood by those skilled in the art that the embodiments described below are merely for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention.

It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "front," "rear," and the like indicate directional or positional relationships based on the directional or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In addition, it should be noted that, in the description of the present invention, unless explicitly stated and limited otherwise, the term "connected" should be interpreted broadly, and for example, it may be a fixed connection, a detachable connection, or an integral connection, or a direct connection, or an indirect connection. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to the specific circumstances. "highest junction temperature" refers to the highest allowable actual operating temperature.

Based on the problems that the size of the controller is large and chips corresponding to the downstream area of a heat dissipation air channel cannot dissipate heat rapidly in the prior art, the invention provides the controller.

The controller of the present invention will be described with reference to fig. 1 and 2. Fig. 1 is a schematic structural diagram of a controller according to an embodiment of the present invention, and fig. 2 is an exploded view of the controller according to an embodiment of the present invention.

As shown in fig. 1 and 2, the controller includes a housing 1, a circuit board 2 is disposed in the housing 1, and a whole vehicle control chip 21, a gateway chip 22, an intelligent driving chip 23, a cabin control chip 24 and a communication chip 25 are disposed on the upper side of the circuit board 2. The whole car control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 are provided with a metal radiator, the metal radiator comprises a substrate 31 and a plurality of fins 32 which are distributed on the upper side surface of the substrate 31 and extend upwards, the lower side surface of the substrate 31 is in contact with the whole car control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25, and the upper ends of all the fins 32 are electrically connected through conductors.

As shown in fig. 1 and 2, specifically, the housing 1 includes a base plate 31, a bottom panel 11 located below the base plate 31, and a surrounding plate 12 disposed between the base plate 31 and the bottom panel 11 and connected to the base plate 31 and the bottom panel 11, respectively, the base plate 31, the bottom panel 11, and the surrounding plate 12 enclose a cavity accommodating the circuit board 2, the circuit board 2 is disposed in the cavity, and the fins 32 are located outside the cavity. A connector 121 is connected to the front edge of the circuit board 2, and the front end of the connector 121 is passed out from the front side of the coaming 12. The underside of the base plate 31 is in contact with the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25, and a plurality of fins 32 extend upward on the upper side of the base plate 31, and each fin 32 extends in the left-right direction in the length direction. An air duct coaming 4 is also arranged on the upper side of the base plate 31, and the air duct coaming 4 and the base plate 31 enclose a heat dissipation air duct which is parallel to the circuit board 2 and extends from left to right. The air duct coaming 4 includes a side plate 41 and a cover plate 42, the side plate 41 includes a front side portion, a left side portion and a rear side portion connected to each other, an edge of the cover plate 42 is abutted with an upper edge of the side plate 41 and fixedly connected by a clamping structure, an air inlet 411 communicating with the heat dissipation air duct is formed on the left side portion, and an air outlet (not shown in the figure) communicating with the heat dissipation air duct is defined between a right end of the front side portion, a right end of the rear side portion, a right end of the base plate 31 and a right end of the cover plate 42. A cooling fan 5 is disposed in the cooling air duct at a position on the left side of the fin 32, a wire harness of the cooling fan 5 passes through a notch on the side plate 41 and is connected with the connector 121, and air flows into the cooling air duct from the air inlet 411 through the driving of the cooling fan 5, flows right through the fin 32 and then flows out from the air outlet. The conductive foam 6 as a conductor is sandwiched between the cover plate 42 and the upper ends of the plurality of fins 32, the conductive foam 6 is pressed by the corresponding fins 32 and the cover plate 42, and the conductive foam 6 is electrically connected to the upper ends of the plurality of fins 32. Wherein, coaming 12, base plate 31, curb plate 41, fin 32 integrated into one piece.

As shown in fig. 2, the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 on the upper side of the circuit board 2 are distributed in a staggered manner along the left-to-right direction.

The whole car control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 are integrated on one circuit board 2, so that the situations of large volume and more manufacturing procedures of the controller caused by the fact that a plurality of chips are distributed on different circuit boards and are in communication connection with the circuit boards are avoided, the integration level of the chips is improved, the volume of the controller is reduced, the manufacturing procedures of the controller are simplified, and the manufacturing cost is reduced.

The whole car control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 on the upper side of the circuit board 2 are distributed in a staggered manner along the direction from left to right, namely along the extending direction of the heat dissipation air duct, so that the influence of heat generated by the chip located in the upstream area of the heat dissipation air duct on the heat dissipation of the chip located in the downstream area of the heat dissipation air duct is weakened, the heat dissipation effect of the chip located in the downstream area of the heat dissipation air duct is enhanced, and the reliability of the normal operation of the chip is ensured.

The upper ends of the fins 32 are electrically connected through the conductive foam 6, so that the fins 32 do not generate a plurality of antenna amplifying effects, thereby weakening the amplifying effect of the fins 32 on electromagnetic radiation and further weakening the intensity of the electromagnetic radiation emitted by the controller towards the surrounding environment. Through such setting, need not to lay a plurality of metal shrapnels around whole car control chip 21, gateway chip 22, intelligent driving chip 23, cabin control chip 24 and communication chip 25 on circuit board 2 and ground through the metal shrapnel and weaken whole car control chip 21, gateway chip 22, intelligent driving chip 23, cabin control chip 24 and communication chip 25's electromagnetic radiation, the area that reserves around whole car control chip 21, gateway chip 22, intelligent driving chip 23, cabin control chip 24 and communication chip 25 and connect a plurality of metal shrapnel on circuit board 2 and lead to circuit board 2's area too big condition to take place, reduced circuit board 2's area, reduced manufacturing cost.

The casing 1 includes base plate 31, be located the bottom plate 11 of the below of base plate 31 and set up between base plate 31 and bottom plate 11 and respectively with the bounding wall 12 that base plate 31 and bottom plate 11 are connected, base plate 31, bottom plate 11 and bounding wall 12 enclose into the cavity that holds circuit board 2, circuit board 2 sets up in the cavity, fin 32 is located the cavity, can play the guard action to the circuit board like this, reduce the manufacturing materials of casing 1 of controller, the assembly of convenient controller, further reduce manufacturing cost, and the radiating effect of metal radiator has been improved.

The radiator fan 5 is arranged at the left side of the fin 32 in the radiator duct, and compared with the modes of arranging the radiator fan 5 at other positions in the radiator duct, the radiator fan 5 can avoid the situation that the normal operation of the radiator fan 5 is influenced due to the fact that the temperature of the radiator fan 5 is too high when the air in the radiator duct flows through the radiator fan 5 after being heated.

The conductive foam 6 serving as a conductor is clamped between the cover plate 42 and the upper ends of the fins 32, the conductive foam 6 is extruded by the fins 32 and the cover plate 42, and the conductive foam 6 is electrically connected with the upper ends of the fins 32, so that the conductive foam 6 is convenient to install and connect, the manufacturing process is simplified, and the manufacturing cost is further reduced. The conductive foam 6 is sandwiched between the cover plate 42 and the upper ends of the fins 32 as a conductor, so that the contact reliability between the conductive foam 6 and the fins 32 can be increased, and the reliability of the electrical connection of the fins 32 can be further ensured. In addition, by such an arrangement, even in the case where the assembly tolerance of the duct cover 4 is large, the reliability of the electrical connection of the conductive foam 6 and the plurality of fins 32 can be ensured.

It should be noted that, the conductive foam 6 is only one specific arrangement, and may be adjusted in practical application, for example, the conductor may be an iron strip, a copper strip or other suitable conductor, and the conductor may be connected to the upper ends of the fins 32 by welding. In addition, the side plate 41 and the base plate 31 are integrally formed, the cover plate 42 is connected with the side plate 41 in a clamping manner, which is only a specific arrangement mode, and in practical application, the adjustment can be performed, for example, the cover plate 42 and the side plate 41 are integrally formed, and the side plate 41 and the base plate 31 are fixedly connected through clamping, screwing or other suitable manners. In addition, the fin 32 is used as a heat dissipating structure, which is only one specific arrangement, and may be adjusted in practical applications, for example, the heat dissipating structure may be a heat dissipating pillar extending upward from the upper side of the substrate 31.

In another preferred embodiment, unlike the above embodiment, the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 on the upper side of the circuit board 2 are staggered in the left-to-right direction in the order of the highest junction temperature.

On the basis that the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 are distributed in a staggered manner along the left-to-right direction in the order of the highest junction temperature, the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 are distributed in a staggered manner along the first direction in the order of the heating power from small to large. That is, on the premise that the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 are alternately distributed in the left-to-right direction in the order of the highest junction temperature from small to large, the heat generation power of each chip is further considered, so that the chip with smaller heat generation power is arranged at the left side of the chip with relatively larger heat generation power.

In another preferred embodiment, unlike the above embodiments, the area of the circuit board 2 surrounding the non-layout area of each chip is positively correlated with the heat generation power of the chip.

Through such setting, can be on the invariable basis of total area of circuit board 2 for the chip of different heating power all has the heat dissipation space rather than the adaptation, guarantees that different chips all have sufficient heat dissipation space, avoids the distance between the adjacent chip less and influences the heat dissipation of chip, makes every chip all reach better radiating effect.

In another preferred embodiment, unlike the above embodiment, the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 on the upper side of the circuit board 2 are staggered in the left-to-right direction in the order of the frequency of use.

Since the higher the frequency of use of the chip, the more heat it generates over a period of time. The chips are distributed in a staggered manner along the left-to-right direction according to the order of the use frequency, so that the influence of the warmed air flowing through the upstream area in the heat dissipation air duct on the heat dissipation of the chips positioned in the downstream area of the heat dissipation air duct can be weakened, the heat dissipation effect of the chips positioned in the downstream area of the heat dissipation air duct is further enhanced, and the reliability of the normal operation of the chips is ensured.

In another preferred embodiment, the area of the circuit board 2 surrounding the non-layout area of each chip is positively correlated with the frequency of use of the chip, unlike the above-described embodiments.

Since the higher the frequency of use of the chip, the more heat it generates over a period of time. The area of the non-layout area surrounding each chip on the circuit board 2 is set to be positively correlated with the use frequency of the chip, so that the chips with different use frequencies can all have heat dissipation spaces matched with the chips on the basis of unchanged total area of the circuit board, different chips are guaranteed to have sufficient heat dissipation spaces, heat dissipation of the chips is prevented from being influenced due to the fact that the distance between adjacent chips is small, and good heat dissipation effect is achieved for each chip.

On the basis of the above-described respective embodiments, it is preferable that the heat dissipation area of the fin 32 facing each chip is positively correlated with the heat generation power of the chip.

Because the higher the heating power of the chip is, the more heat is generated in a short time, the fins 32 opposite to the chip need to emit more heat outwards to avoid the situation that the temperature of the chip is too high, and the larger the heat dissipation area of the fins 32 opposite to the chip is, the heat dissipation requirement of the chip can be better met for the chip with higher heating power. The radiating area of each fin 32 opposite to each chip is set to be positively correlated with the heating power of the chip, so that the fins 32 opposite to the chips with different heating powers all have radiating areas matched with the heating power of the chips, the fins 32 opposite to the different chips are ensured to meet the radiating requirements of the chips, and each chip achieves a good radiating effect.

On the basis of the above-described respective embodiments, it is preferable that the heat dissipation area of the fin 32 facing each chip is positively correlated with the frequency of use of the chip.

Because the higher the frequency of use of the chip, the more heat it generates in a certain period of time, the more heat the fin 32 opposite to the chip needs to be emitted outwards to avoid the situation that the temperature of the chip is too high, and for the chip with higher frequency of use, the larger the heat dissipation area of the fin 32 opposite to the chip is, the heat dissipation requirement of the chip can be better met. The radiating area of each fin 32 opposite to each chip is set to be positively correlated with the using frequency of the chip, so that the fins 32 opposite to the chips with different using frequencies all have radiating areas matched with the using frequency of the chip, the fins 32 opposite to the different chips are ensured to meet the radiating requirement of the chip, and each chip achieves a good radiating effect.

In another possible embodiment, unlike the above embodiment, the substrate of the metal radiator is not a part of the housing, the entire metal radiator is disposed in the housing, the first side of the substrate of the metal radiator is in contact with the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25 on the circuit board 2, the fins of the metal radiator are disposed on the second side of the substrate, and the housing is provided with a heat radiation port communicating with the space between the second side of the substrate and the housing.

In another possible embodiment, the controller is not provided with the housing 1 in the above embodiment. Specifically, the bottom panel 11 and the coaming 12 in the above embodiment are not provided, the circuit board 2 is fixedly connected with the substrate 31 of the metal radiator by screws, and the lower side surface of the substrate 31 is in contact with the whole vehicle control chip 21, the gateway chip 22, the intelligent driving chip 23, the cabin control chip 24 and the communication chip 25.

In other possible embodiments, unlike the above embodiments, the air inlet 411 on the left side portion of the side plate 41 in the above embodiments is replaced with an air outlet, the air outlet enclosed between the right end of the front side portion, the right end of the rear side portion, the right end of the base plate 31 and the right end of the cover plate 42 of the side plate 41 is replaced with an air inlet, the cooling fan 5 is configured to blow air to the left, and air enters the cooling air duct from the air inlet on the right side, flows through the fins 32, and flows out from the air outlet on the left side. Accordingly, the arrangement direction of the chips in the above-described respective embodiments is changed from "the direction from left to right" to "the direction from right to left".

In other possible embodiments, the difference between the above embodiments is that the heat dissipation fan 5 is disposed at the middle position of the cover plate 42, the heat dissipation fan 5 sucks the air above the cover plate 42 and blows the air into the heat dissipation air channel, the air flows in the heat dissipation air channel to two ends of the heat dissipation air channel, and the two ends of the heat dissipation air channel serve as air outlets of the heat dissipation air channel; or the heat dissipation fan 5 is arranged in the middle of the cover plate 42, the heat dissipation fan 5 blows air towards the upper side of the cover plate 42, two ends of the heat dissipation air channel are used as air inlets of the heat dissipation air channel, air is sucked into the heat dissipation air channel through the air inlets at two ends of the heat dissipation air channel and flows towards the middle of the heat dissipation air channel, and finally the air is blown out towards the upper side of the cover plate 42 through the heat dissipation fan 5; accordingly, the arrangement direction of the chips in the above-described respective embodiments is changed from "the direction from left to right" to "the flow direction of the air in the heat dissipation duct".

In addition, the invention also provides a vehicle, which comprises the controller in any embodiment.

It should be noted that, the controller of the present invention may be applied not only to a vehicle, but also to other devices requiring a controller, and when the controller is applied to other devices requiring a controller, the types of the plurality of chips on the circuit board of the controller are adjusted according to specific usage scenarios.

Thus far, the technical solution of the present invention has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present invention, and such modifications and substitutions will fall within the scope of the present invention.

Claims

1. A controller is characterized by comprising a circuit board and a metal radiator, wherein one side of the circuit board is provided with a plurality of chips, the metal radiator comprises a substrate and radiating structures which are distributed on a first side surface of the substrate and extend in a direction away from the substrate, a second side surface of the substrate is contacted with the chips,

the second side of base plate is provided with the wind channel bounding wall, the wind channel bounding wall with the base plate enclose into with the circuit board is parallel and along the heat dissipation wind channel of first direction extension, be provided with radiator fan in the heat dissipation wind channel so that drive air in the heat dissipation wind channel is followed the first direction flows, a plurality of chips are in the crisscross distribution of first direction.

2. The controller of claim 1, wherein the plurality of chips are staggered in the first direction in order of highest junction temperature from small to large.

3. The controller according to claim 2, wherein the plurality of chips are staggered in the first direction in order of the heating power from small to large on the basis that the plurality of chips are staggered in the first direction in order of the highest junction temperature from small to large.

4. A controller according to claim 3, wherein the area of the circuit board surrounding the non-layout area of each chip is positively correlated with the heat generation power of the chip.

5. The controller of claim 1, wherein the plurality of chips are staggered in the first direction in order of frequency of use from small to large.

6. The controller of claim 5, wherein the area of the circuit board surrounding the non-routing area of each chip is positively correlated to the frequency of use of the chip.

7. The controller of claim 3 or 4, wherein the heat dissipation area of the heat dissipation structure opposite each chip is positively correlated with the heat generation power of the chip.

8. The controller of claim 5 or 6, wherein the heat dissipation area of the heat dissipation structure opposite each chip is positively correlated to the frequency of use of the chip.

9. The controller according to any one of claims 1 to 6, comprising a housing including the substrate, a panel facing the substrate, and a shroud disposed between and respectively connected to the substrate and the panel, the substrate, the panel, and the shroud enclosing a cavity in which the circuit board is housed, the circuit board being disposed within the cavity, the heat dissipation structure being disposed outside the housing.

10. A vehicle, characterized in that it comprises a controller according to any one of claims 1 to 9.