CN117529067A - Cabinet system for wafer detection - Google Patents
Cabinet system for wafer detection Download PDFInfo
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- CN117529067A CN117529067A CN202410010635.3A CN202410010635A CN117529067A CN 117529067 A CN117529067 A CN 117529067A CN 202410010635 A CN202410010635 A CN 202410010635A CN 117529067 A CN117529067 A CN 117529067A
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- air inlet
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- 238000001514 detection method Methods 0.000 title claims abstract description 12
- 238000012544 monitoring process Methods 0.000 claims abstract description 33
- 238000007689 inspection Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 229920000742 Cotton Polymers 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 230000035939 shock Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 4
- 238000004378 air conditioning Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/46—Boxes; Parts thereof or accessories therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Ventilation (AREA)
Abstract
The invention provides a cabinet system for wafer detection, which belongs to the field of server environmental control for semiconductor equipment, and comprises a server cabinet, a cabinet air inlet, an air exhaust and monitoring channel and a factory air exhaust pipeline; a temperature and humidity sensor, a waterproof top cover and a dustproof mesh cover are arranged on an air inlet of the cabinet; and a temperature sensor and a wind speed sensor are arranged at the exhaust and monitoring channels. Through this scheme, can effectively realize the temperature and humidity control of server, operating stability improves, is convenient for popularize and apply in fields such as semiconductor check out test set.
Description
Technical Field
The invention relates to the field of server environmental control for semiconductor equipment, in particular to a cabinet system for wafer detection.
Background
It is well known that servers are installed in cabinets and are used in large volumes in data centers, and that data centers or room temperatures are typically 35 ℃ or even above 40 ℃, requiring the use of air conditioning to cool the room environment. If the number of cabinets is small, a single cabinet is added with an air conditioner to directly control the temperature of the server. In severe environments, it is becoming increasingly important to use air conditioning to cool down in order to ensure proper operation of the server. In addition, the server also has a requirement on dust content, and the machine room or the cabinet also needs to consider adding a dust removing device.
However, in the field of semiconductor equipment, the server cabinets are all placed in a clean room, the temperature of the environment is usually stabilized at 24+/-2 ℃, the humidity is usually controlled at 30% -60%, the requirements of the server on the temperature and the humidity of the environment are completely met, and how to realize the heat dissipation control of a large number of high-performance servers with larger power and safe and reliable operation in the environment is the problem to be solved by the invention.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a cabinet system for wafer detection, which can solve the problems.
The invention aims to: a large number of high-performance server sets can be operated continuously in a clean dust-free room with high efficiency and reliability.
Design principle: the temperature and humidity sensor is arranged at the air inlet of the cabinet to monitor the temperature and humidity of the plant, the servers are arranged at intervals of 1U, and meanwhile, the sealing plate is adopted to seal the intervals, so that only the air exhausted by the servers can enter the exhaust channel. The temperature sensor and the air velocity sensor are arranged at the exhaust passage and used for monitoring the exhaust air quantity and the exhaust air temperature, and the temperature difference between the exhaust air and the intake air is usually less than 20 ℃. In addition, a smoke alarm sensor is arranged at the top of the cabinet and used for monitoring the occurrence of abnormal conditions of the server. In order to ensure that wind energy in the cabinet can be smoothly discharged, a centrifugal wind cabinet is configured in the scheme, and if the factory pipeline can meet negative pressure of-500 Pa to-800 Pa at the outlet of the cabinet, the centrifugal wind cabinet can be omitted. The specific scheme is as follows.
The cabinet system for wafer detection comprises a server cabinet, a cabinet air inlet, an air exhaust channel, a monitoring channel and a factory air exhaust pipeline; a temperature and humidity sensor, a waterproof top cover and a dustproof mesh cover are arranged on an air inlet of the cabinet; and a temperature sensor and a wind speed sensor are arranged at the exhaust and monitoring channels.
Further, the server cabinet comprises a cabinet shell, a plurality of server units, a power supply and distribution box (i.e. MSU) and a wind shield, wherein the server units are arranged at intervals up and down, a cabinet exhaust cavity is formed at the front side of the server units, and a cabinet air inlet cavity is formed at the rear side of the server units; the plurality of wind shields are arranged at adjacent intervals of the rear ends of the plurality of server units, adjacent intervals of the rear end surfaces of the server units, the top surface and the bottom surface of the cabinet shell and the rear end surfaces of the power supply and distribution boxes; the cabinet air inlet cavity is formed by surrounding a cabinet air inlet, a cabinet shell rear wall surface, a server unit rear end surface, a power supply and distribution box rear end surface and a wind shield.
Further, the exhaust and monitoring channel comprises an air outlet side door plate, an air speed sensor bracket, a temperature sensor, a waterproof cable connector, an air speed sensor, an exhaust channel and a mounting flange; the waterproof cable connector, the exhaust channel and the mounting flange are arranged on the air outlet side door plate; the wind speed sensor is arranged on the exhaust channel and the mounting flange through the wind speed sensor bracket, and the sensor head is radially inserted into the exhaust channel; the sensor head of the temperature sensor is also arranged in the exhaust channel and the exhaust channel of the mounting flange.
Further, a wind cabinet is further arranged between the air exhaust and monitoring channel and the plant air exhaust pipeline, a centrifugal fan, a frequency converter and a passive damper are arranged in the wind cabinet, and sound absorption cotton is arranged on the peripheral panels of the wind cabinet to reduce noise.
Further, a plurality of Power Distribution Units (PDU) are arranged in the server cabinet, the power distribution units are powered by the power supply and distribution box, and a total voltage and current detection unit is arranged in the power supply and distribution box.
The flow cross sections of the air inlet, the air exhaust and monitoring channels of the cabinet and the air inlet and outlet of the air cabinet are adjustable.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the scheme, through the design of the air duct and the cooperation of the air cabinet, the server can effectively dissipate heat under the condition that the compressor unit is not used for cooling;
2. according to the scheme, through monitoring the temperature of the air inlet and the air quantity, the whole operation working condition of the cabinet can be monitored in real time, meanwhile, the heat dissipation power of the server can be calculated, and the operation rough state of all the servers is deduced;
3. the cabinet is provided with the power supply and distribution box, the power supply is distributed to 3n PDU, the balance of the power supply three phases is ensured, and meanwhile, the safe operation of the server can be effectively ensured due to the fact that the power supply current monitoring module is arranged;
4. the air inlet is provided with a protective cover for preventing the equipment from dropping into the equipment, and a dustproof net is added for preventing debris and other sundries from entering the cabinet to affect the air suction of the server.
Drawings
FIG. 1 is a schematic diagram of a cabinet system of the present invention;
FIG. 2 is a front view of the exhaust and monitoring channel;
FIG. 3 is an isometric view of the exhaust and monitoring channel;
fig. 4 is a schematic diagram of a top air intake structure.
In the figure, 1, a cabinet shell; 2. a server unit; 3. an exhaust cavity of the cabinet; 4. an exhaust and monitoring channel; 5. a wind cabinet; 6. a plant exhaust pipeline; 7. a power supply and distribution box; 8. an air inlet cavity of the cabinet; 9. a wind deflector; 10. an air inlet of the cabinet; 11. an air outlet side door plate; 12. a wind speed sensor bracket; 13. a temperature sensor; 14. waterproof cable joints; 15. a wind speed sensor; 16. an exhaust channel and a mounting flange; 17. a waterproof top cover; 18. a dust-proof net cover; 19. and a cabinet top plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be appreciated that "system," "apparatus," "unit," and/or "module" as used in this specification is a method for distinguishing between different components, elements, parts, portions, or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.
1-4, particularly a high performance multi-core server cabinet in the field of semiconductor inspection equipment, wherein the selected server has a stopper slide rail; the whole design of the cabinet system comprises a heat dissipation scheme, a structure and three parts of power supply and distribution.
The structure part mainly refers to the whole structure arrangement, the sealing of an air duct, the unique design of an air inlet, the arrangement of an air outlet and the like.
The whole structure is arranged: the cabinet system for wafer detection comprises a server cabinet, a cabinet air inlet 10, an air exhaust and monitoring channel 4 and a factory air exhaust pipeline 6. A temperature and humidity sensor, a waterproof top cover and a dustproof mesh cover are arranged on the cabinet air inlet 10; a temperature sensor 13 and a wind speed sensor 15 are provided at the exhaust and monitoring duct 4.
The server cabinet comprises a cabinet shell 1, a plurality of server units 2, a power supply and distribution box 7 and a wind shield 9, wherein the plurality of server units 2 are arranged at intervals up and down, a cabinet exhaust cavity 3 is arranged at the front side of the plurality of server units 2, and a cabinet air inlet cavity 8 is arranged at the rear side of the plurality of server units 2; the plurality of wind shields 9 are arranged at adjacent intervals of the rear ends of the plurality of server units, adjacent intervals of the rear end surfaces of the server units and the top surface and the bottom surface of the cabinet shell as well as the rear end surfaces of the power supply and distribution boxes; the cabinet air inlet cavity 8 is formed by surrounding a cabinet air inlet 10, the rear wall surface of the cabinet shell 1, the rear end surface of the server unit 2, the rear end surface of the power supply and distribution box 7 and a wind shield 9.
Further, the air exhaust and monitoring channel 4 comprises an air outlet side door plate 11, an air speed sensor bracket 12, a temperature sensor 13, a waterproof cable joint 14, an air speed sensor 15, an air exhaust channel and a mounting flange 16; the waterproof cable joint 14, the exhaust channel and the mounting flange 16 are arranged on the air outlet side door plate 11; the wind speed sensor 15 is arranged on the exhaust channel and the mounting flange 16 through the wind speed sensor bracket 12, and the sensor head is radially inserted into the exhaust channel; the sensor head of the temperature sensor 13 is also arranged in the exhaust channel and the exhaust channel of the mounting flange 16.
Wherein, still set up a fan cabinet 5 between the passageway 4 of airing exhaust and monitoring and the plant exhaust duct 6, set up centrifugal fan, converter and passive shock absorber in fan cabinet 5 to set up on the panel around fan cabinet 5 and inhale the sound cotton and fall the noise.
Further, the fan cabinet 5 and the external boundary cables are connected in a connector mode, and heat dissipation ports are formed in two sides of the centrifugal fan motor and are provided with heat dissipation fans.
Specifically, for the fan cabinet 5, there is a centrifugal fan of middle pressure resistance and overload protection, overheat protection, etc. are set, the fan cabinet 5 and the outer boundary cable are all connected through connectors, the centrifugal fan can overcome 800Pa pressure resistance, and when the factory can provide negative pressure pumping of-500 Pa to-800 Pa, the fan cabinet 5 can be omitted.
For the configuration frequency converter, the frequency of the fan can be adjusted according to the piezoresistance of the air volume pipeline system and the actual air volume demand, and in addition, the fan is additionally provided with a damping and noise reduction design.
The damping and noise reduction design of the wind cabinet 5 mainly refers to selecting a corresponding passive damper according to the weight and structure of a fan, and simultaneously attaching sound-absorbing cotton to the peripheral panels for noise reduction.
In one example, the cabinet air inlet 10 is installed at the top of one side of the server cabinet, and the air exhaust and monitoring channel 4 and the plant air exhaust duct 6 are installed at the lower part of the other side of the server cabinet. Of course, the air inlet and outlet flow paths can be changed according to actual needs.
Further, a plurality of power distribution units, preferably 3n, are disposed in the server cabinet. And the power supply distribution unit is supplied with power by the power supply and distribution box 7, and a total voltage and current detection unit is arranged in the power supply and distribution box 7.
In order to ensure that the noise is lower than 80dB during operation, one side surface of the cabinet shell 1 of the server cabinet adopts a transparent glass panel to replace an orifice plate structure, so that noise reduction and observation are facilitated. In a specific example, the front panel cancels the pore plate structure, and adopts a transparent glass panel instead, thereby not only playing a role in reducing noise, but also observing the condition of the server in the cabinet through the panel.
The flow cross section of the cabinet air inlet 10, the air exhaust and monitoring channel 4 and the air inlet and outlet of the air cabinet 5 is adjustable.
The sealed scheme of wind channel mainly indicates that wind flows along rack import, each server, rack export and fan cabinet one-way in proper order, and rack air inlet is all inhaled through the inlet scoop of server self promptly, and is discharged from server self air outlet, and the fan cabinet only pumps server exhaust wind, avoids the new trend to form crosstalk or vortex in the rack inside like this, and then reduces heat exchange efficiency.
The related air duct sealing design mainly uses a metal sealing plate with the size of 1U as a wind shield 9, is arranged on an air inlet side panel bracket and seals the gap between the upper server unit 2 and the lower server unit 2.
The unique cabinet air inlet mainly means that the equipment is placed in the factory and possibly drops on the air inlet, and the air inlet is also likely to suck sundries such as larger fragments and the like to influence the air suction of the server, so that, referring to fig. 4, a waterproof top cover 17 and a dustproof net cover 18 are arranged at a cabinet top plate 19 where the cabinet air inlet 10 is located.
The related air duct design can adjust the width of the air inlet channel according to the size of the cross section area required by air inlet, and the installation of the server is not affected.
Wherein, the cross section of the air inlet and outlet of the cabinet is converted according to the air quantity and the air speed, and the air speed is generally controlled to be 10-15 m/s.
For the heat dissipation scheme, the cabinet system for wafer detection mainly adopts a natural air supply and centrifugal fan (located in the air cabinet 5) pumping mode to cool and dissipate heat of the server, and the heat transfer mode mainly relates to heat conduction and convection heat transfer. The temperature and humidity sensor is arranged at the air inlet 10 of the cabinet, the temperature sensor 13 and the air speed sensor 15 are arranged at the air exhaust and monitoring channel 4 of the cabinet, so that the on-line monitoring of the operating condition parameters of the cabinet is realized, and the temperature difference between the air outlet and the air inlet is less than 20 ℃.
For power supply and distribution design, a power supply and distribution box MSU is mainly arranged, power can be supplied to a single cabinet or a plurality of cabinets, and interfaces are all in a plug-in mode, so that field operation is facilitated. Specifically, the power supply of the server mainly means that 3 PDUs are placed in each cabinet, then the MSU supplies power to the PDUs, the balance of power supply three phases is ensured, and meanwhile, the total voltage and total current monitoring is arranged in the MSU, so that the safe and reliable operation of the server is ensured. The safety control includes total voltage and total current monitoring, air inlet and outlet temperature monitoring and outlet wind speed monitoring, smoke alarm sensor in the top of the cabinet and emergency switch EMO in the door plate of the cabinet.
The sensor signal acquisition related in the embodiment mainly refers to that various monitoring sensor signals related in a cabinet are collected through an IO acquisition module and integrally transmitted to an upper computer PLC through a network cable.
The air inlet and outlet related in the application mainly refers to an air outlet pipeline and an installation panel and the like provided with a sensor and a waterproof cable joint.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The cabinet system for wafer detection comprises a server cabinet, a cabinet air inlet (10), an air exhaust and monitoring channel (4) and a factory air exhaust pipeline (6); the method is characterized in that:
a temperature and humidity sensor, a waterproof top cover and a dustproof mesh cover are arranged on an air inlet (10) of the cabinet;
a temperature sensor (13) and a wind speed sensor (15) are arranged at the exhaust and monitoring channel (4).
2. The cabinet system for wafer inspection according to claim 1, wherein:
the server cabinet comprises a cabinet shell (1), a plurality of server units (2), a power supply and distribution box (7) and a wind shield (9), wherein the server units (2) are arranged at intervals up and down, a cabinet exhaust cavity (3) is formed in the front side of the server units (2), and a cabinet air inlet cavity (8) is formed in the rear side of the server units (2); the wind shields (9) are arranged at adjacent intervals of the rear ends of the server units, adjacent intervals of the rear end faces of the server units, the top face and the bottom face of the cabinet shell and the rear end faces of the power supply and distribution box; the cabinet air inlet cavity (8) is formed by surrounding a cabinet air inlet (10), a rear wall surface of a cabinet shell (1), a rear end surface of a server unit (2), a rear end surface of a power supply and distribution box (7) and a wind shield (9).
3. The cabinet system for wafer inspection according to claim 1, wherein:
the air exhaust and monitoring channel (4) comprises an air outlet side door plate (11), an air speed sensor bracket (12), a temperature sensor (13), a waterproof cable connector (14), an air speed sensor (15), an air exhaust channel and a mounting flange (16); the waterproof cable connector (14) and the exhaust channel and the mounting flange (16) are mounted on the air outlet side door plate (11); the wind speed sensor (15) is arranged on the exhaust channel and the mounting flange (16) through the wind speed sensor bracket (12), and the sensor head is radially inserted into the exhaust channel; the sensor head of the temperature sensor (13) is also arranged in the exhaust channel and the exhaust channel of the mounting flange (16).
4. The cabinet system for wafer inspection according to claim 1, wherein:
an air cabinet (5) is further arranged between the air exhaust and monitoring channel (4) and the plant air exhaust pipeline (6), a centrifugal fan, a frequency converter and a passive shock absorber are arranged in the air cabinet (5), and sound absorption cotton noise reduction is arranged on the peripheral panels of the air cabinet (5).
5. The cabinet system for wafer inspection according to claim 4, wherein:
the fan cabinet (5) is connected with the outer boundary cables through connectors, and heat dissipation ports are formed in two sides of the centrifugal fan motor and are provided with heat dissipation fans.
6. The cabinet system for wafer inspection according to claim 1, wherein:
the cabinet air inlet (10) is arranged at the top of one side of the server cabinet, and the air exhaust and monitoring channel (4) and the factory air exhaust pipeline (6) are arranged at the lower part of the other side of the server cabinet.
7. The cabinet system for wafer inspection according to claim 2, wherein:
a plurality of power distribution units are arranged in the server cabinet, the power distribution units are powered by a power supply and distribution box (7), and a total voltage and current detection unit is arranged in the power supply and distribution box (7).
8. The cabinet system for wafer inspection according to claim 2, wherein:
one side surface of a cabinet shell (1) of the server cabinet adopts a transparent glass panel to replace a pore plate structure, so that noise reduction and observation are facilitated.
9. The cabinet system for wafer inspection according to claim 4, wherein:
the flow cross section of the cabinet air inlet (10), the air exhaust and monitoring channel (4) and the air inlet and outlet of the air cabinet (5) is adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410010635.3A CN117529067A (en) | 2024-01-04 | 2024-01-04 | Cabinet system for wafer detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410010635.3A CN117529067A (en) | 2024-01-04 | 2024-01-04 | Cabinet system for wafer detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117529067A true CN117529067A (en) | 2024-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410010635.3A Pending CN117529067A (en) | 2024-01-04 | 2024-01-04 | Cabinet system for wafer detection |
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| Country | Link |
|---|---|
| CN (1) | CN117529067A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009003396A1 (en) * | 2007-07-04 | 2009-01-08 | Huawei Technologies Co., Ltd. | Direct ventilation heat scattering device and control method |
| CN105007707A (en) * | 2015-07-27 | 2015-10-28 | 浙江中烟工业有限责任公司 | Low-power-consumption cloud computing cabinet heat radiation system |
| CN109348684A (en) * | 2018-11-02 | 2019-02-15 | 湖南华质星通装备有限公司 | A kind of energy-efficient information apparatus cabinet and its energy-saving control method |
| CN109379883A (en) * | 2018-12-11 | 2019-02-22 | 东北大学 | Data center's cabinet that a kind of included temperature control device and server are vertically arranged |
| CN109561637A (en) * | 2018-12-11 | 2019-04-02 | 东北大学 | A kind of data center's cabinet and control system based on cooling on demand theory |
| CN215930969U (en) * | 2021-10-08 | 2022-03-01 | 中国电信股份有限公司 | Cooling test system of server |
| CN115604992A (en) * | 2022-10-17 | 2023-01-13 | 日照职业技术学院（Cn） | Adjustable computer network rack |
-
2024
- 2024-01-04 CN CN202410010635.3A patent/CN117529067A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009003396A1 (en) * | 2007-07-04 | 2009-01-08 | Huawei Technologies Co., Ltd. | Direct ventilation heat scattering device and control method |
| CN105007707A (en) * | 2015-07-27 | 2015-10-28 | 浙江中烟工业有限责任公司 | Low-power-consumption cloud computing cabinet heat radiation system |
| CN109348684A (en) * | 2018-11-02 | 2019-02-15 | 湖南华质星通装备有限公司 | A kind of energy-efficient information apparatus cabinet and its energy-saving control method |
| CN109379883A (en) * | 2018-12-11 | 2019-02-22 | 东北大学 | Data center's cabinet that a kind of included temperature control device and server are vertically arranged |
| CN109561637A (en) * | 2018-12-11 | 2019-04-02 | 东北大学 | A kind of data center's cabinet and control system based on cooling on demand theory |
| CN215930969U (en) * | 2021-10-08 | 2022-03-01 | 中国电信股份有限公司 | Cooling test system of server |
| CN115604992A (en) * | 2022-10-17 | 2023-01-13 | 日照职业技术学院（Cn） | Adjustable computer network rack |
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