CN117525234A - Chip and chip transfer method - Google Patents

Abstract

The invention discloses a chip. The chip includes a light-transmitting substrate and an epitaxial layer provided on the light-transmitting substrate. The epitaxial layer is also provided with a first electrode and a second electrode. The first electrode and the second electrode are along the length of the chip. direction, the epitaxial layer is also provided with a reflective layer on other areas except the area where the first electrode and the second electrode are located, the bottom of the light-transmitting substrate is provided with a chamfer, and the chamfer is located on one side in the chip width direction. Make the side of the chip that has the chamfer weigh less than the opposite side. In the embodiment of the present invention, the first side of the chip is set as a reflective layer and the second side is set as a light-transmitting substrate, and by providing chamfers on the chip, the same electrode orientation and the same first side facing upward or the second side are obtained. The upward-facing chip can realize the mixing of LED chips in a simple and efficient way, avoiding the need to sort a huge amount of LED chips and greatly improving the utilization rate of LED chips.

Description

Chips and chip transfer methods

Technical field

The present invention relates to the field of LED display, and in particular, to a chip and a chip transfer method.

Background technique

As indoor display application technology continues to improve, the currently used projection, DLP (Digital Light

Processing, digital light processing), LCD (Liquid Crystal Display, liquid crystal display), PDP (Plasma Display Panel, plasma display panel) and other display application products can no longer fully meet market application needs. There are still some defects in various aspects that prevent it from breaking through the development of technology. LED (Light Emitting Diode, light-emitting diode) full-color display technology overcomes many shortcomings of the above-mentioned products, such as Mini LED (LED display and backlight) and Micro LED, which have become indoor and outdoor displays respectively, such as command centers, outdoor advertising screens, The first choice for conference centers and other occasions, and one of the main development targets for consumer electronic screens.

Generally, due to the limitations of epitaxial growth equipment, technology and chip technology, the wavelength peak distribution of the chip in the LED wafer is wide, up to 10nm. Since the human eye can easily identify wavelength differences in the visible light band, Mini LED and Micro LED displays require the chip's emission wavelength to be distributed in a narrow range to prevent block color differences from appearing and being recognized by the human eye. The so-called block color difference refers to the color within the block, that is, the wavelength is consistent, while there are subtle differences in color between blocks. Existing solutions, such as Mini LED displays, use sorting to select chips according to wavelength and other parameters. There are problems such as huge sorting volume and very low chip utilization. In Micro LED displays, it is even more impossible to sort, and the problem of wide chip emission wavelength distribution is difficult to solve by relying on conventional epitaxial chip processes.

Therefore, how to realize mixed crystals of LED chips to avoid sorting and improve chip utilization has become an important technical issue that technicians in the field need to solve urgently.

Contents of the invention

The purpose of the present invention is to provide a chip and a chip transfer method to solve the existing technology problems of huge mixed crystal sorting volume and very low chip utilization.

In order to achieve the above object, in a first aspect, the present invention provides a chip. The chip includes a light-transmitting substrate and an epitaxial layer provided on the light-transmitting substrate. The epitaxial layer is also provided with a first electrode and The second electrode, the first electrode and the second electrode are arranged along the length direction of the chip, and a reflective layer is also provided on other areas of the epitaxial layer except the area where the first electrode and the second electrode are located, so The bottom of the light-transmitting substrate is provided with a chamfer, and the chamfer is located on one side in the width direction of the chip so that the weight of the side of the chip with the chamfer is smaller than the weight of the opposite side.

Preferably, the chip includes a first surface on which the reflective layer is located and a second surface opposite to the first surface. The second surface is the bottom surface of a light-transmitting substrate, and the first surface is light-sensitive. The reflectivity is greater than the reflectivity of the second surface to light.

Preferably, the light-transmitting substrate is a sapphire substrate or a silicon carbide substrate, and the chamfer extends along the length direction of the chip.

In a second aspect, the present invention also provides a chip transfer method, which includes the following steps: providing a plurality of chips according to the first aspect, and the chips include a first surface on which the reflective layer is located and a surface opposite to the first surface. On the second side, a number of the chips are placed in the solution for mixing; a first screening channel is provided, and an identification device and a removal device are sequentially provided in the length direction of the first screening channel; the solution mixed with the chips is Flows through the first screening channel, and when the identification device recognizes that the chip has a designated orientation, the removal device does not act, and the chip with the designated orientation passes through the first screening channel; when the identification device When it is recognized that the chip does not have a designated orientation, control the action of the removal device to move the chip that does not have a designated orientation out of the first screening channel; determine the first electrode and the third electrode of the chip The electrode orientation of the two electrodes provides a second screening channel, the width of the second screening channel is greater than the width of the chip and less than the length of the chip, and the second screening channel corresponds to the electrode orientation in its length direction. One side in the width direction is shrunk and a notch is formed so that the chips whose chamfers are close to the notch pass through the second screening channel and the chips whose chamfers are far away from the notch are under the action of gravity. Turn over the second screening channel; move the chip passing through the first screening channel to the second screening channel to obtain the chip with the required electrode orientation; move the chip passing through the first screening channel and the third screening channel The chips of the second screening channel are transferred to the transfer carrier plate.

In a third aspect, the present invention also provides a chip transfer method, which includes the following steps: providing a plurality of chips according to the first aspect, the chips including a first surface on which the reflective layer is located and a surface opposite to the first surface. On the second side, several chips are placed in the solution for mixing; the electrode orientations of the first electrode and the second electrode of the chip are determined; a second screening channel is provided, and the width of the second screening channel is Greater than the width of the chip and less than the length of the chip, the second screening channel shrinks in its length direction corresponding to the electrode toward one side in its width direction and forms a gap so that the chamfer is close to the The chip with the notch passes through the second screening channel and the chip with the chamfering away from the notch rolls over and escapes from the second screening channel under the action of gravity; the solution mixed with the chip flows through the second screening channel. Two screening channels are used to obtain chips with the required electrode orientation; a first screening channel is provided, and an identification device and a removal device are sequentially provided in the length direction of the first screening channel; the chips passing through the second screening channel are Moving to the first screening channel, when the identification device recognizes that the chip has a specified orientation, the removal device does not act, and the chip with the specified orientation passes through the first screening channel; when the When the identification device recognizes that the chip does not have a designated orientation, it controls the action of the removal device to move the chip that does not have a designated orientation out of the first screening channel; The chips of the second screening channel are transferred to the transfer carrier plate.

Preferably, the designated orientation is such that the first side of the chip faces away from the first screening channel.

Preferably, the identification device is a photodiode, and the removal device is an air blowing device. The photodiode receives the first reflected light reflected from the first surface of the chip and the second reflected light reflected from the second surface of the chip. The reflected light determines whether the chip has a specified orientation.

Preferably, the identification device is a camera, and the camera determines whether the chip has a specified orientation by acquiring an image of the chip.

Preferably, the transfer carrier plate is disposed on a mobile bearing platform, and the mobile bearing platform drives the transfer carrier plate to move and receive the chips with the required orientation that pass through the first screening channel and the second screening channel. .

Preferably, the transfer carrier plate is provided with a plurality of inverted trapezoidal grooves. The inverted trapezoidal grooves include an upper guide groove and a lower positioning groove. The opening of the guide groove is larger than the opening of the positioning groove. The positioning groove Corresponding to the chip, it is arranged to accommodate the chip passing through the first screening channel and the second screening channel, and after the step of transferring the chip passing through the first screening channel and the second screening channel to the transfer carrier , further comprising: transferring the chip in the inverted trapezoidal groove to a blue film or onto a substrate.

Compared with the existing technology, the embodiment of the present invention sets the first side of the chip as a reflective layer and the second side as a light-transmitting substrate, which can be used to screen chips with the first side facing up or chips with the second side facing up. By arranging chamfers on the chip to screen the electrode orientations of the first electrode and the second electrode, so as to obtain the same electrode orientation and obtain the same first side up or second side up chip, it can be achieved through simple and efficient This method realizes mixed crystal of LED chips, avoids the need for huge amounts of sorting of LED chips, and greatly improves the utilization rate of LED chips.

Description of drawings

Figure 1 is a schematic side structural view of the chip of the present invention.

Figure 2 is a schematic bottom structural diagram of the chip of the present invention.

Figure 3 is a schematic top view of the structure of the chip of the present invention.

Figure 4 is a schematic diagram of the chip of the present invention passing through the first screening channel.

Figure 5 is a schematic diagram of the chip of the present invention passing through the second screening channel.

Figure 6 is a schematic structural diagram of the docking of the chip of the present invention with the transfer carrier plate provided on the carrier platform.

Figure 7 is a schematic structural diagram of the chip of the present invention after docking with the transfer carrier board.

Figure 8 is a schematic structural diagram of the chip of the present invention after being transferred to the blue film.

Detailed ways

In order to describe in detail the technical content, structural features, and achieved effects of the present invention, the following is a detailed description in combination with the embodiments and the accompanying drawings.

Embodiment 1

As shown in Figures 1 to 3, an embodiment of the present invention provides a chip 10. The chip 10 includes a light-transmitting substrate 1 and an epitaxial layer 2 provided on the light-transmitting substrate 1. The epitaxial layer 2 is also provided with a first The electrode 31 and the second electrode 32 are arranged along the length direction a of the chip 10 . The epitaxial layer 2 is also provided in other areas except the area where the first electrode 31 and the second electrode 32 are located. There is a reflective layer 20, and the bottom of the light-transmitting substrate 1 is provided with a chamfer 11, and the chamfer 11 is located on one side of the chip 10 in the width direction b, so that the weight of the side of the chip 10 with the chamfer 11 is smaller than the opposite side. the weight of.

Specifically, the chip 10 is an LED chip, and the chamfer 11 extends along the length direction a of the chip 10. The chamfer 11 is formed by laser cutting. The setting of the chamfer 11 can enable the chip 10 to turn sideways toward the other side due to the action of gravity. In the embodiment of the present invention, by setting the first surface 101 of the chip 10 as the reflective layer 20 and the second surface 102 as the light-transmitting substrate 1, it can be used to screen the chips 10 with the first surface 101 facing upward or the second surface 102 facing upward. The chip 10 is provided with a chamfer 11 on the chip 10 to screen the electrode orientations of the first electrode 31 and the second electrode 32, thereby obtaining the same electrode orientation and the same first surface 101 facing upward or the second surface 102 facing upward. The chip 10 on the LED chip 10 can realize the mixed crystal of the LED chip 10 in a simple and efficient manner, without the need to sort a huge amount of LED chips 10, which greatly improves the utilization rate of the LED chip 10.

It should be noted that in some other implementations of the embodiments of the present invention, the chamfer 11 can also be formed by other cutting methods. The specific cutting method is not limited here, as long as the chamfer 11 can be formed.

In the embodiment of the present invention, the chip 10 includes a first surface 101 on which the reflective layer is located and a second surface 102 opposite to the first surface 101. The second surface 102 is the bottom surface of the light-transmitting substrate 1, and the first surface 101 is opposite to the light. The reflectivity is greater than the reflectivity of the second surface 102 to light. Specifically, the light-transmitting substrate 1 is a sapphire substrate, and the chip 10 includes a first surface 101 on which the reflective layer 20 is located and a second surface 102 opposite to the first surface 101. , the reflective layer 20 is a Bragg reflective layer, and the reflective layer 20 is a reflective film made of insulating material with high reflectivity. The reflectivity of the reflective layer 20 to light is greater than 90%, and the reflectivity of the light-transmitting substrate 1 is less than or Equal to 30%, the reflective layer 20 can improve the reflective ability of the first surface 101 of the chip 10 on the one hand, and can effectively protect the chip 10 on the other hand. At the same time, the light reflectivity of the reflective layer 20 and the light-transmitting substrate 1 is quite different. , photoelectric identification can be implemented subsequently.

It should be noted that in other implementations of the embodiments of the present invention, the light-transmitting substrate 1 can also be other light-transmitting substrates such as silicon carbide, which is not limited here.

Embodiment 2

As shown in Figures 1 to 8, an embodiment of the present invention also provides a method for transferring the chip 10, which includes the following steps:

S1. Provide a plurality of the above-mentioned chips 10. The chip 10 includes a first surface 101 where the reflective layer 20 is located and a second surface 102 opposite to the first surface 101. Place several chips 10 in a solution for mixing; specifically, mix the electrical properties of the chips 10. The qualified chip 10 is placed in a solution and thoroughly mixed, for example, by stirring. The solution includes organic solvents and/or fluxes, where the organic solvents include pure water, ethanol, acetone, and isopropyl alcohol. A mixture of one or more solvents, and the solvent will not cause damage to the LED chip 10, such as corroding the LED chip 10 or causing a short circuit to the LED chip 10. The solvent is a volatile solvent to improve the mixed crystal efficiency, In order to solve the problem of poor correction caused by concentration of brightness and electrical properties of the chip 10 after solidification.

S2. Provide a first screening channel 4. An identification device 5 and a removal device 6 are provided in the length direction of the first screening channel 4. The identification device 5 is used to identify whether the chip 10 has a specified orientation; specifically, the first screening channel The width of 4 is greater than the width of chip 10 and less than the length of chip 10. Preferably, the width of first screening channel 4 is slightly greater than the width of chip 10. By setting the width of first screening channel 4, the chip 10 is aligned with the first screen in its length direction. Only when the length direction a of the screening channel 4 is consistent can the first screening channel 4 be entered, thereby screening out the chips 10 whose length direction a is consistent with the length direction a of the first screening channel 4 . Of course, in some other embodiments, the width of the first screening channel 4 may also be greater than the length of the chip 10 .

S3. Flow the solution mixed with the chip 10 through the first screening channel 4. When the identification device 5 recognizes that the chip 10 has a designated orientation, the removal device 5 does not act, and the chip 10 with the designated orientation passes through the first screening channel 4; When the identification device 5 recognizes that the chip 10 does not have the designated orientation, it controls the removal device 5 to move the chip 10 that does not have the designated orientation out of the first screening channel 4; specifically, after the chip 10 flows onto the first screening channel 4 , there are two orientation situations of the chip 10 , one is the situation where the first surface 101 of the chip 10 is facing upward (that is, the situation where the first surface 101 of the chip 10 is away from the first screening channel 4 ), and the other is the situation where the chip 10 is facing upward. The second surface 102 of the chip 10 faces upward (that is, the first surface 101 of the chip 10 faces the first screening channel 4). Therefore, the identification device 5 needs to identify the chip 10 with a specified orientation. For example, the present invention implements In this example, the specified direction is the direction in which the first surface 101 of the chip 101 faces away from the first screening channel 4. Therefore, the identification device 5 needs to screen and identify the direction in which the first surface 101 of the chip 10 faces away from the first screening channel 4. Chip 10.

S4. Determine the electrode orientations of the first electrode 31 and the second electrode 32 of the chip 10; specifically, as shown in FIG. 3, the first electrode 31 and the second electrode 32 are N-type electrodes and P-type electrodes respectively. Determine the electrode orientation of the chip 10. The required electrode orientation is to determine whether the first electrode 31 faces forward or the second electrode 32 faces forward. The front here refers to the transmission direction of the first screening channel 4. For example, in the embodiment of the present invention, it is necessary to screen the first electrode 31 facing forward. The front, second electrode 32 faces the rear chip 10 .

S5. Provide a second screening channel 7. The width of the second screening channel 7 is greater than the width of the chip 10 and less than the length of the chip 10. The corresponding electrode of the second screening channel 7 in its length direction shrinks toward one side in its width direction and The notch 71 is formed so that the chips 10 with the chamfer 11 close to the notch 71 pass through the second screening channel 7 and the chips 10 with the chamfer 11 far away from the notch 71 roll over and escape from the second screening channel 7 under the action of gravity; specifically, as shown in Figure 5 shows that the width of the second screening channel 7 is larger than the width of the chip 10 and smaller than the length of the chip 10. It is preferred that the width of the second screening channel 7 is slightly larger than the width of the chip 10. By setting the width of the second screening channel 7, the chip 10 is The second screening channel 7 can be entered only when its length direction is consistent with the length direction of the second screening channel 7 , thereby screening out chips 10 whose length direction is consistent with the length direction of the second screening channel 7 . At this time, even if the width of the first screening channel 4 is greater than the length of the chip 10 , the chips 10 whose required length direction is consistent with the length direction of the second screening channel 7 can be screened out through the second screening channel 7 . Connected to the first screening channel 4, due to the chamfer 11 provided on the chip 10 and the required electrode direction is determined, for example, it is necessary to screen the chip 10 with the first electrode 31 facing the front and the second electrode 32 facing the rear. Therefore, it is necessary to The chip 10 with the second electrode 32 facing the front and the first electrode 31 facing the rear is removed. Therefore, corresponding to the electrode orientation and the chamfer 11 of the chip 10 , one side of the second screening channel 7 in the width direction b is contracted and a notch is formed. 71 so that the chip 10 with the chamfer 11 away from the notch 71 is turned sideways out of the second screening channel 7 and into the mixed solution. As shown in the chip state 11e in Figure 5, when the chip 10 in this state passes through the second screening channel 7, the channel gap 71 does not affect the chip 10. At this time, the chip 10 can normally pass through the second screening channel 7 and enter the lower level. One-step process, as shown in the chip state 11f in Figure 5, when the chip 10 passes through the second screening channel 7 in this state, because there is a gap 71 in the channel, when the chip 10 passes through the gap 71, it will break away from the second screening channel 7 and enter the mixing again. liquid.

S6. Move the chip 10 that has passed through the first screening channel 4 to the second screening channel 7 to obtain the chip with the required electrode orientation.

S7. Transfer the chips 101 that have passed through the first screening channel 4 and the second screening channel 7 to the transfer carrier plate 9 . Specifically, the required chips 10 after screening can be collected and arranged through the transfer carrier plate 9 for subsequent transfer or welding processes.

The embodiment of the present invention uses an identification device to identify the chip 10 with a specified orientation, and by setting the chamfer 11 on the chip 10 and setting it in conjunction with the notch 71 of the second screening channel 7, the electrode orientation of the chip 10 can be screened, which is achieved in a simple and efficient manner. The mixed crystal of LED chips 10 avoids the need to sort LED chips 10 in huge quantities and greatly improves the utilization rate of LED chips 10 .

In the embodiment of the present invention, the identification device 5 determines whether the chip 10 has a specified orientation by receiving light of different intensities reflected by the reflective layer 20 and the light-transmitting substrate 1. Since the first surface 101 of the chip 10 is the reflective layer 20, the second surface 101 of the chip 10 is the reflective layer 20. The surface 102 is a light-transmitting substrate, and the reflective layer 20 and the light-transmitting substrate 1 have different reflectivities for light. For example, the specified orientation of the embodiment of the present invention is that the first surface 101 of the chip faces away from the first screening channel. 4, the identification device 5 continuously identifies the chip 10 passing through the identification device 5. As shown in the chip state 11d in Figure 4, when the identification device 5 receives the reflected light from the first surface 101 of the chip 10, the identification device 5 does not act. , the chip 10 passes through the first screening channel 4 and enters the next step; as shown in the chip state 11c in Figure 4, when the identification device 5 receives the reflected light from the second surface 102 of the chip 10, the identification device 5 emits a signal to Control the action of the removal device 6 to move the chip 10 out of the first screening channel 4 and enter the mixed solution for circulation;

Specifically, as shown in Figure 4, the identification device 5 is a photodiode, and the removal device 6 is an air blowing device. The photodiode receives the first reflected light reflected by the first surface 101 of the chip 10 and the first reflected light reflected by the second surface 102 of the chip 10. The second reflected light determines whether the chip 10 has a specified orientation. The intensity of the first reflected light is greater than the intensity of the second reflected light. When the identification device 5 receives the second reflected light, the identification device 5 feeds back a first signal for controlling the movement. The removal device 6 blows air to blow the chip 10 away from the first screening channel 4. When the identification device 5 receives the first reflected light, the identification device 5 does not feedback the signal, the removal device 6 does not start, and the chip 10 passes through the first screening passage. 4. Specifically, the first signal can be a voltage signal or a current signal. The removal device 6 includes a blowing hole 61 provided on the first screening channel 4. When the identification device 5 feeds back the first signal, the chip 10 moves through the blowing hole 61. The removal device 6 blows air through the blowing hole 61 to blow the chip 10 away from the first screening channel 4. When the identification device 5 receives the first reflected light, the chip 10 can pass through the first screening channel 4 normally and enter the next process.

It should be noted that the position of the blowing hole 61 is not limited, as long as it can blow the chip 10 out of the first screening channel 4 , in addition, the removal device 6 is not limited to the blowing method, as long as it can blow out the chip 10 that does not meet the requirements. The chip 10 can be moved out of the first screening channel 4 in any manner, for example, a robot structure can be selected.

In some other implementations of the embodiment of the present invention, the identification device 5 may also be a camera, which determines whether the chip 10 has a specified orientation by acquiring an image of the chip 10 . Specifically, the identification device 5 continuously takes images of the chip 10 passing through the identification device 5 and determines whether the chip 10 has a designated orientation. For example, the designated orientation in the embodiment of the present invention is that the first side 101 of the chip deviates from the first screening. In the direction of the channel 4, when the recognition device 5 recognizes that the first side 101 of the chip 10 is away from the first screening channel 4, the recognition device 5 does not act, and the chip 10 passes through the first screening channel 4 and enters the next step; as shown in the figure As shown in the chip state 11c in 4, when the recognition device 5 recognizes that the first surface 101 of the chip 10 is facing the first screening channel 4, the recognition device 5 controls the action of the removal device 6 by transmitting a signal to remove the chip 10. The first screen channel 4 and enters the mixed solution for circulation.

In the embodiment of the present invention, the transfer carrier plate 9 is disposed on the movable bearing platform 8, and the movable bearing platform 8 is used to drive the transfer carrier plate 9 to move and receive all the materials with the properties transmitted through the first screening channel 4 and the second screening channel 7. The chip 10 needs to be oriented. Specifically, the required chips 10 after screening can be collected and arranged through the transfer carrier plate 9 for subsequent transfer or welding processes.

As shown in Figure 6, in the embodiment of the present invention, the transfer carrier plate 9 is provided with a number of inverted trapezoidal grooves 90. The inverted trapezoidal grooves 90 include an upper guide groove 91 and a lower positioning groove 92. The opening of the guide groove 91 is larger than the positioning groove. 92 opening, the positioning groove 92 is provided corresponding to the chip 10 to accommodate the chip 10 transmitted on the second screening channel 7. Specifically, the inverted trapezoidal grooves 90 are evenly distributed on the transfer carrier plate 9, and the guide groove 91 is provided with a first groove Wall 911, the first groove wall 911 is arranged vertically, the positioning groove 92 is provided with a second groove wall 921, the second groove wall 921 is inclined, and the second groove wall 921 is matched with the chamfer 11, the first groove wall 911 and A step surface 93 is formed between the second groove walls 921 . By configuring the guide groove 91 to include the vertically disposed first groove wall 911, the range of the guide groove 91 receiving the chip 10 can be larger, and the requirements for the design accuracy of the inverted trapezoidal groove 90 and the movement accuracy of the mobile carrying platform 8 are lower. Conducive to practical use.

In the embodiment of the present invention, the carrying platform 8 is moved at a fixed distance in a two-dimensional plane to receive the chips 10 with the required orientation transmitted through the second screening channel 7, and the chips 10 are vibrated to fall into position. in slot 92. Specifically, the inverted trapezoidal grooves 90 can be distributed in a matrix of multiple rows and columns on the transfer carrier plate 9, and the mobile carrier platform 8 moves at a fixed distance to receive the chips 10 transmitted on the second screening channel 7. The spacing can correspond to the distance between the centers of two adjacent inverted trapezoidal grooves 90 , and the chips 10 can all fall into the positioning grooves 92 through vibration to keep the electrode heights of the chips 10 consistent.

In the embodiment of the present invention, in step S6, the chip 101 that has passed through the first screening channel 4 and the second screening channel 7 is transferred to the transfer carrier 9. After that, it also includes:

S7. Transfer the chip 10 in the inverted trapezoidal groove 90 to the blue film 100 or to the substrate. Specifically, the depth of the inverted trapezoidal groove 90 is the same as or slightly lower than the height of the LED chip 10 . After a certain number of chips 10 are arranged, the chips 10 can be transferred to the blue film 100 or to the substrate for processing. welding.

The transfer method of the chip 10 in the embodiment of the present invention solves the problem of mixed crystals of the chip 10 through two screening methods: structural design of the chip 10 and matching, while quickly transferring the chip 10 to the blue film 100 or the substrate while maintaining the orientation of the electrodes of the chip 10 Highly consistent and very cleverly designed.

Embodiment 3

The difference between this embodiment and the second embodiment is that in this embodiment, the solution mixed with the chips 10 first flows through the second screening channel 7 to screen the chips 10 with the required electrode orientation, and then the chips 10 that have passed through the second screening channel 7 are 10 moves to the first screening channel 4 to screen the chips 10 with the specified orientation. The specific implementation is as follows.

An embodiment of the present invention also provides a method for transferring the chip 10, which includes the following steps:

S10. Provide a plurality of the above-mentioned chips 10. The chip 10 includes a first surface 101 where the reflective layer 20 is located and a second surface 102 opposite to the first surface 101. Place several chips 10 in the solution for mixing; specifically, the electrical properties of the chips 10 are mixed. The qualified chip 10 is placed in a solution and thoroughly mixed, for example, by stirring. The solution includes organic solvents and/or fluxes, where the organic solvents include pure water, ethanol, acetone, and isopropyl alcohol. A mixture of one or more solvents, and the solvent will not cause damage to the LED chip 10, such as corroding the LED chip 10 or causing a short circuit to the LED chip 10. The solvent is a volatile solvent to improve the mixed crystal efficiency, In order to solve the problem of poor correction caused by concentration of brightness and electrical properties of the chip 10 after solidification.

S20. Determine the electrode orientations of the first electrode 31 and the second electrode 32 of the chip 10; specifically, as shown in FIG. 3, the first electrode 31 and the second electrode 32 are N-type electrodes and P-type electrodes respectively. Determine the electrode orientation of the chip 10. The required electrode orientation is to determine whether the first electrode 31 faces the front or the second electrode 32 faces the front. The front here refers to the transmission direction of the first screening channel 4 and the second screening channel 7. For example, it is required in the embodiment of the present invention. The chips 10 whose first electrode 31 faces forward and whose second electrode 32 faces rear are screened.

S30. Provide a second screening channel 7. The width of the second screening channel 7 is greater than the width of the chip 10 and smaller than the length of the chip 10. The corresponding electrode of the second screening channel 7 in its length direction shrinks toward one side in its width direction and The notch 71 is formed so that the chips 10 with the chamfer 11 close to the notch 71 pass through the second screening channel 7 and the chips 10 with the chamfer 11 far away from the notch 71 roll over and escape from the second screening channel 7 under the action of gravity; specifically, as shown in Figure 5 shows that the width of the second screening channel 7 is larger than the width of the chip 10 and smaller than the length of the chip 10. It is preferred that the width of the second screening channel 7 is slightly larger than the width of the chip 10. By setting the width of the second screening channel 7, the chip 10 is Only when the length direction is consistent with the length direction of the second screening channel 7 can the second screening channel 7 be entered, thereby screening out the chips 10 whose length direction is consistent with the length direction of the screening channel. Since the chamfer 11 is provided on the chip 10 and the required electrode direction is determined, for example, it is necessary to screen the chip 10 with the first electrode 31 facing the front and the second electrode 32 facing the rear. Therefore, the second electrode 32 needs to face the front and the rear. The first electrode 31 is removed toward the rear chip 10. Therefore, corresponding to the electrode orientation and the chamfer 11 of the chip 10, one side of the second screening channel 7 in the width direction b is shrunk and a notch 71 is formed to keep the chamfer 11 away from the notch. The chip 10 at 71 is turned sideways out of the second screening channel 7 and enters the mixed solution. As shown in the chip state 11e in Figure 5, when the chip 10 in this state passes through the second screening channel 7, the channel gap 71 does not affect the chip 10. At this time, the chip 10 can normally pass through the second screening channel 7 and enter the lower level. One-step process, as shown in the chip state 11f in Figure 5, when the chip 10 passes through the second screening channel 7 in this state, because there is a gap 71 in the channel, when the chip 10 passes through the gap 71, it will break away from the second screening channel 7 and enter the mixing again. liquid.

S40. Flow the solution mixed with the chip 10 through the second screening channel 7 to obtain the chip with the desired electrode orientation.

S50. Provide a first screening channel 4. An identification device 5 and a removal device 6 are provided in the length direction of the first screening channel 4. The identification device 5 is used to identify whether the chip 10 has a specified orientation; specifically, the first screening channel The width of 4 is greater than the width of chip 10 and less than the length of chip 10. Preferably, the width of first screening channel 4 is slightly greater than the width of chip 10. By setting the width of first screening channel 4, the length direction of chip 10 is consistent with the first screening Only when the length direction a of the channel 4 is consistent can the first screening channel 4 be entered, thereby screening out the chips 10 whose length direction is consistent with the length direction a of the first screening channel 4 .

S60. Move the chips 10 that have passed through the second screening channel 7 to the first screening channel 4. When the identification device 5 recognizes that the chip 10 has a specified orientation, the removal device 5 does not act, and the chip 10 with the specified orientation passes through the first screening channel 4. A screening channel 4; when the identification device 5 recognizes that the chip 10 does not have a designated orientation, the removal device 5 is controlled to move the chip 10 that does not have a designated orientation out of the first screening channel 4; specifically, the chip 10 flows to the first After being placed on the screening channel 4, there will be two orientation situations of the chip 10. One is the situation where the first surface 101 of the chip 10 faces upward (that is, the situation where the first surface 101 of the chip 10 is away from the first screening channel 4), and the other is the situation where the first surface 101 of the chip 10 faces upward. One is the case where the second surface 102 of the chip 10 faces upward (that is, the first surface 101 of the chip 10 faces the first screening channel 4). Therefore, the identification device 5 needs to identify the chip 10 with a specified orientation. For example, in the embodiment of the present invention, the specified direction is the direction in which the first side 101 of the chip 101 deviates from the first screening channel 4. Therefore, the identification device 5 needs to screen and identify the first side 101 of the chip 10 deviating from the first screening channel 4. A chip 10 screening channel 4.

S70. Transfer the chips 101 that have passed through the first screening channel 4 and the second screening channel 7 to the transfer carrier plate 9. Specifically, the required chips 10 after screening can be collected and arranged through the transfer carrier plate 9 for subsequent transfer or welding processes.

The transfer method of the chip 10 in the embodiment of the present invention also solves the problem of mixed crystals of the chip 10 through the structural design of the chip 10 and the matching of two screening methods, while quickly transferring the chip 10 to the blue film 100 or the substrate while maintaining the electrode orientation of the chip 10 The height is consistent and the design is very clever.

The above disclosures are only preferred examples of the present invention. Of course, they cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made based on the patent scope of the present invention still fall within the scope of the present invention.

Claims (10)

1. The chip is characterized by comprising a light-transmitting substrate and an epitaxial layer arranged on the light-transmitting substrate, wherein a first electrode and a second electrode are further arranged on the epitaxial layer, the first electrode and the second electrode are arranged along the length direction of the chip, a reflecting layer is further arranged on other areas of the epitaxial layer except for the areas where the first electrode and the second electrode are located, a chamfer is arranged at the bottom of the light-transmitting substrate, and the chamfer is located on one side of the width direction of the chip so that the weight of one side of the chip with the chamfer is smaller than that of the other opposite side.

2. The chip of claim 1, wherein the chip comprises a first side on which the reflective layer is disposed and a second side opposite the first side, the second side being a bottom surface of the light-transmissive substrate, the first side having a reflectivity to light that is greater than a reflectivity to light of the second side.

3. The chip of claim 1, wherein the light-transmitting substrate is a sapphire substrate or a silicon carbide substrate, and the chamfer extends along a length direction of the chip.

4. The chip transferring method is characterized by comprising the following steps:

providing a plurality of chips according to any one of claims 1 to 3, wherein the chips comprise a first surface on which the reflecting layer is arranged and a second surface opposite to the first surface, and placing the plurality of chips in a solution for mixing;

providing a first screening channel, wherein an identification device and a removal device are sequentially arranged in the length direction of the first screening channel;

flowing the solution mixed with the chip through a first screening channel, wherein when the identification device identifies that the chip has a designated orientation, the removal device is not operated, and the chip with the designated orientation passes through the first screening channel; when the identification device identifies that the chip does not have the designated orientation, controlling the removal device to act so as to remove the chip which does not have the designated orientation from the first screening channel;

determining electrode orientations of the first and second electrodes of the chip;

providing a second screening channel, wherein the width of the second screening channel is larger than the width of the chip and smaller than the length of the chip, the second screening channel is contracted towards one side in the width direction of the electrode in the length direction of the second screening channel, and a notch is formed so that the chip, the chamfer of which is close to the notch, passes through the second screening channel, and the chip, the chamfer of which is far from the notch, is laterally turned over and separated from the second screening channel under the action of gravity;

moving the chip passing through the first screening channel to the second screening channel to obtain a chip with a required electrode orientation;

and transferring the chips passing through the first screening channel and the second screening channel onto a transfer carrier plate.

5. The chip transferring method is characterized by comprising the following steps:

providing a plurality of chips according to any one of claims 1 to 3, wherein the chips comprise a first surface on which the reflecting layer is arranged and a second surface opposite to the first surface, and placing the plurality of chips in a solution for mixing;

determining electrode orientations of the first and second electrodes of the chip;

providing a second screening channel, wherein the width of the second screening channel is larger than the width of the chip and smaller than the length of the chip, the second screening channel is contracted towards one side in the width direction of the electrode in the length direction of the second screening channel, and a notch is formed so that the chip, the chamfer of which is close to the notch, passes through the second screening channel, and the chip, the chamfer of which is far from the notch, is laterally turned over and separated from the second screening channel under the action of gravity;

flowing the solution mixed with the chip through a second screening channel to obtain a chip with a required electrode orientation;

providing a first screening channel, wherein an identification device and a removal device are sequentially arranged in the length direction of the first screening channel;

moving the chip passing through the second screening channel to the first screening channel, wherein when the identification device identifies that the chip has a designated orientation, the removal device does not act, and the chip with the designated orientation passes through the first screening channel; when the identification device identifies that the chip does not have the designated orientation, controlling the removal device to act so as to remove the chip which does not have the designated orientation from the first screening channel;

and transferring the chips passing through the first screening channel and the second screening channel onto a transfer carrier plate.

6. The method of transferring chips of claim 4 or 5, wherein said designated orientation is such that a first side of said chip faces away from said first screening channel.

7. The method according to claim 4 or 5, wherein the identifying means is a photodiode, and the removing means is an air blowing means, and the photodiode judges whether the chip has a specified orientation by receiving a first reflected light reflected from a first face of the chip and a second reflected light reflected from a second face of the chip.

8. The method according to claim 4 or 5, wherein the recognition means is a camera that judges whether the chip has a specified orientation by acquiring an image of the chip.

9. The method of claim 4 or 5, wherein the transfer carrier is disposed on a moving carrier, and the moving carrier drives the transfer carrier to move and receive the chips having the desired orientation passing through the first screening channel and the second screening channel.

10. The method of transferring chips as defined in claim 9, wherein the transferring carrier is provided with a plurality of inverted trapezoidal grooves, the inverted trapezoidal grooves include an upper guide groove and a lower positioning groove, the guide groove has an opening larger than that of the positioning groove, the positioning groove is provided corresponding to the chips to accommodate the chips passing through the first screening channel and the second screening channel, and after the step of transferring the chips passing through the first screening channel and the second screening channel onto the transferring carrier, the method further comprises:

and transferring the chip in the inverted trapezoid groove to a blue film or a substrate.