CN117518598A - Backlight module, manufacturing method thereof and display device - Google Patents

Backlight module, manufacturing method thereof and display device Download PDF

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Publication number
CN117518598A
CN117518598A CN202310520958.2A CN202310520958A CN117518598A CN 117518598 A CN117518598 A CN 117518598A CN 202310520958 A CN202310520958 A CN 202310520958A CN 117518598 A CN117518598 A CN 117518598A
Authority
CN
China
Prior art keywords
back plate
light emitting
backlight module
circuit board
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310520958.2A
Other languages
Chinese (zh)
Inventor
刘乐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou China Star Optoelectronics Technology Co Ltd
Original Assignee
Suzhou China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou China Star Optoelectronics Technology Co Ltd filed Critical Suzhou China Star Optoelectronics Technology Co Ltd
Priority to CN202310520958.2A priority Critical patent/CN117518598A/en
Publication of CN117518598A publication Critical patent/CN117518598A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a backlight module, a manufacturing method thereof and a display device. The backlight module comprises a back plate, a luminous piece and a circuit board; the luminous piece is arranged on the backboard; the circuit board is arranged on one side of the backboard provided with the light emitting piece, a light outlet is arranged in the circuit board, and the light outlet is aligned with the light emitting piece; the heat conductivity coefficient of the backboard is larger than that of the circuit board. According to the invention, the luminous piece is arranged on the backboard, and the heat conductivity coefficient of the backboard is larger than that of the circuit board, so that the heat emitted by the luminous piece can be more rapidly dissipated, the phenomenon that the luminous piece fails at high temperature is avoided, and the yield and stability of the luminous piece are improved; in addition, because the light emitting piece is located on the backboard and corresponds to the light outlet of the circuit board, the alignment and the installation of the backboard and the circuit board are facilitated, the distance between the backboard and the circuit board is reduced, and the light emitting piece is located in the light outlet of the circuit board, so that the thickness of the backlight module can be reduced, and the light and thin backlight module is realized.

Description

Backlight module, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to a backlight module, a manufacturing method thereof and a display device.
Background
Mini LEDs are also called sub-millimeter light emitting diodes, and have a chip size below 200 um. The LED display has the advantages of flexibility, low power consumption, high brightness, high dynamic contrast, narrow frame and the like, and is favored by most manufacturers.
In the prior art, mini LEDs are used as backlight sources of liquid crystal display devices, so that ultra-thin and multi-region control can be realized, which can be compared with organic light-emitting diode (OLED) display devices in terms of display effect, and compared with OLED display devices, the cost of the Mini LEDs is lower.
At present, an LED chip is often welded on a lamp panel, and then the lamp panel is fixed on a backboard; however, the heat conductivity coefficient of the material of the lamp panel is low, so that the LED chip cannot effectively dissipate heat, and a phenomenon of high-temperature failure is easy to occur.
Disclosure of Invention
The embodiment of the invention provides a backlight module, a manufacturing method thereof and a display device, which can improve the heat dissipation effect of a luminous element and avoid the phenomenon of high-temperature failure of the luminous element.
The embodiment of the invention provides a backlight module, which comprises:
a back plate;
the luminous piece is arranged on the backboard;
the circuit board is arranged on one side of the back plate, provided with the light emitting piece, and is internally provided with a light outlet which is aligned with the light emitting piece;
the heat conductivity coefficient of the backboard is larger than that of the circuit board.
In one embodiment of the present invention, a circuit unit is disposed on the circuit board, and the circuit unit is connected to the light emitting element.
In one embodiment of the present invention, the light emitting element is fixedly connected to the back plate near one side of the back plate, and the light emitting element further includes an electrode element, and the electrode element is connected to the circuit unit.
In an embodiment of the invention, the backlight module further includes a connection member, the electrode member is located at a side of the light emitting member away from the back plate, and the connection member is connected between the electrode member and the circuit unit.
In an embodiment of the present invention, the width of the opening on the side of the light outlet away from the back plate is greater than the width of the opening on the side of the light outlet close to the back plate, and the width of the opening is the width of the light outlet along the direction parallel to the back plate.
In one embodiment of the present invention, the opening width of the light outlet gradually increases in a direction along the back plate pointing to the circuit board.
In one embodiment of the present invention, the front projection of the light emitting element on the back plate is located in the front projection of the light outlet on the back plate.
In an embodiment of the invention, the backlight module further includes a packaging adhesive, and the packaging adhesive is filled in the light outlet and covers the light emitting element.
According to the above object of the present invention, the embodiment of the present invention further provides a method for manufacturing a backlight module, which includes the following steps:
forming a light emitting member on the back plate;
forming a light outlet on a circuit board, wherein the heat conductivity coefficient of the back plate is larger than that of the circuit board;
and the circuit board is assembled on one side of the back plate, which is provided with the luminous piece, and the light outlet and the luminous piece are arranged in an alignment way.
According to the above object of the present invention, an embodiment of the present invention further provides a display device, where the display device includes a display panel, and the backlight module or the backlight module manufactured by the manufacturing method of the backlight module, and the display panel is disposed on a light emitting side of the backlight module.
The invention has the beneficial effects that: according to the invention, the luminous piece is arranged on the backboard, and the heat conductivity coefficient of the backboard is larger than that of the circuit board, so that the heat emitted by the luminous piece can be more rapidly dissipated, the heat dissipation effect of the luminous piece is improved, the phenomenon that the luminous piece fails at high temperature is avoided, and the yield and stability of the luminous piece are improved; in addition, because the light emitting piece is located on the backboard and corresponds to the light outlet of the circuit board, the alignment and the installation of the backboard and the circuit board are facilitated, the distance between the backboard and the circuit board is reduced, and the light emitting piece is located in the light outlet of the circuit board, so that the thickness of the backlight module can be reduced, and the light and thin backlight module is realized.
Drawings
The technical solution and other advantageous effects of the present invention will be made apparent by the following detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a backlight module provided in the related art;
fig. 2 is a schematic structural diagram of a backlight module according to an embodiment of the present invention;
FIG. 3 is a flowchart of a method for manufacturing a backlight module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Referring to fig. 1, in the related art, a backlight module includes a back plate 1, a lamp panel 2 disposed on the back plate 1, an LED chip 3 disposed on the lamp panel 2, and a glue layer 4 covering the LED chip 3, wherein the LED chip 3 is welded on the lamp panel 2 and can be connected with a circuit on the lamp panel 2 to realize light emission of the LED chip 3. However, since the lamp panel 2 is generally made of a resin material, the heat conductivity coefficient of the lamp panel is low, and when the LED chip 3 generates heat, the heat cannot be dissipated through the lamp panel 2 in time, so that the heat is concentrated in the LED chip 3, the LED chip 3 is easy to fail at a high temperature, and the lamp panel 2 is easy to deform due to uneven heat dissipation of the lamp panel 2.
Referring to fig. 2, an embodiment of the invention provides a backlight module, which includes a back plate 10, a light emitting member 20, and a circuit board 30.
Wherein the light emitting element 20 is disposed on the back plate 10; the circuit board 30 is disposed on the side of the back plate 10 provided with the light emitting element 20, and the circuit board 30 is provided with a light outlet 301, wherein the light outlet 301 is aligned with the light emitting element 20.
Further, the heat conductivity of the back plate 10 is greater than that of the circuit board 30.
In the implementation and application process, the light-emitting piece 20 is arranged on the back plate 10, and the heat conductivity coefficient of the back plate 10 is larger than that of the circuit board 30, so that the heat emitted by the light-emitting piece 20 can be rapidly dissipated, the heat dissipation effect of the light-emitting piece 20 is improved, the phenomenon that the light-emitting piece 20 fails at a high temperature is avoided, and the yield and stability of the light-emitting piece 20 are improved; in addition, since the light emitting element 20 is located on the back plate 10 and is disposed corresponding to the light outlet 301 of the circuit board 30, the alignment and installation of the back plate 10 and the circuit board 30 are facilitated, so that the distance between the back plate 10 and the circuit board 30 is reduced, and the light emitting element 20 is located in the light outlet 301 of the circuit board 30, so that the thickness of the backlight module can be reduced, and the light and thin backlight module can be realized.
Specifically, referring to fig. 2, the backlight module provided in the embodiment of the invention includes a back plate 10, a light emitting member 20, a circuit board 30, and an optical film 60.
The number of the light emitting elements 20 may be plural, and the plural light emitting elements 20 may be arranged in an array or discretely arranged on the back plate 10.
In one embodiment, the side of the light emitting element 20 near the back plate 10 is fixedly connected to the back plate 10, for example, the light emitting element 20 may be soldered to the back plate 10 by soldering.
The circuit board 30 is arranged on one side of the back plate 10 provided with the light emitting piece 20, and a light outlet 301 is arranged in the circuit board 30, and the light outlet 301 is arranged in alignment with the light emitting piece 20; correspondingly, the number of the light outlets 301 is also plural, and the light outlets 301 are disposed in one-to-one correspondence with the light emitting members 20.
It should be noted that the light emitting element 20 may be an LED chip.
In one embodiment, the front projection of each light emitting element 20 on the back plate 10 is located in the front projection of the corresponding light outlet 301 on the back plate 10, so that the circuit board 30 will not affect the light emitting of the light emitting element 20, and the light emitting effect of the light emitting element 20 is improved.
Further, the opening width of the light outlet 301 at the side far from the back plate 10 is larger than the opening width of the light outlet 301 at the side close to the back plate 10, and the opening width is the width of the light outlet 301 along the direction parallel to the back plate 10.
In one embodiment, the opening width of the light outlet 301 is gradually increased in a direction along the back plate 10 toward the wiring board 30; it can be understood that, since the light emitting portion 20 has a divergent shape, the side wall of the light emitting opening 301 is also configured to be divergent in the embodiment of the present invention, so as to match with the light emitting shape of the light emitting portion 20, so as to further improve the light emitting of the light emitting portion 20.
In the embodiment of the invention, the heat conductivity of the back plate 10 is greater than that of the circuit board 30, and the light emitting element 20 is arranged on the back plate 10, so that compared with the prior art, when the light emitting element 20 emits heat, the heat dissipation capability of the back plate 10 is better than that of the circuit board 30, and the heat generated by the light emitting element 20 can be dissipated as soon as possible, so that the occurrence of the phenomenon that the light emitting element 20 fails due to high temperature is avoided, and the stability and the yield of the light emitting element 20 are improved.
Alternatively, the back plate 10 may be a metallic material or other material having a high thermal conductivity.
Further, since the light outlet 301 on the circuit board 30 and the light emitting element 20 need to be aligned, in the assembly process of the circuit board 30 and the back plate 10, alignment assembly can be achieved through alignment of the light outlet 301 and the light emitting element 20, and the alignment assembly process of the back plate 10 and the circuit board 30 is simplified; compared with the prior art that the LED chip is disposed on the upper surface of the lamp panel, in the embodiment of the invention, the light emitting element 20 is disposed in the light emitting opening 301, so that the thickness of the backlight module can be reduced, and the light and thin backlight module can be realized.
In the embodiment of the invention, the circuit board 30 is further provided with a circuit unit, the light emitting element 20 is further provided with an electrode element, the backlight module further comprises a connecting element 40, and the connecting element 40 is connected between the circuit unit and the electrode element to realize signal transmission.
In one embodiment, the electrode member may be disposed on a side of the light emitting member 20 away from the back plate 10, the circuit unit is disposed on a side of the circuit board 30 away from the back plate 10, and the connection member 40 is connected between the electrode member and the circuit unit.
Alternatively, the connector 40 may be a gold wire.
In another embodiment, the electrode member may be disposed on a side of the light emitting member 20 near the back plate 10, the circuit unit is disposed on a side of the circuit board 30 far from the back plate 10, and the connecting member 40 may overlap with the electrode member through the circuit board 30.
In another embodiment, the electrode member may be disposed on a side of the light emitting member 20 near the back plate 10, the circuit unit is disposed on a side of the circuit board 30 near the back plate 10, and the connection member 40 is disposed between the back plate 10 and the circuit board 30 and connected between the electrode member and the circuit unit.
Further, the backlight module further comprises an encapsulation adhesive 50, wherein the encapsulation adhesive 50 is at least filled in the light outlet 301 and covers the light emitting parts 20 positioned in the light outlet 301, so as to play roles in blocking water and oxygen and protecting encapsulation for each light emitting part 20; the encapsulation adhesive 50 may be a transparent adhesive material.
In one embodiment, the side of the encapsulation glue 50 away from the back plate 10 is in a circular arc shape, so that the encapsulation glue 50 is multiplexed into a lens to perform a converging function on the light emitted by the light emitting element 20, so that the light emitted by the light emitting element 20 is deflected to parallel light, and the light emitting effect of the backlight module is improved.
The optical film 60 is disposed on a side of the circuit board 30 away from the back plate 10, i.e. the optical film 60 is located on a light emitting side of the light emitting member 20, where the optical film 60 may include at least one of a diffusion film, a prism film, a brightness enhancement film, etc. to further enhance the light emitting effect of the backlight module.
It should be noted that the back plate 10 has a concave middle and convex periphery, wherein the light emitting element 20, the circuit board 30 and the packaging adhesive 50 are disposed in the concave middle, and the optical film 60 can be disposed on the convex periphery.
On the premise of bearing, in the embodiment of the invention, the luminous element 20 is arranged on the back plate 10, and the heat conductivity coefficient of the back plate 10 is larger than that of the circuit board 30, so that the heat emitted by the luminous element 20 can be more rapidly dissipated, the heat dissipation effect of the luminous element 20 is improved, the phenomenon that the luminous element 20 fails at high temperature is avoided, and the yield and stability of the luminous element 20 are improved; in addition, since the light emitting element 20 is located on the back plate 10 and is disposed corresponding to the light outlet 301 of the circuit board 30, the alignment and installation of the back plate 10 and the circuit board 30 are facilitated, and the light emitting element 20 is located in the light outlet 301 of the circuit board 30, so that the thickness of the backlight module can be reduced, and the light and thin backlight module can be realized.
In addition, the embodiment of the present invention further provides a method for manufacturing a backlight module described in the above embodiment, and referring to fig. 2 and 3, the method for manufacturing a backlight module includes the following steps:
s10, forming a luminous element 20 on the back plate 10.
S20, forming a light outlet 301 on the circuit board 30, wherein the heat conductivity coefficient of the back plate 10 is larger than that of the circuit board 30.
S30, the circuit board 30 is assembled on one side of the back plate 10 provided with the luminous element 20, and the light outlet 301 is aligned with the luminous element 20.
Specifically, in step S10, a plurality of light emitting elements 20 are formed on the back plate 10, and the plurality of light emitting elements 20 may be arranged in an array or in discrete arrangement on the back plate 10.
In one embodiment, the luminescent member 20 may be soldered to the back plate 10.
In one embodiment, the light emitting member 20 may be a flip-chip LED chip, and the light emitting member 20 is provided with an electrode member, and the electrode member is located on a side of the light emitting member 20 away from the back plate 10.
In step S20, a circuit unit and a plurality of light outlets 301 are formed on the circuit board 30, wherein the light outlets 301 are disposed offset from the circuit unit.
In step S30, the circuit board 30 is assembled with the side of the back plate 10 having the light emitting elements 20 in an aligned manner, and one light outlet 301 is aligned with one light emitting element 20.
The circuit board 30 and the back plate 10 may be bonded by an adhesive layer, or may be assembled by a fixing member such as a screw, which is not limited herein.
After the circuit board 30 is assembled with the back plate 10, each light outlet 301 exposes a corresponding light emitting element 20, and then the light emitting element 20 is connected with the circuit unit on the circuit board 30 by using the connecting element 40.
Alternatively, the connector 40 may be gold wire.
Then, the encapsulation glue 50 is formed on the circuit board 30, wherein the encapsulation glue 50 is filled in each light outlet 301 and covers the light emitting parts 20 in each light outlet 301 to play a role in blocking water and protecting encapsulation for each light emitting part 20, and meanwhile, one side of the encapsulation glue 50 away from the back plate 10 can be arc-shaped, so that the encapsulation glue 50 is multiplexed into a lens to play a role in converging the light emitted by the light emitting parts 20, the light emitted by the light emitting parts 20 is deflected to parallel light, and the light emitting effect of the backlight module is improved.
Then, the optical film 60 is formed on the side of the circuit board 30 away from the back plate 10.
Further, referring to fig. 4, the display device includes a display panel 70, and the backlight module described in the above embodiment or the backlight module manufactured by the manufacturing method of the backlight module described in the above embodiment, where the display panel 70 is disposed on the light emitting side of the backlight module.
Specifically, the display device further includes a middle frame 80 and a front frame 90, where the middle frame 80 may surround the periphery of the back plate 10 and cover the peripheral edge of the optical film 60; the display panel 70 is disposed on a side of the optical film 60 away from the back plate 10 and is disposed on the middle frame 80, and the front frame 90 can fix the display panel 70 and the backlight module.
In the embodiment of the present invention, the display panel 70 may be a liquid crystal display panel, and the display device may be a mobile phone, a tablet, a television, a computer, etc.
In summary, in the embodiment of the invention, the light emitting element 20 is disposed on the back plate 10, and the heat conductivity coefficient of the back plate 10 is greater than that of the circuit board 30, so that the heat emitted by the light emitting element 20 can be more rapidly dissipated, the heat dissipation effect of the light emitting element 20 is improved, the phenomenon that the light emitting element 20 fails at high temperature is avoided, and the yield and stability of the light emitting element 20 are improved; in addition, since the light emitting element 20 is located on the back plate 10 and is disposed corresponding to the light outlet 301 of the circuit board 30, the alignment and installation of the back plate 10 and the circuit board 30 are facilitated, and the light emitting element 20 is located in the light outlet 301 of the circuit board 30, so that the thickness of the backlight module can be reduced, and the light and thin backlight module can be realized.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The backlight module, the manufacturing method thereof and the display device provided by the embodiment of the invention are described in detail, and specific examples are applied to explain the principle and the implementation mode of the invention, and the description of the above embodiments is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims (10)

1. A backlight module, comprising:
a back plate;
the luminous piece is arranged on the backboard;
the circuit board is arranged on one side of the back plate, provided with the light emitting piece, and is internally provided with a light outlet which is aligned with the light emitting piece;
the heat conductivity coefficient of the backboard is larger than that of the circuit board.
2. A backlight module according to claim 1, wherein a circuit unit is disposed on the circuit board, and the circuit unit is connected to the light emitting member.
3. A backlight module according to claim 2, wherein the light emitting member is fixedly connected to the back plate at a side close to the back plate, and the light emitting member further comprises an electrode member connected to the circuit unit.
4. A backlight module according to claim 3, further comprising a connection member, wherein the electrode member is located at a side of the light emitting member away from the back plate, and wherein the connection member is connected between the electrode member and the circuit unit.
5. A backlight module according to claim 1, wherein the opening width of the light outlet on the side far from the back plate is larger than the opening width of the light outlet on the side close to the back plate, and the opening width is the width of the light outlet along the direction parallel to the back plate.
6. A backlight module according to claim 5, wherein the opening width of the light outlet is gradually increased in a direction along the back plate toward the wiring board.
7. A backlight module according to claim 1, wherein the orthographic projection of the light emitting element on the back plate is located in the orthographic projection of the light outlet on the back plate.
8. The backlight module according to claim 1, further comprising a packaging adhesive, wherein the packaging adhesive is at least filled in the light outlet and covers the light emitting member.
9. The manufacturing method of the backlight module is characterized by comprising the following steps:
forming a light emitting member on the back plate;
forming a light outlet on a circuit board, wherein the heat conductivity coefficient of the back plate is larger than that of the circuit board;
and the circuit board is assembled on one side of the back plate, which is provided with the luminous piece, and the light outlet and the luminous piece are arranged in an alignment way.
10. A display device, comprising a display panel, and the backlight module according to any one of claims 1 to 8 or the backlight module manufactured by the manufacturing method of the backlight module according to claim 9, wherein the display panel is disposed on a light emitting side of the backlight module.
CN202310520958.2A 2023-05-10 2023-05-10 Backlight module, manufacturing method thereof and display device Pending CN117518598A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310520958.2A CN117518598A (en) 2023-05-10 2023-05-10 Backlight module, manufacturing method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310520958.2A CN117518598A (en) 2023-05-10 2023-05-10 Backlight module, manufacturing method thereof and display device

Publications (1)

Publication Number Publication Date
CN117518598A true CN117518598A (en) 2024-02-06

Family

ID=89763205

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310520958.2A Pending CN117518598A (en) 2023-05-10 2023-05-10 Backlight module, manufacturing method thereof and display device

Country Status (1)

Country Link
CN (1) CN117518598A (en)

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