CN117515886A

CN117515886A - Heat radiation structure and air conditioning equipment

Info

Publication number: CN117515886A
Application number: CN202210908123.XA
Authority: CN
Inventors: 吴昊; 史俊茹
Original assignee: Zhejiang Dunan Artificial Environment Co Ltd
Current assignee: Zhejiang Dunan Artificial Environment Co Ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2024-02-06

Abstract

The application relates to a heat radiation structure and air conditioning equipment, heat radiation structure includes the evaporation heat absorption module that the level set up and the condensation heat dissipation module that the slope set up, and the setting height of condensation heat dissipation module is higher than the setting height of evaporation heat absorption module to, electronic components pastes the lower terminal surface of locating evaporation heat absorption module, and the one end intercommunication evaporation heat absorption module of condensation heat dissipation module, the other end orientation is kept away from the direction of electronic components and is extended. The application provides a heat radiation structure and air conditioning equipment has solved the lower problem of radiating efficiency of current radiator.

Description

Heat radiation structure and air conditioning equipment

Technical Field

The present disclosure relates to the field of refrigeration technologies, and in particular, to a heat dissipation structure and an air conditioning apparatus.

Background

As the functions of the air conditioning equipment are more and more, the number and the variety of the electronic components of the air conditioning equipment are more and more, so that the heating value of the electronic components of the air conditioning equipment is more and more, and particularly, the heating value of the air conditioning frequency conversion module is obviously increased. In addition, if the heat generated by the electronic components on the air conditioning equipment cannot be discharged in time, the temperature rise, the service life, the operation reliability and the like of the electronic components on the air conditioning equipment are greatly adversely affected.

At present, a radiator is generally used for radiating heat of electronic components on air conditioning equipment, but the existing radiator is low in radiating efficiency, and when the heating value of the electronic components on the air conditioning equipment is large, heat is difficult to radiate in time through the radiator.

Disclosure of Invention

Based on this, it is necessary to provide a heat dissipation structure and an air conditioning apparatus, which solve the problem of low heat dissipation efficiency of the existing heat sink.

The application provides a heat radiation structure includes the evaporation heat absorption module that the level set up and the condensation heat dissipation module that the slope set up, and the setting height of condensation heat dissipation module is higher than the setting height of evaporation heat absorption module to, electronic components pastes the lower terminal surface of locating evaporation heat absorption module, and the one end intercommunication evaporation heat absorption module of condensation heat dissipation module, the other end orientation is kept away from the direction of electronic components and is extended.

In one embodiment, the condensing heat dissipation module and the evaporating heat absorption module are sandwiched to form a preset angle a, and the preset angle a is satisfied, and 0 ° < a <180 °. It can be appreciated that the arrangement is beneficial to reducing the processing difficulty of the heat dissipation structure, thereby improving the processing efficiency of the heat dissipation structure.

In one embodiment, the predetermined angle a is satisfied, 90+.a <180 °. It can be understood that, so set up, be favorable to evaporating gaseous state work piece that produces in the heat absorption module and can get into condensation heat dissipation module more smoothly to improve the circulation efficiency of working medium in the heat radiation structure greatly, and then improved heat radiation structure's heat dissipation efficiency.

In one embodiment, the evaporation heat absorption module comprises a plurality of parallel heat absorption pipes and a plurality of first communication pipes, wherein the heat absorption pipes are arranged at intervals, the first communication pipes are connected with the adjacent heat absorption pipes, so that the adjacent heat absorption pipes are connected end to form a serial pipeline structure, and the heat absorption pipes are horizontally distributed along the same horizontal plane. The condensation heat dissipation module comprises a plurality of heat dissipation pipes which are parallel and are arranged at intervals and a plurality of second communicating pipes, wherein the second communicating pipes are connected with adjacent heat dissipation pipes, so that the adjacent heat dissipation pipes are connected end to form a pipeline structure connected in series, and the plurality of heat dissipation pipes are distributed along the same inclined plane in an inclined mode. It can be understood that the arrangement is beneficial to prolonging the length of the pipeline in the evaporation heat absorption module, and can ensure that the working medium has a certain degree of superheat at the outlet of the evaporation heat absorption module, thereby ensuring that the liquid working medium is completely transformed into the gaseous working medium. And in addition, the length of a pipeline in the condensing and radiating module is effectively prolonged, and the working medium at the outlet of the condensing and radiating module is guaranteed to have a certain supercooling degree, so that gaseous working medium is guaranteed to be completely changed into liquid working medium.

In one embodiment, the inner diameter r of the absorber tube is satisfied, r <1mm, and the inner diameter p of the heat sink tube is satisfied, p <1mm. It can be understood that the arrangement is favorable for forming a self-circulation loop in the heat radiation structure by the working medium, and the heat radiation efficiency of the heat radiation structure is greatly improved.

In one embodiment, a plurality of first micro-channels are arranged in parallel in the heat absorbing pipe, and the maximum inner diameter s of the first micro-channels is satisfied, wherein 10 μm < s <1000 μm. It can be understood that by the arrangement, the convection heat exchange coefficient of the heat absorption pipe is effectively increased, and the heat exchange efficiency of the heat dissipation structure is further improved.

In one embodiment, a plurality of second micro-channels are arranged in parallel in the radiating pipe, and the maximum inner diameter t of the second micro-channels is satisfied, wherein 10 μm < t <1000 μm. It can be understood that the heat convection coefficient of the radiating pipe is effectively increased by the arrangement, and the heat exchange efficiency of the radiating structure is further improved.

In one embodiment, the evaporation heat absorption module further comprises a plurality of first fins arranged at intervals, and the first fins are mounted on the heat absorption tube along the direction perpendicular to the axis of the heat absorption tube. It can be appreciated that such an arrangement is advantageous for further improving the heat exchange efficiency of the evaporation heat absorption module.

In one embodiment, the condensation heat dissipation module further includes a plurality of second fins disposed at intervals, and the plurality of second fins are mounted on the heat dissipation tube along a direction perpendicular to the axis of the heat dissipation tube. It can be appreciated that the arrangement is beneficial to further improving the heat exchange efficiency of the condensing heat dissipation module.

In one embodiment, the heat dissipation structure further comprises a mounting plate, one side of the mounting plate is used for mounting the electronic component, and the evaporation heat absorption module and the condensation heat dissipation module are mounted on one side of the mounting plate, which is away from the electronic component. It can be appreciated that by the arrangement, the installation space of the heat dissipation structure is reduced, and the assembly flexibility of the heat dissipation structure is improved.

In one embodiment, the heat dissipation structure further includes a support member disposed between the mounting plate and the condensation heat dissipation module such that the mounting plate supports the condensation heat dissipation module by the support member, and the support member is not thermally conductive or has a thermal conductivity of less than 0.1W/(m.k). It can be understood that the arrangement effectively prevents heat released by gaseous working media in the condensation heat dissipation module from being transferred to the electronic components, and further ensures that the electronic components can dissipate heat normally. Similarly, the heat in the electronic component is also effectively prevented from being directly transferred to the condensation heat dissipation module, and the condensation heat dissipation module is further ensured to be capable of normally dissipating heat. In conclusion, the heat dissipation efficiency of the heat dissipation structure is improved through the arrangement.

The application also provides air conditioning equipment, which comprises an electronic component and the heat radiation structure in any one of the embodiments, wherein the electronic component is attached to the lower end face of the evaporation heat absorption module.

Compared with the prior art, the heat radiation structure and the air conditioning equipment provided by the application, when the two-phase working medium of gas-liquid passes through the evaporation heat absorption module, because the evaporation heat absorption module is horizontally arranged, and the electronic component is attached to the lower end face of the evaporation heat absorption module, the density of the liquid working medium is greater than that of the gaseous working medium, so that the liquid working medium can be dispersed at one end, close to the electronic component, of the evaporation heat absorption module along the horizontal plane, and the liquid working medium is favorable for fully absorbing heat generated by the electronic component. When part or all of the liquid working medium absorbs heat and changes into gaseous working medium, the condensing heat dissipation module is obliquely arranged, and the setting height of the condensing heat dissipation module is higher than that of the evaporating heat absorption module, so that the gaseous working medium can rapidly rise to the condensing heat dissipation module and release the heat in the condensing heat dissipation module to change into the liquid working medium, and the liquid working medium can reflow back to the evaporating heat absorption module under the action of gravity.

In the heat radiation structure provided by the application, the liquid working medium can be distributed in the evaporation heat absorption module through the gravity, and the liquid state working substance can be dispersed at one end of the evaporation heat absorption module, which is close to the electronic component, along the horizontal plane. The gaseous working medium can rapidly rise to the condensation heat dissipation module, and the other end of the condensation heat dissipation module extends towards the direction away from the electronic component, so that the gaseous working medium can rapidly be away from the electronic component, the influence of the gaseous working medium with higher temperature on the heat release of the electronic component is effectively avoided, and the influence of the electronic component with higher temperature on the heat dissipation of the gaseous working medium is also effectively avoided.

Therefore, the heat absorption efficiency of the liquid working medium in the evaporation heat absorption module to the electronic components is greatly improved, and the heat dissipation efficiency of the gaseous working medium in the condensation heat dissipation module is improved. That is, the heat dissipation structure provided by the application remarkably improves the heat dissipation efficiency compared with the existing heat sink.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a side view of an air conditioning apparatus according to an embodiment provided herein;

FIG. 2 is a side view of an air conditioning apparatus according to another embodiment provided herein;

FIG. 3 is a heat transfer diagram of a heat dissipating structure according to an embodiment of the present disclosure;

FIG. 4 is a top view of an evaporative heat absorption module according to an embodiment of the present application;

FIG. 5 is a cross-sectional view of an evaporative heat absorption module according to an embodiment provided herein;

FIG. 6 is a cross-sectional view of a heat pipe according to an embodiment provided herein;

FIG. 7 is a top view of a condensing heat dissipation module according to an embodiment of the present disclosure;

FIG. 8 is a cross-sectional view of a condensing heat rejection module according to an embodiment provided herein;

fig. 9 is a cross-sectional view of a radiating pipe according to an embodiment provided herein;

fig. 10 is a cross-sectional view of a wick according to an embodiment provided herein.

Reference numerals: 100. an evaporation heat absorption module; 110. a heat absorbing pipe; 111. a first microchannel; 120. a first communication pipe; 130. a first fin; 140. a first fixed sideboard; 200. condensing and radiating module; 210. a heat radiating pipe; 211. a second microchannel; 220. a second communicating pipe; 230. a second fin; 240. a second fixed sideboard; 300. a wick; 400. a mounting plate; 500. a support; 600. an electronic component; 700. and (5) connecting pipes.

Detailed Description

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, in order to improve the heat dissipation efficiency of the existing heat sink, the present application provides a heat dissipation structure, which includes an evaporation heat absorption module 100 horizontally disposed and a condensation heat dissipation module 200 obliquely disposed, wherein the setting height of the condensation heat dissipation module 200 is higher than that of the evaporation heat absorption module 100, and the electronic component 600 is attached to the lower end surface of the evaporation heat absorption module 100, one end of the condensation heat dissipation module 200 is communicated with the evaporation heat absorption module 100, and the other end extends towards a direction away from the electronic component 600.

It should be noted that, the horizontal arrangement of the evaporation heat absorption module 100 refers to: the working fluid passages in the evaporation heat absorption module 100 extend in the same horizontal plane. Likewise, the inclined arrangement of the condensing heat dissipation module 200 means that: the working fluid passages within the condensing heat dissipation module 200 extend within the same inclined plane and this inclined arrangement refers to an inclined arrangement of the condensing heat dissipation module 200 with respect to the horizontal plane.

Further, it should be noted that the working medium is usually a fluid medium with two phases of gas and liquid, when the working medium absorbs heat through the evaporation heat absorption module 100, the working medium is converted from a liquid state to a gaseous state, and when the working medium releases heat through the condensation heat dissipation module 200, the working medium is converted from the gaseous state to the liquid state.

When the gas-liquid two-phase working medium passes through the evaporation heat absorption module 100, the evaporation heat absorption module 100 is horizontally arranged, and the electronic component 600 is attached to the lower end face of the evaporation heat absorption module 100, and because the density of the liquid working medium is greater than that of the gaseous working medium, the liquid working medium can be dispersed at one end, close to the electronic component 600, of the evaporation heat absorption module 100 along a horizontal plane, so that the liquid working medium is favorable for fully absorbing heat generated by the electronic component 600. When part or all of the liquid working medium absorbs heat and changes into gaseous working medium, the condensing heat dissipation module 200 is obliquely arranged, and the setting height of the condensing heat dissipation module 200 is higher than that of the evaporating heat absorption module 100, so that the gaseous working medium can rapidly rise to the condensing heat dissipation module 200 and release the working medium with heat to be changed into liquid in the condensing heat dissipation module 200, and the liquid working medium can reflow back to the evaporating heat absorption module 100 under the action of gravity.

In the above-mentioned heat dissipation structure, the liquid working medium can be distributed in the evaporation heat absorption module 100 by gravity, and the liquid working medium can be dispersed at one end of the evaporation heat absorption module 100 near the electronic component 600 along the horizontal plane. The gaseous working medium can rapidly rise to the condensation heat dissipation module 200, and because the other end of the condensation heat dissipation module 200 extends towards the direction away from the electronic component 600, the gaseous working medium can rapidly be away from the electronic component 600, so that the influence of the gaseous working medium with higher temperature on the heat release of the electronic component 600 is effectively avoided, and the influence of the electronic component 600 with higher temperature on the heat dissipation of the gaseous working medium is also effectively avoided.

In summary, the above arrangement greatly improves the heat absorption efficiency of the liquid working medium in the evaporation heat absorption module 100 to the electronic component 600, and improves the heat dissipation efficiency of the gaseous working medium in the condensation heat dissipation module 200. That is, the heat dissipation structure provided by the application remarkably improves the heat dissipation efficiency compared with the existing heat sink.

In one embodiment, as shown in fig. 1, the condensing heat dissipation module 200 and the evaporation heat absorption module 100 are sandwiched to form a preset angle a, which is satisfied, 0 ° < a <180 °. Therefore, the processing difficulty of the heat dissipation structure is reduced, and the processing efficiency of the heat dissipation structure is improved.

Further, in one embodiment, as shown in FIG. 1, the predetermined angle a is satisfied, 90A < 180. That is, the condensing heat dissipation module 200 and the evaporation heat absorption module 100 are clamped to form the preset angle a as an obtuse angle, so that the gaseous working substance generated in the evaporation heat absorption module 100 can more smoothly enter the condensing heat dissipation module 200, thereby greatly improving the circulation efficiency of the working substance in the heat dissipation structure and further improving the heat dissipation efficiency of the heat dissipation structure.

Further, in an embodiment, as shown in fig. 2, the preset angle a is equal to 90 °, so that the working medium in the condensing and heat dissipating module 200 can be quickly returned to the evaporating and heat absorbing module 100 after being liquefied, and heat dissipating efficiency of the heat dissipating structure is improved.

In an embodiment, as shown in fig. 4 and fig. 5, the evaporation heat absorption module 100 includes a plurality of parallel heat absorption tubes 110 and a plurality of first communication tubes 120, wherein the first communication tubes 120 connect adjacent heat absorption tubes 110, so that the adjacent heat absorption tubes 110 are connected end to form a serial pipeline structure, and the plurality of heat absorption tubes 110 are horizontally distributed along the same horizontal plane. Thus, the length of the pipeline in the evaporation heat absorption module 100 is effectively prolonged, and the working medium at the outlet of the evaporation heat absorption module 100 can be guaranteed to have a certain degree of superheat, so that the liquid working medium is guaranteed to be completely changed into a gaseous working medium.

Similarly, as shown in fig. 7 and 8, the condensing heat dissipation module 200 includes a plurality of heat dissipation tubes 210 arranged in parallel and at intervals and a plurality of second connection tubes 220, wherein the second connection tubes 220 connect adjacent heat dissipation tubes 210, so that the adjacent heat dissipation tubes 210 are connected end to form a serial pipeline structure, and the plurality of heat dissipation tubes 210 are distributed along the same inclined plane in an inclined manner. Thus, the length of the pipeline in the condensing heat dissipation module 200 is effectively prolonged, and the working medium at the outlet of the condensing heat dissipation module 200 can be guaranteed to have a certain supercooling degree, so that the gaseous working medium is guaranteed to be completely changed into a liquid working medium.

Note that, in the above embodiment, the absorber pipe 110 and the radiator pipe 210 communicate through the connection pipe 700.

Further, the inner diameter r of the absorber tube 110 is satisfied, r <1mm, and the inner diameter p of the radiator tube 210 is satisfied, p <1mm. Since the inner diameter of the heat absorbing pipe 110 is sufficiently small, the heat absorbing pipe 110 can form a state in which the bubble columns and the liquid columns are arranged at intervals and are randomly distributed. In the heat absorbing pipe 110, the working medium absorbs heat and gasifies to generate bubbles, and the bubbles expand and boost rapidly to push the working medium to flow to the radiating pipe 210 with lower temperature, and in the radiating pipe 210, the bubbles shrink and collapse due to cooling, and the pressure of the bubbles drops. Due to the pressure difference between the heat absorption pipe 110 and the heat radiation pipe 210 and the pressure imbalance between the adjacent heat absorption pipe 110 and the adjacent heat radiation pipe 210, the working medium oscillates and flows between the heat absorption pipe 110 and the heat radiation pipe 210, thereby realizing heat transfer. In the whole process, no external mechanical work and electric work are consumed, and the self-oscillation is completely under the drive of heat. Therefore, the working medium is beneficial to forming a self-circulation loop in the heat dissipation structure, and the heat dissipation efficiency of the heat dissipation structure is greatly improved.

Further, in one embodiment, as shown in fig. 6, a plurality of first micro-channels 111 are disposed in parallel in the heat absorbing tube 110, and the maximum inner diameter s of the first micro-channels 111 is satisfied, 10 μm < s <1000 μm. In this way, the heat convection coefficient of the heat absorbing pipe 110 is effectively increased, and the heat exchange efficiency of the heat dissipating structure is further improved.

Similarly, in one embodiment, as shown in fig. 9, a plurality of second micro-channels 211 are disposed in parallel in the heat dissipating tube 210, and the maximum inner diameter t of the second micro-channels 211 is satisfied, 10 μm < t <1000 μm. In this way, the heat convection coefficient of the radiating tube 210 is effectively increased, and the heat exchange efficiency of the radiating structure is further improved.

In other embodiments, the absorber tube 110 is a single cylindrical tube as shown in fig. 5, or the radiator tube 210 is a single cylindrical tube as shown in fig. 8.

Still further, in one embodiment, as shown in fig. 10, the wick 300 is provided in each of the heat absorbing pipe 110 and the heat dissipating pipe 210. Specifically, the liquid working substance in the radiating pipe 210 is sucked into the wick 300 and flows back into the heat absorbing pipe 110 by the action of capillary pressure, thereby completing the automatic circulation of the working substance.

In order to further improve the heat exchange efficiency of the evaporation heat absorption module 100, in an embodiment, as shown in fig. 4, the evaporation heat absorption module 100 further includes a plurality of first fins 130 disposed at intervals, and the plurality of first fins 130 are mounted to the heat absorption tube 110 along a direction perpendicular to the axis of the heat absorption tube 110.

Specifically, the first fin 130 is welded or clamped to the heat absorption tube 110.

Further, in an embodiment, as shown in fig. 4, a plurality of first fins 130 are distributed on each heat absorbing tube 110, and each first fin 130 is connected to only a single heat absorbing tube 110. Therefore, the modularized design of the heat dissipation structure is facilitated, and the assembly difficulty of the heat dissipation structure is reduced.

In other embodiments, a plurality of parallel first fins 130 are distributed on each heat absorbing tube 110, and each first fin 130 is connected to a plurality of heat absorbing tubes 110 at the same time. Thus, the processing cost of the heat dissipation structure is reduced.

Similarly, in order to further improve the heat exchange efficiency of the condensing heat dissipation module 200, in an embodiment, as shown in fig. 7, the condensing heat dissipation module 200 further includes a plurality of second fins 230 disposed at intervals, and the plurality of second fins 230 are mounted to the heat dissipation tube 210 along a direction perpendicular to the axis of the heat dissipation tube 210.

Specifically, the second fin 230 is welded or snapped to the radiating pipe 210.

Further, in an embodiment, as shown in fig. 7, a plurality of second fins 230 are disposed on each heat dissipating tube 210 in parallel, and each second fin 230 is connected to only a single heat dissipating tube 210. Therefore, the modularized design of the heat dissipation structure is facilitated, and the assembly difficulty of the heat dissipation structure is reduced.

In other embodiments, a plurality of parallel second fins 230 are distributed on each heat dissipating tube 210, and each second fin 230 is connected to a plurality of heat dissipating tubes 210 simultaneously. Thus, the processing cost of the heat dissipation structure is reduced.

In an embodiment, as shown in fig. 1 and 2, the heat dissipation structure further includes a mounting board 400, one side of the mounting board 400 is used for mounting the electronic component 600, and the evaporation heat absorption module 100 and the condensation heat dissipation module 200 are mounted on the side of the mounting board 400 facing away from the electronic component 600. Therefore, the installation space of the heat dissipation structure is reduced, and the assembly flexibility of the heat dissipation structure is improved.

It should be noted that, as shown in fig. 5, the evaporation heat absorption module 100 is connected to the mounting plate 400 through the first fixed side plate 140.

Further, in an embodiment, as shown in fig. 1 and 2, the heat dissipation structure further includes a support member 500, the support member 500 is disposed between the mounting board 400 and the condensation heat dissipation module 200, such that the mounting board 400 supports the condensation heat dissipation module 200 through the support member 500, and the support member 500 is not conductive or the thermal conductivity of the support member 500 is less than 0.1W/(m.k). In this way, the heat released by the gaseous working medium in the condensation heat dissipation module 200 is effectively prevented from being transferred to the electronic component 600, and the electronic component 600 is ensured to be capable of normally dissipating heat. Similarly, the heat in the electronic component 600 is effectively prevented from being directly transferred to the condensation heat dissipation module 200, so that the condensation heat dissipation module 200 can dissipate heat normally. In conclusion, the heat dissipation efficiency of the heat dissipation structure is improved through the arrangement.

It should be noted that, as shown in fig. 8, the condensing heat dissipation module 200 is connected to the support member 500 through the second fixing edge plate 240.

Specifically, the supporting member 500 is made of a thermal-resistant layer material, or the surface of the supporting member 500 is coated with a thermal-insulating coating.

More specifically, the material of the support 500 is one or more of titanium nitride, tantalum oxide, germanium nitride, titanium oxide, titanium oxynitride, silicon carbide, silicon oxide, aluminum nitride, and silicon nitride. The surface of the support 500 is coated with one or more of composite silicate, aluminum-based reflective thermal insulation coating, and organic radiation coating.

Further, as shown in fig. 1, when the preset angle a satisfies 90 ° -a <180 °, the support 500 is in the form of a block having a triangular cross section, and as shown in fig. 2, when the preset angle a is equal to 90 °, the support 500 is in the form of a column.

The application also provides an air conditioning device, which comprises the electronic component 600 and the heat dissipation structure described in any one of the above embodiments, wherein the electronic component 600 is attached to the lower end face of the evaporation heat absorption module 100.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.

Claims

1. The utility model provides a heat radiation structure, its characterized in that, including evaporation heat absorption module (100) and the condensation heat dissipation module (200) that the slope set up of level, the setting height of condensation heat dissipation module (200) is higher than the setting height of evaporation heat absorption module (100), and, electronic components (600) paste and locate the lower terminal surface of evaporation heat absorption module (100), the one end intercommunication of condensation heat dissipation module (200) evaporation heat absorption module (100), the other end orientation is kept away from the direction extension of electronic components (600).

2. The heat dissipating structure according to claim 1, wherein the condensing heat dissipating module (200) and the evaporating heat absorbing module (100) are sandwiched to form a preset angle a, which is satisfied, 0 ° < a <180 °.

3. The heat dissipating structure of claim 2, wherein the predetermined angle a is satisfied, 90 ° -a <180 °.

4. The heat dissipation structure according to claim 1, wherein the evaporation heat absorption module (100) includes a plurality of parallel heat absorption tubes (110) and a plurality of first communication tubes (120) arranged at intervals, the first communication tubes (120) connect adjacent heat absorption tubes (110) so that adjacent heat absorption tubes (110) are connected end to form a serial pipeline structure, and the plurality of heat absorption tubes (110) are horizontally distributed along the same horizontal plane;

the condensation heat dissipation module (200) comprises a plurality of heat dissipation pipes (210) which are parallel and are arranged at intervals and a plurality of second communicating pipes (220), wherein the second communicating pipes (220) are connected with adjacent heat dissipation pipes (210) so that the adjacent heat dissipation pipes (210) are connected end to form a serial pipeline structure, and the plurality of heat dissipation pipes (210) are distributed along the same inclined plane in an inclined mode.

5. The heat dissipating structure of claim 4, wherein the inner diameter r of the heat absorbing tube (110) is satisfied, r <1mm, and the inner diameter p of the heat dissipating tube (210) is satisfied, p <1mm.

6. The heat dissipation structure according to claim 4, characterized in that a plurality of first micro-channels (111) are arranged in parallel in the heat absorption tube (110), and the maximum inner diameter s of the first micro-channels (111) is satisfied, 10 μm < s <1000 μm; and/or the number of the groups of groups,

a plurality of second micro-channels (211) are arranged in parallel in the radiating pipe (210), and the maximum inner diameter t of the second micro-channels (211) is satisfied, wherein the t is 10 mu m < t <1000 mu m.

7. The heat radiation structure according to claim 4, wherein the evaporation heat absorption module (100) further includes a plurality of first fins (130) arranged at intervals, and the plurality of first fins (130) are mounted to the heat absorption tube (110) along a direction perpendicular to an axis of the heat absorption tube (110); and/or the number of the groups of groups,

the condensing heat dissipation module (200) further comprises a plurality of second fins (230) arranged at intervals, and the second fins (230) are arranged on the heat dissipation tube (210) along the direction perpendicular to the axis of the heat dissipation tube (210).

8. The heat dissipating structure of claim 1, further comprising a mounting plate (400), wherein one side of the mounting plate (400) is used for mounting an electronic component (600), and wherein the evaporation heat absorption module (100) and the condensation heat dissipation module (200) are mounted on a side of the mounting plate (400) facing away from the electronic component (600).

9. The heat dissipating structure of claim 8, further comprising a support (500), said support (500) being disposed between said mounting plate (400) and said condensing heat dissipating module (200) such that said mounting plate (400) supports said condensing heat dissipating module (200) by said support (500), and wherein said support (500) is non-thermally conductive or said support (500) has a thermal conductivity of less than 0.1W/(m.k).

10. An air conditioning apparatus, characterized by comprising an electronic component (600) and the heat dissipation structure according to any one of claims 1 to 9, wherein the electronic component (600) is attached to the lower end face of the evaporation heat absorption module (100).