CN117512751A - Electroplating liquid supply equipment for producing miniature electronic components - Google Patents

Electroplating liquid supply equipment for producing miniature electronic components Download PDF

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Publication number
CN117512751A
CN117512751A CN202311373903.XA CN202311373903A CN117512751A CN 117512751 A CN117512751 A CN 117512751A CN 202311373903 A CN202311373903 A CN 202311373903A CN 117512751 A CN117512751 A CN 117512751A
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CN
China
Prior art keywords
electroplating
basket
transmission
liquid
tank
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Pending
Application number
CN202311373903.XA
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Chinese (zh)
Inventor
邓才参
陈松深
卢永发
夏冠荣
廖剑亮
梁光发
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Zhaoqing Yingtuo Automation Equipment Technology Co ltd
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Zhaoqing Yingtuo Automation Equipment Technology Co ltd
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Application filed by Zhaoqing Yingtuo Automation Equipment Technology Co ltd filed Critical Zhaoqing Yingtuo Automation Equipment Technology Co ltd
Priority to CN202311373903.XA priority Critical patent/CN117512751A/en
Publication of CN117512751A publication Critical patent/CN117512751A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • C25D17/22Apparatus for electrolytic coating of small objects in bulk having open containers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses electroplating liquid supply equipment for producing miniature electronic components, and relates to the technical field of electroplating. According to the electroplating liquid supply equipment, the first liquid inlet end and the second liquid inlet end are arranged at the bottom end of the working groove, the overflow port is arranged at the upper part of the working groove, the height of the overflow port corresponds to the working water level of the electroplating liquid in the working groove, the electroplating liquid used in the working groove can be effectively recovered, the electroplating liquid in the working groove is continuously exchanged, the concentration of metal ions in the electroplating liquid is ensured to be maintained at a higher level during electroplating, a plating layer can be formed on the surface of a workpiece to be plated more quickly, the electroplating efficiency is further effectively improved, the electroplating time is reduced, the effect of reducing the electroplating cost is achieved, and meanwhile, the electroplating basket in the electroplating liquid supply equipment adopting the technical scheme is used for electroplating, the electroplating effect is remarkably improved, the plating layer is more uniform, and the problems of reduced electroplating efficiency and poor electroplating effect of the conventional liquid supply equipment are solved.

Description

Electroplating liquid supply equipment for producing miniature electronic components
Technical Field
The invention relates to the technical field of electroplating, in particular to electroplating liquid supply equipment for producing miniature electronic components.
Background
Electroplating is a process of plating metal or alloy on the surface of a workpiece by utilizing an electrolysis principle, and the electroplating can enable the surface of the workpiece to form a metal film or alloy film, thereby achieving the effect of preventing the workpiece from being oxidized, and simultaneously having the effects of improving the wear resistance, conductivity, reflectivity, corrosion resistance, attractive appearance and the like of the workpiece.
In the electroplating production process, for the electroplating process of precision products (such as miniature electronic components), the supply and treatment of the electroplating solution are particularly important, and the electroplating production efficiency, the plating quality and the production cost can be directly influenced. The plating solution supply and treatment in the traditional electroplating production equipment have not been effectively adopted, the plating solution used in the traditional electroplating production equipment is slower to recover, the used plating solution is difficult to recover timely, the plating solution in the electroplating working tank is not replaced timely, a plating layer is difficult to form on the surface of the miniature electronic component rapidly, the electroplating time can be greatly increased, the electroplating efficiency is reduced, and the production cost is increased. Meanwhile, in the existing electroplating liquid supply equipment, the electroplating liquid generally directly enters the electroplating basket from the bottom of the electroplating basket, and the movement track of the element to be plated can be influenced in the process that the electroplating liquid enters the electroplating basket, so that the electroplating effect is poor, and the plating uniformity is poor.
Disclosure of Invention
The invention aims to provide electroplating liquid supply equipment for producing miniature electronic components, which can effectively improve the electroplating efficiency and the electroplating effect and solve the problems of low electroplating efficiency and poor electroplating effect of the conventional liquid supply equipment.
To achieve the purpose, the invention adopts the following technical scheme:
the electroplating liquid supply equipment for producing the miniature electronic components comprises an electroplating liquid circulation device, an electroplating basket, a working groove and an anode piece, wherein the electroplating basket is rotatably arranged in the working groove, the anode piece is positioned in the working groove, and the anode piece is arranged outside the electroplating basket;
the bottom end of the working tank is provided with a first liquid inlet end, a second liquid inlet end and a recovery end, the upper part of the working tank is provided with an overflow port, the first liquid inlet end and the second liquid inlet end are respectively communicated with the output end of the electroplating liquid circulating device, and the recovery end and the overflow port are respectively connected with the input end of the electroplating liquid circulating device; the height of the overflow port corresponds to the working water level of the electroplating liquid in the working tank;
the electroplating basket comprises a basket body, a connecting rod and a screwing cover, wherein an electroplating cavity is formed in the top surface of the basket body in a downward sinking mode, the screwing cover is arranged on the top of the electroplating cavity, and a cathode ring is arranged on the inner wall of the basket body;
The center of the basket body protrudes upwards to form an installation part, and the bottom end of the connecting rod is fixedly connected with the installation part; the installation department is equipped with from down supreme first liquid medicine passageway that runs through, the delivery outlet of first liquid medicine passageway is located the top of installation department, first liquid medicine passageway with second feed liquor end intercommunication.
Preferably, the electroplating solution circulating device comprises a recovery tank and a main drug water tank, wherein the output end of the recovery tank is connected with the input end of the main drug water tank, the recovery end and the overflow port are respectively connected with the input end of the recovery tank, and the first liquid inlet end and the second liquid inlet end are respectively communicated with the output end of the main drug water tank.
Preferably, the electroplating liquid supply apparatus further comprises a first electromagnetic valve, a second electromagnetic valve and a third electromagnetic valve;
the first electromagnetic valve is arranged between the output end of the main medicine water tank and the first liquid inlet end, the second electromagnetic valve is arranged between the output end of the main medicine water tank and the second liquid inlet end, and the third electromagnetic valve is arranged between the input end of the recovery tank and the recovery end.
Preferably, the electroplating liquid supply device further comprises a first power pump and a second power pump, wherein the first power pump is connected with the output end of the main medicine water tank, and the second power pump is arranged between the output end of the recovery tank and the input end of the main medicine water tank.
Preferably, a liquid level sensor is further arranged in the working groove, and the installation height of the liquid level sensor corresponds to the installation height of the overflow port.
Preferably, the electroplating liquid supply device further comprises a rotary bracket and a connection tray, wherein the connection tray is positioned in the working groove, the rotary bracket is fixedly connected with the bottom of the working groove, and the connection tray is rotatably connected with the top of the rotary bracket;
the bottom of the electroplating basket is connected with the connecting tray;
the second liquid inlet end is positioned in the rotary bracket.
Preferably, the basket body comprises a shell and an inner chassis, the shell is arranged outside the inner chassis in a surrounding manner, the shell and the inner chassis are connected to form the basket body, and the cathode is arranged on the inner wall of the shell in a surrounding manner; the center of the inner chassis protrudes upwards to form the mounting part; the screwing cover is covered on the top of the shell;
the electroplating basket further comprises a base, the base is arranged at the bottom of the basket body, the base is provided with a second liquid medicine channel penetrating from bottom to top, the first liquid medicine channel is communicated with the second liquid medicine channel, and the second liquid medicine channel is communicated with the second liquid inlet end;
The base is used for being connected with the connecting tray, and when the base is connected with the connecting tray, the horizontal height of the overflow port is higher than the horizontal height of the screwing cover.
Preferably, a transparent net cover is arranged in the middle of the screwing cover, and a plurality of overflow holes are formed in the transparent net cover;
the outer ring of the screwing cover is provided with a plurality of top row holes, the plurality of top row holes are respectively distributed on the periphery of the transparent net cover, and the positions of the top row holes correspond to the positions of the inner wall of the cathode ring;
and each top row hole is respectively provided with a detachable pressing block, the size of each pressing block corresponds to the size of each top row hole, and when the electroplating basket is in a working state, the pressing blocks are embedded into the top row holes.
Preferably, the electroplating liquid supply device further comprises a power device which is used for being in transmission connection with the electroplating basket, the power device comprises a base plate, a first driving mechanism and a turnover assembly, the base plate is fixedly arranged on an external fixing frame, the first driving mechanism is arranged on the base plate and is in transmission connection with the turnover assembly, and the first driving mechanism is used for driving the turnover assembly to perform turnover movement and driving the turnover assembly to approach or depart from the external electroplating basket; the turnover assembly is provided with a second driving mechanism, the output end of the second driving mechanism is used for being connected with an external electroplating basket, and when the turnover assembly performs turnover movement to a horizontal state, the output end of the second driving mechanism can be in transmission connection with the electroplating basket, so that the electroplating basket is driven to perform rotary movement along a horizontal plane;
The overturning assembly further comprises a mounting plate, and one end of the mounting plate is in transmission connection with the first driving mechanism;
the second driving mechanism comprises a second motor, a transmission chain and a transmission shaft assembly, the second motor is mounted on a mounting plate, and the rotating end of the second motor penetrates through the mounting plate and is positioned below the mounting plate; the transmission shaft assembly is vertically arranged on the mounting plate and is in rotary connection with the mounting plate, and the rotary end of the second motor is in transmission connection with the transmission shaft assembly through the transmission chain;
the bottom of transmission shaft subassembly is equipped with first joint, the top of connecting rod is equipped with the second and connects, first joint with the second connects and connects.
Preferably, a first transmission gear is arranged at the rotating end of the second motor, and the transmission shaft assembly comprises a transmission shaft, a bearing seat and a second transmission gear; the bearing seat is fixedly arranged on the mounting plate; the transmission shaft is vertically arranged on the mounting plate, the top of the transmission shaft is connected with the bearing seat, and the bottom of the transmission shaft is connected with the first joint;
the second transmission gear is arranged in the middle of the transmission shaft, and the first transmission gear is in transmission connection with the second transmission gear through the transmission chain;
The transmission shaft assembly further comprises a conductive shaft, a limit nut, a limit sliding sleeve and a spring, wherein the conductive shaft is arranged in the transmission shaft, the top of the conductive shaft is connected with the limit nut, the bottom of the conductive shaft is connected with the limit sliding sleeve, and the bottom of the limit sliding sleeve is connected with the first joint;
the lower part of the transmission shaft is a transmission part, the outer wall of the transmission part is provided with at least one transmission plane, and the transmission plane is arranged in the axial direction from the outer side of the transmission part; the limiting sliding sleeve is sleeved outside the transmission part, and the inner wall of the limiting sliding sleeve is attached to the outer wall of the transmission part;
the inside of the transmission part is provided with a mounting groove for mounting the spring, the spring is sleeved outside the conductive shaft, and the spring is positioned in the mounting groove;
the overturning assembly further comprises two driving cylinders and a push plate, the push plate is sleeved outside the conductive shaft, and the push plate is positioned between the limit nut and the bearing seat; the two driving cylinders are respectively arranged at two sides of the mounting plate, and the telescopic ends of the two driving cylinders are respectively connected with two ends of the push plate;
A distance for the push plate to move up and down is arranged between the limit nut and the limit sliding sleeve; the two driving cylinders are used for driving the push plate to move up and down.
The technical scheme has the following beneficial effects: according to the electroplating liquid supply device, the first liquid inlet end and the second liquid inlet end are arranged at the bottom end of the working groove, the overflow port is arranged at the upper part of the working groove, the height of the overflow port corresponds to the working water level of the electroplating liquid in the working groove, new electroplating liquid is continuously supplied to the working groove through the first liquid inlet end and the second liquid inlet end in the electroplating process, the electroplating liquid in electroplating is continuously recovered through the overflow port, the electroplating liquid is processed by the electroplating liquid circulating device and then is continuously supplied to the working groove, the whole liquid supply process is enabled to form a circulating system, the electroplating liquid used in the working groove can be effectively recovered, the electroplating liquid in the working groove is continuously exchanged, the concentration of metal ions in the electroplating liquid is ensured to be maintained at a higher level in the electroplating process, more metal atoms can be reduced through electrode reaction under the action of an external electric field, and are deposited on the surface of a workpiece to be plated, so that the surface of the workpiece to be plated can be formed more quickly, the electroplating efficiency is improved, the electroplating cost is effectively reduced, and the electroplating cost is reduced. Simultaneously, adopt the electroplating basket in the electroplating feed liquid equipment of this technical scheme to electroplate, can show the improvement electroplating effect, make the cladding material more even.
Drawings
FIG. 1 is a schematic view showing the construction of a plating liquid supply apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view showing the installation of a plating basket and a working tank in the plating liquid supply apparatus shown in FIG. 1;
FIG. 3 is a schematic view showing the structure of a plating basket in the plating liquid supply apparatus shown in FIG. 1;
FIG. 4 is a cross-sectional view of the plating basket of FIG. 3;
FIG. 5 is a schematic view of the structure of the housing and the screw-on cover of the plating basket of FIG. 3;
FIG. 6 is a schematic view of the structure of FIG. 5 at another angle;
FIG. 7 is a schematic view of the base of the plating basket of FIG. 3;
FIG. 8 is a schematic view showing the construction of a power unit in the plating liquid supply apparatus shown in FIG. 1;
FIG. 9 is a schematic side view of the power plant of FIG. 8 (with the protective cover, first protective cover, and second protective cover in a transparent state);
FIG. 10 is a bottom schematic view of the power plant of FIG. 8;
FIG. 11 is a schematic illustration of the power plant of FIG. 8 with the first and second protective housings removed;
FIG. 12 is a schematic view of the flip assembly of FIG. 11 (with the first protective shell and the second protective shell removed);
FIG. 13 is a schematic view of the structure of the rotating shaft of the power plant of FIG. 8;
FIG. 14 is a cross-sectional view of the flip assembly of FIG. 12;
FIG. 15 is a schematic view of the drive shaft of the invert assembly of FIG. 14;
FIG. 16 is a cross-sectional view of the drive shaft of FIG. 15 shown in the drive section;
wherein: the plating liquid circulating device 1, the recovery tank 11, the main liquid medicine tank 12, the first electromagnetic valve 31, the third electromagnetic valve 32, the third electromagnetic valve 33, the first power pump 41 and the second power pump 42;
the working tank 221, the rotary bracket 222, the connecting tray 223, the anode piece 224, the liquid level sensor 225, the suspension ring 226, the overflow port 2211, the first liquid inlet 2212, the second liquid inlet 2213 and the recovery end 2214;
electroplating basket 5: the connecting rod 51, the outer shell 52, the base 53, the inner chassis 54, the cathode ring 55, the screwing cover 56, the locking screw 57, the second connector 511, the limiting groove 521, the second liquid medicine channel 531, the groove 532, the mounting portion 541, the transparent net cover 561, the top row holes 562, the pressing block 563, the buckle 564, the first liquid medicine channel 5411 and the overflow hole 5611;
power plant 7: the drive mechanism includes a base plate 71, a first drive mechanism 72, a tilting assembly 73, a stopper 74, a protective cover 75, a first motor 721, a decelerator 722, a third transmission gear 723, a driven mechanism 724, a second drive mechanism 731, a mounting plate 732, a first protective case 733, a second protective case 734, a drive cylinder 735, a push plate 736, a rotation shaft 7241, a driven gear 7242, a second motor 7311, a transmission chain 7312, a transmission shaft assembly 7313, a fixing portion 7321, a first transmission gear 73111, a connecting portion 72411, a mounting space 72412, a first joint 73131, a transmission shaft 73132, a bearing housing 73133, a second transmission gear 73134, a conductive shaft 73135, a stopper nut 73136, a stopper slide 73137, a spring 73138, a transmission portion 731321, and a transmission plane 7313211.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly, for distinguishing between the descriptive features, and not sequentially, and not lightly.
In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
An electroplating liquid supply apparatus for producing a microelectronic device according to an embodiment of the present invention will be described below with reference to fig. 1 to 16.
An electroplating liquid supply device for producing miniature electronic components comprises an electroplating liquid circulation device 1, an electroplating basket 5, a working groove 221 and an anode piece 224, wherein the electroplating basket 5 is rotatably arranged in the working groove 221, the anode piece 224 is positioned in the working groove 221, and the anode piece 224 is arranged outside the electroplating basket 5;
The bottom end of the working tank 221 is provided with a first liquid inlet 2212, a second liquid inlet 2213 and a recovery end 2214, the upper part of the working tank 221 is provided with an overflow port 2211, the first liquid inlet 2212 and the second liquid inlet 2213 are respectively communicated with the output end of the electroplating liquid circulating device 1, and the recovery end 2214 and the overflow port 2211 are respectively connected with the input end of the electroplating liquid circulating device 1; the height of the overflow port 2211 corresponds to the working water level of the plating solution in the working tank 221;
the electroplating basket 5 comprises a basket body, a connecting rod 51 and a screwing cover 56, wherein an electroplating cavity is formed in the top surface of the basket body in a downward sinking mode, the screwing cover 56 is arranged on the top of the electroplating cavity in a covering mode, and a cathode ring 55 is arranged on the inner wall of the basket body;
the center of the basket body protrudes upwards to form a mounting portion 541, and the bottom end of the connection rod 51 is fixedly connected with the mounting portion 541; the mounting portion 541 is provided with a first liquid medicine channel 5411 penetrating from bottom to top, an output port of the first liquid medicine channel 5411 is located at a top end of the mounting portion 541, and the first liquid medicine channel 5411 is communicated with the second liquid inlet end 2213.
It should be noted that, as shown in fig. 1 and fig. 2, the plating solution supply apparatus in the present embodiment is configured such that, by disposing the first solution inlet end 2212 and the second solution inlet end 2213 at the bottom end of the working tank 221, and disposing the overflow port 2211 at the upper portion of the working tank 221, the height of the overflow port 2211 corresponds to the working water level of the plating solution in the working tank 221, during the plating process, new plating solution is continuously supplied to the working tank 221 through the first solution inlet end 2212 and the second solution inlet end 2213, and the plating solution during the plating process is continuously recovered through the overflow port 2211, and becomes new plating solution after being processed by the plating solution circulation device 1, and is continuously supplied to the working tank, so that the whole solution supply process forms a circulation system. Simultaneously, adopt the electroplating basket in the electroplating feed liquid equipment of this technical scheme to electroplate, can show the improvement electroplating effect, make the cladding material more even.
The working process of the electroplating liquid supply equipment in the technical scheme is as follows: placing the electroplating basket 5 into the working groove 221, starting the electroplating solution circulating device 1, and automatically supplying the liquid medicine to the working groove 221 and the electroplating basket 5; one path of electroplating liquid is injected into the electroplating basket 5 through the second liquid inlet end 2213, and the other path of electroplating liquid is directly injected into the working groove 221 through the first liquid inlet end 2212, so that the working amount of the electroplating liquid can be quickly reached, and the initial liquid supply time is greatly saved. When the plating liquid reaches the working level, the plating liquid still injected is returned to the plating liquid circulating apparatus 1 through the overflow port 2211 of the working tank 221. When the electroplating solution reaches the working amount, the electroplating basket 5 rotates to perform electroplating treatment on the workpiece to be plated, and in the electroplating process, the solution needs to be continuously supplied to the working tank 221 and the electroplating basket 5, meanwhile, the used electroplating solution is continuously recovered, the recovered electroplating solution is electrolyzed, filtered and heated in the electroplating solution circulating device 1, and finally, the electroplating solution is injected into the working tank 221 again for exchange; the working tank 221 is filled with the treated plating solution (i.e., the liquid medicine) continuously, and the excess liquid medicine is recovered continuously after the plating, so that a circulation system is formed in the whole solution supply process. After the plating operation is completed, all the liquid supply is stopped, and the remaining plating liquid in the operation tank 221 is recovered, and the above-described cycle operation is performed sequentially.
It is worth to describe that, according to the technical scheme, the electroplating solution is injected from the bottom of the working groove 221, the electroplating solution after electroplating is recovered from the top of the working groove 221, so that an efficient solution supply system is formed, the used electroplating solution is continuously recovered in the electroplating process, the electroplating solution in the working groove 221 is continuously exchanged, a plating layer can be formed on the surface of a workpiece to be plated more easily and quickly, and the electroplating time of the workpiece to be plated can be saved. If the plating solution used in the plating process cannot be replaced in time, the concentration of metal ions in the plating solution in the working tank 221 is low, and the amount of reduced metal atoms is small during plating, it is difficult to form a plating layer on the surface of the workpiece to be plated, so that the plating efficiency is reduced, the time for forming the plating layer on the surface of the workpiece to be plated is increased, and the production efficiency is affected and the cost is increased.
According to the technical scheme, the mounting part 541 is arranged in the middle of the basket body, the first liquid medicine channel 5411 penetrating through the mounting part 541 is arranged in the mounting part 541, so that electroplating liquid enters from the bottom end of the mounting part 541 and is output from the top end of the mounting part 541, and new electroplating liquid is required to be continuously input into the electroplating basket 5 in the electroplating process; meanwhile, the first liquid medicine channel 5411 is arranged in the technical scheme, so that the electroplating liquid flows downwards from the top end of the main body into the basket main body, and in the electroplating process, the movement track of the workpiece to be plated cannot be influenced in the input process of the electroplating liquid, so that a better electroplating effect can be achieved. If a liquid medicine channel is arranged at the bottom of the basket body, the electroplating liquid enters from the bottom of the basket body, so that the risk that the workpiece to be plated runs out of the basket body from the liquid medicine channel in the electroplating process exists; moreover, if the plating solution enters the basket body from the bottom of the basket body, the injection of the plating solution affects the movement track of the workpiece to be plated, resulting in a greatly reduced plating effect.
It is worth to point out that, the electroplating basket 5 of this technical scheme adopts the centrifugal plating cylinder body structure, and the work piece that waits to plate is inside electroplating basket 5, keeps apart completely with the positive pole, and the working method is that the rotatory centrifugal force that produces of adjustment makes waiting to plate the work piece and adhere to on the negative pole and electroplate. The electroplating efficiency of the electroplating basket 5 of the technical scheme achieves the electroplating effect of the centrifugal machine, and the workpiece to be plated can be completely isolated from the anode, so that the product adhesion risk is reduced.
Preferably, the working groove 221 is provided with a suspension ring 226 inside, and the anode member 224 is suspended from the suspension ring 226.
Further describing, the plating solution circulating device 1 includes a recovery tank 11 and a main chemical tank 12, an output end of the recovery tank 11 is connected to an input end of the main chemical tank 12, the recovery end 2214 and the overflow port 2211 are respectively connected to an input end of the recovery tank 11, and the first liquid inlet end 2212 and the second liquid inlet end 2213 are respectively communicated to an output end of the main chemical tank 12.
Specifically, the plating solution circulating apparatus 1 according to the present embodiment is a plating solution circulating apparatus 1 conventional in the art, such as: a liquid medicine circulation system for electroplating machines with application number 202110007093.0.
Further illustratively, the plating liquid supply apparatus further includes a first solenoid valve 31, a second solenoid valve 32, and a third solenoid valve 33;
The first electromagnetic valve 31 is disposed between the output end of the main drug tank 12 and the first liquid inlet end 2212, the second electromagnetic valve 32 is disposed between the output end of the main drug tank 12 and the second liquid inlet end 2213, and the third electromagnetic valve 33 is disposed between the input end of the recovery tank 11 and the recovery end 2214.
It should be noted that, during the electroplating process, the first electromagnetic valve 31 and the second electromagnetic valve 32 are always opened, so that the electroplating solution processed in the main solution tank 12 continuously enters the working tank 221 through the first solution inlet end 2212 and the second solution inlet end 2213, the working tank 221 is continuously supplied with the electroplating solution, and when the electroplating solution reaches the working amount, the electroplating solution still injected flows back to the recovery tank 11 from the overflow port 2211 of the working tank 221. The recovery end 2214 is in a closed state in the electroplating process, so that the electroplating liquid cannot flow out of the recovery end 2214, thereby ensuring the electroplating effect and the electroplating efficiency. After the plating operation, all the liquid supply is stopped by closing the first electromagnetic valve 31 and the second electromagnetic valve 32, the third electromagnetic valve 33 is opened, the remaining plating liquid in the working tank 221 is recovered, and the above-described circulation operation is performed sequentially.
Further, the electroplating liquid supply apparatus further includes a first power pump 41 and a second power pump 42, where the first power pump 41 is connected to the output end of the main chemical tank 12, and the second power pump 42 is disposed between the output end of the recovery tank 11 and the input end of the main chemical tank 12.
It should be noted that, in this embodiment, the output end of the main liquid medicine tank 12 is connected with a first power pump 41, and the electroplating liquid in the main liquid medicine tank 12 can be conveyed into the working tank by the first power pump 41. The second power pump 42 is arranged between the output end of the recovery tank 11 and the input end of the main liquid medicine tank 12, the returned electroplating solution is stored in the recovery tank 11 to a certain capacity, and then is supplied into the main liquid medicine tank 12 through the second power pump 42, so that the recovered electroplating solution is electrolyzed, filtered and heated in the main liquid medicine tank 12, and finally is injected into the working tank 221 again for exchange.
To further illustrate, a liquid level sensor 225 is further disposed inside the working tank 221, and the installation height of the liquid level sensor 225 corresponds to the installation height of the overflow port 2211.
In order to better control the working amount of the plating solution, a level sensor is installed in the working tank 221, and when the injected plating solution exceeds the controlled amount, the supply is slowed down or intermittently stopped.
Further describing, the electroplating liquid supply apparatus further includes a rotating bracket 222 and a connection tray 223, the connection tray 223 is located inside the working groove 221, the rotating bracket 222 is fixedly connected to the bottom of the working groove 221, and the connection tray 223 is rotatably connected to the top of the rotating bracket 222;
The bottom of the plating basket 5 is connected with the connection tray 223;
the second liquid inlet 2213 is located inside the rotating bracket 222.
In the technical scheme, the bottom of the electroplating basket 5 is connected with the connecting tray 223, and the position of the electroplating basket 5 can be fixed through the connecting tray 223, so that the electroplating basket 5 rotates around the center of the electroplating basket 5.
Preferably, a connecting seat is arranged in the middle of the connecting tray 223, a plurality of protruding blocks are arranged at intervals at the top of the connecting seat, and a plurality of protruding blocks are circumferentially arranged at intervals; the top edge of the lug is provided with a chamfer;
the base 53 is provided with a plurality of grooves 532 at intervals along the circumference, the grooves 532 correspond to the protrusions 22311 in the vertical direction, and the protrusions 22311 are snap-coupled with the grooves 532 when the plating basket is mounted to the connection tray.
The present solution enables the base 53 and the connection tray 223 to be engaged by the cooperation of the groove 53 and the protrusion 22311, and when in use, the base 53 can be automatically engaged with the connection tray 223 without limiting the direction, thereby ensuring reliable and safe transmission and low noise.
Preferably, the smooth transition between the faces of the bump enables the connection tray 223 and the base 53 to be connected together more simply and quickly, and the transmission is more reliable and safer, and the noise is lower.
To further illustrate, the basket body includes a casing 52 and an inner bottom plate 54, the casing 52 is disposed around the outer portion of the inner bottom plate 54, the casing 52 and the inner bottom plate 54 are connected to form the basket body, and the cathode ring 55 is disposed on the inner wall of the casing 52; the center of the inner chassis 54 protrudes upward to form the mounting portion 541; the screwing cover 56 is covered on the top of the outer shell 52;
the electroplating basket 5 further comprises a base 53, the base 53 is mounted at the bottom of the basket body, the base 53 is provided with a second liquid medicine channel 531 penetrating from bottom to top, the first liquid medicine channel 5411 is communicated with the second liquid medicine channel 531, and the second liquid medicine channel 531 is communicated with the second liquid inlet end 2213;
the base 53 is used for connecting the connection tray 223, and when the base 53 and the connection tray 223 are connected, the horizontal height of the overflow port 2211 is higher than the horizontal height of the screwing cap 56.
Preferably, the mounting portion 541 is provided with a plurality of first liquid medicine channels 5411, the base 53 is provided with a plurality of second liquid medicine channels 531, the plurality of first liquid medicine channels 5411 and the plurality of second liquid medicine channels 531 are respectively communicated in a one-to-one correspondence manner, and by setting the plurality of first liquid medicine channels 5411 and the plurality of second liquid medicine channels 531, the internal efficiency of electroplating solution injection into the electroplating basket 5 can be increased.
Preferably, a reading magnetic card is arranged in the middle of the base 53, and real-time data of the production process can be recorded and provided through the reading magnetic card.
To further illustrate, a transparent net cover 561 is disposed in the middle of the screwing cover 56, and a plurality of overflow holes 5611 are disposed on the transparent net cover 561;
the outer ring of the screwing cap 56 is provided with a plurality of top row holes 562, the plurality of top row holes 562 are respectively distributed on the periphery of the transparent net cap 561, and the positions of the top row holes 562 correspond to the positions of the inner wall of the cathode ring 55;
each top row of holes 562 is respectively provided with a detachable pressing block 563, the size of each pressing block 563 corresponds to the size of each top row of holes 562, and when the electroplating basket 5 is in a working state, each pressing block 563 is embedded into each top row of holes 562.
According to the technical scheme, the transparent net cover 561 is arranged in the middle of the screwing cover 56, the transparent net cover 561 is internally provided with the plurality of overflow holes 5611, and when the electroplating solution fills the inside of the electroplating basket 5, the overflow holes 5611 through which the excessive electroplating solution can pass overflow and flow into the working groove 221. Meanwhile, the transparent net cover 561 in the scheme is transparent, so that the situation inside the electroplating basket 5 can be conveniently observed.
It should be noted that, in the present technical solution, a plurality of top row holes 562 are provided on the outer ring of the screwing cap 56, and the plurality of top row holes 562 are respectively located above the inner wall of the cathode ring 55, and when the electroplating operation is completed, the electroplating solution inside the electroplating basket 5 can be discharged from the top row holes 562 by accelerating the rotation speed of the electroplating basket 5, so as to drain the electroplating solution inside the electroplating basket 5 completely. When the electroplating work is performed, the pressing block 563 needs to be embedded into the top row holes 562, so that the workpiece to be plated is prevented from flying out of the top row holes 562 in the electroplating process, and the electroplating work is prevented from being affected.
A plurality of limit grooves 521 are arranged on the periphery of the top of the shell 52, and the groove openings of the limit grooves 521 extend to the top end of the shell 52;
the inner side wall of the screwing cap 56 is provided with a plurality of buckles 564 matched with the limit groove 521, and the width of the groove opening of the limit groove 521 is larger than that of the buckles 564.
The screw cap 56 is required to be frequently detached during the plating process, so that the plating basket 5 is put in a work piece to be plated or a plated product is taken out, and the operations are sequentially circulated. The body and cover of the generally conventional plating basket 5 are screwed or otherwise compressed using a snap-in-place like structure. If the screw is used for locking, a plurality of screws are used for locking, so that the workload is increased, and the screws or screw holes can slide teeth due to frequent disassembly and assembly. Another structure similar to a quick clamp is used for pressing, the structure has a common problem, under the condition of frequent use, the structure can be slowly loosened and locked, and the structure is more deadly to adjust and calibrate frequently, so that the structure cannot be cared for during operation when the structure is slightly loosened, and serious consequences can appear if the structure is used continuously. Therefore, the technical scheme provides a novel screwing cover structure, the screwing cover 56 and the shell 52 can be locked by slightly rotating the screwing cover 56 through the cooperation of the limiting groove 521 and the buckle 564, the screwing cover 56 can be quickly covered on the top of the shell 52, and the screwing cover structure adopting the technical scheme is convenient and fast to operate, safe and reliable, can reduce the labor intensity of manpower, greatly saves the time cost and improves the production efficiency.
Preferably, the outer circumference of the screw cap 56 is provided with vertical grooves and recesses, which can increase friction during screwing and facilitate manual operation.
Preferably, the top surface of the buckle 564 is provided with a slope, and the upper jaw of the limit groove 521 is also provided with a slope, which is matched with the slope of the buckle 564, so that the two parts are more and more fastened when being screwed together.
Further illustratively, the plating basket 5 further includes a plurality of locking screws 57, and the screw cap 56 is coupled to the housing 52 by the locking screws 57.
According to the technical scheme, the locking screw 57 is additionally used, so that the connection between the screwing cover 56 and the shell 52 is firmer, the loosening is further prevented, and double-insurance locking is realized. Because the technical scheme has locked the screwing cover 56 and the outer shell 52 through the cooperation of the limit groove 521 and the buckle 564, the number of the locking screws 57 used in the technical scheme can be reduced, so that the difficulty and time for disassembling the screwing cover 56 are reduced.
Preferably, the plating basket 5 is provided with four locking screws 57, and the four locking screws 57 are respectively provided at the outer circumference of the screw-on cover 56 at uniform intervals.
Further, the top end of the connecting rod 51 is provided with a second connector 511, and the second connector is connected to a power device.
Specifically, the operation method and the working flow of the electroplating basket 5 in the technical scheme are as follows: firstly, the locking screw 57 is removed, the screwing cover 56 is taken off, a workpiece to be plated is placed at the bottom of the inner chassis 54, then the screwing cover 56 is covered, the clamping buckle 564 of the screwing cover 56 is aligned with the limit groove 521 on the shell 52, and the screwing cover 56 is lightly rotated until locking is achieved; locking the locking screw 57 to strengthen the tightening performance of the screwing cap 56; the entire plating basket 5 is then placed in the working tank where plating is performed, and the plating basket 5 is connected to the power unit through the connector 511. The electroplating solution for electroplating enters the electroplating basket 5 through the second liquid medicine channel 531 and enters the electroplating basket 5 through the first liquid medicine channel 5411, and then overflows from the transparent net cover 561, and the electroplating solution is filled up to the set position in the working groove, so that the electroplating work is started; the electroplating basket 5 rotates according to the parameters set by the system, and the workpiece to be plated is attached to the inner wall of the cathode ring due to the centrifugal force formed by rotation, and the product is driven to uniformly contact the cathode ring under the action of the centrifugal force, so that the circulating motion is formed, and the batch of workpieces to be plated can complete the electroplating process without difference.
Further describing, the electroplating liquid supply apparatus further includes a power device 7 in transmission connection with the electroplating basket 5, where the power device 7 includes a base plate 71, a first driving mechanism 72 and a turnover assembly 73, the base plate 71 is fixedly installed on an external fixing frame, the first driving mechanism 72 is installed on the base plate 71, the first driving mechanism 72 is in transmission connection with the turnover assembly 73, and the first driving mechanism 72 is used to drive the turnover assembly 72 to perform a turnover motion, so as to drive the turnover assembly 72 to approach or depart from the external electroplating basket; the turnover assembly 73 is provided with a second driving mechanism 731, the output end of the second driving mechanism 731 is used for being connected with an external electroplating basket, and when the turnover assembly 73 performs turnover movement to a horizontal state, the output end of the second driving mechanism 731 can be in transmission connection with the electroplating basket, so that the electroplating basket is driven to perform rotary movement along a horizontal plane;
The turnover assembly 73 further comprises a mounting plate 732, and one end of the mounting plate 732 is in transmission connection with the first driving mechanism 72;
the second driving mechanism 731 includes a second motor 7311, a driving chain 7312 and a driving shaft assembly 7313, the second motor 7311 is mounted on a mounting plate 732, and a rotating end of the second motor 7311 passes through the mounting plate 732 and is located below the mounting plate 732; the transmission shaft assembly 7313 is vertically arranged on the mounting plate 732, the transmission shaft assembly 7313 is rotatably connected with the mounting plate 732, and the rotating end of the second motor 7311 is in transmission connection with the transmission shaft assembly 7313 through the transmission chain 7312;
the bottom of the transmission shaft assembly 7313 is provided with a first connector 73131, the top of the connecting rod 51 is provided with a second connector 511, and the first connector 73131 is connected with the second connector 511.
It is worth to say that, this technical scheme designs a simple structure, leakproofness are good, save space and mobilizable power device 7, and power device 7 that passes through makes electroplating basket 5 do rotary motion in the working tank. The power device of the technical scheme comprises a base plate 71, a first driving mechanism 72 and a turnover assembly 73, wherein the base plate 71 is fixedly arranged on an external fixing frame, the first driving mechanism 72 is arranged on the base plate 71, and the turnover assembly 73 is in transmission connection based on the first driving mechanism 72. Through the driving action of the first driving mechanism 72, the turnover assembly 73 can be driven to perform turnover movement, when the electroplating basket 5 is placed in the working groove 221 and needs to be electroplated, the first driving mechanism 72 drives the turnover assembly 73 to gradually turn down from a vertical state to a horizontal direction, when the turnover assembly 73 turns down to the horizontal state, the output end of the second driving mechanism 731 is connected with the top end of the electroplating basket, then the second driving mechanism 731 drives the electroplating basket to perform rotary movement, and a workpiece to be plated in the electroplating basket moves to the inner side wall of the electroplating basket and contacts with the cathode of the inner side wall of the electroplating basket through the action of centrifugal force, so that electroplating is performed, and the workpiece to be plated forms a plating layer; after the plating is completed, the first driving mechanism 72 drives the flip assembly 73 to flip up slowly from the horizontal state to the vertical state. Because the power device of this technical scheme is turned over to vertical state after electroplating is accomplished, can avoid the upset subassembly 73 to be in directly over the working groove of long-time, can reduce the corruption of electroplating solution steam to upset subassembly 73 to the life of extension upset subassembly 73 and whole power device. Moreover, as the power device adopts the flip-type movement, compared with a horizontal movement structure adopting a guide rail type, the power device can greatly save the occupied space.
In the technical scheme, the second motor 7311 is in transmission connection with the transmission shaft assembly 7313 through the transmission chain 7312, after the second motor 7311 is started, the rotating end of the second motor 7311 rotates, the transmission shaft assembly 7313 can be driven to rotate through the transmission effect of the transmission chain 7312, the first connector 73131 based on the bottom of the transmission shaft assembly 7313 is used for connecting the second connector 511 of the electroplating basket 5, when the transmission shaft assembly 7313 rotates, the electroplating basket can be driven to rotate, so that a workpiece to be plated in the electroplating basket moves to the inner side wall of the electroplating basket under the action of centrifugal force, the inner side wall cathode of the electroplating basket contacts, and a plating layer can be formed on the surface of the workpiece to be plated through electroplating.
Preferably, the transmission chain 7312 of the present embodiment is a silent chain, which is a standard part, commercially available, and is used for transmission, which has the advantages of heavy load, silence, high speed, and durability.
To further illustrate, the rotating end of the second motor 7311 is provided with a first transmission gear 73111, and the transmission shaft assembly 7313 includes a transmission shaft 73132, a bearing housing 73133, and a second transmission gear 73134; the bearing housing 73133 is fixedly mounted to the mounting plate 732; the transmission shaft 73132 is vertically arranged on the mounting plate 732, the top of the transmission shaft 73132 is connected with the bearing seat 73133, and the bottom of the transmission shaft 73132 is connected with the first joint 73131;
The second transmission gear 73134 is disposed in the middle of the transmission shaft 73132, and the first transmission gear 73111 and the second transmission gear 73134 are in transmission connection through the transmission chain 7312;
the transmission shaft assembly 7313 further comprises a conductive shaft 73135, a limit nut 73136, a limit sliding sleeve 73137 and a spring 73138, wherein the conductive shaft 73135 is installed inside the transmission shaft 73132, the top of the conductive shaft 73135 is connected with the limit nut 73136, the limit nut 73136 is sleeved outside the conductive shaft 73135, the bottom of the conductive shaft 73135 is connected with the limit sliding sleeve 73137, and the bottom of the limit sliding sleeve 73137 is connected with the first connector 73131;
the lower part of the transmission shaft 73132 is provided with a transmission part 731321, the outer wall of the transmission part 731321 is provided with at least one transmission plane 7313211, and the transmission plane 7313211 is opened from the outer side of the transmission part 731321 to the axial center direction; the sliding sleeve 73137 is provided with a limit groove matched with the transmission part 731321, the groove opening of the limit groove faces the transmission part 731321, the transmission part 731321 is arranged in the limit groove, the limit sliding sleeve 73137 is sleeved outside the transmission part 731321, and the bottom wall of the limit groove is attached to the outer wall of the transmission part 731321;
The transmission part 731321 is internally provided with a mounting groove for mounting the spring 73138, the spring 73138 is sleeved outside the conductive shaft 73135, the spring 73138 is positioned in the mounting groove, one end of the spring 73138 is propped against the top wall of the mounting groove, and the other end is propped against the bottom wall of the limiting groove;
it should be noted that, as shown in fig. 15, the outer wall of the transmission portion 731321 in the present technical solution is provided with at least one transmission plane 7313211, and through the cooperation of the transmission plane 7313211 and the limiting sliding sleeve 73137, the sliding sleeve 73137 in the present technical solution can move up and down along with the conductive shaft 73135, meanwhile, the sliding sleeve 73137 can also move rotationally along with the transmission shaft 73132, and the first connector 73131 is connected with the sliding sleeve 73137, so that the first connector 73131 can achieve the effect of not only moving up and down, but also moving rotationally, and meanwhile, the power source can be transmitted to the plating basket through the conductive shaft 73135, thereby performing plating.
The turnover assembly 73 further comprises two driving cylinders 735 and a push plate 736, the push plate 736 is sleeved outside the conductive shaft 73135, and the push plate 736 is located between the limit nut 73136 and the bearing seat 73133; the two driving cylinders 735 are respectively mounted on two sides of the mounting plate 732, and telescopic ends of the two driving cylinders 735 are respectively connected with two ends of the push plate 736;
A distance for the push plate 736 to move up and down is arranged between the limit nut 73136 and the limit sliding sleeve 73137; two of the driving cylinders 735 are used to drive the push plate 736 to move up and down.
The first transmission gear 73111 and the second transmission gear 73134 in this technical scheme are in transmission connection with the transmission chain 7312, when the second motor 7311 works, the first transmission gear 73111 can be driven to rotate, so as to drive the second transmission gear 73134 to rotate, based on the fixed connection of the second transmission gear 73134 and the transmission shaft 73132, the transmission shaft 73132 can be driven to rotate, so as to drive the first connector 73131 to rotate, and when the first connector 73131 at the bottom of the transmission shaft 73132 is connected with the electroplating basket, the rotation motion can be transmitted, so that the electroplating basket is driven to rotate in a working groove filled with electroplating liquid.
It should be noted that, if the turnover assembly 73 is turned down to the horizontal state, the first connector 73131 is disconnected from the second connector 511, it is difficult to connect the first connector 73131 with the second connector 511, so the turnover assembly 73 of the present embodiment is further provided with a driving cylinder 735 for driving the conductive shaft 73135 to move up and down, when the turnover assembly 73 is turned down to the horizontal state, the first connector 73131 is located directly above the second connector 511, a small distance is provided between the first connector 73131 and the second connector 511, at this time, the telescopic end of the driving cylinder 735 contracts, so as to drive the push plate 736 to slowly descend, and the push plate 736 slowly descends so that the conductive shaft 73135 also slowly descends until the first connector 73131 and the second connector 511 are mutually connected. The flip assembly 73 of the present solution enables better coupling of the first connector 73131 and the second connector 511 without damaging the machine.
Specifically, the working principle of the overturning assembly 73 in the technical solution is as follows: when the turnover assembly 73 is not in a horizontal state, the driving cylinder 735 is pushed upwards, and the push plate 7 simultaneously pushes the conductive shaft 73135, the limit nut 73136, the limit sliding sleeve 73137 and the first connector 73131 upwards; after the plating basket is placed at a fixed position in the working groove, the first driving mechanism 72 drives the turnover assembly 73 to turn downwards to be in a horizontal state, and at the moment, the first connector 73131 and the second connector of the plating basket form axial alignment; at this time, the telescopic end of the driving cylinder 735 is retracted, and drives the push plate 736 to descend, so that the conductive shaft 73135, the limit nut 73136, the limit sliding sleeve 73137 and the first connector 73131 descend simultaneously, the first connector 73131 is pressed towards the second connector of the electroplating basket, and under the pressure action of the spring 73138, the two connectors are tightly sealed and matched, so that transmission or power supply conduction is realized. The power is transferred to the plating basket through the conductive shaft 73135, the stop collar 73137 and the first connector 73131. After the two connectors are tightly sealed and matched, under the driving action of the second driving mechanism 731, the transmission shaft 73132 is driven to rotate, and based on the transmission connection of the limiting sliding sleeve 73137 and the transmission shaft 73132, the limiting sliding sleeve 73137 can be driven to rotate, so that the first connector 73131 is driven to rotate, the electroplating basket is driven to rotate, and the power supply is transmitted simultaneously during rotation.
The first driving mechanism 72 includes a first motor 721, a decelerator 722, a third transmission gear set including two third transmission gears 723, and a driven mechanism 724 including a rotation shaft 7241 and two driven gears 7242;
the rotating shaft 7241 is detachably mounted above the base plate 71, two ends of the rotating shaft 7241 are respectively connected with the two driven gears 7242, and the rotating shaft 7241 is connected with one end of the mounting plate 732;
the speed reducer 722 is mounted at the bottom of the base plate 71, an output shaft of the first motor 721 is in transmission connection with an input end of the speed reducer 722, and two ends of an output shaft 7221 of the speed reducer 722 are respectively connected with two third transmission gears 723; the two third transmission gears 723 are respectively meshed with the corresponding two driven gears 7242.
According to the technical scheme, the speed reducer 722 is arranged, the first motor 721 slows down through the speed reducer 722 and is transmitted through the third transmission gear 723, and the whole overturning assembly 73 can be overturned from the horizontal position to be about 90 degrees slowly; or the entire flip assembly 73 is flipped from a vertical position to a horizontal position.
Further, the two sides of the rotation shaft 7241 are respectively provided with a connection portion 72411, and the connection portion 72411 is connected to the driven gear 7242;
A mounting space 72412 is provided in the middle of the rotating shaft 7241, a fixing portion 7321 is provided on a side of the mounting plate 732, which is connected to the rotating shaft 7241, and the fixing portion 7321 is mounted in the mounting space 72412;
the flip power device further comprises a limiting block 74, the limiting block 74 is in an L shape, the bottom end of the limiting block 74 abuts against the fixing portion 7321, the fixing portion 7321 is connected with the rotating shaft 7241 through a screw, and the limiting block 74 is connected with the fixing portion 7321 through a screw.
It should be noted that, in this technical solution, the fixing portion 7321 and the rotating shaft 7241 can be conveniently connected by arranging the installation space 72412 in the middle of the rotating shaft 7241 and arranging the plane on which the installation space 72412 is located, so that the connection between the fixing portion 7321 and the rotating shaft 7241 can be more stable and reliable, and the fixing portion 7321 can be further reinforced by the limiting block 74, so that the connection relationship between the fixing portion 7321 and the rotating shaft 7241 is more firm and stable.
Further describing, the flipping assembly 73 further includes a first protective housing 733 and a second protective housing 734, the first protective housing 733 covers the top surface of the mounting plate 732, and the second protective housing 734 covers the bottom surface of the mounting plate 732;
The main body of the second motor 7311, the bearing housing 73133 and the upper portion of the driving shaft 73132 are all located inside the first protective case 733, the first driving gear 73111, the second driving gear 73134 and the driving chain 7312 are all located inside the second protective case 734, and the first joint 73131 is located below the second protective case 734.
According to the technical scheme, the first protective shell 733 and the second protective shell 734 are respectively arranged on the top surface and the bottom surface of the mounting plate 732, the second driving mechanism 731 can be hidden in the first protective shell 733 and the second protective shell 734, the second connector 511 is only required to be arranged outside the second protective shell 734 and used for being connected with an electroplating basket, the second driving mechanism 731 can be better protected, and steam generated by electroplating liquid is prevented from corroding metal parts and electrical elements, so that the service life of the second driving mechanism 731 is effectively prolonged, and the normal exertion of a transmission function is ensured. In addition, the first driving mechanism 72 in the present embodiment is installed outside the working tank, and does not substantially contact with the vapor generated from the plating solution in the working tank, so that the protective case may not be provided outside the first driving mechanism 72.
Further described, the flip-type power plant further includes a protective cover 75, the protective cover 75 is mounted on the top of the base plate 71, and the protective cover 75 covers the driven gear 7242.
The driven gear 7242 in this technical scheme is mounted on the top of the base plate 71 and is located at a position close to the working groove 221, so that the protective cover 75 is provided outside the driven gear 7242 in this technical scheme, which can play a role in protecting the driven gear 7242 and prevent the driven gear 7242 from being corroded by steam generated by the plating solution.
Other configurations and the like of plating solution supply apparatuses for producing microelectronic devices according to embodiments of the present invention and the operation thereof are known to those of ordinary skill in the art and will not be described in detail herein.
In the description herein, reference to the term "embodiment," "example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. The electroplating liquid supply equipment for producing the miniature electronic components is characterized by comprising an electroplating liquid circulation device, an electroplating basket, a working groove and an anode piece, wherein the electroplating basket is rotatably arranged in the working groove, the anode piece is positioned in the working groove, and the anode piece is arranged outside the electroplating basket;
the bottom end of the working tank is provided with a first liquid inlet end, a second liquid inlet end and a recovery end, the upper part of the working tank is provided with an overflow port, the first liquid inlet end and the second liquid inlet end are respectively communicated with the output end of the electroplating liquid circulating device, and the recovery end and the overflow port are respectively connected with the input end of the electroplating liquid circulating device; the height of the overflow port corresponds to the working water level of the electroplating liquid in the working tank;
the electroplating basket comprises a basket body, a connecting rod and a screwing cover, wherein an electroplating cavity is formed in the top surface of the basket body in a downward sinking mode, the screwing cover is arranged on the top of the electroplating cavity, and a cathode ring is arranged on the inner wall of the basket body;
The center of the basket body protrudes upwards to form an installation part, and the bottom end of the connecting rod is fixedly connected with the installation part; the installation department is equipped with from down supreme first liquid medicine passageway that runs through, the delivery outlet of first liquid medicine passageway is located the top of installation department, first liquid medicine passageway with second feed liquor end intercommunication.
2. The plating liquid supply apparatus for producing a microelectronic device according to claim 1, wherein said plating liquid circulating means comprises a recovery tank and a main chemical tank, an output end of said recovery tank is connected to an input end of said main chemical tank, said recovery end and said overflow port are respectively connected to an input end of said recovery tank, and said first liquid inlet end and said second liquid inlet end are respectively connected to an output end of said main chemical tank.
3. The plating liquid supply apparatus for producing a microelectronic element according to claim 2, wherein the plating liquid supply apparatus further comprises a first solenoid valve, a second solenoid valve, and a third solenoid valve;
the first electromagnetic valve is arranged between the output end of the main medicine water tank and the first liquid inlet end, the second electromagnetic valve is arranged between the output end of the main medicine water tank and the second liquid inlet end, and the third electromagnetic valve is arranged between the input end of the recovery tank and the recovery end.
4. The plating liquid supply apparatus for producing a microelectronic device according to claim 2, further comprising a first power pump and a second power pump, wherein the first power pump is connected to the output end of the main medicine tank, and the second power pump is provided between the output end of the recovery tank and the input end of the main medicine tank.
5. The plating liquid supply apparatus for producing a microelectronic device according to claim 1, wherein a liquid level sensor is further provided inside the working tank, and a mounting height of the liquid level sensor corresponds to a mounting height of the overflow port.
6. The plating liquid supply apparatus for producing a microelectronic device according to claim 1, further comprising a rotary bracket and a connection tray, said connection tray being located inside said working tank, said rotary bracket being fixedly connected to the bottom of said working tank, said connection tray being rotatably connected to the top of said rotary bracket;
the bottom of the electroplating basket is connected with the connecting tray;
the second liquid inlet end is positioned in the rotary bracket.
7. The plating liquid supply apparatus for manufacturing a microelectronic device according to claim 6, wherein said basket body comprises an outer shell and an inner chassis, said outer shell being enclosed outside said inner chassis, said outer shell and said inner chassis being connected to form said basket body, said cathode being looped around an inner wall of said outer shell; the center of the inner chassis protrudes upwards to form the mounting part; the screwing cover is covered on the top of the shell;
The electroplating basket further comprises a base, the base is arranged at the bottom of the basket body, the base is provided with a second liquid medicine channel penetrating from bottom to top, the first liquid medicine channel is communicated with the second liquid medicine channel, and the second liquid medicine channel is communicated with the second liquid inlet end;
the base is used for being connected with the connecting tray, and when the base is connected with the connecting tray, the horizontal height of the overflow port is higher than the horizontal height of the screwing cover.
8. The electroplating liquid supply apparatus for producing miniature electronic components of claim 7, wherein a transparent net cover is arranged in the middle of said screwing cover, and a plurality of overflow holes are arranged on said transparent net cover;
the outer ring of the screwing cover is provided with a plurality of top row holes, the plurality of top row holes are respectively distributed on the periphery of the transparent net cover, and the positions of the top row holes correspond to the positions of the inner wall of the cathode ring;
and each top row hole is respectively provided with a detachable pressing block, the size of each pressing block corresponds to the size of each top row hole, and when the electroplating basket is in a working state, the pressing blocks are embedded into the top row holes.
9. The electroplating liquid supply apparatus for producing miniature electronic components of claim 1, further comprising a power device in driving connection with the electroplating basket, wherein the power device comprises a base plate, a first driving mechanism and a turnover assembly, the base plate is fixedly arranged on an external fixing frame, the first driving mechanism is arranged on the base plate, the first driving mechanism is in driving connection with the turnover assembly, and the first driving mechanism is used for driving the turnover assembly to perform turnover movement so as to drive the turnover assembly to approach or separate from the external electroplating basket; the turnover assembly is provided with a second driving mechanism, the output end of the second driving mechanism is used for being connected with an external electroplating basket, and when the turnover assembly performs turnover movement to a horizontal state, the output end of the second driving mechanism can be in transmission connection with the electroplating basket, so that the electroplating basket is driven to perform rotary movement along a horizontal plane;
The overturning assembly further comprises a mounting plate, and one end of the mounting plate is in transmission connection with the first driving mechanism;
the second driving mechanism comprises a second motor, a transmission chain and a transmission shaft assembly, the second motor is mounted on a mounting plate, and the rotating end of the second motor penetrates through the mounting plate and is positioned below the mounting plate; the transmission shaft assembly is vertically arranged on the mounting plate and is in rotary connection with the mounting plate, and the rotary end of the second motor is in transmission connection with the transmission shaft assembly through the transmission chain;
the bottom of transmission shaft subassembly is equipped with first joint, the top of connecting rod is equipped with the second and connects, first joint with the second connects and connects.
10. The plating liquid supply apparatus for producing a microelectronic device according to claim 9, wherein a rotating end of said second motor is provided with a first transmission gear, said transmission shaft assembly including a transmission shaft, a bearing housing and a second transmission gear; the bearing seat is fixedly arranged on the mounting plate; the transmission shaft is vertically arranged on the mounting plate, the top of the transmission shaft is connected with the bearing seat, and the bottom of the transmission shaft is connected with the first joint;
The second transmission gear is arranged in the middle of the transmission shaft, and the first transmission gear is in transmission connection with the second transmission gear through the transmission chain;
the transmission shaft assembly further comprises a conductive shaft, a limit nut, a limit sliding sleeve and a spring, wherein the conductive shaft is arranged in the transmission shaft, the top of the conductive shaft is connected with the limit nut, the bottom of the conductive shaft is connected with the limit sliding sleeve, and the bottom of the limit sliding sleeve is connected with the first joint;
the lower part of the transmission shaft is a transmission part, the outer wall of the transmission part is provided with at least one transmission plane, and the transmission plane is arranged in the axial direction from the outer side of the transmission part; the limiting sliding sleeve is sleeved outside the transmission part, and the inner wall of the limiting sliding sleeve is attached to the outer wall of the transmission part;
the spring is sleeved outside the conductive shaft, the spring is positioned in the mounting groove, one end of the spring is propped against the top wall of the mounting groove, and the other end of the spring is propped against the inner wall of the sliding sleeve;
the overturning assembly further comprises two driving cylinders and a push plate, the push plate is sleeved outside the conductive shaft, and the push plate is positioned between the limit nut and the bearing seat; the two driving cylinders are respectively arranged at two sides of the mounting plate, and the telescopic ends of the two driving cylinders are respectively connected with two ends of the push plate;
A distance for the push plate to move up and down is arranged between the limit nut and the limit sliding sleeve; the two driving cylinders are used for driving the push plate to move up and down.
CN202311373903.XA 2023-10-20 2023-10-20 Electroplating liquid supply equipment for producing miniature electronic components Pending CN117512751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311373903.XA CN117512751A (en) 2023-10-20 2023-10-20 Electroplating liquid supply equipment for producing miniature electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311373903.XA CN117512751A (en) 2023-10-20 2023-10-20 Electroplating liquid supply equipment for producing miniature electronic components

Publications (1)

Publication Number Publication Date
CN117512751A true CN117512751A (en) 2024-02-06

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ID=89759606

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311373903.XA Pending CN117512751A (en) 2023-10-20 2023-10-20 Electroplating liquid supply equipment for producing miniature electronic components

Country Status (1)

Country Link
CN (1) CN117512751A (en)

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