CN117507163B - Spacing-adjustable wafer cutting equipment and process - Google Patents
Spacing-adjustable wafer cutting equipment and process Download PDFInfo
- Publication number
- CN117507163B CN117507163B CN202410001144.2A CN202410001144A CN117507163B CN 117507163 B CN117507163 B CN 117507163B CN 202410001144 A CN202410001144 A CN 202410001144A CN 117507163 B CN117507163 B CN 117507163B
- Authority
- CN
- China
- Prior art keywords
- wafer
- blades
- cutting
- adjustable
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000008569 process Effects 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 230000009471 action Effects 0.000 claims abstract description 9
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910003460 diamond Inorganic materials 0.000 description 8
- 239000010432 diamond Substances 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a spacing-adjustable wafer cutting device and a spacing-adjustable wafer cutting process, wherein the spacing-adjustable wafer cutting process comprises the steps of cutting a wafer by adopting the spacing-adjustable wafer cutting device; the wafer cutting equipment with the adjustable distance comprises a center rod, blades and an adjusting mechanism, wherein the blades are sleeved on the center rod and can slide along the length direction of the rod of the center rod, the number of the blades is multiple, the distance between every two adjacent blades is L, and the adjusting mechanism is configured to be capable of adjusting the size of the L. In the process of cutting the wafer, the spacing between a plurality of blades can be adjusted in an equal proportion under the action of the adjusting mechanism, so that chips with different sizes can be cut according to requirements, the universality is higher, the mode that the plurality of blades simultaneously cut the wafer is adopted, the working time of the wafer during cutting can be reduced, and the cutting efficiency of the wafer is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to spacing-adjustable wafer cutting equipment and a spacing-adjustable wafer cutting process.
Background
Along with the development of technology, silicon is widely applied to various fields as a nonmetallic material, and can be applied from the advanced technology field to the domestic light industry field; when the wafer is applied in the semiconductor industry, the wafer needs to be cut to meet the shape requirement of the chip, in the process of cutting the wafer, grid-shaped cutting channels need to be processed on the surface of the wafer, and then the wafer is cut along the cutting channels, so that the whole wafer is divided into a plurality of single chips according to the size of the chip.
The existing wafer cutting methods mainly comprise three types: the diamond tool method, the laser etching method and the diamond wheel method, wherein the diamond wheel method grinds slices by high-speed rotation of the diamond wheel, and the method is characterized by high efficiency and low residual stress, however, the existing technology is to only install a piece of diamond wheel on the grinding wheel, and the diamond wheel needs to be respectively scratched on a wafer for many times in the transverse direction and the vertical direction to finish cutting of one wafer, so that the efficiency is low.
In order to solve the problem of low cutting efficiency of the existing diamond grinding wheel method, in the related art, for example, chinese patent document with the authority publication number CN112466793B discloses a chip wafer dicing device, and the chip wafer dicing device is provided with a plurality of diamond grinding wheels on a grinding wheel, so that in the process of cutting a wafer, all cutting grooves in one direction can be cut at a time, thereby improving the cutting efficiency.
The chip wafer dicing device improves the efficiency of dicing the wafer to a certain extent, but in the actual working process, the chip wafer dicing device only can dice the wafer with dicing channels with preset intervals, so that the dicing requirements of chips with different sizes cannot be met, and the universality is poor.
Disclosure of Invention
Based on this, it is necessary to provide a pitch-adjustable wafer dicing apparatus and process for solving the problem of poor versatility of the current wafer dicing apparatus.
The above purpose is achieved by the following technical scheme:
the spacing-adjustable wafer cutting equipment comprises a central rod, blades and an adjusting mechanism, wherein the blades are sleeved on the central rod and can slide along the length direction of the rod of the central rod, the number of the blades is multiple, and the distance between two adjacent blades is L; the adjustment mechanism is configured to be able to adjust the size of L.
Further, the adjusting mechanism comprises a spacing adjusting assembly and a clamping assembly, wherein the spacing adjusting assembly is configured to drive the blade to slide along the rod length direction of the central rod; the clamping assembly is configured to enable all of the blades to be clamped.
Further, the interval adjusting assembly comprises a guide rail, a wedge block and two sleeves, wherein the two sleeves are symmetrically arranged and respectively sleeved at two ends of the center rod and can synchronously move along opposite directions, and each sleeve is provided with a conical surface; the guide rail extends along the rod length direction of the central rod and is arranged on the central rod, and two ends of the guide rail are respectively matched with the conical surface stops on the two sleeves; a wedge block is arranged between every two adjacent blades, the wedge block is matched with the blade stop, and the wedge blocks are inserted on the guide rail and can slide along the guide rail; when the two sleeves synchronously move in opposite directions, the wedge-shaped blocks are simultaneously driven to slide along the length direction of the rod perpendicular to the central rod, so that the distance between two adjacent blades is changed.
Further, the clamping assembly comprises two elastic pieces, the two elastic pieces and the two sleeves are arranged in one-to-one correspondence, the uniform ends of the two elastic pieces and the two sleeves are arranged on the sleeves, the other ends of the two elastic pieces are arranged on the outermost blades, and the outer blades have a tendency of moving inwards under the action of the elastic pieces.
Further, the elastic piece is a pressure spring.
Further, the clamping assembly further comprises a plurality of adjusting bolts, wherein one half of the adjusting bolts and one sleeve are correspondingly arranged, and the other half of the adjusting bolts and the other sleeve are correspondingly arranged; the adjusting bolt is in threaded connection with the sleeve in use and is inserted into the outermost blade to fix all the blades.
Further, the sleeve can rotate around the axis of the sleeve, and the fit mode between the sleeve and the central rod is spiral fit.
Further, the adjustable pitch wafer cutting apparatus further includes a driving member configured to provide a driving force for rotation of the sleeve.
Further, the number of the guide rails is plural, and the guide rails are circumferentially arranged on the center rod, and each guide rail is provided with plural wedge-shaped blocks.
The invention also provides a spacing-adjustable wafer cutting process, which adopts spacing-adjustable wafer cutting equipment and comprises the following steps:
s1, confirming the type of a wafer;
s2, identifying grid-shaped cutting channels on the surface of the wafer;
s3, the number of all cutting lanes in the first direction is X, and X is divided into Y groups, each group comprises Z subgroups, each subgroup comprises M cutting lanes, wherein X, Y, Z, M is a natural number, and the number of Z and the number of blades are equal;
step S4, adjusting the distance between every two adjacent blades according to the distance between every two adjacent subgroups;
step S5, moving all the blades to the first large group and corresponding to the first cutting channel in the corresponding small group;
s6, cutting the wafer along the first cutting channel to the Mth cutting channel in the corresponding group respectively by all the blades in sequence;
step S7, moving all the blades to the next large group and corresponding to the first cutting channel in the corresponding small group, and repeating the step S6 until all the cutting channels in the first direction of the wafer are cut;
and S8, repeating the steps S3 to S7 on the cutting lines in the second direction of the wafer until all the cutting lines in the second direction of the wafer are cut, wherein the second direction and the first direction are perpendicular.
The beneficial effects of the invention are as follows:
the invention relates to a spacing-adjustable wafer cutting device and a process, wherein the spacing-adjustable wafer cutting process comprises the steps of cutting a wafer by adopting the spacing-adjustable wafer cutting device; the interval-adjustable wafer cutting equipment is in the in-process of cutting the wafer, can be according to the cutting demand of chip different sizes, through the interval between a plurality of blades of adjustment mechanism equal proportion adjustment, the commonality is higher, and adopts a plurality of blades to cut the mode of wafer simultaneously, can reduce the used operating time when the wafer cuts, improves the cutting efficiency of wafer.
Drawings
Fig. 1 is a schematic perspective view of a pitch-adjustable wafer dicing apparatus according to an embodiment of the invention;
FIG. 2 is a schematic top view of a pitch-adjustable wafer dicing apparatus according to an embodiment of the invention;
FIG. 3 is a cross-sectional view in the A-A direction of the adjustable pitch wafer dicing apparatus of FIG. 2;
FIG. 4 is a schematic view of a part of the spacing-adjustable wafer dicing apparatus shown in FIG. 3 at a position B;
FIG. 5 is a cross-sectional view in the C-C direction of the adjustable pitch wafer dicing apparatus of FIG. 2;
FIG. 6 is a schematic perspective view of a center rod and a frame assembly of an adjustable pitch wafer dicing apparatus according to an embodiment of the present invention;
FIG. 7 is a schematic perspective view illustrating an assembly of a guide rail and a wedge block of a wafer dicing apparatus with adjustable pitch according to an embodiment of the present invention;
FIG. 8 is a schematic perspective view of a blade of an adjustable pitch wafer dicing apparatus according to an embodiment of the invention;
fig. 9 is a schematic perspective view of a sleeve of an adjustable pitch wafer dicing apparatus according to an embodiment of the invention;
fig. 10 is a schematic perspective view of a mounting frame of a pitch-adjustable wafer dicing apparatus according to an embodiment of the invention.
Wherein:
100. a base; 110. a mounting frame;
200. a blade; 201. a mounting groove; 202. a slot;
300. a central rod; 310. a sleeve frame; 311. a connecting cylinder; 312. an arc-shaped plate; 313. a screw; 320. a guide rail; 330. wedge blocks; 340. a pressure spring;
400. a second driving motor; 410. a sleeve; 411. a collar; 4111. a jack; 412. a conical surface; 420. a sliding sleeve; 430. and (5) adjusting a bolt.
Detailed Description
The present invention will be further described in detail below with reference to examples, which are provided to illustrate the objects, technical solutions and advantages of the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The numbering of components herein, such as "first," "second," etc., is used merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated. In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
As shown in fig. 1 to 10, an adjustable pitch wafer dicing apparatus according to an embodiment of the present invention is used for dicing a wafer; in the present embodiment, the adjustable pitch wafer cutting apparatus is provided to include a center rod 300, a blade 200, and an adjusting mechanism, the center rod 300 being provided in a round rod-like structure; the blades 200 are sleeved on the central rod 300 and can slide along the rod length direction of the central rod 300, specifically, as shown in fig. 8, the blades 200 are arranged into a ring-shaped structure and are provided with a base part and a cutting part sleeved on the base part, as shown in fig. 4, the cross section of the cutting part along the plane passing through the axis of the cutting part is arranged into an isosceles triangle, each angle of the isosceles triangle is arranged into an acute angle, the number of the blades 200 is multiple, the distance between every two adjacent blades 200 is L, in the actual cutting process, the cutting form of the single-shaft multiple blades 200 consumes high power and has high cost, so that the number of the blades 200 is not suitable to be arranged too much; the adjustment mechanism is configured to be able to adjust the size of L.
For example, the number of blades 200 may be four, and are sleeved on the center rod 300 at equal intervals along the rod length direction of the center rod 300; in the process of cutting a wafer, firstly, according to cutting requirements of chips with different sizes, identifying grid-shaped cutting channels on the surface of the wafer, wherein the grid-shaped cutting channels are provided with transverse grooves and vertical grooves which are vertically arranged; then, according to the distance between the vertical grooves or the horizontal grooves, the spacing between the four blades 200 is adjusted in equal proportion by an adjusting mechanism; taking the cutting vertical groove as an example, the distance between two adjacent blades 200 may be set to be equal to the distance between two adjacent vertical grooves, that is, the blades 200 may be set to correspond to the vertical grooves one by one, and then the four blades 200 are driven to rotate by the central rod 300 and simultaneously move along the extending direction of the vertical groove, so that a first vertical groove group including four vertical grooves adjacent to each other may be cut; after the cutting is completed, the four blades 200 are driven by the central rod 300 to move to the next first vertical groove group along the extending direction of the transverse grooves, and the above process is repeated until all the vertical grooves are cut.
It will be appreciated that the distance between two adjacent blades 200 may be set to be equal to the distance between a plurality of vertical slots, that is, a second vertical slot group is provided between two adjacent blades 200, the second vertical slot group includes a plurality of vertical slots adjacent to each other, and then the four blades 200 are driven to rotate by the central rod 300 and simultaneously move along the extending direction of the vertical slots, so that the blades 200 can cut the first vertical slot in the second corresponding vertical slot group; after the cutting is completed, the four blades 200 are driven by the central rod 300 to move to the second vertical groove in the second vertical groove group corresponding to each other along the extending direction of the horizontal grooves, and the above process is repeated until all the vertical grooves are cut.
It will be appreciated that the vertical slots may be divided into a plurality of second vertical slot groups, each of which is configured to include a plurality of third vertical slot groups, each of which is configured to include a plurality of vertical slots, and a distance between two adjacent blades 200 may be set to be equal to a distance between two adjacent third vertical slot groups, that is, one third vertical slot group is disposed between two adjacent blades 200, and then the four blades 200 are driven to rotate while being moved in an extending direction of the vertical slots by the center rod 300, so that the blades 200 can cut the first second vertical slot group and the first vertical slot among the respective corresponding third vertical slot groups; after the cutting is completed, the four blades 200 are driven by the central rod 300 to move to the second vertical groove in the corresponding third vertical groove group along the extending direction of the horizontal groove, and the process is repeated until all the vertical grooves in the first and second vertical groove groups are cut; the four blades 200 are then moved by the central rod 300 in the direction of extension of the transverse slot into the next second set of vertical slots and the process is repeated until all vertical slots have been cut.
It can be understood that the cutting mode of the horizontal slot can be set to be the same as the cutting mode of the vertical slot, and the description is omitted.
It can be understood that, by arranging a plurality of center rods 300, each center rod 300 is sleeved with a plurality of blades 200, so that in the process of cutting a wafer, the plurality of center rods 300 simultaneously drive the respective blades 200 to cut the same wafer, thereby further improving the cutting efficiency of the wafer.
In some embodiments, the adjustment mechanism is configured to include a spacing adjustment assembly configured to enable sliding of the blade 200 along the bar length direction of the center bar 300; the clamping assembly is configured to enable all of the blades 200 to be clamped.
In this embodiment, the interval adjusting assembly is configured to include a guide rail 320, a wedge block 330 and two sleeves 410, where the two sleeves 410 are symmetrically disposed and respectively sleeved at two ends of the central rod 300 and can synchronously move in opposite directions, each sleeve 410 has a conical surface 412, specifically, as shown in fig. 9, the sleeves 410 are configured as a cylindrical structure, and both ends are disposed with openings, and the conical surfaces 412 are coaxially disposed outside one of the openings; more specifically, as shown in fig. 3 and 4, the sleeves 410 are arranged to be sleeved outside the central rod 300 when installed, and the smaller diameter ends of the conical surfaces 412 on the two sleeves 410 are arranged opposite to each other; more specifically, as shown in fig. 4, in order to facilitate the installation of the sleeve 410, the adjustable pitch wafer cutting apparatus is configured to further include a stand 100, the stand 100 is configured to have a plate structure, and two mounting frames 110 are detachably connected to the bottom of the stand 100 through bolts, the two mounting frames 110 are symmetrically arranged, and the two sleeves 410 are respectively and correspondingly inserted with the mounting frames 110 one by one during the installation; the guide rail 320 extends along the rod length direction of the central rod 300 and is arranged on the central rod 300, two ends of the guide rail 320 are respectively matched with the conical surfaces 412 on the two sleeves 410 in a stop mode, specifically, as shown in fig. 7, the guide rail 320 is provided with a plate-shaped structure with a U-shaped section, and as shown in fig. 4, two end portions of the guide rail 320 are respectively abutted against the peripheral walls of the conical surfaces 412 of the two sleeves 410; more specifically, in order to facilitate the installation of the guide rail 320, as shown in fig. 6, a sleeve frame 310 is sleeved on the outer portion of the central rod 300, the sleeve frame 310 is detachably connected to the central rod 300 through a screw 313, the sleeve frame 310 is provided with a connecting cylinder 311, the connecting cylinder 311 is provided with a cylindrical structure, two protruding portions are provided on the outer peripheral wall of the connecting cylinder 311, an arc plate 312 coaxially arranged with the connecting cylinder 311 is fixedly connected to the outer portion of each protruding portion, as shown in fig. 5, the guide rail 320 is inserted between the two arc plates 312 when installed, and the end portion of the guide rail 320 can be clamped with the end portion of the arc plate 312, so that the guide rail 320 can only slide along the rod length direction perpendicular to the central rod 300.
Every two adjacent blades 200 are provided with a wedge block 330, the wedge block 330 is matched with the blade 200 in a stop mode, the wedge block 330 is inserted on the guide rail 320 and can slide along the guide rail 320, specifically, as shown in fig. 7, the shape of the wedge block 330 is a triangular prism, the shapes of two end faces of the wedge block 330 are isosceles trapezoids, the side face of the long bottom edge of the wedge block 330 coincides with the U-shaped bottom face of the guide rail 320 during installation, two end faces of the wedge block 330 coincide with the U-shaped side face of the guide rail 320, as shown in fig. 8, two mounting grooves 201 are formed in the two end faces of the base portion of the blade 200, as shown in fig. 4, and the wedge block 330 is simultaneously inserted in the mounting grooves 201 of the two adjacent blades 200 during installation.
When the two sleeves 410 move synchronously in opposite directions, the wedge 330 is simultaneously driven to slide along the length direction of the rod perpendicular to the central rod 300 so as to change the distance between the two adjacent blades 200, specifically, as shown in fig. 4, when the two sleeves 410 move synchronously in directions close to each other, the contact point between the conical surface 412 and the guide rail 320 is changed, under the guiding action of the conical surface 412, the guide rail 320 synchronously drives the wedge 330 to slide outwards along the length direction of the rod perpendicular to the central rod 300, and under the pushing action of the wedge 330, the distance between the two adjacent blades 200 is increased, so that chips with larger sizes can be processed.
In this embodiment, the clamping assembly is configured to include two elastic members, the two elastic members and the two sleeves 410 are disposed in one-to-one correspondence, and the uniform ends are disposed on the sleeves 410, and the other ends are disposed on the outermost blades 200, and the outer blades 200 have a tendency to move inward under the action of the elastic members; specifically, as shown in fig. 3, the elastic member may be provided as a compression spring 340 and sleeved on the outside of the sleeve frame 310; more specifically, in order to facilitate the installation of the compression spring 340, as shown in fig. 9, a collar 411 is sleeved on the outside of the sleeve 410 at the bottom of the conical surface 412, and the diameter of the collar 411 is larger than that of the sleeve 410, and one end of the compression spring 340 is fixedly connected to the end surface of the collar 411 during the installation.
As shown in fig. 4, when the two sleeves 410 move in the direction away from each other simultaneously, the contact point between the tapered surface 412 and the guide rail 320 is changed accordingly, the guide rail 320 simultaneously drives the wedge block 330 to slide inward in the longitudinal direction perpendicular to the central rod 300 under the guiding action of the tapered surface 412, and the distance between the adjacent two blades 200 is reduced under the combined action of the compression spring 340 and the wedge block 330, so that chips with smaller sizes can be processed.
It can be appreciated that, at this time, the driving cylinders are set to drive the two sleeves 410 to synchronously move along the directions close to each other or far away from each other, the first driving motors are set to drive the center rod 300 to rotate and further drive the blade 200 to rotate so as to cut the wafer, specifically, the number of the first driving motors is two and is set in one-to-one correspondence with the mounting frame 110, the first driving motors are fixedly connected on the mounting frame 110 by bolts, the motor shafts of the first driving motors penetrate through the sleeves 410 and are coaxially and fixedly connected on the center rod 300, and the sleeves 410 are set to relatively rotate with the motor shafts of the second driving motors 400 and relatively slide along the axial direction.
In a further embodiment, the clamping assembly is configured to further comprise a plurality of adjusting bolts 430, wherein one half of the adjusting bolts 430 are correspondingly configured to one sleeve 410, the other half of the adjusting bolts 430 are correspondingly configured to the other sleeve 410, the adjusting bolts 430 are screwed onto the sleeves 410 and are inserted onto the outermost blades 200 to fix all the blades 200 in use, and specifically, as shown in fig. 8, a corresponding number of slots 202 are provided on both end surfaces of the base portion of the blades 200 to facilitate insertion of the adjusting bolts 430, as shown in fig. 9, a corresponding number of insertion holes 4111 are provided on the end surface of the collar 411, and internal threads are provided on the inner peripheral wall of the insertion holes 4111 to facilitate screwing with the adjusting bolts 430, as shown in fig. 4, and when the spacing between the blades 200 needs to be adjusted, the adjusting bolts 430 are unscrewed from the insertion holes 4111, and then the spacing between the blades 200 is adjusted in equal proportion by the adjusting mechanism according to the distance between the vertical grooves or the horizontal grooves; after the adjustment is completed, the adjusting bolt 430 passes through the insertion hole 4111 again and is inserted into the slot 202 to fix the positions of all the blades 200, so as to avoid the blades 200 from shaking in the cutting process and affecting the cutting effect on the wafer.
For example, the number of the adjusting bolts 430 may be six, and then three slots 202 are correspondingly disposed on both end surfaces of the base portion of the blade 200 and uniformly distributed along the circumferential direction, and then three insertion holes 4111 are correspondingly disposed on the end surface of the collar 411 and uniformly distributed along the circumferential direction.
In a further embodiment, the sleeves 410 are configured to rotate around their axes and are in a spiral fit with the central rod 300, specifically, when the distance between the blades 200 needs to be adjusted, the two sleeves 410 are driven to rotate synchronously in opposite directions by an external force, and because the sleeves 410 and the central rod 300 are in spiral fit, the two sleeves 410 can move synchronously in directions approaching to each other or away from each other, so that the contact point between the guide rail 320 and the conical surface 412 changes, the guide rail 320 synchronously drives the wedge block 330 to slide along the rod length direction perpendicular to the central rod 300 under the guiding action of the conical surface 412, and the distance between the adjacent two blades 200 changes under the coaction of the compression spring 340 and the wedge block 330, thereby chips with different sizes can be processed.
In a further embodiment, the pitch-adjustable wafer cutting apparatus is configured to further include a driving member configured to provide a driving force for rotation of the sleeve 410, specifically, as shown in fig. 4, the driving member is configured as a second driving motor 400, two second driving motors 400 are provided and are arranged in one-to-one correspondence with the mounting frame 110, taking one second driving motor 400 as an example, the second driving motor 400 is fixedly connected to the mounting frame 110 through a bolt, and a motor shaft of the second driving motor 400 is inserted into the sleeve 410, and the sleeve 410 is configured to be capable of synchronously rotating with the motor shaft of the second driving motor 400 and capable of relatively sliding along the axial direction; more specifically, a sliding sleeve 420 is sleeved outside each sleeve 410, and the sliding sleeve 420 is inserted on the mounting frame 110 and can slide relatively, so that the sleeve 410 is prevented from being in direct friction contact with the mounting frame 110, and the transmission stability of the sleeve 410 is prevented from being affected; in use, the second driving motor 400 drives the sleeve 410 to rotate, the sleeve 410 drives the blade 200 to rotate through the adjusting bolt 430, the blade 200 drives the guide rail 320 to rotate through frictional contact with the wedge block 330, and the guide rail 320 drives the center rod 300 to rotate through the sleeve frame 310.
In some embodiments, the number of the guide rails 320 is multiple, and the guide rails 320 are arranged on the central rod 300 along the circumferential direction, and each guide rail 320 is provided with a plurality of wedge blocks 330, so that in the process of cutting a wafer, the plurality of wedge blocks 330 in the same circle can push the same blade 200 at the same time, which is beneficial to improving the stability of the blade 200 during moving and rotating; for example, the number of the guide rails 320 may be three, as shown in fig. 5, the three guide rails 320 are uniformly arranged around the sleeve frame 310 in the circumferential direction, correspondingly, as shown in fig. 8, the number of the mounting grooves 201 on both end surfaces of the same blade 200 is three, and is uniformly arranged in the circumferential direction, as shown in fig. 6, the number of the protruding portions is three, and is uniformly arranged outside the connecting cylinder 311 in the circumferential direction, and the number of the arc plates 312 is three, and is arranged in one-to-one correspondence with the protruding portions.
The embodiment of the invention also provides a spacing-adjustable wafer cutting process, which adopts spacing-adjustable wafer cutting equipment and comprises the following steps:
s1, confirming the type of a wafer;
specifically, after the wafer is placed, the model of the wafer can be confirmed by manual input or machine identification.
S2, identifying grid-shaped cutting channels on the surface of the wafer;
specifically, the identification can be performed by a camera.
S3, the number of all cutting lanes in the first direction is X, and X is divided into Y groups, each group comprises Z subgroups, each subgroup comprises M cutting lanes, wherein X, Y, Z, M is a natural number, and the number of Z and the number of blades are equal;
specifically, assuming that the number of all the dicing lanes in the first direction is set to x=36 and the number of the blades 200 is set to 4, then z=4, then y=3 and m=3 may be set, that is, all the dicing lanes in the first direction are equally divided into 3 large groups, each of which includes 4 small groups, each of which includes 3 dicing lanes.
Step S4, adjusting the distance between every two adjacent blades according to the distance between every two adjacent subgroups;
specifically, the distance between every two adjacent small groups is 3 cutting lanes, and the distance between every two adjacent blades is adjusted to be 3 cutting lanes.
Step S5, moving all the blades to the first large group and corresponding to the first cutting channel in the corresponding small group;
specifically, for convenience of description, all the dicing lanes are numbered according to the serial numbers of 1 to 36, the first group includes dicing lanes with serial numbers of 1 to 12, the first group of the first group includes dicing lanes with serial numbers of 1 to 3, the second group of the first group includes dicing lanes with serial numbers of 4 to 6, the third group of the first group includes dicing lanes with serial numbers of 7 to 9, and the fourth group of the first group includes dicing lanes with serial numbers of 10 to 12.
The second major group includes lanes numbered 13 to 24, the first minor group of the second major group includes lanes numbered 13 to 15, the second minor group of the second major group includes lanes numbered 16 to 18, the third minor group of the second major group includes lanes numbered 19 to 21, and the fourth minor group of the second major group includes lanes numbered 22 to 24.
The third major group includes dicing lanes numbered 25 through 36; the first subgroup of the third subgroup comprises lanes with numbers 25 to 27, the second subgroup of the third subgroup comprises lanes with numbers 28 to 30, the third subgroup of the third subgroup comprises lanes with numbers 31 to 33, and the fourth subgroup of the third subgroup comprises lanes with numbers 34 to 36.
The first blade 200 is moved to correspond to a lane with a number 1, the second blade 200 is moved to correspond to a lane with a number 4, the third blade 200 is moved to correspond to a lane with a number 7, and the fourth blade 200 is moved to correspond to a lane with a number 10.
S6, cutting the wafer along the first cutting channel to the Mth cutting channel in the corresponding group respectively by all the blades in sequence;
specifically, the first blade 200 cuts the lane with the number 1, the second blade 200 cuts the lane with the number 4, the third blade 200 cuts the lane with the number 7, and the fourth blade 200 cuts the lane with the number 10; after the cutting is completed, the first blade 200 is moved to correspond to the cutting lane with the number 2, the second blade 200 is moved to correspond to the cutting lane with the number 5, the third blade 200 is moved to correspond to the cutting lane with the number 8, and the fourth blade 200 is moved to correspond to the cutting lane with the number 11 until the cutting lanes in the first large group are cut.
Step S7, moving all the blades to the next large group and corresponding to the first cutting channel in the corresponding small group, and repeating the step S6 until all the cutting channels in the first direction of the wafer are cut;
specifically, the first blade 200 is moved to correspond to the scribe line with the number 25, the second blade 200 is moved to correspond to the scribe line with the number 28, the third blade 200 is moved to correspond to the scribe line with the number 31, and the fourth blade 200 is moved to correspond to the scribe line with the number 34, and step S6 is repeated until all scribe lines in the first direction of the wafer are cut.
And S8, repeating the steps S3 to S7 on the cutting lines in the second direction of the wafer until all the cutting lines in the second direction of the wafer are cut, wherein the second direction and the first direction are perpendicular.
Specifically, the steps S3 to S7 are repeated for the scribe lines in the second direction of the wafer until all the scribe lines in the second direction of the wafer are cut.
It will be appreciated that y=1, m=9 may also be provided, that is to say that all the dicing lanes in the first direction are divided into 1 large group, which comprises 4 small groups, each of which comprises 9 dicing lanes.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. The spacing-adjustable wafer cutting equipment is characterized by comprising a center rod, blades and an adjusting mechanism, wherein the blades are sleeved on the center rod and can slide along the length direction of the rod of the center rod, the number of the blades is multiple, and the distance between every two adjacent blades is L; the adjusting mechanism is configured to be capable of adjusting the size of L;
the adjusting mechanism comprises a spacing adjusting assembly and a clamping assembly, wherein the spacing adjusting assembly is configured to drive the blade to slide along the rod length direction of the center rod; the clamping assembly is configured to enable all of the blades to be clamped;
the interval adjusting assembly comprises a guide rail, a wedge block and two sleeves, wherein the two sleeves are symmetrically arranged and respectively sleeved at two ends of the center rod and can synchronously move along opposite directions, and each sleeve is provided with a conical surface; the guide rail extends along the rod length direction of the central rod and is arranged on the central rod, and two ends of the guide rail are respectively matched with the conical surface stops on the two sleeves; a wedge block is arranged between every two adjacent blades, the wedge block is matched with the blade stop, and the wedge blocks are inserted on the guide rail and can slide along the guide rail; when the two sleeves synchronously move in opposite directions, the wedge-shaped blocks are simultaneously driven to slide along the length direction of the rod perpendicular to the central rod so as to change the distance between two adjacent blades;
the clamping assembly comprises two elastic pieces, the two elastic pieces and the two sleeves are arranged in one-to-one correspondence, the uniform ends of the two elastic pieces are arranged on the sleeves, the other ends of the two elastic pieces are arranged on the outermost blades, and the outer blades have a trend of moving inwards under the action of the elastic pieces.
2. The adjustable pitch wafer cutting apparatus of claim 1, wherein the resilient member is a compression spring.
3. The adjustable pitch wafer cutting apparatus of claim 1, wherein the clamping assembly further comprises a plurality of adjustment bolts, one half of the adjustment bolts and one of the sleeves being disposed in correspondence, the other half of the adjustment bolts and the other of the sleeves being disposed in correspondence; the adjusting bolt is in threaded connection with the sleeve in use and is inserted into the outermost blade to fix all the blades.
4. The adjustable pitch wafer cutting apparatus of claim 3, wherein the sleeve is rotatable about its own axis and is in a screw fit with the central rod.
5. The adjustable pitch wafer cutting apparatus of claim 4, further comprising a drive configured to provide a driving force for rotation of the sleeve.
6. The pitch-adjustable wafer cutting apparatus according to claim 1, wherein a plurality of the guide rails are provided on the center rod in a circumferential direction, and a plurality of the wedge blocks are provided on each of the guide rails.
7. A pitch-adjustable wafer dicing process, characterized in that a pitch-adjustable wafer dicing apparatus according to any one of claims 1 to 6 is employed, comprising the steps of:
s1, confirming the type of a wafer;
s2, identifying grid-shaped cutting channels on the surface of the wafer;
s3, the number of all cutting lanes in the first direction is X, and X is divided into Y groups, each group comprises Z subgroups, each subgroup comprises M cutting lanes, wherein X, Y, Z, M is a natural number, and the number of Z and the number of blades are equal;
step S4, adjusting the distance between every two adjacent blades according to the distance between every two adjacent subgroups;
step S5, moving all the blades to the first large group and corresponding to the first cutting channel in the corresponding small group;
s6, cutting the wafer along the first cutting channel to the Mth cutting channel in the corresponding group respectively by all the blades in sequence;
step S7, moving all the blades to the next large group and corresponding to the first cutting channel in the corresponding small group, and repeating the step S6 until all the cutting channels in the first direction of the wafer are cut;
and S8, repeating the steps S3 to S7 on the cutting lines in the second direction of the wafer until all the cutting lines in the second direction of the wafer are cut, wherein the second direction and the first direction are perpendicular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410001144.2A CN117507163B (en) | 2024-01-02 | 2024-01-02 | Spacing-adjustable wafer cutting equipment and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410001144.2A CN117507163B (en) | 2024-01-02 | 2024-01-02 | Spacing-adjustable wafer cutting equipment and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117507163A CN117507163A (en) | 2024-02-06 |
| CN117507163B true CN117507163B (en) | 2024-03-19 |
Family
ID=89749730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410001144.2A Active CN117507163B (en) | 2024-01-02 | 2024-01-02 | Spacing-adjustable wafer cutting equipment and process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117507163B (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422227B1 (en) * | 1999-11-08 | 2002-07-23 | Tokyo Seimitsu Co., Ltd. | Dicing apparatus, kerf inspecting method and kerf inspecting system |
| CN205148643U (en) * | 2015-11-23 | 2016-04-13 | 无锡荣能半导体材料有限公司 | Silicon rod cutting machine |
| CN106827266A (en) * | 2017-01-18 | 2017-06-13 | 天津市山友玉石纽扣有限公司 | A kind of disconnected grain machine of jade pole |
| CN208162761U (en) * | 2018-04-10 | 2018-11-30 | 苏州富莱克精密工具有限公司 | A kind of combined saw blade milling cutter |
| CN209699604U (en) * | 2018-12-28 | 2019-11-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of novel wafer cutting blade structure |
| CN212257358U (en) * | 2020-07-17 | 2020-12-29 | 泰州芯格电子科技有限公司 | Scribing device for semiconductor production and processing |
| CN212241639U (en) * | 2020-04-24 | 2020-12-29 | 安徽火天晶体科技有限公司 | Efficient cutting device for processing magneto-optical crystal |
| CN112466793A (en) * | 2021-02-01 | 2021-03-09 | 四川晶辉半导体有限公司 | Chip wafer scribing device |
| CN213410574U (en) * | 2020-08-17 | 2021-06-11 | 广东邦普循环科技有限公司 | Cutting structure applied to power battery module disassembling device |
| CN215549938U (en) * | 2021-06-17 | 2022-01-18 | 昆山威皓特精密机械有限公司 | Polycrystalline silicon cutting device |
| CN215966650U (en) * | 2021-09-17 | 2022-03-08 | 日进新实业(大连)有限公司 | Aluminum pipe fixed length saw cuts machine |
| CN216266917U (en) * | 2021-09-22 | 2022-04-12 | 山东润马光能科技有限公司 | Polycrystalline silicon rod cutting machine |
| CN114700858A (en) * | 2022-03-21 | 2022-07-05 | 湖南大学 | Wireless automatic indexing adjusting ring and method of multi-cutter grinding wheel dicing saw |
| CN219650004U (en) * | 2023-04-10 | 2023-09-08 | 池州市鼎弘半导体科技有限公司 | Slitter based on packaging mold film-wetting adhesive tape |
| CN219788861U (en) * | 2023-02-24 | 2023-10-03 | 扬州永翔新能源科技有限公司 | Monocrystalline silicon slice slicing device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020157657A1 (en) * | 2001-04-25 | 2002-10-31 | Kulicke & Soffa Investments Inc. | Dicing method and apparatus for cutting panels or wafers into rectangular shaped die |
-
2024
- 2024-01-02 CN CN202410001144.2A patent/CN117507163B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422227B1 (en) * | 1999-11-08 | 2002-07-23 | Tokyo Seimitsu Co., Ltd. | Dicing apparatus, kerf inspecting method and kerf inspecting system |
| CN205148643U (en) * | 2015-11-23 | 2016-04-13 | 无锡荣能半导体材料有限公司 | Silicon rod cutting machine |
| CN106827266A (en) * | 2017-01-18 | 2017-06-13 | 天津市山友玉石纽扣有限公司 | A kind of disconnected grain machine of jade pole |
| CN208162761U (en) * | 2018-04-10 | 2018-11-30 | 苏州富莱克精密工具有限公司 | A kind of combined saw blade milling cutter |
| CN209699604U (en) * | 2018-12-28 | 2019-11-29 | 华进半导体封装先导技术研发中心有限公司 | A kind of novel wafer cutting blade structure |
| CN212241639U (en) * | 2020-04-24 | 2020-12-29 | 安徽火天晶体科技有限公司 | Efficient cutting device for processing magneto-optical crystal |
| CN212257358U (en) * | 2020-07-17 | 2020-12-29 | 泰州芯格电子科技有限公司 | Scribing device for semiconductor production and processing |
| CN213410574U (en) * | 2020-08-17 | 2021-06-11 | 广东邦普循环科技有限公司 | Cutting structure applied to power battery module disassembling device |
| CN112466793A (en) * | 2021-02-01 | 2021-03-09 | 四川晶辉半导体有限公司 | Chip wafer scribing device |
| CN215549938U (en) * | 2021-06-17 | 2022-01-18 | 昆山威皓特精密机械有限公司 | Polycrystalline silicon cutting device |
| CN215966650U (en) * | 2021-09-17 | 2022-03-08 | 日进新实业(大连)有限公司 | Aluminum pipe fixed length saw cuts machine |
| CN216266917U (en) * | 2021-09-22 | 2022-04-12 | 山东润马光能科技有限公司 | Polycrystalline silicon rod cutting machine |
| CN114700858A (en) * | 2022-03-21 | 2022-07-05 | 湖南大学 | Wireless automatic indexing adjusting ring and method of multi-cutter grinding wheel dicing saw |
| CN219788861U (en) * | 2023-02-24 | 2023-10-03 | 扬州永翔新能源科技有限公司 | Monocrystalline silicon slice slicing device |
| CN219650004U (en) * | 2023-04-10 | 2023-09-08 | 池州市鼎弘半导体科技有限公司 | Slitter based on packaging mold film-wetting adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117507163A (en) | 2024-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6606985B2 (en) | Dual-cutting method devoid of useless strokes | |
| CN108907736B (en) | Connecting rod processing system | |
| CN111673507A (en) | Multistation anchor clamps and have milling machine of multistation anchor clamps | |
| CN112372344B (en) | Clamp for milling waveguide tube of slot antenna | |
| CN117507163B (en) | Spacing-adjustable wafer cutting equipment and process | |
| CN210524177U (en) | Chip cutting device | |
| CN114290105B (en) | Device for machining mechanical parts and using method thereof | |
| CN102328122A (en) | Processing device and processing method for tangential key groove of motor shaft | |
| CN212600396U (en) | Multistation anchor clamps and have milling machine of multistation anchor clamps | |
| CN212977508U (en) | Milling machine fixture | |
| CN113172775A (en) | Building material and processing system and processing method thereof | |
| CN117484703B (en) | Wafer high-efficiency dicing device and dicing process thereof | |
| CN109746797B (en) | Device and method for machining circular arc teeth of standard circular rod part of rotor blade of gas compressor | |
| CN220093821U (en) | Driving shaft drilling and milling clamp | |
| CN221019721U (en) | Detachable rotary workbench | |
| CN217452927U (en) | Grooved drum shaft machining machine tool capable of reducing deflection | |
| CN220902932U (en) | Double-sided processing equipment for diamond saw blade | |
| CN214393304U (en) | Clamp for milling multiple end faces of circular workpiece | |
| CN215178571U (en) | Running-in platform for spindle test | |
| CN220698937U (en) | Novel clamp for portable machining | |
| CN217966683U (en) | Butting device for follower fixture | |
| CN221088202U (en) | Transformer clamp cutting machine | |
| CN219900321U (en) | Roller centre bore processingequipment | |
| US20240139839A1 (en) | Apparatus and method for machining cylindrical grooves by multi-wire cutting of profiles | |
| CN219945653U (en) | Online adjustable grinding device of preformed armor rods end |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |