CN117506189A - Method for preventing brittle target from cracking - Google Patents
Method for preventing brittle target from cracking Download PDFInfo
- Publication number
- CN117506189A CN117506189A CN202311472575.9A CN202311472575A CN117506189A CN 117506189 A CN117506189 A CN 117506189A CN 202311472575 A CN202311472575 A CN 202311472575A CN 117506189 A CN117506189 A CN 117506189A
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- Prior art keywords
- solder
- treatment
- brittle
- brittle target
- sand blasting
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Links
- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000005336 cracking Methods 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 121
- 238000005488 sandblasting Methods 0.000 claims abstract description 51
- 238000003466 welding Methods 0.000 claims abstract description 35
- 239000013077 target material Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 229910052738 indium Inorganic materials 0.000 claims description 16
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 16
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 16
- 239000004576 sand Substances 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 8
- 238000005422 blasting Methods 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 230000008602 contraction Effects 0.000 abstract description 8
- 238000005452 bending Methods 0.000 abstract description 6
- 238000005266 casting Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/06—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for producing matt surfaces, e.g. on plastic materials, on glass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a method for preventing a brittle target from cracking, which comprises the following steps: (1) After a groove is processed on a backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard; (2) And (3) assembling and welding the welding surface of the brittle target blank which is split into 5 pieces with the back plate treated in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain the brittle target material. According to the method, the complete brittle target blank is split, gaps are reserved between every two of the brittle target blanks, and then the complete brittle target blank is spliced, so that the brittle target material cracking risk caused by bending deformation and thermal expansion and contraction is effectively avoided; and the groove of the backboard and the welding surface of the target blank are subjected to sand blasting, so that the welding strength of the brittle target material is improved, and the method has a large-scale popularization and application prospect.
Description
Technical Field
The invention relates to the technical field of target processing, in particular to a method for preventing brittle targets from cracking.
Background
Brittle targets such as Si-containing targets, WSi targets, crSi targets, si targets or Ge targets, which are brittle due to their own brittleness, and which are inevitably bent due to negative pressure, water pressure, sputtering, etc. when used, can cause cracking; in addition, the target blank can crack due to uneven temperature and thermal expansion and cold contraction of the material in the using process. Typically such problems are optimized by stiffening the back-plate to reduce bending, but the optimization results are still not optimistic and the cracking probability is not reduced.
CN113388794a discloses a method for improving edge cracking of an aluminum target, which is to replace static pressure treatment in aluminum target processing with forging treatment. The method can effectively solve the problem of edge cracks in the processing process of the aluminum target, improves the product quality and increases the qualification rate of the processing of the aluminum target.
CN113684459a discloses a method for binding a rotary target material for reducing cracking, which comprises the steps of firstly metallizing the outer surface of a back tube and the inner surface of an ITO target cylinder, then welding and binding the two surfaces together, controlling the temperature in a binding furnace by distributing heaters from top to bottom in the binding furnace, controlling the temperature difference between the maximum temperature and the minimum temperature in the binding front back tube from top to bottom to be less than or equal to 3 ℃, controlling the temperature difference between the maximum temperature and the minimum temperature in the binding furnace from top to bottom to be less than or equal to 8 ℃ when heating and binding, controlling the temperature difference between the maximum temperature and the minimum temperature in the binding furnace from top to bottom to be less than or equal to 5 ℃ when heating and binding, thus greatly improving the welding yield and the stability of the binding process of the ITO target material, reducing the problem of target material cracking caused by thermal shock and welding failure after the binding process of the target material, and reducing the manufacturing cost.
CN106011757a discloses a casting method for preventing cracking of a brittle alloy used as a sputtering target, which mainly comprises casting a brittle alloy cast into a sheet or plate shape, having a thickness of 8-15 mm, and a dimension in a plane perpendicular to the thickness direction of 20 times or more of the thickness; the final flaky or plate-shaped casting is formed by continuously injecting liquid alloy, and the casting is gradually thickened along the thickness direction, and the surface of the flaky or plate-shaped casting is horizontal in the casting process; the casting mold is formed by directly placing the parts containing the cavity on the bottom plate, and the casting mode of gradually thickening along the thickness direction to form the final casting is realized by reasonably designing the shapes and the sizes of the bottom plate and the parts containing the cavity.
However, the method can not well solve the cracking problem of the brittle target material caused by bending, thermal expansion and cold contraction.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a method for preventing a brittle target from cracking, which utilizes a gap between each block to absorb the bending generated in the use process of the target and the cracking caused by thermal expansion and cold contraction by a way of splitting and recombining a complete brittle target blank. And the welding strength of the finally obtained brittle target material is improved by combining with sand blasting. The method disclosed by the invention is simple to operate and suitable for large-scale popularization and application.
To achieve the purpose, the invention adopts the following technical scheme:
the invention provides a method for preventing a brittle target from cracking, which comprises the following steps:
(1) After a groove is processed on a backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
(2) And (3) assembling and welding the welding surface of the brittle target blank which is split into 5 pieces with the back plate treated in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain the brittle target material.
According to the method for preventing the cracking of the brittle target, disclosed by the invention, the complete brittle target blank is split into 5 pieces and then spliced into the complete target blank, and the gaps are reserved between every two target blanks, so that the cracking risks caused by bending and thermal expansion and contraction can be absorbed, and the cracking problem of the brittle target caused by thermal expansion and contraction is optimized. In addition, the invention also processes a groove on the backboard, and sequentially carries out first sand blasting treatment and first solder smearing treatment on the groove. The welding surface of the brittle target blank is sequentially subjected to the second sand blasting treatment and the second solder smearing treatment, so that the adhesiveness of the solder is improved, the welding strength is improved, and the highest welding strength is realized by using the least solder.
Preferably, the depth of the groove in step (1) is 0.5 to 2mm, for example, 0.5mm, 0.8mm, 1mm, 1.3mm, 1.5mm, 1.7mm or 2mm, etc., but the present invention is not limited to the above-mentioned values, and other values not mentioned in the above-mentioned range are equally applicable.
The depth of the groove is preferably 0.5-2 mm, so that the eccentricity of a target blank of a brittle target material and displacement of the target blank during welding of the target blank and a backboard can be prevented, and welding flux can be conveniently paved on the backboard.
Preferably, the sand material used in the first sand blasting in step (1) comprises silicon carbide.
The roughness of the groove after the first blasting is preferably 2 to 5 μm, and may be, for example, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm, etc., but is not limited to the recited values, and other non-recited values within the range of the values are equally applicable.
Preferably, the solder in the first solder application process of step (1) comprises indium solder.
The thickness of the solder layer after the first solder application treatment is preferably 0.1 to 0.2mm, and may be, for example, 0.1mm, 0.12mm, 0.15mm, 0.16mm, 0.17mm, 0.19mm, or 0.2mm, etc., but is not limited to the recited values, and other non-recited values within the range of values are equally applicable.
In the invention, the thickness of the solder layer after the first solder coating treatment is preferably 0.1-0.2 mm, so that the finally obtained brittle target material has excellent welding strength. When the thickness of the solder layer is too small after the first solder coating treatment, the welding strength of the brittle target material is small, and the sputtering use requirement cannot be met; when the thickness of the solder layer is too large after the first solder coating treatment, the solder fills gaps among each target blank, and the brittle target material has a cracking risk.
Preferably, the sputtering surfaces of the brittle target blanks split into 5 pieces in the step (2) are protected by polyimide adhesive tapes, so that the processing procedures after assembly and welding can be reduced.
Preferably, the gap between each of the brittle target blanks split into 5 pieces in the step (2) is 0.2-0.4 mm, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.38mm or 0.4mm, etc., but the gap is not limited to the recited values, and other non-recited values within the range of the recited values are equally applicable.
The invention preferably has the gap of 0.2-0.4 mm between every two brittle target blanks separated into 5 brittle target blanks, and can effectively avoid the problems of bending caused by negative pressure, water pressure, sputtering and the like and cracking caused by thermal expansion and cold contraction when the target material is used. When the gap is too small, the brittle target still has the risk of cracking; when the gap is too large, the finally obtained brittle target material cannot be used for sputtering normally.
Preferably, the sand material used in the second sand blasting treatment in the step (2) comprises silicon carbide.
The roughness of the brittle target blank after the second blasting treatment is preferably 2 to 5 μm, and may be, for example, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm, etc., but is not limited to the recited values, and other values not recited in the range of values are equally applicable.
Preferably, the solder in the second solder application process of step (2) comprises indium solder.
Preferably, the thickness of the solder layer after the second solder application treatment in the step (2) is 0.1 to 0.2mm, for example, 0.1mm, 0.12mm, 0.15mm, 0.16mm, 0.17mm, 0.19mm or 0.2mm, etc., but the thickness is not limited to the values listed, and other values not listed in the range are equally applicable.
The thickness of the solder layer after the second solder coating treatment is preferably 0.1-0.2 mm, so that the flatness of each target blank can be ensured to meet the requirements of sputtering use.
As a preferred technical scheme of the invention, the method comprises the following steps:
(1) After a groove with the depth of 0.5-2 mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 2-5 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.1-0.2 mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between every two brittle target blanks split into 5 brittle target blanks is 0.2-0.4 mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 2-5 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.1-0.2 mm.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) According to the method for preventing the brittle target from cracking, disclosed by the invention, the complete brittle target blank is split into 5 pieces, a specific gap is reserved between each piece and then spliced into the complete target blank, and the complete target blank is assembled and welded with the backboard, so that the risk of cracking the brittle target caused by thermal expansion and cold contraction is effectively avoided;
(2) According to the method for preventing the brittle target from cracking, provided by the invention, the groove of the backboard and the welding surface of the target blank are subjected to sand blasting, so that the adhesiveness of the welding flux is greatly improved, the welding strength of the brittle target is improved, the highest welding strength realized by using the least welding flux is realized, and the method has a large-scale popularization and application prospect.
Drawings
FIG. 1 is a schematic structural diagram of a brittle target according to an embodiment of the present invention.
In the figure: 1-splitting into 5 brittle target blanks; 2-backboard.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
A schematic structural diagram of a brittle target in an embodiment of the present invention is shown in FIG. 1.
The brittle target comprises a back plate 2 and brittle target blanks 1 which are arranged on the back plate 2 and are split into 5 pieces.
The present invention will be described in further detail below. The following examples are merely illustrative of the present invention and are not intended to represent or limit the scope of the invention as defined in the claims.
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
Example 1
The embodiment provides a method for preventing a brittle target from cracking, which comprises the following steps:
(1) After a groove with the depth of 1mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 3 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.13mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between each two brittle target blanks split into 5 blocks is 0.4mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 3 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.15mm.
Example 2
The embodiment provides a method for preventing a brittle target from cracking, which comprises the following steps:
(1) After a groove with the depth of 0.5mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 5 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.2mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between each two brittle target blanks split into 5 blocks is 0.2mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 2 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.1mm.
Example 3
The embodiment provides a method for preventing a brittle target from cracking, which comprises the following steps:
(1) After a groove with the depth of 1.5mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 2.5 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.18mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between each two brittle target blanks split into 5 blocks is 0.33mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 4.5 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.16mm.
Example 4
The embodiment provides a method for preventing a brittle target from cracking, which comprises the following steps:
(1) After a groove with the depth of 2mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 2 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.1mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between each two brittle target blanks split into 5 blocks is 0.4mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 5 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.2mm.
Example 5
This example provides a method for preventing cracking of a brittle target, which is the same as example 1 except that the thickness of the solder layer after the first solder application treatment in step (1) is 0.05 mm.
Example 6
This example provides a method for preventing cracking of a brittle target, which is the same as example 1 except that the thickness of the solder layer after the first solder application treatment in step (1) is 0.4mm.
Example 7
This example provides a method for preventing cracking of a brittle target, which is the same as example 1 except that the gap between each of the brittle target blanks split into 5 pieces in step (2) is 0.1mm.
Example 8
This example provides a method of preventing cracking of a brittle target, which is the same as example 1 except that the gap between each of the brittle target blanks split into 5 pieces in step (2) is 0.5 mm.
Comparative example 1
This comparative example provides a method of preventing cracking of a brittle target, which is the same as example 1 except that the first blasting treatment is not performed in step (1).
Comparative example 2
This comparative example provides a method of preventing cracking of a brittle target, which is the same as example 1 except that the second blasting treatment is not performed in step (2).
The welding strength of the brittle targets obtained in the above examples and comparative examples was measured, and whether or not the brittle targets had cracking phenomenon was observed, and the results are shown in table 1.
TABLE 1
As can be seen from table 1:
(1) It can be seen from comprehensive examples 1 to 4 that the method for preventing the brittle target from cracking provided by the invention effectively solves the problem of cracking of the brittle target, and the welding strength of the brittle target is higher;
(2) As can be seen from the combination of examples 1 and examples 5 to 6, in example 5, the thickness of the solder layer after the first solder application treatment in step (1) is thinner, resulting in smaller soldering strength of the brittle target material; in example 6, the thickness of the solder layer after the first solder application treatment in step (1) is too large, so that the solder fills the gaps between each target blank and the brittle target material cracks;
(3) It can be seen from the combination of examples 1 and examples 7 to 8 that in example 7, the gap between each of the brittle target blanks split into 5 pieces in step (2) is too small, and the welding strength of the brittle target is basically not affected, but the target is cracked; in the embodiment 8, in the step (2), the gap between each of the brittle target blanks split into 5 pieces is too large, and although the welding strength of the finally obtained brittle target material is basically unaffected and cannot crack, the brittle target material with too large gap cannot be normally sputtered for use;
(4) It can be seen from a combination of examples 1 and comparative examples 1 to 2 that the absence of the first blasting treatment in step (1) in comparative example 1 and the absence of the first blasting treatment in step (2) in comparative example 2 resulted in a decrease in the adhesion of the solder and a significant decrease in the soldering strength of the brittle target.
The applicant declares that the above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that are easily conceivable within the technical scope of the present invention disclosed by the present invention fall within the scope of the present invention and the disclosure.
Claims (10)
1. A method of preventing cracking of a brittle target, the method comprising the steps of:
(1) After a groove is processed on a backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
(2) And (3) assembling and welding the welding surface of the brittle target blank which is split into 5 pieces with the back plate treated in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain the brittle target material.
2. The method of claim 1, wherein the depth of the groove of step (1) is 0.5-2 mm.
3. The method according to claim 1 or 2, wherein the grit material used in the first grit blasting of step (1) comprises silicon carbide;
preferably, the roughness of the groove after the first sand blasting treatment is 2-5 mu m.
4. A method according to any one of claims 1 to 3, wherein the solder in the first solder application treatment of step (1) comprises indium solder;
preferably, the thickness of the solder layer after the first solder coating treatment is 0.1-0.2 mm.
5. The method according to any one of claims 1 to 4, wherein the sputtering surfaces of the brittle target blanks split into 5 pieces in step (2) are protected by polyimide tape.
6. The method of any one of claims 1 to 5, wherein the gap between each of the 5 pieces of brittle target blank split in step (2) is 0.2 to 0.4mm.
7. The method according to any one of claims 1 to 6, wherein the sand material used for the second blasting in step (2) comprises silicon carbide;
preferably, the roughness of the brittle target blank after the second sand blasting is 2-5 mu m.
8. The method of any one of claims 1 to 7, wherein the solder in the second solder application process of step (2) comprises indium solder.
9. The method of any one of claims 1 to 8, wherein the thickness of the solder layer after the second solder application treatment of step (2) is 0.1 to 0.2mm.
10. The method according to any one of claims 1 to 9, characterized in that it comprises the steps of:
(1) After a groove with the depth of 0.5-2 mm is processed on the backboard, sequentially carrying out first sand blasting treatment and first solder smearing treatment on the groove to obtain a treated backboard;
the sand material adopted by the first sand blasting treatment comprises silicon carbide; the roughness of the groove after the first sand blasting treatment is 2-5 mu m; the solder in the first solder application process comprises indium solder; the thickness of the solder layer after the first solder coating treatment is 0.1-0.2 mm;
(2) The sputtering surfaces of the brittle target blanks split into 5 pieces are protected by polyimide adhesive tapes, and the welding surfaces of the brittle target blanks split into 5 pieces are assembled and welded with the back plate after the treatment in the step (1) after the second sand blasting treatment and the second solder smearing treatment in sequence to obtain brittle target materials;
the gap between every two brittle target blanks split into 5 brittle target blanks is 0.2-0.4 mm;
the sand material adopted by the second sand blasting treatment comprises silicon carbide; the roughness of the brittle target blank after the second sand blasting treatment is 2-5 mu m;
the solder in the second solder coating process comprises indium solder; the thickness of the solder layer after the second solder coating treatment is 0.1-0.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311472575.9A CN117506189A (en) | 2023-11-07 | 2023-11-07 | Method for preventing brittle target from cracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311472575.9A CN117506189A (en) | 2023-11-07 | 2023-11-07 | Method for preventing brittle target from cracking |
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| Publication Number | Publication Date |
|---|---|
| CN117506189A true CN117506189A (en) | 2024-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311472575.9A Pending CN117506189A (en) | 2023-11-07 | 2023-11-07 | Method for preventing brittle target from cracking |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117506189A (en) |
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2023
- 2023-11-07 CN CN202311472575.9A patent/CN117506189A/en active Pending
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