CN117500768A - 复合部件、激光加工方法和复合部件的制造方法 - Google Patents

复合部件、激光加工方法和复合部件的制造方法 Download PDF

Info

Publication number
CN117500768A
CN117500768A CN202180099190.5A CN202180099190A CN117500768A CN 117500768 A CN117500768 A CN 117500768A CN 202180099190 A CN202180099190 A CN 202180099190A CN 117500768 A CN117500768 A CN 117500768A
Authority
CN
China
Prior art keywords
fibers
hole
laser
holes
composite component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180099190.5A
Other languages
English (en)
Chinese (zh)
Inventor
川筋康文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigaphoton Inc
Original Assignee
Gigaphoton Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigaphoton Inc filed Critical Gigaphoton Inc
Publication of CN117500768A publication Critical patent/CN117500768A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • C04B35/78—Ceramic products containing macroscopic reinforcing agents containing non-metallic materials
    • C04B35/80—Fibres, filaments, whiskers, platelets, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/001—Turbines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
CN202180099190.5A 2021-07-13 2021-07-13 复合部件、激光加工方法和复合部件的制造方法 Pending CN117500768A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/026342 WO2023286174A1 (ja) 2021-07-13 2021-07-13 複合部品、レーザ加工方法、及び複合部品の製造方法

Publications (1)

Publication Number Publication Date
CN117500768A true CN117500768A (zh) 2024-02-02

Family

ID=84919731

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180099190.5A Pending CN117500768A (zh) 2021-07-13 2021-07-13 复合部件、激光加工方法和复合部件的制造方法

Country Status (4)

Country Link
US (1) US20240100631A1 (https=)
JP (1) JPWO2023286174A1 (https=)
CN (1) CN117500768A (https=)
WO (1) WO2023286174A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118543996B (zh) * 2024-05-30 2025-06-24 中南大学 一种基于三明治结构的陶瓷材料高品质激光打孔方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059577A1 (en) * 2001-09-24 2003-03-27 Siemens Westinghouse Power Corporation Ceramic matrix composite structure having integral cooling passages and method of manufacture
CN110089202A (zh) * 2016-12-28 2019-08-02 株式会社藤仓 布线基板和布线基板的制造方法
CN110386241A (zh) * 2018-04-19 2019-10-29 波音公司 复合制品及其制造方法
CN111039686A (zh) * 2019-12-13 2020-04-21 中国航空制造技术研究院 一种含原位孔的连续纤维增强陶瓷基复合材料制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129246A (ja) * 1983-12-15 1985-07-10 Nitto Electric Ind Co Ltd 三次元繊維補強発泡体の製造方法
US6617013B2 (en) * 2001-05-10 2003-09-09 Siemens Westinghouse Power Corporation Ceramic matrix composite having improved interlaminar strength
FR2924426B1 (fr) * 2007-11-30 2011-06-03 Messier Bugatti Procede de fabrication de pieces en materiau composite a renfort en fibres de carbone.
KR101125317B1 (ko) * 2008-11-17 2012-03-28 신코 덴키 코교 가부시키가이샤 배선 기판 및 그 제조 방법
JP2013202689A (ja) * 2012-03-29 2013-10-07 Nagoya Univ レーザー加工方法、レーザー加工装置、およびレーザー加工装置に用いられる大気圧プラズマ装置
US20150030803A1 (en) * 2013-07-29 2015-01-29 The Boeing Company Composite Laminates Having Hole Patterns Produced by Controlled Fiber Placement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059577A1 (en) * 2001-09-24 2003-03-27 Siemens Westinghouse Power Corporation Ceramic matrix composite structure having integral cooling passages and method of manufacture
CN110089202A (zh) * 2016-12-28 2019-08-02 株式会社藤仓 布线基板和布线基板的制造方法
CN110386241A (zh) * 2018-04-19 2019-10-29 波音公司 复合制品及其制造方法
CN111039686A (zh) * 2019-12-13 2020-04-21 中国航空制造技术研究院 一种含原位孔的连续纤维增强陶瓷基复合材料制备方法

Also Published As

Publication number Publication date
US20240100631A1 (en) 2024-03-28
JPWO2023286174A1 (https=) 2023-01-19
WO2023286174A1 (ja) 2023-01-19

Similar Documents

Publication Publication Date Title
JP5816409B2 (ja) レーザビア穴あけのためのスループットを高める方法
US6347101B1 (en) Laser with absorption optimized pumping of a gain medium
US6999491B2 (en) High intensity and high power solid state laser amplifying system and method
US6795456B2 (en) 157 nm laser system and method for multi-layer semiconductor failure analysis
JP2005525001A (ja) ビーム伝達及びビーム照準制御を備えるリソグラフィレーザ
CN111247626B (zh) 激光照射方法和激光照射系统
EP2422415A2 (en) Scalable, efficient laser systems
EP1335459A2 (en) Laser oscillator
TW201023461A (en) Very high power laser chamber optical improvements
Basu et al. Amplification in Ni-like Nb at 204.2 Å pumped by a table-top laser
JP2007253189A (ja) レーザ加工装置
US20240100631A1 (en) Composite component, laser processing method, and method for manufacturing composite component
KR102806156B1 (ko) 복수의 레이저 빔을 결합하는 장치 및 방법
JP7418465B2 (ja) 均一なビームを有するエキシマレーザ
JP7660598B2 (ja) レーザ加工方法、及びレーザ加工システム
JP7697026B2 (ja) レーザ加工方法及びレーザ加工システム
JP2002141590A (ja) エキシマーまたはフッ素分子レーザー及び自動ｕｖ予備電離放電形繰り返しパルスガスレーザー装置
WO2023180017A1 (en) Euv light source target metrology
US11784452B2 (en) Optical element for a deep ultraviolet light source
JP2025504973A (ja) ハンドヘルドｌｉｂｓ器具とその応用のためのデュアルビームシングル空間モードレーザー
CN117480028A (zh) 激光加工装置、激光加工方法和电子器件的制造方法
JP3766515B2 (ja) Ｑスイッチｃｏ２レーザ装置
US20250199416A1 (en) Laser processing system and laser processing method
US20240173796A1 (en) Laser processing apparatus, laser processing method, and electronic device manufacturing method
US20250162082A1 (en) Laser processing method, laser processing apparatus, and electronic device manufacturing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination