CN117500338A - Display panel, binding method of display panel and display device - Google Patents
Display panel, binding method of display panel and display device Download PDFInfo
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- CN117500338A CN117500338A CN202311395272.1A CN202311395272A CN117500338A CN 117500338 A CN117500338 A CN 117500338A CN 202311395272 A CN202311395272 A CN 202311395272A CN 117500338 A CN117500338 A CN 117500338A
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60277—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of conductive adhesives
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel, a binding method of the display panel and a display device, wherein the display panel comprises a substrate; the organic film layer is arranged on one side of the substrate and is provided with a hollowed-out part, an organic film block and a heightening component; the conductive adhesive layer is arranged on one side of the organic film layer, which is away from the substrate; the chip is arranged on one side of the conductive adhesive layer, which is away from the substrate; the binding component is electrically connected with the chip through the conductive adhesive layer, and signals are transmitted from the chip to pixels in the display area through the binding component. Through set up the bed hedgehopping part between organic membrane piece and binding part for binding part and chip are binding the in-process, utilize the bed hedgehopping part to reduce the space of storage air, avoid too much air unable getting rid of, maintain the relative balance of fretwork portion and external atmospheric pressure, prevent that the bubble from breaking even from appearing in the conducting resin layer, thereby can improve display panel's reliability.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a display panel, a binding method of the display panel and a display device.
Background
With the progress of technology, digital display devices such as smart phones and tablet computers are widely used, wherein a display panel is an indispensable interpersonal communication interface in these display devices. Such as an OLED (Organic Light Emitting Diode ) display panel, has the advantages of self-luminescence, energy saving, consumption reduction, flexibility, good flexibility and the like, is focused by users, and is widely applied to terminal products such as smart phones, tablet computers and the like.
Bonding process is to realize the electrical connection between the display panel and the chip through the conductive adhesive layer, and is limited by the structure of the existing display panel, and the conductive adhesive layer may have the problem of bubbles or damage during Bonding, which affects the reliability of the display panel.
Therefore, a new display panel, a binding method of the display panel, and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a display panel, a binding method of the display panel and a display device,
in a first aspect, an embodiment of the present invention provides a display panel, including a substrate; the organic film layer is arranged on one side of the substrate and comprises a hollowed-out area and an organic film block, the hollowed-out area is provided with a heightening component and a binding component, and the heightening component and the binding component divide the hollowed-out area into hollowed-out parts; the conductive adhesive layer is arranged on one side of the organic film layer, which is away from the substrate, and in the direction vertical to the plane of the substrate, the orthographic projection of the conductive adhesive layer on the substrate covers the orthographic projection of the hollow area on the substrate, and the conductive adhesive layer is in contact with the binding component; the chip is arranged on one side of the conductive adhesive layer, which is away from the substrate, and is contacted with the conductive adhesive layer; in the hollow area, the heightening component is arranged between the organic membrane block and the binding component.
In a second aspect, an embodiment of the present invention provides a binding method for a display panel, including: providing a substrate; forming an organic film layer on one side of a substrate; patterning the organic film layer to form a hollowed-out area, an organic film block and a raised part; a binding part is arranged in the hollowed-out area, a heightening part is arranged between the organic membrane block and the binding part, and the heightening part and the binding part separate the hollowed-out area into hollowed-out parts; a conductive adhesive layer is arranged on one side of the organic film layer away from the substrate; providing a chip, wherein the chip comprises chip pins, and binding the chip and the binding component through a conductive adhesive layer.
In a third aspect, an embodiment of the present invention provides a display apparatus, including: the display panel of any one of the above embodiments.
Compared with the related art, the display panel provided by the embodiment of the invention comprises a substrate, an organic film layer, a binding component, a conductive adhesive layer and a chip. Through dig the fretwork district that the macropore formed in organic rete and set up the unit that is raised, the unit that is raised and bind the unit and separate out fretwork portion with the fretwork district, bind the in-process with the chip, utilize the unit that is raised to reduce the space of fretwork district storage air, about to reduce the fretwork district into fretwork portion, avoid too much air unable getting rid of, maintain the relative balance of fretwork area and external atmospheric pressure, prevent that the bubble from appearing in the conductive adhesive layer and even break, thereby can improve display panel's reliability, satisfy customer's specification requirement.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a schematic plan view of a prior art display panel;
FIG. 2 is an enlarged schematic view of the area C of the display panel of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the structure at C1-C2 in FIG. 2;
FIG. 4 is a top view of the relative positions of a binding member and a raised member provided by one embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of one embodiment of FIG. 4 at C3-C4;
FIG. 6 is a schematic cross-sectional view of another embodiment of FIG. 4 at C3-C4;
FIG. 7 is a top view of the relative positions of binding and raised elements provided by another embodiment of the present invention;
FIG. 8 is a top view of the relative positions of binding and raised elements provided by yet another embodiment of the present invention;
FIG. 9 is a top view of the relative positions of binding and raised elements provided by yet another embodiment of the present invention;
FIG. 10 is a top view of the relative positions of binding and raised elements provided by yet another embodiment of the present invention;
FIG. 11 is a schematic cross-sectional view of the structure at C5-C6 in FIG. 10;
FIG. 12 is a top view of the relative positions of binding and raised elements provided by yet another embodiment of the present invention;
FIG. 13 is a top view of the relative positions of binding and raised elements provided by yet another embodiment of the present invention;
FIG. 14 is a flowchart of a method for binding a display panel according to an embodiment of the present invention;
FIG. 15 is a schematic cross-sectional view of a structure obtained by each step in a method for binding a display panel according to an embodiment of the present disclosure;
FIG. 16 is a top view of the relative positions of a chip and raised features provided by one embodiment of the present invention;
FIG. 17 is a top view of the relative positions of a chip and raised features provided by another embodiment of the present invention;
fig. 18 is a schematic top view of a display device according to an embodiment of the disclosure.
Detailed Description
Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Referring to fig. 1, which is a schematic plan view of a display panel according to the prior art, the display panel 100 in fig. 1 includes a display area AA and a non-display area NA surrounding the display area AA, wherein the non-display area NA includes a binding area, and a plurality of binding members 6 are included in the binding area. An organic film layer and a conductive adhesive layer are sequentially arranged on one side, far away from the light emitting side, of the substrate. At present, in the manufacturing process of a display panel, an organic film layer needs to be covered on a substrate to change the flatness of the surface of the film layer. When the display panel normally displays, the binding part 6 is electrically connected with the chip through the conductive adhesive layer, and signals are transmitted from the chip to the pixels P in the display area AA through the binding part 6 and the first connection line L, which includes a data line, a power signal line, and the like, thereby providing corresponding signals.
Fig. 2 is an enlarged schematic view of a region C of the display panel of fig. 1, and fig. 3 is a sectional view taken along a direction C1-C2 of fig. 2. Referring to fig. 2, the binding area includes a plurality of binding members 6, during the binding process, the organic film layer covered around the binding members 6 is first dug to expose the binding members 6, the hollow area 7 is formed on the organic film layer, and meanwhile, the organic film layer includes a plurality of organic film blocks 210, and the hollow area between the binding members 6 and the organic film blocks 210 can retain air along with the promotion of the subsequent binding process. Specifically, in the binding process of the binding component 6 and the chip, the conductive adhesive layer can cover the hollowed-out area between the binding component 6 and the organic film block to form a part of enclosed space, a large amount of air is left in the enclosed space and cannot be discharged, the internal and external air pressures of the conductive adhesive layer are unbalanced, as the driving chip is pressed downwards, the accumulated air can impact the conductive adhesive layer, the conductive adhesive layer is likely to generate bubbles, even more, the conductive adhesive layer is likely to generate cracking, and finally, the binding component and the chip are bound and then have the defects of peeling and the like, so that the reliability of the display panel is affected.
In order to solve the above-mentioned technical problems, the embodiments of the present disclosure provide a display panel and a display device, and the embodiments of the present disclosure provide the display panel are described in detail below.
FIG. 4 is a top view of the relative positions of a binding member and a raised member provided by one embodiment of the present invention; FIG. 5 is a schematic cross-sectional view at C3-C4 of one embodiment of FIG. 4. The embodiment of the invention provides a display panel, as shown in fig. 5, which comprises a substrate 1; the organic film layer 2 is arranged on one side of the substrate, and comprises a hollowed-out area 7 and an organic film block 210, wherein the hollowed-out area 7 is provided with a heightening component 201 and a binding component 6, and the heightening component 201 and the binding component 6 divide the hollowed-out area 7 into hollowed-out parts 701; the conductive adhesive layer 3 is arranged on one side of the organic film layer 2, which is away from the substrate, and in the direction vertical to the plane of the substrate, the orthographic projection of the conductive adhesive layer 3 on the substrate covers the orthographic projection of the hollowed-out part 701 on the substrate, and the conductive adhesive layer 3 is partially contacted with the binding part 6; the chip 4 is arranged on one side of the conductive adhesive layer 3, which is away from the substrate, and the chip 4 is contacted with the conductive adhesive layer 3; the chip 4 comprises pins 41, and the chip 4 is connected with the binding component 6 through the conductive adhesive layer 3; in the hollowed-out area, the raising member 201 is disposed between the organic film block 210 and the binding member 6. In the binding process of the binding component 6 and the chip 4, the conductive adhesive layer 3 is first lapped with the organic film block 210, so that in the range of the hollowed-out part 701, a closed space is surrounded by the conductive adhesive layer 3, the organic film block 210, the substrate 1 and the binding component 6 (or the heightening component 201), a large amount of air is easily stored in the closed space in the binding process, and when the chip 4 and the conductive adhesive layer 3 are bonded by further applying pressure, the internal pressure is increased, the air stored in the closed space can impact the conductive adhesive layer 3 due to extrusion of external force, and bubbles or even cracks of the conductive adhesive layer 3 are easily caused. For the above problems, those skilled in the art easily think that the vent is formed in the organic film layer or the conductive adhesive layer, but because the vent is formed, the chip is easily deformed under the action of the stress of the organic film layer or the conductive adhesive layer in the binding area in the binding process of the chip and the binding component, so that the binding component is damaged. In addition, if the clearance is not reserved between the hollowed-out area and the binding part to avoid air retention, the conductive adhesive layer has no deformation space, and the chip and the binding part are not connected in a crimping way. According to the invention, the raised part 201 is arranged in the hollowed-out area, the space for storing air is reduced by utilizing the raised part 201, excessive air is prevented from being stored in the hollowed-out part 701, and the relative balance of the air pressure inside and outside the conductive adhesive layer 3 is maintained, so that the reliability of the display panel is improved, meanwhile, the raised part also has the function of supporting the conductive adhesive layer, so that the problems of falling or sinking of the conductive adhesive layer are avoided, the reliability of the arrangement of the conductive adhesive layer is improved, and the binding between the binding part and the chip is firmer.
It should be noted that, the raised part 201 is disposed in the hollowed-out area 7 formed by digging a large hole in the organic film layer, and the preparation process of the raised part is not particularly limited in this embodiment, and the hollowed-out area 7 may be formed on the surface of the organic film layer 2 through a photolithography process after the whole layer of the organic film layer 2 is prepared, or the hollowed-out area 7 may be prepared by a halftone mask process. The raised feature 201 in the embodiment of the present invention may be formed by a patterning process such as etching, and specifically, the etching may be a dry etching process or a wet etching process. It should be noted that the dry etching is different from the wet etching in that the wet etching uses a solvent or a solution for etching. Wet etching is a purely chemical reaction process, which means that the etching purpose is achieved by removing the parts not masked by the masking film material by using a chemical reaction between the solution and the pre-etching material. The method has the advantages of good selectivity, good repeatability, high production efficiency, simple equipment and low cost. Dry etching is of many types, including laser etching, photo-evaporation, vapor phase etching, plasma etching, and the like. The dry etching has the advantages that: the method has the advantages of good anisotropism, high selection ratio, good controllability, flexibility and repeatability, safe operation of the thin wire, easy realization of automation, no chemical waste liquid, no pollution in the treatment process and high cleanliness.
In this embodiment, the etching may be performed on the organic film layer 2 by selecting a specific solution according to the material of the organic film layer, or the etching may also be performed directly on the organic film layer 2 by using a laser, where the raised component 201 is formed while the organic film layer 2 forms a hollow area suitable for binding, and referring to fig. 4 and 7, which are top views of the relative positions of the binding component and the raised component provided in the two embodiments of the present invention, the cross-sectional pattern of the raised component parallel to the substrate direction includes: round or square. It can be understood that in this embodiment, when the organic film layer 2 is perforated, the hollowed-out portion 701 and the raised portion 201/202 are formed while the organic film layer region corresponding to the binding member 6 is removed by etching or other process, and the raised portion 201/202 is directly formed by etching or other process by the organic film layer 2 without performing additional processing procedure inside the organic film layer, so that the cross-sectional pattern of the raised portion 201/202 in the direction parallel to the substrate is not limited, preferably including: round, square, offer the convenience, be convenient for operate.
With continued reference to fig. 4, a top view of the relative positions of the binding member and the raised member in a binding manner is provided in an embodiment of the present invention. The binding member 6 includes adjacent first and second sides A1 and A2, the first side A1 having a length smaller than the second side A2; the raised parts between the first edge of the binding part 201 and the organic film block 210 are first raised parts 201, the raised parts between the second edge A2 of the binding part and the organic film block 210 are second raised parts, and in this embodiment, more first raised parts than second raised parts need to be set, that is, the sum of the front projection areas of the first raised parts 201 on the substrate is S1, and the sum of the front projection areas of the second raised parts on the substrate is S2, where the second raised parts need not be set, that is, s2=0.
It should be noted that, based on the usual binding manner of the binding member and the chip, that is, the angle of the binding machine along the extending direction of the short side of the chip or as close as possible to the extending direction of the short side of the chip from the central area of the chip (or from the edge of the chip), the chip and the binding member are pressed together to complete the binding. The binding mode can effectively avoid cracking and even breaking of the long side of the chip in the pressing process, so that the binding mode is the preferred binding mode of the embodiment. Referring to fig. 5, the present embodiment provides more first elevating members to reduce air remaining in the hollow portion 701 around the first elevating member 201, that is, it is required to satisfy that the sum of cross-sectional areas of the first elevating members parallel to the substrate direction is larger than the sum of cross-sectional areas of the second elevating members parallel to the substrate direction. When the conductive adhesive layer is formed above the binding component, air is necessarily remained in the enclosed space surrounded by the conductive adhesive layer 3, the organic film block 210, the substrate 1 and the binding component 6 (or the heightening component 201), and in the process that the chip is bonded with the binding component by the binding mode under the acting force of the binding machine, a large amount of air is extruded into the hollowed-out part 701 around the first heightening component 201 due to the pressure effect of the binding machine, the internal pressure is increased, and the remained air impacts the conductive adhesive layer, so that bubbles or damage of the conductive adhesive layer are easily caused. The above-described problem can be avoided by providing the sum of the cross-sectional areas of the first elevated member parallel to the substrate direction to be larger than the sum of the cross-sectional areas of the second elevated member parallel to the substrate direction. In addition, only the first raised part is provided, and the second raised part is not provided, that is, s2=0 is a preferred embodiment of the present invention, if a large number of second raised parts are simultaneously provided, the conductive adhesive layer is easy to deform due to extrusion, and there is no space for the conductive adhesive layer to overflow, which can cause insufficient adhesion between the chip and the binding part, and affect the binding effect.
Fig. 7, 8 and 9 are top views showing the relative positions of binding elements and raising elements according to three embodiments of the present invention, where the arrangement of the raising elements 202 is a single row, meaning that the number of first raising elements may be one or more, and/or the number of second raising elements may be one or more, and the number of second raising elements may be one or more, arranged in a row along the first direction N; the second direction is parallel to the plane of the substrate and intersects the first direction. It should be noted that, the larger the proportion of the pad component 202 occupying the area of the hollowed-out area 7, that is, the smaller the hollowed-out volume of the organic film layer 2 is, the larger the volume of the organic film block 210 is, the smaller the corresponding hollowed-out space 701 is, and the smaller the space capable of storing air is. Thus, the preferred manner of disposing the raising members 202 is with reference to fig. 8 and 9, the raising members 2021/2022 are single-row and one in number, i.e., the raising members between the binding members and the organic film blocks are monolithic, and the distance between the raising members and the binding members or the raising members is not limited herein. In addition, whether the set position of the raising member 2021/2022 is fig. 8 or fig. 9 depends on the binding manner of the binding member and the chip.
The setting mode of the heightening component provided in this embodiment can keep the organic film layer around the heightening component to the greatest extent, the organic film layer is hollowed out as little as possible, the smaller the space of the hollowed-out part formed correspondingly is, the less air is stored in the hollowed-out part, the air stored in the hollowed-out part is prevented from impacting the conductive adhesive layer due to extrusion when the binding component is bound with the chip, and the conductive adhesive layer is prevented from being air-bubble or damaged. Secondly, the whole block heightening portions 2021/2022 shown in fig. 8 or 9 are arranged, and the conductive adhesive layer is supported, so that the problems of falling or sinking of the conductive adhesive layer are avoided, the reliability of the arrangement of the conductive adhesive layer is improved, and the binding part and the chip are firmly bound. Finally, the whole block of the heightening component 2021/2022 shown in fig. 7 or 8 is arranged, the heightening component has simple structure, and if the heightening component is formed by patterning treatment processes such as etching, the operation is simple and convenient because the etched patterns are simple and the number is small; if the raised parts are formed through a half-tone mask process, the patterns of the raised parts are simple, and the corresponding mask plate (mask) is simpler in structure, so that the cost for preparing the mask plate is lower, and the production efficiency is improved.
FIG. 10 is a top view of the relative positions of binding members and raised members provided by yet another embodiment of the present invention, with the first raised members being arranged in at least two rows along the second direction M and/or the second raised members being arranged in at least two rows along the first direction N; the second direction M is parallel to the plane of the substrate and intersects the first direction N.
It is understood that the arrangement of the raised members in at least two rows means that the number of the first raised members is two or more, and is arranged in at least two rows along the second direction M, and/or the number of the second raised members is two or more, and the second raised members are arranged in at least two rows along the first direction N. The setting of at least two rows of heightening parts, the more the quantity of the heightening parts, the larger the sum of cross sectional areas of the heightening parts parallel to the direction of the substrate, the smaller the area where the organic film layer is hollowed out, the larger the supporting effect on the conductive adhesive layer, the problems of the conductive adhesive layer such as the occurrence of the falling of the conductive adhesive layer or the sinking of the conductive adhesive layer can be effectively avoided, the reliability of the setting of the conductive adhesive layer is improved, and the binding of the binding parts and the chips is firmer. Secondly, the more the number of the heightening parts is, the larger the sum of cross-sectional areas of the heightening parts parallel to the direction of the substrate is, the more the heightening parts can help to reduce the storage of internal gas when the conductive adhesive layer is extruded, so that the air stored in the hollowed-out part can be prevented from impacting the conductive adhesive layer due to extrusion when the pressure is applied to the chip, and the conductive adhesive layer is made to be air-bubble or damaged.
Referring to FIG. 11, there is shown a schematic cross-sectional view of the structure at C5-C6 in FIG. 10. Among the raised members, the third raised member 2031 closest to the binding member is included, and a distance D between the third raised member and an orthographic projection of the binding member on the substrate is in a range of 30 micrometers to 200 micrometers.
The spacing D between the third raised feature and the perpendicular projection of the binding feature on the substrate is in the range of 30 microns to 200 microns. It should be noted that, this distance should not be too big, preferably is not more than 200 microns, and too big then can lead to the fretwork portion space great, leads to fretwork portion to store more air, when the chip receives the pressure effect of binding machine and binding part laminating, the air that remains in the fretwork portion also can receive the extrusion and cause inside pressure to grow, and then strikes the conductive adhesive layer, leads to the conductive adhesive layer to appear bubble or break. The distance is not too small, preferably not less than 30 micrometers, if too small, the binding component is too close to the chip, and if too close, the chip and the heightening component are tightly adjacent to each other even overlap in the thickness direction of the panel in the binding process, the chip and the binding component cannot be tightly attached to each other, the separation of the subsequent binding positions is caused, and the reliability of the product is affected.
Referring to fig. 5 and 6, fig. 5 is a schematic cross-sectional view of fig. 4 at C3-C4, and fig. 6 is a schematic cross-sectional view of fig. 4 at C3-C4 in another embodiment. The height of the elevating component in the direction vertical to the substrate is smaller than or equal to the height of the organic film block in the direction vertical to the substrate. In fig. 5, the height of the raising member 201 in the direction perpendicular to the substrate is equal to or close to the height of the organic film block in the direction perpendicular to the substrate, in fig. 6, the height of the raising member 201 in the direction perpendicular to the substrate is smaller than the height of the organic film block in the direction perpendicular to the substrate, and in addition, a plurality of raising members may be arranged at different heights at the same time.
It should be noted that, the vertical distance between the conductive adhesive layer 3 and the substrate 1 is not exactly the same, because the height of the organic film layer 2 in the panel thickness direction is larger than the height of the binding member 6 in the panel thickness direction, after the organic film layer 2 is hollowed to expose the binding member 6, the conductive adhesive layer 3 is overlapped with the organic film layer 2 and is attached to the binding member 6, and thus the vertical distance between the conductive adhesive layer 3 and the substrate 1 is not fixed. The raising member 201 is formed by the organic film layer 2, after the conductive adhesive layer 3 is attached to the binding member 6, the raising member 201 is located between the conductive adhesive layer 3 and the substrate 1, and is extruded by the conductive adhesive layer 3, so that the height of the raising member 7 is changed, that is, the height of the raising member 201 in the direction perpendicular to the substrate is equal to or smaller than the height of the organic film layer 2 in the thickness direction of the panel. Therefore, when the height of the raised part 201 in the direction perpendicular to the substrate is equal to or very close to the height of the organic film block in the direction perpendicular to the substrate, the operation in the process is relatively convenient and simple, after the raised part 201 is formed, no further operation in the process is required for the height of the raised part, the raised part 201 is positioned between the conductive adhesive layer 3 and the substrate 1 after the conductive adhesive layer 3 is attached to the binding part 6, the conductive adhesive layer 3 is tightly attached to the raised part 201 through external force extrusion, the effect of supporting the conductive adhesive layer is achieved, the problems of falling or sinking of the conductive adhesive layer are avoided, the reliability of the conductive adhesive layer is improved, and the binding of the binding part and the chip is firmer. When the height of the elevating members 201 in the direction perpendicular to the substrate is smaller than the height of the organic film layer 2 in the thickness direction of the panel, the specific height of each elevating member 201 is not limited herein, and the hollowed-out portions 701 are communicated with each other. The air amount stored in each hollow part 701 is not identical, when the conductive adhesive layer 3 is extruded, the air stored in each hollow part 701 is extruded, more air stored in the hollow parts flows to the hollow parts with less storage due to extrusion, so that the balance of air pressure among the hollow parts is maintained, more air stored in one hollow part is prevented, the corresponding part of the conductive adhesive layer is impacted due to extrusion, and the local conductive adhesive layer 3 is prevented from being air bubbles or damaged due to overlarge internal air pressure.
Fig. 12 is a top view showing the relative positions of a binding member and a raising member according to still another embodiment of the present invention, and fig. 13 is a top view showing the relative positions of a binding member and a raising member according to still another embodiment of the present invention.
Illustratively, the binding elements 6 are arranged in rows along the first direction N and in columns along the second direction M; the first direction N is parallel to the plane of the substrate, and the second direction M is parallel to the plane of the substrate and intersects the first direction N. In the embodiment of the present disclosure, the binding member 6 may be disposed in one row and a plurality of columns, or may be disposed in a plurality of rows and a plurality of columns. In some examples, as shown in fig. 2, 4, 7, the binding component 6 is a row and a plurality of columns; in other examples, as shown in fig. 12 and 13, the binding members 6 are provided in a plurality of rows and a plurality of columns, but the arrangement of the raising members of the present invention is applicable regardless of the arrangement of the binding members 6 in a plurality of rows and a plurality of columns. Therefore, the present invention is not limited to the above embodiments, and the binding members 6 are arranged in several rows and several columns, and the above embodiments are applicable to the arrangement of the raising members.
Fig. 14 is a flowchart of a method for binding a display panel according to an embodiment of the invention. The embodiment of the invention also provides a binding method of the display panel, which is used for preparing the display panel in the above embodiments, and the binding method of the display panel comprises the following steps:
s110: providing a substrate;
s120: forming a binding component and an organic film layer on one side of a substrate;
s130: patterning the organic film layer to form a hollowed-out part, an organic film block and a heightening component; wherein the heightening component is arranged between the organic membrane block and the binding component;
s140: a conductive adhesive layer is arranged on one side of the organic film layer away from the substrate;
s150: providing a chip, wherein the chip comprises chip pins, and binding the chip and the binding component through a conductive adhesive layer.
The binding method of the display panel is described in detail below with reference to fig. 15.
In step S110, a substrate 1 is provided;
alternatively, the substrate 1 may be a hard substrate such as a glass substrate; the flexible substrate may be a polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone, polyethylene naphthalate, or the like, and the material thereof is not particularly limited.
In step S120, a binding member and an organic film layer 2 are formed on one side of the substrate;
alternatively, the organic film layer may be formed by evaporation, coating, IJP (ink jet printing), ALD (Atomic Layer Deposition ), CVD (Chemical Vapor Deposition, chemical vapor deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition ), or the like.
In step S130, patterning the organic film layer to form a hollowed-out portion 701, an organic film block 210 and a raised member 204; wherein the raising member 204 is provided between the organic film block 210 and the binding member 6.
In the embodiment of the present invention, the hollowed-out portion 701 and the raised member 204 may be formed on the organic film layer by a photolithography process. For example, a photoresist may be coated on the organic film layer 2 first and patterned, and the photoresist may be classified into a negative photoresist and a positive photoresist. The insoluble substances formed after illumination are negative-type glue; on the contrary, the photoresist is insoluble in some solvents, and becomes soluble substance after illumination, namely positive photoresist, and optionally, in this embodiment, positive photoresist may be used, and the photoresist is patterned through a mask plate corresponding to the structural shape of the hollowed-out portion 701 and the raised part 204 to be formed.
Specifically, the step of patterning the photoresist includes: exposing part of the photoresist by adopting a patterned mask plate; the exposed portions of the photoresist are removed to form a patterned photoresist. Firstly, arranging a mask plate above photoresist, and irradiating the mask plate by adopting a proper light source so that part of light rays penetrate the mask plate to be incident on the photoresist, and exposing the photoresist; the exposed portion of the photoresist is then removed by a developer or the like to form a patterned photoresist, and then the organic film layer 2 may be further etched by a dry etching process or a wet etching process to form the hollowed-out portion 701 and the raised member 204.
It can be appreciated that in the embodiment of the present invention, after the binding member 6 is formed on the substrate in advance, the organic film layer 2 may be formed, and the patterning process may be performed on the organic film layer 2 to form the organic film block 210, the raised member 204 and the hollowed-out area, so that the raised member 204 is disposed between the binding member 6 and the organic film block 210, the binding member 6 is exposed to the hollowed-out area, and the raised member 201 and the binding member 6 divide the hollowed-out area into a plurality of hollowed-out portions 701.
In step S140, a conductive adhesive layer 3 is formed on the side of the organic film layer facing away from the substrate;
alternatively, the conductive paste layer 3 may be an anisotropic conductive paste layer (Anisotropic Conductive Film, ACF). The anisotropic conductive adhesive layer may be directly attached to the side of the organic film block 210 facing away from the substrate 1.
In step S150, the chip 4 is provided, and pressure is applied to one side of the chip, so that the chip pins 41 are in contact with the conductive adhesive layer 3, and the conductive adhesive layer 3 is in contact with the binding member 6, so as to complete the binding of the chip 4 and the binding member 6;
in the embodiment of the invention, a certain pressure can be applied to one side of the chip far away from the substrate by using the binding machine, so that the chip 4 and the binding component 6 are bound through the conductive adhesive layer 3, and the chip 4 and the binding component 6 are conducted through the conductive adhesive layer 3.
Referring to fig. 16, a top view of the relative positions of a chip and a raised feature according to one embodiment of the present invention is provided, and referring to fig. 17, a top view of the relative positions of a chip and a raised feature according to another embodiment of the present invention is provided.
The chip 4 comprises a third side and a fourth side which are adjacent, and the length of the third side is smaller than that of the fourth side; the heightening component between the third side and the organic film block is a third heightening component 205, and the heightening component between the fourth side and the organic film block is a fourth heightening component; the method comprises the steps of carrying out a first treatment on the surface of the The binding machine performs pressing on the chip and the binding component along a second direction from the central area of the chip to complete binding; the sum of orthographic projection areas of the third raised parts on the substrate is S1, the sum of cross sectional areas of the fourth raised parts parallel to the direction of the substrate is S2, and because of the conventional binding mode in the binding process, more third raised parts than the fourth raised parts are preferably arranged, namely S2 > S1, and the fourth raised parts are not required to be arranged, namely S1=0; the second direction is parallel to the plane of the substrate and intersects the first direction.
It should be noted that, in the conventional binding process, the binding machine applies a force to the chip 4 along the second direction M from the central area of the chip 4 (fig. 16) or from one side of the chip (fig. 17), where the force includes a component force (not shown) perpendicular to the display panel, and also includes a component force F1 (F11) parallel to the display panel along the second direction M, and the chip 4 is pressed by the force along the second direction M and the binding member 6, so as to complete the binding. The binding mode is a main binding mode in the current binding technology, because the second direction M applies the acting force to perform the lamination, namely, applies the acting force to perform the lamination along the direction same as the extending direction of the third side of the chip or the angle as close as possible to the extending direction of the third side of the chip, the chip 4 is protected from being broken, and if the first direction N of the chip is used for the lamination, namely, applies the acting force to perform the lamination along the direction same as the extending direction of the fourth side of the chip or the angle as close as possible to the extending direction of the chip, the chip is easy to crack or even break in the lamination process.
In this process, since the chip 4 is attached to the bonding member 6 by the force F1 (F11) along the second direction M, the air remaining between the chip 4 and the bonding member 6 is compressed to the region S4 between the fourth side and the organic film block 210 by the force F1 along the second direction, and a large amount of air is accumulated in the region S4, it is necessary to provide the elevating member 205 in the region S4, the space of the region S4 storing air is reduced due to the existence of the elevating member 205, the air compressed to the region S4 is compressed to escape from the bonding region except for a small amount of remaining air, and no excessive air is generated, thereby avoiding the generation of bubbles caused by the impact of the air to the conductive adhesive layer due to the compression. Further, since the binding manner of the present embodiment mainly causes the region S4 to accumulate air, the region S3 between the third side and the organic film block 210 hardly accumulates air due to the direction of the action of the external force, fig. 16 is a preferred embodiment of the present invention, that is, the region S3 is not provided with the raising means (S1 is equal to 0), and only the region S4 where the air is easily stored is provided with the raising means. In addition, in other embodiments, for example, the sum S2 of the cross-sectional areas of the fourth raised members 205 parallel to the substrate direction is larger than the sum S1 of the cross-sectional areas of the third raised members parallel to the substrate direction, and the number and the area of the specific raised members are not limited. The influence caused by the accumulation of air in the alleviation area S3 is not influenced, and the production process is simple and efficient to operate.
Referring to fig. 18, a display device provided in an embodiment of the invention includes: the display panel of any one of the above embodiments.
The display device shown in fig. 18 has the technical effects of the technical solution of the display panel in any of the above embodiments, and the explanation of the same or corresponding structure and terms as those of the above embodiments is not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the invention.
It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention, and they should be included in the scope of the present invention.
It should also be noted that the exemplary embodiments mentioned in this invention are based on a series of steps or describe some methods. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, or may be performed in a different order from the order in the embodiments, or several steps may be performed simultaneously.
Claims (11)
1. A display panel, comprising:
a substrate;
the organic film layer is arranged on one side of the substrate and comprises a hollowed-out area and an organic film block, the hollowed-out area is provided with a heightening component and a binding component, and the heightening component and the binding component divide the hollowed-out area into hollowed-out parts;
the conductive adhesive layer is arranged on one side of the organic film layer, which is away from the substrate, and in the direction vertical to the plane where the substrate is located, the orthographic projection of the conductive adhesive layer on the substrate covers the orthographic projection of the hollowed-out part on the substrate, and the conductive adhesive layer is partially contacted with the binding component;
the chip is arranged on one side of the conductive adhesive layer, which is away from the substrate, and is contacted with the conductive adhesive layer;
the hollow-out area is provided with a heightening component which is arranged between the organic film block and the binding component.
2. The display panel of claim 1, wherein the display panel comprises,
the binding component includes adjacent first and second edges, the first edge having a length less than a length of the second edge;
the heightening component between the first edge of the binding component and the organic film block is a first heightening component, the sum of orthographic projection areas of the first heightening component on the substrate is S1, the heightening component between the second edge of the binding component and the organic film block is a second heightening component, and the sum of orthographic projection areas of the second heightening component on the substrate is S2; wherein S1 is more than S2, and S2 is more than or equal to 0.
3. The display panel of claim 2, wherein the display panel comprises,
the first raised elements are arranged in a row along the second direction, and/or,
the second heightening parts are arranged in a row along the first direction;
the second direction is parallel to the plane of the substrate and intersects the first direction.
4. The display panel of claim 2, wherein the display panel comprises,
the first elevating members are arranged in at least two rows along the second direction, and/or,
the second heightening parts are arranged in at least two rows along the first direction;
the second direction is parallel to the plane of the substrate and intersects the first direction.
5. The display panel according to claim 3 or 4, wherein,
the cross-sectional pattern of the elevating member in a direction parallel to the substrate includes: round or square.
6. The display panel of claim 1, wherein the display panel comprises,
among the raised elements, a third raised element closest to the binding element is included;
the spacing between the third raised feature and the orthographic projection of the binding feature on the substrate is in the range of 30 microns to 200 microns.
7. The display panel of claim 1, wherein the display panel comprises,
the height of the heightening component in the direction vertical to the substrate is smaller than or equal to the height of the organic film block in the direction vertical to the substrate.
8. The display panel of claim 1, wherein the display panel comprises,
the chip comprises chip pins;
the chip is connected with the binding component through the conductive adhesive layer;
the display panel further includes a pixel and a first connection line through which a voltage signal is transmitted from the chip to the pixel.
9. A method of binding a display panel, comprising:
providing a substrate;
forming a binding component and an organic film layer on one side of the substrate;
patterning the organic film layer to form a hollowed-out part, an organic film block and a heightening component; wherein, the heightening component is arranged between the organic membrane block and the binding component;
a conductive adhesive layer is arranged on one side of the organic film layer away from the substrate;
providing a chip, wherein the chip comprises chip pins, and binding the chip and the binding component through a conductive adhesive layer.
10. The method of claim 9, wherein the chip includes a third side and a fourth side adjacent to each other, the third side having a length smaller than a length of the fourth side;
the heightening component between the third side and the organic film block is a third heightening component, and the heightening component between the fourth side and the organic film block is a fourth heightening component;
the binding machine presses the chip and the binding component along a second direction from the central area of the chip;
the sum of orthographic projection areas of the third heightening component on the substrate is S1, and the sum of cross sectional areas of the fourth heightening component parallel to the direction of the substrate is S2; wherein S2 is more than S1, S1 is more than or equal to 0;
the second direction is parallel to the plane of the substrate and intersects the first direction.
11. A display device, comprising: the display panel of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311395272.1A CN117500338A (en) | 2023-10-25 | 2023-10-25 | Display panel, binding method of display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311395272.1A CN117500338A (en) | 2023-10-25 | 2023-10-25 | Display panel, binding method of display panel and display device |
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| CN117500338A true CN117500338A (en) | 2024-02-02 |
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| CN202311395272.1A Pending CN117500338A (en) | 2023-10-25 | 2023-10-25 | Display panel, binding method of display panel and display device |
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| Country | Link |
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| CN (1) | CN117500338A (en) |
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- 2023-10-25 CN CN202311395272.1A patent/CN117500338A/en active Pending
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