CN117497469B - Multi-size wafer transmission device and method and electronic equipment - Google Patents

Multi-size wafer transmission device and method and electronic equipment Download PDF

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Publication number
CN117497469B
CN117497469B CN202410001456.3A CN202410001456A CN117497469B CN 117497469 B CN117497469 B CN 117497469B CN 202410001456 A CN202410001456 A CN 202410001456A CN 117497469 B CN117497469 B CN 117497469B
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wafer
module
transport module
identification information
control unit
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CN117497469A (en
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戴金方
相宇阳
耿晓杨
李玲娅
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Wuxi Zhuohai Technology Co ltd
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Wuxi Zhuohai Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a multi-size wafer transmission device, a multi-size wafer transmission method and electronic equipment. Each loading table is defined with identification information, and the transport module grabs the wafer on the target loading table according to the grabbing instruction and places the wafer on the wafer positioning module; after the transport module grabs the wafer on the target loading table, the control module sets the identification of the transport module as a first identification according to the identification information corresponding to the loading table; after the control module transportation module places the wafer on the wafer positioning module, the first mark of the transportation module is changed into the second mark; the control module further determines an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation; and the wafer positioning module is used for positioning the wafer according to the execution parameters. The wafer positioning and distinguishing of non-original size are realized, equipment is not required to be replaced, and customized measurement requirements are met.

Description

Multi-size wafer transmission device and method and electronic equipment
Technical Field
The present invention relates to the field of wafer transmission technologies, and in particular, to a multi-size wafer transmission device, a multi-size wafer transmission method, and an electronic device.
Background
Semiconductor devices are very large, large and expensive. In recent years, with the rise of three-generation and four-generation compound semiconductors, various compound multifunctional and customized requirements such as multiple materials, multiple sizes, multiple transparencies, multiple angles, multiple transmission carrier forms and the like are provided for equipment.
In the prior art, particularly, the size and the positioning direction of the loading port of the semiconductor measurement equipment can only be used by the original parameters of the equipment, and the customization requirement cannot be met, if the equipment is correspondingly replaced, the equipment cost is relatively high, and the production cost is not reduced.
Disclosure of Invention
The invention provides a multi-size wafer transmission device, a multi-size wafer transmission method and electronic equipment, which realize positioning and distinguishing of wafers with non-original sizes, do not need to replace equipment, and meet the customized measurement requirement.
In a first aspect, an embodiment of the present invention provides a multi-sized wafer transfer apparatus, including at least two loading tables, at least two transport modules, a wafer positioning module, and a control module;
each loading table is defined with identification information, and the control module is respectively connected with the transport module and the wafer positioning module;
the transport module is used for grabbing the wafer on the loading table according to the grabbing instruction and placing the wafer on the wafer positioning module;
The control module is used for setting the identification of the transport module as a first identification according to the identification information corresponding to the loading table after the transport module grabs the wafer on the loading table; the first identifier is used for representing the identification information and the grabbing state of the transport module;
the control module is used for changing the first identifier of the transport module into a second identifier after the transport module places the wafer on the wafer positioning module; the second identifier is used for representing the identification information and the placement state of the transport module;
the control module is further used for determining an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
Optionally, the control module includes a first control unit and a second control unit;
the first control unit is connected with the transportation module; the second control unit is connected with the wafer positioning module; the first control unit is connected with the second control unit;
the first control unit is used for acquiring the identification information of the loading table corresponding to the process of grabbing the wafer after the transport module grabs the wafer on the loading table according to the grabbing instruction, and setting the identification of the transport module as the first identification according to the identification information;
The first control unit is further configured to change the first identifier of the transport module to the second identifier after the transport module transmits the wafer to the wafer positioning module;
the second control unit is used for determining an execution parameter according to the second identifier.
Optionally, the second control unit is further configured to send an initialization signal to the first control unit after determining the execution parameter;
the first control unit is further configured to set the identifier of the transport module to an initial identifier according to the initialization signal.
The embodiment of the invention also provides a multi-size wafer transmission device, which comprises at least two loading tables, a transport module, a wafer positioning module and a control module;
each loading table is defined with identification information, and the control module is respectively connected with the transport module and the wafer positioning module;
the transport module is used for grabbing the wafer on the loading table according to the grabbing instruction and placing the wafer on the wafer positioning module;
the control module is used for acquiring the identification information of the loading table corresponding to the wafer which is grabbed by the transport module;
The control module is also used for determining an execution parameter according to the identification information, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
In a second aspect, an embodiment of the present invention provides a multi-size wafer transfer method, performed by a multi-size wafer transfer apparatus, where the multi-size wafer transfer apparatus includes at least two loading tables, at least two transport modules, a wafer positioning module, and a control module;
the method comprises the following steps:
each loading table is defined with identification information, and the transport module grabs the wafer on the loading table according to the grabbing instruction and places the wafer on the wafer positioning module;
after the transport module grabs the wafer on the loading table, the control module sets the identification of the transport module as a first identification according to the identification information corresponding to the loading table; the first identifier is used for representing the identification information and the grabbing state of the transport module;
the control module changes the first identification of the transport module into a second identification after the transport module places the wafer on the wafer positioning module; the second identifier is used for representing the identification information and the placement state of the transport module;
The control module determines an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
Optionally, the control module includes a first control unit and a second control unit;
the method comprises the following steps:
the first control unit acquires the identification information of the loading table corresponding to the wafer grabbing process after the transport module grabs the wafer on the loading table according to the grabbing instruction, and sets the identification of the transport module as the first identification according to the identification information;
the first control unit changes the first identifier of the transport module into the second identifier after the transport module transmits the wafer to the wafer positioning module;
the second control unit determines an execution parameter according to the second identifier.
Optionally, after the second control unit determines the execution parameter according to the second identifier, the second control unit sends an initialization signal to the first control unit;
the first control unit identifies the transport module as an initial identification according to the initialization signal.
Optionally, after the at least two transport modules grasp the wafer on the loading table according to the grasping instruction, the identifier of the transport module is set as a first identifier according to the identification information of the loading table corresponding to the wafer grasping process;
after one of the transport modules transmits and places the wafer to the wafer positioning module, the first control unit changes the identification of the corresponding transport module from the first identification to the second identification; the rest of the transport modules are still the first identifications;
the second control unit determines the transport module to determine an execution parameter according to the second identifier and sends an initialization signal to the first control unit; the first control unit marks the corresponding transport module as an initial mark according to the initialization signal.
The embodiment of the invention also provides a multi-size wafer transmission method which is executed by the multi-size wafer transmission device, wherein the multi-size wafer transmission device comprises at least two loading tables, a transportation module, a wafer positioning module and a control module;
the method comprises the following steps:
each loading table is defined with identification information, and the transport module grabs the wafer on the loading table according to the grabbing instruction and places the wafer on the wafer positioning module;
The control module acquires the identification information of the loading table corresponding to the wafer which is grabbed by the transport module;
the control module determines an execution parameter according to the identification information, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
In a third aspect, an embodiment of the present invention provides an electronic device, including:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the multi-sized wafer transfer method of any embodiment of the present invention.
According to the technical scheme provided by the embodiment of the invention, the control module sets the first mark for the transport module according to the identification information of the corresponding loading table when the transport module grabs the wafer, and changes the first mark into the second mark after the transport module is provided with the wafer positioning module, so that the wafer grabbed by the transport module is traced, and the positioning and distinguishing of the wafer with the non-original size are realized according to the mapping relation between the identification information of the corresponding loading table and the execution parameters, the equipment is not required to be replaced, and the customized measurement requirement is met.
Drawings
Fig. 1 is a schematic structural diagram of a multi-sized wafer transfer apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of another multi-sized wafer transfer apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of another multi-sized wafer transfer apparatus according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of another multi-sized wafer transfer apparatus according to an embodiment of the present invention.
Fig. 5 is a flow chart of a multi-size wafer transmission method according to an embodiment of the present invention.
Fig. 6 is a flow chart of another multi-size wafer transfer method according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the prior art, particularly, the size and the positioning direction of the loading port of the semiconductor measurement device can only be used by original parameters of the machine, for example, if the original size of the semiconductor device machine is 12 inches and 8 inches, and if the original size of the semiconductor device machine is 12 inches and 8 inches, the wafer size can be known after positioning and identifying by the wafer positioning module, and if the material is 6 inches for the loading port of 12 inches and 8 inches, the notch position wafer positioning module cannot be distinguished, the customization requirement cannot be met, and if the semiconductor device machine is correspondingly replaced, the equipment cost is relatively high, and the production cost is unfavorable to be reduced.
In view of the above, fig. 1 is a schematic structural diagram of a multi-sized wafer transfer apparatus, referring to fig. 1, including at least two loading tables 110, at least two transporting modules 120, a wafer positioning module 130 and a control module 140;
each loading table 110 has identification information according to the wafer size; the control module 140 is connected to the transport module 120 and the wafer positioning module 130, respectively;
the transport module 120 is configured to grab the wafer on the target loading table 110 according to the grabbing instruction, and transfer the wafer to the wafer positioning module 130;
the control module 140 is configured to set the identifier of the transport module 120 to a first identifier according to the identification information corresponding to the loading table 110 after the transport module 120 grabs the wafer on the target loading table 110; the first identifier is used to represent the identification information and the grasping status of the transport module 120;
The control module 140 is configured to change the first identifier of the transport module 120 to the second identifier after the transport module 120 places the wafer on the wafer positioning module 130; the second identifier is used to represent the identification information and the placement state of the transport module 120;
the control module 140 is further configured to determine an execution parameter according to the second identifier, where the identification information has a mapping relationship with the execution parameter;
the wafer positioning module 130 is configured to position a wafer according to the execution parameters.
Specifically, the transport module 120 may use a manipulator, and the manipulator is used to grasp the wafer from the loading table 110, so as to implement the work flow for different processing procedures of the wafer through the transfer of different positions of the manipulator. Each loading station 110 is defined with identification information, which is information for identifying the identity of the loading station 110, which is one or more of parameter information, position information, and number information of the initial size of the semiconductor equipment station. For example, if the stage 110 of the semiconductor device machine adopts the parameter information of the initial size as the identification information of the stage 110, if the original size wafer combination of the stage is 12 inches and 8 inches, the corresponding one of the stages 110 is set to 12 inches of identification information and the other stage 110 is set to 8 inches of identification information. The identification information serves as identification information of the loading stations 110, so that each loading station 110 can be distinguished using the identification information. The transport module 120 takes the material on the loading station 110 according to a grabbing instruction, which may be generated and sent by the semiconductor equipment station controller, to transfer the wafer transport to the wafer positioning module 130.
After the transport module 120 grabs the wafer on the loading table 110 according to the grabbing instruction, the control module 140 obtains the identification information of the corresponding loading table 110, where the process of obtaining the identification information of the corresponding loading table 110 when the transport module 120 grabs the wafer by the control module 140 may obtain the corresponding loading table 110 when the transport module 120 grabs the wafer through direct obtaining, for example, through visual monitoring. The identification information of the corresponding loading platform 110 may be converted into communication data by an indirect acquisition manner, for example, through a grabbing process of the transport module 120, and sent to the control module 140, so that the control module 140 may bind the transport module 120 with the identification information of the corresponding loading platform 110 when grabbing a wafer, set the identification of the transport module 120 as a first identification, for example, name a plurality of loading platforms 110 as LPA, LPB, LPC … … in sequence, name a plurality of transport modules 120 as ARM1, ARM2, ARM3 … …, and use the code stream feature to identify that the transport module 120 grabs the target loading platform 110. For example, when the first transport module ARM1 grabs a wafer on the first loading platform LPA, the control module 140 identifies the code stream of the first transport module ARM1 as wf_sourcenos1=a1, that is, the first identifier, according to the identification information on the first loading platform LPA. If the first transport module ARM1 grabs a wafer on the second loading platform LPB, the control module 140 identifies the code stream of the first transport module ARM1 as wf_sourcenos1=b1 according to the identification information on the second loading platform LPB. Similarly, the first identification is accomplished based on identification information of the particular transport module 120 and corresponding loading station 110. The first flag may indicate that the transport module 120 is currently in a gripping state and indicates which of the load stations is gripping a wafer.
In the embodiment of the invention, the WF_SourceARM 1=A1 is used as the code stream identifier, and the code stream identifier can be identified through binary, decimal, hexadecimal and other digital code streams, so that the identification and differentiation effects can be achieved. After the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the control module 140 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, that is, as the second mark, to indicate that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. The control module 140 can know that the wafer on the wafer positioning module 130 is the wafer corresponding to the first loading platform LPA according to the second identifier, that is, the second identifier may indicate that the transport module 120 is currently in a placed state, so that the wafer placed on the wafer positioning module 130 is the wafer corresponding to the loading platform, thereby realizing the memorization and tracing of the grabbing process of the transport module 120.
The control module 140 loads the execution parameters of the wafer positioning module 130 and the subsequent execution units according to the second identifier of the transport module 120, where the execution parameters include the positioning, the angle, the notch rotation angle, and the like of the wafer. The identification information and the execution parameters have a mapping relationship, that is, each loading platform corresponds to one execution parameter, for example, the identification information of 12 inches of the first loading platform LPA, but according to the requirements of the customized application, the wafer placed by the first loading platform LPA is a 6-inch wafer needing 45-degree positioning of the notch, so that the identification information of the first loading platform LPA corresponds to the execution parameters of 45-degree positioning of the notch one by one. Accordingly, the control module 140 determines the execution parameters corresponding to the identification information of the transport module 120 according to the second identification of the transport module 120, so that the execution parameters can be loaded into the wafer positioning module 130 and the subsequent execution units. Therefore, the wafer positioning and distinguishing of the non-original size are realized, equipment is not required to be replaced, and the customization requirement is met.
For ease of understanding, the exemplary illustration, the work scenario takes two load stations 110 as an example, the identification information of the first load station LPA is the initial 12 inch wafer information, the identification information of the first load station LPB is the initial 8 inch wafer information, and the notch 45 degree positioning and the 0 degree positioning are required to be performed on the 6 inch wafer, respectively. A 6-inch wafer, which performs notch 45 degree positioning, is placed on the first stage LPA, and a 6-inch wafer, which performs notch 0 degree positioning, is placed on the first stage LPB. The identification information of the first loading platform LPA corresponds to the execution parameter for executing 45-degree positioning of the notch, the identification information of the first loading platform LPB corresponds to the execution parameter for executing 0-degree positioning of the notch, and the working process of the multi-size wafer transmission device is as follows:
the first transport module ARM1 grabs the wafer at the first loading station LPA according to the grabbing instruction, and places the wafer in the wafer positioning module 130 after grabbing the wafer. The transport module 120 may be identified as grabbing the target load station 110 using the code stream features. For example, the control module 140 identifies the code stream of the first transport module ARM1 as wf_sourcearm 1=a1, i.e. the first identifier, according to the identification information on the first loading station LPA.
After the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the control module 140 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, that is, as the second mark, to indicate that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. The control module 140 can know that the wafer on the wafer positioning module 130 is the wafer corresponding to the first LPA according to the second identifier, so as to realize the memorization and tracing of the grabbing process of the first transport module ARM 1.
According to the second identifier, the first loading station LPA is known to take the material, and the identification information of the first loading station LPA corresponds to the execution parameter of the 45-degree positioning of the notch, so the control module 140 sends the execution parameter to the wafer positioning module 130. The wafer positioning module 130 performs positioning rotation of the wafer according to the execution parameters. And 6-inch wafers with 45-degree positioning gaps are transmitted into different subsequent working cavity components correspondingly by changing uplink and downlink responses to identify and process the 6-inch wafers with 45-degree positioning gaps.
Accordingly, if the transport module 120 is required to pick the wafer at the first loading station LPB according to the pick-up instruction, the wafer is placed in the wafer positioning module 130. After the transport module 120 is placed, the control module 140 traces the identification information of the first loading platform LPB corresponding to the time when the transport module 120 grabs the wafer according to the second identifier, and can know that the first loading platform LPB is for taking the material according to the identification information, and the identification information of the first loading platform LPB corresponds to the execution parameter of the notch 0 degree positioning, so that the control module 140 sends the execution parameter to the wafer positioning module 130. The wafer positioning module 130 performs positioning rotation of the wafer according to the execution parameters. And 6-inch wafers with 0-degree positioning gaps are transmitted into different subsequent working cavity components correspondingly by changing uplink and downlink responses to identify and process the 6-inch wafers with 0-degree positioning gaps.
According to the technical scheme provided by the embodiment of the invention, the control module sets the first mark for the transport module according to the identification information of the corresponding loading table when the transport module grabs the wafer, and changes the first mark into the second mark after the transport module is provided with the wafer positioning module, so that the wafer grabbed by the transport module is traced, and the positioning and distinguishing of the wafer with the non-original size are realized according to the mapping relation between the identification information of the corresponding loading table and the execution parameters, the equipment is not required to be replaced, and the customized measurement requirement is met.
Fig. 2 is a schematic structural diagram of another multi-sized wafer transfer apparatus according to an embodiment of the present invention, and referring to fig. 1, referring to fig. 2, the control module 140 includes a first control unit 141 and a second control unit 142;
the first control unit 141 is connected with the transport module 120; the second control unit 142 is connected to the wafer positioning module 130; the first control unit 141 is connected to the second control unit 142; the first control unit 141 is configured to obtain, after the transport module 120 grabs the wafer on the target loading table 110 according to the grabbing instruction, identification information of the loading table 110 corresponding to the grabbing of the wafer, and set an identifier of the transport module 120 as a first identifier according to the identification information;
The first control unit 141 is further configured to change the first identifier of the transport module 120 to the second identifier after the transport module 120 transmits the wafer to the wafer positioning module 130; the second control unit 142 is configured to determine the execution parameter according to the second identifier.
Specifically, after the transport module 120 grabs the wafer on the target loading platform 110 according to the grabbing instruction, the identifying information is converted into communication data and sent to the control module 140, and the identifying information is used for identity discrimination of the loading platform 110. The first control unit 141 identifies the transport module 120 as a first identification according to the identification information.
For example, the plurality of load stations 110 are named LPA, LPB, LPC … … in sequence, the plurality of transport modules 120 are named ARM1, ARM2, ARM3 … …, and the code stream feature may be used to identify the transport module 120 as grabbing the target load station 110. For example, if the first transport module ARM1 grabs a wafer on the first loading platform LPA, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a1, that is, as the first mark, according to the identification information on the first loading platform LPA. If the first transport module ARM1 grabs a wafer on the second loading platform LPB, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=b1 according to the identification information on the second loading platform LPB. Similarly, the first identification is accomplished according to the particular transport module 120 and corresponding loading station 110.
In the embodiment of the invention, the WF_SourceARM 1=A1 is used as the code stream identifier, and the code stream identifier can be identified through binary, decimal, hexadecimal and other digital code streams, so that the identification and differentiation effects can be achieved. After the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, that is, as the second mark, to indicate that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. The second control unit 142 can determine that the wafer on the wafer positioning module 130 is the wafer corresponding to the first loading station LPA according to the second identifier. If the wafer corresponding to the first loading platform LPA is a 6 inch wafer, 45 degree positioning needs to be performed, so that the execution parameters of the wafer positioning module 130 can be determined according to the second identifier. And the 6-inch wafer with the gap positioned at 45 degrees is correspondingly transmitted into different subsequent working cavity components by changing uplink and downlink responses to identify and process the 6-inch wafer with the gap positioned at 45 degrees.
Optionally, the second control unit 142 is further configured to send an initialization signal to the first control unit 141 after determining the execution parameter; the first control unit 141 is further configured to set the identifier of the transport module 120 to an initial identifier according to the initialization signal. Specifically, after the second control unit 142 determines the execution parameters, the wafer positioning module 130 performs positioning on the wafer, the second control unit 142 sends initialization information to the first control unit 141, and the first control unit 141 performs initialization recovery on the transport module 120 on which the wafer is placed according to the initialization information. For example, based on the above embodiment, the first control unit 141 identifies the code stream of the first transport module ARM1 as wf_sourcearm 1=a0, which is the second identification, indicating that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. When the first control module 140 receives the initialization signal, the code stream of the first transport module ARM1 that completes the placement is identified as wf_sourcearm 1=00, i.e. the initial identification. Indicating that the first transport module ARM1 has completed placing in an idle state, the next cycle workflow may be performed.
Fig. 3 is a schematic structural diagram of another multi-sized wafer transfer apparatus according to an embodiment of the present invention, referring to fig. 3, a first control unit 141 and a second control unit 142 are added to a conventional semiconductor equipment platform, and the semiconductor equipment platform includes a plurality of loading ports, which are respectively named as LPA, LPB, LPC. Each load port is configured with a magazine, and further includes a robot control unit 320, a robot 330, a wafer positioning module 130, a transfer chamber 340, and a semiconductor equipment station controller 310. The first control unit 141 is communicatively connected to the semiconductor device platform controller 310, and the first control unit 141 is communicatively connected to the second control unit 142, where the dashed line is a movement track of the manipulator 330. The first control unit 141 and the second control unit 142 may both use a dual serial port single chip microcomputer, and the first control unit 141 and the second control unit 142 may use three-wire communication, for example, the first control unit 141 and the second control unit 142 maintain high level in standby state. The lines a and B are the output of the first control unit 141 to the second control unit 142, and the line c is the output of the second control unit 142 to the first control unit 141.
The first control unit 141 determines that the wafer is from one of LPA, LPB and LPC according to the identification information, and when the wafer positioning module 130 performs the predetermined positioning, the first control unit 141 outputs a low level to inform the second control unit 142 through the a line and/or the B line, and keeps the low level, and the second control unit 142 sets the C line to the high level. The first control unit 141 changes the robot variable wf_sourcearmn=a1/B1/C1 to A0/B0/C0 (n=1/2/3). When the wafer positioning module 130 finishes the positioning operation, the second control unit 142 makes an angle and a size, and the second control unit 142 outputs a C-line low level. The first control unit 141 resumes the high level of the a line and/or the B line after receiving the signal, and accordingly resumes the variable wf_sourcearmn of the robot to the initial 00.
Based on the above embodiments, fig. 4 is a schematic structural view of another multi-sized wafer conveying apparatus according to an embodiment of the present invention, referring to fig. 4, including at least two loading tables 110, a transporting module 120, a wafer positioning module 130 and a control module 140;
each loading table 110 has identification information according to the wafer size; the control module 140 is connected to the transport module 120 and the wafer positioning module 130, respectively;
the transport module 120 is configured to grab the wafer on the target loading table 110 according to the grabbing instruction, and transfer the wafer to the wafer positioning module 130;
the control module 140 is configured to obtain the identification information of the loading table corresponding to the wafer captured by the transport module;
the control module 140 is further configured to determine an execution parameter according to the identification information, where the identification information has a mapping relationship with the execution parameter;
the wafer positioning module 130 is configured to position a wafer according to the execution parameters.
Specifically, each loading table 110 is defined with identification information, which is information for identifying the identity of the loading table 110 by one or more of parameter information, position information, and number information of the initial size of the semiconductor equipment table. For example, if the stage 110 of the semiconductor device machine adopts the parameter information of the initial size as the identification information of the stage 110, if the original size wafer combination of the stage is 12 inches and 8 inches, the corresponding one of the stages 110 is set to 12 inches of identification information and the other stage 110 is set to 8 inches of identification information. The identification information serves as identification information of the loading stations 110, so that each loading station 110 can be distinguished using the identification information. The transport module 120 takes the material on the loading station 110 according to a grabbing instruction, which may be generated and sent by the semiconductor equipment station controller, to transfer the wafer transport to the wafer positioning module 130.
After the transport module 120 grabs the wafer on the loading table 110 according to the grabbing instruction, the control module 140 obtains the identification information of the corresponding loading table 110, where the process of obtaining the identification information of the corresponding loading table 110 when the transport module 120 grabs the wafer by the control module 140 may obtain the corresponding loading table 110 when the transport module 120 grabs the wafer through direct obtaining, for example, through visual monitoring. The identification information of the corresponding loading platform 110 may also be converted into communication data by an indirect acquisition manner, for example, through a grabbing process of the transport module 120, and sent to the control module 140, so that the control module 140 may bind the identification information of the corresponding loading platform 110 when the transport module 120 grabs the wafer, where the identification information and the execution parameter have a mapping relationship, that is, each loading platform corresponds to an execution parameter, for example, the identification information of the first loading platform LPA is 12 inches, but according to the requirements of the customized application, the wafer placed by the first loading platform LPA is a 6 inch wafer that needs to be positioned with a gap of 45 degrees, and therefore, the identification information of the first loading platform LPA corresponds to the execution parameter that needs to be positioned with a gap of 45 degrees in a one-to-one correspondence manner. After the transportation module 120 finishes placing, the control module 140 determines corresponding execution parameters according to the identification information, so that the execution parameters can be loaded to the wafer positioning module 130 and the subsequent execution units. Therefore, the wafer positioning and distinguishing of the non-original size are realized, equipment is not required to be replaced, and the customization requirement is met.
Fig. 5 is a flow chart of a multi-size wafer transfer method according to an embodiment of the present invention, and in combination with fig. 1, the multi-size wafer transfer method is performed by a multi-size wafer transfer apparatus, and the multi-size wafer transfer apparatus includes at least two loading tables 110, at least two transporting modules 120, a wafer positioning module 130, and a control module 140; the apparatus may be implemented in hardware and/or software. The method specifically comprises the following steps:
s110, each loading platform is provided with identification information according to the wafer size; the transport module grabs the wafer on the target loading table according to the grabbing instruction and transmits the wafer to the wafer positioning module;
specifically, the transport module 120 may use a manipulator, and the manipulator is used to grasp the wafer from the loading table 110, so as to implement the work flow for different processing procedures of the wafer through the transfer of different positions of the manipulator. Each loading station 110 is defined with identification information, which is information for identifying the identity of the loading station 110, which is one or more of parameter information, position information, and number information of the initial size of the semiconductor equipment station. For example, if the stage 110 of the semiconductor device machine adopts the parameter information of the initial size as the identification information of the stage 110, if the original size wafer combination of the stage is 12 inches and 8 inches, the corresponding one of the stages 110 is set to 12 inches of identification information and the other stage 110 is set to 8 inches of identification information. The identification information serves as identification information of the loading stations 110, so that each loading station 110 can be distinguished using the identification information. The transport module 120 takes the material on the loading station 110 according to a grabbing instruction, which may be generated and sent by the semiconductor equipment station controller, to transfer the wafer transport to the wafer positioning module 130.
S120, after the transport module grabs the wafer on the target loading table, the control module sets the identification of the transport module as a first identification according to the identification information corresponding to the loading table; the first identifier is used for representing the identification information and the grabbing state of the transport module;
specifically, after the transport module 120 grabs the wafer on the loading table 110 according to the grabbing instruction, the control module 140 obtains the identification information of the corresponding loading table 110, where the process of obtaining the identification information of the corresponding loading table 110 when the transport module 120 grabs the wafer by the control module 140 may obtain the corresponding loading table 110 when the transport module 120 grabs the wafer through direct obtaining, for example, through visual monitoring. The identification information of the corresponding loading platform 110 may be converted into communication data by an indirect acquisition manner, for example, through a grabbing process of the transport module 120, and sent to the control module 140, so that the control module 140 may bind the transport module 120 with the identification information of the corresponding loading platform 110 when grabbing a wafer, set the identification of the transport module 120 as a first identification, for example, name a plurality of loading platforms 110 as LPA, LPB, LPC … … in sequence, name a plurality of transport modules 120 as ARM1, ARM2, ARM3 … …, and use the code stream feature to identify that the transport module 120 grabs the target loading platform 110. For example, when the first transport module ARM1 grabs a wafer on the first loading platform LPA, the control module 140 identifies the code stream of the first transport module ARM1 as wf_sourcenos1=a1, that is, the first identifier, according to the identification information on the first loading platform LPA. If the first transport module ARM1 grabs a wafer on the second loading platform LPB, the control module 140 identifies the code stream of the first transport module ARM1 as wf_sourcenos1=b1 according to the identification information on the second loading platform LPB. Similarly, the first identification is accomplished based on identification information of the particular transport module 120 and corresponding loading station 110. The first flag may indicate that the transport module 120 is currently in a gripping state and indicates which of the load stations is gripping a wafer. In the embodiment of the invention, the WF_SourceARM 1=A1 is used as the code stream identifier, and the code stream identifier can be identified through binary, decimal, hexadecimal and other digital code streams, so that the identification and differentiation effects can be achieved.
S130, after the transport module places the wafer on the wafer positioning module, the control module changes the first identification of the transport module into the second identification; the second identifier is used for indicating the identification information and the placement state of the transport module.
Specifically, after the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the control module 140 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, that is, as the second mark, to indicate that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. The control module 140 can know that the wafer on the wafer positioning module 130 is the wafer corresponding to the first loading platform LPA according to the second identifier, that is, the second identifier may indicate that the transport module 120 is currently in a placed state, so that the wafer placed on the wafer positioning module 130 is the wafer corresponding to the loading platform, thereby realizing the memorization and tracing of the grabbing process of the transport module 120.
S140, the control module determines an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation;
specifically, the control module 140 loads the execution parameters of the wafer positioning module 130 and the subsequent execution units according to the second identifier of the transport module 120, where the execution parameters include the positioning, the angle, the notch rotation angle, and the like of the wafer. The identification information and the execution parameters have a mapping relation, that is, each loading platform corresponds to one execution parameter, for example, the identification information of 12 inches of the first loading platform LPA, but according to the requirements of customized application, the wafer placed by the first loading platform LPA is a 6-inch wafer needing 45-degree positioning of a notch, so that the positioning and distinguishing of the wafer with a non-original size are realized, equipment replacement is not needed, and the customization requirements are met.
And S150, the wafer positioning module positions the wafer according to the execution parameters.
In some embodiments, optionally, the control module 140 includes a first control unit 141 and a second control unit 142;
the method comprises the following steps:
the first control unit 141 grabs the wafer on the target loading table 110 according to the grabbing instruction by the transport module 120, then grabs the identification information of the loading table 110 corresponding to the wafer, and sets the identification of the transport module 120 as the first identification according to the identification information;
the first control unit 141 also changes the first identifier of the transport module 120 to the second identifier after the transport module 120 transmits the wafer to the wafer positioning module 130;
the second control unit 142 determines the execution parameters based on the second identification.
After the transport module 120 grabs the wafer on the target loading table 110 according to the grabbing instruction, the identifying information is converted into communication data and sent to the control module 140, and the identifying information is used for identity discrimination of the loading table 110. The first control unit 141 identifies the transport module 120 as a first identification according to the identification information.
For example, the plurality of load stations 110 are named LPA, LPB, LPC … … in sequence, the plurality of transport modules 120 are named ARM1, ARM2, ARM3 … …, and the code stream feature may be used to identify the transport module 120 as grabbing the target load station 110. For example, if the first transport module ARM1 grabs a wafer on the first loading platform LPA, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a1, that is, as the first mark, according to the identification information on the first loading platform LPA. If the first transport module ARM1 grabs a wafer on the second loading platform LPB, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=b1 according to the identification information on the second loading platform LPB. Similarly, the first identification is accomplished according to the particular transport module 120 and corresponding loading station 110.
In the embodiment of the invention, the WF_SourceARM 1=A1 is used as the code stream identifier, and the code stream identifier can be identified through binary, decimal, hexadecimal and other digital code streams, so that the identification and differentiation effects can be achieved. After the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, that is, as the second mark, to indicate that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. The second control unit 142 can determine that the wafer on the wafer positioning module 130 is the wafer corresponding to the first loading station LPA according to the second identifier. If the wafer corresponding to the first loading platform LPA is a 6 inch wafer, 45 degree positioning needs to be performed, so that the execution parameters of the wafer positioning module 130 can be determined according to the second identifier. And the 6-inch wafer with the gap positioned at 45 degrees is correspondingly transmitted into different subsequent working cavity components by changing uplink and downlink responses to identify and process the 6-inch wafer with the gap positioned at 45 degrees.
Optionally, after the second control unit 142 determines the transportation module 120 to determine the execution parameter according to the second identifier, the second control unit 142 sends an initialization signal to the first control unit 141;
The first control unit 141 sets the identification of the transport module 120 to an initial identification according to the initialization signal.
Specifically, after the second control unit 142 determines the execution parameters, the wafer positioning module 130 performs positioning on the wafer, the second control unit 142 sends initialization information to the first control unit 141, and the first control unit 141 performs initialization recovery on the transport module 120 on which the wafer is placed according to the initialization information. For example, based on the above embodiment, the first control unit 141 identifies the code stream of the first transport module ARM1 as wf_sourcearm 1=a0, which is the second identification, indicating that the wafer on the first loading platform LPA grabbed by the first transport module ARM1 has been placed. When the first control module 140 receives the initialization signal, the code stream of the first transport module ARM1 that completes the placement is identified as wf_sourcearm 1=00, i.e. the initial identification. Indicating that the first transport module ARM1 has completed placing in an idle state, the next cycle workflow may be performed.
Optionally, if at least two transport modules 120 grasp the wafer on the target loading table 110 according to the grasping instruction, the identifier of the transport module 120 is set to be the first identifier according to the identification information of the loading table 110 corresponding to the time of grasping the wafer;
After one of the transport modules 120 transfers and places the wafer to the wafer positioning module 130, the first control unit 141 changes the identifier of the corresponding transport module 120 from the first identifier to the second identifier; the remaining transport modules 120 remain the first identifications;
the second control unit 142 determines the transport module 120 to determine the execution parameters according to the second identification, and transmits an initialization signal to the first control unit 141; the first control unit 141 identifies the corresponding transport module 120 as an initial identification according to the initialization signal.
Specifically, when there are multiple transport modules 120, the multiple transport modules 120 may be deployed to capture wafers on different loading platforms 110 at the same time, for example, the first transport module ARM1 captures a wafer on the first loading platform LPA, the first control unit 141 identifies the code stream of the first transport module ARM1 as wf_sourcearm 1=a1 according to the identification information on the first loading platform LPA, the second transport module ARM2 captures a wafer on the second loading platform LPB, and the first control unit 141 identifies the code stream of the second transport module ARM2 as wf_sourcearm 2=b1 according to the identification information on the second loading platform LPB. Similarly, different first identifications are made according to the specific transport module 120 and corresponding loading station 110.
After the first transport module ARM1 transfers the wafer to the wafer positioning module 130, the first control unit 141 marks the code stream of the first transport module ARM1 as wf_sourcenos1=a0, and the other transport modules 120 are still unchanged from the first mark. At this time, after the second control unit 142 determines the execution parameters, the wafer positioning module 130 performs positioning on the wafer, the second control unit 142 sends initialization information to the first control unit 141, and the first control unit 141 performs initialization recovery on the transport module 120 with the wafer placed according to the initialization information. For example, the first control unit 141 identifies the code stream of the first transport module ARM1 as wf_sourcenos1=a0, indicating that the wafer on the first loading station LPA grabbed by the first transport module ARM1 has been placed. When the first control module 140 receives the initialization signal, the code stream of the first transport module ARM1 that completes the placement is identified as wf_sourcearm 1=00, i.e. the initial identification. The first transport module ARM1 can then proceed with the next cycle workflow, for example wait for a task or continue to take material. The remaining transport modules 120 may be placed on wafers in sequence or selectively, depending on the application.
Fig. 6 is a flow chart of another multi-size wafer transfer method according to an embodiment of the present invention, and in combination with fig. 4, the multi-size wafer transfer method is performed by a multi-size wafer transfer apparatus, and the multi-size wafer transfer apparatus includes at least two loading tables 110, a transport module 120, a wafer positioning module 130, and a control module 140; the apparatus may be implemented in hardware and/or software. The method specifically comprises the following steps:
s210, defining identification information on each loading platform, and enabling the transport module to grab the wafer on the target loading platform according to the grabbing instruction and place the wafer on the wafer positioning module;
specifically, each loading table 110 is defined with identification information, which is information for identifying the identity of the loading table 110 by one or more of parameter information, position information, and number information of the initial size of the semiconductor equipment table. For example, if the stage 110 of the semiconductor device machine adopts the parameter information of the initial size as the identification information of the stage 110, if the original size wafer combination of the stage is 12 inches and 8 inches, the corresponding one of the stages 110 is set to 12 inches of identification information and the other stage 110 is set to 8 inches of identification information. The identification information serves as identification information of the loading stations 110, so that each loading station 110 can be distinguished using the identification information. The transport module 120 takes the material on the loading station 110 according to a grabbing instruction, which may be generated and sent by the semiconductor equipment station controller, to transfer the wafer transport to the wafer positioning module 130.
S220, the control module acquires identification information of a loading table corresponding to the wafer grabbed by the transport module;
specifically, after the transport module 120 grabs the wafer on the loading table 110 according to the grabbing instruction, the control module 140 obtains the identification information of the corresponding loading table 110, where the process of obtaining the identification information of the corresponding loading table 110 when the transport module 120 grabs the wafer by the control module 140 may obtain the corresponding loading table 110 when the transport module 120 grabs the wafer through direct obtaining, for example, through visual monitoring. The identification information of the corresponding loading platform 110 may also be converted into communication data by means of indirect acquisition, for example, by a grabbing process of the transport module 120, and sent to the control module 140.
S230, the control module determines an execution parameter according to the identification information, wherein the identification information and the execution parameter have a mapping relation;
specifically, the control module 140 may bind the transport module 120 with the identification information of the corresponding loading table 110 when capturing the wafer, where the identification information has a mapping relationship with the execution parameters, that is, each loading table corresponds to one execution parameter, for example, the identification information of the first loading table LPA is 12 inches, but according to the requirement of the customized application, the first loading table LPA places a 6 inch wafer that needs to be positioned at 45 degrees of the gap, so that the identification information of the first loading table LPA corresponds to the execution parameter that needs to be positioned at 45 degrees of the gap one by one. After the transportation module 120 finishes placing, the control module 140 determines corresponding execution parameters according to the identification information, so that the execution parameters can be loaded to the wafer positioning module 130 and the subsequent execution units. Therefore, the wafer positioning and distinguishing of the non-original size are realized, equipment is not required to be replaced, and the customization requirement is met.
S240, the wafer positioning module positions the wafer according to the execution parameters.
Fig. 7 shows a schematic diagram of the structure of an electronic device 10 that may be used to implement an embodiment of the invention. Electronic devices are intended to represent various forms of digital computers, such as laptops, desktops, workstations, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. Electronic equipment may also represent various forms of mobile devices, such as personal digital processing, cellular telephones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions, are meant to be exemplary only, and are not meant to limit implementations of the inventions described and/or claimed herein.
As shown in fig. 7, the electronic device 10 includes at least one processor 11, and a memory, such as a Read Only Memory (ROM) 12, a Random Access Memory (RAM) 13, etc., communicatively connected to the at least one processor 11, in which the memory stores a computer program executable by the at least one processor, and the processor 11 may perform various appropriate actions and processes according to the computer program stored in the Read Only Memory (ROM) 12 or the computer program loaded from the storage unit 18 into the Random Access Memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 may also be stored. The processor 11, the ROM 12 and the RAM 13 are connected to each other via a bus 14. An input/output (I/O) interface 15 is also connected to bus 14.
Various components in the electronic device 10 are connected to the I/O interface 15, including: an input unit 16 such as a keyboard, a mouse, etc.; an output unit 17 such as various types of displays, speakers, and the like; a storage unit 18 such as a magnetic disk, an optical disk, or the like; and a communication unit 19 such as a network card, modem, wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information/data with other devices via a computer network, such as the internet, and/or various telecommunication networks.
The processor 11 may be a variety of general and/or special purpose processing components having processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), various specialized Artificial Intelligence (AI) computing chips, various processors running machine learning model algorithms, digital Signal Processors (DSPs), and any suitable processor, controller, microcontroller, etc. The processor 11 performs the various methods and processes described above, such as a multi-sized wafer transfer method.
In some embodiments, the multi-sized wafer transfer method may be implemented as a computer program tangibly embodied on a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and/or installed onto the electronic device 10 via the ROM 12 and/or the communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the multi-sized wafer transfer method described above may be performed. Alternatively, in other embodiments, the processor 11 may be configured to perform the multi-sized wafer transfer method in any other suitable manner (e.g., by means of firmware).
A computer program for carrying out methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer programs, when executed by the processor, cause the functions/acts specified in the flowchart and/or block diagram block or blocks to be implemented. The computer program may execute entirely on the machine, partly on the machine, as a stand-alone software package, partly on the machine and partly on a remote machine or entirely on the remote machine or server.
In the context of the present invention, a computer-readable storage medium may be a tangible medium that can contain, or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, the computer readable storage medium may be a machine readable signal medium. More specific examples of a machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to a user; and a keyboard and a pointing device (e.g., a mouse or a trackball) through which a user can provide input to the electronic device. Other kinds of devices may also be used to provide for interaction with a user; for example, feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form, including acoustic input, speech input, or tactile input.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. The multi-size wafer transmission device is characterized by comprising at least two loading tables, at least two conveying modules, a wafer positioning module and a control module;
each loading table is defined with identification information, and the control module is respectively connected with the transport module and the wafer positioning module;
the transport module is used for grabbing the wafer on the loading table according to the grabbing instruction and placing the wafer on the wafer positioning module;
the control module is used for setting the identification of the transport module as a first identification according to the identification information corresponding to the loading table after the transport module grabs the wafer on the loading table; the first identifier is used for representing the identification information and the grabbing state of the transport module;
the control module is used for changing the first identifier of the transport module into a second identifier after the transport module places the wafer on the wafer positioning module; the second identifier is used for representing the identification information and the placement state of the transport module;
the control module is further used for determining an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation;
And the wafer positioning module is used for positioning the wafer according to the execution parameters.
2. The multi-sized wafer transfer device of claim 1, wherein the control module comprises a first control unit and a second control unit;
the first control unit is connected with the transportation module; the second control unit is connected with the wafer positioning module; the first control unit is connected with the second control unit;
the first control unit is used for acquiring the identification information of the loading table corresponding to the process of grabbing the wafer after the transport module grabs the wafer on the loading table according to the grabbing instruction, and setting the identification of the transport module as the first identification according to the identification information;
the first control unit is further configured to change the first identifier of the transport module to the second identifier after the transport module transmits the wafer to the wafer positioning module;
the second control unit is used for determining an execution parameter according to the second identifier.
3. The multi-sized wafer transfer device of claim 2, wherein the second control unit is further configured to send an initialization signal to the first control unit after determining the execution parameters;
The first control unit is further configured to set the identifier of the transport module to an initial identifier according to the initialization signal.
4. The multi-size wafer transmission device is characterized by comprising at least two loading tables, a transportation module, a wafer positioning module and a control module;
each loading table is defined with identification information, and the control module is respectively connected with the transport module and the wafer positioning module;
the transport module is used for grabbing the wafer on the loading table according to the grabbing instruction and placing the wafer on the wafer positioning module;
the control module is used for acquiring the identification information of the loading table corresponding to the wafer which is grabbed by the transport module;
the control module is also used for determining an execution parameter according to the identification information, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
5. The multi-size wafer transmission method is executed by a multi-size wafer transmission device and is characterized by comprising at least two loading tables, at least two conveying modules, a wafer positioning module and a control module;
The method comprises the following steps:
each loading table is defined with identification information, and the transport module grabs the wafer on the loading table according to the grabbing instruction and places the wafer on the wafer positioning module;
after the transport module grabs the wafer on the loading table, the control module sets the identification of the transport module as a first identification according to the identification information corresponding to the loading table; the first identifier is used for representing the identification information and the grabbing state of the transport module;
the control module changes the first identification of the transport module into a second identification after the transport module places the wafer on the wafer positioning module; the second identifier is used for representing the identification information and the placement state of the transport module;
the control module determines an execution parameter according to the second identifier, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
6. The multi-sized wafer transfer method of claim 5, wherein the control module comprises a first control unit and a second control unit;
The method comprises the following steps:
the first control unit acquires the identification information of the loading table corresponding to the wafer grabbing process after the transport module grabs the wafer on the loading table according to the grabbing instruction, and sets the identification of the transport module as the first identification according to the identification information;
the first control unit changes the first identifier of the transport module into the second identifier after the transport module transmits the wafer to the wafer positioning module;
the second control unit determines an execution parameter according to the second identifier.
7. The multi-sized wafer transfer method of claim 6, wherein the second control unit sends an initialization signal to the first control unit after the second control unit determines an execution parameter according to the second identification;
the first control unit identifies the transport module as an initial identification according to the initialization signal.
8. The method according to claim 6, wherein if at least two transport modules grasp the wafer on the loading table according to the grasping instruction, the identifier of the transport module is set to be a first identifier according to the identification information of the loading table corresponding to the time of grasping the wafer;
After one of the transport modules transmits and places the wafer to the wafer positioning module, the first control unit changes the identification of the corresponding transport module from the first identification to the second identification; the rest of the transport modules are still the first identifications;
the second control unit determines the transport module to determine an execution parameter according to the second identifier and sends an initialization signal to the first control unit; the first control unit marks the corresponding transport module as an initial mark according to the initialization signal.
9. The multi-size wafer transmission method is executed by a multi-size wafer transmission device and is characterized by comprising at least two loading tables, a transportation module, a wafer positioning module and a control module;
the method comprises the following steps:
each loading table is defined with identification information, and the transport module grabs the wafer on the loading table according to the grabbing instruction and places the wafer on the wafer positioning module;
the control module acquires the identification information of the loading table corresponding to the wafer which is grabbed by the transport module;
The control module determines an execution parameter according to the identification information, wherein the identification information and the execution parameter have a mapping relation;
and the wafer positioning module is used for positioning the wafer according to the execution parameters.
10. An electronic device, the electronic device comprising:
at least one processor; the method comprises the steps of,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores a computer program executable by the at least one processor to enable the at least one processor to perform the multi-sized wafer transfer method of any one of claims 5-9.
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