CN117484993A - Expanded polytetrafluoroethylene conductive sealing plate and manufacturing method thereof - Google Patents
Expanded polytetrafluoroethylene conductive sealing plate and manufacturing method thereof Download PDFInfo
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- CN117484993A CN117484993A CN202311214578.2A CN202311214578A CN117484993A CN 117484993 A CN117484993 A CN 117484993A CN 202311214578 A CN202311214578 A CN 202311214578A CN 117484993 A CN117484993 A CN 117484993A
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- expanded polytetrafluoroethylene
- conductive
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- fibers
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- 229920000295 expanded polytetrafluoroethylene Polymers 0.000 title claims abstract description 361
- 238000007789 sealing Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 176
- 239000010410 layer Substances 0.000 claims abstract description 116
- 239000002344 surface layer Substances 0.000 claims abstract description 45
- 230000000149 penetrating effect Effects 0.000 claims abstract description 31
- 239000012528 membrane Substances 0.000 claims description 30
- 238000005507 spraying Methods 0.000 claims description 26
- 238000005245 sintering Methods 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 10
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 6
- 239000004917 carbon fiber Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 16
- 239000004810 polytetrafluoroethylene Substances 0.000 description 16
- -1 polytetrafluoroethylene Polymers 0.000 description 15
- 239000007921 spray Substances 0.000 description 12
- 244000025254 Cannabis sativa Species 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/718—Weight, e.g. weight per square meter
Abstract
The invention provides a expanded polytetrafluoroethylene conductive sealing plate and a manufacturing method thereof, wherein the expanded polytetrafluoroethylene conductive sealing plate comprises at least one expanded polytetrafluoroethylene conductive film layer, and the expanded polytetrafluoroethylene conductive film layer comprises an expanded polytetrafluoroethylene base film and a plurality of conductive fibers arranged on the expanded polytetrafluoroethylene base film at intervals; each conductive fiber penetrates through the expanded polytetrafluoroethylene base film, and each conductive fiber comprises a penetrating part and extending parts connected with two opposite ends of the penetrating part; the extending parts of each end are obliquely bent compared with the penetrating parts, and the extending parts of the conductive fibers are mutually overlapped to form conductive surface layers on two opposite sides of the expanded polytetrafluoroethylene base film respectively. The expanded polytetrafluoroethylene conductive sealing plate provided by the invention not only has the advantages of high and low temperature resistance, good sealing performance and the like, but also has good conductivity, and is stable in structure and capable of realizing the overall conductive effect.
Description
Technical Field
The invention relates to the technical field of polytetrafluoroethylene materials, in particular to a swelling polytetrafluoroethylene conductive sealing plate and a manufacturing method thereof.
Background
Expanded Polytetrafluoroethylene (PTFE) is produced from polytetrafluoroethylene resin by a special processing method such as stretching, and has a network structure formed by connecting fine fibers, and numerous fine pores are formed between these fine fibers. Expanded polytetrafluoroethylene has good chemical resistance, abrasion resistance and extremely strong high/low temperature resistance, and can be used in some fields requiring high temperature sealing and having a demand for weight due to its large number of fine pores. The polytetrafluoroethylene resin has excellent electrical insulation properties, and can be used as a coating material for electric wires and the like. In some special application fields, it is required to realize the conductive function while sealing, so as to realize the transmission of the electric signal. Therefore, the development of the conductive expanded polytetrafluoroethylene sealing material is necessary, and the high and low temperature resistance, good sealing performance and conductivity can be realized.
In the stretching and forming process of the expanded polytetrafluoroethylene, other conductive substances (such as conductive particles and the like) are difficult to mix, so that the conductive expanded polytetrafluoroethylene is obtained: in addition to polytetrafluoroethylene particles, the addition of other substances can cause the expanded polytetrafluoroethylene to be difficult to form fibers during the stretching process and not be capable of forming a film state. Therefore, the conductive expanded polytetrafluoroethylene film is difficult to prepare by adjusting the formula and adding the conductive substance, and further the conductive expanded polytetrafluoroethylene sealing element cannot be prepared.
The current expanded polytetrafluoroethylene conductive material is generally prepared by coating a conductive material on the surface of expanded polytetrafluoroethylene (refer to patent CN107446156a, etc.), drying, and forming a conductive layer on the surface of expanded polytetrafluoroethylene. However, since the conductive layer is only provided on the surface of the expanded polytetrafluoroethylene and the surface energy of the expanded polytetrafluoroethylene itself is small, it is difficult to compound with other materials (mainly because the polarity of fluorine atoms in the expanded polytetrafluoroethylene is strong, and when the fluorine atoms are combined with other elements, electrons are almost taken out to become a stable structure of the outermost layer 8 electrons; therefore, it is difficult to have other groups and generate van der Waals force), so that the conductive layer of such a structure is easily detached from the surface of the expanded polytetrafluoroethylene, and the structural stability is poor, thereby affecting the normal use thereof.
Disclosure of Invention
The invention aims to provide an expanded polytetrafluoroethylene conductive sealing plate which has the advantages of high and low temperature resistance, good sealing performance and the like, has good conductivity, is stable in structure and can realize the overall conductive effect (not only surface conduction).
The invention provides a puffed polytetrafluoroethylene conductive sealing plate, which comprises at least one puffed polytetrafluoroethylene conductive film layer, wherein the puffed polytetrafluoroethylene conductive film layer comprises a puffed polytetrafluoroethylene base film and a plurality of conductive fibers arranged on the puffed polytetrafluoroethylene base film at intervals; each conductive fiber penetrates through the expanded polytetrafluoroethylene base film along the thickness direction of the expanded polytetrafluoroethylene base film, each conductive fiber comprises a penetrating part and protruding parts connected with two opposite ends of the penetrating part, the penetrating parts are positioned in the expanded polytetrafluoroethylene base film, and the protruding parts at the two opposite ends are respectively positioned at two opposite sides of the expanded polytetrafluoroethylene base film; the extending parts of each end are obliquely bent compared with the penetrating parts, and the extending parts of the conductive fibers are mutually overlapped to form conductive surface layers on two opposite sides of the expanded polytetrafluoroethylene base film respectively.
In one implementation, the extension is folded to abut the surface of the expanded polytetrafluoroethylene base membrane to cause the conductive surface layer to abut the surface of the expanded polytetrafluoroethylene base membrane.
In one implementation, the expanded polytetrafluoroethylene-based membrane has a thickness of 2 to 20 microns, the conductive fibers have a diameter of 1 to 20 microns, and the conductive fibers have a length of 1 to 10mm.
In one implementation, the conductive fibers are chopped carbon fibers or metal fibers.
In one implementation, the expanded polytetrafluoroethylene conductive sealing plate includes a plurality of expanded polytetrafluoroethylene conductive film layers, and the plurality of expanded polytetrafluoroethylene conductive film layers are stacked along the thickness direction; the expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are connected with each other, and the conductive surface layers of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted.
In one implementation, gaps are formed among the extending parts of the plurality of conductive fibers in each expanded polytetrafluoroethylene conductive film layer, so that gaps are formed at positions of the conductive surface layer corresponding to the gaps; the expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted and adhered and fixed through the gaps.
In one possible implementation, the expanded polytetrafluoroethylene base membranes of each adjacent two of the expanded polytetrafluoroethylene conductive membrane layers are bonded together after being sintered and melted.
The invention also provides a manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate, which is used for manufacturing the expanded polytetrafluoroethylene conductive sealing plate, wherein the expanded polytetrafluoroethylene conductive sealing plate comprises at least one expanded polytetrafluoroethylene conductive film layer; the manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate comprises the following steps:
s10: providing an expanded polytetrafluoroethylene base film, and arranging a spraying device provided with a plurality of conductive fibers on one side of the expanded polytetrafluoroethylene base film; spraying a plurality of conductive fibers to the expanded polytetrafluoroethylene base film by using the spraying device, so that the conductive fibers penetrate through the expanded polytetrafluoroethylene base film, and the opposite ends of the conductive fibers extend out to the opposite sides of the expanded polytetrafluoroethylene base film respectively;
s20: rolling the expanded polytetrafluoroethylene base film to enable parts of the plurality of conductive fibers extending to the two opposite sides of the expanded polytetrafluoroethylene base film to be pressed down and mutually lapped together so as to respectively form conductive surface layers on the two opposite sides of the expanded polytetrafluoroethylene base film, thereby obtaining an expanded polytetrafluoroethylene conductive film layer; the conductive fibers are located in the expanded polytetrafluoroethylene base film and penetrate through the expanded polytetrafluoroethylene base film, and the portions, which extend to two opposite sides of the expanded polytetrafluoroethylene base film and are pressed down, of the conductive fibers are extending portions.
In one implementation, the expanded polytetrafluoroethylene conductive seal plate comprises a plurality of the expanded polytetrafluoroethylene conductive film layers; the manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate further comprises the following steps:
s30: stacking a plurality of expanded polytetrafluoroethylene conductive film layers together along the thickness direction of the expanded polytetrafluoroethylene conductive film layers, wherein the conductive surface layers of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted; meanwhile, gaps are formed among the extending parts of a plurality of conductive fibers in each expanded polytetrafluoroethylene conductive film layer, gaps are formed at positions of the conductive surface layers corresponding to the gaps, and expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted through the gaps;
s40: sintering the expanded polytetrafluoroethylene conductive film layers at a certain temperature to enable the expanded polytetrafluoroethylene base films of the adjacent expanded polytetrafluoroethylene conductive film layers to be bonded together after being melted.
In one implementation manner, in the step S10, when the conductive fibers are ejected from the ejection device, the length direction of the conductive fibers is parallel to the thickness direction of the expanded polytetrafluoroethylene base film, and the velocity of the conductive fibers when the conductive fibers are ejected from the ejection device is 5-80 m/S.
According to the expanded polytetrafluoroethylene conductive sealing plate, the plurality of conductive fibers are arranged, each conductive fiber penetrates through the expanded polytetrafluoroethylene base film, the part, located in the expanded polytetrafluoroethylene base film, of each conductive fiber is a penetrating part, the parts, extending to the two opposite sides of the expanded polytetrafluoroethylene base film, of each conductive fiber are extending parts, and the extending parts of the plurality of conductive fibers are mutually lapped together after being obliquely bent, so that conductive surface layers are respectively formed on the two opposite sides of the expanded polytetrafluoroethylene base film; the conductive surface layers on the two opposite sides are connected together through the penetrating parts of the conductive fibers, so that the overall conductive effect of the expanded polytetrafluoroethylene conductive film layer is realized, and the expanded polytetrafluoroethylene conductive film layer has good conductive performance. Meanwhile, the expanded polytetrafluoroethylene conductive film layer has a stable structure, and the conductive surface layer is not easy to separate from the expanded polytetrafluoroethylene base film. The expanded polytetrafluoroethylene conductive sealing plate not only has the advantages of light weight, high and low temperature resistance, good sealing performance and the like of expanded polytetrafluoroethylene, but also has good conductivity, and the structure is stable and reliable.
Drawings
FIG. 1 is a side view of an expanded polytetrafluoroethylene electrically conductive seal plate in accordance with an embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of fig. 1.
Fig. 3 is a schematic plan view of fig. 1.
Fig. 4 is a side view of the single expanded polytetrafluoroethylene conductive membrane of fig. 1.
Fig. 5 is a schematic cross-sectional view of fig. 4.
Fig. 6 is a schematic cross-sectional view of the individual conductive fibers of fig. 5 disposed on an expanded polytetrafluoroethylene-based membrane.
Fig. 7 to 12b are schematic views of a process for manufacturing an expanded polytetrafluoroethylene conductive sealing plate according to an embodiment of the invention.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
The terms upper, lower, left, right, front, rear, top, bottom and the like (if any) in the description and in the claims are used for descriptive purposes and not necessarily for describing relative positions of structures in the figures and in describing relative positions of structures. It should be understood that the use of directional terms should not be construed to limit the scope of the invention as claimed.
As shown in fig. 1 to 6, the expanded polytetrafluoroethylene conductive sealing plate provided by the embodiment of the invention comprises at least one expanded polytetrafluoroethylene conductive film layer 1. The expanded polytetrafluoroethylene conductive film layer 1 comprises an expanded polytetrafluoroethylene base film 11 (namely, an expanded polytetrafluoroethylene film, wherein the expanded polytetrafluoroethylene base film 11 can be prepared by stretching polytetrafluoroethylene resin and other special processing methods) and a plurality of conductive fibers 12 which are arranged on the expanded polytetrafluoroethylene base film 11 at intervals. Along the thickness direction T of the expanded polytetrafluoroethylene film 11, each of the conductive fibers 12 penetrates the expanded polytetrafluoroethylene film 11, and each of the conductive fibers 12 includes a penetrating portion 121 and protruding portions 122 connected to opposite ends of the penetrating portion 121 (the penetrating portion 121 and the protruding portions 122 at the opposite ends are integrally formed), the penetrating portion 121 being located in the expanded polytetrafluoroethylene film 11, and the protruding portions 122 at the opposite ends being located at opposite sides of the expanded polytetrafluoroethylene film 11, respectively. In each of the conductive fibers 12, the protruding portions 122 of each end are bent obliquely with respect to the penetrating portions 121, and the protruding portions 122 of the plurality of conductive fibers 12 are mutually overlapped to form the conductive surface layers 10 on the opposite sides of the expanded polytetrafluoroethylene base film 11, respectively.
Specifically, the opposite ends of each conductive fiber 12 are a first end and a second end, respectively, and the protruding parts 122 of the first ends of the plurality of conductive fibers 12 are mutually overlapped after being obliquely bent, so that a conductive surface layer 10 is formed on one side of the expanded polytetrafluoroethylene base film 11; the extensions 122 of the second ends of the plurality of conductive fibers 12 are brought together after being bent at an incline to form the conductive surface layer 10 on the other side of the expanded polytetrafluoroethylene base film 11.
In each expanded polytetrafluoroethylene conductive film layer 1, a plurality of conductive fibers 12 are densely arranged on an expanded polytetrafluoroethylene base film 11, and a conductive surface layer 10 is formed by mutually abutting protruding portions 122 of adjacent conductive fibers 12. Wherein the adjacent conductive fibers 12 comprise: the adjacent conductive fibers 12 and the non-adjacent but adjacent conductive fibers 12 are provided that they can be brought together (i.e., the conductive surface layer 10 is formed by the protrusions 122 of the adjacent conductive fibers 12 and/or the protrusions 122 of the non-adjacent but adjacent conductive fibers 12 being brought together). Since the extension 122 has a certain length and the conductive fibers 12 are densely arranged on the expanded polytetrafluoroethylene base film 11, the extension 122 can overlap with the adjacent extension 122 after being obliquely bent, thereby forming the conductive surface layer 10 of the conductive network structure on the surface of the expanded polytetrafluoroethylene base film 11.
According to the expanded polytetrafluoroethylene conductive sealing plate provided by the embodiment, through arranging the plurality of conductive fibers 12, each conductive fiber 12 penetrates through the expanded polytetrafluoroethylene base film 11, the part of each conductive fiber 12 positioned in the expanded polytetrafluoroethylene base film 11 is a penetrating part 121, the parts of each conductive fiber 12 extending to two opposite sides of the expanded polytetrafluoroethylene base film 11 are extending parts 122, and the extending parts 122 of the plurality of conductive fibers 12 are mutually lapped together after being obliquely bent so as to respectively form conductive surface layers 10 on two opposite sides of the expanded polytetrafluoroethylene base film 11; the conductive surface layers 10 on the two opposite sides are connected together through the penetrating parts 121 of the conductive fibers 12, so that the overall conductive effect of the expanded polytetrafluoroethylene conductive film layer 1 (not only surface conduction, both sides of the expanded polytetrafluoroethylene conductive film layer 1 and both sides of the expanded polytetrafluoroethylene conductive film layer 1 are conductive) is realized, and the expanded polytetrafluoroethylene conductive film layer 1 has good conductive performance. Meanwhile, the expanded polytetrafluoroethylene conductive film layer 1 has a stable structure, and the conductive surface layer 10 is not easy to separate from the expanded polytetrafluoroethylene base film 11 (since the conductive fibers 12 penetrate through the expanded polytetrafluoroethylene base film 11, the conductive surface layer 10 is firmly connected with the expanded polytetrafluoroethylene base film 11 through the penetrating parts 121 of the conductive fibers 12, so that the separation is not easy to occur). The expanded polytetrafluoroethylene conductive sealing plate not only has the advantages of light weight, high and low temperature resistance, good sealing performance and the like of expanded polytetrafluoroethylene, but also has good conductivity, and the structure is stable and reliable. Meanwhile, the expanded polytetrafluoroethylene conductive sealing plate also has good air permeability (a plurality of micropores are formed in the expanded polytetrafluoroethylene base film 11, and the micropores are not blocked in a mode of arranging the conductive fibers 12 on the expanded polytetrafluoroethylene base film 11, so that the original air permeability of the expanded polytetrafluoroethylene base film 11 is maintained).
As an embodiment, in each of the expanded polytetrafluoroethylene conductive film layers 1, the distribution density of the conductive fibers 12 on the expanded polytetrafluoroethylene base film 11 (i.e., the number of the conductive fibers 12 on the expanded polytetrafluoroethylene base film 11 per unit area) may be determined according to the conductivity requirement of the expanded polytetrafluoroethylene conductive film layer 1 (it is easy to understand that, in the case where the characteristics of the material, thickness, length, etc. of the conductive fibers 12 are constant, the greater the distribution density of the conductive fibers 12, the better the conductivity and the higher the conductivity of the expanded polytetrafluoroethylene conductive film layer 1, and the smaller the distribution density of the conductive fibers 12, the weaker the conductivity and the lower the conductivity of the expanded polytetrafluoroethylene conductive film layer 1).
Preferably, in each expanded polytetrafluoroethylene conductive film layer 1, a plurality of conductive fibers 12 are arranged substantially uniformly and orderly on the expanded polytetrafluoroethylene base film 11 so as to maintain uniform conductivity at each portion of the expanded polytetrafluoroethylene conductive film layer 1. Of course, in other embodiments, the plurality of conductive fibers 12 may be unevenly distributed on the expanded polytetrafluoroethylene base film 11 according to specific requirements, so that the electrical conductivity of each portion of the expanded polytetrafluoroethylene conductive film layer 1 is not uniform.
Preferably, the penetrating portions 121 of the conductive fibers 12 have a substantially straight structure, and the penetrating portions 121 are disposed substantially vertically in the expanded polytetrafluoroethylene base film 11 (i.e., the longitudinal direction of the penetrating portions 121 is substantially parallel to the thickness direction T of the expanded polytetrafluoroethylene base film 11), so that the penetrating portions 121 can penetrate the expanded polytetrafluoroethylene base film 11 more smoothly. Of course, in other embodiments, the penetrating portion 121 may be disposed in the expanded polytetrafluoroethylene film 11 in an oblique direction (i.e. the length direction of the penetrating portion 121 forms an angle with the thickness direction T of the expanded polytetrafluoroethylene film 11, and the angle is greater than 0 ° and less than 90 °).
In one embodiment, the inclined bending direction of the extending portions 122 of the plurality of conductive fibers 12 in each expanded polytetrafluoroethylene conductive film layer 1 may be any direction (i.e. the extending portions 122 may be inclined in any direction when inclined and bent, and the inclined direction of the extending portions 122 of each conductive fiber 12 is not necessarily uniform, because during the actual manufacturing process, both ends of the conductive fibers 12 may be bent to some extent after passing through the expanded polytetrafluoroethylene base film 11, and the bending direction is not necessarily the same, so that the inclined direction of the extending portions 122 is not necessarily the same during the subsequent rolling process).
As shown in fig. 4 to 6, as an embodiment, the protruding portion 122 is bent to abut against the surface of the expanded polytetrafluoroethylene base membrane 11 so that the conductive surface layer 10 abuts against the surface of the expanded polytetrafluoroethylene base membrane 11 (i.e., the conductive surface layer 10 abuts against the surface of the expanded polytetrafluoroethylene base membrane 11).
As one embodiment, the expanded polytetrafluoroethylene base film 11 has a thickness of 2 to 20 micrometers, the conductive fibers 12 have a diameter of 1 to 20 micrometers, and the conductive fibers 12 have a length of 1 to 10mm, so that the conductive fibers 12 can penetrate the expanded polytetrafluoroethylene base film 11 more smoothly and the expanded polytetrafluoroethylene conductive film layer 1 has good conductivity.
Preferably, the expanded polytetrafluoroethylene-based film 11 has a thickness of 3 to 10 micrometers, the conductive fibers 12 have a diameter of 5 to 10 micrometers, and the conductive fibers 12 have a length of 2 to 5mm.
As one embodiment, the conductive fibers 12 are chopped carbon fibers or metal fibers. The metal fiber can be copper fiber, iron fiber, silver fiber, aluminum fiber, gold fiber, etc.
As shown in fig. 1 and 2, as an embodiment, the expanded polytetrafluoroethylene conductive sealing plate includes a plurality of expanded polytetrafluoroethylene conductive film layers 1 (four-layer structure is illustrated in the drawing), and the plurality of expanded polytetrafluoroethylene conductive film layers 1 are stacked in the thickness direction T. The expanded polytetrafluoroethylene base films 11 of each adjacent two expanded polytetrafluoroethylene conductive film layers 1 are connected with each other (i.e., the lower surface of the expanded polytetrafluoroethylene base film 11 of the expanded polytetrafluoroethylene conductive film layer 1 positioned above is connected with the upper surface of the expanded polytetrafluoroethylene base film 11 of the expanded polytetrafluoroethylene conductive film layer 1 positioned below), the conductive surface layers 10 of each adjacent two expanded polytetrafluoroethylene conductive film layers 1 are in contact (i.e., the conductive surface layer 10 of the lower side of the expanded polytetrafluoroethylene conductive film layer 1 positioned above is in contact with the conductive surface layer 10 of the upper side of the expanded polytetrafluoroethylene conductive film layer 1 positioned below), thereby fixing the plurality of expanded polytetrafluoroethylene conductive film layers 1 together and realizing the overall conductivity of the expanded polytetrafluoroethylene conductive sealing plate. Of course, in other embodiments, the expanded polytetrafluoroethylene conductive seal plate may be a single layer of expanded polytetrafluoroethylene conductive membrane 1.
As shown in fig. 1 to 3, in each of the expanded polytetrafluoroethylene conductive film layers 1, gaps are provided between the protruding portions 122 of the plurality of conductive fibers 12, so that a plurality of gaps 100 are formed at positions of the conductive surface layer 10 corresponding to the respective gaps (as shown in fig. 3, since the conductive fibers 12 are thin and the conductive fibers 12 have a certain distribution density, the protruding portions 122 of the plurality of conductive fibers 12 form gaps after overlapping, and then the gaps 100 are formed on the conductive surface layer 10 (i.e., the conductive surface layer 10 is a mesh structure), that is, the conductive surface layer 10 does not completely cover the surface of the expanded polytetrafluoroethylene base film 11, and the surface of the expanded polytetrafluoroethylene base film 11 can be exposed through the gaps 100). The expanded polytetrafluoroethylene base films 11 of every two adjacent expanded polytetrafluoroethylene conductive film layers 1 are contacted and adhered and fixed through the gaps 100.
As one embodiment, the expanded polytetrafluoroethylene base films 11 of each adjacent two of the expanded polytetrafluoroethylene conductive film layers 1 are bonded together after being sintered and melted (the sintering temperature of the expanded polytetrafluoroethylene conductive film layers 1 is higher than the melting temperature of the expanded polytetrafluoroethylene base films 11 when the expanded polytetrafluoroethylene conductive film layers 1 are sintered, so that the expanded polytetrafluoroethylene base films 11 are melted, and the expanded polytetrafluoroethylene base films 11 of the adjacent two expanded polytetrafluoroethylene conductive film layers 1 after being melted are bonded together through the gaps 100 on the conductive surface layer 10 and can be compounded after being cooled).
As one embodiment, the conductive fibers 12 are inserted on the expanded polytetrafluoroethylene base film 11 by spraying to form a structure similar to a brush of the conductive fibers; and then rolling the expanded polytetrafluoroethylene base film 11 inserted with the conductive fibers 12 by using a rolling device, and flattening the parts of the conductive fibers 12 extending to the two opposite sides of the expanded polytetrafluoroethylene base film 11 to form the expanded polytetrafluoroethylene conductive film layer 1. And then stacking a plurality of expanded polytetrafluoroethylene conductive film layers 1 together, and sintering the stacked film layers into a plate to obtain the integrally conductive expanded polytetrafluoroethylene conductive sealing plate.
As shown in fig. 7 to 12b, the embodiment of the invention further provides a method for manufacturing the expanded polytetrafluoroethylene conductive sealing plate, which is used for manufacturing the expanded polytetrafluoroethylene conductive sealing plate. The expanded polytetrafluoroethylene conductive sealing plate comprises at least one expanded polytetrafluoroethylene conductive film layer 1; the manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate comprises the following steps:
s10: as shown in fig. 7 to 8c, an expanded polytetrafluoroethylene base film 11 is provided, and a spraying device 2 provided with a plurality of conductive fibers 12 is placed on one side of the expanded polytetrafluoroethylene base film 11; the spraying device 2 is used for densely spraying a plurality of conductive fibers 12 onto the expanded polytetrafluoroethylene base membrane 11, so that the conductive fibers 12 penetrate the expanded polytetrafluoroethylene base membrane 11, and opposite ends of the conductive fibers 12 extend to opposite sides of the expanded polytetrafluoroethylene base membrane 11 respectively, that is, a structure similar to fiber grass is formed on the opposite sides of the expanded polytetrafluoroethylene base membrane 11 (specifically, when the conductive fibers 12 are sprayed, the spraying device 2 can spray the conductive fibers 12 onto the expanded polytetrafluoroethylene base membrane 11 and move along the direction S1 at the same time so as to spray the conductive fibers 12 onto different positions on the expanded polytetrafluoroethylene base membrane 11). Wherein fig. 7 is a side view of the spraying device 2 before spraying the conductive fibers 12 onto the expanded polytetrafluoroethylene base membrane 11; fig. 8a is a side view of the expanded polytetrafluoroethylene-based film 11 after a plurality of conductive fibers 12 are sprayed thereon, fig. 8b is a schematic sectional view of fig. 8a, and fig. 8c is a schematic plan view of fig. 8 a.
S20: as shown in fig. 9 to 10c, the expanded polytetrafluoroethylene base film 11 is rolled by the rolling device 3 such that portions of the plurality of conductive fibers 12 extending to opposite sides of the expanded polytetrafluoroethylene base film 11 are pressed against each other (specifically, the rolling device 3 includes an upper roller and a lower roller, which may be made of a hardened rubber material, the expanded polytetrafluoroethylene base film 11 is moved in the S2 direction while the expanded polytetrafluoroethylene base film 11 is passed through the rolling device 3 such that the upper and lower ends of the conductive fibers 12 are pressed against each other to form conductive surface layers 10 on the opposite sides of the expanded polytetrafluoroethylene base film 11, respectively, thereby obtaining the expanded polytetrafluoroethylene conductive film layer 1. The portion of the conductive fiber 12 located in the expanded polytetrafluoroethylene base film 11 is a penetrating portion 121, and the portion of the conductive fiber 12 protruding to opposite sides of the expanded polytetrafluoroethylene base film 11 and being pressed down is a protruding portion 122. Wherein fig. 9 is a side view of the rolling device 3 when the expanded polytetrafluoroethylene base film 11 is rolled; fig. 10a is a side view of the expanded polytetrafluoroethylene conductive film layer 1 formed by rolling, fig. 10b is a schematic sectional view of fig. 10a, and fig. 10c is a schematic plan view of fig. 10 a.
As one embodiment, the expanded polytetrafluoroethylene conductive sealing plate comprises a plurality of expanded polytetrafluoroethylene conductive film layers 1. After the step S20, the method for manufacturing the expanded polytetrafluoroethylene conductive sealing plate further comprises the following steps:
s30: as shown in fig. 11, according to a desired thickness, a plurality of expanded polytetrafluoroethylene conductive film layers 1 are stacked together in a thickness direction T thereof under a certain pressure or a certain tension (i.e., when a plurality of expanded polytetrafluoroethylene conductive film layers 1 are stacked together, it is necessary to apply a pressure to the plurality of expanded polytetrafluoroethylene conductive film layers 1 so as to bring adjacent expanded polytetrafluoroethylene conductive film layers 1 into close contact with each other, the pressure may be applied by pressing the plurality of expanded polytetrafluoroethylene conductive film layers 1 with a certain pressure or winding the plurality of expanded polytetrafluoroethylene conductive film layers 1 on a roll with a certain tension), and the conductive surface layers 10 of each adjacent two of the expanded polytetrafluoroethylene conductive film layers 1 are brought into contact with each other; meanwhile, gaps are formed among the extending parts 122 of the plurality of conductive fibers 12 in each expanded polytetrafluoroethylene conductive film layer 1, gaps 100 are formed at positions of the conductive surface layer 10 corresponding to the gaps, and expanded polytetrafluoroethylene base films 11 of every two adjacent expanded polytetrafluoroethylene conductive film layers 1 are contacted through the gaps 100. Fig. 11 is a schematic structural view of a plurality of expanded polytetrafluoroethylene conductive film layers 1 when stacked.
S40: as shown in fig. 12a and 12b, the plurality of expanded polytetrafluoroethylene conductive film layers 1 are sintered at a certain temperature (the sintering temperature is higher than the melting temperature of the expanded polytetrafluoroethylene base film 11, for example, 347 to 390 ℃), and the expanded polytetrafluoroethylene base films 11 of adjacent expanded polytetrafluoroethylene conductive film layers 1 are bonded together after being melted; meanwhile, the conductive surface layer 10 positioned inside is buried in the expanded polytetrafluoroethylene base film 11, and the expanded polytetrafluoroethylene conductive sealing plate with the structure of the multilayer expanded polytetrafluoroethylene conductive film layer 1 is obtained. Fig. 12a is a side view of a plurality of expanded polytetrafluoroethylene conductive film layers 1 after sintering, and fig. 12b is a schematic cross-sectional view of fig. 12 a.
In one embodiment, in the step S10, the spraying device 2 is a spray gun. The spraying device 2 may be disposed below the expanded polytetrafluoroethylene base film 11, in which case the spraying device 2 sprays the conductive fibers 12 upward; the spraying device 2 may also be arranged above the expanded polytetrafluoroethylene base film 11, in which case the spraying device 2 sprays the conductive fibers 12 downwards.
In one embodiment, in the step S10, when the conductive fibers 12 are ejected from the ejection device 2, the length direction of the conductive fibers 12 is parallel to the thickness direction T of the expanded polytetrafluoroethylene base film 11; the velocity of the conductive fibers 12 when being sprayed from the spraying device 2 is 5-80 m/s, so that the conductive fibers 12 can penetrate the expanded polytetrafluoroethylene base membrane 11 more smoothly, and the conductive fibers 12 cannot completely penetrate the expanded polytetrafluoroethylene base membrane 11 and then are separated from the expanded polytetrafluoroethylene base membrane 11 (if the spraying velocity is too high, the conductive fibers 12 may completely penetrate the expanded polytetrafluoroethylene base membrane 11 and then are separated from the expanded polytetrafluoroethylene base membrane 11). Preferably, the conductive fibers 12 are ejected from the ejection device 2 at a rate of 20 to 50m/s.
In one embodiment, in the step S20, after the expanded polytetrafluoroethylene base film 11 is rolled, the portions of the conductive fibers 12 extending to opposite sides of the expanded polytetrafluoroethylene base film 11 are pressed to contact the surface of the expanded polytetrafluoroethylene base film 11, that is, the extending portions 122 of the conductive fibers 12 contact the surface of the expanded polytetrafluoroethylene base film 11, so that the conductive surface layer 10 contacts the surface of the expanded polytetrafluoroethylene base film 11.
According to the expanded polytetrafluoroethylene conductive sealing plate provided by the embodiment of the invention, through arranging the plurality of conductive fibers 12, each conductive fiber 12 penetrates through the expanded polytetrafluoroethylene base film 11, the part of each conductive fiber 12 positioned in the expanded polytetrafluoroethylene base film 11 is the penetrating part 121, the parts of each conductive fiber 12 extending to the two opposite sides of the expanded polytetrafluoroethylene base film 11 are the extending parts 122, and the extending parts 122 of the plurality of conductive fibers 12 are mutually overlapped after being obliquely bent so as to respectively form the conductive surface layers 10 on the two opposite sides of the expanded polytetrafluoroethylene base film 11; the conductive surface layers 10 on the two opposite sides are connected together through the penetrating parts 121 of the conductive fibers 12, so that the overall conductive effect of the expanded polytetrafluoroethylene conductive film layer 1 (not only surface conduction, both sides of the expanded polytetrafluoroethylene conductive film layer 1 and both sides of the expanded polytetrafluoroethylene conductive film layer 1 are conductive) is realized, and the expanded polytetrafluoroethylene conductive film layer 1 has good conductive performance. Meanwhile, the expanded polytetrafluoroethylene conductive film layer 1 has a stable structure, and the conductive surface layer 10 is not easy to separate from the expanded polytetrafluoroethylene base film 11 (since the conductive fibers 12 penetrate through the expanded polytetrafluoroethylene base film 11, the conductive surface layer 10 is firmly connected with the expanded polytetrafluoroethylene base film 11 through the penetrating parts 121 of the conductive fibers 12, so that the separation is not easy to occur). The expanded polytetrafluoroethylene conductive sealing plate not only has the advantages of light weight, high and low temperature resistance, good sealing performance and the like of expanded polytetrafluoroethylene, but also has good conductivity, and the structure is stable and reliable. Meanwhile, the expanded polytetrafluoroethylene conductive sealing plate also has good air permeability (a plurality of micropores are formed in the expanded polytetrafluoroethylene base film 11, and the micropores are not blocked in a mode of arranging the conductive fibers 12 on the expanded polytetrafluoroethylene base film 11, so that the original air permeability of the expanded polytetrafluoroethylene base film 11 is maintained).
Example 1
A spray gun with chopped conductive fibers was placed under the expanded polytetrafluoroethylene film, and copper fibers with a diameter of 6 μm and a length of 4mm were sprayed at a spray speed of 45m/s onto the expanded polytetrafluoroethylene film with a thickness of 4. Mu.m. When spraying, the length direction of the conductive fiber is parallel to the thickness direction of the expanded polytetrafluoroethylene film, the conductive fiber pierces the expanded polytetrafluoroethylene film, and a fiber grass-like shape is formed on two sides of the expanded polytetrafluoroethylene film. The swelling polytetrafluoroethylene film with the conductive fiber grass is passed through a hardened rubber pressure roller, the fiber grass is pressed down, and the fibers are overlapped on the upper/lower surface of the film to form a conductive interpenetrating network structure.
And then stacking the films layer by layer according to the required thickness, sintering the stacked films at 380 ℃ for 6 hours under certain pressure or tension, so that the expanded polytetrafluoroethylene between different layers is mutually bonded together, and finally forming the conductive expanded polytetrafluoroethylene sealing material with the interpenetrating conductive network structure. The conductive expanded polytetrafluoroethylene sealing material was tested to have a conductivity of 5.6X10 5 S/m。
Example two
A spray gun with chopped conductive fibers was placed under the expanded polytetrafluoroethylene film, and carbon fibers with a diameter of 6 μm and a length of 6mm were sprayed at a spray speed of 30m/s onto the expanded polytetrafluoroethylene film with a thickness of 7. Mu.m. When spraying, the length direction of the conductive fiber is parallel to the thickness direction of the expanded polytetrafluoroethylene film, the conductive fiber pierces the expanded polytetrafluoroethylene film, and a fiber grass-like shape is formed on two sides of the expanded polytetrafluoroethylene film. The swelling polytetrafluoroethylene film with the conductive fiber grass is passed through a hardened rubber pressure roller, the fiber grass is pressed down, and the fibers are overlapped on the upper/lower surface of the film to form a conductive interpenetrating network structure.
And then stacking the films layer by layer according to the required thickness, sintering the stacked films at 370 ℃ for 8 hours under certain pressure or tension, so that the expanded polytetrafluoroethylene between different layers is mutually bonded together, and finally forming the conductive expanded polytetrafluoroethylene sealing material with the interpenetrating conductive network structure. The conductive expanded polytetrafluoroethylene sealing material was tested to have a conductivity of 8.1X10 3 S/m。
Example III
A spray gun with chopped conductive fibers is arranged below the expanded polytetrafluoroethylene film, and carbon fibers with the diameter of 2 micrometers and the length of 5mm are sprayed on the expanded polytetrafluoroethylene film with the thickness of 10 micrometers at the spraying speed of 15 m/s. When spraying, the length direction of the conductive fiber is parallel to the thickness direction of the expanded polytetrafluoroethylene film, the conductive fiber pierces the expanded polytetrafluoroethylene film, and a fiber grass-like shape is formed on two sides of the expanded polytetrafluoroethylene film. The swelling polytetrafluoroethylene film with the conductive fiber grass is passed through a hardened rubber pressure roller, the fiber grass is pressed down, and the fibers are overlapped on the upper/lower surface of the film to form a conductive interpenetrating network structure.
And then stacking the films layer by layer according to the required thickness, sintering the stacked films at 385 ℃ for 3 hours under certain pressure or tension, so that the expanded polytetrafluoroethylene between different layers is mutually bonded together, and finally forming the conductive expanded polytetrafluoroethylene sealing material with the interpenetrating conductive network structure. The conductive expanded polytetrafluoroethylene sealing material was tested to have a conductivity of 4.3X10 6 S/m。
Example IV
A spray gun with chopped conductive fibers was placed under the expanded polytetrafluoroethylene film, and carbon fibers 3 μm in diameter and 6mm in length were sprayed at a spray rate of 20m/s onto the expanded polytetrafluoroethylene film having a thickness of 7. Mu.m. When spraying, the length direction of the conductive fiber is parallel to the thickness direction of the expanded polytetrafluoroethylene film, the conductive fiber pierces the expanded polytetrafluoroethylene film, and a fiber grass-like shape is formed on two sides of the expanded polytetrafluoroethylene film. The swelling polytetrafluoroethylene film with the conductive fiber grass is passed through a hardened rubber pressure roller, the fiber grass is pressed down, and the fibers are overlapped on the upper/lower surface of the film to form a conductive interpenetrating network structure.
And then stacking the films layer by layer according to the required thickness, sintering the stacked films at 380 ℃ for 8 hours under certain pressure or tension, so that the expanded polytetrafluoroethylene between different layers is mutually bonded together, and finally forming the conductive expanded polytetrafluoroethylene sealing material with the interpenetrating conductive network structure. The conductive expanded polytetrafluoroethylene sealing material was tested to have a conductivity of 1.3X10 2 S/m。
The foregoing is merely illustrative embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the technical scope of the present invention, and the invention should be covered. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. The expanded polytetrafluoroethylene conductive sealing plate is characterized by comprising at least one expanded polytetrafluoroethylene conductive film layer, wherein the expanded polytetrafluoroethylene conductive film layer comprises an expanded polytetrafluoroethylene base film and a plurality of conductive fibers arranged on the expanded polytetrafluoroethylene base film at intervals; each conductive fiber penetrates through the expanded polytetrafluoroethylene base film along the thickness direction of the expanded polytetrafluoroethylene base film, each conductive fiber comprises a penetrating part and protruding parts connected with two opposite ends of the penetrating part, the penetrating parts are positioned in the expanded polytetrafluoroethylene base film, and the protruding parts at the two opposite ends are respectively positioned at two opposite sides of the expanded polytetrafluoroethylene base film; the extending parts of each end are obliquely bent compared with the penetrating parts, and the extending parts of the conductive fibers are mutually overlapped to form conductive surface layers on two opposite sides of the expanded polytetrafluoroethylene base film respectively.
2. The expanded polytetrafluoroethylene electrically conductive seal as defined in claim 1 wherein said extension is folded to abut a surface of said expanded polytetrafluoroethylene base membrane to cause said electrically conductive facing to abut the surface of said expanded polytetrafluoroethylene base membrane.
3. The expanded polytetrafluoroethylene electrically conductive sealing plate according to claim 1 wherein said expanded polytetrafluoroethylene base membrane has a thickness of 2 to 20 microns, said conductive fibers have a diameter of 1 to 20 microns, and said conductive fibers have a length of 1 to 10mm.
4. The expanded polytetrafluoroethylene electrically conductive gasket of claim 1 wherein said electrically conductive fibers are chopped carbon fibers or metal fibers.
5. The expanded polytetrafluoroethylene electrically conductive sealing plate as claimed in any one of claims 1 to 4, wherein said expanded polytetrafluoroethylene electrically conductive sealing plate comprises a plurality of said expanded polytetrafluoroethylene electrically conductive film layers, a plurality of said expanded polytetrafluoroethylene electrically conductive film layers being stacked in said thickness direction; the expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are connected with each other, and the conductive surface layers of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted.
6. The expanded polytetrafluoroethylene electrically conductive sealing plate as claimed in claim 5 wherein each of said expanded polytetrafluoroethylene electrically conductive layers has gaps between the protrusions of said plurality of electrically conductive fibers such that said electrically conductive facing layer forms voids at locations corresponding to said gaps; the expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted and adhered and fixed through the gaps.
7. The expanded polytetrafluoroethylene electrically conductive seal as defined in claim 6 wherein the expanded polytetrafluoroethylene base membranes of each adjacent two of said expanded polytetrafluoroethylene electrically conductive membrane are bonded together by sintering and melting.
8. A method of making an expanded polytetrafluoroethylene electrically conductive seal plate, for use in making an expanded polytetrafluoroethylene electrically conductive seal plate as defined in any one of claims 1-7, said expanded polytetrafluoroethylene electrically conductive seal plate comprising at least one expanded polytetrafluoroethylene electrically conductive membrane; the manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate comprises the following steps:
s10: providing an expanded polytetrafluoroethylene base film, and arranging a spraying device provided with a plurality of conductive fibers on one side of the expanded polytetrafluoroethylene base film; spraying a plurality of conductive fibers to the expanded polytetrafluoroethylene base film by using the spraying device, so that the conductive fibers penetrate through the expanded polytetrafluoroethylene base film, and the opposite ends of the conductive fibers extend out to the opposite sides of the expanded polytetrafluoroethylene base film respectively;
s20: rolling the expanded polytetrafluoroethylene base film to enable parts of the plurality of conductive fibers extending to the two opposite sides of the expanded polytetrafluoroethylene base film to be pressed down and mutually lapped together so as to respectively form conductive surface layers on the two opposite sides of the expanded polytetrafluoroethylene base film, thereby obtaining an expanded polytetrafluoroethylene conductive film layer; the conductive fibers are located in the expanded polytetrafluoroethylene base film and penetrate through the expanded polytetrafluoroethylene base film, and the portions, which extend to two opposite sides of the expanded polytetrafluoroethylene base film and are pressed down, of the conductive fibers are extending portions.
9. The method of making an expanded polytetrafluoroethylene electrically conductive sealing plate as defined in claim 8 wherein said expanded polytetrafluoroethylene electrically conductive sealing plate comprises a plurality of said expanded polytetrafluoroethylene electrically conductive membrane; the manufacturing method of the expanded polytetrafluoroethylene conductive sealing plate further comprises the following steps:
s30: stacking a plurality of expanded polytetrafluoroethylene conductive film layers together along the thickness direction of the expanded polytetrafluoroethylene conductive film layers, wherein the conductive surface layers of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted; meanwhile, gaps are formed among the extending parts of a plurality of conductive fibers in each expanded polytetrafluoroethylene conductive film layer, gaps are formed at positions of the conductive surface layers corresponding to the gaps, and expanded polytetrafluoroethylene base films of every two adjacent expanded polytetrafluoroethylene conductive film layers are contacted through the gaps;
s40: sintering the expanded polytetrafluoroethylene conductive film layers at a certain temperature to enable the expanded polytetrafluoroethylene base films of the adjacent expanded polytetrafluoroethylene conductive film layers to be bonded together after being melted.
10. The method of producing a conductive sealing plate of expanded polytetrafluoroethylene as claimed in claim 8 or 9, wherein in the step S10, the length direction of the conductive fibers is parallel to the thickness direction of the expanded polytetrafluoroethylene base film when the conductive fibers are ejected from the ejection device; the speed of the conductive fiber sprayed out of the spraying device is 5-80 m/s.
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