CN117484410A - Preparation method of diamond grinding head - Google Patents
Preparation method of diamond grinding head Download PDFInfo
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- CN117484410A CN117484410A CN202311673897.XA CN202311673897A CN117484410A CN 117484410 A CN117484410 A CN 117484410A CN 202311673897 A CN202311673897 A CN 202311673897A CN 117484410 A CN117484410 A CN 117484410A
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- 239000010432 diamond Substances 0.000 title claims abstract description 172
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 172
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 238000000498 ball milling Methods 0.000 claims abstract description 123
- 239000000919 ceramic Substances 0.000 claims abstract description 118
- 238000000034 method Methods 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 59
- 238000005245 sintering Methods 0.000 claims abstract description 55
- 239000002994 raw material Substances 0.000 claims abstract description 49
- 239000000080 wetting agent Substances 0.000 claims abstract description 25
- 238000000465 moulding Methods 0.000 claims abstract description 23
- 239000004375 Dextrin Substances 0.000 claims abstract description 21
- 229920001353 Dextrin Polymers 0.000 claims abstract description 21
- 235000019425 dextrin Nutrition 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 19
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 19
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 19
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 19
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 19
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910001948 sodium oxide Inorganic materials 0.000 claims abstract description 19
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
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- 229910001634 calcium fluoride Inorganic materials 0.000 claims abstract description 16
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000009736 wetting Methods 0.000 claims abstract description 14
- 239000007767 bonding agent Substances 0.000 claims abstract description 12
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Abstract
The invention discloses a preparation method of a diamond grinding head, which comprises the following steps: obtaining multiple components of the low-temperature ceramic bond according to a first preset formula to prepare the low-temperature ceramic bond, wherein the multiple components of the low-temperature ceramic bond comprise: sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide, and calcium fluoride; obtaining a plurality of raw materials of the diamond grinding head according to a second preset formula, performing ball milling, and then adding a wetting agent for wetting to obtain a grinding head forming material, wherein the plurality of raw materials of the diamond grinding head comprise a low-temperature ceramic bonding agent, diamond micro powder, a pore-forming agent and dextrin; cold press molding is carried out on the grinding head forming material to obtain a grinding head green body; sintering the grinding head green body to obtain a grinding head cooked body; and bonding the grinding head blank with the grinding head matrix, and curing to obtain the diamond grinding head. The diamond grinding wheel prepared by the method has the advantages of low sintering temperature of the ceramic bond, high strength and hardness of the grinding head, and high sharpness and wear resistance.
Description
Technical Field
The invention relates to the technical field of precision machining, in particular to a preparation method of a diamond grinding head.
Background
The diamond grinding head is a generic name of a small handle diamond-like grinding tool and is widely applied to grinding processing of hard and brittle materials such as sapphire, glass, silicon carbide, hard alloy and the like. The diamond grinding heads are mainly classified into metal bond diamond grinding heads, resin bond diamond grinding heads and ceramic bond diamond grinding heads according to the kind of bonding agent. The metal diamond grinding tool has the advantages of high strength and good wear resistance, and is suitable for rough machining. The resin diamond grinding tool has high elasticity and good self-sharpening property, and is suitable for finish machining and superfinishing. However, the particle size of the resin bond limits the difficulty in using ultra-fine particle size abrasive particles in resin abrasives, resulting in less applications in the field of ultra-precision machining. The ceramic diamond grinding tool has the advantages of high strength, high sharpness and the like, and has a plurality of applications in the field of ultra-precise machining of hard and brittle materials such as tungsten steel, sapphire, silicon carbide and the like.
At present, though the ceramic diamond grinding head has the advantages of high hardness, good self-sharpening performance and the like, under the condition of high sintering temperature of a ceramic bonding agent, diamond is easy to graphitize, and the sharpness of the grinding head is greatly reduced. In the field of ultra-precision machining, the diamond particle size of ceramic diamond grinding heads is typically finer than 7 μm, resulting in a decrease in the graphitization temperature of the diamond. In order to ensure sharpness and strength of the fine-grained grinding head, the ceramic bond is required to have a lower sintering temperature and a higher strength. However, a decrease in the sintering temperature of the binder leads to a decrease in the strength and hardness of the grinding head, which in turn leads to a decrease in the service life of the grinding head.
How to reduce the sintering temperature of the ceramic bond, and the diamond in the grinding head can not generate graphitization, so that the strength and the hardness of the grinding head can not be reduced, and the sharpness and the wear resistance of the grinding head are improved, and the problem is to be solved.
Therefore, a method of manufacturing a diamond grinding head is needed.
Disclosure of Invention
To this end, the present invention provides a method of manufacturing a diamond grinding head to solve or at least alleviate the above-identified problems.
According to one aspect of the present invention, there is provided a diamond grinding head manufacturing method, comprising: obtaining multiple components of the low-temperature ceramic bond according to a first preset formula to prepare the low-temperature ceramic bond, wherein the multiple components of the low-temperature ceramic bond comprise: sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide, and calcium fluoride; obtaining a plurality of raw materials of the diamond grinding head according to a second preset formula, performing ball milling, and then adding a wetting agent for wetting to obtain a grinding head forming material, wherein the plurality of raw materials of the diamond grinding head comprise the low-temperature ceramic bonding agent, diamond micro powder, a pore-forming agent and dextrin; cold press molding is carried out on the grinding head molding material to obtain a grinding head green body; sintering the grinding head green body to obtain a grinding head cooked body; and bonding the grinding head blank with a grinding head matrix, and solidifying to obtain the diamond grinding head.
Optionally, in the method for preparing a diamond grinding head according to the present invention, the obtaining of the plurality of components of the low-temperature ceramic bond according to the first predetermined formulation to prepare the low-temperature ceramic bond includes: obtaining a plurality of components of the low-temperature ceramic bond according to a first preset formula, and performing ball milling to obtain a powdery bond material; smelting the powdery binder material, and performing water quenching treatment to obtain a glass material; ball milling the glass material and water with the same quality, and drying based on the first drying temperature to obtain the low-temperature ceramic bond.
Optionally, in the method for manufacturing a diamond grinding head according to the invention, smelting the powdery binder material includes: placing the powdery binder material into a box-type resistance furnace for smelting; ball milling the glass material and water with the same quality, and drying based on a first drying temperature to obtain the low-temperature ceramic bond, wherein the ball milling process comprises the following steps: and placing the glass frit and water with the same mass into a ball milling tank, adding grinding balls, performing ball milling based on a first ball milling rotating speed, and drying based on a first drying temperature to obtain the low-temperature ceramic bond, wherein the first ball milling rotating speed is 300-800 r/min.
Optionally, in the method for preparing a diamond grinding head according to the present invention, obtaining a plurality of raw materials of the diamond grinding head according to a second predetermined formulation and performing ball milling, and then adding a wetting agent to wet to obtain a grinding head molding material, comprising: placing a plurality of raw materials of the diamond grinding head obtained according to a second preset formula into a ball milling tank, adding grinding balls, and performing ball milling based on a second ball milling rotating speed and a second ball milling time, wherein the second ball milling rotating speed is 300-800 r/min, and the second ball milling time is 30-50 min; sieving multiple raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing, and sieving to obtain the grinding head molding material.
Optionally, in the method for manufacturing a diamond grinding head according to the invention, cold press molding the grinding head molding material to obtain a grinding head green body includes: and carrying out cold press molding on the grinding head molding material through a die, and then carrying out demoulding and drying based on a second drying temperature to obtain a grinding head green body.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, cold press molding the grinding head molding material includes: and carrying out cold press molding on the grinding head molding material based on the pressure of 100-150 Mpa, and maintaining the pressure for 20-30 s.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, sintering the grinding head green body to obtain a grinding head green body, including: and placing the grinding head green body into a sintering furnace for sintering, heating to a sintering temperature based on a preset heating rate in the sintering process, and preserving heat for a second preset time to obtain a grinding head green body.
Alternatively, in the method for manufacturing a diamond grinding head according to the present invention, the predetermined heating rate is 3 to 5 ℃/min, the sintering temperature is 600 to 750 ℃, and the second predetermined time period is 3 to 5 hours.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, the first predetermined formulation includes a corresponding molar ratio of each component of the low-temperature ceramic bonding agent; wherein the molar ratio of the sodium oxide is 10 to 40mol%, the molar ratio of the bismuth oxide is 10 to 30mol%, the molar ratio of the boron oxide is 20 to 30mol%, the molar ratio of the silicon oxide is 1 to 10mol%, the molar ratio of the aluminum oxide is 1 to 10mol%, the molar ratio of the yttrium oxide is 1 to 10mol%, and the molar ratio of the calcium fluoride is 1 to 6mol%.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, the second predetermined formulation includes a mass fraction of each raw material of the diamond grinding head; wherein the mass fraction of the low-temperature ceramic bond is 10-40%, the mass fraction of the diamond micro powder is 40-60%, the mass fraction of the pore-forming agent is 1-10%, and the mass fraction of the dextrin is 1-5%.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, bonding the grinding head blank to a grinding head base includes: and bonding the grinding head blank with the grinding head matrix through epoxy resin glue.
Optionally, in the method for manufacturing a diamond grinding head according to the present invention, after obtaining the diamond grinding head, further comprising: and finishing the diamond grinding head through a finishing tool, wherein the range of axial runout and radial runout of the diamond grinding head after finishing is 0-20 mu m.
Alternatively, in the diamond grinding head manufacturing method according to the present invention, the particle size of the low-temperature ceramic bonding agent is 5 μm or less.
Optionally, in the method for preparing a diamond grinding head according to the present invention, the diamond micro powder is a two-type material, and the particle size of the diamond micro powder is 3000 to 10000#.
Alternatively, in the diamond grinding head manufacturing method according to the present invention, the dextrin has a particle size of 100 to 300 μm.
Optionally, in the method for manufacturing a diamond grinding head according to the invention, the pore-forming agent is glass hollow microspheres.
Alternatively, in the method of manufacturing a diamond grinding head according to the present invention, the wetting agent is a PVA solution having a mass fraction of 5 to 10 wt%.
According to the technical scheme, the invention provides a preparation method of a diamond grinding head, which comprises the steps of obtaining sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide and calcium fluoride according to a first preset formula to prepare a low-temperature ceramic bonding agent; obtaining a low-temperature ceramic bond, diamond micropowder, pore-forming agent and dextrin according to a second preset formula, performing ball milling, and then adding a wetting agent for wetting to obtain a grinding head molding material; and further, carrying out cold press molding on the grinding head molding material to obtain a grinding head green body, sintering the grinding head green body to obtain a grinding head cooked body, bonding the grinding head cooked body and the grinding head matrix, and curing to obtain the diamond grinding head. The boron oxide and the sodium oxide in the low-temperature ceramic bond have the characteristic of high connection strength, the bismuth oxide can reduce the sintering temperature of the ceramic bond, the silicon oxide and the aluminum oxide can ensure the hardness and the strength of the ceramic bond, and meanwhile, the calcium oxide can improve the bending strength of the ceramic bond, reduce the thermal expansion coefficient and improve the compactness of the ceramic bond. Thus, the diamond grinding head prepared by the low-temperature ceramic bond can be high in strength and hardness and high in sharpness and wear resistance under the condition of reducing the sintering temperature of the ceramic bond. Therefore, the low-temperature ceramic bond diamond grinding head prepared by the method can simultaneously meet the requirements of low sintering temperature of the ceramic bond, no graphitization of diamond, high strength and hardness of the grinding head, and higher sharpness and wear resistance.
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent.
Drawings
To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings, which set forth the various ways in which the principles disclosed herein may be practiced, and all aspects and equivalents thereof are intended to fall within the scope of the claimed subject matter. The above, as well as additional objects, features, and advantages of the present disclosure will become more apparent from the following detailed description when read in conjunction with the accompanying drawings. Like reference numerals generally refer to like parts or elements throughout the present disclosure.
Fig. 1 shows a schematic flow chart of a method 100 for manufacturing a diamond grinding head according to an embodiment of the invention;
fig. 2 shows a schematic representation of a diamond grinding head made in accordance with three embodiments of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Aiming at the ceramic bond diamond grinding head, the invention provides a diamond grinding head preparation method 100 for preparing a grinding head with high strength and high wear resistance under the condition of reducing the sintering temperature of the ceramic bond.
Fig. 1 shows a schematic flow chart of a method 100 for manufacturing a diamond grinding head according to an embodiment of the invention. In addition, according to the method 100 for manufacturing a diamond grinding head of the present invention, by manufacturing a low-temperature ceramic bond, the diamond grinding head is manufactured based on the low-temperature ceramic bond, so that the finally manufactured diamond grinding head has high strength and hardness, and higher sharpness and wear resistance, while the sintering temperature of the ceramic bond is reduced.
The diamond grinding head manufacturing method 100 of the present invention is described below with reference to fig. 1.
As shown in fig. 1, the method 100 includes the following steps 110-150.
Step 110, obtaining multiple components of the low-temperature ceramic bond according to a first preset formula to prepare the low-temperature ceramic bond, wherein the multiple components of the low-temperature ceramic bond comprise: sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide, and calcium fluoride.
In the embodiment of the present invention, sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide, and calcium fluoride are obtained according to a first predetermined formulation to prepare a low-temperature ceramic bond, and then a diamond grinding head is prepared based on the low-temperature ceramic bond (as one of the components of the diamond grinding head). Thus, the low-temperature ceramic bond used for preparing the diamond grinding head is mixed powder composed of sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide and calcium fluoride. The boron oxide and the sodium oxide in the low-temperature ceramic bond have the characteristic of high connection strength, the sintering temperature of the ceramic bond can be reduced by adding the bismuth oxide, the hardness and the strength of the ceramic bond can be ensured by adding the silicon oxide and the aluminum oxide, meanwhile, the bending strength of the ceramic bond can be improved by adding the calcium oxide, the thermal expansion coefficient is reduced, the compactness of the ceramic bond is improved, and the wettability of the ceramic bond to diamond can be further increased.
Step 120, obtaining a plurality of raw materials of the diamond grinding head according to a second preset formula, performing ball milling, adding a wetting agent, and wetting to obtain a grinding head forming material, wherein the plurality of raw materials of the diamond grinding head comprise the low-temperature ceramic bonding agent, the diamond micro powder, the pore-forming agent and the dextrin prepared in the step 110;
in the embodiment of the invention, various raw materials (low-temperature ceramic bond, diamond micropowder, pore-forming agent and dextrin) of the diamond grinding head are obtained according to a second preset formula, the obtained low-temperature ceramic bond, diamond micropowder, pore-forming agent and dextrin are ball-milled, after ball milling is finished, wetting agents are added into the various raw materials of the diamond grinding head after ball milling, and after wetting is finished, grinding head molding materials can be obtained.
And 130, performing cold press molding on the grinding head molding material obtained in the step 120 to obtain a grinding head green body.
And 140, sintering the grinding head green body obtained in the step 130 to obtain a grinding head cooked body.
And 150, bonding the grinding head blank obtained in the step 140 with a grinding head matrix prepared in advance, and solidifying to obtain the diamond grinding head.
In some embodiments, the process of preparing the low temperature ceramic bond in step 110 is as follows.
Firstly, obtaining multiple components (sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide and calcium fluoride) of the low-temperature ceramic bond according to a first preset formula, and ball-milling the multiple components of the low-temperature ceramic bond to obtain the powdery binder. Here, the various components of the low-temperature ceramic bond can be placed in a ball milling tank, and added with grinding balls for ball milling, and the various components of the low-temperature ceramic bond can be fully mixed through ball milling to obtain the uniformly mixed powdery bond material. Wherein the ball to material ratio (mass ratio of the grinding balls to the various components of the low temperature ceramic bond) may be 3:1.
And then smelting the powdery binder to obtain a liquid binder, and quenching the liquid binder to obtain the glass frit.
In some embodiments, the powdered binder may be placed in a box-type resistance furnace for smelting. Specifically, the powdered binder may be placed in a corundum crucible and smelted in a box-type resistance furnace.
In some embodiments, the smelting temperature at which the powdered binder material is smelted may be 800-1200 ℃.
Finally, ball milling is carried out on the glass frit and water with the same quality, and drying is carried out based on the first drying temperature, so that the low-temperature ceramic bonding agent can be obtained.
In some embodiments, the glass frit and water with the same quality can be placed in a ball milling tank, grinding balls are added into the ball milling tank, ball milling is performed based on a first ball milling rotating speed, and after ball milling is completed, the ball milled glass frit and water are dried based on a first drying temperature, so that the low-temperature ceramic bonding agent can be obtained. Wherein the first ball milling rotation speed may be 300 to 800r/min, that is, the glass frit (in the ball milling tank) and water may be ball-milled based on the ball milling rotation speed of 300 to 800 r/min.
In some embodiments, the mill balls may be added three times for ball milling for the frit and water placed in the ball milling tank, and the ball milling time may be 60 minutes each time. For example, the diameter of the grinding balls added by the first ball milling may be 10 to 15mm, the diameter of the grinding balls added by the second ball milling may be 5 to 10mm, and the diameter of the grinding balls added by the third ball milling may be 3 to 5mm. After the three ball milling is completed, low-temperature ceramic bond slurry can be obtained, and then the low-temperature ceramic bond slurry can be dried based on the first drying temperature and sieved to obtain the low-temperature ceramic bond with the particle size of less than or equal to 5 mu m.
In some embodiments, the first drying temperature may be 40 to 60 ℃. That is, the low-temperature ceramic bond slurry may be dried based on a drying temperature of 40 to 60 ℃ to obtain the low-temperature ceramic bond.
In some embodiments, the first predetermined formulation includes a corresponding molar ratio of each component of the low temperature ceramic binder. Wherein, the mole ratio of sodium oxide is 10-40 mole percent, the mole ratio of bismuth oxide is 10-30 mole percent, the mole ratio of boron oxide is 20-30 mole percent, the mole ratio of silicon oxide is 1-10 mole percent, the mole ratio of aluminum oxide is 1-10 mole percent, the mole ratio of yttrium oxide is 1-10 mole percent, and the mole ratio of calcium fluoride is 1-6 mole percent.
That is, in some embodiments, the various components of the low temperature ceramic bond are obtained according to the first predetermined recipe in step 110, specifically implemented as follows: 10 to 40mol percent of sodium oxide, 10 to 30mol percent of bismuth oxide, 20 to 30mol percent of boron oxide, 1 to 10mol percent of silicon oxide, 1 to 10mol percent of aluminum oxide, 1 to 10mol percent of yttrium oxide and 1 to 6mol percent of calcium fluoride are obtained.
In some embodiments, the particle size of the various components of the low temperature ceramic bond is 5 μm or less. Thus, the particle size of the low-temperature ceramic bond prepared in step 110 is 5 μm or less.
In some embodiments, the process of preparing the millbase molding material in step 120 is as follows.
Firstly, obtaining multiple raw materials of a diamond grinding head according to a second preset formula, placing the multiple raw materials of the diamond grinding head obtained according to the second preset formula into a ball milling tank, adding grinding balls into the ball milling tank, and ball milling the multiple raw materials of the diamond grinding head based on a second ball milling rotating speed and a second ball milling time to fully mix the multiple raw materials of the diamond grinding head so as to obtain the multiple raw materials of the uniformly mixed diamond grinding head. Wherein the second ball milling rotating speed is 300-800 r/min, and the second ball milling time is 30-50 min. That is, the various raw materials of the diamond grinding head (in the ball milling tank) may be ball-milled for 30 to 60 minutes based on a ball milling rotation speed of 300 to 800 r/min.
Here, the grinding balls may be added to the ball mill tank in a second predetermined ratio, and specifically, the mass ratio of the various raw materials of the diamond grinding head to the grinding balls may be the second predetermined ratio. In one embodiment, the second predetermined ratio may be 1:1, that is, the mass ratio of the plurality of raw materials of the diamond grinding head to the added grinding balls is 1:1.
And then, sieving various raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing and sieving to obtain the grinding head molding material. For example, the multiple raw materials of the diamond grinding head after ball milling may be sieved and placed in a mortar, and a wetting agent may be added dropwise to the mortar to wet the multiple raw materials of the diamond grinding head in the mortar.
In some embodiments, the wetting agent may be a PVA solution (i.e., a polyvinyl alcohol solution) having a mass fraction (concentration) of 5 to 10 wt%.
In some embodiments, the second predetermined recipe includes a mass fraction for each raw material of the diamond grinding head. Wherein, the mass fraction of the low-temperature ceramic bond is 10-40%, the mass fraction of the diamond micro powder is 40-60%, the mass fraction of the pore-forming agent is 1-10%, and the mass fraction of the dextrin is 1-5%.
That is, in some embodiments, the multiple raw materials for the diamond grinding head are obtained according to the second predetermined recipe in step 120, specifically implemented as follows: 10-40% of low-temperature ceramic bond, 40-60% of diamond micropowder, 1-10% of pore-forming agent and 1-5% of dextrin are obtained.
In some embodiments, the diamond micropowder in step 120 is a binary material, and the diamond micropowder has a particle size of 3000-10000 #.
In some embodiments, the dextrin in step 120 has a particle size of 100 to 300 μm.
In some embodiments, the pore former in step 120 is glass hollow microspheres, and the glass hollow microspheres have a particle size of 10 to 100 μm.
In some embodiments, the millbase molding material may be cold-press molded in step 130 to obtain a millbase green body by: and placing the grinding head forming material into a mould, cold-pressing and forming the grinding head forming material through the mould, demoulding, and drying based on a second drying temperature to obtain a grinding head green body. Specifically, after cold press molding and demolding are performed on the grinding head molding material through a mold, an initial grinding head green body can be obtained, and then the initial grinding head green body can be dried based on a second drying temperature, so that a final grinding head green body is obtained.
In some embodiments, the pressure for cold press molding the grinding head forming material may be 100-150 Mpa. Specifically, the grinding head molding material can be subjected to cold press molding based on the pressure of 100-150 Mpa, and the pressure is maintained for 20-30 s, and then the demolding is performed.
In some embodiments, the second drying temperature is 40-50 ℃ and the drying time based on the second drying temperature is 10-24 hours. That is, the initial grinding-head green body obtained by demolding may be dried for 10 to 24 hours based on a drying temperature of 40 to 50 ℃ to obtain a final grinding-head green body.
In some embodiments, the mill base green body (final mill base green body) may be sintered in step 140 by: and (3) placing the grinding head green body (the final grinding head green body) into a sintering furnace for sintering, heating to a sintering temperature based on a preset heating rate in the sintering process, and preserving heat for a second preset time to obtain the grinding head green body.
In some embodiments, the predetermined ramp rate during sintering is 3 to 5 ℃/min, the sintering temperature is 600 to 750 ℃, and the second predetermined time period is 3 to 5 hours. That is, during the sintering process, the temperature can be raised to 600-750 ℃ based on the temperature rising rate of 3-5 ℃/min, and the temperature is kept for 3-5 hours, so that the grinding head blank is obtained. The sintering process is a low-temperature sintering process based on the low-temperature ceramic bond prepared above.
In some embodiments, the grinding tip blank may be bonded to the grinding tip base by an epoxy glue in step 150. After the bonding is completed, the diamond grinding head can be obtained by curing for 10 to 12 hours.
In some embodiments, after the diamond grinding tip is obtained, the diamond grinding tip may also be dressed by a dressing tool. The axial runout and the radial runout of the diamond grinding head after finishing are in the range of 0-20 mu m.
In some embodiments, the dressing tool may be a 1000-2000 mesh diamond wheel.
The following will describe in detail the material components and technical parameters involved in the preparation of the diamond grinding head by means of three specific examples.
In a first specific embodiment, in step 110, obtaining multiple components of the low temperature ceramic bond according to a first predetermined recipe may be implemented as: 25mol% of sodium oxide, 25mol% of bismuth oxide, 30mol% of boron oxide, 5mol% of silicon oxide, 7mol% of aluminum oxide, 5mol% of yttrium oxide and 3mol% of calcium fluoride are obtained.
And further, in the process of ball-milling a plurality of components of the low-temperature ceramic bond obtained according to the first preset formula so as to fully mix to obtain the powdery bond, the ball-milling rotating speed can be 500r/min, and the ball-milling time can be 1h.
The smelting temperature for smelting the powdery binder may be 1200 ℃. Wherein, in the smelting process of the powdery binder, the temperature is raised to 1200 ℃ at a heating rate of 3 ℃/min, and the temperature is kept for 1h. After the heat preservation is completed, the liquid binder material can be obtained. And then quenching the liquid binder material to obtain the glass material.
When the glass material and water with the same quality are ball-milled, the grinding balls can be added for ball milling for three times, the rotation speed of each ball milling is 800r/min, and the ball milling time is 60min. The diameter of the grinding balls added by the first ball milling can be 15mm (ball-to-material ratio is 3:1), the grinding balls with the diameter of 10mm (ball-to-material ratio is 4:1) are added by the second ball milling after the grinding balls with the diameter of 15mm are taken out after the first ball milling, the grinding balls with the diameter of 10mm are taken out after the second ball milling, the third ball milling is carried out, and the grinding balls with the diameter of 5mm (ball-to-material ratio is 5:1) are added by the third ball milling. After the three ball milling is completed, the obtained low-temperature ceramic bond slurry is placed in a blast drying oven, the low-temperature ceramic bond slurry is dried based on the drying temperature of 60 ℃, and the low-temperature ceramic bond with the particle size smaller than or equal to 5 mu m is obtained after the drying through a 400# screen.
In step 120, obtaining multiple raw materials for the diamond grinding head according to the second predetermined recipe may be implemented as: obtaining 20% of low-temperature ceramic bond, 60% of diamond micropowder, 10% of pore-forming agent (glass hollow microsphere) and 5% of dextrin. In addition, 3% of a wetting agent (for dropwise addition after sieving various raw materials of the diamond grinding head after ball milling) was prepared.
The granularity of the selected diamond micropowder is 3000#. The particle size of the dextrin was 200. Mu.m. The particle size of the glass hollow microspheres is 100 μm. The wetting agent may be a 10wt% PVA solution.
And placing the multiple raw materials of the diamond grinding head obtained according to the second preset formula into a ball milling tank, and performing ball milling on the multiple raw materials of the diamond grinding head at a second ball milling rotating speed of 800r/min for 30min. That is, various raw materials of the diamond grinding head (in the ball milling pot) were ball-milled for 30min based on a ball milling rotation speed of 800 r/min.
Sieving various raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing, and sieving through a 60# screen to obtain the grinding head molding material.
In step 130, the charge density during cold press molding of the grinding head molding material may be 2.2g/cm 3 The cold press molding of the grinding head forming material is performed under a pressure of 150MPa and a dwell time of 30s, and then after demolding, the initial grinding head green body may be dried in a drying oven, wherein the initial grinding head green body may be dried for 24 hours based on a drying temperature of 40 ℃ to obtain a final grinding head green body.
In step 140, the grinding head green body (final grinding head green body) may be placed in a sintering furnace for sintering, the sintering temperature may be 720 ℃, the predetermined heating rate in the sintering process is 3 ℃/min, and the heat preservation time (second predetermined time) is 5h. That is, during the sintering process, the temperature can be raised to 720 ℃ based on a heating rate of 3 ℃/min, and the temperature is kept for 5 hours, so that the grinding head blank is obtained.
In step 150, the grinding head blank may be cleaned, and then the grinding head blank is bonded to a grinding head substrate, which may be a tungsten steel substrate, using an epoxy resin adhesive. Further, the diamond grinding head can be trimmed by a 1000-mesh diamond grinding wheel, and the axial runout and the radial runout of the trimmed diamond grinding head are ensured to be 0-20 mu m.
In a second embodiment, in step 110, obtaining multiple components of the low temperature ceramic bond according to a first predetermined recipe may be implemented as: 35mol% of sodium oxide, 15mol% of bismuth oxide, 30mol% of boron oxide, 3mol% of silicon oxide, 2mol% of aluminum oxide, 10mol% of yttrium oxide and 5mol% of calcium fluoride are obtained.
And further, in the process of ball-milling a plurality of components of the low-temperature ceramic bond obtained according to the first preset formula so as to fully mix to obtain the powdery bond, the ball-milling rotating speed can be 500r/min, and the ball-milling time can be 1h.
The smelting temperature for smelting the powdery binder may be 1000 ℃. Wherein, in the smelting process of the powdery binder, the temperature is raised to 1000 ℃ at a heating rate of 3 ℃/min, and the temperature is kept for 1h. After the heat preservation is completed, the liquid binder material can be obtained. And then quenching the liquid binder material to obtain the glass material.
When the glass material and water with the same quality are ball-milled, the grinding balls can be added for ball milling for three times, the rotation speed of each ball milling is 800r/min, and the ball milling time is 60min. The diameter of the grinding balls added by the first ball milling can be 15mm (ball-to-material ratio is 3:1), the grinding balls with the diameter of 10mm (ball-to-material ratio is 4:1) are added by the second ball milling after the grinding balls with the diameter of 15mm are taken out after the first ball milling, the grinding balls with the diameter of 10mm are taken out after the second ball milling, the third ball milling is carried out, and the grinding balls with the diameter of 5mm (ball-to-material ratio is 5:1) are added by the third ball milling. After the three ball milling is completed, the obtained low-temperature ceramic bond slurry is placed in a blast drying oven, the low-temperature ceramic bond slurry is dried based on the drying temperature of 60 ℃, and the low-temperature ceramic bond with the particle size smaller than or equal to 5 mu m is obtained after the drying through a 400# screen.
In step 120, obtaining multiple raw materials for the diamond grinding head according to the second predetermined recipe may be implemented as: 30% of low-temperature ceramic bond, 55% of diamond micropowder, 7% of pore-forming agent (glass hollow microsphere) and 5% of dextrin are obtained. In addition, 3% of a wetting agent (for dropwise addition after sieving various raw materials of the diamond grinding head after ball milling) was prepared.
The granularity of the selected diamond micropowder is 5000#. The particle size of the dextrin was 200. Mu.m. The particle size of the glass hollow microspheres is 10 μm. The wetting agent may be a 10wt% PVA solution.
And placing the multiple raw materials of the diamond grinding head obtained according to the second preset formula into a ball milling tank, and performing ball milling on the multiple raw materials of the diamond grinding head at a second ball milling rotating speed of 300r/min for 60min. That is, the various raw materials of the diamond grinding head (in the ball mill pot) were ball-milled for 60min based on a ball milling rotation speed of 300 r/min.
Sieving various raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing, and sieving through a 60# screen to obtain the grinding head molding material.
In step 130, the charge density during cold press molding of the grinding head molding material may be 2.2g/cm 3 The cold press molding of the grinding head forming material is performed under a pressure of 150MPa and a dwell time of 15s, and then after demolding, the initial grinding head green body may be dried in a drying oven, wherein the initial grinding head green body may be dried for 24 hours based on a drying temperature of 40 ℃ to obtain a final grinding head green body.
In step 140, the grinding head green body (final grinding head green body) may be placed in a sintering furnace to perform sintering, the sintering temperature may be 700 ℃, the predetermined heating rate in the sintering process is 3 ℃/min, and the heat preservation time period (second predetermined time period) is 5h. That is, during the sintering process, the temperature may be raised to 700 ℃ based on a temperature raising rate of 3 ℃/min, and the temperature is maintained for 5 hours, to obtain the grinding head green compact.
In step 150, the grinding head blank may be cleaned, and then the grinding head blank is bonded to a grinding head substrate, which may be a tungsten steel substrate, using an epoxy resin adhesive. Furthermore, the diamond grinding head can be trimmed by a 1200-mesh diamond grinding wheel, so that the axial runout and the radial runout of the trimmed diamond grinding head are in the range of 0-15 mu m.
In a third embodiment, in step 110, obtaining multiple components of the low temperature ceramic bond according to a first predetermined recipe may be implemented as: 40mol% of sodium oxide, 10mol% of bismuth oxide, 30mol% of boron oxide, 2mol% of silicon oxide, 2mol% of aluminum oxide, 10mol% of yttrium oxide and 6mol% of calcium fluoride are obtained.
And further, in the process of ball-milling a plurality of components of the low-temperature ceramic bond obtained according to the first preset formula so as to fully mix to obtain the powdery bond, the ball-milling rotating speed can be 500r/min, and the ball-milling time can be 1h.
The smelting temperature for smelting the powdery binder may be 800 ℃. Wherein, in the smelting process of the powdery binder, the temperature is raised to 800 ℃ at a heating rate of 3 ℃/min, and the temperature is kept for 1h. After the heat preservation is completed, the liquid binder material can be obtained. And then quenching the liquid binder material to obtain the glass material.
When the glass material and water with the same quality are ball-milled, the grinding balls can be added for ball milling for three times, the rotation speed of each ball milling is 800r/min, and the ball milling time is 60min. The diameter of the grinding balls added by the first ball milling can be 15mm (ball-to-material ratio is 3:1), the grinding balls with the diameter of 10mm (ball-to-material ratio is 4:1) are added by the second ball milling after the grinding balls with the diameter of 15mm are taken out after the first ball milling, the grinding balls with the diameter of 10mm are taken out after the second ball milling, the third ball milling is carried out, and the grinding balls with the diameter of 5mm (ball-to-material ratio is 5:1) are added by the third ball milling. After the three ball milling is completed, the obtained low-temperature ceramic bond slurry is placed in a blast drying oven, the low-temperature ceramic bond slurry is dried based on the drying temperature of 60 ℃, and the low-temperature ceramic bond with the particle size smaller than or equal to 5 mu m is obtained after the drying through a 400# screen.
In step 120, obtaining multiple raw materials for the diamond grinding head according to the second predetermined recipe may be implemented as: obtaining 37% of low-temperature ceramic bond, 50% of diamond micropowder, 5% of pore-forming agent (glass hollow microsphere) and 5% of dextrin. In addition, 3% of a wetting agent (for dropwise addition after sieving various raw materials of the diamond grinding head after ball milling) was prepared.
The granularity of the selected diamond micro powder is 10000#. The particle size of the dextrin was 200. Mu.m. The particle size of the glass hollow microspheres is 10 μm. The wetting agent may be a 10wt% PVA solution.
And placing the multiple raw materials of the diamond grinding head obtained according to the second preset formula into a ball milling tank, and performing ball milling on the multiple raw materials of the diamond grinding head at a second ball milling rotating speed of 300r/min for 60min. That is, the various raw materials of the diamond grinding head (in the ball mill pot) were ball-milled for 60min based on a ball milling rotation speed of 300 r/min.
Sieving various raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing, and sieving through a 60# screen to obtain the grinding head molding material.
In step 130, the grinding head forming materialIn the cold press molding process, the charging density can be 2.1g/cm 3 The cold press molding of the grinding head forming material is performed under a pressure of 150MPa and a dwell time of 15s, and then after demolding, the initial grinding head green body may be dried in a drying oven, wherein the initial grinding head green body may be dried for 24 hours based on a drying temperature of 40 ℃ to obtain a final grinding head green body.
In step 140, the grinding head green body (final grinding head green body) may be placed in a sintering furnace to perform sintering, the sintering temperature may be 600 ℃, the predetermined heating rate in the sintering process is 3 ℃/min, and the heat preservation time period (second predetermined time period) is 5h. That is, during the sintering process, the temperature may be raised to 600 ℃ based on a temperature raising rate of 3 ℃/min, and the temperature is maintained for 5 hours, to obtain the grinding head green compact.
In step 150, the grinding head blank may be cleaned, and then the grinding head blank is bonded to a grinding head substrate, which may be a tungsten steel substrate, using an epoxy resin adhesive. Furthermore, the diamond grinding head can be trimmed by a 1500-mesh diamond grinding wheel, so that the axial runout and the radial runout of the trimmed diamond grinding head are in the range of 0-10 mu m.
The above is merely illustrative of specific embodiments of the present invention, and it should be noted that the material formulation involved in the method for preparing a diamond grinding head of the present invention is not limited to the technical parameters described in the above embodiments.
Fig. 2 shows a schematic representation of a diamond grinding head made in accordance with three embodiments of the invention.
Wherein a corresponds to the first embodiment, b corresponds to the second embodiment, and c corresponds to the third embodiment.
The following is a mechanical property test procedure for the diamond grinding head prepared according to the diamond grinding head preparing method 100 of the present invention.
Wherein, based on the grinding head forming materials prepared in the three specific embodiments, 50 x 5mm grinding wheel bars are prepared, and further, the bending strength of each grinding wheel bar can be tested by adopting a three-point bending method, and the hardness of each grinding wheel bar can be tested by adopting a Rockwell hardness tester.
In addition, the diamond grinding heads prepared by the three specific embodiments can be used for polishing two kinds of workpieces of sapphire and tungsten steel respectively, wherein the rotation speed of a grinding wheel shaft is 17000r/min, the rotation speed of a main shaft is 200r/min, and the feeding amount is 0.2 mu m/s when the sapphire workpieces are processed; the rotation speed of the grinding wheel shaft is 37000r/min, the rotation speed of the main shaft is 200r/min, and the feeding amount is 0.05 mu m/s when the tungsten steel workpiece is processed. Further, the sizes of the workpiece and the diamond grinding head were measured by a micrometer, and the ratio of the size consumed by the diamond grinding head to the workpiece was used as the abrasion ratio of the grinding head, which can be used to estimate the durability of the diamond grinding head. And detecting the surface quality of the workpiece after processing by using a UA3P three-dimensional morphology measuring instrument. See tables 1 and 2 below for specific data.
Table 1 specific parameters of diamond grinding head to process sapphire
Table 2 specific parameters for processing tungsten steel by diamond grinding head
It can be seen that the diamond grinding head prepared by the diamond grinding head preparation method 100 provided by the embodiment of the invention has high strength and hardness and high durability.
According to the preparation method of the diamond grinding head provided by the embodiment of the invention, sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide and calcium fluoride are obtained according to a first preset formula so as to prepare a low-temperature ceramic bonding agent; obtaining a low-temperature ceramic bond, diamond micropowder, pore-forming agent and dextrin according to a second preset formula, performing ball milling, and then adding a wetting agent for wetting to obtain a grinding head molding material; and further, carrying out cold press molding on the grinding head molding material to obtain a grinding head green body, sintering the grinding head green body to obtain a grinding head cooked body, bonding the grinding head cooked body and the grinding head matrix, and curing to obtain the diamond grinding head. The boron oxide and the sodium oxide in the low-temperature ceramic bond have the characteristic of high connection strength, the bismuth oxide can reduce the sintering temperature of the ceramic bond, the silicon oxide and the aluminum oxide can ensure the hardness and the strength of the ceramic bond, and meanwhile, the calcium oxide can improve the bending strength of the ceramic bond, reduce the thermal expansion coefficient and improve the compactness of the ceramic bond. Thus, the diamond grinding head prepared by the low-temperature ceramic bond can be high in strength and hardness and high in sharpness and wear resistance under the condition of reducing the sintering temperature of the ceramic bond. Therefore, the low-temperature ceramic bond diamond grinding head prepared by the method can simultaneously meet the requirements of low sintering temperature of the ceramic bond, no graphitization of diamond, high strength and hardness of the grinding head, and higher sharpness and wear resistance.
Embodiments of the present invention further include: the method of any one of A1-a10, wherein bonding the grinding head embryo to a grinding head base comprises: and bonding the grinding head blank with the grinding head matrix through epoxy resin glue. The method of any one of A1-a11, wherein after obtaining the diamond grinding head, further comprising: and finishing the diamond grinding head through a finishing tool, wherein the range of axial runout and radial runout of the diamond grinding head after finishing is 0-20 mu m. A13, the method of any one of A1-A12, wherein the particle size of the low-temperature ceramic bond is less than or equal to 5 μm. A14, the method of any one of A1-A13, wherein the diamond micro powder is a two-type material, and the granularity of the diamond micro powder is 3000-10000#. The method according to any one of A15 to A14, wherein the dextrin has a particle size of 100 to 300. Mu.m. The method of any one of A1-a15, wherein the pore-forming agent is a glass hollow microsphere. The method according to any one of A17 to A16, wherein the wetting agent is a PVA solution having a mass fraction of 5 to 10 wt%.
In the description of the present specification, the terms "coupled," "fixed," and the like are to be construed broadly unless otherwise specifically indicated and defined. Furthermore, the terms "front," "rear," "upper," "lower," "inner," "outer," "top," "bottom," and the like refer to an azimuth or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not refer to or imply that the devices or units referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore, should not be construed as limiting the invention.
In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects.
Those skilled in the art will appreciate that the modules or units or components of the devices in the examples disclosed herein may be arranged in a device as described in this embodiment, or alternatively may be located in one or more devices different from the devices in this example.
Those skilled in the art will appreciate that the modules in the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The modules or units or components of the embodiments may be combined into one module or unit or component and, furthermore, they may be divided into a plurality of sub-modules or sub-units or sub-components.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments.
As used herein, unless otherwise specified the use of the ordinal terms "first," "second," "third," etc., to describe a general object merely denote different instances of like objects, and are not intended to imply that the objects so described must have a given order, either temporally, spatially, in ranking, or in any other manner.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of the above description, will appreciate that other embodiments are contemplated within the scope of the invention as described herein. Furthermore, it should be noted that the language used in the specification has been principally selected for readability and instructional purposes, and may not have been selected to delineate or circumscribe the inventive subject matter.
Claims (10)
1. A method of making a diamond grinding head comprising:
obtaining multiple components of the low-temperature ceramic bond according to a first preset formula to prepare the low-temperature ceramic bond, wherein the multiple components of the low-temperature ceramic bond comprise: sodium oxide, bismuth oxide, boron oxide, silicon oxide, aluminum oxide, yttrium oxide, and calcium fluoride;
Obtaining a plurality of raw materials of the diamond grinding head according to a second preset formula, performing ball milling, and then adding a wetting agent for wetting to obtain a grinding head forming material, wherein the plurality of raw materials of the diamond grinding head comprise the low-temperature ceramic bonding agent, diamond micro powder, a pore-forming agent and dextrin;
cold press molding is carried out on the grinding head molding material to obtain a grinding head green body;
sintering the grinding head green body to obtain a grinding head cooked body;
and bonding the grinding head blank with a grinding head matrix, and solidifying to obtain the diamond grinding head.
2. The method of claim 1, wherein obtaining the plurality of components of the low temperature ceramic bond according to the first predetermined recipe to produce the low temperature ceramic bond comprises:
obtaining a plurality of components of the low-temperature ceramic bond according to a first preset formula, and performing ball milling to obtain a powdery bond material;
smelting the powdery binder material, and performing water quenching treatment to obtain a glass material;
ball milling the glass material and water with the same quality, and drying based on the first drying temperature to obtain the low-temperature ceramic bond.
3. The method of claim 2, wherein smelting the powdered binder material comprises:
Placing the powdery binder material into a box-type resistance furnace for smelting;
ball milling the glass material and water with the same quality, and drying based on a first drying temperature to obtain the low-temperature ceramic bond, wherein the ball milling process comprises the following steps:
and placing the glass frit and water with the same mass into a ball milling tank, adding grinding balls, performing ball milling based on a first ball milling rotating speed, and drying based on a first drying temperature to obtain the low-temperature ceramic bond, wherein the first ball milling rotating speed is 300-800 r/min.
4. A method according to any one of claims 1 to 3, wherein obtaining a plurality of raw materials of a diamond grinding head according to a second predetermined formulation and ball milling, and adding a wetting agent for wetting to obtain a grinding head forming material, comprises:
placing a plurality of raw materials of the diamond grinding head obtained according to a second preset formula into a ball milling tank, adding grinding balls, and performing ball milling based on a second ball milling rotating speed and a second ball milling time, wherein the second ball milling rotating speed is 300-800 r/min, and the second ball milling time is 30-50 min;
sieving multiple raw materials of the ball-milled diamond grinding head, dripping a wetting agent for wetting, uniformly mixing, and sieving to obtain the grinding head molding material.
5. The method of any of claims 1-4, wherein cold press molding the abrasive tip forming stock to obtain an abrasive tip green body comprises:
and carrying out cold press molding on the grinding head molding material through a die, and then carrying out demoulding and drying based on a second drying temperature to obtain a grinding head green body.
6. The method of any of claims 1-5, wherein cold press molding the millbase forming material comprises:
and carrying out cold press molding on the grinding head molding material based on the pressure of 100-150 Mpa, and maintaining the pressure for 20-30 s.
7. The method of any one of claims 1-6, wherein sintering the grinding bit green body to obtain a grinding bit green body comprises:
and placing the grinding head green body into a sintering furnace for sintering, heating to a sintering temperature based on a preset heating rate in the sintering process, and preserving heat for a second preset time to obtain a grinding head green body.
8. The method of claim 7, wherein,
the preset heating rate is 3-5 ℃/min, the sintering temperature is 600-750 ℃, and the second preset time is 3-5 h.
9. The method of any one of claim 1 to 8, wherein,
the first predetermined formulation includes a corresponding molar ratio of each component of the low temperature ceramic bond;
Wherein the molar ratio of the sodium oxide is 10 to 40mol%, the molar ratio of the bismuth oxide is 10 to 30mol%, the molar ratio of the boron oxide is 20 to 30mol%, the molar ratio of the silicon oxide is 1 to 10mol%, the molar ratio of the aluminum oxide is 1 to 10mol%, the molar ratio of the yttrium oxide is 1 to 10mol%, and the molar ratio of the calcium fluoride is 1 to 6mol%.
10. The method of any one of claim 1 to 9, wherein,
the second preset formula comprises the mass fraction of each raw material of the diamond grinding head;
wherein the mass fraction of the low-temperature ceramic bond is 10-40%, the mass fraction of the diamond micro powder is 40-60%, the mass fraction of the pore-forming agent is 1-10%, and the mass fraction of the dextrin is 1-5%.
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