CN110238765B - Ceramic bond for super-finishing grinding wheel and application thereof - Google Patents
Ceramic bond for super-finishing grinding wheel and application thereof Download PDFInfo
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- CN110238765B CN110238765B CN201910540985.XA CN201910540985A CN110238765B CN 110238765 B CN110238765 B CN 110238765B CN 201910540985 A CN201910540985 A CN 201910540985A CN 110238765 B CN110238765 B CN 110238765B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C17/00—Disintegrating by tumbling mills, i.e. mills having a container charged with the material to be disintegrated with or without special disintegrating members such as pebbles or balls
- B02C17/10—Disintegrating by tumbling mills, i.e. mills having a container charged with the material to be disintegrated with or without special disintegrating members such as pebbles or balls with one or a few disintegrating members arranged in the container
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/528—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from carbonaceous particles with or without other non-organic components
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
- C04B35/6316—Binders based on silicon compounds
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- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
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- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/349—Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite
Abstract
The invention provides a ceramic bond for a super-finishing grinding wheel and a preparation method and application thereof, aiming at the problems of a ceramic bond grinding wheel in the prior art, wherein the ceramic bond comprises the following components in percentage by weight: 25-50% of silicon dioxide powder, 5-10% of kaolin, 5-15% of nitrate powder, 5-15% of boron oxide powder, 2-8% of metal oxide powder and 2-10% of additive. The grinding wheel prepared by the ceramic bond has the characteristics of good self-sharpening property, high porosity, most of the grinding wheel is closed pores, and good grinding performance.
Description
Technical Field
The invention belongs to the technical field of super-finishing grinding wheels, and particularly relates to a ceramic bond for a super-finishing grinding wheel, and a preparation method and application thereof.
Background
In the information age of twenty-first century, electronic products are rapidly developed towards miniaturization, high performance and multifunction, the requirements on Integrated Circuit (IC) manufacturing technology are higher and higher, silicon wafers gradually tend to be large in diameter, but the silicon wafers are difficult to thin and grind due to the increase of the diameter. When a large-diameter silicon wafer is ground, the problems of large grinding damage, low surface precision, difficult automation control and the like exist, and high-quality and high-efficiency processing cannot be carried out. The grinding wheel prepared by the common ceramic bond has poor self-sharpening property and low porosity, has a large contact surface during grinding, is difficult to fall off, and is easy to wear, slide, scratch and the like on a workpiece, so that the processing quality of the workpiece is influenced.
Chinese patent CN 1938129B discloses a porous vitrified bond grinding wheel and a preparation method thereof, which can solve the self-sharpening problem of the grinding wheel to a certain extent, but the holes of the grinding wheel are mostly through holes, and because the holes are high, the impurities after grinding can permeate into the grinding wheel along with the holes, thereby affecting subsequent use.
Disclosure of Invention
The invention provides a ceramic bond for a super-finishing grinding wheel, a preparation method and application thereof, aiming at the problems of the ceramic bond grinding wheel in the prior art.
The invention adopts the following technical scheme:
a ceramic bond for a super-finishing grinding wheel comprises the following components in percentage by weight: 25-50% of silicon dioxide powder, 5-10% of kaolin, 5-15% of nitrate powder, 5-15% of boron oxide powder, 2-8% of metal oxide powder and 2-10% of additive.
Preferably, the nitrate powder is one or more of lithium nitrate, calcium nitrate and magnesium nitrate.
Preferably, the metal oxide powder is iron oxide and/or aluminum oxide.
Preferably, the additive is one or more of calcium carbonate, calcium bicarbonate, magnesium carbonate and sodium bicarbonate.
The preparation method of the ceramic bond for the ultra-precision grinding wheel comprises the steps of putting all raw materials into a ball milling tank, carrying out dry milling for 48-96 hours, adding water, carrying out wet milling for 96-150 hours, then sieving, standing for 48 hours, separating powder from water, drying the powder after water separation, and finally carrying out dry milling for 24-72 hours and sieving to obtain the ceramic bond powder for the ultra-precision grinding wheel.
Further, the drying process is specifically operative to: drying at 80-120 deg.C for 12-20 hr.
According to the application of the ceramic bond for the super-precision grinding wheel in the preparation of the diamond grinding wheel, the pores in the prepared diamond grinding wheel are closed pores.
The invention has the following beneficial effects:
1) the superfinishing grinding wheel prepared from the ceramic bond provided by the invention has the advantages that most of the air holes in the superfinishing grinding wheel are closed air holes, and the closed air holes are compared with the through holes, so that the grinding wheel has higher strength, and the service life of the grinding wheel is prolonged; and during high porosity, the piece after the grinding easily gets into the emery wheel inside, is unfavorable for subsequent grinding, and the emergence of this kind of condition can effectively be avoided to the obturator. According to the invention, by adding the additive, the porosity of the diamond grinding wheel tissue structure prepared by the bonding agent can reach 70%, and the use requirement of the grinding wheel ultra-precision grinding is met.
2) The ceramic bond of the invention selects silicon oxide and aluminum oxide, which form a network skeleton in the ceramic bond and play a basic supporting role, and the silicon oxide and the aluminum oxide are favorable for increasing the wettability to abrasive materials.
3) The ceramic bonding agent has the advantages of low cost of raw materials, simple preparation process and strong popularization applicability.
Drawings
FIG. 1 is a TGDSC curve of the vitrified bond obtained in example 2;
FIG. 2 is a diamond wheel made using the vitrified bond obtained in example 2;
FIG. 3 is a comparative schematic view of a prior art and the present invention of a diamond wheel-ground silicon wafer;
FIG. 4 is an atomic force three-dimensional photograph of a ground silicon wafer;
fig. 5 is an SEM image of the diamond wheel.
Detailed Description
In order to make the technical purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention are further described below with reference to the accompanying drawings and specific embodiments.
Example 1:
the ceramic bond for the super-finishing grinding wheel is prepared from the following raw materials in parts by weight:
preparing raw materials: 46kg of silicon dioxide powder, 9kg of kaolin, 9kg of calcium nitrate, 6kg of lithium nitrate, 14kg of boron oxide powder, 4kg of alumina, 2kg of ferric oxide, 6kg of calcium carbonate and 4kg of calcium bicarbonate.
The method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 80 hours;
2) adding water, and wet grinding for 110 hours;
3) sieving with a 270# sieve, standing for 48 hours, separating water from powder, and drying at 100 ℃ for 40 hours;
4) after being crushed, the mixture is ball milled for 60 hours and then sieved by a No. 325 sieve to prepare the required ceramic bond powder.
Example 2:
preparing raw materials: 48kg of silicon dioxide powder, 10kg of kaolin, 9kg of calcium nitrate, 6kg of lithium nitrate, 12kg of boron oxide powder, 2kg of alumina, 3kg of ferric oxide, 4kg of calcium carbonate and 6kg of calcium bicarbonate.
The method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 75 hours;
2) adding water, and wet grinding for 105 hours;
3) sieving with a 270# sieve, standing for 44 hours, separating water from powder, and drying at 100 ℃ for 40 hours;
4) then the powder is ground and ball-milled for 60 hours and then sieved by a No. 325 sieve to prepare the required ceramic bond powder.
The obtained ceramic bond powder is subjected to TGDSC test, the TGDSC curve spectrum is shown in figure 1, and it can be seen from the figure that the quality of the ceramic bond does not change along with the increase of the temperature, the endotherm is obvious at 620 ℃, and an endothermic peak begins to appear, which indicates that the bond begins to appear a liquid phase and melt, and indicates that the sintering temperature of the bond is about 623 ℃. The sintering temperature of the ceramic bond in the prior art is generally about 700 ℃, and the ceramic bond prepared by the invention can effectively reduce the sintering temperature.
Example 3:
preparing raw materials: 50kg of silicon dioxide powder, 8kg of kaolin, 6kg of calcium nitrate, 6kg of lithium nitrate, 13kg of boron oxide powder, 4kg of alumina, 3kg of ferric oxide, 5kg of calcium carbonate and 5kg of calcium bicarbonate.
The method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 80 hours;
2) adding water, and wet grinding for 110 hours;
3) then sieving, standing for 48 hours, separating water from the powder, and then drying for 40 hours at 100 ℃;
4) then the powder is ground and ball-milled for 60 hours, and then the powder is sieved to prepare the required ceramic bond powder.
Taking 50kg of the ceramic bond powder prepared in the embodiment 2 and 50kg of diamond micro powder with the granularity of 2-4 mu m, processing a diamond grinding wheel by adopting a conventional process, namely wetting the ceramic bond powder and the diamond micro powder by using resin liquid, uniformly mixing, performing cold press molding by using a mold, and sintering into a block body in a muffle furnace at 630 ℃ to obtain a grinding wheel block; the obtained grinding wheel block is processed to prepare a diamond grinding wheel, and as shown in fig. 2, SEM and porosity tests are performed on the diamond grinding wheel, and SEM images (fig. 5) and porosity (4 times of detection) of the structure of the diamond grinding wheel have the following detection results: it can be seen that the diamond grinding wheel is full of air holes in the tissue structure, the size of the air holes is uniform, most of the air holes are closed holes, and therefore the closed hole structure almost covers the whole tissue structure, the porosity is high, and a foundation is laid for improving the grinding quality.
TABLE 1 porosity test results for diamond wheel
The diamond grinding wheel obtained by the method is placed in a silicon wafer thinning grinding machine for experiment, the experimental result is shown in figure 3, meanwhile, the thinning result of the diamond grinding wheel in the prior art is used as a contrast, and the comparison in figure 3 shows that the surface of a silicon wafer (left figure) workpiece ground by the diamond grinding wheel prepared by the ceramic bond in the prior art has stripes with different degrees and presents the stripes in a shape of 'melon peel', while the silicon wafer (right figure) ground by the diamond grinding wheel prepared by the ceramic bond in the invention is more glossy and has better surface quality.
Furthermore, the atomic force detection is carried out on the ground silicon wafer, and the method is mainly used for detecting the roughness of the surface of the silicon wafer. As shown in FIG. 4, the silicon wafer ground by the diamond grinding wheel made of the ceramic bond of the present invention has a relatively flat surface and does not have too deep scratches (right drawing), while the diamond grinding wheel made of the ceramic bond of the prior art has too deep scratches on the surface of the workpiece, which results in poor surface quality of the workpiece and difficulty in performing the next process (left drawing).
Finally, it should be noted that: the above embodiments are merely illustrative and not restrictive of the technical solutions of the present invention, and any equivalent substitutions and modifications or partial substitutions made without departing from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. The ceramic bond for the ultra-precision grinding wheel is characterized by being used for preparing a diamond grinding wheel and specifically comprising the following components in percentage by weight: 46-50% of silicon dioxide powder, 5-10% of kaolin, 5-15% of nitrate powder, 5-15% of boron oxide powder, 2-8% of metal oxide powder and 2-10% of additive;
the nitrate powder is one or more of lithium nitrate, calcium nitrate and magnesium nitrate;
the metal oxide powder is ferric oxide and/or aluminum oxide;
the additive is one or more of calcium carbonate, calcium bicarbonate, magnesium carbonate and sodium bicarbonate;
the preparation method of the ceramic bond for the ultra-precision grinding wheel comprises the steps of putting all raw materials into a ball milling tank, carrying out dry milling for 48-96 hours, adding water, carrying out wet milling for 96-150 hours, then sieving, standing for 45-52 hours, separating powder from water, drying the powder after water separation, finally carrying out dry milling for 24-72 hours, and then sieving to obtain the ceramic bond powder for the ultra-precision grinding wheel.
2. The vitrified bond for an ultra-precision grinding wheel according to claim 1, wherein the drying process is specifically operated to: drying at 80-120 deg.C for 12-20 hr.
3. The vitrified bond for the ultra-precision grinding wheel of claim 1, which is prepared from the following raw materials in parts by weight:
46kg of silicon dioxide powder, 9kg of kaolin, 9kg of calcium nitrate, 6kg of lithium nitrate, 14kg of boron oxide powder, 4kg of alumina, 2kg of ferric oxide, 6kg of calcium carbonate and 4kg of calcium bicarbonate;
the method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 80 hours;
2) adding water, and wet grinding for 110 hours;
3) sieving with a 270# sieve, standing for 48 hours, separating water from powder, and drying at 100 ℃ for 40 hours;
4) after being crushed, the mixture is ball milled for 60 hours and then sieved by a No. 325 sieve to prepare the required ceramic bond powder.
4. The vitrified bond for the ultra-precision grinding wheel of claim 1, which is prepared from the following raw materials in parts by weight: 48kg of silicon dioxide powder, 10kg of kaolin, 9kg of calcium nitrate, 6kg of lithium nitrate, 12kg of boron oxide powder, 2kg of alumina, 3kg of ferric oxide, 4kg of calcium carbonate and 6kg of calcium bicarbonate;
the method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 75 hours;
2) adding water, and wet grinding for 105 hours;
3) sieving with a 270# sieve, standing for 44 hours, separating water from powder, and drying at 100 ℃ for 40 hours;
4) then the powder is ground and ball-milled for 60 hours and then sieved by a No. 325 sieve to prepare the required ceramic bond powder.
5. The vitrified bond for the ultra-precision grinding wheel of claim 1, which is prepared from the following raw materials in parts by weight: 50kg of silicon dioxide powder, 8kg of kaolin, 6kg of calcium nitrate, 6kg of lithium nitrate, 13kg of boron oxide powder, 4kg of alumina, 3kg of ferric oxide, 5kg of calcium carbonate and 5kg of calcium bicarbonate;
the method comprises the following specific steps:
1) putting the raw material powder into a ball milling tank, and carrying out dry milling for 80 hours;
2) adding water, and wet grinding for 110 hours;
3) then sieving, standing for 48 hours, separating water from the powder, and then drying for 40 hours at 100 ℃;
4) then the powder is ground and ball-milled for 60 hours, and then the powder is sieved to prepare the required ceramic bond powder.
6. Use of the vitrified bond for the ultra-precision grinding wheel according to any one of claims 1 to 5 in the production of a diamond grinding wheel.
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| CN115179204A (en) * | 2022-08-03 | 2022-10-14 | 深圳市永霖科技有限公司 | Resin grinding wheel and preparation method thereof |
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| CN103786102A (en) * | 2014-01-10 | 2014-05-14 | 当涂县南方红月磨具磨料有限公司 | Ceramic brown fused alumina abrasive wheel containing iron ore tailings |
| CN104493732A (en) * | 2014-12-26 | 2015-04-08 | 常熟市海虞砂轮有限责任公司 | Ceramic bond |
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| CN110238765A (en) | 2019-09-17 |
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