CN117479609A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN117479609A CN117479609A CN202310444771.9A CN202310444771A CN117479609A CN 117479609 A CN117479609 A CN 117479609A CN 202310444771 A CN202310444771 A CN 202310444771A CN 117479609 A CN117479609 A CN 117479609A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000005538 encapsulation Methods 0.000 claims abstract description 62
- 238000005520 cutting process Methods 0.000 claims abstract description 44
- 238000003698 laser cutting Methods 0.000 claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 7
- 230000004927 fusion Effects 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 120
- 239000010408 film Substances 0.000 description 36
- 238000005452 bending Methods 0.000 description 16
- 238000005245 sintering Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The utility model provides a display panel and manufacturing method of display panel, this display panel's manufacturing method is through forming cutting channel slot and at least one auxiliary groove in the periphery of encapsulation layer, auxiliary groove surrounds the display area and passes the region between the edge that is close to the terminal area of encapsulation layer and the terminal area, auxiliary groove part sets up in cutting channel slot's one side that is close to and/or keep away from the display area, cutting channel slot surrounds the relative both sides of the part and the terminal area of display area except for being close to the terminal area, laminate the polaroid on waiting to cut the display panel, then wait to cut the display panel and carry out the deaeration processing, in deaeration processing course, produce bubble and separation between polaroid and the protection film of cutting channel department, when waiting to cut the base plate and carry out laser cutting, can avoid taking place the fusion knot between polaroid and the protection film, so can solve the difficult problem of tearing of protection film, thereby can improve display panel's yield, reduction in production cost.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel and a method for manufacturing the display panel.
Background
In recent years, with the technical development of smart terminal devices and wearable devices, the demands for flat panel displays are increasingly diversified. For example, an Organic Light-Emitting Diode (OLED) display has self-luminous characteristics, and is more energy-saving compared with a liquid crystal display in which a backlight module is omitted.
At present, the manufacturing of the display panel is to make an integral process on a motherboard and then cut and separate, further complete a back-end module process, take a flexible display panel as an example, form a plurality of flexible display panels on the motherboard, then cut the motherboard to form an independent flexible display panel, and then cut the independent flexible display panel secondarily according to the appearance of an actual product in a laser cutting mode and the appearance of the actual product. However, due to the high heat energy of the laser beam, the cut polaroid and the material of the protective film are sintered easily, so that the protective film is difficult to tear, the yield loss of the OLED display panel is caused, and the production cost is increased.
Therefore, it is necessary to provide a display panel and a method for manufacturing the display panel to improve the defect.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method of the display panel, which can solve the problem of material sintering of a polaroid and a protective film caused by laser cutting, thereby improving the yield of the display panel and reducing the production cost.
The embodiment of the application provides a display panel, which comprises a display area, a terminal area positioned at one side of the display area, a substrate, a circuit layer, a retaining wall and an encapsulation layer, wherein the circuit layer, the retaining wall and the encapsulation layer are sequentially stacked on the substrate, the retaining wall surrounds the display area, and the encapsulation layer is continuously distributed at one sides of the display area and the retaining wall, which are far away from the display area;
wherein, the region between the edge of the encapsulation layer close to the terminal region and the terminal region is provided with an auxiliary groove.
According to an embodiment of the application, the display panel further includes a flat layer, the flat layer is disposed on the circuit layer, the retaining wall is disposed on the flat layer, and the auxiliary trench penetrates through the flat layer.
According to an embodiment of the application, the display panel further includes a bending region, the bending region is located at one side of the terminal region, which is close to the display region, and the auxiliary trench is at least disposed between an edge of the encapsulation layer, which is close to the bending region, and the bending region.
According to an embodiment of the application, the auxiliary trench surrounds the display area.
According to an embodiment of the present application, the display panel includes an anti-crack groove disposed between the auxiliary groove and an edge of the encapsulation layer, the anti-crack groove surrounding a portion of the display region other than being close to the terminal region.
According to an embodiment of the present application, the display panel further includes a sealant layer disposed at one end of the display area near the terminal area, and filling at least part of the auxiliary grooves.
According to an embodiment of the present application, the width of the auxiliary groove is greater than or equal to 100 micrometers and less than or equal to 300 micrometers.
According to an embodiment of the present application, the display panel further includes a polarizer, and in a thickness direction of the display panel, the polarizer is not overlapped with the auxiliary groove between an edge of the encapsulation layer near the terminal region and the terminal region.
The embodiment of the application also provides a manufacturing method of a display panel, the manufacturing method of the display panel is used for manufacturing the display panel provided by any one of the embodiments, the display panel is formed by cutting a display panel to be cut, the display panel to be cut comprises a display area and a terminal area arranged on one side of the display area, the display panel to be cut further comprises a substrate, a circuit layer, a retaining wall and a packaging layer, the circuit layer, the retaining wall and the packaging layer are sequentially stacked on the substrate, the retaining wall surrounds the display area, the packaging layer is continuously distributed on one side, away from the display area, of the retaining wall, and the manufacturing method of the display panel comprises the following steps:
forming a dicing channel groove and at least one auxiliary groove on the periphery of the encapsulation layer, the auxiliary groove surrounding the display region and passing through a region between an edge of the encapsulation layer near the terminal region and the terminal region, the auxiliary groove portion being disposed on one side of the dicing channel groove near and/or away from the display region, the dicing channel groove surrounding a portion of the display region other than near the terminal region and opposite sides of the terminal region;
attaching a polaroid to the display panel to be cut, wherein a protective film is attached to the polaroid;
defoaming the display panel to be cut;
performing laser cutting on the display panel to be cut along a cutting path, wherein the cutting path corresponds to the cutting channel groove; and
and stripping the protective film.
According to an embodiment of the present application, the width of the auxiliary groove is greater than the width of the dicing street groove.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display panel and a manufacturing method of the display panel, through forming a cutting channel groove and at least one auxiliary groove at the periphery of a packaging layer, the auxiliary groove surrounds a display area and penetrates through an area between the edge of the packaging layer, which is close to a terminal area, and a terminal area of the packaging layer, wherein the auxiliary groove is partially arranged at one side of the cutting channel groove, which is close to and/or far away from the display area, the cutting channel groove surrounds the part, except for the terminal area, of the display area and the two opposite sides of the terminal area, a polaroid is attached to the display panel to be cut, then the display panel to be cut is subjected to defoamation treatment, in the defoamation treatment process, bubbles are generated between the polaroid at the cutting channel and a protective film, when the substrate to be cut is subjected to laser cutting, fusion bonding between the polaroid and the protective film can be avoided, so that the problem that the protective film is difficult to tear can be solved, and the yield of the display panel can be improved, and the production cost can be reduced.
Drawings
Fig. 1 is a schematic plan view of a display panel to be cut according to a first embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of the display panel to be cut shown in FIG. 1 along the direction A-A
Fig. 3 is a flowchart illustrating a method for manufacturing a display panel according to a first embodiment of the present disclosure;
fig. 4 is a schematic plan view of a display panel according to a first embodiment of the present application;
FIG. 5 is a cross-sectional view of the display panel shown in FIG. 4 along the direction A-A';
fig. 6 is a schematic structural diagram of a display panel after bending according to the first embodiment of the present application;
fig. 7 is a schematic plan view of a display panel to be cut according to a second embodiment of the present disclosure;
FIG. 8 is a cross-sectional view of the display panel to be cut shown in FIG. 7 along the direction A-A
Fig. 9 is a schematic plan view of a display panel according to a second embodiment of the present application;
fig. 10 is a cross-sectional view of the display panel shown in fig. 9 along A-A'.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals.
The present application is further described below with reference to the drawings and specific examples.
The embodiment of the application provides a display panel and a manufacturing method of the display panel, which can solve the problem of material sintering of a polaroid and a protective film caused by laser cutting, thereby improving the yield of the display panel and reducing the production cost.
Referring to fig. 4, the display panel includes a display area AA and a terminal area PA located at one side of the display area AA.
Specifically, the display panel may include a display area AA and a non-display area NA disposed around the display area AA, where the display area AA may be used for displaying a picture image, and a plurality of sub-pixels distributed in an array may be disposed in the display area AA, and each sub-pixel may be controlled to emit light independently by a pixel driving circuit.
The non-display area NA does not have an image display function, and the non-display areas NA at different positions have different roles. Taking the schematic plan view of the display panel shown in fig. 4 as an example, the non-display area NA located at the left and right sides of the display area AA may be used for placing the gate driving circuit and other signal traces, and the non-display area NA located below the display area AA may be used for placing the source driving circuit, fan-out traces, terminals, etc.
The terminal area PA is part of the non-display area NA and is located below the display area AA. A plurality of terminals may be disposed in the terminal area PA, and at least one of the driving chip, the touch chip, the flexible circuit board, or the printed circuit board may be connected to the display panel through the terminals in the bonding area PA.
Referring to fig. 5, the display panel includes a substrate 10, a circuit layer 11, a wall 12 and an encapsulation layer 13 sequentially stacked on the substrate, wherein the wall 12 surrounds a display area AA, and the encapsulation layer 13 is continuously distributed on the display area AA and one side of the wall 12 facing away from the display area AA.
In the present embodiment, the display panel is an organic light emitting diode display panel, and in the display area AA, the display panel may further include, but is not limited to, a first electrode layer 14, a light emitting layer 15, a common layer 16, and a second electrode layer 17 sequentially stacked on the circuit layer 11. The circuit layer 11 may have a plurality of pixel driving circuits therein, each of which may include at least one thin film transistor, and the pixel driving circuits are electrically connected to the first electrode layer 14.
Further, the display panel may further include an optical coupling layer 18 and an anti-reflection layer 19, the optical coupling layer 18 is disposed on the surface of the cathode layer 17, the anti-reflection layer 19 is disposed on the surface of the light-out coupling layer 18 facing away from the second electrode layer 17, and the material of the anti-reflection layer 19 may be, but is not limited to, lithium fluoride (LiF). The light-out coupling layer 18 of the display panel is protected by the anti-reflection layer 19, and the light-out efficiency of the display panel is improved together with the light-out coupling layer 18.
In this embodiment, the retaining wall 12 is a closed annular structure, and the retaining wall 12 is disposed at the periphery of the display area AA to form a complete enclosure for the display area AA. The display panel may include 1 or 2 or more barriers, and the plurality of barriers 12 may surround the periphery of the display area AA layer by layer.
The encapsulation layer 13 is a thin film encapsulation structure composed of at least two inorganic layers and an organic layer assumed between the adjacent two inorganic layers. For example, as shown in fig. 2, the encapsulation layer 13 includes a first inorganic encapsulation layer 131, an organic encapsulation layer 132 and a second inorganic encapsulation layer 133, where the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 are continuously distributed on the display area AA and a side of the barrier wall 12 facing away from the display area AA, and the organic encapsulation layer 132 is blocked on a side of the barrier wall 12 adjacent to the display area AA.
The first and second inorganic encapsulation layers 131 and 133 may each be formed of an inorganic material, which may be, but is not limited to, any one or a combination of silicon nitride, silicon oxide, or silicon oxynitride, by chemical vapor deposition. The organic encapsulation layer 132 may be formed of a transparent organic material having fluidity by inkjet printing or other means.
The display panel further includes a polarizer 35, and the polarizer 35 is disposed on the encapsulation layer 13. It should be noted that, the polarizer 35 being disposed on the encapsulation layer 13 means that the polarizer 35 is disposed on the encapsulation layer 13 and is attached to the surface of the encapsulation layer 13 through optical cement.
In the present embodiment, the region of the encapsulation layer 13 near the edge of the terminal area PA and between the terminal area PA is provided with the auxiliary trench 20.
It should be noted that, as shown in fig. 1 to 5, the display panel provided in this embodiment is formed by cutting a display panel to be cut, on which a scribe line groove 22 and an auxiliary groove 20 are formed, the auxiliary groove 20 surrounds the display area AA and passes through the area between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, the scribe line groove 22 surrounds a portion of the display area AA, the polarizer 35 covers the scribe line groove 22 and a portion of the auxiliary groove 20, and the protective film 36 is attached to the surface of the polarizer 35.
Specifically, the scribe line grooves 22 surround the portion of the display area AA other than the portion near the terminal area PA and the opposite sides of the terminal area PA. At both left and right ends and upper ends of the display area AA, the scribe line grooves 22 are located between the auxiliary grooves 20 and the display area AA, and the polarizer 35 may cover all the scribe line grooves 22 and be attached to the top surfaces of the banks protruding from both sides of the scribe line grooves 22. The polarizer 35 covers the other portion of the auxiliary groove 20 except the auxiliary groove 20 located at the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, and the polarizer 35 may be attached to the top surface of the bank protruding from both sides of the auxiliary groove 20, i.e., the polarizer 35 does not overlap the auxiliary groove 20 located between the edge of the encapsulation layer 13 near the terminal area BA and the terminal area BA in the thickness direction of the display panel. Under this structure, auxiliary groove 20 can communicate with external environment, cutting way slot 22 is not with external environment intercommunication, when the deaeration is carried out to the display panel, the air can get into auxiliary groove 20 to by auxiliary groove 20 to adjacent cutting way slot 22 extrusion, because the viscidity between polaroid 35 and the display panel is greater than the viscidity between protection film 36 and the polaroid 35, under the effect of atmospheric pressure, can make the polaroid 35 of cutting way slot 22 department and protection film 36 produce the bubble and separate, so can laser cutting in-process cutting way slot 22 department polaroid 35 and protection film 36 take place the sintering, thereby can solve the difficult problem of tearing of protection film.
After the display panel to be cut is cut along the scribe line grooves 22, the auxiliary grooves 20 located outside the scribe line grooves 22 are cut off, and the auxiliary grooves 20 located in the region of the encapsulation layer 13 between the edge near the terminal area PA and the terminal area PA may remain.
Further, the display panel further includes a bending area BA, the bending area BA is located at a side of the terminal area PA near the display area AA, and the auxiliary trench 20 is at least disposed between an edge of the encapsulation layer 13 near the bending area BA and the bending area BA.
In the final structure of the display panel, as shown in fig. 6, the bending area BA is configured to bend into a circular arc shape, the terminal area PA is configured to bend to the back of the display panel, and the auxiliary trench 20 is located between the edge of the encapsulation layer 13 near the bending area BA and the bending area BA.
Specifically, the display panel further includes a back plate 31, a spacer layer 32 disposed at the bottom of the back plate 31, a metal support plate 33, and a heat dissipation composite layer 34, where the display panel may further include an ultra-thin glass 37 and a cover plate 39, the ultra-thin glass 37 is attached to the polarizer 35 through a first optical adhesive layer 36, and the cover plate 39 is attached to the ultra-thin glass 37 through a second optical adhesive layer 38.
Further, as shown in fig. 2, the width d1 of the auxiliary groove 20 is greater than or equal to the width d2 of the scribe line groove 22, so that the separation position of the protective film 36 and the polarizer 35 is concentrated in the scribe line groove 22, and the protective film 36 and the polarizer 35 at the scribe line groove 22 are prevented from sintering during the laser cutting process.
Further, the width d1 of the auxiliary grooves 20 is greater than or equal to 100 microns and less than or equal to 300 microns, and the width d2 of the dicing street grooves 22 is greater than or equal to 100 microns and less than or equal to 200 microns.
In one embodiment, the width d1 of the auxiliary trench 20 is 200 microns and the width d2 of the scribe line trench 22 is 150 microns. In other embodiments, the width d1 of the auxiliary groove 20 is not limited to 200 micrometers, but may be 100 micrometers, 150 micrometers, 250 micrometers, 300 micrometers, etc., and the width d2 of the scribe line groove 22 is not limited to 150 micrometers, but may be 100 micrometers, 125 micrometers, 175 micrometers, 200 micrometers, etc., as long as it is less than or equal to the width d1 of the auxiliary groove 20.
Further, a distance d3 between the auxiliary grooves 20 and the dicing street grooves 22 is greater than or equal to 200 micrometers and less than or equal to 1000 micrometers.
In the present embodiment, the distance d3 between the auxiliary groove 20 and the scribe line groove 22 is 300 micrometers, and in practical application, the distance d3 between the auxiliary groove 20 and the scribe line groove 22 is not limited to 300 micrometers in the above embodiment, but may be 200 micrometers, 500 micrometers, 800 micrometers, 1000 micrometers, or the like, and only needs to be between 200 micrometers and 1000 micrometers. Therefore, on one hand, the width of the display panel frame can be reduced, and on the other hand, the situation that the polarizer 35 and the protective film 36 cannot be separated in the defoaming process due to the fact that the tension is evenly distributed due to the fact that the distance between the auxiliary groove 20 and the cutting channel groove 22 is too long can be avoided.
Further, the display panel further includes a planarization layer 21, the planarization layer 21 is disposed on the circuit layer 11, the retaining wall is disposed on the planarization layer, the auxiliary trench 20 penetrates the planarization layer 21, and the scribe line trench 22 also penetrates the planarization layer 21.
In one embodiment, the number of the flat layers 21 disposed on the circuit layer 11 may be 1, 2 or 3 or more, and the auxiliary grooves 20 and the scribe line grooves 22 may penetrate through the flat layers of 1, 2 or 3 or more, and the depths of the auxiliary grooves 20 and the scribe line grooves 22 may be the same or different, which is not limited herein.
Further, the display panel includes a crack-resistant trench 110, and the crack-resistant trench 110 is disposed in the non-display area BA and partially surrounds the display area AA.
As shown in fig. 4 and 5, the anti-cracking groove 110 is disposed at the periphery of the display area AA and is located at a side of the retaining wall 12 away from the display area AA, and an edge of the encapsulation layer 13 is located at a side of the anti-cracking groove 110 close to the display area AA. The crack-resistant groove 110 may be disposed along an edge of the display area AA except for a portion near the terminal area PA, and the region between the terminal area PA and the display area AA is not provided with the crack-resistant groove 110.
In this embodiment, a plurality of inorganic insulating layers, such as a gate insulating layer, an interlayer dielectric layer, a passivation protecting layer, etc., may be further disposed on the substrate 10, the inorganic insulating layers may be entirely laid on the substrate 10, the anti-cracking trench 110 may be opened on the passivation protecting layer, or opened on the passivation protecting layer and continuously extended into the inorganic insulating layers such as the interlayer dielectric layer or the gate insulating layer, etc., and the anti-cracking trench 110 may be used to prevent cracks generated by the inorganic layers at the cutting edge from diffusing into the first inorganic encapsulation layer 131 and the second inorganic encapsulation layer 133 during the cutting process.
Further, as shown in fig. 6, the display panel further includes a sealant layer 40, where the sealant layer 40 is disposed at an end of the display area AA near the terminal area PA, and fills at least part of the auxiliary trench 20.
Specifically, the sealant layer 40 is disposed in the bending area BA and the side of the bending area BA near the display area AA and the terminal area PA. The sealant layer 40 can be formed by solidifying ultraviolet light curing glue, and the solidified sealant layer 40 can maintain the bending shape of the bending area BA on one hand, and can fill the auxiliary groove 20 on the other hand, so that the damage to the internal devices of the display panel caused by the invasion of water vapor and oxygen in the external environment through the auxiliary groove 2 is avoided.
Referring to fig. 9 and 10, the structure of the display panel according to the second embodiment is substantially the same as that of the display panel according to the first embodiment, except that: the second embodiment provides a display panel with the auxiliary trench 20 having a closed ring structure and surrounding the display area AA.
As shown in fig. 7 and 8, the display panel provided in this embodiment is cut from a display panel to be cut, a scribe line groove 22 and an auxiliary groove 20 are formed on the display panel to be cut, the auxiliary groove 20 surrounds the display area AA and passes through the area between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, the scribe line groove 22 is disposed on one side of the auxiliary groove 20 facing away from the display area AA and surrounds the left and right ends and the upper ends of the display area AA and the left and right ends of the terminal area PA, the polarizer 35 covers the scribe line groove 22 and part of the auxiliary groove 20, and the protective film 36 is attached to the surface of the polarizer 35.
Specifically, the scribe line grooves 22 surround the portion of the display area AA other than the portion near the terminal area PA and the opposite sides of the terminal area PA. At both right and left ends and the upper end of the display area AA, the scribe line grooves 22 are located at one side of the auxiliary groove 20 away from the display area AA, and the polarizer 35 may cover all the scribe line grooves 22 and be attached to the top surfaces of the banks protruding from both sides of the scribe line grooves 22. The polarizer 35 covers the other portion of the auxiliary groove 20 except the auxiliary groove 20 located at the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, and the polarizer 35 may be attached to the top surface of the bank protruding from both sides of the auxiliary groove 20, i.e., the polarizer 35 does not overlap the auxiliary groove 20 located between the edge of the encapsulation layer 13 near the terminal area BA and the terminal area BA in the thickness direction of the display panel. Under this structure, auxiliary groove 20 can communicate with external environment, cutting way slot 22 is not with external environment intercommunication, when the deaeration is carried out to the display panel, the air can get into auxiliary groove 20 to by auxiliary groove 20 to adjacent cutting way slot 22 extrusion, because the viscidity between polaroid 35 and the display panel is greater than the viscidity between protection film 36 and the polaroid 35, under the effect of atmospheric pressure, can make the polaroid 35 of cutting way slot 22 department and protection film 36 produce the bubble and separate, so can laser cutting in-process cutting way slot 22 department polaroid 35 and protection film 36 take place the sintering, thereby can solve the difficult problem of tearing of protection film.
As shown in fig. 7 to 10, after the display panel to be cut is cut along the dicing street grooves 22, the portion of the periphery of the dicing street 20 may be cut off, and a circle of auxiliary grooves 20 around the periphery of the display area AA may remain.
The embodiment of the application also provides a manufacturing method of a display panel, where the manufacturing method of the display panel is used for manufacturing and forming the display panel provided by any one of the embodiments, the display panel is formed by cutting a display panel to be cut, the display panel to be cut includes a display area AA and a terminal area PA disposed at one side of the display area AA, the display panel to be cut further includes a substrate 10, and a circuit 11 layer, a retaining wall 12 and an encapsulation layer 13 sequentially stacked on the substrate 10, the retaining wall 12 surrounds the display area AA, the encapsulation layer 13 is continuously distributed at one sides of the display area AA and the retaining wall 12, which are far away from the display area AA, and the manufacturing method of the display panel includes:
step S10: a dicing channel groove 22 and at least one auxiliary groove 20 are formed at the periphery of the encapsulation layer, the auxiliary groove 20 surrounds the display area AA and passes through the area between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, the auxiliary groove 20 is partially disposed at one side of the dicing channel groove 22 near and/or far from the display area AA, and the dicing channel groove 22 surrounds the portion of the display area AA except for the near terminal area PA and the opposite sides of the terminal area PA.
Step S20: attaching a polaroid 35 to the display panel to be cut, wherein a protective film 36 is attached to the polaroid 35;
step S30: defoaming treatment is carried out on the display panel to be cut;
step S40: performing laser cutting on the display panel to be cut along a cutting path, wherein the cutting path corresponds to the cutting channel groove 22; and
step S50: the protective film 36 is peeled off.
In one embodiment, the auxiliary trench 20 is partially disposed on a side of the scribe line trench 22 near the display area AA.
As shown in fig. 1 and 2, a scribe line groove 22 and an auxiliary groove 20 are formed on the display panel to be cut, the auxiliary groove 20 surrounds the display area AA, and passes through the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, the scribe line groove 22 surrounds a portion of the display area AA, and the polarizer 35 covers the scribe line groove 22 and a portion of the auxiliary groove 20. Specifically, the scribe line grooves 22 surround the portion of the display area AA other than the portion near the terminal area PA and the opposite sides of the terminal area PA. At the left and right ends and the upper end of the display area AA, the scribe line grooves 22 are located between the auxiliary grooves 20 and the display area AA.
Specifically, the scribe line grooves 22 surround the portion of the display area AA other than the portion near the terminal area PA and the opposite sides of the terminal area PA. At both left and right ends and upper ends of the display area AA, the scribe line grooves 22 are located between the auxiliary grooves 20 and the display area AA, and the polarizer 35 may cover all the scribe line grooves 22 and be attached to the top surfaces of the banks protruding from both sides of the scribe line grooves 22. The polarizer 35 covers the other portion of the auxiliary groove 20 except the auxiliary groove 20 located at the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, and the polarizer 35 may be attached to the top surface of the bank protruding from both sides of the auxiliary groove 20, i.e., the polarizer 35 does not overlap the auxiliary groove 20 located between the edge of the encapsulation layer 13 near the terminal area BA and the terminal area BA in the thickness direction of the display panel. Under this structure, auxiliary groove 20 can communicate with external environment, cutting way slot 22 is not with external environment intercommunication, when the deaeration is carried out to the display panel, the air can get into auxiliary groove 20 to by auxiliary groove 20 to adjacent cutting way slot 22 extrusion, because the viscidity between polaroid 35 and the display panel is greater than the viscidity between protection film 36 and the polaroid 35, under the effect of atmospheric pressure, can make the polaroid 35 of cutting way slot 22 department and protection film 36 produce the bubble and separate, so can laser cutting in-process cutting way slot 22 department polaroid 35 and protection film 36 take place the sintering, thereby can solve the difficult problem of tearing of protection film.
After the display panel to be cut is cut along the scribe line grooves 22, the auxiliary grooves 20 located outside the scribe line grooves 22 are cut off, and the auxiliary grooves 20 located in the region of the encapsulation layer 13 between the edge near the terminal area PA and the terminal area PA may remain.
In one embodiment, the auxiliary trench 20 is partially disposed on a side of the scribe line trench 22 away from the display area AA.
As shown in fig. 7 and 8, a scribe line groove 22 and an auxiliary groove 20 are formed on the display panel to be cut, the auxiliary groove 20 surrounds the display area AA and passes through the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, the scribe line groove 22 is disposed at one side of the auxiliary groove 20 facing away from the display area AA and surrounds the left and right ends and upper ends of the display area AA and the left and right ends of the terminal area PA, the polarizer 35 covers the scribe line groove 22 and part of the auxiliary groove 20, and the protective film 36 is attached to the surface of the polarizer 35.
Specifically, the scribe line grooves 22 surround the portion of the display area AA other than the portion near the terminal area PA and the opposite sides of the terminal area PA. At both right and left ends and the upper end of the display area AA, the scribe line grooves 22 are located at one side of the auxiliary groove 20 away from the display area AA, and the polarizer 35 may cover all the scribe line grooves 22 and be attached to the top surfaces of the banks protruding from both sides of the scribe line grooves 22. The polarizer 35 covers the other portion of the auxiliary groove 20 except the auxiliary groove 20 located at the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, and the polarizer 35 may be attached to the top surface of the bank protruding from both sides of the auxiliary groove 20, i.e., the polarizer 35 does not overlap the auxiliary groove 20 located between the edge of the encapsulation layer 13 near the terminal area BA and the terminal area BA in the thickness direction of the display panel. Under this structure, auxiliary groove 20 can communicate with external environment, cutting way slot 22 is not with external environment intercommunication, when the deaeration is carried out to the display panel, the air can get into auxiliary groove 20 to by auxiliary groove 20 to adjacent cutting way slot 22 extrusion, because the viscidity between polaroid 35 and the display panel is greater than the viscidity between protection film 36 and the polaroid 35, under the effect of atmospheric pressure, can make the polaroid 35 of cutting way slot 22 department and protection film 36 produce the bubble and separate, so can laser cutting in-process cutting way slot 22 department polaroid 35 and protection film 36 take place the sintering, thereby can solve the difficult problem of tearing of protection film.
As shown in fig. 7 to 10, after the display panel to be cut is cut along the dicing street grooves 22, the portion of the periphery of the dicing street 20 may be cut off, and a circle of auxiliary grooves 20 around the periphery of the display area AA may remain.
In one embodiment, the auxiliary grooves 20 may be disposed on both the inner and outer sides of the scribe line groove 22, and the two auxiliary grooves 20 may be joined to form one groove in the region between the edge of the encapsulation layer 13 near the terminal area PA and the terminal area PA, and after the display panel to be diced is diced along the scribe line groove 22, the display panel as shown in fig. 9 may be formed.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display panel and a manufacturing method of the display panel, through forming a cutting channel groove and at least one auxiliary groove at the periphery of a packaging layer, the auxiliary groove surrounds a display area and penetrates through an area between the edge of the packaging layer, which is close to a terminal area, and a terminal area of the packaging layer, wherein the auxiliary groove is partially arranged at one side of the cutting channel groove, which is close to and/or far away from the display area, the cutting channel groove surrounds the part, except for the terminal area, of the display area and the two opposite sides of the terminal area, a polaroid is attached to the display panel to be cut, then the display panel to be cut is subjected to defoamation treatment, in the defoamation treatment process, bubbles are generated between the polaroid at the cutting channel and a protective film, when the substrate to be cut is subjected to laser cutting, fusion bonding between the polaroid and the protective film can be avoided, so that the problem that the protective film is difficult to tear can be solved, and the yield of the display panel can be improved, and the production cost can be reduced.
In summary, although the present application discloses the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the application, so the scope of the application is defined by the claims.
Claims (10)
1. The display panel is characterized by comprising a display area, a terminal area positioned at one side of the display area, a substrate, a circuit layer, a retaining wall and an encapsulation layer, wherein the circuit layer, the retaining wall and the encapsulation layer are sequentially arranged on the substrate in a stacked mode, the retaining wall surrounds the display area, and the encapsulation layer is continuously distributed at one sides of the display area and the retaining wall, which are away from the display area;
wherein, the region between the edge of the encapsulation layer close to the terminal region and the terminal region is provided with an auxiliary groove.
2. The display panel of claim 1, further comprising a planarization layer disposed on the circuit layer, the retaining wall disposed on the planarization layer, the auxiliary trench extending through the planarization layer.
3. The display panel of claim 1, further comprising a inflection region located on a side of the terminal region adjacent to the display region, the auxiliary trench being disposed at least between an edge of the encapsulation layer adjacent to the inflection region and the inflection region.
4. The display panel of claim 1, wherein the auxiliary trench surrounds the display region.
5. The display panel of claim 4, wherein the display panel includes a crack resistant trench disposed between the auxiliary trench and an edge of the encapsulation layer, the crack resistant trench surrounding a portion of the display region other than proximate the terminal region.
6. The display panel of claim 1, further comprising a sealant layer disposed at an end of the display region proximate to the terminal region and filling at least a portion of the auxiliary trench.
7. The display panel of claim 1, wherein the auxiliary trench has a width greater than or equal to 100 microns and less than or equal to 300 microns.
8. The display panel of claim 1, further comprising a polarizer that does not overlap the auxiliary groove between an edge of the encapsulation layer near the terminal region and the terminal region in a thickness direction of the display panel.
9. The manufacturing method of the display panel is characterized in that the display panel is formed by cutting a display panel to be cut, the display panel to be cut comprises a display area and a terminal area arranged on one side of the display area, the display panel to be cut further comprises a substrate, a circuit layer, a retaining wall and a packaging layer which are sequentially stacked on the substrate, the retaining wall surrounds the display area, the packaging layer is continuously distributed on one side, away from the display area, of the display area and one side, away from the display area, of the retaining wall, and the manufacturing method of the display panel comprises the following steps:
forming a dicing channel groove and at least one auxiliary groove on the periphery of the encapsulation layer, the auxiliary groove surrounding the display region and passing through a region between an edge of the encapsulation layer near the terminal region and the terminal region, the auxiliary groove portion being disposed on one side of the dicing channel groove near and/or away from the display region, the dicing channel groove surrounding a portion of the display region other than near the terminal region and opposite sides of the terminal region;
attaching a polaroid to the display panel to be cut, wherein a protective film is attached to the polaroid;
defoaming the display panel to be cut;
performing laser cutting on the display panel to be cut along a cutting path, wherein the cutting path corresponds to the cutting channel groove; and
and stripping the protective film.
10. The method of claim 9, wherein the auxiliary grooves have a width greater than a width of the scribe line grooves.
Priority Applications (1)
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CN202310444771.9A CN117479609A (en) | 2023-04-24 | 2023-04-24 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202310444771.9A CN117479609A (en) | 2023-04-24 | 2023-04-24 | Display panel and manufacturing method thereof |
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CN117479609A true CN117479609A (en) | 2024-01-30 |
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CN202310444771.9A Pending CN117479609A (en) | 2023-04-24 | 2023-04-24 | Display panel and manufacturing method thereof |
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- 2023-04-24 CN CN202310444771.9A patent/CN117479609A/en active Pending
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