CN117479521B - Electromagnetic shielding structure of wave-transparent material - Google Patents
Electromagnetic shielding structure of wave-transparent material Download PDFInfo
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- CN117479521B CN117479521B CN202311819556.9A CN202311819556A CN117479521B CN 117479521 B CN117479521 B CN 117479521B CN 202311819556 A CN202311819556 A CN 202311819556A CN 117479521 B CN117479521 B CN 117479521B
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- 239000012780 transparent material Substances 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 36
- 230000000737 periodic effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 16
- 239000005341 toughened glass Substances 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000012937 correction Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 16
- 239000011521 glass Substances 0.000 abstract description 16
- 230000004044 response Effects 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses an electromagnetic shielding structure of a wave-transparent material, which is characterized in that: the electromagnetic shielding layer is arranged on the outer surface of the dielectric substrate layer, and the metal pattern layers are arranged in a periodic equidistant array by metal pattern units. According to the invention, the metal pattern circuits which are periodically and equally arranged on the surface of the wave-transmitting material in the sub-wavelength are utilized to generate specific response to the incident electromagnetic wave, so that the equivalent dielectric constant of the glass is changed, the equivalent wave impedance in the glass medium is matched with the wave impedance in the air, the electromagnetic wave transmission performance of the specific electromagnetic wave in the specific frequency band in the incoming wave direction is effectively reduced, and the electromagnetic shielding function of the wave-transmitting material is realized.
Description
Technical Field
The invention belongs to the technical field of electromagnetic communication and the field of novel artificial electromagnetic materials, and particularly relates to a structure for realizing electromagnetic shielding of a wave-transmitting material, which can effectively reduce the electromagnetic wave transmission performance of a specific electromagnetic wave in a specific frequency band in a specific incoming wave direction, thereby realizing the electromagnetic shielding function of the wave-transmitting material.
Background
The new generation of mobile communication technology has greatly improved speed, time delay, connection number and mobility. However, since the increase of the frequency causes the reduction of the wavelength, many influences which are not considered in the prior-generation mobile communication cannot be simply ignored, such as reflection characteristics and transmission loss when electromagnetic waves penetrate through dielectric layers of walls, windows and the like, and interference problems of various electromagnetic signals existing in space.
In order to effectively alleviate the problems of co-channel interference and the like in a communication system, novel electromagnetic shielding has been attracting attention of researchers in recent years. The development of the metamaterial and the super surface field provides a solution for solving the problem of co-channel interference: the equivalent dielectric constant and the equivalent magnetic permeability of the wave-transparent material can be regulated and controlled by attaching the periodically arranged metal patterns on the wave-transparent material, so that electromagnetic shielding of electromagnetic waves is possible under the condition that the wave-transparent material is obliquely incident at a large angle.
Disclosure of Invention
The invention aims to: in order to effectively reduce the transmission performance of electromagnetic waves of the wave-transmitting material, the invention provides a structure for realizing electromagnetic shielding of the wave-transmitting material. The metal pattern circuits which are periodically and equally arranged on the surface of the wave-transmitting material in the sub-wavelength period are utilized to generate specific response to the incident electromagnetic wave, so that the equivalent dielectric constant of the glass is changed, the equivalent wave impedance in the glass medium is matched with the wave impedance in the air, the electromagnetic wave transmission performance of the specific electromagnetic wave in the specific frequency band in the incoming wave direction is effectively reduced, and the electromagnetic shielding function of the wave-transmitting material is realized.
In order to solve the technical problems, the invention adopts the following technical scheme: the electromagnetic shielding structure comprises a medium substrate layer and an electromagnetic shielding layer arranged on the outer surface of the medium substrate layer, wherein the electromagnetic shielding layer is formed by metal pattern units in a periodic equidistant array.
Preferably, the dielectric substrate layer is made of a wave-transparent material, and the wave-transparent material is a PCB substrate, glass, acrylic material, plastic or wood board.
Preferably, when the dielectric substrate layer is a PCB substrate, the metal pattern layer is formed by etching; when the dielectric substrate layer adopts conductive glass, the metal pattern layer is formed on the conductive film by etching through an ITO process.
Preferably, when the dielectric substrate layer is made of toughened glass, acrylic material, plastic or wood board, the metal pattern layer is printed on the outer surface of the transparent flexible material layer through a Cu-Mesh process, and then the metal pattern layer is bonded on the surface of the dielectric substrate through a bonding process.
Preferably, the medium substrate layer is a double-layer hollow toughened glass layer, two outer surfaces of the double-layer hollow toughened glass layer are respectively provided with a metal pattern layer, the metal pattern layer comprises an opposite structure, the opposite structure is formed by connecting a T-shaped knot with one end of a semicircular ring, the T-shaped knot comprises a transverse wing and a rib warp which is vertically connected with the center of the transverse wing, the rib warp of the T-shaped knot is vertically connected with the tangential direction of the connecting end of the semicircular ring, and the opposite structure uses the other end of the semicircular ring as the center of a circle and rotates for four times according to 90 degrees to form the metal pattern unit.
Preferably, the metal pattern layer is printed on the PET flexible film through Cu-Mesh, and then is adhered to the outer surface of the double-layer hollow toughened glass layer through OCA photoresist.
Preferably, the period T of the equidistant array of the metal pattern units satisfies the formula (1),
（1）
Wherein T is the period of the equidistant array of metal pattern units,Is the dielectric constant of the dielectric substrate,/>For the thickness of the material,/>Correction factor,/>，/>Is the air wavelength of the center frequency point of the incident wave.
Preferably, the diameter of the semicircle in the metal pattern unit is D, and satisfies the formula (2),
（2）
Wherein D is the diameter of a semicircle,For the thickness of the material,/>To adjust the term,/>， Is the air wavelength of the center frequency point of the incident wave.
Preferably, the metal pattern unit satisfies the following dimensional relationship (3),
（3）
In the method, in the process of the invention,Is the length of the rib meridian,/>Is the length of the transverse wing,/>The width of the transverse wing, D is the diameter of a semicircle ring,Is the dielectric constant of the dielectric substrate,/>The air wavelength is the center frequency point of the incident wave.
Compared with the prior art, the invention has the following advantages:
1. The invention is applied to building structures adopting wave-transmitting materials on building outer walls, glass windows, plastics, wood boards and the like, and the transmission amplitude of electromagnetic waves in the wave-transmitting materials is greatly reduced in the wave-coming direction of specific electromagnetic waves in specific frequency bands by sticking metal pattern layers on the surfaces of the structures.
2. The invention has wide application range, and can flexibly change the size of the metal pattern layer according to the specific size of the dielectric substrate layer so as to realize the optimal performance.
3. The invention can ensure the integral structural strength if adopting the etching process of the printed circuit board; the invention can ensure the high light transmittance of the glass if adopting the ITO process of the conductive glass; the invention can realize high visibility of the surface of the medium substrate and high light transmittance of the medium substrate (such as glass, acrylic material and the like) made of transparent materials by adopting a process of printing and pasting the metal pattern layer on the medium substrate after adopting a Cu Mesh process.
4. The mounting mode of the invention can be a post-mounting process, namely, the mounting can be completed under the condition of not replacing the original medium substrate, and the designed metal pattern layer is adhered to the surface of the medium substrate through an adhesion process.
5. The metal pattern layer can be printed and bonded with the dielectric substrate by adopting a flexible material, so that the conformal requirement is greatly facilitated, and the application is wider.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the description of the embodiments or the prior art will be briefly described below.
FIG. 1 is an overall scheme of an electromagnetic shielding structure of a wave-transparent material according to an embodiment of the present invention;
FIG. 2 is a unit plan view of an electromagnetic shielding structure of a wave-transparent material according to an embodiment of the present invention;
FIG. 3 is a plan view of a metal pattern layer according to an embodiment of the present invention;
Fig. 4 is a graph showing the transmission performance of full-band electromagnetic waves on a wave-transparent material before and after a flexible transparent material film is adhered to the surface in the embodiment of the present invention.
The dielectric substrate layer 1, the metal pattern layer 2, the metal pattern unit 3, the OCA photoresist layer 4, the double-layer hollow glass 5, the PET layer 6, the anisotropic structure 7, the T-shaped junction 8, the semicircular ring 9, the transverse wings 10 and the rib warps 11.
Description of the embodiments
The application will be further elucidated with reference to specific examples. It is to be understood that these examples are for the purpose of illustrating the application only and are not to be construed as limiting the scope of the application, since modifications to the application, which are various equivalent to those skilled in the art, will fall within the scope of the application as defined in the appended claims after reading the application.
In the description and claims, unless the context specifically defines the terms "a," "an," "the," and "the" include plural referents. If there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. The term "and/or" as used herein includes all or any element and all combination of one or more of the associated listed items.
It will be understood by those skilled in the art that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Examples
In the embodiment, the center frequency point required by design is 2.595GHz, the designed frequency band is 2.515-2.675GHz, and the electromagnetic wave incident angle is 0-60 degrees.
In this embodiment, the dielectric substrate layer adopts a hollow double-layer toughened glass, the dielectric substrate layer has a double-layer toughened glass structure, and an air medium exists between the two layers.
In this embodiment, a Cu Mesh process is adopted, a metal pattern layer is printed on a transparent flexible PET material, and then the metal pattern layer is bonded on the surface of the dielectric substrate through an adhesion process.
In this embodiment, as shown in fig. 1 and 2, the transparent flexible layer, the first glass layer as the dielectric substrate, the second glass layer as the dielectric substrate, and the transparent flexible layer of the other outer surface of the dielectric substrate are included. Wherein:
The metal pattern layer is printed on one side surface of the transparent flexible layer through a Cu Mesh process, and the transparent flexible layer is adhered to two outer surfaces of the dielectric substrate glass layer through OCA optical adhesives. The metal pattern layer is printed on the side surface of the transparent flexible layer, which is close to the medium substrate layer, and the transparent flexible layer can play a role in protection, so that the service life of the structure is prolonged.
As shown in fig. 3, in order to meet the design requirement of the electromagnetic shielding of the present invention, the metal pattern layer is a metal pattern circuit periodically arranged at equal intervals; the metal pattern circuit is composed of a semicircular ring and a T-shaped junction, one end of the semicircular ring is connected with the T-shaped junction along the vertical direction of a tangent line, the other end of the semicircular ring takes the center of a unit as an origin, and the semicircular ring sequentially rotates by 90 degrees with the vertical direction of the plane of the transparent flexible medium layer as an axis, so that an opposite structure is formed. The first transparent flexible film layer and the second transparent flexible film layer metal pattern layer are designed to be of an equal-period concentric structure, so that simulation calculation and evaluation of the influence of processing dislocation deviation on the corresponding overall performance are facilitated.
In the embodiment, the metal pattern layers are metal pattern circuits which are periodically distributed at equal intervals, the period T of the metal pattern circuits is regulated according to a formula and in a small range, and the size of the period T is set to be 0.24 wavelength of the central frequency point;
In this embodiment, W1 is set to a fixed value, and may be set to a minimum processable width; determining an initial value of a dimension parameter D through an initial value formula, setting the L1 dimension to be 0.3D, continuously adjusting dimension parameters D, L and W2 of a metal pattern circuit of a metal pattern layer, observing transmission amplitude of the structure under different dimensions, and continuously adjusting the dimension of the metal pattern circuit to meet design requirements;
As shown in fig. 2, in this embodiment, the thickness of the dielectric substrate is a determined parameter, the first wave-transparent material layer includes a first wave-transparent material layer having a thickness h1, and the second wave-transparent material layer has a thickness h2; an air layer with a certain thickness is filled between the first wave-transmitting material layer and the second wave-transmitting material layer, and the thickness of the air layer is h3; the wave-transparent material is a conventional toughened glass material. According to the invention, the flexible metal pattern layer is attached to the surface of the hollow double-layer glass, so that the rear-loading mode is realized, and the application range is wider.
In order to intuitively embody the change of the transmission amplitude of electromagnetic waves by the wave-transmitting material adhered with the flexible transparent material film compared with the hollow glass material without the flexible transparent material film double layers, the transmission performance is defined as: transmission performance (dB) =transmission amplitude (dB) of electromagnetic wave of wave-transmitting material with the flexible transparent material film bonded thereto at a specific incident angle-transmission amplitude (dB) of electromagnetic wave of wave-transmitting material without the flexible transparent material film bonded thereto at a specific incident angle;
As shown in fig. 4, the graph shows that the electromagnetic wave transmission performance of the wave-transmitting material of the bonded flexible transparent material film after treatment is that the electromagnetic wave transmission amplitude of the wave-transmitting material of the bonded flexible transparent material film is reduced by 5dB compared with that of the wave-transmitting material of the unbonded flexible transparent material film in the frequency range of 2.515-2.675GHz within the incidence angle of 0-60 DEG, especially the electromagnetic wave transmission amplitude of the wave-transmitting material of the bonded flexible transparent material film is reduced by more than 10dB compared with that of the wave-transmitting material of the unbonded flexible transparent material film near the central frequency point of 2.595GHz, and the electromagnetic wave attenuation is more obvious; and the wave-transparent material adhered with the flexible transparent material film outside the frequency band basically has no influence on the transmission performance of electromagnetic waves. Therefore, the wave-transmitting material for bonding the flexible transparent material film has good electromagnetic wave shielding effect in a designed frequency band within the range of 0-60 degrees of incident angle of incident wave.
It is to be understood that the invention is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (6)
1. The utility model provides a wave-transparent material electromagnetic shield structure which characterized in that: the electromagnetic shielding layer is a metal pattern layer which is formed by arranging metal pattern units in a periodic equidistant array;
The dielectric substrate layer is formed by printing a metal pattern layer on the outer surface of a transparent flexible material layer through a Cu-Mesh process, and then bonding the metal pattern layer on the surface of the dielectric substrate through a bonding process;
The medium substrate layer is double-deck cavity toughened glass layer, exists air medium between the two-layer, the two surfaces on double-deck cavity toughened glass layer are equipped with the metal pattern layer respectively, the metal pattern layer contains the opposite structure, the opposite structure comprises T shape knot and semicircle ring's one end connection, the T shape knot include the wing, with the rib warp that the wing center is perpendicular to be connected, the rib warp of T shape knot is perpendicular to the tangential direction of semicircle ring link, the opposite structure uses the other end of semicircle ring as the centre of a circle, constitutes according to 90 rotatory four times metal pattern unit.
2. The wave-transparent material electromagnetic shielding structure according to claim 1, wherein: the medium substrate layer can also adopt acrylic materials, plastics or wood plates to replace the double-layer hollow toughened glass layer.
3. The wave-transparent material electromagnetic shielding structure according to claim 1, wherein: the metal pattern layer is printed on the PET flexible film through Cu-Mesh, and then is adhered to the outer surface of the double-layer hollow toughened glass layer through OCA photoresist.
4. The wave-transparent material electromagnetic shielding structure according to claim 1, wherein: the period T of the equidistant array of metal pattern units, and satisfies the following formula (1),
（1）
Wherein T is the period of the equidistant array of metal pattern units,Is the dielectric constant of the dielectric substrate,/>For the thickness of the material,/>Correction factor,/>，/>Is the air wavelength of the center frequency point of the incident wave.
5. The wave-transparent material electromagnetic shielding structure according to claim 1, wherein: the diameter of the semicircle ring in the metal pattern unit is D and satisfies the formula (2),
（2）
Wherein D is the diameter of a semicircle,For the thickness of the material,/>To adjust the term,/>， />Air wavelength of incident wave center frequency point,/>Is the dielectric constant of the dielectric substrate.
6. The wave-transparent material electromagnetic shielding structure according to claim 1, wherein: the metal pattern unit satisfies the following dimensional relation (3),
（3）
In the method, in the process of the invention,Is the length of the rib meridian,/>Is the length of the transverse wing,/>Is the width of the transverse wing, D is the diameter of a semicircle, and is/(Is the dielectric constant of the dielectric substrate,/>The air wavelength is the center frequency point of the incident wave.
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| CN117479521A (en) | 2024-01-30 |
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