CN117471625A - Package structure for aligning and connecting optical fiber to chip and manufacturing method thereof - Google Patents
Package structure for aligning and connecting optical fiber to chip and manufacturing method thereof Download PDFInfo
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- CN117471625A CN117471625A CN202311659654.0A CN202311659654A CN117471625A CN 117471625 A CN117471625 A CN 117471625A CN 202311659654 A CN202311659654 A CN 202311659654A CN 117471625 A CN117471625 A CN 117471625A
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- optical fiber
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 271
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims abstract description 86
- 238000010168 coupling process Methods 0.000 claims abstract description 78
- 239000004065 semiconductor Substances 0.000 claims abstract description 78
- 230000008878 coupling Effects 0.000 claims abstract description 76
- 238000005859 coupling reaction Methods 0.000 claims abstract description 76
- 238000007493 shaping process Methods 0.000 claims abstract description 41
- 230000000712 assembly Effects 0.000 claims abstract description 11
- 238000000429 assembly Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 23
- 239000000835 fiber Substances 0.000 claims description 17
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 14
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- 230000009286 beneficial effect Effects 0.000 description 3
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- 230000007547 defect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a packaging structure for aligning and connecting an optical fiber to a chip and a manufacturing method thereof, comprising the following steps: the optical coupling device comprises a first semiconductor chip, a first surface of the first semiconductor chip, a positioning area and an optical coupling area, wherein a plurality of positioning assemblies and a plurality of beam shaping elements are arranged above the positioning area, so that self-aligned optical connection of each optical fiber in the optical fiber array to the optical coupling interface of the first semiconductor chip is realized, when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, the optical fiber array can be well packaged and fixed, the optical fiber position in the optical fiber array is prevented from being shifted or tilted to cause tilting, and higher optical alignment tolerance can be realized, so that optical coupling from the optical fibers can be effectively coupled to the corresponding optical coupling interface.
Description
Technical Field
The present invention relates to the field of semiconductor packaging, and in particular, to a packaging structure for aligning and connecting an optical fiber to a chip and a method for manufacturing the same.
Background
With the development of artificial intelligence technology, data communication is being actively developed, because artificial intelligence is severely dependent on data processing, and a large amount of data needs to be transmitted through a network for processing. This has led to an increasing demand for high-speed data communication networks that can handle the large amounts of data required for artificial intelligence applications.
While current data communication systems/infrastructures are likely copper-based, there are critical limitations in bandwidth, delay, interference, and distance during data transmission. As an alternative or industry trend, optical networks are becoming an important component of our digital infrastructure, and their importance only continues to grow as we rely more and more on digital communications and data exchanges.
Optical networks involve several key technology components that can transmit large amounts of data over long distances, such as optical fibers, optical transceivers, optical amplifiers; optical cross-connect and dense wavelength division multiplexing, etc. Fiber-to-chip connections are a fundamental and important technology covering all of the above applications. The technology realizes high-speed data transmission between equipment and a data center, thereby realizing faster and more efficient data processing. The following are some of the challenges involved in fiber-to-chip connections:
1. Alignment: precise alignment between the optical fiber and the chip ensures accurate and efficient data transmission. Any misalignment can lead to insertion loss and reduce the effectiveness of the connection.
2. Increasing the number of optical fibers or larger sized optical fiber arrays: in recent years, the need for large data transfers between networks has increased dramatically, particularly as artificial intelligence has emerged in the marketplace.
3. And (3) packaging: once the fibers and chips are aligned, they need to be packaged together to prevent damage, ensure stability and maintain alignment. This can be difficult due to the small size of the components and the need for precision and durability.
4. Cost: the connection of the optical fibers to the chip is a labor intensive and expensive process requiring specialized alignment equipment and highly skilled technicians.
For the above reasons, how to provide a package structure for self-aligned connection of an optical fiber to a chip and a method for manufacturing the same have become an urgent problem to be solved.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a packaging structure for aligning and connecting an optical fiber to a chip and a manufacturing method thereof, which are used for solving the problems of precisely aligning and connecting the optical fiber to the chip, realizing the reliability of packaging and fixing and the like.
The invention adopts the following technical scheme:
according to an aspect of the present invention, there is provided a package structure for aligning and connecting an optical fiber to a chip, comprising:
a first semiconductor chip having opposite first and second surfaces, an optical coupling region disposed on the first surface and a positioning region for positioning optical fibers in an external optical fiber array, wherein an optical coupling interface is disposed in the optical coupling region;
the positioning assemblies are arranged above the positioning areas and are arranged along a first direction, and when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, the positioning assemblies position the optical fibers in the external optical fiber array, wherein the optical fibers in the external optical fiber array extend along a second direction, and the second direction is perpendicular to the first direction;
the plurality of beam shaping elements are arranged on the first surface and are arranged along a first direction, the beam shaping elements adjust the light input by the optical fiber, and the light incident thereon is coupled to the corresponding optical coupling interface by modulating the distance between the beam shaping elements and the optical coupling interface.
Further, a positioning assembly for positioning each optical fiber, the positioning assembly comprising one or more raised elements;
each protrusion unit includes a first protrusion portion and a second protrusion portion disposed opposite and spaced apart along a first direction, the first protrusion portion having a first inclined surface, the second protrusion portion having a second inclined surface, the first inclined surface and the second inclined surface of each protrusion unit being configured to clamp a corresponding optical fiber when the optical fiber in an external optical fiber array is placed on the first surface of the first semiconductor chip.
Further, for the positioning assembly for positioning each optical fiber, the plurality of protruding units are arranged at intervals along the second direction.
Further, the first and second inclined surfaces of each protruding unit and the first surface between the first and second inclined surfaces are configured as a fiber cage so that the corresponding optical fiber is abutted with the first inclined surface, the second inclined surface, and the first surface, respectively, when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
Further, the first and second inclined surfaces of each protruding unit are respectively at an acute angle with the first surface.
Further, the first protruding portion and the second protruding portion are made of organic matters.
In some embodiments, the beam shaping element comprises at least one first prism lens unit, each first prism lens unit configured to reflect all wavelengths of light incident thereon; the first prism-lens unit includes a first prism;
and along the second direction, the first prism lens unit is positioned at a first transverse distance from the edge of one side of the positioning area, which is close to the optical coupling area, and the first prism lens unit is positioned at a second transverse distance from the optical coupling interface of the first semiconductor chip.
Further, the first prism lens unit further comprises a first convex lens arranged close to the light outlet of the optical fiber, and the first convex lens collimates and converges the light input by the optical fiber.
Further, the package structure for aligning and connecting the optical fiber to the chip further includes: and the plurality of stop structures are arranged on the first surface and positioned at the edge of the positioning area, which is close to one side of the optical coupling area, and are arranged along the first direction.
In some embodiments, a first groove is disposed on the first surface, wherein the first groove is located at an edge of the positioning region near the light coupling region, and a sidewall of the first groove away from the positioning region is configured as a first end surface coupled with external light;
the beam shaping element comprises a second prism lens unit and a third prism lens unit, wherein the second prism lens unit is arranged close to the light outlet of the optical fiber, the third prism lens unit is arranged in the first groove, and the light incident on the second prism lens unit, the third prism lens unit and the first end face are coupled to the corresponding light coupling interfaces by modulating the distance between the second prism lens unit and the third prism lens unit.
Further, the second prism-lens unit includes at least one second prism, and the third prism-lens unit includes at least one third prism; each of the second prisms is configured to reflect all wavelengths of light incident thereon, and each of the third prisms is configured to reflect all wavelengths of light incident thereon;
the second prism lens unit is at a third lateral distance position from the first end face of the first semiconductor chip, and the third prism lens unit is at a fourth lateral distance position from the first end face of the first semiconductor chip.
Further, the second prism lens unit further comprises a second convex lens, and the second convex lens is arranged at the emergent end of the second prism;
the third prism lens unit further comprises a third convex lens and a fourth convex lens, the third convex lens is arranged at the incident end of the third prism, and the fourth convex lens is arranged at the emergent end of the third prism.
Optionally, the first semiconductor chip comprises a photonic integrated circuit chip or a photonic interposer.
According to another aspect of the present invention, there is also provided a method of manufacturing a package structure for aligning and connecting an optical fiber to a chip, the method including:
providing a first semiconductor chip, wherein the first semiconductor chip is provided with a first surface and a second surface which are opposite, an optical coupling area and a positioning area for positioning optical fibers in an external optical fiber array are arranged on the first surface, and an optical coupling interface is arranged in the optical coupling area;
forming a plurality of positioning components on the positioning area, wherein the positioning components are arranged along a first direction, and the positioning components position the optical fibers in the external optical fiber array when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, and the optical fibers in the external optical fiber array extend along a second direction which is perpendicular to the first direction;
And forming a plurality of beam shaping elements on the first surface, wherein the plurality of beam shaping elements are arranged along a first direction, the beam shaping elements adjust the light input by the optical fiber, and the light incident on the beam shaping elements is coupled to the corresponding optical coupling interfaces by modulating the distance between the beam shaping elements and the optical coupling interfaces.
Further, a positioning assembly for positioning each optical fiber, the positioning assembly comprising one or more raised elements;
each protrusion unit includes a first protrusion portion and a second protrusion portion disposed opposite in a first direction, the first protrusion portion having a first inclined surface, the second protrusion portion having a second inclined surface, the first inclined surface and the second inclined surface of each protrusion unit being configured to clamp a corresponding optical fiber when the optical fiber in an external optical fiber array is placed on the first surface of the first semiconductor chip.
Further, for the positioning assembly for positioning each optical fiber, the plurality of protruding units are arranged at intervals along the second direction.
Further, the first and second inclined surfaces of each protruding unit and the first surface between the first and second inclined surfaces are configured as a fiber cage so that the corresponding optical fiber is abutted with the first inclined surface, the second inclined surface, and the first surface, respectively, when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
Further, the first protruding portion and the second protruding portion are made of organic matters; the first protruding part and the second protruding part are formed on the first surface of the first semiconductor chip in a nano-inscribing mode.
Further, a plurality of stopper structures are formed on the first surface, and the stopper structures are formed on the first surface and are located at an edge of the positioning region on a side close to the light coupling region, the stopper structures being arranged in the first direction.
Further, the plurality of stop structures are made of organic matters; the plurality of stop structures are formed on the first surface of the first semiconductor chip in a nano-inscribing manner.
Optionally, the first semiconductor chip comprises a photonic integrated circuit chip or a photonic interposer.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1. the packaging structure for aligning and connecting the optical fibers to the chips can realize self-aligned optical connection of the optical coupling interfaces of the optical fibers in the optical fiber array to the first semiconductor chip, can well package and fix the optical fiber array when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, prevent the optical fibers in the optical fiber array from tilting caused by shifting or shaking, and can also realize higher optical alignment tolerance and effectively couple the light from the optical fibers to the corresponding optical coupling interfaces.
2. The manufacturing method of the packaging structure for aligning and connecting the optical fiber to the chip can produce the packaging structure for self-aligning and connecting the optical fiber and the chip; specifically, an optical coupling area and a positioning area for positioning optical fibers in an external optical fiber array are arranged on a first surface of a first semiconductor chip, a plurality of positioning components are formed on the positioning area, the positioning components are arranged along a first direction, when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, the positioning components position the optical fibers in the external optical fiber array on the first surface to form a plurality of beam shaping elements, and the plurality of beam shaping elements are arranged along the first direction to adjust light input by the optical fibers so as to effectively couple the light from the optical fibers to corresponding optical coupling interfaces.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other embodiments may be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic plan view of a package structure for aligning and connecting an optical fiber to a chip according to an embodiment of the present invention.
Fig. 2 is a schematic side view of the structure according to the direction B-B in fig. 1.
Fig. 3 is a schematic diagram of optical path propagation according to a first embodiment of the present invention.
Fig. 4 is a schematic diagram of still another optical path propagation according to a first embodiment of the present invention.
Fig. 5 is a schematic side view of the structure according to the A-A direction in fig. 1.
Fig. 6A is a schematic diagram according to the partial method at F in fig. 5.
Fig. 6B is a schematic cross-sectional structure of a different first protrusion in a protrusion unit provided according to an embodiment of the present invention.
Fig. 7 is a schematic side view of the structure according to the direction C-C in fig. 1.
Fig. 8 is a schematic side view of a package structure for aligning and connecting an optical fiber to a chip according to a second embodiment of the present invention.
Fig. 9 is a schematic diagram of optical path propagation according to a second embodiment of the present invention.
Fig. 10 is a flowchart of a method for fabricating a package structure for aligning and connecting an optical fiber to a chip according to an embodiment of the present invention.
The main reference numerals in the drawings of the present specification are explained as follows:
100-a first semiconductor chip, 100 A-A first surface, 105-a positioning region, 1024-an optical coupling region, 104-an optical coupling interface, 106-a first trench;
200-positioning assembly, 210-protruding unit, 211-first protruding part, 212-second protruding part, 211A-first inclined plane, 212A-second inclined plane;
300-beam shaping element, 310-first prism lens unit, 320-second prism lens unit, 330-third prism lens unit;
400-stop structure;
600-optical fiber array structure, 601-optical fiber.
Detailed Description
The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention, as well as the preferred embodiments thereof, together with the following detailed description of the invention, given by way of illustration only, together with the accompanying drawings.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The meaning of a chip herein may include a bare chip. The order illustrated herein represents one exemplary scenario when referring to method steps, but does not represent a limitation on the order. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention will be further described in detail with reference to the drawings and detailed description below in order to make the objects, features and advantages of the invention more comprehensible.
Example 1
Fig. 1 is a schematic plan view of a package structure for aligning and connecting an optical fiber to a chip according to an embodiment of the present invention. Fig. 2 is a schematic side view of the structure according to the direction B-B in fig. 1. Fig. 3 is a schematic diagram of optical path propagation according to a first embodiment of the present invention.
1-3, a package structure for aligning and connecting an optical fiber to a chip according to an embodiment of the present invention includes:
a first semiconductor chip 100, the first semiconductor chip 100 having a first surface 100a and a second surface (not shown) opposite to each other, an optical coupling region 1024 and a positioning region 105 for positioning optical fibers in an external optical fiber array being provided on the first surface 100a, wherein an optical coupling interface 104 is provided in the optical coupling region 1024;
a plurality of positioning members 200 disposed above the positioning region 105 and aligned in a first direction, the positioning members 200 positioning the optical fibers 601 in the external optical fiber array when the optical fibers 601 in the external optical fiber array are placed on the first surface 100a of the first semiconductor chip 100, wherein the optical fibers 601 in the external optical fiber array extend in a second direction perpendicular to the first direction;
A plurality of beam shaping elements 300, the plurality of beam shaping elements 300 being disposed on the first surface 100a, and the plurality of beam shaping elements 300 being disposed in a first direction, the beam shaping elements 300 adjusting light input to the optical fiber 601 by modulating a distance between the beam shaping elements 300 and the optical coupling interfaces to couple light incident thereon to the corresponding optical coupling interfaces 104.
In an embodiment of the present invention, the first semiconductor chip 100 is illustratively a photonic integrated circuit chip (PIC chip) or a photonic interposer, where the photonic integrated circuit chip is a silicon-based photonic integrated circuit chip that uses photons as an information carrier for information processing and data transmission. The photonic interposer may be, for example, a passive photonic integrated circuit chip.
Illustratively, the optical fiber array structure 600 according to the embodiment of the present invention includes an optical fiber array, where the optical fiber array includes a plurality of optical fibers 601 arranged at intervals, and the number of the plurality of optical fibers 601 is: there may be 4, 8, 16 or more. Wherein each optical fiber 601 includes an optical fiber core (black thick solid line in the figure) and an optical fiber cladding (line frame wrapping black thick solid line in the figure) covering the optical fiber core; the existing fiber array structure 600 further includes an outer protective layer that covers the fiber array at the same time, and includes two cover plates sandwiched between both sides of the fiber array, wherein the cover plates above the fiber array are generally longer and the cover plates below the fiber array are generally shorter, wherein the cover plates below the shorter length are used to expose the remaining surfaces of the fiber array for alignment connection to the first semiconductor chip 100. The embodiments of the present invention are not limited herein.
In the conventional technology, a solution of etching a first surface of a first semiconductor chip to form a U-shaped groove to accommodate optical fibers in an optical fiber array is generally adopted, but the solution of etching the U-shaped groove is not well compatible with the existing preparation process of the first semiconductor chip, and a secondary processing process is generally required for forming, which increases the difficulty and complexity of the packaging and manufacturing process of the first semiconductor chip.
The technical scheme provided by the embodiment of the invention aims to realize self-aligned optical connection of each optical fiber in the optical fiber array to the optical coupling interface on the first semiconductor chip by arranging the positioning area and the optical coupling area on the first surface of the first semiconductor chip and arranging a plurality of positioning components and a plurality of beam shaping elements on the first surface above the positioning area, so that the optical fiber array can be well packaged and fixed when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip, the optical fiber array is prevented from tilting caused by shifting or shaking of the optical fiber position in the optical fiber array, and higher optical alignment tolerance can be realized, and the optical coupling from the optical fiber is effectively coupled to the corresponding optical coupling interface.
It should be appreciated that the above-described modulating the distance between the beam shaping element 300 and the optical coupling interface 104 may refer to three-dimensional spatial distances, including, for example, X-direction distances and/or Y-direction distances and/or Z-direction distances.
Fig. 5 is a schematic side view of the structure according to the direction A-A in fig. 1, and fig. 6A is a schematic view according to the partial method at F in fig. 5.
Illustratively, in an embodiment of the present invention, for positioning assembly 200 for positioning each optical fiber, it includes one or more protruding units 210, where the plurality of protruding units 210 are arranged at intervals along the second direction when it includes a plurality of protruding units 210; it should be noted that, because the positioning assemblies 200 for fixing different optical fibers are arranged in the first direction, and the different protruding units in the positioning assemblies 200 for fixing the same optical fiber are arranged at intervals in the second direction. As shown in fig. 5 and 6A, the protrusion unit 210 includes first protrusions 211 and second protrusions 212 disposed opposite to and at intervals along a first direction, the first protrusions 211 having a first inclined surface 211A, the second protrusions 212 having a second inclined surface 212A, and the first inclined surface 211A and the second inclined surface 212A of each protrusion unit 210 are configured to clamp the corresponding optical fiber 601 when the optical fiber 601 in an external optical fiber array is placed on the first surface 100a of the first semiconductor chip 100.
It should be noted that, in the exemplary embodiment of the present invention, each positioning assembly 200 includes a plurality of protruding units 210 arranged at intervals along the second direction, and each protruding unit 210 forms a side fiber stopper for limiting the optical fiber. In the extending direction of each optical fiber 601, through the combined action of 2 or more protruding units 210, the front end and the rear end of each optical fiber 601 can be aligned, and through the combined action of a plurality of positioning assemblies 200, the packaging structure for aligning and connecting the optical fibers to the chip provided by the embodiment of the invention has higher optical fiber alignment precision on the front end surface and the rear end surface of the optical fiber array.
Further, the first and second inclined surfaces 211A and 212A of each protrusion unit 210 and the first surface 100a located between the first and second inclined surfaces 211A and 212A are configured as a fiber cage such that the corresponding optical fibers 601 are abutted with the first inclined surfaces 211A, 212A and the first surface 100a, respectively, when the optical fibers 601 in an external optical fiber array are placed on the first surface 100a of the first semiconductor chip 100.
In addition, in the scheme of the common technology, because in each U-shaped groove, the optical fibers can only contact with two side walls of the U-shaped groove and cannot contact with the bottom of the U-shaped groove, gaps are reserved between the optical fibers and the bottom of the U-shaped groove, so that the fixed positions of the optical fibers are easily deviated due to shaking in the packaging and moving process, especially when the width (determined by the number of the optical fibers) of the optical fiber array is wider, the position deviation of the optical fiber array is more obvious, and even the phenomenon that one side of the optical fiber array has a tilting occurs, so that the subsequent optical fiber alignment accuracy is seriously influenced.
Compared with the conventional technical solution, each protruding unit 210 disposed above the positioning area 105 according to the embodiment of the present invention may be used as two baffles located on two sides of the optical fiber 601, and the inclined planes of the two baffles and the first surface 100a located between the inclined planes of the two baffles form an optical fiber cage, that is, may form a solid supporting structure in three-point contact with the optical fiber 601, and according to the principle of lowest energy, the solid supporting position of the optical fiber 601 is not affected even during the moving and transporting process, so that the optical fiber array has the advantage of being capable of well packaging and fixing the optical fibers in the optical fiber array above the first semiconductor chip.
Further, to facilitate aligned placement of the optical fibers 601 in the optical fiber array in the corresponding positioning assembly, the first and second inclined surfaces 211A, 212A of each protrusion 210 are respectively at an acute angle to the first surface 100 a.
It should be noted that, in other embodiments of the present invention (not shown), each positioning assembly 200 includes a protrusion unit 210, and the protrusion unit 210 forms a side fiber stopper for limiting the optical fiber.
Further, the first and second inclined surfaces 211A and 212A of the protrusion unit 210 and the first surface 100a located between the first and second inclined surfaces 211A and 212A are configured as a fiber cage such that the corresponding optical fibers 601 are respectively abutted with the first inclined surfaces 211A, 212A and the first surface 100a when the optical fibers 601 in the external optical fiber array are placed on the first surface 100a of the first semiconductor chip 100. And the first inclined plane 211A and the second inclined plane 212A have a certain length in the second direction, so that in the extending direction of each optical fiber 601, through the action of the protruding unit 210, the front end and the rear end of each optical fiber 601 can be aligned, and through the combined action of the plurality of positioning assemblies 200, the package structure for aligning and connecting optical fibers to a chip provided by the embodiment of the invention has higher optical fiber alignment precision on the front end surface and the rear end surface of the optical fiber array. Fig. 6B is a schematic cross-sectional structure of a different first protrusion in a protrusion unit provided according to an embodiment of the present invention.
Optionally, as shown in fig. 6B, in other embodiments, the first protrusion of each protrusion unit 210 further has a first step surface parallel to the first surface 100 a. Alternatively, in other embodiments, the first protrusion of each protrusion unit 210 further has a first side surface, which is located between the first inclined surface 211A and the first surface 100a and is connected to the first inclined surface 211A.
It should be understood that, in the embodiment of the present invention, since the first inclined surface 211A of the first protruding portion 211 and the second inclined surface 212A of the second protruding portion 212 are disposed opposite to each other, the first protruding portion 211 and the second protruding portion 212 may be disposed in a mirror-symmetrical structure, and thus the shape of the second protruding portion 212 is not described herein.
Illustratively, the materials of the first protrusion 211 and the second protrusion 212 are organic. This is advantageous in that such one first and second protrusions 211 and 212 are formed (prepared) directly over the first semiconductor chip 100 by means of nano-writing, and since the nano-writing does not require etching, the process compatibility is friendly, so that such one first and second protrusions can be formed during the packaging process, and also can be formed during the preparation of the first semiconductor chip, thereby having an advantage of simplifying the manufacturing process.
With continued reference to fig. 2 and 3, in this embodiment, the beam shaping element 300 includes at least one first prism-lens unit 310, each of the first prism-lens units 310 being configured to reflect all wavelengths of light incident thereon; the first prism-lens unit 310 includes a first prism; along the second direction, the first prism-lens unit 310 is located at a first lateral distance from an edge of the positioning region 105 on a side close to the optical coupling region 1024, and the first prism-lens unit 310 is located at a second lateral distance from the optical coupling interface 104 of the first semiconductor chip 100, so as to enable coupling of light from the optical fiber 601 incident thereon to the corresponding optical coupling interface 104.
Illustratively, the first prism-lens unit 310 further includes a first convex lens disposed near the light-out port of the optical fiber 601, which collimates and condenses the light input by the optical fiber, thereby forming a light beam focused to the optical coupling interface. Meanwhile, higher light alignment tolerance can be realized, which is beneficial to improving the operation efficiency of the surface coupling process and reducing the coupling loss under the same alignment mismatch degree.
Specifically, the material of the first prism lens unit 310 may be an organic material having a refractive index of 1.4-1.7, and the shape thereof may be modeled using Zemax, so as to form a reflector plus aspherical structure, which can achieve a loss generated by alignment within 1dB based on an alignment tolerance of ±2.2μm (XY direction), and a loss generated by alignment within 0.5dB based on an alignment tolerance of ±35 μm (Z direction).
Further, in some embodiments, as shown in fig. 4, a lens is further disposed at the light exit of the optical fiber to increase alignment tolerance, specifically, a 3D nano-inscribed lens (organic material) is added near the light exit of the optical fiber, and the design of the lens with collimation and focusing functions greatly increases alignment tolerance in XY directions. The alignment can be realized on the basis of alignment tolerance at + -9 μm (XY direction), the loss generated by alignment is within 1dB, and the alignment distance in Z direction is hardly limited.
Further, as shown in fig. 1 and 7, in the embodiment of the present invention, the package structure for aligning and connecting the optical fiber to the chip further includes a plurality of stop structures 400, the plurality of stop structures 400 are disposed on the first surface 100a and located at an edge of the positioning region 105 near the optical coupling region, and the plurality of stop structures 400 are disposed in a first direction.
Specifically, when the optical fiber array is placed on the first surface 100a of the first semiconductor chip 100, each optical fiber may be placed in the corresponding protruding unit 210 for pre-alignment, and then the optical fiber array is pushed towards the direction approaching the optical coupling area 1024, so that the light outlet ports of the optical fibers of the optical fiber array can be closer to the beam shaping element, until the pushing ends, and the limitation may be performed by the positions of the above-mentioned plurality of stop structures 400, for example, at least 3 stop structures 400 are placed on the first surface, where two are located at the edge of the positioning area and near both sides of the optical fiber array, and the other is located at the edge of the positioning area and near the middle of the optical fiber array; thus, with such a package structure, a higher photo alignment tolerance can be achieved. Further, since the entire optical fiber array structure is always parallel to the first surface 100a, no other defect is generated during the pressing and pushing of the optical fiber array in the direction of the optical coupling region.
Example two
Fig. 8 is a schematic side view of a package structure for aligning and connecting an optical fiber to a chip according to a second embodiment of the present invention, and fig. 9 is a schematic propagation diagram of an optical path according to a second embodiment of the present invention.
As shown in fig. 8 to 9, the difference between the scheme of the second embodiment and the first embodiment is that: the first embodiment is a scheme applied to a face coupler, and the second embodiment is a scheme applied to an edge coupler.
Illustratively, a first trench 106 is disposed on the first surface of the first semiconductor chip 100, wherein the first trench 106 is located at an edge of the positioning region 105 near the optical coupling region 1024, and a sidewall of the first trench 106 remote from the positioning region 105 is configured as a first end surface (not shown) coupled with external light to achieve coupling with incident light through the optical coupling interface 104 within the first semiconductor chip 100; the beam shaping element 300 comprises a second prism lens unit 320 and a third prism lens unit 330, wherein the second prism lens unit 320 is arranged near the light outlet port of the optical fiber 601, and the third prism lens unit 330 is arranged in the first groove 106, and the light incident thereon is coupled to the corresponding light coupling interface 104 by modulating the distance between the second prism lens unit 320, the third prism lens unit 330 and the first end surface.
Illustratively, the second prism-lens unit 320 includes at least one second prism, and the third prism-lens unit 330 includes at least one third prism; each of the second prisms is configured to reflect all wavelengths of light incident thereon, and each of the third prisms is configured to reflect all wavelengths of light incident thereon; the second prism lens unit 320 is at a third lateral distance from the first end face of the first semiconductor chip, and the third prism lens unit 330 is at a fourth lateral distance from the first end face of the first semiconductor chip.
The solution of the edge coupler of the second embodiment is beneficial to the optical coupling effect of the existing package structure, because: since the optical waveguide of the edge coupler extends parallel to the direction of the first surface of the first semiconductor chip, when light is coupled to the optical waveguide in the edge coupler, the edge coupler of the first semiconductor chip 100 near the first end face can directly receive the light in parallel, and the light does not need to be adjusted again, so that the technical solution of the second embodiment performs better in terms of optical coupling efficiency under the condition of the same alignment tolerance.
Further, in some embodiments, the second prism-lens unit 320 further includes a second convex lens disposed at the exit end of the second prism; the third prism lens unit 330 further includes a third convex lens and a fourth convex lens, the third convex lens is disposed at the incident end of the third prism, and the fourth convex lens is disposed at the exit end of the third prism.
Specifically, in the present embodiment, the entire optical path is: light from the optical fiber is firstly reflected on the side surface of the second prism lens unit 320, then the reflected light is converged and converted into parallel light through the second convex lens and then enters the third prism lens unit 330, the third convex lens is used for converging the light again and then reflecting on the side surface of the third prism, and the reflected light can be converged by the fourth convex lens before entering the optical waveguide, so that higher alignment tolerance can be realized, the operation efficiency of the coupling process is improved, and the coupling loss under the same alignment mismatch degree is reduced.
According to another aspect of the present invention, there is also provided a method of fabricating a package structure for aligning and connecting an optical fiber to a chip.
Fig. 10 is a flowchart of a method for fabricating a package structure for aligning and connecting an optical fiber to a chip according to an embodiment of the present invention.
As shown in fig. 10, the method for manufacturing the package structure for aligning and connecting the optical fiber to the chip includes:
step S10, providing a first semiconductor chip, wherein the first semiconductor chip is provided with a first surface and a second surface which are opposite, an optical coupling area and a positioning area for positioning optical fibers in an external optical fiber array are arranged on the first surface, and an optical coupling interface is arranged in the optical coupling area;
step S20, forming a plurality of positioning components on the positioning area, wherein the positioning components are arranged along a first direction, and the positioning components position the optical fibers in the external optical fiber array when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, and the optical fibers in the external optical fiber array extend along a second direction which is perpendicular to the first direction;
and step S30, forming a plurality of beam shaping elements on the first surface, wherein the plurality of beam shaping elements are arranged along a first direction, the beam shaping elements adjust the light input by the optical fiber, and the light incident on the beam shaping elements is coupled to the corresponding optical coupling interfaces by modulating the distance between the beam shaping elements and the optical coupling interfaces.
The embodiment of the invention provides a manufacturing method of a packaging structure for aligning and connecting an optical fiber to a chip, which can produce the packaging structure for self-aligning and connecting the optical fiber and the chip; specifically, an optical coupling area and a positioning area for positioning optical fibers in an external optical fiber array are arranged on a first surface of a first semiconductor chip, a plurality of positioning components are formed on the positioning area, the positioning components are arranged along a first direction, when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, the positioning components position the optical fibers in the external optical fiber array on the first surface to form a plurality of beam shaping elements, and the plurality of beam shaping elements are arranged along the first direction to adjust light input by the optical fibers so as to effectively couple the light from the optical fibers to corresponding optical coupling interfaces.
Referring to the foregoing embodiments of fig. 1-9, in an exemplary embodiment of the present invention, a positioning assembly 200 for positioning each optical fiber includes a plurality of protrusion units 210, the plurality of protrusion units 210 being arranged at intervals along a second direction; it should be noted that, because the positioning assemblies 200 for fixing different optical fibers are arranged in the first direction, and the different protruding units in the positioning assemblies 200 for fixing the same optical fiber are arranged at intervals in the second direction. Each protrusion unit 210 includes a first protrusion 211 and a second protrusion 212 disposed opposite and spaced apart in a first direction, the first protrusion 211 having a first inclined surface 211A, the second protrusion 212 having a second inclined surface 212A, the first inclined surface 211A and the second inclined surface 212A of each protrusion unit 210 being configured to clamp a corresponding optical fiber 601 when the optical fiber 601 in an external optical fiber 601 array is placed on the first surface 100a of the first semiconductor chip 100.
Further, the first and second inclined surfaces 211A and 212A of each protrusion unit 210 and the first surface 100a located between the first and second inclined surfaces 211A and 212A are configured as an optical fiber 601 cage such that the corresponding optical fiber 601 abuts the first inclined surfaces 211A, 212A and the first surface 100a, respectively, when the optical fibers 601 in the external optical fiber 601 array are placed on the first surface 100a of the first semiconductor chip 100.
It should be noted that, in other embodiments of the present invention (not shown), each positioning assembly 200 includes a protrusion unit 210, and the protrusion unit 210 forms a side fiber stopper for limiting the optical fiber. The first and second inclined surfaces 211A and 212A of the protrusion unit 210 and the first surface 100a located between the first and second inclined surfaces 211A and 212A are configured as a fiber cage such that the corresponding optical fibers 601 are respectively abutted with the first inclined surfaces 211A, 212A and the first surface 100a when the optical fibers 601 in an external optical fiber array are placed on the first surface 100a of the first semiconductor chip 100. And the first inclined surface 211A and the second inclined surface 212A have a certain length in the second direction so that both front and rear ends of each optical fiber 601 can be aligned by the action of the protrusion unit 210 in the extending direction of each optical fiber 601.
Further, the materials of the first protruding portion 211 and the second protruding portion 212 are organic matters; the first and second protrusions 211 and 212 are formed on the first surface 100a of the first semiconductor chip 100 by nano-writing.
Further, a plurality of stopper structures 400 are formed on the first surface 100a, and the stopper structures 400 are formed on the first surface 100a at an edge of the positioning region near the light coupling region side, the stopper structures 400 being arranged in the first direction.
Further, the material of the plurality of stop structures 400 is organic; the plurality of stopper structures 400 are formed on the first surface 100a of the first semiconductor chip 100 by nano-writing.
Further, the first semiconductor chip 100 includes a photonic integrated circuit chip or a photonic interposer.
The foregoing details of the fabrication method may refer to those of the foregoing embodiments of the package structure for aligning and connecting the optical fiber to the chip, and will not be described herein.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the invention, but rather to cover all equivalent variations and modifications in shape, construction, characteristics and spirit according to the scope of the present invention as defined in the appended claims.
Claims (21)
1. A package structure for aligning and connecting an optical fiber to a chip, comprising:
a first semiconductor chip having opposite first and second surfaces, an optical coupling region disposed on the first surface and a positioning region for positioning optical fibers in an external optical fiber array, wherein an optical coupling interface is disposed in the optical coupling region;
the positioning assemblies are arranged above the positioning areas and are arranged along a first direction, and when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, the positioning assemblies position the optical fibers in the external optical fiber array, wherein the optical fibers in the external optical fiber array extend along a second direction, and the second direction is perpendicular to the first direction;
the plurality of beam shaping elements are arranged on the first surface and are arranged along a first direction, the beam shaping elements adjust the light input by the optical fiber, and the light incident thereon is coupled to the corresponding optical coupling interface by modulating the distance between the beam shaping elements and the optical coupling interface.
2. The package structure for aligning and connecting optical fibers to a chip of claim 1, wherein for positioning each optical fiber a positioning assembly comprising one or more raised elements;
each protrusion unit includes a first protrusion portion and a second protrusion portion that are opposite in a first direction and are disposed at intervals, the first protrusion portion having a first inclined surface, the second protrusion portion having a second inclined surface, the first inclined surface and the second inclined surface of each protrusion unit being configured to clamp a corresponding optical fiber when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
3. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 2,
the plurality of protruding units are arranged at intervals along the second direction for positioning the positioning assembly of each optical fiber.
4. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 2,
the first and second inclined surfaces of each protruding unit and the first surface between the first and second inclined surfaces are configured as a fiber cage so that the corresponding optical fiber abuts against the first inclined surface, the second inclined surface, and the first surface, respectively, when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
5. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 4,
the first and second inclined surfaces of each projection unit are respectively at an acute angle with the first surface.
6. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 2,
the first protruding portion and the second protruding portion are made of organic matters.
7. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 1,
the beam shaping element comprises at least one first prism lens unit, each first prism lens unit being configured to reflect all wavelengths of light incident thereon; the first prism-lens unit includes a first prism;
and along the second direction, the first prism lens unit is positioned at a first transverse distance from the edge of one side of the positioning area, which is close to the optical coupling area, and the first prism lens unit is positioned at a second transverse distance from the optical coupling interface of the first semiconductor chip.
8. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 7,
The first prism lens unit further comprises a first convex lens arranged close to the light outlet of the optical fiber, and the first convex lens collimates and converges the light input by the optical fiber.
9. The package structure for aligning and connecting an optical fiber to a chip as recited in claim 1, further comprising:
and the plurality of stop structures are arranged on the first surface and positioned at the edge of the positioning area, which is close to one side of the optical coupling area, and are arranged along the first direction.
10. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 1,
a first groove is arranged on the first surface, wherein the first groove is positioned at one side edge of the positioning area, which is close to the optical coupling area, and the side wall of the first groove, which is far away from the positioning area, is configured to be a first end surface coupled with external light;
the beam shaping element comprises a second prism lens unit and a third prism lens unit, wherein the second prism lens unit is arranged close to the light outlet of the optical fiber, the third prism lens unit is arranged in the first groove, and the light incident on the second prism lens unit, the third prism lens unit and the first end face are coupled to the corresponding light coupling interfaces by modulating the distance between the second prism lens unit and the third prism lens unit.
11. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 10,
the second prism lens unit includes at least one second prism, and the third prism lens unit includes at least one third prism; each of the second prisms is configured to reflect all wavelengths of light incident thereon, and each of the third prisms is configured to reflect all wavelengths of light incident thereon;
the second prism lens unit is at a third lateral distance position from the first end face of the first semiconductor chip, and the third prism lens unit is at a fourth lateral distance position from the first end face of the first semiconductor chip.
12. The package structure for aligning and connecting an optical fiber to a chip as recited in claim 11, wherein,
the second prism lens unit further comprises a second convex lens, and the second convex lens is arranged at the emergent end of the second prism;
the third prism lens unit further comprises a third convex lens and a fourth convex lens, the third convex lens is arranged at the incident end of the third prism, and the fourth convex lens is arranged at the emergent end of the third prism.
13. The package structure for aligning and connecting an optical fiber to a chip as claimed in claim 1,
the first semiconductor chip comprises a photonic integrated circuit chip or a photonic interposer.
14. A method of fabricating a package structure for aligning and connecting an optical fiber to a chip, the method comprising:
providing a first semiconductor chip, wherein the first semiconductor chip is provided with a first surface and a second surface which are opposite, an optical coupling area and a positioning area for positioning optical fibers in an external optical fiber array are arranged on the first surface, and an optical coupling interface is arranged in the optical coupling area;
forming a plurality of positioning components on the positioning area, wherein the positioning components are arranged along a first direction, and the positioning components position the optical fibers in the external optical fiber array when the optical fibers in the external optical fiber array are placed on the first surface of the first semiconductor chip, and the optical fibers in the external optical fiber array extend along a second direction which is perpendicular to the first direction;
and forming a plurality of beam shaping elements on the first surface, wherein the plurality of beam shaping elements are arranged along a first direction, the beam shaping elements adjust the light input by the optical fiber, and the light incident on the beam shaping elements is coupled to the corresponding optical coupling interfaces by modulating the distance between the beam shaping elements and the optical coupling interfaces.
15. The method of claim 14, wherein the method further comprises aligning the optical fibers to the package structure of the chip,
a positioning assembly for positioning each optical fiber, the positioning assembly comprising one or more raised elements;
each protrusion unit includes a first protrusion portion and a second protrusion portion that are opposite in a first direction and are disposed at intervals, the first protrusion portion having a first inclined surface, the second protrusion portion having a second inclined surface, the first inclined surface and the second inclined surface of each protrusion unit being configured to clamp a corresponding optical fiber when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
16. The method of manufacturing a package structure for aligning and connecting an optical fiber to a chip as claimed in claim 15,
the plurality of protruding units are arranged at intervals along the second direction for positioning the positioning assembly of each optical fiber.
17. The method of manufacturing a package structure for aligning and connecting an optical fiber to a chip as claimed in claim 15,
the first and second inclined surfaces of each protruding unit and the first surface between the first and second inclined surfaces are configured as a fiber cage so that the corresponding optical fiber abuts against the first inclined surface, the second inclined surface, and the first surface, respectively, when the optical fiber in the external optical fiber array is placed on the first surface of the first semiconductor chip.
18. The method of claim 16, wherein the optical fibers are aligned to connect to the package structure of the chip,
the first protruding part and the second protruding part are made of organic matters;
the first protruding part and the second protruding part are formed on the first surface of the first semiconductor chip in a nano-inscribing mode.
19. The method of claim 14, wherein the method further comprises aligning the optical fibers to the package structure of the chip,
a plurality of stopper structures are formed on the first surface, and the stopper structures are formed on the first surface and are located at an edge of the positioning region on a side close to the light coupling region, the stopper structures being arranged in a first direction.
20. The method of manufacturing a package structure for aligning and connecting an optical fiber to a chip as claimed in claim 19,
the stop structures are made of organic matters;
the plurality of stop structures are formed on the first surface of the first semiconductor chip in a nano-inscribing manner.
21. The method of claim 14, wherein the method further comprises aligning the optical fibers to the package structure of the chip,
The first semiconductor chip comprises a photonic integrated circuit chip or a photonic interposer.
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| CN202311659654.0A CN117471625A (en) | 2023-12-05 | 2023-12-05 | Package structure for aligning and connecting optical fiber to chip and manufacturing method thereof |
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| CN202311659654.0A CN117471625A (en) | 2023-12-05 | 2023-12-05 | Package structure for aligning and connecting optical fiber to chip and manufacturing method thereof |
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