CN117471282A - Semiconductor vacuum test box - Google Patents

Abstract

The application relates to a semiconductor vacuum test box, which relates to the technical field of test equipment and comprises a box body, wherein an opening is formed on one side of the box body, a box door for closing the opening is hinged on the box body, and a first driving piece for driving the box door to rotate is arranged on the box body; the box body is internally provided with a base in a sliding manner, the base is provided with a test board, the box body is internally provided with a second driving piece, the second driving piece is used for driving the base to slide out or slide in through the opening, and the base is provided with a baffle plate capable of sealing the opening. The cooperation of each part in this application need not the manual chamber door of opening of operating personnel, and the sealed side of formation can be protected operating personnel to base, baffle and chamber door enclose jointly, and avoided high temperature gas to overflow fast and cause the scald to operating personnel through the opening.

Description

Semiconductor vacuum test box

Technical Field

The application relates to the field of test equipment technology, in particular to a semiconductor vacuum test box.

Background

In order to achieve the qualification rate of semiconductor chips, almost all semiconductor chips are subjected to burn-in testing before leaving the factory; the semiconductor chip is tested in a vacuum environment to avoid oxidation of pins of the semiconductor chip in an aerobic environment, so that the semiconductor chip is tested by a vacuum test box.

The vacuum test box comprises a box body and a box door, wherein a plurality of test boards are arranged in the box body, the semiconductor chips to be tested are arranged on the test boards, the test boards are used for providing necessary system signals for the semiconductor chips to be tested, simulating the working state of the semiconductor chips, accelerating the electrical faults of the semiconductor chips under the condition of high temperature, acquiring the fault rate of the semiconductor chips in a period of time, and enabling the semiconductor chips to work under a given load state so that defects of the semiconductor chips occur in a shorter time, thereby obtaining the fault rate of the semiconductor chips approximately in life cycle and avoiding faults occurring in early use.

The vacuum test box in the prior art is mostly in a mode of opening the box door at the side surface, namely, the box door is hinged to one side of the box body, after the test of the semiconductor chip is finished, an operator needs to open the box door to open the box body, and then stretches hands into the box body, so that the semiconductor chip is pulled out of the test board. However, since the test of the semiconductor chip is usually performed in a high-temperature environment, when an operator opens the box door, high-temperature gas in the test box can quickly overflow through the opening, and scalding of the operator at the opening is easily caused; and the temperature in the box body after the test is finished is higher, when an operator stretches hands into the box body to take the semiconductor chip, the operator is easy to scald due to mistaken touch on the inner wall of the box body, and certain potential safety hazards exist.

Disclosure of Invention

In order to improve the problems in the art, the present application provides a semiconductor vacuum test chamber.

The application provides a semiconductor vacuum test box adopts following technical scheme:

the semiconductor vacuum test box comprises a box body, wherein an opening is formed on one side of the box body, a box door for closing the opening is hinged to the box body, and a first driving piece for driving the box door to rotate is arranged on the box body; the box body is internally provided with a base in a sliding manner, the base is provided with a test board, the box body is internally provided with a second driving piece, the second driving piece is used for driving the base to slide out or slide in through the opening, and the base is provided with a baffle plate capable of sealing the opening.

By adopting the technical scheme, when the semiconductor is tested, the semiconductor chip is mounted on the test board, the whole base is positioned in the box body, the baffle plate seals the opening, the box door is positioned on one side of the baffle plate and is attached to the baffle plate, and the whole box body is in a sealed state; after the test of the semiconductor chip is finished, the box door is driven by the first driving piece to rotate in a direction away from the baffle plate, and then the base is driven by the second driving piece to slide, so that the base can slide out through the opening. And the base is at gliding in-process, and the baffle is followed the base and is slided in step, and base, baffle and chamber door enclose jointly and establish and form the closed side, and the gliding in-process of baffle, the bore of box and external intercommunication increases gradually, and at this in-process, the interior high temperature gas of box slowly shifts out through the bore of increase gradually, and operating personnel can be located closed side one side to avoid being scalded by high temperature gas. When the base slides out completely, after high-temperature gas overflows, the box door is driven to rotate in the same direction through the first driving piece, so that the box door is far away from the base, a space is formed between the box door and the base and between the box door and the baffle, and an operator can take out the semiconductor chip on the test board. The cooperation of all the components in the process does not need to manually open the box door by an operator, the base, the baffle and the box door are jointly surrounded to form a closed side, so that the operator can be protected, and the operator is prevented from being scalded due to the rapid overflow of high-temperature gas through the opening; in addition, after the base drives the test board to slide out of the box body, an operator can take down the semiconductor chip from the test board, so that the operator is prevented from being injured by contacting the inner wall of the box body when the semiconductor chip is taken out, and potential safety hazards are reduced.

Optionally, the first driving piece comprises a mounting seat arranged on the box body, a mounting groove is formed in the mounting seat, a first screw rod is rotationally connected in the mounting groove, a first motor is arranged on the mounting seat, and an output shaft of the first motor is fixedly connected with the first screw rod in a coaxial manner; the driving rod is arranged on the screw nut of the first screw rod, one end of the driving rod is hinged with the screw nut of the first screw rod, and the other end of the driving rod is hinged with the box door.

Through adopting above-mentioned technical scheme, the rotation of first motor output shaft drives first lead screw and rotates in the mounting groove, and the rotation of first lead screw drives screw nut and slides in the mounting groove, drives the tip of actuating lever from this and slides in step, through the slip of actuating lever in order to drive the chamber door and rotate, and the chamber door can rotate along keeping away from or being close to open-ended direction from this to the switch of control box.

Optionally, the jack has been seted up on the cell wall of mounting groove, the jack interpolation is equipped with the limiting plate, the limiting plate can with the actuating lever butt is in order to restrict the sliding range of actuating lever.

By adopting the technical scheme, when the semiconductor chip is positioned in the box body for testing, the limiting plate is inserted into the jack, the sliding range of the driving rod along with the screw rod nut of the first screw rod is limited, and when the screw rod nut of the first screw rod slides to be abutted with the groove wall at one end of the mounting groove, the screw rod nut of the first screw rod cannot continuously slide in the same direction, and at the moment, the box door is attached to the baffle plate; after the test of the semiconductor chip is finished, the first motor drives the first screw rod to reversely rotate, the screw rod nut of the first screw rod drives the driving rod to move along the direction close to the limiting plate, when the driving rod slides to be in abutting joint with the limiting plate, the driving rod cannot continuously slide in the same direction, and when the second driving piece subsequently drives the base and the baffle to slide out of the box body, the box door is positioned at a position which can be attached to the baffle, so that the base, the baffle and the box door are jointly enclosed to form a closed side, and the box door is prevented from excessively rotating; when the base completely slides out, after high-temperature gas overflows, the limiting plate is taken out of the jack, the first motor drives the first screw rod to rotate, and the driving rod can continuously move in the same direction, so that the box door is driven to rotate, a space is formed between the box door and the base and between the box door and the baffle, and an operator can take out the semiconductor chip on the test plate.

Optionally, mounting groove one side is provided with and is used for placing the seat of placing of limiting plate, place the seat cavity setting and inside with the jack intercommunication, be provided with in the jack and be used for sealing the flexible pad of jack, flexible pad one end is fixed in on the pore wall of jack, the other end with the pore wall laminating of jack.

By adopting the technical scheme, the placing seat can be used for placing the limiting plate, and when the limiting plate is positioned in the placing seat, the driving rod cannot be contacted with the limiting plate in the process that the driving rod slides along with the screw rod nut of the first screw rod in the mounting groove; through this setting, when the limiting plate need remove the restriction to the actuating lever, can slide the limiting plate in the jack, the limiting plate passes through the flexible pad and gets in and out the seat of placing with one side of jack laminating, and need not to take out the side releasable restriction from the jack with the limiting plate, avoid the limiting plate to break away from the jack from this to prevent to cause the careless omission of limiting plate.

Optionally, the base comprises a bottom plate, the second driving piece is used for driving the bottom plate to slide, the baffle is arranged on the bottom plate, a mounting plate is arranged on the bottom plate in a sliding manner, the sliding direction of the mounting plate is perpendicular to the sliding direction of the bottom plate, and the test plate is arranged on the mounting plate; the base plate is provided with a spring, a first magnetic block is arranged on the spring, and a second magnetic block which is repulsed with the first magnetic block is arranged on the mounting plate.

By adopting the technical scheme, when the semiconductor chip is positioned in the box body, the first magnetic block is far away from the second magnetic block under the action of the second magnetic block, and the spring is in a pressed state; after the high-temperature gas overflows, the box door is driven to rotate in the same direction through the first driving piece, so that the box door is away from the base, a space is formed between the box door and the base and between the box door and the baffle, the spring rebounds to drive the first magnetic block to move along the direction close to the second magnetic block, and the second magnetic block and the first magnetic block repel each other, so that the second magnetic block drives the mounting plate to slide, the mounting plate drives the test plate and the semiconductor chip on the test plate to be away from the bottom plate, and an operator can conveniently take down the semiconductor chip on the test plate.

Optionally, a placement groove is formed in the bottom plate, and the first magnetic block is slidably arranged in the placement groove.

Through adopting above-mentioned technical scheme, spring and first magnetic path all are arranged in the standing groove, and when the resilience of spring driven first magnetic path slides, first magnetic path is arranged in the standing groove, restricts the slip direction of first magnetic path from this, avoids first magnetic path to appear the condition of dislocation at gliding in-process to cause the unstable slip of mounting panel.

Optionally, a guide groove is formed in the bottom plate, and a guide block is arranged on the mounting plate and is located in the guide groove and in sliding fit with the guide groove.

Through adopting above-mentioned technical scheme, the slip of guide block in the guide way drives the mounting panel and slides, restricts the slip direction of mounting panel from this to avoid the gliding in-process of mounting panel to appear unstable condition, lead to producing the influence to the semiconductor chip on the test board.

Optionally, a docking slot for sliding the side end of the mounting plate is formed on the box door.

Through adopting above-mentioned technical scheme, after the base was slipped out completely, high temperature gas overflowed, through first driving piece drive chamber door equidirectional rotation for the base is kept away from to the chamber door, forms the space between chamber door and base and the baffle this moment, and the butt joint groove on the chamber door is docked with the side of mounting panel, and the side of mounting panel is slideable to in the butt joint groove, carries out bearing and spacing to the mounting panel through the butt joint groove, further improves the stability of mounting panel slip in-process.

Optionally, the butt joint groove is kept away from the one end of mounting panel is provided with the third magnetic path, the mounting panel is kept away from the one end of second magnetic path be provided with the fourth magnetic path that the third magnetic path is inhaled mutually.

Through adopting above-mentioned technical scheme, third magnetic path and fourth magnetic path inhale mutually, under the attraction of third magnetic path, the fourth magnetic path removes along the direction that is close to third magnetic path, from this further order about the mounting panel roll-off, improves the flexibility of mounting panel slip in-process.

Optionally, a fixing frame is arranged on the base, and the fixing frame is attached to the inner wall of the box body.

Through adopting above-mentioned technical scheme, when semiconductor chip is located the box and tests, the inner wall laminating of fixed frame and box from this improves the holistic intensity of base for the stability that the base is located the box is higher.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the box door does not need to be opened manually by an operator, the base, the baffle plate and the closed side formed by the box door in a surrounding mode can protect the operator, and the operator is prevented from being scalded due to the fact that high-temperature gas overflows rapidly through the opening; in addition, after the base drives the test board to slide out of the box body, an operator can take down the semiconductor chip from the test board, so that the operator is prevented from being injured by contacting the inner wall of the box body when the semiconductor chip is taken out, and potential safety hazards are reduced;

2. when the semiconductor chip is positioned in the box body, the first magnetic block is far away from the second magnetic block under the action of the second magnetic block, and the spring is in a pressed state; when the test of the semiconductor chip is finished, the base completely slides out, and after the high-temperature gas overflows, the box door is driven by the first driving piece to rotate in the same direction, so that the box door is far away from the base, a space is formed between the box door and the base and between the box door and the baffle, the rebound of the spring drives the first magnetic block to move along the direction close to the second magnetic block, and the second magnetic block is repelled with the first magnetic block, so that the second magnetic block drives the mounting plate to slide, the mounting plate drives the test plate and the semiconductor chip on the test plate to be far away from the bottom plate, and an operator can conveniently take down the semiconductor chip on the test plate;

3. when the semiconductor chip is located in the box body and tested, the fixing frame is attached to the inner wall of the box body, so that the overall strength of the base is improved, and the stability of the base in the box body is higher.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a semiconductor vacuum test box according to an embodiment of the present application, in which a base and a baffle are both located in the box, and a box door rotates to be attached to the baffle;

FIG. 2 is a schematic view of an embodiment in which the door is rotated 90 degrees and the second driving member drives the base to slide out of the housing;

FIG. 3 is a schematic view of an embodiment in which the door is rotated 180 degrees;

FIG. 4 is a schematic view of the first drive member mated with the door of the embodiment;

FIG. 5 is a partial schematic view of a mounting slot in an embodiment;

FIG. 6 is a schematic view of the mating of the cabinet and cabinet door in an embodiment;

FIG. 7 is a cross-sectional view of the base in an embodiment;

fig. 8 is an enlarged view of a portion a in fig. 7.

Reference numerals illustrate: 1. a case; 2. an opening; 3. a door; 4. a first driving member; 41. a mounting groove; 42. a first motor; 43. a first screw rod; 5. a base; 51. a bottom plate; 52. a mounting plate; 6. a test board; 7. a second driving member; 71. a second motor; 72. a second screw rod; 8. a baffle; 9. a driving rod; 91. a driving block; 92. a first hinge shaft; 93. a movable rod; 10. a jack; 11. a limiting plate; 12. a placement seat; 13. a flexible pad; 14. a spring; 15. a first magnetic block; 16. a second magnetic block; 17. a guide groove; 18. a guide block; 19. a butt joint groove; 20. a third magnetic block; 21. a fourth magnetic block; 22. a fixed frame; 23. a second hinge shaft; 24. a limiting hole; 25. a limit protrusion; 26. a through hole; 27. a chute; 28. a slide bar; 29. and a limit groove.

Detailed Description

The present application is described in further detail below in conjunction with figures 1-8.

The embodiment of the application discloses a semiconductor vacuum test box. Referring to fig. 1 and 2, the semiconductor vacuum test box comprises a box body 1, wherein an opening 2 is formed at one side of the box body 1, a box door 3 for closing the opening 2 is hinged on the box body 1, and a first driving piece 4 for driving the box door 3 to rotate is arranged on the box body 1; the box 1 is internally provided with a base 5 in a sliding manner, the base 5 is provided with a test board 6, the box 1 is internally provided with a second driving piece 7, the second driving piece 7 is used for driving the base 5 to slide out or slide in through the opening 2, and the base 5 is provided with a baffle 8 capable of sealing the opening 2.

Referring to fig. 3 and 4, the first driving member 4 includes a mounting seat mounted on the case 1, a mounting groove 41 is formed in the mounting seat, a first screw 43 is rotationally connected in the mounting groove 41, a first motor 42 is mounted on the mounting seat, and an output shaft of the first motor 42 is fixedly connected with the first screw 43 coaxially; a driving block 91 is fixed on a screw nut of the first screw rod 43, the driving block 91 is arranged in the mounting groove 41 in a sliding way, a first hinge shaft 92 is vertically fixed on the driving block 91, and a driving rod 9 is hinged on the first hinge shaft 92; the driving rod 9 comprises a second hinge shaft 23 fixed on the box door 3, the second hinge shaft 23 is arranged in parallel with the first hinge shaft 92, the first hinge shaft 23 is hinged with a movable rod 93, and one end of the movable rod 93 far away from the second hinge shaft 23 is hinged on the first hinge shaft 92.

In the present embodiment, for the convenience of production, the driving lever 9 is provided as the engagement of the second hinge shaft 23 with the movable lever 93, thereby achieving the hinge of the driving lever 9 with the door 3, and in other embodiments, the end of the movable lever 93 may be directly hinged with the door 3.

The rotation of the output shaft of the first motor 42 drives the first screw rod 43 to rotate in the mounting groove 41, the rotation of the first screw rod 43 drives the screw rod nut to slide in the mounting groove 41, the end part of the movable rod 93 is driven to synchronously slide, the box door 3 is driven to rotate through the sliding of the movable rod 93, and the box door 3 can rotate in a direction away from or close to the opening 2, so that the opening and closing of the box body 1 are controlled.

Referring to fig. 4 and 5, a hollow placement seat 12 is fixed at one side of a mounting groove 41, a jack 10 communicated with the placement seat 12 is formed in the mounting groove 41, a flexible pad 13 is fixed in the jack 10, the flexible pad 13 is in a sheet shape, one end of the flexible pad 13 is fixed on the hole wall of the jack 10, and the other end is attached to the hole wall of the jack 10; the limiting plate 11 is arranged in the placing seat 12 in a sliding manner, the limiting plate 11 can be propped against the driving block 91 to limit the sliding range of the driving block 91, the placing seat 12 is provided with the limiting hole 24, the limiting hole 24 is long-strip-shaped, the limiting protrusion 25 is arranged in the limiting hole 24 in a sliding manner, the limiting protrusion 25 is vertically fixed on the limiting plate 11, and one end of the placing seat 12 far away from the jack 10 is provided with the through hole 26 for the end part of the limiting plate 11 to slide out.

The placement seat 12 may be used for placing the limiting plate 11, and when the limiting plate 11 is located in the placement seat 12, the driving block 91 does not contact with the limiting plate 11 during the process that the driving rod 9 slides along the screw nut of the first screw 43 in the mounting groove 41; when the semiconductor chip is positioned in the box body 1 for testing, the limiting protrusion 25 is slid, the limiting plate 11 is driven by the sliding of the limiting protrusion 25 in the limiting hole 24 to slide, the limiting plate 11 moves out of the placing seat 12 through the flexible pad 13 and is attached to the jack 10, so that the semiconductor chip enters the mounting groove 41, at the moment, the sliding range of the movable rod 93 along with the screw nut of the first screw rod 43 is limited, and when the screw nut of the first screw rod 43 slides to be abutted against the groove wall at one end of the mounting groove 41, the movable rod 93 cannot continuously slide in the same direction, and at the moment, the box door 3 is attached to the baffle 8; after the test of the semiconductor chip is finished, the first motor 42 drives the first screw rod 43 to reversely rotate, the screw nut of the first screw rod 43 drives the driving block 91 to move along the direction close to the limiting plate 11, namely to move towards the middle part of the mounting groove 41, when the driving block 91 slides to be abutted against the limiting plate 11, the driving rod 9 cannot continuously slide in the same direction, at the moment, the box door 3 rotates 90 degrees, and then, when the base 5 and the baffle 8 are driven to slide out of the box body 1, the box door 3 is positioned at a position which can be attached to the baffle 8, so that the base 5, the baffle 8 and the box door 3 are jointly enclosed to form a closed side, and excessive rotation of the box door 3 is avoided; when the base 5 is completely slipped out, after high-temperature gas overflows, the limiting plate 11 is reversely slipped, so that the limiting plate 11 is moved into the placing seat 12, the first motor 42 drives the first screw rod 43 to rotate, the driving block 91 can continue to move in the same direction, and the box door 3 is driven to rotate 90 degrees again, so that a space is formed between the box door 3 and the base 5 and the baffle plate 8, and an operator can take out the semiconductor chip on the test board 6.

Referring to fig. 6, two parallel sliding grooves 27 are formed in the bottom wall in the box body 1, a second motor 71 is installed in one sliding groove 27, an output shaft of the second motor 71 is fixedly connected with a second screw rod 72 in a coaxial mode, the second screw rod 72 is located in the sliding groove 27 and is rotationally connected with the sliding groove 27, a sliding rod 28 is fixed in the other sliding groove 27, and the sliding rod 28 is parallel to the second screw rod 72 and is arranged along the length direction of the sliding groove 27; the base 5 includes a bottom plate 51, the baffle 8 is vertically fixed at one end of the bottom plate 51, two sliding blocks (not shown in the figure) are fixed at the bottom of the bottom plate 51, the two sliding blocks are respectively located in the two sliding grooves 27 and are slidably connected with the corresponding sliding grooves 27, one sliding block is fixedly connected with a screw nut of the first screw rod 43, and the other sliding block is slidably connected with the sliding rod 28. Rotation of the output shaft of the second motor 71 drives the sliding blocks to slide in the corresponding sliding grooves 27, so that the bottom plate 51 is driven to drive the baffle plate 8 to slide.

Referring to fig. 2, a fixing frame 22 is fixed to the bottom plate 51, and when the entire bottom plate 51 is positioned in the case 1, the fixing frame 22 is bonded to the inner wall of the case 1, thereby improving the strength of the entire bottom plate 51.

Referring to fig. 7 and 8, a mounting plate 52 is slidably arranged on the bottom plate 51, two parallel guide grooves 17 are formed in the bottom plate 51, the guide grooves 17 are perpendicular to the sliding grooves 27, two guide blocks 18 are fixed at the bottom of the mounting plate 52, and the two guide blocks 18 are respectively located in the two sliding grooves 27 and are slidably connected with the corresponding sliding grooves 27; the springs 14 are fixed in the two guide grooves 17, one ends of the springs 14 are fixed with the groove walls of the corresponding guide grooves 17, the other ends of the springs 14 are fixed with the first magnetic blocks 15, the second magnetic blocks 16 are fixed on the guide blocks 18 positioned in the corresponding guide grooves 17, and the second magnetic blocks 16 repel the first magnetic blocks 15.

When the semiconductor chip is positioned in the box body 1, under the action of the second magnetic block 16, the first magnetic block 15 is far away from the second magnetic block 16, and the spring 14 is in a pressed state; after the semiconductor chip tests are finished, the bottom plate 51 slides out completely, and after the high-temperature gas overflows, the box door 3 is driven by the first motor 42 to rotate in the same direction, so that the box door 3 rotates 180 degrees, at the moment, a space is formed between the box door 3, the base 5 and the baffle 8, the rebound of the spring 14 drives the first magnetic block 15 to move along the direction close to the second magnetic block 16, the second magnetic block 16 and the first magnetic block 15 repel each other, the second magnetic block 16 drives the mounting plate 52 to slide, the mounting plate 52 drives the test plate 6 and the semiconductor chip on the test plate to be far away from the bottom plate 51, and therefore an operator can conveniently take down the semiconductor chip on the test plate 6.

In the embodiment of the present application, for the convenience of production, the placement groove and the guide groove 17 are integrally communicated, and therefore, the first magnet 15 is directly provided in the guide groove 17.

Referring to fig. 8, a limiting groove 29 communicated with the guiding groove 17 is formed in the mounting plate 52, the limiting groove 29 is parallel to the guiding groove 17, and the guiding block 18, the first magnetic block 15 and the second magnetic block 16 all comprise protruding portions, and the protruding portions are located in the limiting groove 29 and are slidably connected with the limiting groove 29, so that the guiding block 18, the first magnetic block 15 and the second magnetic block 16 are prevented from being separated from the guiding groove 17.

Referring to fig. 3, a fourth magnet 21 is fixed to one end of the mounting plate 52 near the door 3, a docking slot 19 is formed in the door 3 for sliding the side end of the mounting plate 52, a third magnet 20 is fixed to the end of the docking slot 19, and the third magnet 20 and the fourth magnet 21 are attracted to each other.

When the door 3 rotates 90 degrees, the second motor 71 drives the bottom plate 51 to slide out of the box body 1, the mounting plate 52 slides along with the bottom plate 51, and the side end of the mounting plate 52 can slide in the butt joint groove 19, so that the stability of the mounting plate 52 in the sliding-out process is improved; when the door 3 rotates 180 degrees, the fourth magnetic block 21 moves along the direction approaching the third magnetic block 20 under the attraction of the third magnetic block 20, the docking slot 19 on the door 3 is docked with the side end of the mounting plate 52, and the side end of the mounting plate 52 can slide into the docking slot 19.

The implementation principle of the semiconductor vacuum test box in the embodiment of the application is as follows: when a semiconductor is tested, the semiconductor chip is mounted on the test board 6, the whole base 5 is positioned in the box body 1, the baffle plate 8 seals the opening 2, the box door 3 is positioned on one side of the baffle plate 8 and is attached to the baffle plate 8, and the whole box body 1 is in a sealing state; after the test of the semiconductor chip is completed, the movable rod 93 is driven to slide by the first motor 42, thereby driving the door 3 to rotate in a direction away from the barrier 8, the door 3 is rotated by 90 degrees, and then the base 5 is driven to slide by the rotation of the second motor 71, so that the bottom plate 51 and the mounting plate 52 can slide out through the opening 2. And bottom plate 51 and mounting panel 52 are in the gliding in-process, and bottom plate 51 is followed to baffle 8 and is slided in step, and bottom plate 51, baffle 8 and chamber door 3 enclose jointly and establish and form the closed side, and the gliding in-process of baffle 8, box 1 and external intercommunication's bore increase gradually, and in this process, the interior high temperature gas of box 1 slowly shifts out through the bore of increase gradually, and operating personnel can be located closed side one side to avoid being scalded by high temperature gas. When the bottom plate 51 is completely slipped out, after the high-temperature gas overflows, the movable rod 93 is driven by the first motor 42 to continue sliding, the box door 3 continues to rotate in the same direction, and the box door 3 rotates 180 degrees, so that the box door 3 is far away from the base 5, at this time, a space is formed between the box door 3 and the base 5 and the baffle plate 8, and an operator can take out the semiconductor chip on the test board 6. The cooperation of all the components in the process does not need to manually open the box door 3 by an operator, the base 5, the baffle 8 and the box door 3 are arranged together to form a closed side, so that the operator can be protected, and the condition that high-temperature gas overflows rapidly through the opening 2 to scald the operator is avoided; in addition, after the base 5 drives the test board 6 to slide out of the box body 1, an operator can take down the semiconductor chip from the test board 6, so that the operator is prevented from being injured by contacting the inner wall of the box body 1 when the semiconductor chip is taken out, and potential safety hazards are reduced.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (10)

1. A semiconductor vacuum test box is characterized in that: the novel box comprises a box body (1), wherein an opening (2) is formed in one side of the box body (1), a box door (3) for closing the opening (2) is hinged to the box body (1), and a first driving piece (4) for driving the box door (3) to rotate is arranged on the box body (1); the novel test box is characterized in that a base (5) is arranged in the box body (1) in a sliding manner, a test board (6) is arranged on the base (5), a second driving piece (7) is arranged in the box body (1), the second driving piece (7) is used for driving the base (5) to slide out or slide in through the opening (2), and a baffle (8) capable of sealing the opening (2) is arranged on the base (5).

2. A semiconductor vacuum test chamber according to claim 1, wherein: the first driving piece (4) comprises a mounting seat arranged on the box body (1), a mounting groove (41) is formed in the mounting seat, a first screw rod (43) is connected in the mounting groove (41) in a rotating mode, a first motor (42) is arranged on the mounting seat, and an output shaft of the first motor (42) is fixedly connected with the first screw rod (43) in a coaxial mode; a driving rod (9) is arranged on a screw nut of the first screw rod (43), one end of the driving rod (9) is hinged with the screw nut of the first screw rod (43), and the other end of the driving rod is hinged with the box door (3).

3. A semiconductor vacuum test chamber according to claim 2, wherein: the slot wall of the mounting slot (41) is provided with an inserting hole (10), a limiting plate (11) is inserted into the inserting hole (10), and the limiting plate (11) can be abutted with the driving rod (9) to limit the sliding range of the driving rod (9).

4. A semiconductor vacuum test chamber according to claim 3, wherein: the utility model discloses a socket, including installation groove (41), locating plate (11), jack (10) and flexible pad (13), installation groove (41) one side is provided with and is used for placing place seat (12) of limiting plate (11), place seat (12) cavity setting and inside with jack (10) intercommunication, be provided with in jack (10) and be used for the closure flexible pad (13) one end is fixed in on the pore wall of jack (10), the other end with the pore wall laminating of jack (10).

5. A semiconductor vacuum test chamber according to claim 1, wherein: the base (5) comprises a bottom plate (51), the second driving piece (7) is used for driving the bottom plate (51) to slide, the baffle (8) is arranged on the bottom plate (51), a mounting plate (52) is arranged on the bottom plate (51) in a sliding mode, the sliding direction of the mounting plate (52) is perpendicular to the sliding direction of the bottom plate (51), and the test plate (6) is arranged on the mounting plate (52); the base plate (51) is provided with a spring (14), the spring (14) is provided with a first magnetic block (15), and the mounting plate (52) is provided with a second magnetic block (16) which is repulsed with the first magnetic block (15).

6. A semiconductor vacuum test chamber according to claim 5, wherein: the bottom plate (51) is provided with a placing groove, and the first magnetic block (15) is slidably arranged in the placing groove.

7. A semiconductor vacuum test chamber according to claim 5, wherein: the bottom plate (51) is provided with a guide groove (17), the mounting plate (52) is provided with a guide block (18), and the guide block (18) is positioned in the guide groove (17) and is in sliding fit with the guide groove (17).

8. A semiconductor vacuum test chamber according to claim 5, wherein: the box door (3) is provided with a butt joint groove (19) for sliding the side end of the mounting plate (52).

9. A semiconductor vacuum test chamber according to claim 8, wherein: the butt joint groove (19) is far away from one end of the mounting plate (52) is provided with a third magnetic block (20), and one end of the mounting plate (52) far away from the second magnetic block (16) is provided with a fourth magnetic block (21) attracted with the third magnetic block (20).

10. A semiconductor vacuum test chamber according to claim 1, wherein: the base (5) is provided with a fixed frame (22), and the fixed frame (22) is attached to the inner wall of the box body (1).