CN117470871B - Detection device - Google Patents
Detection device Download PDFInfo
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- CN117470871B CN117470871B CN202311793770.1A CN202311793770A CN117470871B CN 117470871 B CN117470871 B CN 117470871B CN 202311793770 A CN202311793770 A CN 202311793770A CN 117470871 B CN117470871 B CN 117470871B
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- 238000001514 detection method Methods 0.000 title claims abstract description 21
- 230000033001 locomotion Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 26
- 230000007246 mechanism Effects 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 70
- 239000000835 fiber Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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Abstract
The invention discloses a detection device, which is used for detecting a wafer and comprises the following components: the workbench is provided with an avoidance opening on the table top, and the avoidance opening penetrates through the table top of the workbench in the up-down direction; the bearing jig is arranged on the workbench and is positioned above the avoidance port, and the bearing jig is configured to support the wafer; the camera is arranged on the workbench, faces the wafer and is used for shooting a detection image for the wafer; the camera is arranged on the workbench through a first position adjusting component, and the first position adjusting component is configured to adjust the focal length of the camera and the inclination angle of the camera relative to the wafer.
Description
Technical Field
The invention belongs to the technical field of detection equipment, and particularly relates to detection equipment for wafer detection.
Background
A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape. The processing requirement of the wafer is high, and each processed wafer needs to be detected one by one so as to ensure the quality of the wafer. In general, one device is only suitable for a wafer of a certain size, and different detection devices are required to be configured for wafers of different sizes, so that the universality of the detection devices is poor. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to provide the detection equipment with good universality.
In order to solve the above technical problems, the present invention provides a detecting apparatus for detecting a wafer, including: the workbench is provided with an avoidance opening on the table top, and the avoidance opening penetrates through the table top of the workbench in the up-down direction; the bearing jig is arranged on the workbench and is positioned above the avoidance port, and the bearing jig is configured to support the wafer; the camera is arranged on the workbench, faces the wafer and is used for shooting a detection image for the wafer; the camera is arranged on the workbench through a first position adjusting component, and the first position adjusting component is configured to adjust the focal length of the camera and the inclination angle of the camera relative to the wafer.
Preferably, the carrying jig at least comprises a carrying substrate and a plurality of clamping assemblies arranged on the carrying substrate, wherein the carrying substrate is provided with a first through hole penetrating through the carrying substrate in the up-down direction, and the plurality of clamping assemblies are distributed on the carrying substrate at intervals along the circumferential direction of the first through hole;
the clamping assembly comprises a clamping drive and a clamping block connected with the clamping drive, and the clamping block responds to the linear reciprocating motion of the clamping drive to do telescopic motion in the radial direction of the wafer;
the telescopic movement of the clamping block enables the clamping block to have a clamping state when clamping the wafer and a retraction state when keeping away from the wafer.
Preferably, a supporting portion is provided at one end of the clamping block, which is close to the wafer, and in the clamped state, the supporting portion is in contact with the peripheral wall of the wafer and the edge area of the bottom end face.
Preferably, the clamping assembly further comprises a ball guide shaft module and a push-pull block, the ball guide shaft module comprises a guide shaft and a ball shaft sleeve, the ball shaft sleeve is sleeved on the guide shaft and fixedly arranged on the bearing substrate, one end, close to the wafer, of the guide shaft is connected with the clamping block, the push-pull block is provided with a second through hole for the guide shaft to penetrate, and the push-pull block is in sliding fit with the guide shaft;
the guide shaft is fixedly provided with a first limiting piece and a second limiting piece, the first limiting piece and the second limiting piece are respectively located on two sides of the push-pull block, the first limiting piece is close to the clamping blocks in distribution compared with the second limiting piece, a biasing piece is abutted between the first limiting piece and the push-pull block, and under the action of the biasing piece, the push-pull block is elastically abutted with the second limiting piece.
Preferably, the clamping assembly further comprises a height adjusting plate, the ball guide shaft module is arranged on the height adjusting plate, and the height adjusting plate is arranged on the bearing substrate;
the clamping drive is a linear motor, and the height adjusting plate is configured to adjust the distance between the central axis of the guide shaft and the bearing substrate so that the central axis of the output shaft of the linear motor and the central axis of the guide shaft are located on the same horizontal plane.
Preferably, the first position adjusting assembly comprises a camera supporting plate, a first guiding unit and a first driving unit, wherein the camera supporting plate is provided with a camera, the camera supporting plate is arranged on the workbench in a sliding way through the first guiding unit, the sliding track of the camera supporting plate is an arc line, and the first driving unit is configured to drive the camera supporting plate to move on the workbench along the sliding track;
the camera is arranged on the camera support plate, the camera is arranged on the camera support plate through the linear reciprocating mechanism, and the linear reciprocating mechanism is configured to drive the camera to do linear reciprocating motion along the radial direction of the sliding track of the camera support plate.
Preferably, the first driving unit comprises a motor fixedly arranged on the workbench, a gear in transmission connection with an output shaft of the motor, and an arc-shaped rack meshed with the gear and fixedly arranged on the camera supporting plate;
the first guide unit comprises an arc-shaped guide rail fixedly arranged on the workbench and an arc-shaped slide block matched with the arc-shaped guide rail, and the camera support plate is fixedly connected with the arc-shaped slide block.
Preferably, the arc-shaped guide rail is arranged on the workbench through a connecting plate, the connecting plate is provided with a motion limiting unit arranged on the side wall of the arc-shaped guide rail, and the motion limiting unit is configured to limit the motion position of the arc-shaped sliding block.
Preferably, the detection device further includes: the light source is arranged on the workbench and is used for being matched with the camera; the second position adjusting assembly is connected with the light source, the light source is arranged on the workbench through the second position adjusting assembly, and the second position adjusting assembly is configured to adjust the inclination angle of the light source relative to the wafer;
the light source and the camera are located on the same side of the wafer, and are in opposite distribution.
Preferably, the bearing jig is arranged above the avoidance port through a linear module.
The technical scheme provided by the invention has the following advantages:
in this embodiment, the first position adjusting component can adjust the focal length of the camera and the inclination angle of the camera relative to the wafer, so that the camera can detect wafers with different sizes, and the universality of the detection device is effectively expanded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic perspective view of a detection device according to the present invention;
FIG. 2 is a schematic diagram of the positional relationship among a table, a camera, and a light source;
FIG. 3 is a schematic view of the structure of FIG. 2 in a bottom view;
FIG. 4 is a schematic diagram of a carrier fixture;
FIG. 5 is a schematic view of the clamp assembly in a top view;
FIG. 6 is a schematic view of the clamp assembly in a bottom view;
FIG. 7 is a schematic cross-sectional view of a clamping assembly;
FIG. 8 is an exploded view of the clamping assembly;
FIG. 9 is a schematic view of the first position adjustment assembly at a first viewing angle;
FIG. 10 is a schematic view of the first position adjustment assembly at a second view angle;
FIG. 11 is a schematic view of the positional relationship between the stage and the second set of correlation fibers;
fig. 12 is an enlarged schematic view of the area a in fig. 11.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. The invention will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.
Referring to fig. 1 to 3, the present invention provides a detecting apparatus for detecting an appearance quality of a wafer 900. Of course, the detection device can also be used for appearance detection of other disc-shaped workpieces. In this embodiment, the inspection apparatus includes a workbench 100, a carrying jig 200, a camera 300, and a light source 500. The carrying jig 200, the camera 300 and the light source 500 are all disposed on the workbench 100, and the workbench 100 is used for mounting the carrying jig 200, the camera 300 and the light source 500.
The carrier 200 is used for supporting the wafer 900, and the wafer 900 is placed on the carrier 200 during the inspection process. Referring to fig. 4 to 8, the carrier tool 200 includes a carrier substrate 210, and a plurality of clamping assemblies 220 disposed on the carrier substrate 210. The carrier substrate 210 is provided with a first through hole 211 penetrating the carrier substrate in the vertical direction, the first through hole 211 is circular, and the plurality of clamping assemblies 220 are distributed on the carrier substrate 210 at intervals along the circumferential direction of the first through hole 211. An opening 212 communicating with the first through hole 211 is disposed on an edge of the carrier substrate 210. The opening 212 forms an access passage for the robot.
The clamping assembly 220 at least includes a clamping drive 221, and a clamping block 222 coupled to the clamping drive 221. The clamping drive 221 is capable of outputting a linear reciprocating motion, for example, the clamping drive 221 may be a linear motor, a cylinder, a ball screw, or the like. Wherein the clamping drive 221 is preferably a linear motor, which is capable of providing relatively precise movement.
The clamp block 222 performs a telescopic motion in a radial direction of the wafer 900 in response to the linear reciprocation of the clamp drive 221. The telescopic movement of the clamping block 222 causes it to have a clamped state when clamping the wafer 900 and a retracted state when moving away from the wafer 900. In the clamped state, the clamping block 222 protrudes toward the wafer 900 by the clamping drive 221 to clamp the wafer 900. In the retracted state, the grip block 222 is reversely retracted by the grip drive 221.
The end of the clamping block 222 near the wafer 900 is provided with a supporting portion 2221, and in this embodiment, the supporting portion 2221 and the clamping block 222 are integrally formed. The clamping block 222 is made of polyether-ether-ketone material and has good mechanical properties.
In the clamped state, the holder 2221 contacts the peripheral wall of the wafer 900 and the edge region of the bottom end surface. The support portion 2221 is in an "L" shape, and the "L" shape of the support portion 2221 can reduce the contact area with the wafer 900 as much as possible, and reduce the friction between the clamping block 222 and the wafer 900 during the expansion and contraction movement.
Further, the clamping assembly 220 also includes a ball guide shaft module and a push-pull block 223. The ball guide shaft module comprises a guide shaft 224 and a ball shaft sleeve 225, and the ball shaft sleeve 225 is sleeved on the guide shaft 224. The inner ring of the ball sleeve 225 is provided with a plurality of balls (not shown), and the balls are distributed at intervals in the circumferential direction and the axial direction of the ball sleeve 225. The guide shaft 224 has a bead groove formed in its outer peripheral surface for engaging the ball. The arrangement of the balls and the ball grooves can effectively prevent the guide shaft 224 from rotating relative to the ball shaft sleeve 225, and improve the movement accuracy of the guide shaft 224.
The ball bushing 225 is provided with a bushing seat 2251, and the ball bushing 225 is fixed to the carrier substrate 210 through the bushing seat 2251. The push-pull block 223 is provided with a second through hole for the guide shaft 224 to penetrate, and the push-pull block 223 is in sliding fit with the guide shaft 224.
Wherein, the second through hole is provided with a linear bearing 2242 therein. The second through hole is a stepped hole, which is divided into a large diameter portion and a small diameter portion in the axial direction of the guide shaft 224, and the large diameter portion of the small diameter portion is distributed closer to the second limiting member 227. The large diameter portion accommodates the linear bearing 2242, and a limit shoulder for limiting the linear bearing 2242 is formed between the large diameter portion and the small diameter portion.
The large diameter portion is formed with an opening on the outer wall surface of the push-pull block 223, and a baffle 2243 is provided at the opening. The baffle 2243 is fixedly arranged on the outer wall surface of the push-pull block 223, and the baffle 2243 is provided with a baffle hole for the guide shaft 224 to pass through. The stopper 2243 and the above-described limit shoulder can limit the linear bearing 2242 in the axial direction of the guide shaft 224.
The clamping block 222 is connected to one end of the guide shaft 224 near the wafer 900. Specifically, the clamping block 222 is disposed on the guide shaft 224 through the engagement seat 2241, and the engagement seat 2241 is connected with the clamping block 222 by a screw.
The guide shaft 224 is further fixedly provided with a first limiting piece 226 and a second limiting piece 227, the first limiting piece 226 and the second limiting piece 227 are respectively located on two sides of the push-pull block 223, and the first limiting piece 226 is distributed closer to the clamping block 222 than the second limiting piece 227. Preferably, the first limiting member 226 and the second limiting member 227 are annular, and are fixedly arranged on the guide shaft 224 through fasteners.
A biasing member 228 is abutted between the first limiting member 226 and the push-pull block 223, and the biasing member 228 is a compression spring, specifically, one end of the biasing member 228 abuts against the first limiting member 226, and the opposite end abuts against the baffle 2243.
Under the action of the biasing member 228, the push-pull block 223 elastically abuts against the second limiting member 227. When the clamping drive 221 drives the push-pull block 223 to move (extend) along the direction from the second limiting member 227 to the first limiting member 226, the guide shaft 224 moves towards the wafer 900, and when the clamping block 222 on the guide shaft 224 contacts with the wafer 900, the biasing member 228 is compressed by the push-pull block 223, so as to play a role of buffering and avoid damaging the wafer 900.
The reason for the biasing member 228 being compressed is: when the clamping block 222 contacts the wafer 900, the control unit (not shown) controls the clamping drive 221 to stop moving, and there is a time difference between when the control unit sends a signal to the clamping drive 221 and when the clamping drive 221 receives the signal, that is, after the clamping block 222 contacts the wafer 900, the push-pull block 223 also moves briefly, and if the biasing member 228 is not provided, the clamping block 222 generates an additional force to the wafer 900, which is not desirable.
When the clamping drive 221 drives the push-pull block 223 to move (retract) along the direction from the first limiting member 226 to the second limiting member 227, the push-pull block 223 abuts against the second limiting member 227 under the action of the biasing member 228, so as to drive the guide shaft 224 to move away from the wafer 900. When the wafer 900 is inspected, the plurality of clamping blocks 222 are retracted one by one, and when a certain clamping block 222 is in a retracted state, the camera 300 can capture the area of the wafer 900 that was previously covered by the clamping block 222.
In the present embodiment, the clamping assembly 220 further includes a clamping and limiting unit, which includes a sensing piece 2231, a first photoelectric sensor 2232, and a second photoelectric sensor 2233. The sensing piece 2231 is fixedly provided on the push-pull block 223 to move in synchronization with the push-pull block 223. The sensing piece 2231 is provided with a first sensing part M and a second sensing part N, the first sensing part M is matched with the first photoelectric sensor 2232, and the second sensing part N is matched with the second photoelectric sensor 2233.
In operation, when the clamping block 222 is in the clamping state, the first sensing portion M triggers the first photoelectric sensor 2232, and the second sensing portion N does not trigger the second photoelectric sensor 2233. If the second sensing portion N triggers the second photoelectric sensor 2233 while the clamping block 222 is in the clamped state, it indicates that the wafer 900 is not clamped correctly and inspection is required.
Referring to fig. 6, the clamping assembly 220 further includes a height adjustment plate 229, the ball guide shaft module is disposed on the height adjustment plate 229, and the height adjustment plate 229 is disposed on the carrier substrate 210. The height adjustment plate 229 is used to adjust the distance between the central axis X of the guide shaft 224 and the carrier substrate 210 so that the central axis Y of the output shaft of the clamping drive 221 (linear motor) and the central axis X of the guide shaft 224 are located on the same horizontal plane, thereby improving the movement accuracy of the clamping drive 221.
Further, the clamping drive 221 is disposed on the height-adjusting plate 229 through the connecting plate 2291, so that the clamping drive 221, the height-adjusting plate 229 and the ball guide shaft module form a mounting unit, and the mounting unit has the advantages of convenience and flexibility in assembly and disassembly.
In the present embodiment, the table surface of the table 100 is provided with the avoidance port 110, and the avoidance port 110 penetrates the table surface of the table 100 in the up-down direction. The bearing jig 200 is arranged above the avoiding port 110 through the linear module 120. The linear modules 120 are provided with a pair, and the linear modules 120 are installed on the surface of the workbench 100 and symmetrically distributed on two sides of the avoidance port 110. The carrying jig 200 can perform linear reciprocating motion in the length direction of the avoidance port 110 through the linear module.
The camera 300 and the light source 500 are located below the wafer 900, and the avoidance port 110 is used to avoid the camera 300 and the light source 500. Of course, the camera 300 and the light source 500 may be disposed above the wafer 900, and the positional relationship among the wafer 900, the camera 300 and the light source 500 may be adjusted according to practical situations, and the following description will be given by taking the case that the camera 300 and the light source 500 are disposed below the wafer 900.
The camera 300 is disposed toward the wafer 900 for capturing a detection image for the wafer 900. In this embodiment, the camera 300 is disposed on the workbench 100 through the first position adjusting assembly 400, and the first position adjusting assembly 400 is used for adjusting the focal length of the camera 300 and the inclination angle of the camera 300 relative to the wafer 900, so that the camera 300 can detect wafers 900 with different sizes, and the universality of the detection device is effectively expanded. The "different sized wafers 900" described above refer to wafers having different diameters.
Referring to fig. 9 and 10, the first position adjusting assembly 400 includes a camera support plate 410, a first guide unit 420, and a first driving unit 430. The camera support plate 410 is mounted with the camera 300, and the camera support plate 410 is slidably disposed on the table 100 through the first guide unit 420.
The sliding track of the camera support plate 410 is an arc line, and the first driving unit 430 is used to drive the camera support plate 410 to move along the sliding track on the workbench 100. In this embodiment, the sliding track is an arc line with an upward opening. When the camera 300 moves along the sliding track, the tilt angle with the wafer 900 can be adjusted, so that the camera 300 obtains a suitable shooting angle.
Further, the camera support plate 410 is provided with a linear reciprocating mechanism 440, and the camera 300 is provided on the camera support plate 410 through the linear reciprocating mechanism 440. The linear reciprocating mechanism 440 is used for driving the camera 300 to perform linear reciprocating motion along the radial direction of the sliding track of the camera support plate 410, so as to realize adjustment of the focal length of the camera 300. The linear reciprocating mechanism 440 may be a linear slide, a cylinder, a screw unit, or the like. Preferably, the linear reciprocating mechanism 440 is a linear slide.
In this embodiment, the first driving unit 430 includes a motor 431 fixed on the workbench 100, a gear 432 in driving connection with an output shaft of the motor 431, and an arc-shaped rack 433 meshed with the gear 432 and fixed on the camera support plate 410. The central angle of the arc-shaped rack 433 has a value ranging from 30 ° to 60 °, for example, the central angle of the arc-shaped rack 433 may be 30 °, 35 °, 40 °, 45 °, 50 °, 55 °, 60 °, or may be increased by 1 ° at intervals between 30 ° and 60 °. Preferably, the angle of the central angle of the arc-shaped rack 433 is 40 °.
The first guiding unit 420 includes an arc-shaped guide rail 421 fixed on the workbench 100, and an arc-shaped slider 422 matched with the arc-shaped guide rail 421. The camera support plate 410 is fixedly connected with the arc-shaped slider 422. In the present embodiment, the first driving unit 430 and the first guiding unit 420 are distributed on two opposite sides of the camera support plate 410, so that space is effectively utilized, and the overall structure is attractive and compact.
Wherein, the arc-shaped guide rail 421 is arranged on the workbench 100 through the connecting plate 423. The side wall of the connecting plate 423 provided with the arc-shaped guide rail 421 is provided with a movement limiting unit, and the movement limiting unit is used for limiting the movement position of the arc-shaped sliding block 422.
Specifically, the limiting unit includes two parts, the first part is a mechanical limiting structure 450, and the second part is a photoelectric sensor structure. The mechanical limiting structure 450 is disposed at two ends of the arc-shaped guide rail 421 and is in collision fit with the arc-shaped slider 422, so as to limit the limit position of the arc-shaped slider 422.
In order to reduce the instant impact force between the arc-shaped sliding block 422 and the mechanical limiting structure 450, the mechanical limiting structure 450 is a silica gel block, and the silica gel has a certain elastic deformation capability, and can absorb part of the impact force through elastic deformation, so that the purpose of buffering and damping is achieved.
In this embodiment, the mechanical limiting structure 450 is hollow and cylindrical, and the hollow structure facilitates the installation of the mechanical limiting structure 450 on the connecting plate 423. When the mechanical limiting structure 450 is installed, the hollow holes can accommodate part of the structures of the screws, and the installation is convenient.
The photoelectric sensor structure comprises a sensing piece and a plurality of third photoelectric sensors 460, wherein the third photoelectric sensors 460 are distributed along the extending direction of the sliding track, and the third photoelectric sensors 460 are arranged at equal intervals.
In this embodiment, the light source 500 and the camera 300 are located on the same side of the wafer 900, and the light source 500 and the camera 300 are in a state of being distributed in opposite directions. The light source 500 is a planar light source, and the light source 500 is disposed on the table 100 through the second position adjusting assembly 600. The light source 500 is matched with the camera 300 and faces the wafer 900 to illuminate the wafer 900, so that the camera 300 can collect detection images conveniently, and the collection quality of the images is improved.
The second position adjusting assembly 600 is used for adjusting the inclination angle of the light source 500 relative to the wafer, so that the light source 500 can be suitable for wafers with different sizes, and has the advantage of good versatility. The structure of the second position adjustment assembly 600 is substantially the same as that of the first position adjustment assembly 400, and the structure of the second position adjustment assembly 600 will not be described herein, but reference may be made to the structure of the first position adjustment assembly 400.
In this embodiment, as shown in fig. 4, a first set of correlation fibers 230 is disposed on the carrier substrate 210, and the first set of correlation fibers 230 includes two correlation fibers distributed at a 180 ° interval for detecting whether the wafer 900 is on the carrier jig 200. When the wafer 900 is clamped by the clamping block 222, the wafer 900 is located in the light emitting area of the first set of correlation fibers 230, so that it can be determined that the wafer 900 is located on the carrier tool 200.
Further, referring to fig. 11 and 12, a second set of correlation fibers 240 is further disposed on the table 100, and the second set of correlation fibers 240, the camera 300, and the light source 500 are distributed on the same side of the wafer 900. The second set of correlation fibers 240 also includes two correlation fibers for detecting the gloss level of the wafer 900. The camera 300 adjusts its parameter value according to the glossiness sensed by the second set of correlation fibers 240 to prevent the camera 300 from exposing.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. Based on the embodiments of the present invention, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present invention.
Claims (7)
1. A inspection apparatus for inspecting a wafer (900), comprising:
the workbench (100) is provided with an avoidance port (110) on the table top, and the avoidance port penetrates through the table top of the workbench (100) in the up-down direction;
the bearing jig (200) is arranged on the workbench (100) and is positioned above the avoidance port (110), and the bearing jig (200) is configured to support the wafer (900);
a camera (300) disposed on the stage (100) and facing the wafer (900) for capturing a detection image of the wafer (900);
wherein the camera (300) is arranged on the workbench (100) through a first position adjusting component (400), and the first position adjusting component (400) is configured to adjust the focal length of the camera (300) and the inclination angle of the camera (300) relative to the wafer (900);
the first position adjusting assembly (400) comprises a camera supporting plate (410), a first guiding unit (420) and a first driving unit (430), wherein the camera supporting plate (410) is provided with a camera (300), the camera supporting plate (410) is slidably arranged on the workbench (100) through the first guiding unit (420), the sliding track of the camera supporting plate (410) is an arc line, and the first driving unit (430) is configured to drive the camera supporting plate (410) to move on the workbench (100) along the sliding track;
wherein, the camera support plate (410) is provided with a linear reciprocating mechanism (440), the camera (300) is arranged on the camera support plate (410) through the linear reciprocating mechanism (440), and the linear reciprocating mechanism (440) is configured to drive the camera (300) to do linear reciprocating motion along the radial direction of the sliding track of the camera support plate (410);
the first driving unit (430) comprises a motor (431) fixedly arranged on the workbench (100), a gear (432) in transmission connection with an output shaft of the motor (431), and an arc-shaped rack (433) meshed with the gear (432) and fixedly arranged on the camera supporting plate (410);
the first guiding unit (420) comprises an arc-shaped guide rail (421) fixedly arranged on the workbench (100) and an arc-shaped sliding block (422) matched with the arc-shaped guide rail (421), and the camera supporting plate (410) is fixedly connected with the arc-shaped sliding block (422);
the arc-shaped guide rail (421) is arranged on the workbench (100) through a connecting plate (423), the connecting plate (423) is provided with a motion limiting unit arranged on the side wall of the arc-shaped guide rail (421), and the motion limiting unit is configured to limit the motion position of the arc-shaped sliding block (422).
2. The detecting device according to claim 1, wherein,
the bearing jig (200) at least comprises a bearing substrate (210) and a plurality of clamping assemblies (220) arranged on the bearing substrate (210), wherein the bearing substrate (210) is provided with a first through hole (211) penetrating through the bearing substrate in the up-down direction, and the plurality of clamping assemblies (220) are distributed on the bearing substrate (210) at intervals along the circumferential direction of the first through hole (211);
the clamping assembly (220) comprises a clamping drive (221) and a clamping block (222) connected with the clamping drive (221), wherein the clamping block (222) responds to the linear reciprocating motion of the clamping drive (221) to make telescopic motion in the radial direction of the wafer (900);
the telescopic movement of the clamping block (222) enables the clamping block to have a clamping state when clamping the wafer (900) and a retracting state when keeping away from the wafer (900).
3. The detecting device according to claim 2, wherein,
a supporting portion (2221) is arranged at one end, close to the wafer (900), of the clamping block (222), and in the clamping state, the supporting portion (2221) is in contact with the peripheral wall of the wafer (900) and the edge area of the bottom end face.
4. The detecting device according to claim 2, wherein,
the clamping assembly (220) further comprises a ball guide shaft module and a push-pull block (223), the ball guide shaft module comprises a guide shaft (224) and a ball shaft sleeve (225), the ball shaft sleeve (225) is sleeved on the guide shaft (224) and fixedly arranged on the bearing substrate (210), one end, close to the wafer (900), of the guide shaft (224) is connected with the clamping block (222), the push-pull block (223) is provided with a second through hole for the guide shaft (224) to penetrate, and the push-pull block (223) is in sliding fit with the guide shaft (224);
the guide shaft (224) is further fixedly provided with a first limiting piece (226) and a second limiting piece (227), the first limiting piece (226) and the second limiting piece (227) are respectively located on two sides of the push-pull block (223), the first limiting piece (226) is close to the clamping block (222) for distribution compared with the second limiting piece (227), a biasing piece (228) is abutted between the first limiting piece (226) and the push-pull block (223), and under the action of the biasing piece (228), the push-pull block (223) is elastically abutted with the second limiting piece (227).
5. The detecting apparatus according to claim 4, wherein,
the clamping assembly (220) further comprises a height adjusting plate (229), the ball guide shaft module is arranged on the height adjusting plate (229), and the height adjusting plate (229) is arranged on the bearing substrate (210);
wherein the clamping drive (221) is a linear motor, and the height adjustment plate (229) is configured to adjust a distance between a central axis of the guide shaft (224) and the carrier substrate (210) so that a central axis of an output shaft of the linear motor and a central axis of the guide shaft (224) are located on the same horizontal plane.
6. The detection apparatus according to claim 1, further comprising:
a light source (500) provided on the table (100) for cooperating with the camera (300);
a second position adjustment assembly (600) connected with the light source (500), wherein the light source (500) is arranged on the workbench (100) through the second position adjustment assembly (600), and the second position adjustment assembly (600) is configured to adjust the inclination angle of the light source (500) relative to the wafer;
the light source (500) and the camera (300) are located on the same side of the wafer (900), and the light source (500) and the camera (300) are distributed in opposite directions.
7. The detecting device according to claim 1, wherein,
the bearing jig (200) is arranged above the avoidance port (110) through the linear module (120).
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| CN202311793770.1A CN117470871B (en) | 2023-12-25 | 2023-12-25 | Detection device |
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| JPS61137050A (en) * | 1984-12-07 | 1986-06-24 | Hitachi Ltd | Apparatus for inspecting wafer |
| KR100803758B1 (en) * | 2007-01-10 | 2008-02-18 | 주식회사 엠디아이테크 | An inspection device for semiconductor wafer |
| CN101490538A (en) * | 2006-08-02 | 2009-07-22 | 株式会社尼康 | Defect detecting apparatus and defect detecting method |
| CN115372254A (en) * | 2022-07-13 | 2022-11-22 | 彼图科技(青岛)有限公司 | Wafer defect detection equipment based on image data processing |
| CN116908204A (en) * | 2023-09-14 | 2023-10-20 | 苏州汇创芯精密智能装备有限公司 | Semiconductor detection equipment based on AOI (automatic optical inspection) |
| CN117110301A (en) * | 2023-09-19 | 2023-11-24 | 深圳市飞兆微电子有限公司 | Semiconductor detection device |
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2023
- 2023-12-25 CN CN202311793770.1A patent/CN117470871B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61137050A (en) * | 1984-12-07 | 1986-06-24 | Hitachi Ltd | Apparatus for inspecting wafer |
| CN101490538A (en) * | 2006-08-02 | 2009-07-22 | 株式会社尼康 | Defect detecting apparatus and defect detecting method |
| KR100803758B1 (en) * | 2007-01-10 | 2008-02-18 | 주식회사 엠디아이테크 | An inspection device for semiconductor wafer |
| CN115372254A (en) * | 2022-07-13 | 2022-11-22 | 彼图科技(青岛)有限公司 | Wafer defect detection equipment based on image data processing |
| CN116908204A (en) * | 2023-09-14 | 2023-10-20 | 苏州汇创芯精密智能装备有限公司 | Semiconductor detection equipment based on AOI (automatic optical inspection) |
| CN117110301A (en) * | 2023-09-19 | 2023-11-24 | 深圳市飞兆微电子有限公司 | Semiconductor detection device |
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