CN117455895A - Preparation device and preparation method for realizing wire clamp - Google Patents
Preparation device and preparation method for realizing wire clamp Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 175
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The invention relates to the field of mechanical production, and discloses a preparation device and a preparation method for realizing a wire clamp, wherein the method comprises the following steps: super-pixel segmentation is carried out on the wire clamp image to obtain a wire clamp segmented image, a wire clamp image foreground of the wire clamp segmented image is extracted, and the wire clamp image foreground is fused to obtain a wire clamp fusion image foreground; constructing a three-dimensional modeling wire clamp of the wire clamp to be prepared; analyzing the clamp clamping force of the three-dimensional modeling clamp, and configuring preparation equipment of the clamp to be prepared; constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment, simulating wire clamp preparation work of the preparation equipment, obtaining wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources, obtaining adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment to obtain a finished wire clamp; and analyzing the surface defects of the wire clamps of the finished wire clamps, and performing surface treatment on the finished wire clamps to obtain the target wire clamps. The invention can improve the preparation effect of the wire clamp.
Description
Technical Field
The invention relates to the field of mechanical production, in particular to a preparation device and a preparation method for realizing a wire clamp.
Background
The wire clamp preparation realizes the wire clamp preparation process of stable connection and fixation between wires through material selection, process design and assembly methods. The safety of circuit transmission can be improved through wire clamp preparation.
At present, the wire clamp is prepared mainly by designing a preparation drawing of the wire clamp and preparing the wire clamp according to a process through the preparation drawing, and the wire clamp preparation process is excessively templated by the method, so that the problem of the wire clamp preparation process can not be found in time, and the wire clamp preparation effect is poor.
Disclosure of Invention
The invention provides a preparation device and a preparation method for realizing a wire clamp, and mainly aims to improve the preparation effect of the wire clamp.
In order to achieve the above object, the present invention provides a method for manufacturing a wire clip, including:
obtaining a wire clamp image of a wire clamp to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extracting a wire clamp image foreground of the wire clamp segmented image, and fusing the wire clamp image foreground to obtain a wire clamp fused image foreground;
extracting the wire clamp characteristics of the wire clamp fusion image foreground, and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
Analyzing the clamp clamping force of the three-dimensional modeling clamp, and constructing a preparation flow drawing of the clamp to be prepared through the clamp demand data when the clamp clamping force meets the requirement, and configuring preparation equipment of the clamp to be prepared based on the preparation flow drawing;
constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;
and analyzing the surface defects of the wire clamps of the finished wire clamps, and performing surface treatment on the finished wire clamps when the surface defects of the wire clamps meet the requirements to obtain target wire clamps.
Optionally, the performing superpixel segmentation on the clip image to obtain a clip segmented image includes:
preprocessing the wire clamp image to obtain a processed wire clamp image;
Extracting image features of the processing wire clamp image;
based on the image characteristics, constructing a similarity measurement index of the processing wire clamp image;
and performing super-pixel segmentation on the processing wire clamp image based on the similarity measurement index to obtain the wire clamp segmented image.
Optionally, the constructing a similarity metric of the processing wire clip image based on the image feature includes:
marking a center point in the wire clip segmentation image according to the image characteristics;
marking the corresponding pixels of the processing clamp image through the center point to obtain marked pixels;
calculating the pixel similarity of the marked pixels by using the following formula through the center point:
wherein silhouette (a, b) represents the pixel similarity of the mark pixel a and the mark pixel b, a_c represents the distance from the mark pixel a to the c-th center point, b_c represents the distance from the mark pixel b to the c-th center point, and W represents the cluster radius;
and constructing a similarity measurement index of the processing wire clamp image through the pixel similarity.
Optionally, the fusing the clip image foreground to obtain a clip fused image foreground includes:
Dividing the frequency of the clamp fusion image prospect to obtain a high-frequency clamp prospect and a low-frequency clamp prospect;
high-frequency fusion is carried out on the front Jing Jin of the high-frequency wire clamp, so that a high-frequency parallax wire clamp prospect is obtained;
performing low-frequency fusion on the low-frequency wire clamp prospect to obtain a low-frequency parallax wire clamp prospect;
and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground to obtain the wire clamp fusion image foreground.
Optionally, the image fusion of the high-frequency parallax clip foreground and the low-frequency parallax clip foreground to obtain the clip fusion image foreground includes:
and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground by using the following formula to obtain the wire clamp fusion image foreground:
wherein τ represents the clamp fusion image foreground, trh represents the fusion function, R represents the high-frequency parallax clamp foreground, and P i And (3) representing P, S representing the high-frequency parallax wire clamp foreground and the wire clamp image foreground corresponding to the low-frequency parallax wire clamp foreground, gamma representing regularization parameters, and i representing the number of the wire clamp image foreground corresponding to the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground.
Optionally, the constructing the three-dimensional modeling wire clip of the wire clip to be prepared based on the wire clip features includes:
identifying a wire clamp structure and a wire clamp attribute of the wire clamp to be prepared based on the wire clamp characteristics;
scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared;
constructing a modeling function of the wire clamp to be prepared based on the wire clamp attribute;
and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared by using the modeling function through the point cloud data and the wire clamp attribute.
Optionally, the analyzing the wire clamp clamping force of the three-dimensional modeling wire clamp includes:
gridding the three-dimensional modeling wire clamp to obtain a gridding modeling wire clamp;
applying boundary conditions to the gridding modeling wire clamp to obtain a conditional gridding modeling wire clamp;
applying load to the condition gridding modeling wire clamp to obtain a load gridding modeling wire clamp;
calculating a rigidity matrix of the load gridding modeling wire clamp;
and analyzing the clamp clamping force of the three-dimensional modeling clamp through the rigidity matrix.
Optionally, the calculating the stiffness matrix of the load gridding modeling clip includes:
determining a load curve of the load gridding modeling wire clamp;
Based on the load curve, calculating a stiffness matrix of the load gridding modeling wire clamp by using the following formula:
L＝∫Ωproperty*sin(θ t )
wherein L represents a stiffness matrix of the load gridding modeling wire clamp, Ω represents a stress grid unit corresponding to the load gridding modeling wire clamp, property represents a material property of the load gridding modeling wire clamp corresponding to the stress grid unit, sin (θ t ) Represents a load curve, θ t And the load value of the load gridding modeling wire clamp corresponding to the stressed grid unit at the moment t is represented.
Optionally, the constructing, by the coordination network, a time-frequency resource of the preparation device includes:
identifying device characteristics of the preparation device;
analyzing equipment functions and equipment regulation parameters of the preparation equipment based on the equipment characteristics;
designing the network topology of the preparation equipment by utilizing the coordination network through the equipment functions, the equipment regulation parameters and preset equipment requirement indexes;
and constructing the time-frequency resource of the preparation equipment based on the network topology.
In order to solve the above problems, the present invention also provides a preparation device for realizing a wire clip, the device comprising:
the wire clamp image foreground extraction module is used for acquiring wire clamp images of wire clamps to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp images to obtain wire clamp segmented images, extracting wire clamp image foreground of the wire clamp segmented images, and fusing the wire clamp image foreground to obtain wire clamp fused image foreground;
The wire clamp three-dimensional modeling module is used for extracting wire clamp characteristics of the wire clamp fusion image foreground and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
the wire clamp drawing design module is used for analyzing the wire clamp clamping force of the three-dimensional modeling wire clamp, when the wire clamp clamping force meets the requirement, constructing a preparation flow drawing of the wire clamp to be prepared through the wire clamp demand data, and configuring preparation equipment of the wire clamp to be prepared based on the preparation flow drawing;
the equipment time-frequency resource allocation module is used for constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and preparing the wire clamps through the preparation equipment based on the adjusted time-frequency resources to obtain finished wire clamps;
and the wire clamp surface treatment module is used for analyzing the wire clamp surface defect of the finished wire clamp, and carrying out surface treatment on the finished wire clamp when the wire clamp surface defect meets the requirement to obtain the target wire clamp.
According to the embodiment of the invention, the super-pixel segmentation is carried out on the wire clamp image, the wire clamp segmented image is obtained by grouping pixels in the image into super-pixels with similar characteristics, so that the efficiency of subsequent processing and analysis is improved; further, based on the wire clamp characteristics, the three-dimensional modeling wire clamp for the wire clamp to be manufactured can intuitively display the structure and the appearance of the wire clamp, is beneficial to previewing and verifying design schemes before actual manufacturing, and reduces the possibility of errors and reworking; furthermore, the preparation equipment for preparing the wire clamp can further perfect the wire clamp preparation flow by configuring the preparation equipment based on the preparation flow drawing, the cooperative work among the equipment can be realized by constructing a coordination network of the preparation equipment, so that the wire clamp preparation effect is improved, and finally, the wire clamp surface defect of the finished wire clamp can be detected and repaired by analyzing the wire clamp surface defect of the finished wire clamp, so that the wire clamp damage caused by defect expansion can be avoided, and the maintenance cost of the equipment is reduced. Therefore, the preparation device and the preparation method for realizing the wire clamp can improve the preparation effect of the wire clamp.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a wire clip according to an embodiment of the present invention;
FIG. 2 is a functional block diagram of a device for manufacturing a wire clip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device for implementing a device for manufacturing a wire clip according to an embodiment of the present invention;
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The embodiment of the application provides a preparation method for realizing a wire clamp. The execution main body for realizing the wire clamp preparation method comprises at least one of a server, a terminal and the like which can be configured to execute the method provided by the embodiment of the application. In other words, the preparation method for realizing the wire clip can be executed by software or hardware installed in a terminal device or a server device, and the software can be a blockchain platform. The service end includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, and the like. The server may be an independent server, or may be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.
Referring to fig. 1, a flow chart of a method for manufacturing a wire clip according to an embodiment of the present invention is shown. In this embodiment, the method for manufacturing the wire clip includes:
s1, obtaining a wire clamp image of a wire clamp to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extracting a wire clamp image foreground of the wire clamp segmented image, and fusing the wire clamp image foreground to obtain a wire clamp fused image foreground.
In the embodiment of the invention, the wire clamp image refers to a wire clamp effect image of a wire clamp to be manufactured, and the wire clamp requirement data refers to requirements of the wire clamp to be manufactured for manufacturing, such as requirements of wire clamp type, wire clamp hardness, wire clamp material and the like.
Further, in the embodiment of the invention, through carrying out super-pixel segmentation on the wire clip image, the wire clip segmented image is obtained by grouping pixels in the image into super-pixels with similar characteristics, so that the efficiency of subsequent processing and analysis is improved, wherein the wire clip segmented image is obtained by dividing the wire clip image into super-pixel images with similar characteristics.
As an embodiment of the present invention, the performing superpixel segmentation on the clip image to obtain a clip segmented image includes: preprocessing the wire clamp image to obtain a processed wire clamp image; extracting image features of the processing wire clamp image; based on the image characteristics, constructing a similarity measurement index of the processing wire clamp image; and performing super-pixel segmentation on the processing wire clamp image based on the similarity measurement index to obtain the wire clamp segmented image.
The processing clamp image refers to an image obtained by performing operations such as graying, filtering and denoising on the image, and the image features refer to pixel-level image feature attributes of the processing clamp image, such as color, texture and shape. These features will be used to describe the similarity between pixels, the similarity measure being an indicator of how similar the pixels are to each other.
Further, in an optional embodiment of the present invention, the constructing a similarity measure indicator of the processing clip image based on the image feature includes: marking a center point in the wire clip segmentation image according to the image characteristics; marking the corresponding pixels of the processing clamp image through the center point to obtain marked pixels; calculating the pixel similarity of the marked pixels by using the following formula through the center point:
wherein silhouette (a, b) represents the pixel similarity of the mark pixel a and the mark pixel b, a_c represents the distance from the mark pixel a to the c-th center point, b_c represents the distance from the mark pixel b to the c-th center point, and W represents the cluster radius;
and constructing a similarity measurement index of the processing wire clamp image through the pixel similarity.
Furthermore, the embodiment of the invention can effectively reduce the interference of the background on the theme by extracting the foreground of the wire clip image of the wire clip segmentation image, pay attention to important elements in the image and improve the visual effect. The wire clip image foreground is an image foreground containing a wire clip.
As an embodiment of the present invention, the extracting the clip image foreground of the clip split image may be performed by a matting technique.
Further, the embodiment of the invention fuses the wire clamp image foreground to obtain the wire clamp fused image foreground, so that the wire clamp image with more perfect details can be obtained, and a data basis is provided for wire clamp construction in the later stage. The wire clamp fusion image foreground is a fusion image obtained by fusing the wire clamp image foreground.
As an embodiment of the present invention, the fusing the clip image foreground to obtain a clip fused image foreground includes: dividing the frequency of the clamp fusion image prospect to obtain a high-frequency clamp prospect and a low-frequency clamp prospect; high-frequency fusion is carried out on the front Jing Jin of the high-frequency wire clamp, so that a high-frequency parallax wire clamp prospect is obtained; performing low-frequency fusion on the low-frequency wire clamp prospect to obtain a low-frequency parallax wire clamp prospect; and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground to obtain the wire clamp fusion image foreground.
The high-frequency wire clamp foreground and the low-frequency wire clamp foreground refer to an image set obtained by dividing the wire clamp image foreground into images at high frequency and low frequency, the high-frequency parallax wire clamp foreground refers to an image obtained by fusing the high-frequency wire clamp foreground images, and the low-frequency parallax wire clamp foreground refers to an image obtained by fusing the low-frequency wire clamp foreground.
Further, in an optional embodiment of the present invention, the image fusion of the high-frequency parallax clip foreground and the low-frequency parallax clip foreground to obtain the clip fusion image foreground includes:
and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground by using the following formula to obtain the wire clamp fusion image foreground:
wherein τ represents the clamp fusion image foreground, trh represents the fusion function, R represents the high-frequency parallax clamp foreground, and P i And (3) representing P, S representing the high-frequency parallax wire clamp foreground and the wire clamp image foreground corresponding to the low-frequency parallax wire clamp foreground, gamma representing regularization parameters, and i representing the number of the wire clamp image foreground corresponding to the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground.
S2, extracting the wire clamp characteristics of the wire clamp fusion image prospect, and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics.
According to the embodiment of the invention, key information of the wire clamp can be extracted by extracting the wire clamp characteristics of the wire clamp fusion image foreground, so that a data basis is provided for wire clamp modeling in the later stage. Wherein the clip features refer to the characteristic properties of the clip, such as color, shape, etc. The clip features may be identified by image feature extraction techniques.
Furthermore, the three-dimensional modeling wire clamp for the wire clamp to be manufactured is constructed based on the wire clamp characteristics, so that the structure and the appearance of the wire clamp can be intuitively displayed, the design scheme can be previewed and verified before actual manufacturing, and the possibility of errors and reworking is reduced. The three-dimensional modeling wire clamp is a wire clamp model modeled by a three-dimensional modeling technology.
As one embodiment of the present invention, the constructing the three-dimensional modeling wire clip of the wire clip to be manufactured based on the wire clip features includes: identifying a wire clamp structure and a wire clamp attribute of the wire clamp to be prepared based on the wire clamp characteristics; scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared; constructing a modeling function of the wire clamp to be prepared based on the wire clamp attribute; and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared by using the modeling function through the point cloud data and the wire clamp attribute.
The wire clamp structure refers to a composition structure, such as a shape, a width and the like, of the wire clamp to be manufactured, the wire clamp attribute refers to a color, a texture and the like of the wire clamp structure, the point cloud data refers to data describing a space structure of the wire clamp to be manufactured, and the modeling function refers to a function for performing space modeling on the wire clamp to be manufactured, such as a function of parametric modeling, reverse modeling, grid modeling and the like.
S3, analyzing the clamp clamping force of the three-dimensional modeling clamp, and when the clamp clamping force meets the requirement, constructing a preparation flow drawing of the clamp to be prepared through the clamp demand data, and configuring preparation equipment of the clamp to be prepared based on the preparation flow drawing.
The embodiment of the invention can provide powerful support for the design and improvement of the wire clamp by analyzing the clamp clamping force of the three-dimensional modeling wire clamp, wherein the clamp clamping force refers to the force applied by the wire clamp when fixing wires and cables, and is used for ensuring the wires and cables to be stably and reliably connected and transmit power.
As one embodiment of the present invention, the analyzing the clamp clamping force of the three-dimensional modeling clamp includes: gridding the three-dimensional modeling wire clamp to obtain a gridding modeling wire clamp; applying boundary conditions to the gridding modeling wire clamp to obtain a conditional gridding modeling wire clamp; applying load to the condition gridding modeling wire clamp to obtain a load gridding modeling wire clamp; calculating a rigidity matrix of the load gridding modeling wire clamp; and analyzing the clamp clamping force of the three-dimensional modeling clamp through the rigidity matrix.
The method comprises the steps of carrying out unit mesh division on a three-dimensional modeling wire clamp to obtain the modeling wire clamp, wherein the condition mesh modeling wire clamp is to apply proper boundary conditions to a wire clamp model according to an actual application scene. For example, in the analysis of clamping force, a fixed boundary condition may be applied to hold the wire clamp stationary under the action of clamping force, where the load grid modeling wire clamp is a wire clamp that applies an appropriate load at the location of the clamping force to be analyzed, and where the stiffness matrix is a matrix describing the relationship between displacement and stress of the wire clamp under the action of external force.
Further, in an alternative embodiment of the present invention, the calculating the stiffness matrix of the load gridding modeling clip includes: determining a load curve of the load gridding modeling wire clamp; based on the load curve, calculating a stiffness matrix of the load gridding modeling wire clamp by using the following formula:
L＝∫Ωproperty*sin(θ t )
wherein L represents a stiffness matrix of the load gridding modeling wire clamp, Ω represents a stress grid unit corresponding to the load gridding modeling wire clamp, property represents a material property of the load gridding modeling wire clamp corresponding to the stress grid unit, sin (θ t ) Represents a load curve, θ t And the load value of the load gridding modeling wire clamp corresponding to the stressed grid unit at the moment t is represented.
The material properties refer to material characteristic properties of the load gridding modeling clamp corresponding to the stressed grid unit, such as elastic modulus E and Poisson ratio v.
According to the embodiment of the invention, when the clamping force of the wire clamp meets the requirement, the preparation flow drawing of the wire clamp to be prepared is constructed according to the wire clamp demand data, so that the accurate preparation of the wire clamp can be realized through the drawing, and the wire clamp preparation efficiency is improved. The preparation flow drawing refers to a step drawing of preparing the wire clamp. The preparation flow drawing for constructing the wire clamp to be prepared can be prepared through CAD.
Furthermore, the wire clamp preparation flow can be further improved by configuring the preparation equipment of the wire clamp to be prepared based on the preparation flow drawing. The preparation equipment refers to mechanical equipment for preparing the wire clamp, such as cutting equipment, welding equipment, forming equipment and the like.
S4, constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and preparing the wire clamp through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp.
According to the embodiment of the invention, the cooperative work among the devices can be realized by constructing the coordination network of the preparation device, so that the wire clamp preparation effect is improved. Wherein, the coordination network refers to a network which can realize data transmission and regulation among the preparation devices. The coordination network can be realized by setting up a network protocol.
Furthermore, according to the embodiment of the invention, through the coordination network, the time-frequency resource of the preparation equipment can be constructed, so that a time-frequency resource allocation scheme of the preparation equipment can be constructed efficiently and reliably, and the preparation effect of wire clamp preparation is improved. The time-frequency resource allocation scheme refers to a scheme for reasonably allocating frequency bands and time slots to the preparation equipment.
As an embodiment of the present invention, said constructing, by the coordination network, a time-frequency resource of the preparation device includes: identifying device characteristics of the preparation device; analyzing equipment functions and equipment regulation parameters of the preparation equipment based on the equipment characteristics; designing the network topology of the preparation equipment by utilizing the coordination network through the equipment functions, the equipment regulation parameters and preset equipment requirement indexes; and constructing the time-frequency resource of the preparation equipment based on the network topology.
The equipment features refer to feature attributes of the preparation equipment, such as functional features, structural features and the like, the equipment functions refer to functions of the preparation equipment for wire clamp production, such as softening structures, welding and the like, the network topology refers to proper network topology structure design according to demand analysis, common topology structures comprise star-shaped, ring-shaped, net-shaped and the like, and the equipment demand indexes refer to demand targets of the preparation equipment for wire clamp preparation.
Further, according to the embodiment of the invention, the wire clamp preparation work of the preparation equipment is simulated through the time-frequency resource, the wire clamp simulation work data can be obtained, and the abnormality of the wire clamp preparation process can be analyzed through the simulation work, so that the wire clamp preparation effect is improved. The wire clamp simulation work data refer to production data generated by simulating wire clamp preparation work of the preparation equipment. The wire clamp preparation work of the preparation equipment is simulated, and the obtained wire clamp simulation work data can be realized through a simulation function.
Further, according to the embodiment of the invention, the position of the preparation abnormality of the preparation equipment in the preparation process can be identified by analyzing the time-frequency conflict of the wire clamp simulation work data, the repair is carried out in a targeted manner, and the preparation efficiency of the wire clamp is improved. The time-frequency conflict refers to abnormality existing in the simulation preparation process of the wire clamp, such as abnormality of wire clamp abrasion, improper connection between devices and the like. The analysis of the time-frequency conflict of the wire clamp simulation work data can be realized by analyzing abnormal data in the wire clamp simulation work data.
In the embodiment of the invention, the time-frequency resource adjustment refers to a scheme of allocating frequency bands and time slots obtained after the parameters of the time-frequency resource are adjusted, and the wire clamp preparation flow can be optimized through the time-frequency resource adjustment, so that the wire clamp preparation effect is improved.
According to the embodiment of the invention, the wire clamp is prepared by the preparation equipment, and the finished wire clamp can be manufactured to obtain a preliminary finished wire clamp. The finished wire clamp is a wire clamp finished product prepared through equipment.
S5, analyzing the surface defects of the wire clamps of the finished wire clamps, and when the surface defects of the wire clamps meet the requirements, performing surface treatment on the finished wire clamps to obtain target wire clamps.
According to the embodiment of the invention, the wire clamp surface defects of the finished wire clamp can be detected and repaired by analyzing the wire clamp surface defects of the finished wire clamp, so that the wire clamp is prevented from being damaged due to defect expansion, and the maintenance cost of equipment is reduced. Wherein the defect of the surface of the wire clamp refers to the damage existing on the surface of the finished wire clamp, such as abrasion, fracture and the like. The clip surface defects may be achieved by activating a scanning technique.
Further, according to the embodiment of the invention, the surface treatment is carried out on the finished wire clamp, so that the target wire clamp can be obtained, the surface performance of the wire clamp can be improved, and the stability, reliability and durability of the wire clamp in the use process are improved. The target wire clamp is a final wire clamp finished product. The surface treatment of the finished wire clamp can be achieved by surface coating and surface modification.
According to the embodiment of the invention, the super-pixel segmentation is carried out on the wire clamp image, the wire clamp segmented image is obtained by grouping pixels in the image into super-pixels with similar characteristics, so that the efficiency of subsequent processing and analysis is improved; further, based on the wire clamp characteristics, the three-dimensional modeling wire clamp for the wire clamp to be manufactured can intuitively display the structure and the appearance of the wire clamp, is beneficial to previewing and verifying design schemes before actual manufacturing, and reduces the possibility of errors and reworking; furthermore, the preparation equipment for preparing the wire clamp can further perfect the wire clamp preparation flow by configuring the preparation equipment based on the preparation flow drawing, the cooperative work among the equipment can be realized by constructing a coordination network of the preparation equipment, so that the wire clamp preparation effect is improved, and finally, the wire clamp surface defect of the finished wire clamp can be detected and repaired by analyzing the wire clamp surface defect of the finished wire clamp, so that the wire clamp damage caused by defect expansion can be avoided, and the maintenance cost of the equipment is reduced. Therefore, the preparation method for realizing the wire clamp can improve the preparation effect of the wire clamp.
Fig. 2 is a functional block diagram of a preparation apparatus for implementing a wire clip according to an embodiment of the present invention.
The preparation device 200 for realizing the wire clamp can be installed in electronic equipment. According to the implemented functions, the preparation apparatus 200 for implementing the wire clip may include a wire clip image foreground extraction module 201, a wire clip three-dimensional modeling module 202, a wire clip drawing design module 203, a device time-frequency resource configuration module 204, and a wire clip surface processing module 205. The module of the invention, which may also be referred to as a unit, refers to a series of computer program segments, which are stored in the memory of the electronic device, capable of being executed by the processor of the electronic device and of performing a fixed function.
In the present embodiment, the functions concerning the respective modules/units are as follows:
the wire clamp image foreground extraction module 201 is configured to obtain a wire clamp image of a wire clamp to be prepared and wire clamp demand data, perform super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extract a wire clamp image foreground of the wire clamp segmented image, and fuse the wire clamp image foreground to obtain a wire clamp fused image foreground;
the wire clamp three-dimensional modeling module 202 is used for extracting wire clamp characteristics of the wire clamp fusion image foreground and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
The wire clamp drawing design module 203 is configured to analyze a wire clamp clamping force of the three-dimensional modeling wire clamp, and when the wire clamp clamping force meets a requirement, construct a preparation flow drawing of the wire clamp to be prepared according to the wire clamp demand data, and configure preparation equipment of the wire clamp to be prepared based on the preparation flow drawing;
the device time-frequency resource configuration module 204 is configured to construct a coordination network of the preparation device, construct a time-frequency resource of the preparation device through the coordination network, simulate wire clamp preparation work of the preparation device through the time-frequency resource to obtain wire clamp simulation work data, analyze time-frequency conflict of the wire clamp simulation work data, adjust the time-frequency resource based on the time-frequency conflict to obtain an adjusted time-frequency resource, and perform wire clamp preparation through the preparation device based on the adjusted time-frequency resource to obtain a finished wire clamp;
the wire clamp surface treatment module 205 is configured to analyze a wire clamp surface defect of the finished wire clamp, and when the wire clamp surface defect meets a requirement, perform surface treatment on the finished wire clamp to obtain a target wire clamp.
In detail, each module in the apparatus 200 for manufacturing a wire clip according to the embodiment of the present invention adopts the same technical means as the method for manufacturing a wire clip according to the drawings, and can produce the same technical effects, which are not described herein.
The embodiment of the invention provides electronic equipment for realizing a preparation method of a wire clamp.
Referring to fig. 3, the electronic device may include a processor 30, a memory 31, a communication bus 32, and a communication interface 33, and may further include a computer program stored in the memory 31 and executable on the processor 30, such as a preparation method program for implementing a wire clip.
The processor may be formed by an integrated circuit in some embodiments, for example, a single packaged integrated circuit, or may be formed by a plurality of integrated circuits packaged with the same function or different functions, including one or more central processing units (Central Processing Unit, CPU), a microprocessor, a digital processing chip, a graphics processor, a combination of various control chips, and the like. The processor is a Control Unit (Control Unit) of the electronic device, connects various components of the entire electronic device using various interfaces and lines, and executes various functions of the electronic device and processes data by running or executing programs or modules stored in the memory (for example, executing a preparation program for realizing a wire clip, etc.), and calling data stored in the memory.
The memory includes at least one type of readable storage medium including flash memory, removable hard disk, multimedia card, card memory (e.g., SD or DX memory, etc.), magnetic memory, magnetic disk, optical disk, etc. The memory may in some embodiments be an internal storage unit of the electronic device, such as a mobile hard disk of the electronic device. The memory may in other embodiments also be an external storage device of the electronic device, such as a plug-in mobile hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card) or the like, which are provided on the electronic device. Further, the memory may also include both internal storage units and external storage devices of the electronic device. The memory may be used not only for storing application software installed in an electronic device and various types of data, for example, codes based on a preparation program for realizing a wire clip, etc., but also for temporarily storing data that has been output or is to be output.
The communication bus may be a peripheral component interconnect standard (Peripheral Component Interconnect, PCI) bus, or an extended industry standard architecture (Extended Industry Standard Architecture, EISA) bus, among others. The bus may be classified as an address bus, a data bus, a control bus, etc. The bus is arranged to enable a connection communication between the memory and at least one processor or the like.
The communication interface is used for communication between the electronic equipment and other equipment, and comprises a network interface and a user interface. Optionally, the network interface may include a wired interface and/or a wireless interface (e.g., WI-FI interface, bluetooth interface, etc.), typically used to establish a communication connection between the electronic device and other electronic devices. The user interface may be a Display (Display), an input unit such as a Keyboard (Keyboard), or alternatively a standard wired interface, a wireless interface. Alternatively, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch, or the like. The display may also be referred to as a display screen or display unit, as appropriate, for displaying information processed in the electronic device and for displaying a visual user interface.
For example, although not shown, the electronic device may further include a power source (such as a battery) for supplying power to the respective components, and preferably, the power source may be logically connected to the at least one processor through a power management device, so that functions of charge management, discharge management, power consumption management, and the like are implemented through the power management device. The power supply may also include one or more of any of a direct current or alternating current power supply, recharging device, power failure detection circuit, power converter or inverter, power status indicator, etc. The electronic device may further include various sensors, bluetooth modules, wi-Fi modules, etc., which are not described herein.
It should be understood that the embodiments described are for illustrative purposes only and are not limited to this configuration in the scope of the patent application.
The preparation program stored in the memory of the electronic device for realizing the wire clip is a combination of a plurality of instructions, and when running in the processor, the preparation program can realize:
obtaining a wire clamp image of a wire clamp to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extracting a wire clamp image foreground of the wire clamp segmented image, and fusing the wire clamp image foreground to obtain a wire clamp fused image foreground;
extracting the wire clamp characteristics of the wire clamp fusion image foreground, and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
analyzing the clamp clamping force of the three-dimensional modeling clamp, and constructing a preparation flow drawing of the clamp to be prepared through the clamp demand data when the clamp clamping force meets the requirement, and configuring preparation equipment of the clamp to be prepared based on the preparation flow drawing;
constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;
And analyzing the surface defects of the wire clamps of the finished wire clamps, and performing surface treatment on the finished wire clamps when the surface defects of the wire clamps meet the requirements to obtain target wire clamps.
Specifically, the specific implementation method of the above instruction by the processor may refer to descriptions of related steps in the corresponding embodiment of the drawings, which are not repeated herein.
Further, the electronic device integrated modules/units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. The computer readable storage medium may be volatile or nonvolatile. For example, the computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM).
The present invention also provides a computer readable storage medium storing a computer program which, when executed by a processor of an electronic device, can implement:
obtaining a wire clamp image of a wire clamp to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extracting a wire clamp image foreground of the wire clamp segmented image, and fusing the wire clamp image foreground to obtain a wire clamp fused image foreground;
Extracting the wire clamp characteristics of the wire clamp fusion image foreground, and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
analyzing the clamp clamping force of the three-dimensional modeling clamp, and constructing a preparation flow drawing of the clamp to be prepared through the clamp demand data when the clamp clamping force meets the requirement, and configuring preparation equipment of the clamp to be prepared based on the preparation flow drawing;
constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;
and analyzing the surface defects of the wire clamps of the finished wire clamps, and performing surface treatment on the finished wire clamps when the surface defects of the wire clamps meet the requirements to obtain target wire clamps.
In addition, each functional module in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units can be realized in a form of hardware or a form of hardware and a form of software functional modules.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.
The embodiment of the application can acquire and process the related data based on the artificial intelligence technology. Among these, artificial intelligence (Artificial Intelligence, AI) is the theory, method, technique and application that uses a digital computer or a digital computer-controlled machine to simulate, extend and expand human intelligence, sense the environment, acquire knowledge and use knowledge to obtain optimal results.
Furthermore, it is evident that the word "comprising" does not exclude other elements or steps, and that the singular does not exclude a plurality. A plurality of units or means recited in the apparatus claims can also be implemented by means of one unit or means in software or hardware. The terms first, second, etc. are used to denote a name, but not any particular order.
Finally, it should be noted that the above-mentioned embodiments are merely for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. A method for making a wire clip, the method comprising:
obtaining a wire clamp image of a wire clamp to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp image to obtain a wire clamp segmented image, extracting a wire clamp image foreground of the wire clamp segmented image, and fusing the wire clamp image foreground to obtain a wire clamp fused image foreground;
extracting the wire clamp characteristics of the wire clamp fusion image foreground, and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
analyzing the clamp clamping force of the three-dimensional modeling clamp, and constructing a preparation flow drawing of the clamp to be prepared through the clamp demand data when the clamp clamping force meets the requirement, and configuring preparation equipment of the clamp to be prepared based on the preparation flow drawing;
Constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and performing wire clamp preparation through the preparation equipment based on the adjusted time-frequency resources to obtain a finished wire clamp;
and analyzing the surface defects of the wire clamps of the finished wire clamps, and performing surface treatment on the finished wire clamps when the surface defects of the wire clamps meet the requirements to obtain target wire clamps.
2. The method for preparing a wire clip according to claim 1, wherein the performing superpixel segmentation on the wire clip image to obtain a wire clip segmented image comprises:
preprocessing the wire clamp image to obtain a processed wire clamp image;
extracting image features of the processing wire clamp image;
based on the image characteristics, constructing a similarity measurement index of the processing wire clamp image;
and performing super-pixel segmentation on the processing wire clamp image based on the similarity measurement index to obtain the wire clamp segmented image.
3. The method for manufacturing a wire clip according to claim 2, wherein the constructing a similarity metric for the processed wire clip image based on the image features comprises:
marking a center point in the wire clip segmentation image according to the image characteristics;
marking the corresponding pixels of the processing clamp image through the center point to obtain marked pixels;
calculating the pixel similarity of the marked pixels by using the following formula through the center point:
wherein silhouette (a, b) represents the pixel similarity of the mark pixel a and the mark pixel b, a_c represents the distance from the mark pixel a to the c-th center point, b_c represents the distance from the mark pixel b to the c-th center point, and W represents the cluster radius;
and constructing a similarity measurement index of the processing wire clamp image through the pixel similarity.
4. The method for preparing a wire clip according to claim 1, wherein the fusing the wire clip image foreground to obtain a wire clip fused image foreground comprises:
dividing the frequency of the clamp fusion image prospect to obtain a high-frequency clamp prospect and a low-frequency clamp prospect;
high-frequency fusion is carried out on the front Jing Jin of the high-frequency wire clamp, so that a high-frequency parallax wire clamp prospect is obtained;
Performing low-frequency fusion on the low-frequency wire clamp prospect to obtain a low-frequency parallax wire clamp prospect;
and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground to obtain the wire clamp fusion image foreground.
5. The method for preparing a wire clip according to claim 4, wherein the image fusion of the high-frequency parallax wire clip foreground and the low-frequency parallax wire clip foreground to obtain the wire clip fusion image foreground comprises:
and carrying out image fusion on the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground by using the following formula to obtain the wire clamp fusion image foreground:
wherein τ represents the clamp fusion image foreground, trh represents the fusion function, R represents the high-frequency parallax clamp foreground, and P i And (3) representing P, S representing the high-frequency parallax wire clamp foreground and the wire clamp image foreground corresponding to the low-frequency parallax wire clamp foreground, gamma representing regularization parameters, and i representing the number of the wire clamp image foreground corresponding to the high-frequency parallax wire clamp foreground and the low-frequency parallax wire clamp foreground.
6. The method for manufacturing a wire clip according to claim 1, wherein the constructing the three-dimensional modeling wire clip of the wire clip to be manufactured based on the wire clip characteristics comprises:
Identifying a wire clamp structure and a wire clamp attribute of the wire clamp to be prepared based on the wire clamp characteristics;
scanning the wire clamp structure to obtain point cloud data of the wire clamp to be prepared;
constructing a modeling function of the wire clamp to be prepared based on the wire clamp attribute;
and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared by using the modeling function through the point cloud data and the wire clamp attribute.
7. The method of manufacturing a wire clamp according to claim 1, wherein said analyzing the clamp clamping force of the three-dimensional modeling wire clamp comprises:
gridding the three-dimensional modeling wire clamp to obtain a gridding modeling wire clamp;
applying boundary conditions to the gridding modeling wire clamp to obtain a conditional gridding modeling wire clamp;
applying load to the condition gridding modeling wire clamp to obtain a load gridding modeling wire clamp;
calculating a rigidity matrix of the load gridding modeling wire clamp;
and analyzing the clamp clamping force of the three-dimensional modeling clamp through the rigidity matrix.
8. The method of manufacturing a wire clip of claim 7, wherein the calculating the stiffness matrix of the load gridding modeling wire clip comprises:
Determining a load curve of the load gridding modeling wire clamp;
based on the load curve, calculating a stiffness matrix of the load gridding modeling wire clamp by using the following formula:
L＝∫Ωproperty*sin(θ t )
wherein L represents a stiffness matrix of the load gridding modeling wire clamp, Ω represents a stress grid unit corresponding to the load gridding modeling wire clamp, property represents a material property of the load gridding modeling wire clamp corresponding to the stress grid unit, sin (θ t ) Represents a load curve, θ t And the load value of the load gridding modeling wire clamp corresponding to the stressed grid unit at the moment t is represented.
9. The method for preparing a wire clip according to claim 1, wherein the constructing, by the coordination network, a time-frequency resource of the preparation device includes:
identifying device characteristics of the preparation device;
analyzing equipment functions and equipment regulation parameters of the preparation equipment based on the equipment characteristics;
designing the network topology of the preparation equipment by utilizing the coordination network through the equipment functions, the equipment regulation parameters and preset equipment requirement indexes;
and constructing the time-frequency resource of the preparation equipment based on the network topology.
10. A preparation device for realizing a wire clip, characterized by performing the preparation method for realizing a wire clip according to any one of claims 1-9, the device comprising:
The wire clamp image foreground extraction module is used for acquiring wire clamp images of wire clamps to be prepared and wire clamp demand data, performing super-pixel segmentation on the wire clamp images to obtain wire clamp segmented images, extracting wire clamp image foreground of the wire clamp segmented images, and fusing the wire clamp image foreground to obtain wire clamp fused image foreground;
the wire clamp three-dimensional modeling module is used for extracting wire clamp characteristics of the wire clamp fusion image foreground and constructing the three-dimensional modeling wire clamp of the wire clamp to be prepared based on the wire clamp characteristics;
the wire clamp drawing design module is used for analyzing the wire clamp clamping force of the three-dimensional modeling wire clamp, when the wire clamp clamping force meets the requirement, constructing a preparation flow drawing of the wire clamp to be prepared through the wire clamp demand data, and configuring preparation equipment of the wire clamp to be prepared based on the preparation flow drawing;
the equipment time-frequency resource allocation module is used for constructing a coordination network of the preparation equipment, constructing time-frequency resources of the preparation equipment through the coordination network, simulating wire clamp preparation work of the preparation equipment through the time-frequency resources to obtain wire clamp simulation work data, analyzing time-frequency conflict of the wire clamp simulation work data, adjusting the time-frequency resources based on the time-frequency conflict to obtain adjusted time-frequency resources, and preparing the wire clamps through the preparation equipment based on the adjusted time-frequency resources to obtain finished wire clamps;
And the wire clamp surface treatment module is used for analyzing the wire clamp surface defect of the finished wire clamp, and carrying out surface treatment on the finished wire clamp when the wire clamp surface defect meets the requirement to obtain the target wire clamp.
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