CN117443670B - SMD upper cover tape gluing device with heating function - Google Patents
SMD upper cover tape gluing device with heating function Download PDFInfo
- Publication number
- CN117443670B CN117443670B CN202311787657.2A CN202311787657A CN117443670B CN 117443670 B CN117443670 B CN 117443670B CN 202311787657 A CN202311787657 A CN 202311787657A CN 117443670 B CN117443670 B CN 117443670B
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- China
- Prior art keywords
- charging barrel
- glue
- heat conduction
- conduction pipe
- separation disc
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 32
- 238000010438 heat treatment Methods 0.000 title claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 90
- 239000012530 fluid Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000000926 separation method Methods 0.000 claims description 54
- 230000008569 process Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 13
- 230000009471 action Effects 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
Landscapes
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of surface coating, in particular to an SMD upper cover tape gluing device with heating function; comprises a base and a frame fixedly connected with the upper surface of the base; the upper surface of the base is connected with a supporting plate which is moved by a moving assembly; the supporting plate can drive the SMD components to move on a plane; a charging barrel is arranged at the front side of the frame; the upper end of the charging barrel is provided with an opening, and the lower port is provided with a one-way discharging hole; the outer wall of the lower end of the charging barrel is movably sleeved with a U-shaped ring sleeve; the inner side of the U-shaped ring sleeve is connected with the water pump through a one-way liquid inlet pipe; according to the glue heating method, the heated fluid enters the inner side of the heat conducting pipe under the negative pressure effect and flows, so that the glue can keep certain fluidity under the heat conduction of the heat conducting pipe at the inner side, the stability of subsequent gluing is further ensured, and compared with the glue heating mode in the prior art, the glue heating method is high in heat energy utilization rate and good in heat conduction effect.
Description
Technical Field
The invention relates to the technical field of surface coating, in particular to a SMD upper cover tape gluing device with heating function.
Background
The SMD upper cover tape gluing device is special equipment for gluing operation in the SMD component manufacturing process. The SMD component can be automatically glued, so that the component is protected and fixed, and the heat dissipation performance of the SMD component is improved. Glue used in the SMD upper cover tape gluing device can flocculate under the condition of too low temperature, so that the glue is easy to solidify in the charging barrel, subsequent gluing cannot be realized, and therefore, the glue needs to be heated before being glued by the SMD upper cover tape gluing device, the viscosity of the glue is reduced, and the fluidity of the glue is improved.
In the prior art, the heat source is arranged on the outer side of the container filled with the glue, the heat source can be transmitted to the glue after penetrating through the container and the container filled with the glue, the heating efficiency of the glue is low, meanwhile, the heat source cannot be fully utilized, and the gluing efficiency and the gluing effect of the follow-up SMD upper cover tape gluing device are affected.
In view of the above, the present invention provides an SMD upper cover tape gluing device with heating, which solves the above technical problems.
Disclosure of Invention
In order to make up the defects of the prior art, the invention provides the SMD upper cover tape gluing device with heating, and the heated fluid enters the inner side of the heat conduction pipe and flows under the negative pressure effect, so that the glue can keep certain fluidity under the heat conduction of the heat conduction pipe at the inner side, the stability of the subsequent gluing is further ensured, and compared with the glue heating at the outer side of the glue in the prior art, the glue heating mode has high heat energy utilization rate and good heat conduction effect.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to a SMD upper cover tape gluing device with heating, which comprises a base and a frame fixedly connected with the upper surface of the base; the upper surface of the base is connected with a supporting plate which is moved by a moving assembly; the supporting plate can drive the SMD components to move on a plane; a charging barrel is arranged at the front side of the frame; the upper end of the charging barrel is provided with an opening, and the lower port is provided with a one-way discharging hole;
the outer wall of the lower end of the charging barrel is movably sleeved with a U-shaped ring sleeve; the inner side of the U-shaped ring sleeve is connected with the water pump through a one-way liquid inlet pipe; the inner side of the U-shaped ring sleeve is communicated with the inside of the charging barrel through an L-shaped hole; a heat conduction pipe is arranged at the inner side of the charging barrel; the lower end of the heat conducting pipe is communicated with the L-shaped hole opening; the inner side of the upper port of the charging barrel is movably connected with a piston controlled by a controller in a sealing way; the piston moves up and down under the control of the controller, so that fluid is driven to conduct heat to the glue on the inner side of the charging barrel, and the glue is sprayed along the unidirectional discharging hole.
Preferably, the upper surface of the piston is fixedly connected with an electric push rod; the top of the frame is fixedly connected with a motor; the motor output shaft is connected with the electric push rod through a connecting plate; a separation disc is arranged in the charging barrel; the diameter of the outer wall of the separation disc is matched with that of the inner wall of the charging barrel; one end of the heat conduction pipe close to the upper side is communicated with the upper surface of the separation disc; the separation disc can prevent fluid flowing out from the upper end of the heat conduction pipe from contacting with glue in the charging barrel.
Preferably, the separation disc is positioned at the upper position of the charging barrel and is fixedly connected with the inner wall of the charging barrel; the heat pipe is made of an elastic material, such as silica gel; the heat conduction pipe expands under the action of fluid pressure to fill the inner space of the charging barrel.
Preferably, the separation disc is positioned at the upper position of the charging barrel in the initial state and is movably and hermetically connected with the inner wall of the charging barrel; the heat pipe is made of a flexible material, such as rubber; the separation disc can extrude the glue in the charging barrel along the unidirectional discharging hole under the action of fluid pressure.
Preferably, a spiral slide bar is arranged on the inner wall of the charging barrel; the spiral sliding strip is arranged on the inner wall of the charging barrel from top to bottom in a spiral line; a chute is arranged on the outer wall of the separation disc; the sliding groove is in sliding sealing connection with the spiral sliding strip; the heat conducting pipe is driven to spirally wind in the downward moving process by the separation disc.
Preferably, the heat conduction pipe is in an inclined state in a straightened state; one end of the heat conduction pipe close to the upper part is eccentrically connected with the center of the separation disc; the heat conduction pipe drives the heat conduction pipe to disturb glue on the inner side of the charging barrel in the downward moving process; the separation disc divides the space inside the charging barrel into an upper cavity and a lower cavity.
Preferably, the material density of the heat conduction pipe is greater than the glue density in the charging barrel; the density of fluid in the heat conduction pipe is greater than the density of glue in the material barrel; the heat conducting pipe sinks in the process of downward movement of the piston.
Preferably, the wall thickness of the heat conducting pipe increases along with the distance from the separation disc, and the heat conducting pipe close to the separation disc is firstly expanded under the action of the pressure of the fluid at the inner side.
The beneficial effects of the invention are as follows:
1. according to the glue heating method, the heated fluid enters the inner side of the heat conducting pipe under the negative pressure effect and flows, so that the glue can keep certain fluidity under the heat conduction of the heat conducting pipe at the inner side, the stability of subsequent gluing is further ensured, and compared with the glue heating mode in the prior art, the glue heating method is high in heat energy utilization rate and good in heat conduction effect.
2. According to the invention, the partition plate moves downwards and rotates along with the extrusion of the medium in the upper cavity, and the partition plate drives the heat-conducting pipe to twist, so that the heat-conducting pipe is spirally wound under the rotation of the partition plate, and the heat-conducting pipes are mutually staggered in the vertical direction in the rotation process of the partition plate, thus the influence of the heat-conducting pipe on the downward movement of the partition plate is avoided, and the stability of the downward movement of the partition plate is improved.
3. According to the invention, the material density of the heat conduction pipe and the fluid density of the inner side of the heat conduction pipe are larger than the glue density in the charging barrel, so that under the condition that the heat conduction pipe is loosely wound along with the downward movement of the separation disc, the heat conduction pipe can sink downwards, so that the wound part of the heat conduction pipe is close to the inner side of the charging barrel and is close to the lower position, the lower glue of the charging barrel is better in heat conduction, the glue heating effect close to the one-way discharging hole is improved, and the glue in the charging barrel can be discharged along the one-way discharging hole under the better heating effect, and the gluing process is realized.
Drawings
The invention will be further described with reference to the drawings and embodiments.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective sectional view of example 1 of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is an expansion schematic of the heat pipe in example 3;
fig. 5 is an enlarged view at B in fig. 4;
FIG. 6 is a perspective sectional view of embodiment 2 of the present invention;
fig. 7 is an enlarged view at C in fig. 6;
fig. 8 is an enlarged view at D in fig. 6;
fig. 9 is a view showing a state in which the piston moves down in example 2.
In the figure: the device comprises a base 1, a frame 11, a moving assembly 12, a supporting plate 13, a charging barrel 2, a one-way discharging hole 21, a U-shaped annular sleeve 22, a one-way liquid inlet pipe 23, an L-shaped hole 24, a spiral slide bar 25, a heat conducting pipe 3, a piston 4, an electric push rod 41, a motor 42, a connecting plate 43, a separation disc 5 and a sliding chute 51.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 to 9, the present invention is described in detail in the following embodiments:
the embodiment 1, a SMD upper cover tape gumming device with heating, including a base 1 and a frame 11 fixedly connected with the upper surface of the base 1; the upper surface of the base 1 is connected with a supporting plate 13 which is moved by a moving assembly 12; the supporting plate 13 can drive the SMD components to move on a plane; the front side of the frame 11 is provided with a charging barrel 2; the upper end of the charging barrel 2 is provided with an opening, and the lower port is provided with a one-way discharging hole 21;
the outer wall of the lower end of the charging barrel 2 is movably sealed and sleeved with a U-shaped ring sleeve 22; the inner side of the U-shaped ring sleeve 22 is connected with the water pump through a one-way liquid inlet pipe 23; the inner side of the U-shaped ring sleeve 22 is communicated with the inside of the charging barrel 2 through an L-shaped hole 24; a heat conduction pipe 3 is arranged on the inner side of the charging barrel 2; the lower end of the heat conduction pipe 3 is communicated with the orifice of the L-shaped hole 24; the inner side of the upper port of the charging barrel 2 is movably and hermetically connected with a piston 4 controlled by a controller; the piston 4 moves up and down under the control of the controller, so that fluid is driven to conduct heat to the glue on the inner side of the charging barrel 2, and the glue is sprayed along the unidirectional discharging hole 21.
In this embodiment, the upper surface of the piston 4 is fixedly connected with an electric push rod 41; the top of the frame 11 is fixedly connected with a motor 42; the output shaft of the motor 42 is connected with the electric push rod 41 through a connecting plate 43; a separation disc 5 is arranged in the charging barrel 2; the diameter of the outer wall of the separation disc 5 is matched with that of the inner wall of the charging barrel 2; one end, close to the upper side, of the heat conducting pipe 3 is communicated with the upper surface of the separation disc 5; the separation disc 5 can prevent fluid flowing out from the upper end of the heat conduction pipe 3 from contacting with glue in the charging barrel 2.
In this embodiment, the separation disc 5 is located at a position above the charging barrel 2 and is fixedly connected with the inner wall of the charging barrel 2; the heat conduction pipe 3 is made of an elastic material such as silica gel; the heat conduction pipe 3 expands under the action of fluid pressure to fill the internal space of the charging barrel 2;
during operation, in the prior art, the heat source is arranged at the outer side of the container filled with the glue, the heat source can be transmitted to the glue after penetrating through the container and the container filled with the glue, the heating efficiency of the glue is low, and meanwhile, the heat source cannot be fully utilized, so that the gluing efficiency and the gluing effect of a follow-up SMD upper cover tape gluing device are affected;
therefore, before coating SMD components, the operator firstly checks the SMD upper cover with a gluing device to avoid faults, clamps the SMD components on a supporting plate 13, then inserts a charging barrel 2 along a middle clamping frame of a frame 11, the outer wall of one lower end of the charging barrel 2 enters the inner side of a U-shaped annular sleeve 22, so that an L-shaped hole 24 on the outer wall of the lower end of the charging barrel 2 is communicated with the inner side of the U-shaped annular sleeve 22, the outer wall of the lower end of the charging barrel 2 is in movable sealing fit with the inner wall of the U-shaped annular sleeve 22, then clamps the charging barrel 2 by using the clamping frame, a controller controls a motor 42 to rotate, the rotating motor 42 drives a connecting plate 43 and an electric push rod 41 to rotate, the electric push rod 41 is driven by the motor 42 to move to the position right above an upper port of the charging barrel 2, then the controller controls the motor 42 to stop rotating, the electric push rod 41 stretches to drive a piston 4 to enter the inner side of the charging barrel 2 along the upper port of the charging barrel 2, the outer wall of the piston 4 is movably sealed with the inner wall of the charging barrel 2, the piston 4 can seal the upper port of the charging barrel 2 after entering the inner side of the charging barrel 2, one end of the unidirectional liquid inlet pipe 23 far away from the U-shaped annular sleeve 22 is communicated with a water pump, before the controller controls the charging barrel 2 to glue, the controller is used for controlling the moving assembly 12 to drive the supporting plate 13 and SMD components on the supporting plate 13 to move in the directions of the x axis and the y axis until a plurality of SMD components are driven by the supporting plate 13 to sequentially move to the position right below the charging barrel 2, the controller controls the electric push rod 41 to stretch, the electric push rod 41 can drive the piston 4 to move from top to bottom, the space inside the charging barrel 2 is divided into an upper cavity and a lower cavity by the separation disc 5, glue is stored in the lower cavity, fluid in the upper cavity can enter the inner side of the heat conducting pipe 3 along the upper end of the heat conducting pipe 3 under the extrusion of the piston 4, the unidirectional liquid inlet pipe 23 can only unidirectionally enter liquid towards the inner side of the heat conducting pipe 3, so that fluid at the inner side of the heat conducting pipe 3 cannot be discharged, as the fluid amount at the inner side of the heat conducting pipe 3 increases, expansion can occur under the condition that the fluid pressure at the inner side of the heat conducting pipe 3 increases, the heat conducting pipe 3 can extrude surrounding glue after expansion, so that the glue in a lower cavity is discharged along the unidirectional discharge hole 21 at the lower end of the feed cylinder 2 under the expansion extrusion of the heat conducting pipe 3, the glue is sprayed on SMD components along the unidirectional discharge hole 21, a gluing process is realized, in order to avoid solidification caused by excessively low temperature of the glue in the subsequent feed cylinder 2, the controller can control the electric push rod 41 to shorten, the piston 4 can be driven to move upwards in the shortening process of the electric push rod 41, the space in an upper cavity is enlarged and negative pressure is formed, and the medium in the heat conducting pipe 3 enters into an upper cavity along the upper end of the heat conducting pipe 3 under the negative pressure, the glue in the lower cavity is discharged along the unidirectional discharge hole 21 in one direction, under the condition that the glue fills the lower cavity, the expanded heat conduction pipe 3 is not restored and keeps an expanded state, the heated medium enters the inner side of the U-shaped annular sleeve 22 along the unidirectional liquid inlet pipe 23 under the action of negative pressure generated by the water pump and the upper cavity, enters the heat conduction pipe 3 along the L-shaped hole 24 and finally flows into the upper cavity along the heat conduction pipe 3, the heated fluid in the heat conduction pipe 3 absorbs the heat of the medium in the heat conduction pipe 3 in the flowing process, so that the glue in the lower cavity can keep a certain temperature, the excessively low solidification of the glue temperature is avoided, the controller controls the piston 4 to move downwards in the material cylinder 2 again after the next SMD component moves to the position right below the lower end of the material cylinder 2, the medium in the upper cavity enters the inner side of the heat conduction pipe 3 along the upper end of the heat conduction pipe 3, the heat conduction pipe 3 expands again, the glue in the lower cavity is extruded after the heat conduction pipe 3 expands, the glue in the lower cavity is discharged along the unidirectional discharge hole 21 under extrusion, then the controller controls the piston 4 to move upwards again, the heated fluid enters the heat conduction pipe 3, the heat of the fluid at the inner side of the heat conduction pipe 3 is transferred to the glue in the lower cavity, and the steps are repeated; the heated fluid enters the inner side of the heat conduction pipe 3 under the negative pressure effect and flows, so that the glue can keep certain fluidity under the heat conduction of the heat conduction pipe 3 at the inner side, the stability of subsequent gluing is further ensured, and compared with the glue heating at the outer side of the glue in the prior art, the glue heating mode has high heat energy utilization rate and good heat conduction effect; the heat conducting pipe 3 is made of elastic materials, and expands along with the increase of the fluid quantity, and the glue in the charging barrel 2 is discharged along the unidirectional discharge hole 21 without dead angles and residues after the heat conducting pipe 3 expands; after the glue in the cartridge 2 is used up, the controller controls the electric push rod 41 to shorten and drive the piston 4 to move upwards and separate from the upper port of the cartridge 2, then the motor 42 rotates and drives the connecting plate 43 and the electric push rod 41 to move out of the upper port of the cartridge 2, and after the clamping frame in the middle of the frame 11 is loosened, the empty cartridge 2 is pulled out, and a new cartridge 2 is replaced.
Example 2, this example differs from example 1 in that:
the separation disc 5 is positioned at the upper position of the charging barrel 2 in the initial state and is movably and hermetically connected with the inner wall of the charging barrel 2; the heat conducting pipe 3 is made of a flexible material, such as rubber; the separation disc 5 can extrude the glue in the charging barrel 2 along the unidirectional discharging hole 21 under the action of fluid pressure.
In this embodiment, a spiral slide 25 is disposed on the inner wall of the barrel 2; the spiral sliding strip 25 is arranged on the inner wall of the charging barrel 2 from top to bottom in a spiral line; the outer wall of the separation disc 5 is provided with a chute 51; the sliding groove 51 is in sliding sealing connection with the spiral sliding strip 25; the separation disc 5 drives the heat conduction pipe 3 to spirally wind in the downward moving process.
In this embodiment, the heat conducting pipe 3 is in an inclined state in a straightened state; one end, close to the upper part, of the heat conducting pipe 3 is eccentrically connected with the center of the separation disc 5; the heat conduction pipe 3 drives the heat conduction pipe 3 to disturb the glue on the inner side of the charging barrel 2 in the downward moving process; the partition plate 5 divides the space inside the cartridge 2 into an upper chamber and a lower chamber.
In this embodiment, the material density of the heat conducting pipe 3 is greater than the glue density in the material cylinder 2; the density of the fluid in the heat conduction pipe 3 is larger than the density of the glue in the charging barrel 2; the heat conduction pipe 3 sinks in the process of downwards moving the piston 4;
when in operation, the controller controls the moving component 12 to drive the supporting plate 13 and SMD components on the supporting plate 13 to move in the directions of the x axis and the y axis until a plurality of SMD components are driven by the supporting plate 13 to sequentially move to the position right below the charging barrel 2, after the first SMD component moves to the position right below the charging barrel 2, the controller controls the electric push rod 41 to extend to drive the piston 4 to move downwards, the piston 4 can squeeze the medium in the upper cavity, a small amount of medium can enter the heat conducting pipe 3 to enable the shrunken heat conducting pipe 3 to be spread, the heat conducting pipe 3 is made of flexible materials, the heat conducting pipe 3 can not expand continuously after being spread, the medium in the upper cavity can push the separation disc 5 to move downwards under the extrusion of the piston 4, the glue in the lower cavity can be extruded by the separation disc 5, the glue in the lower cavity is pressed to be discharged along the unidirectional discharging hole 21, the electric push rod 41 can be controlled to shorten and drive the piston 4 to move upwards by the controller, the glue space of the lower cavity is kept unchanged because the unidirectional discharging hole 21 can only discharge in one direction, the position of the separation disc 5 is kept stable, the space in the upper cavity is enlarged to form negative pressure along with the upward movement of the piston 4, and under the cooperation of the water pump, heated medium enters the inner side of the U-shaped annular sleeve 22 along the unidirectional liquid inlet pipe 23, enters the L-shaped hole 24 along the inner side of the U-shaped annular sleeve 22, finally enters the heat conducting pipe 3 along the L-shaped hole 24, the glue in the lower cavity absorbs the heat of the medium in the heat conducting pipe 3, the glue is heated, the medium in the heat conducting pipe 3 enters the upper cavity along the upper end of the heat conducting pipe 3, the piston 4 is extruded by the driving of the electric push rod 41 after the next SMD component moves to the right below the charging barrel 2, so that the piston 4 is pushed to move downwards by the medium in the upper cavity, the piston 4 presses the glue in the lower cavity again so that the glue is discharged along the unidirectional discharge hole 21;
because the spiral slide bar 25 is arranged on the inner wall of the charging barrel 2, the sliding groove 51 on the outer wall of the separation disc 5 is in sliding sealing connection with the spiral slide bar 25, the separation disc 5 moves from top to bottom in the charging barrel 2 along with the extrusion action of the medium in the lower cavity, the separation disc 5 moves along the spiral line direction of the spiral slide bar 25 in the downward moving process, so that the separation disc 5 rotates while moving downwards, the eccentric connected heat conduction pipe 3 can be driven to rotate in the charging barrel 2 in the rotating process of the separation disc 5, the heat conduction pipe 3 stirs the glue in the lower cavity along with the rotation of the separation disc 5, the glue disturbance aim is realized, the absorption temperature of the glue on the medium in the heat conduction pipe 3 is more uniform, the subsequent glue spreading effect is improved, the separation disc 5 moves downwards along with the extrusion action of the medium in the upper cavity, the heat conduction pipe 3 is driven to twist, the heat conduction pipe 3 is mutually staggered in the vertical direction in the rotating process of the separation disc 5, and the heat conduction pipe 3 is prevented from influencing the downward moving of the separation disc 5, and the downward moving stability of the separation disc 5 is improved; the material density of the heat conduction pipe 3 and the fluid density of the inner side of the heat conduction pipe 3 are larger than the glue density in the charging barrel 2, so under the condition that the heat conduction pipe 3 is loosely wound along with the downward movement of the separation disc 5, the heat conduction pipe 3 can sink downwards, the wound part of the heat conduction pipe 3 is close to the inner side of the charging barrel 2 and is close to the lower position, so that the lower glue of the charging barrel 2 is better in heat conduction, the glue heating effect close to the one-way discharging hole 21 is improved, and the glue in the charging barrel 2 can be discharged along the one-way discharging hole 21 under the better heating effect, so that the gluing process is realized.
Example 3, this example differs from example 1 in that:
the wall thickness of the heat conduction pipe 3 increases along with the distance from the separation disc 5, and the heat conduction pipe 3 close to the separation disc 5 is firstly expanded under the action of the pressure of the fluid at the inner side;
during operation, in the process that the piston 4 moves downwards along with the electric push rod 41, the piston 4 can enable a medium in the upper cavity to enter the inner side of the heat conducting pipe 3 along the upper end of the heat conducting pipe 3, and enable the heat conducting pipe 3 to expand firstly along the upper end of the heat conducting pipe 3, glue in the lower cavity is extruded by the expansion of the heat conducting pipe 3, the glue is discharged along the unidirectional discharge hole 21, the gluing process is realized, in the process that the piston 4 moves upwards, the unidirectional discharge hole 21 can only discharge unidirectionally, so that the space in the lower cavity is kept unchanged, the expansion degree of the heat conducting pipe 3 is kept unchanged, heated fluid entering from the unidirectional liquid inlet pipe 23 enters the heat conducting pipe 3 along the U-shaped annular sleeve 22 and the L-shaped hole 24, enters the upper cavity along the heat conducting pipe 3, and along with the secondary downward movement of the piston 4, the fluid in the upper cavity is extruded into the heat conducting pipe 3 by the piston 4, the heat conducting tube 3 is expanded again along the unidirectional discharge hole 21, the wall thickness of the heat conducting tube 3 increases along with the increase of the wall thickness of the heat conducting tube 3 away from the separation disc 5, so that the glue in the lower cavity can be extruded more thoroughly on the one hand, and the heat source contained in the fluid in the heat conducting tube 3 is transferred to the glue and is gathered more on the upper position of the heat conducting tube 3 on the other hand, so that the heat exchange between the new fluid entering the heat conducting tube 3 and the original fluid heat is reduced in the process of the new fluid entering the heat conducting tube 3 from bottom to top, the heat energy of the new fluid entering the inner side of the heat conducting tube 3 is ensured, the heating effect of the fluid at the lower position of the heat conducting tube 3 on the surrounding glue is further maintained, and the glue is discharged along the unidirectional discharge hole 21 under better fluid heating.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in fig. 1, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present invention, and furthermore, the terms "first", "second", "third", etc. are merely used for distinguishing the description, and should not be construed as indicating or implying relative importance.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. An SMD upper cover tape gluing device with heating comprises a base (1) and a frame (11) fixedly connected with the upper surface of the base (1); the upper surface of the base (1) is connected with a supporting plate (13) which is moved by a moving assembly (12); the supporting plate (13) can drive the SMD components to move on a plane; the front side of the frame (11) is provided with a charging barrel (2); the upper end of the charging barrel (2) is provided with an opening, and the lower port is provided with a one-way discharging hole (21);
the method is characterized in that: the outer wall of the lower end of the charging barrel (2) is movably sealed and sleeved with a U-shaped ring sleeve (22); the inner side of the U-shaped ring sleeve (22) is connected with the water pump through a one-way liquid inlet pipe (23); the inner side of the U-shaped ring sleeve (22) is communicated with the inside of the charging barrel (2) through an L-shaped hole (24); a heat conduction pipe (3) is arranged at the inner side of the charging barrel (2); the lower end of the heat conduction pipe (3) is communicated with the orifice of the L-shaped hole (24); the inner side of the upper port of the charging barrel (2) is movably and hermetically connected with a piston (4) controlled by a controller; the piston (4) moves up and down under the control of the controller, so that fluid is driven to conduct heat to the glue on the inner side of the charging barrel (2), and the glue is sprayed along the unidirectional discharging hole (21);
the upper surface of the piston (4) is fixedly connected with an electric push rod (41); the top of the frame (11) is fixedly connected with a motor (42); the output shaft of the motor (42) is connected with the electric push rod (41) through a connecting plate (43); a separation disc (5) is arranged in the charging barrel (2); the diameter of the outer wall of the separation disc (5) is matched with that of the inner wall of the charging barrel (2); one end of the heat conduction pipe (3) close to the upper side is communicated with the upper surface of the separation disc (5); the separation disc (5) can prevent fluid flowing out from the upper end of the heat-conducting pipe (3) from contacting with glue in the charging barrel (2);
the separation disc (5) is positioned at the upper position of the charging barrel (2) and is fixedly connected with the inner wall of the charging barrel (2); the heat conducting pipe (3) is made of elastic material; the heat conduction pipe (3) expands under the action of fluid pressure to fill the internal space of the charging barrel (2);
the separation disc (5) is positioned at the upper position of the charging barrel (2) in the initial state and is movably and hermetically connected with the inner wall of the charging barrel (2); the heat conducting pipe (3) is made of flexible materials; the separating disc (5) can extrude the glue in the charging barrel (2) along the unidirectional discharging hole (21) under the action of fluid pressure.
2. The SMD cover tape gluing device with heating as in claim 1, wherein: the inner wall of the charging barrel (2) is provided with a spiral slide bar (25); the spiral sliding strip (25) is arranged on the inner wall of the charging barrel (2) from top to bottom in a spiral line shape; a chute (51) is arranged on the outer wall of the separation disc (5); the sliding groove (51) is in sliding sealing connection with the spiral sliding strip (25); the separation disc (5) drives the heat conduction pipe (3) to spirally wind in the downward moving process.
3. The SMD cover tape gluing device with heating as in claim 2, wherein: the heat conduction pipe (3) is in an inclined state in a straightened state; one end of the heat conduction pipe (3) close to the upper part is eccentrically connected with the center of the separation disc (5); the heat conduction pipe (3) drives the heat conduction pipe (3) to disturb the glue on the inner side of the charging barrel (2) in the downward moving process.
4. The SMD cover tape gluing device with heating as in claim 1, wherein: the material density of the heat conduction pipe (3) is greater than the glue density in the charging barrel (2); the density of the fluid in the heat conduction pipe (3) is larger than the density of the glue in the charging barrel (2); the heat conducting pipe (3) sinks in the downward moving process of the piston (4).
5. The SMD cover tape gluing device with heating as in claim 1, wherein: the wall thickness of the heat conduction pipe (3) increases along with the distance from the separation disc (5), and the heat conduction pipe (3) close to the separation disc (5) expands firstly under the action of the inner fluid pressure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311787657.2A CN117443670B (en) | 2023-12-25 | 2023-12-25 | SMD upper cover tape gluing device with heating function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311787657.2A CN117443670B (en) | 2023-12-25 | 2023-12-25 | SMD upper cover tape gluing device with heating function |
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| CN117443670B true CN117443670B (en) | 2024-03-08 |
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| CN219092581U (en) * | 2022-12-28 | 2023-05-30 | 深圳市飞栩达科技有限公司 | Dispensing machine |
| CN117000516A (en) * | 2023-07-24 | 2023-11-07 | 太极半导体（苏州）有限公司 | 3D encapsulation forming device with intelligent accurate temperature control function |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4370944A (en) * | 1980-05-14 | 1983-02-01 | Sumitomo Light Metal Ind., Ltd. | Apparatus for coating the inner surface of long tubes of small diameter |
| CN203972241U (en) * | 2014-07-15 | 2014-12-03 | 苏州市星光精密机械有限公司 | PUR glue dispensing valve |
| US10190716B1 (en) * | 2018-09-11 | 2019-01-29 | Akurate Dynamics, Llc | Heated hose with improved power feedthrough |
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| CN117000516A (en) * | 2023-07-24 | 2023-11-07 | 太极半导体（苏州）有限公司 | 3D encapsulation forming device with intelligent accurate temperature control function |
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| CN117443670A (en) | 2024-01-26 |
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