CN117442884A - Near infrared light blanket - Google Patents
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- CN117442884A CN117442884A CN202311711256.9A CN202311711256A CN117442884A CN 117442884 A CN117442884 A CN 117442884A CN 202311711256 A CN202311711256 A CN 202311711256A CN 117442884 A CN117442884 A CN 117442884A
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
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- A61N5/0622—Optical stimulation for exciting neural tissue
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- A—HUMAN NECESSITIES
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- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N5/067—Radiation therapy using light using laser light
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0626—Monitoring, verifying, controlling systems and methods
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0632—Constructional aspects of the apparatus
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0658—Radiation therapy using light characterised by the wavelength of light used
- A61N2005/0659—Radiation therapy using light characterised by the wavelength of light used infrared
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N2005/0664—Details
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Radiation-Therapy Devices (AREA)
Abstract
A near infrared light blanket comprises a plurality of paths of mixed-parallel vertical cavity surface emitting laser chip integrated array light sources, a central control circuit board, a flexible foldable light source outer bracket and a flexible isolation inner bracket; the laser chip integrated array light source is characterized in that a plurality of rectangular ceramic substrates packaged with a series-parallel vertical cavity surface emitting laser chip array are fixed on a copper belt by cured heat conducting glue; the copper belt comprises 1-6 rectangular ceramic substrates; the rectangular ceramic substrates are fixed on the copper strips, and the series-connected packaged parallel-serial vertical cavity surface emitting laser chip arrays on the rectangular ceramic substrates are connected with an external direct current power supply in parallel through positive and negative electrodes to form a multi-path parallel-serial integrated chip array light source.
Description
Technical Field
The utility model belongs to the field of medical health care rehabilitation medical equipment, and particularly relates to a near infrared light blanket.
Background
Diabetes is a metabolic disease characterized by hyperglycemia. Hyperglycemia is caused by defective insulin secretion or impaired biological action, or both. Long-standing hyperglycemia leads to chronic damage, dysfunction, of various tissues, especially the eyes, kidneys, heart, blood vessels, nerves.
The final development of diabetes depends on the blood sugar level of the patient and the metabolic indexes such as blood pressure, blood fat and the like. For patients with stable blood sugar control and standard blood pressure, blood fat and other indexes, the patients may only slightly raise blood sugar and need to be treated by hypoglycemic drugs, but no obvious complications and serious consequences exist. If a patient has poor long-term glycemic control, particularly with hypertension, hyperlipidemia, and smoking, the patient often develops diabetic complications, such as neuropathy, and the like.
Many foot complications in diabetics arise from sensory neuropathy and mild autonomic and motor neuropathy. Wherein sensory neuropathy incorporates excessive mechanical stress, which is the primary initiating factor in foot ulcers and infections. Inflammation and tissue damage are the result of a degree of repetitive stress acting on a particular region of loss of sensation. Autonomic dysfunction leads to destruction of the soft tissue of the skin, causing invasion of exogenous bacteria. The chemical trend changes resulting in inefficiency of the leukocyte reaction. In addition, hyperglycemia, reduced oxygen partial pressure, malnutrition, and the like can co-trigger tissue edema, acid accumulation, hyperosmosis, and inefficient anaerobic metabolism. Such environments are suitable for bacterial growth and hinder the function of leukocytes. Furthermore, vascular disease can cause limited antibiotic transport, further resulting in reduced bacterial clearance efficiency, leading to localized soft tissue infection, and even the formation of osteomyelitis. Diabetic Peripheral Neuropathy (DPN) is characterized by loss of sensory function at the extremities, with or with pain, and is often more severe in the lower extremities than in the upper extremities, and is a significant cause of non-traumatic amputation leading to diabetic foot ulcers. Current treatment regimens are primarily to delay the onset of DPN by tightly controlling blood glucose. After DPN occurs, therapeutic measures focus on preventing foot wound infection and amputation, such as foot care education and periodic foot examination, and no obvious drug treatment regimen for effectively reversing DPN is currently available. In recent years, infrared lasers have been used to improve microcirculation and reduce pain, and some medical institutions at home and abroad try to improve DPN symptoms using infrared lasers [ 1-5 ].
In principle, as the wavelength of physical light increases, the penetration of soft tissue of the human body increases. Since the epidermis of the soft tissue of the human body contains a large amount of moisture, the absorption of the moisture to the light rays is drastically increased after the wavelength is more than 1000nm, and the light rays are converted into a large amount of heat, meaning that the light rays penetrating into the soft tissue are drastically attenuated. The absorption of physical light by human soft tissue has a gold window of about 900nm-1000nm.
The utility model provides a shortwave infrared integrated medical light source and application thereof (application number: 202010521887.4), which discloses a shortwave infrared integrated medical light source packaged by a certain process and provides a shortwave infrared integrated medical light source system of medical and household rehabilitation treatment equipment with a vertical cavity surface emitting laser chip array. The Chinese patent application of the inventor (202111111414.8) and the utility model application (202122310909.5) disclose a double-path near-infrared laser integrated medical light source which comprises a packaging substrate, a vertical cavity surface emitting near-infrared laser chip set, a red light LED chip set, a double-path substrate electrode, a substrate positioning hole and a lens set; the packaging substrate is covered with a high-strength heat-conducting insulating film material, and a near infrared laser chip set and a red light LED chip set double-circuit chip electric connection circuit is prepared on the insulating heat-conducting film; the lens group images the luminous image of the vertical cavity surface emitting near infrared laser chip packaged on the substrate 15+/-10 cm in front of the light outlet of the light source system. The utility model patent application of the inventor (application number: 2023216123449) discloses a near-infrared medical care light source, wherein a low-power vertical cavity surface emitting near-infrared laser chip with the wavelength of 940nm is independently packaged into single laser beads through a certain process, and a unique plano-concave or biconcave resin lens is used for carrying out speckling on light spots of near-infrared rays emitted by the vertical cavity surface emitting near-infrared laser chip in the packaging process; a certain number of vertical cavity surface emitting near infrared laser beads are uniformly arranged on the heat conducting flexible material body to form an array; after the speckles are spread, light spots formed by light rays emitted by the lamp beads of the adjacent vertical cavity surface emitting near infrared laser mutually form overlapping so as to achieve the effect of uniform irradiation; a layer of semitransparent optical film is covered on the lamp bead array of the near infrared laser emitting from the vertical cavity surface to achieve the light mixing effect, so that operators or patients are prevented from suffering unexpected laser radiation; the near infrared medical light source can delay the disease development of diabetic foot patients and has good daily health care effect.
The above-mentioned near infrared medical light source has a certain limitation in use, such as smaller irradiation area.
Reference is made to:
【1】 Liu Jie, xu Zhongcheng, "observation of efficacy of IR laser treatment of diabetic peripheral neuropathy", journal of Chinese Physics and rehabilitation, vol.28, 10 th edition, 2006, p.693
【2】 Zhou Fan et al, "effect of 890nm infrared laser on treatment of diabetic peripheral neuropathy", chinese contemporary medicine 2021, 2 nd month, 28 th edition, P:68
【3】 Zhao Jinfeng, "therapeutic action of Infrared therapeutic apparatus in diabetic peripheral neuropathy", J.Utility neurological disease, vol.11, 21, P:87, year 11, month 19
【4】 Zhang Jinfei "analysis of clinical efficacy of Infrared/Red light therapeutic apparatus on diabetic peripheral neuropathy", shenzhen J.Zhen.traditional Chinese medicine, J.Ind.12, vol.26, 24 th, p.95
【5】Moghtaderi A,et al.Validation of Michigan neuropathy screening instrument for diabetic peripheral neuropathy Clin Neurol Neurosurg,Vol.5,1(2005)。
Disclosure of Invention
The utility model aims to provide a near infrared light blanket aiming at the defects of the existing technologies such as wavelength limitation of red light and infrared light sources, small single irradiation area and the like and the use of the technologies.
The technical scheme of the utility model is that the near infrared blanket, namely a continuous and pulse adjustable large-area flexible near infrared integrated light source and bracket wrapping device, comprises a multi-channel series-parallel vertical cavity surface emitting laser integrated chip array light source, a central control circuit board, a flexible foldable light source outer bracket and a flexible isolation inner bracket. The chip packaging areas B on the heat-conducting ceramic substrate A are mutually isolated to form a rectangular array, and the vertical cavity surface emitting laser chips C are uniformly arranged on the chip packaging areas B to form a vertical cavity surface emitting laser chip array.
The vertical cavity surface emitting laser chips C in each row (in the long side direction) are connected in series, and then the arrays of the multiple rows of vertical cavity surface emitting laser chips C are connected in parallel, so that the driving voltage of the whole multi-channel series-parallel integrated chip array light source is reduced.
The wavelength of the vertical cavity surface emitting laser chip A is 810nm, or 850nm, or 940nm; the optical power range of the single vertical cavity surface emitting near infrared laser chip is 0.01-0.5W.
The heat conducting ceramic substrate is made of high heat conducting ceramic materials such as aluminum nitride or boron nitride or composite high heat conducting ceramic materials, and aims to radiate heat emitted by the vertical cavity surface emitting laser chip C array during working into air or conduct the heat to the copper heat radiating substrate below. The heat conducting substrate is rectangular, has no special requirement on the length-width ratio, and can be manufactured according to practical requirements.
The packaging process of the vertical cavity surface emitting laser chip C array is similar to the LED integrated packaging process.
A plurality of rectangular ceramic substrates A which are packaged with the series-parallel vertical cavity surface emitting laser chip arrays are fixed on a copper strip D by cured heat conducting glue. The circuits among the rectangular ceramic substrates A, which are packaged with the series-parallel vertical cavity surface emitting laser chip arrays, are connected in series. One copper strip (relatively shaped into a slightly deformable envelope of fig. 5) contained 1-6 rectangular ceramic substrates a. The whole rectangular ceramic substrate A array which is fixed on the copper belt and is packaged with the series-parallel vertical cavity surface emitting laser chip array in series is connected with an external direct current power supply through an anode and a cathode, and a plurality of series-parallel packaged vertical cavity surface emitting laser chip arrays which are fixed on the copper belt are connected with the external direct current power supply in parallel through the anode and the cathode, so that a multi-path series-parallel integrated chip array light source is formed, and the working voltage is reduced.
The thickness of the copper strip is more than 2 mm. And positioning holes E are formed at two ends of the copper strip and are fixed with the flexible resin foldable part F through the positioning holes.
The flexible foldable light source outer bracket comprises a flexible resin foldable part F and an external flexible fabric; the flexible resin foldable part F is of a resin structure formed by an injection molding process and is of a trapezoid structure. The upper surface is of a hollow plane structure, and the copper strip fixed with the ceramic substrate is fixed with the flexible foldable light source outer bracket F through the positioning hole H. The bottom edge strips JK and LM of the flexible resin foldable part F may be sewn to the outer flexible fabric (e.g., cowhells fabric) of the flexible foldable light source outer bracket.
The flexible foldable light source outer support can be opened or tightened through the connecting buckle R at the end part, so that the treatment and unbinding are convenient. When the flexible foldable light source outer support F is in any tightening or unbinding state, the cross section of the copper strips on each flexible foldable light source outer support F is near to one cambered surface, and the most tightening state of the copper strips is a cylindrical surface.
The two ends of the flexible foldable light source outer support are provided with movable connecting buckles, and the two opposite movable connecting buckles R can be tightened by using binding bands or are respectively sewn on the opposite flexible fabrics for bonding.
The fabric outside the flexible foldable light source outer bracket is provided with a power interface similar to the power interface of a hot water bag or an electric blanket.
The flexible isolation inner support Q is a single-layer or double-layer flexible resin or fabric hoop with an adjustable opening, the double-layer hollow flexible resin hoop-shaped structure is two single-layer hoops, and the shape of the single-layer hoops is similar to that of the resin hoops outside the saline water bottle. The interval between the double-layer hollow flexible resin hoops is 1-12 cm.
The flexible isolation inner support Q can be opened or tightened through the connecting buckle S at the end part, so that the treatment and unbinding are convenient.
The flexible isolation inner support Q is made of modified PVC plastic (flexible), and is arranged to isolate the lower limb (lower leg) of a patient from a light source during treatment. The outer part of the flexible isolation inner support Q is paved with a layer of extremely thin frosted PET film which is arranged to obtain more uniform light.
The flexible isolation inner support Q is a disposable item due to contact with the patient during treatment.
When the multipath series-parallel integrated chip array light source emits near infrared light for treatment, a continuous light emitting mode can be used, and a pulse emitting mode can also be used. The width of the near infrared light pulse emitted by the vertical cavity surface emitting near infrared laser chip array ranges from 1 micro second to 1 second. Since various physical factors such as the power of the chips in the vertical cavity surface emitting near infrared laser chip array, the geometric interval between the chips, the number of ceramic substrates, the distance between copper strips and the like affect the power density of near infrared laser in the front 2-10 cm range, the power density (corresponding to the corresponding wavelength) of human body receiving near infrared laser irradiation must satisfy the following requirements: diagnostic and therapeutic laser equipment safety requirements (GB 9706.20-2020, part 1 of safety for laser products): the requirements of the equipment classification, requirements (GB 7247.1-2012), and therefore the various physical properties mentioned above must therefore be integrated.
The current of the multi-channel series-parallel integrated chip array light source circuit is provided by a central control circuit board. The central control circuit board is powered by a dc 12V switching power supply, and pulse or constant current of the multi-path series-parallel integrated chip array light source circuit is respectively output by boosting or reducing voltage of the central control circuit board after the other dc switching power supply is accessed from the outside. The functions are completed by an independent singlechip on a central control circuit board through embedded software.
The beneficial effects are that: the utility model provides a near infrared blanket, namely a continuous and pulse-adjustable large-area flexible near infrared integrated light source, a flexible foldable light source outer bracket and a flexible isolation inner bracket. In order to improve diabetic peripheral neuropathy symptoms of diabetic patients and delay the disease development of diabetic foot patients, the near infrared light blanket can play a good health care role aiming at the defects of the existing technologies such as wavelength limitation of red light and infrared light sources, small single irradiation area and the like and use.
Drawings
Fig. 1 is a schematic diagram of a structure of a ceramic substrate for packaging a vertical cavity surface emitting near infrared laser chip array.
Fig. 2 is a schematic view of a copper strip structure with a ceramic substrate fixed thereto.
Fig. 3 is a schematic view of the structure of the flexible resin foldable member.
Fig. 4 is a schematic view of the upper planar structure of the flexible resin foldable member.
Fig. 5 is a schematic view of the flexible foldable light source outer support in a contracted state.
Fig. 6 is a schematic cross-sectional view of a flexible isolation stent.
Specific examples:
the present utility model will be specifically described with reference to the following examples.
Example 1
A schematic structural diagram of a ceramic substrate for packaging a vertical cavity surface emitting near infrared laser chip array in example 1 is shown in fig. 1.
The embodiment relates to a near infrared light blanket for treating diabetic peripheral neuropathy symptoms of a diabetic patient, namely a continuous and pulse-adjustable large-area flexible near infrared integrated light source, which comprises a multi-channel hybrid vertical cavity surface emitting laser integrated chip array light source, a central control circuit board, a flexible foldable light source outer bracket and a flexible isolation inner bracket.
The multi-channel series-parallel vertical cavity surface emitting laser integrated chip array light source is packaged by an aluminum nitride ceramic substrate, the length of the aluminum nitride ceramic substrate is 25.9 mm, the width of the aluminum nitride ceramic substrate is 10.45 mm, a packaging area comprises 12 x 4 arrays (48 packaging positions), and the packaging position spacing is 0.2 mm.
One vertical cavity surface emitting laser chip (6 in total) is arranged at each packaging position along the length direction, one vertical cavity surface emitting laser chip (2 in total) is arranged at each packaging position along the width direction, and the vertical cavity surface emitting laser chips between the columns are staggered.
6 vertical cavity surface emitting laser chips in each row are connected in series, and the rows are connected in parallel to form a series-parallel circuit.
The rated working voltage of the single 940nm vertical cavity surface emitting laser chip is 1.9V, the rated current is 20mA, and the luminous power is 18mW.
The copper strip had a thickness of 2.5 mm, a width of 1.5 cm and a length of 14 cm.
4 aluminum nitride substrates are fixed on the copper belt.
The flexible foldable light source outer support comprises a flexible resin foldable part F and an external flexible fabric.
There are 8 flexible resin foldable parts, including 32 aluminum nitride substrates, 768 vertical cavity surface emitting laser chips.
The flexible resin foldable part is of a resin structure formed by an injection molding process, is of a trapezoid structure and is made of modified PVC plastic (flexible); the upper surface of the flexible foldable light source outer bracket is in a hollow plane structure, and the copper strip fixed with the ceramic substrate is fixed with the flexible foldable light source outer bracket through a positioning hole; two edges at the bottom of the flexible resin foldable part can be sewn on flexible fabric (such as cowhells fabric) outside the flexible foldable light source outer bracket; the flexible foldable light source outer bracket can be opened or tightened through the connecting buckle R at the end part, so that the treatment and unbinding are convenient; when the flexible foldable light source outer brackets are in any tightening or unbinding state, the cross section of the copper strip on each flexible foldable light source outer bracket is near to a cambered surface, and the most tightening state is a cylindrical surface; the two groups of connecting buckles opposite to the end part of the flexible foldable light source outer bracket can be tightened by using a binding belt, or the opposite flexible fabrics are respectively sewn with self-adhesive fabrics for bonding; the fabric outside the flexible foldable light source outer bracket is provided with a power interface similar to the power interface of a hot water bag or an electric blanket.
The flexible isolation inner support is of an open double-layer hollow flexible resin hoop-shaped structure, and the shape of the single-layer hoop is similar to that of the resin hoop outside the saline water bottle; the interval between the double-layer hollow flexible resin hoops is 1-12 cm; the flexible isolation inner bracket can be opened or tightened through the connecting buckle S at the end part, so that the treatment and unbinding are convenient; the flexible isolation inner bracket is made of modified PVC plastic (flexible), and is arranged for isolating the lower limb (lower leg) of a patient from a light source during treatment; the outside of flexible isolation inner support has laid the dull polish PET membrane of one deck extremely thin, sets up dull polish PET membrane in order to make to obtain more even light.
The flexible foldable light source outer support and the flexible isolation inner support are made of modified flexible PVC resin.
The total light power of the multi-channel series-parallel vertical cavity surface emitting laser integrated chip array light source is 13.83W, the working voltage of the circuit is dc 45.6V, and the working current is 640mA.
The single chip microcomputer model of the control circuit board is GD32F303, the current frequency of the vertical cavity surface emitting near infrared laser integrated chip array is adjustable from 500kHz to 50Hz, and the duty ratio is 50%.
The above embodiments are preferred examples of the present utility model, but the scope of the present utility model is not limited to the above embodiments, and any modifications and partial substitutions within the knowledge of those skilled in the art without departing from the spirit and scope of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. A near infrared light blanket is characterized in that the continuous and pulse adjustable large-area flexible near infrared integrated light source and bracket wrapping device comprises a multi-channel series-parallel vertical cavity surface emitting laser chip integrated array light source, a central control circuit board, a flexible foldable light source outer bracket and a flexible isolation inner bracket; the laser chip integrated array light source is characterized in that a plurality of rectangular ceramic substrates packaged with a series-parallel vertical cavity surface emitting laser chip array are fixed on a copper belt by cured heat conducting glue; one copper belt comprises 1-6 rectangular ceramic substrates; the rectangular ceramic substrates are fixed on the copper strips, and the series-connected packaged parallel-serial vertical cavity surface emitting laser chip arrays on the rectangular ceramic substrates are connected with an external direct current power supply in parallel through positive and negative electrodes to form a multi-path parallel-serial integrated chip array light source.
2. The multi-channel series-parallel vertical cavity surface emitting laser chip integrated array light source of claim 1, wherein the vertical cavity surface emitting laser chip is packaged on a heat conducting ceramic substrate; the chip packaging areas on the heat-conducting ceramic substrate are mutually isolated to form a rectangular array, and the vertical cavity surface emitting laser chips are uniformly arranged on the chip packaging areas to form a vertical cavity surface emitting laser chip array; the vertical cavity surface emitting laser chips in the long side direction of each row are connected in series, and then the arrays of the multiple rows of vertical cavity surface emitting laser chips are connected in parallel to each other, so that the driving voltage of the light source of the whole multi-channel series-parallel integrated chip array is reduced; the wavelength of the vertical cavity surface emitting laser chip A is 810nm, or 850nm, or 940nm; the optical power range of the single vertical cavity surface emitting near infrared laser chip is 0.01-0.5W.
3. The near infrared light blanket of claim 1, wherein the ceramic substrate is made of aluminum nitride or boron nitride or a composite high thermal conductivity ceramic material; the heat conducting ceramic substrate is rectangular; a plurality of rectangular ceramic substrates which are packaged with a series-parallel vertical cavity surface emitting laser chip array are fixed on a copper belt by cured heat conducting glue; the circuits among the rectangular ceramic substrates which are packaged with the series-parallel vertical cavity surface emitting laser chip arrays are connected in series; a copper strip comprises 1-6 rectangular ceramic substrates.
4. The near infrared light blanket of claim 1, wherein the copper tape has a thickness greater than 2 mm. And positioning holes are formed at two ends of the copper strip and are fixed with the flexible resin foldable part through the positioning holes.
5. The near infrared light blanket of claim 1, wherein the flexible foldable light source outer bracket comprises a flexible resin foldable member and an outer flexible fabric; the flexible resin foldable part is of a resin structure formed by an injection molding process and is of a trapezoid structure; the upper surface of the flexible resin foldable part is in a hollow plane structure; the copper strips for fixing the ceramic substrate are fixed with the flexible foldable light source outer bracket through the positioning holes; the bottom edge strip M of the flexible resin foldable part F is sewn on the flexible fabric outside the flexible foldable light source outer bracket.
6. The near infrared light blanket of claim 1, wherein the flexible foldable light source outer bracket is provided with loose connection buckles at both ends; a power interface is arranged on the fabric outside the flexible foldable light source outer bracket.
7. The near infrared light blanket of claim 1, wherein the flexible insulating inner support is a single or double layer hollow flexible resin or fabric collar capable of being opened.
8. The near infrared light blanket of claim 1, wherein a frosted transparent resin film is laid on the outside of the flexible isolation inner support.
9. The near infrared light blanket of claim 1, wherein the laser chip uses a continuous light emitting mode or a mode of impulse emission; the width of the near infrared light pulse emitted by the vertical cavity surface emitting near infrared laser chip array ranges from 1 micro second to 1 second.
10. The near infrared light blanket of claim 1, wherein the current of the multi-path series-parallel integrated chip array light source circuit is provided by a central control circuit board; the central control circuit board is powered by a direct-current 12V switching power supply, and pulse or constant current of the multi-channel series-parallel integrated chip array light source circuit is respectively output by boosting or reducing voltage of the central control circuit board after being accessed from the outside by another direct-current switching power supply; the functions are completed by an independent singlechip on a central control circuit board through embedded software.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311711256.9A CN117442884A (en) | 2023-12-13 | 2023-12-13 | Near infrared light blanket |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311711256.9A CN117442884A (en) | 2023-12-13 | 2023-12-13 | Near infrared light blanket |
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| CN117442884A true CN117442884A (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311711256.9A Pending CN117442884A (en) | 2023-12-13 | 2023-12-13 | Near infrared light blanket |
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| Country | Link |
|---|---|
| CN (1) | CN117442884A (en) |
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2023
- 2023-12-13 CN CN202311711256.9A patent/CN117442884A/en active Pending
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