CN117435012A - Server, heat dissipation system and heat dissipation method - Google Patents

Abstract

The application discloses a server, a heat radiation system and a heat radiation method, wherein the heat radiation system comprises a direct cooling evaporation assembly, an air cooling evaporation assembly and a heat exchange assembly, the direct cooling evaporation assembly comprises at least one direct cooling plate assembly, and the direct cooling plate assembly is used for heating devices arranged in the server and can absorb heat; the air-cooled evaporation assembly comprises an evaporator and a first fan, and air flow formed by the first fan passes through the surface of the evaporator; the heat exchange assembly comprises a compressor, a condenser, a gas-liquid separator and a liquid reservoir, wherein a liquid discharge outlet of the compressor is connected with an inlet of the condenser through a pipeline, the liquid reservoir is arranged on a pipeline at an outlet of the condenser, the pipeline at the outlet of the liquid reservoir is respectively connected with a direct cooling evaporation assembly and a pipeline at an inlet of the evaporator, the pipelines at the outlets of the direct cooling evaporation assembly and the evaporator are respectively converged to the pipeline at the inlet of the compressor, and the gas-liquid separator is arranged on the pipeline at the inlet of the compressor; the direct cooling evaporation assembly and the evaporator are connected in parallel in the heat dissipation system.

Description

Server, heat dissipation system and heat dissipation method

Technical Field

The present disclosure relates to the field of server heat dissipation technologies, and in particular, to a server, a heat dissipation system, and a heat dissipation method.

Background

With the development of information technology, the heat flux density of key components such as a CPU (Central processing Unit), a GPU (graphics processing Unit) and the like of electronic products is higher and higher, and the requirement on heat dissipation is also higher and higher. Because the heating values of different points are different, high-density local hot spots exist, and the traditional air cooling heat dissipation technology is adopted, so that the heat dissipation requirement of the high-density hot spots cannot be met, and a high-energy-consumption heat dissipation system of the high-energy-consumption heat dissipation system can bring high economic expenditure and resource waste.

Disclosure of Invention

In order to solve at least one of the above technical problems, the present application provides a server, a heat dissipation system and a heat dissipation method, and the adopted technical scheme is as follows.

The heat dissipation system comprises a direct cooling evaporation assembly, an air cooling evaporation assembly and a heat exchange assembly, wherein the direct cooling evaporation assembly comprises at least one direct cooling plate assembly, the direct cooling plate assembly is used for being arranged on a heating device in a server and capable of absorbing heat, and a second expansion valve is arranged on a pipeline at an inlet of the direct cooling evaporation assembly; the air-cooled evaporation assembly comprises an evaporator and a first fan, wherein air flow formed by the first fan passes through the surface of the evaporator, and a pipeline at the inlet of the evaporator is provided with a first expansion valve; the heat exchange assembly comprises a compressor, a condenser, a gas-liquid separator and a liquid reservoir, wherein a liquid discharge outlet of the compressor is connected with an inlet of the condenser through a pipeline, the liquid reservoir is arranged on a pipeline at an outlet of the condenser, the pipeline at the outlet of the liquid reservoir is respectively connected with the direct cooling evaporation assembly and the pipeline at the inlet of the evaporator, the pipeline at the outlet of the direct cooling evaporation assembly and the pipeline at the outlet of the evaporator are respectively converged to the pipeline at the inlet of the compressor, and the gas-liquid separator is arranged on the pipeline at the inlet of the compressor; wherein, the direct cooling evaporation component and the evaporator are connected in parallel in the heat dissipation system.

In certain embodiments of the present application, the heat dissipation system includes a first flow regulating valve and a second flow regulating valve, the first flow regulating valve is disposed in a pipeline at an inlet of the evaporator, and the second flow regulating valve is disposed in a pipeline at an inlet of the direct-cooling evaporation assembly.

In some embodiments of the present application, the heat dissipation system includes a high-low pressure controller, and the high-low level controller is connected to the pipeline at the inlet of the compressor and the drain outlet through pipelines respectively.

In certain embodiments of the present application, the heat dissipation system includes a first temperature controller and a second temperature controller, the first temperature controller is disposed in the evaporator, and the second temperature controller is disposed in the direct-cooling evaporation assembly.

In certain embodiments of the present application, the heat dissipation system includes a first filter disposed in a conduit at an outlet of the reservoir.

In some embodiments of the present application, the heat dissipation system includes a bypass pipe and a differential pressure regulating valve, two ends of the bypass pipe are respectively connected with an outlet of the compressor and an inlet of the accumulator, and the differential pressure regulating valve is disposed in the bypass pipe.

In certain embodiments of the present application, the pipeline of the exit of the evaporator is provided with a second pressure sensor, the pipeline of the exit of the direct-cooling evaporation assembly is provided with a fourth pressure sensor, the pipeline of the entrance of the compressor is provided with a third pressure sensor, and the pipeline of the exit of the condenser is provided with a first pressure sensor.

In certain embodiments of the present application, the heat dissipation system includes a charging valve disposed in a line at an inlet of the compressor.

In certain embodiments of the present application, the heat dissipation system includes a check valve disposed in a conduit at an outlet of the evaporator.

In certain embodiments of the present application, the pipeline at the outlet of the direct-cooling evaporation assembly is provided with a first pressure regulating valve, and the pipeline at the inlet of the compressor is provided with a second pressure regulating valve.

In certain embodiments of the present application, the heat dissipation system includes a high pressure regulator valve disposed in a conduit at an outlet of the condenser.

The server provided by the application comprises a cabinet, wherein a heat dissipation system is arranged in the cabinet.

In certain embodiments of the present application, the cabinet is provided with a first chamber, the first chamber is located the bottom of the cabinet, the evaporator with the first fan set up in the first chamber, the air inlet side of the first chamber is provided with the second filter, the air outlet side of the first chamber is provided with electric heater and dehydrator.

The heat dissipation method provided by the application adopts the heat dissipation system to cool the server, and comprises the following working procedures:

s1, the liquid storage device respectively provides high-pressure low-temperature coolant for the evaporator and the direct-cooling evaporation assembly;

s2, after being processed by the first expansion valve, the coolant forms low temperature and low pressure and enters the evaporator; after being treated by the second expansion valve, the coolant forms low temperature and low pressure and enters the direct cooling evaporation assembly;

s3, the coolant exchanges heat with the air flow formed by the first fan in the evaporator to form cold air, and the coolant forms high-temperature low-pressure air and is discharged from a pipeline at the outlet of the evaporator; the coolant exchanges heat with the heating device in the direct-cooling evaporation assembly, forms high-temperature low-pressure gas, and is discharged from a pipeline at the outlet of the direct-cooling evaporation assembly;

s4, collecting the coolants at the outlets of the evaporator and the direct cooling evaporation assembly, then enabling the coolants to enter the gas-liquid separator, enabling the coolants to enter the compressor after gas-liquid separation, and enabling the coolants to form high-temperature and high-pressure gas after the coolants are processed by the compressor;

s5, the coolant enters the condenser from the compressor, and the coolant forms high-pressure low-temperature liquid after heat exchange treatment of the condenser and flows into the liquid reservoir.

Embodiments of the present application have at least the following beneficial effects: in the heat dissipation system, a direct cooling plate assembly of the direct cooling evaporation assembly is arranged on a heating device in the server, so that accurate heat dissipation is performed on a high heat flux point of the server, air flow formed by a first fan of the air cooling evaporation assembly forms cold air after heat exchange of the evaporator, and the cold air enters the server to form a low-temperature large environment; and the coolant after heat exchange by the direct cooling evaporation assembly and the evaporator flows back to the compressor and the condenser of the heat exchange assembly for treatment, and the two share one set of heat exchange assembly, so that the cost is reduced, and the energy consumption is saved. The method and the device can be widely applied to the technical field of server heat dissipation.

Drawings

The aspects and advantages described and/or appended to the embodiments of the present application will become apparent and readily appreciated from the following drawings. It should be noted that the embodiments shown in the drawings below are exemplary only and are not to be construed as limiting the application.

Fig. 1 is a schematic diagram of a heat dissipation system.

Fig. 2 is a schematic structural diagram of a direct-cooling evaporation assembly.

Fig. 3 is a schematic structural diagram of a heat dissipation system disposed in a server.

Reference numerals:

100. a direct-cooling evaporation assembly; 110. A direct cooling plate assembly; 111. A direct cooling plate;

210. an evaporator; 211. A check valve; 220. A first fan;

310. a compressor; 311. a high-low voltage controller; 320. a condenser; 321. a high pressure regulating valve; 322. a second fan; 330. a gas-liquid separator; 340. a reservoir; 341. a first filter; 351. a bypass pipe; 352. a differential pressure regulating valve; 360. a liquid adding valve; 370. a liquid viewing mirror;

411. a first expansion valve; 412. a second expansion valve; 421. a first flow regulating valve; 422. a second flow regulating valve; 431. a first temperature controller; 432. a second temperature controller; 441. a first pressure sensor; 442. a second pressure sensor; 443. a third pressure sensor; 444. a fourth pressure sensor; 451. a first pressure regulating valve; 452. a second pressure regulating valve;

500. a cabinet; 510. a first chamber; 511. a second filter; 512. an electric heater; 513. a water remover; 520. a second chamber; 530. a main chamber.

Detailed Description

Embodiments of the present application are described in detail below with reference to fig. 1-3, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that, if the terms "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships are based on the orientations or positional relationships illustrated in the drawings, it is merely for convenience in describing the present application and simplifying the description, and it does not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application. Features defining "first", "second" are used to distinguish feature names from special meanings, and furthermore, features defining "first", "second" may explicitly or implicitly include one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The application relates to a server, the server includes rack 500, is provided with cooling system in the rack 500, and cooling system is the heating device heat dissipation in the server with the mode of liquid cooling on the one hand, effectively solves the heat dissipation problem of local high hot spot, forms low temperature air current in the server with the mode of forced air cooling on the other hand, promotes the server heat dissipation.

Other constructions and operations of the server are well known to those skilled in the art, and will not be described in detail herein, and the structure of the heat dissipation system will be described below.

The application relates to a cooling system, cooling system include direct cooling evaporation subassembly 100, forced air cooling evaporation subassembly and heat transfer subassembly, and direct cooling evaporation subassembly 100 and forced air cooling evaporation subassembly are respectively through the pipe connection heat transfer subassembly, and direct cooling evaporation subassembly 100 is arranged in for the device that generates heat in the server dispels the heat, and forced air cooling evaporation subassembly provides the air current of taking away the heat for the server. It can be understood that the direct cooling evaporation assembly 100 dissipates heat for the heating device in a liquid cooling manner, the air cooling evaporation assembly provides fresh air with temperature, moderate temperature and meeting parameter requirements for the server in a low-temperature air flow manner, and the heat exchange assembly dissipates heat absorbed by the coolants in the direct cooling evaporation assembly 100 and the air cooling evaporation assembly.

Under the condition, according to different local heat flux densities of the server, different cooling modes are adopted respectively, so that accurate heat dissipation is realized, and the problem of equipment failure caused by local overheating is solved. The direct cooling evaporation assembly 100 effectively solves the problem of heat dissipation of local hot spots in the server, the air cooling evaporation assembly provides a large heat dissipation environment for the server, and meanwhile, low-temperature airflow formed by the air cooling evaporation assembly can also exchange heat with the surface of the direct cooling evaporation assembly 100. On the other hand, the direct cooling evaporation assembly 100 and the air cooling evaporation assembly share one set of heat exchange assembly, so that the cost of the heat dissipation system is greatly saved.

The direct-cooling evaporation assembly 100 comprises at least one direct-cooling plate assembly 110, wherein the direct-cooling plate assembly 110 is used for a heating device arranged in a server and can absorb heat, so that the direct-cooling evaporation assembly 100 dissipates heat for a high heat flux point in the server. The pipelines at the inlet and the outlet of the direct-cooling evaporation assembly 100 are respectively connected to the heat exchange assembly, the high-temperature coolant in the direct-cooling evaporation assembly 100 enters the heat exchange assembly, the coolant is cooled after being treated by the heat exchange assembly, and the heat exchange assembly provides low-temperature coolant for the direct-cooling evaporation assembly 100.

The direct cooling plate assembly 110 comprises at least one direct cooling plate 111, wherein the direct cooling plate 111 is arranged at a heating device in the server, the direct cooling plate 111 exchanges heat with equipment points with high heat flux, and heat is taken away by means of a coolant flowing through the direct cooling plate 111 so as to achieve the purpose of heat dissipation.

It is understood that in the case where the direct cooling plate assembly 110 includes at least two direct cooling plates 111, the direct cooling plates 111 in the direct cooling plate assembly 110 are connected in series or in parallel. In the case where the direct-cooling evaporation assembly 100 includes at least two direct-cooling plate assemblies 110, the direct-cooling plate assemblies 110 in the direct-cooling evaporation assembly 100 are connected in parallel.

The air cooling evaporation assembly provides a proper airflow environment for a low heat flux point in the server, the air cooling evaporation assembly comprises an evaporator 210 and a first fan 220, the evaporator 210 is arranged at an air inlet position, the first fan 220 is arranged close to the evaporator 210, airflow formed by the first fan 220 passes through the surface of the evaporator 210, pipelines at an inlet and an outlet of the evaporator 210 are respectively connected to a heat exchange assembly, and the heat exchange assembly provides low-temperature coolant for the evaporator 210. Specifically, the low-temperature coolant enters the evaporator 210, the air flow formed by the first fan 220 passes through the surface of the evaporator 210, the coolant exchanges heat with the air flow to form a low-temperature air flow, the coolant after absorbing heat enters the heat exchange assembly, and the heat exchange assembly processes the coolant and obtains the low-temperature coolant.

Referring to the drawings, in a pipeline of a heat dissipating system, a direct cooling evaporation assembly 100 and an evaporator 210 are connected in parallel. It is understood that the pipelines at two ends of the heat exchange assembly are connected with the direct-cooling evaporation assembly 100 and the evaporator 210 through three-way valves, and the coolant enters the direct-cooling evaporation assembly 100 and the evaporator 210 respectively.

In consideration of the different temperature requirements of the evaporator 210 and the direct-cooling evaporation assembly 100 for the evaporation pressure of the coolant, a first pressure regulating valve 451 is provided in the pipeline at the outlet of the direct-cooling evaporation assembly 100, and the first pressure regulating valve 451 is used to regulate the evaporation pressure of the direct-cooling evaporation assembly 100. Specifically, the regulation function of the first pressure regulating valve 451 ensures that the evaporation pressure of the direct-cooling evaporation assembly 100 is higher than the evaporation pressure of the evaporator 210 when the heat dissipation system is in operation, and can keep the evaporation pressure value of the direct-cooling evaporation assembly 100 stable. Further, the heat radiation system includes a check valve 211, the check valve 211 being disposed at a pipe line at an outlet of the evaporator 210, the check valve 211 being used to prevent the coolant discharged from the direct cooling evaporation assembly 100 from entering the evaporator 210 when the heat radiation system is stopped.

The heat dissipation system includes a first flow rate adjusting valve 421, the first flow rate adjusting valve 421 is a solenoid valve, the first flow rate adjusting valve 421 is disposed on a pipeline at an inlet of the evaporator 210, the first flow rate adjusting valve 421 is used for adjusting a flow rate of the coolant flowing through the evaporator 210, and the first flow rate adjusting valve 421 serves as a switch of a water inlet pipeline of the evaporator 210. Further, a pressure gauge is provided in the pipeline at the outlet of the evaporator 210 for testing the pressure at the outlet end of the evaporator 210.

The heat dissipation system includes a second flow rate adjusting valve 422, the second flow rate adjusting valve 422 employs a solenoid valve, the second flow rate adjusting valve 422 is disposed on a pipeline at an inlet of the direct-cooling evaporation assembly 100, the second flow rate adjusting valve 422 is used for adjusting a flow rate of the coolant flowing through the direct-cooling evaporation assembly 100, and the second flow rate adjusting valve 422 serves as a switch of a water inlet pipeline of the direct-cooling evaporation assembly 100. Further, a pressure gauge is provided in the pipeline at the outlet of the direct-cooling evaporation assembly 100 for testing the pressure at the outlet end of the direct-cooling evaporation assembly 100.

It can be understood that, during the operation of the heat dissipation system, after the heat exchange is performed on the coolant in the evaporator 210 and the direct-cooling evaporation assembly 100, the working conditions of the coolant are changed, so that a pressure difference exists between the pipelines at the outlets of the evaporator 210 and the direct-cooling evaporation assembly 100, and in order to ensure that the pressures of the pipelines at the outlets of the evaporator 210 and the direct-cooling evaporation assembly 100 tend to be the same, the flow distribution of the coolant entering the evaporator 210 and the direct-cooling evaporation assembly 100 is adjusted by adjusting the opening of the first flow adjusting valve 421 and the second flow adjusting valve 422 respectively, so that the pressures at the outlets of the evaporator 210 and the direct-cooling evaporation assembly 100 are indirectly controlled in a flow adjustment manner.

The heat dissipation system includes a first expansion valve 411, the first expansion valve 411 is disposed on a pipeline at an inlet of the evaporator 210, and in combination with the drawing, the first expansion valve 411, a first flow rate adjusting valve 421 and the evaporator 210 are connected in series, and the first expansion valve 411 is located between the inlet of the evaporator 210 and the first flow rate adjusting valve 421. During normal operation of the heat dissipation system, the inlet liquid amount of the evaporator 210 is adjusted through the first expansion valve 411 according to the change of the load of the server, and the outlet superheat degree of the evaporator 210 is controlled.

The heat dissipation system includes a second expansion valve 412, where the second expansion valve 412 is disposed on a pipeline at an inlet of the direct-cooling evaporation assembly 100, and referring to the drawings, the second expansion valve 412, a second flow regulating valve 422 and the direct-cooling evaporation assembly 100 are connected in series, and the second expansion valve 412 is located between the inlet of the direct-cooling evaporation assembly 100 and the second flow regulating valve 422. During normal operation of the heat dissipation system, the liquid inlet amount of the direct-cooling evaporation assembly 100 is adjusted through the second expansion valve 412 according to the change of the load of the server, and the superheat degree of the outlet of the direct-cooling evaporation assembly 100 is controlled.

The heat dissipation system includes a first temperature controller 431, the first temperature controller 431 is disposed on the evaporator 210, and the first temperature controller 431 is electrically connected to the first flow control valve 421. When the temperature of the evaporator 210 reaches the set lower limit, the first temperature controller 431 causes the first flow regulating valve 421 to close, stopping the cooling action of the evaporator 210. When the temperature of the evaporator 210 is raised to the upper limit of the set value, the first temperature controller 431 turns on the first flow regulating valve 421 to restore the cooling effect of the evaporator 210, thereby achieving two-position regulation of the temperature of the evaporator 210.

The heat dissipation system includes a second temperature controller 432, the second temperature controller 432 is disposed on the direct-cooling evaporation assembly 100, and the second temperature controller 432 is electrically connected to the second flow regulating valve 422. When the temperature of the direct-cooling evaporation assembly 100 reaches the set lower limit, the second temperature controller 432 closes the second flow rate adjustment valve 422, stopping the cooling function of the direct-cooling evaporation assembly 100. When the temperature of the direct-cooling evaporation assembly 100 is raised to the upper limit of the set value, the second temperature controller 432 turns on the second flow rate adjustment valve 422, and resumes the refrigeration of the direct-cooling evaporation assembly 100, thereby achieving two-position adjustment of the temperature of the direct-cooling evaporation assembly 100.

Referring to the drawings, the heat exchange assembly includes a compressor 310 and a condenser 320, the pipelines at the outlets of the direct-cooling evaporation assembly 100 and the evaporator 210 are respectively converged to the pipeline at the inlet of the compressor 310, the liquid discharge outlet of the compressor 310 is connected with the inlet of the condenser 320 through the pipeline, and the pipeline at the outlet of the condenser 320 is respectively connected with the pipelines at the inlets of the direct-cooling evaporation assembly 100 and the evaporator 210. Further, the heat exchange assembly includes a second fan 322, the second fan 322 is disposed near the condenser 320, and an air flow formed by the second fan 322 passes through a surface of the condenser 320 and can take away heat of the coolant in the condenser 320 to realize air-cooled condensation.

It can be understood that the temperature of the coolant increases after heat exchange in the direct-cooling evaporation assembly 100 and the evaporator 210, and the coolant flows from the direct-cooling evaporation assembly 100 and the evaporator 210 into the compressor 310, and the coolant is formed in a high-temperature and high-pressure state by the compressor 310, and is cooled after being processed by the condenser 320, so as to obtain the coolant in a low-temperature state.

The pipeline at the inlet of the compressor 310 is provided with a second pressure regulating valve 452, the second pressure regulating valve 452 is provided on the suction pipeline of the compressor 310, and the second pressure regulating valve 452 is used for regulating the suction pressure of the compressor 310. Specifically, when the pressure of the evaporator 210 increases during the start-up cool down period, the suction air is throttled by the adjustment of the second pressure regulating valve 452, and the suction air pressure is controlled not to exceed the limit, so as to protect the motor of the compressor 310 from overload.

The heat dissipation system comprises a high-low pressure controller 311, the high-low level control is respectively connected with the pipeline at the inlet of the compressor 310 and the pipeline at the liquid discharge outlet through pipelines, the high-pressure part of the high-low pressure controller 311 plays a role in protecting the high-pressure side of the heat dissipation system from overpressure, the low-pressure control part of the high-low pressure controller 311 plays a role in preventing the air suction pressure of the compressor 310 from being too low, and the normal starting and stopping of the compressor 310 are controlled when the heat dissipation system is in normal operation. When the evaporator 210 and the direct-cooling evaporation assembly 100 reach the cooling requirement, the heat exchange assembly stops supplying liquid to the evaporator 210 and the direct-cooling evaporation assembly 100, the coolant in the evaporator 210 and the direct-cooling evaporation assembly 100 is pumped out, the suction pressure of the compressor 310 is reduced, and when the suction pressure is reduced to a control value that the low-pressure part of the high-low pressure controller 311 is disconnected, the compressor 310 is stopped. At this time, the heat dissipation system is in a waiting load state. When the temperature of any one of the evaporator 210 and the direct-cooling evaporation assembly 100 is raised to the temperature control value, the first flow rate regulating valve 421 is controlled by the corresponding first temperature controller 431 to be opened, and the second flow rate regulating valve 422 is controlled by the corresponding second temperature controller 432 to be opened, so that the liquid inlet of the evaporator 210 and the direct-cooling evaporation assembly 100 is carried out, the suction pressure of the compressor 310 is raised, and when the suction pressure is raised to the on control value of the low-pressure part of the high-low pressure controller 311, the compressor 310 is restarted to move.

It will be appreciated that the advantage of using the low pressure portion of the high and low pressure controller 311 to control the compressor 310 to start and stop normally, rather than using the first temperature controller 431 and the second temperature controller 432 to directly control the compressor 310, is that: the method can ensure that the coolant at the low pressure side is pumped out before the compressor 310 is stopped, so that more coolant is prevented from entering the crankcase of the compressor 310 after the stopping, so that the coolant is dissolved in lubricating oil, and the oil level in the crankcase is raised to cause a large amount of oil loss when the compressor is started next time.

It should be noted that, the temperature control of the evaporator 210 and the direct-cooling evaporation assembly 100 is performed by the first temperature controller 431 and the second temperature controller 432, the first flow rate adjusting valve 421 and the second flow rate adjusting valve 422, and the low pressure control portion of the high-low pressure controller 311.

The heat dissipation system includes a gas-liquid separator 330, the gas-liquid separator 330 is connected in series with the compressor 310, the gas-liquid separator 330 is disposed on a pipeline at an inlet of the compressor 310, the coolant discharged from the direct cooling evaporation assembly 100 and the evaporator 210 flows through the gas-liquid separator 330, and the gas-liquid separator 330 is used for separating gas and liquid in the coolant before entering the compressor 310.

The heat dissipation system includes a charging valve 360, the charging valve 360 is used for charging the heat dissipation system with coolant, and the charging valve 360 is disposed on a pipeline at an inlet of the compressor 310. In connection with the drawing, the charging valve 360, the gas-liquid separator 330 and the compressor 310 are sequentially connected in series.

The heat dissipation system includes a liquid reservoir 340, the liquid reservoir 340 is disposed in a pipeline at an outlet of the condenser 320, the liquid reservoir 340 is used for storing high-pressure coolant from the condenser 320, so that the liquid does not submerge the surface of the condenser 320, and the circulation of the coolant is regulated and stabilized to adapt to the variation of working conditions, and meanwhile, the high-pressure coolant can be prevented from channeling into the pipeline with low pressure. The lines at the outlet of the reservoir 340 connect the lines at the inlets of the direct-cooled evaporator assembly 100 and the evaporator 210, respectively, to provide coolant to the direct-cooled evaporator assembly 100 and the evaporator 210, respectively.

The heat dissipation system includes a bypass pipe 351, and both ends of the bypass pipe 351 are respectively connected to an outlet of the compressor 310 and an inlet of the accumulator 340. Referring to the drawings, the heat dissipation system includes a differential pressure regulating valve 352, and the differential pressure regulating valve 352 is disposed at a bypass pipe 351. Further, the heat dissipation system includes a high pressure regulating valve 321, and the high pressure regulating valve 321 is disposed on a pipeline at an outlet of the condenser 320. When the coolant temperature is low, a part of the liquid accumulation and a part of the exhaust gas are bypassed to the reservoir 340 by the cooperation of the high-pressure regulating valve 321 and the differential pressure regulating valve 352, so that the pressure on the high-pressure side of the heat radiation system is maintained not to be significantly reduced.

The heat dissipation system includes a first filter 341, the first filter 341 is disposed in a pipe at an outlet of the reservoir 340, the first filter 341 is configured as a dry filter, and the first filter 341 is configured to effectively filter impurities in the coolant.

The heat dissipation system includes a liquid-viewing mirror 370, wherein the liquid-viewing mirror 370 is disposed on a pipeline at an outlet of the liquid reservoir 340, and the liquid-viewing mirror 370 is used for observing a state of a coolant in the pipeline. In connection with the drawing, the first filter 341 and the liquid viewing mirror 370 are connected in series in this order on a pipe at the outlet of the liquid reservoir 340.

The pipeline at the outlet of the evaporator 210 is provided with a second pressure sensor 442, the pipeline at the outlet of the direct cooling evaporation assembly 100 is provided with a fourth pressure sensor 444, the pipeline at the inlet of the compressor 310 is provided with a third pressure sensor 443, and the pipeline at the outlet of the condenser 320 is provided with a first pressure sensor 441.

According to the above description of the heat dissipation system, the following is a supplementary description of the structure of the server.

The control panel of the heat dissipation system is disposed at the front side of the cabinet 500, which is convenient to operate and control. The cabinet 500 is provided with a main chamber 530, and various devices of the server are disposed in the main chamber 530.

The direct-cooling evaporator assembly 100 and the evaporator 210 are integrated in the cabinet 500, which reduces the occupied area, facilitates the transportation and deployment of equipment, and reduces the material cost. Referring to the drawings, the cabinet 500 is provided with a first chamber 510, the first chamber 510 is located at the bottom of the cabinet 500, a main chamber 530 is located above the first chamber 510, and the main chamber 530 communicates with the first chamber 510. The evaporator 210 and the first fan 220 are disposed in the first chamber 510, and the evaporator 210 and the first fan 220 are disposed at the air inlet of the first chamber 510, and under the action of the first fan 220, the external air enters the first chamber 510 and exchanges heat with the evaporator 210 to form a low-temperature air flow, and the low-temperature air flow enters the main chamber 530 from the first chamber 510 to form a suitable low-temperature environment in the main chamber 530. The back panel of the cabinet 500 is provided with an air outlet area, and the air outlet area is provided as an air hole.

The air intake side of the first chamber 510 is provided with a second filter 511, and the second filter 511 is used for adjusting the cleanliness of the air flow. The air outlet side of the first chamber 510 is provided with an electric heater 512, and the electric heater 512 is used for adjusting the temperature of the air flow. The air outlet side of the first chamber 510 is provided with a water trap 513, the water trap 513 being for the humidity of the air flow.

The cabinet 500 is provided with a second chamber 520, the second chamber 520 is disposed at the bottom of the cabinet 500, and the second chamber 520 is located below the first chamber 510, and the liquid reservoir 340, the first filter 341, the compressor 310, the gas-liquid separator 330, and the liquid charging valve 360 are disposed in the second chamber 520.

The condenser 320 and the second fan 322 are disposed outside the cabinet 500, so that heat of the coolant in the condenser 320 can be conveniently dissipated to the atmosphere in a well ventilated environment.

The following describes the heat dissipation method in detail in connection with specific embodiments, and it should be noted that the following description is merely exemplary and not a specific limitation of the present application.

The application relates to a heat dissipation method, which adopts a heat dissipation system to cool a server, and comprises the following working procedures.

S1, the reservoir 340 provides the high pressure and low temperature coolant to the evaporator 210 and the direct-cooled evaporator assembly 100, respectively.

S2, after being processed by the first expansion valve 411, the coolant forms low temperature and low pressure and enters the evaporator 210; after being treated by the second expansion valve 412, the coolant forms a low temperature and pressure and enters the direct chill evaporation assembly 100.

S3, the coolant exchanges heat with the air flow formed by the first fan 220 in the evaporator 210 to form cold air, and the coolant forms high-temperature low-pressure air and is discharged from a pipeline at the outlet of the evaporator 210; the coolant exchanges heat with the heat generating device in the direct-cooling evaporation assembly 100, forms a high-temperature low-pressure gas, and is discharged from a pipeline at an outlet of the direct-cooling evaporation assembly 100.

S4, the cooling agent at the outlets of the evaporator 210 and the direct cooling evaporation assembly 100 is collected and enters the gas-liquid separator 330, the gas-liquid separation is completed, the cooling agent enters the compressor 310, and the cooling agent is processed by the compressor 310 to form high-temperature and high-pressure gas.

S5, the coolant enters the condenser 320 from the compressor 310, and forms high-pressure low-temperature liquid after heat exchange treatment by the condenser 320, and flows into the liquid reservoir 340.

It will be appreciated that the coolant goes from step S1 to step S5 in the heat-dissipating system, and then completes one heat-exchanging cycle.

In step S3, the opening degrees of the first flow rate adjustment valve 421 and the second flow rate adjustment valve 422 are respectively adjusted so that the pressures at the outlets of the evaporator 210 and the direct-cooling evaporation module 100 are equalized, and the coolant flow rates are distributed.

In step S4, the high-low pressure controller 311 is used to operate the start-up and stop of the compressor 310 according to the variation of the suction pressure of the compressor 310.

In step S5, when the temperature of the coolant after the compressor 310 is low, at least a part of the coolant after the compressor 310 is processed may be introduced into the accumulator 340 through the bypass pipe 351 by the cooperation of the high-pressure regulator 321 and the differential pressure regulator 352.

In the description of the present specification, if a description appears with reference to the term "one embodiment," "some examples," "some embodiments," "an exemplary embodiment," "an example," "a particular example," or "some examples," etc., it is intended that the particular feature, structure, material, or characteristic described in connection with the embodiment or example be included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the present application have been described in detail above with reference to the drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application.

In the description of the present application, the patent names, if appearing ", indicate a relationship of" and "instead of a relationship of" or ". For example, patent name "a A, B", describing what is claimed in this application is: a technical scheme with a subject name A and a technical scheme with a subject name B.

Claims (14)

1. A heat dissipation system, characterized by: comprising

The direct-cooling evaporation assembly (100), the direct-cooling evaporation assembly (100) comprises at least one direct-cooling plate assembly (110), the direct-cooling plate assembly (110) is used for being arranged in a heating device in a server and can absorb heat, and a pipeline at an inlet of the direct-cooling evaporation assembly (100) is provided with a second expansion valve (412);

the air-cooled evaporation assembly comprises an evaporator (210) and a first fan (220), wherein air flow formed by the first fan (220) passes through the surface of the evaporator (210), and a pipeline at the inlet of the evaporator (210) is provided with a first expansion valve (411);

the heat exchange assembly comprises a compressor (310), a condenser (320), a gas-liquid separator (330) and a liquid reservoir (340), wherein a liquid discharge outlet of the compressor (310) is connected with an inlet of the condenser (320) through a pipeline, the liquid reservoir (340) is arranged on a pipeline at an outlet of the condenser (320), the pipeline at the outlet of the liquid reservoir (340) is respectively connected with the pipeline at the inlets of the direct-cooling evaporation assembly (100) and the evaporator (210), the pipeline at the outlets of the direct-cooling evaporation assembly (100) and the evaporator (210) are respectively converged to the pipeline at the inlet of the compressor (310), and the gas-liquid separator (330) is arranged on the pipeline at the inlet of the compressor (310);

wherein the direct-cooling evaporation assembly (100) and the evaporator (210) are connected in parallel in the heat dissipation system.

2. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a first flow regulating valve (421) and a second flow regulating valve (422), wherein the first flow regulating valve (421) is arranged on a pipeline at the inlet of the evaporator (210), and the second flow regulating valve (422) is arranged on a pipeline at the inlet of the direct-cooling evaporation assembly (100).

3. The heat dissipation system according to claim 1 or 2, characterized in that: the heat dissipation system comprises a high-low pressure controller (311), and the high-low level control is connected with pipelines at the inlet of the compressor (310) and the liquid discharge outlet through pipelines respectively.

4. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a first temperature controller (431) and a second temperature controller (432), wherein the first temperature controller (431) is arranged on the evaporator (210), and the second temperature controller (432) is arranged on the direct-cooling evaporation assembly (100).

5. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a first filter (341), wherein the first filter (341) is arranged on a pipeline at the outlet of the liquid reservoir (340).

6. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a bypass pipe (351) and a pressure difference regulating valve (352), wherein two ends of the bypass pipe (351) are respectively connected with an outlet of the compressor (310) and an inlet of the liquid storage device (340), and the pressure difference regulating valve (352) is arranged in the bypass pipe (351).

7. The heat dissipation system according to claim 1, wherein: the pipeline of the exit of evaporimeter (210) is provided with second pressure sensor (442), the pipeline of the exit of direct-cooled evaporation subassembly (100) is provided with fourth pressure sensor (444), the pipeline of the entrance of compressor (310) is provided with third pressure sensor (443), the pipeline of the exit of condenser (320) is provided with first pressure sensor (441).

8. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a liquid adding valve (360), and the liquid adding valve (360) is arranged on a pipeline at the inlet of the compressor (310).

9. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a check valve (211), wherein the check valve (211) is arranged on a pipeline at the outlet of the evaporator (210).

10. The heat dissipation system according to claim 1, wherein: a first pressure regulating valve (451) is arranged on a pipeline at the outlet of the direct-cooling evaporation assembly (100), and a second pressure regulating valve (452) is arranged on a pipeline at the inlet of the compressor (310).

11. The heat dissipation system according to claim 1, wherein: the heat dissipation system comprises a high-pressure regulating valve (321), and the high-pressure regulating valve (321) is arranged on a pipeline at the outlet of the condenser (320).

12. A server, characterized by: the server comprises a cabinet (500), the cabinet (500) having the heat dissipation system as claimed in any one of claims 1 to 11 disposed therein.

13. The server according to claim 12, wherein: the cabinet (500) is provided with a first chamber (510), the first chamber (510) is located the bottom of the cabinet (500), the evaporator (210) and the first fan (220) are arranged in the first chamber (510), the air inlet side of the first chamber (510) is provided with a second filter (511), and the air outlet side of the first chamber (510) is provided with an electric heater (512) and a dehydrator (513).

14. A method of dissipating heat, comprising: the heat dissipation method adopts the heat dissipation system as defined in any one of claims 1 to 11 to cool a server, and the work flow of the heat dissipation method comprises the following steps of

S1, the liquid reservoir (340) respectively provides high-pressure low-temperature coolant for the evaporator (210) and the direct-cooling evaporation assembly (100);

s2, after being processed by the first expansion valve (411), the coolant forms low temperature and low pressure and enters the evaporator (210); after being treated by the second expansion valve (412), the coolant forms low temperature and low pressure and enters the direct cooling evaporation assembly (100);

s3, the coolant exchanges heat with the air flow formed by the first fan (220) in the evaporator (210) to form cold air, and the coolant forms high-temperature low-pressure air and is discharged from a pipeline at the outlet of the evaporator (210); the coolant exchanges heat with the heating device in the direct-cooling evaporation assembly (100), forms high-temperature low-pressure gas, and is discharged from a pipeline at the outlet of the direct-cooling evaporation assembly (100);

s4, collecting the coolants at the outlets of the evaporator (210) and the direct cooling evaporation assembly (100), enabling the coolants to enter the gas-liquid separator (330), enabling the coolants to enter the compressor (310) after gas-liquid separation is completed, and enabling the coolants to form high-temperature and high-pressure gas after being processed by the compressor (310);

s5, the coolant enters the condenser (320) from the compressor (310), and the coolant is subjected to heat exchange treatment by the condenser (320) to form high-pressure low-temperature liquid and flows into the liquid reservoir (340).