CN117434127A - Preparation method of integrated glucose sensor of integrated printed circuit board - Google Patents
Preparation method of integrated glucose sensor of integrated printed circuit board Download PDFInfo
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- CN117434127A CN117434127A CN202311388329.5A CN202311388329A CN117434127A CN 117434127 A CN117434127 A CN 117434127A CN 202311388329 A CN202311388329 A CN 202311388329A CN 117434127 A CN117434127 A CN 117434127A
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- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 title claims abstract description 60
- 239000008103 glucose Substances 0.000 title claims abstract description 60
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000523 sample Substances 0.000 claims abstract description 87
- 238000005452 bending Methods 0.000 claims abstract description 55
- 238000005520 cutting process Methods 0.000 claims abstract description 25
- 238000007639 printing Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 238000004377 microelectronic Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 108010015776 Glucose oxidase Proteins 0.000 claims description 6
- 239000004366 Glucose oxidase Substances 0.000 claims description 6
- 229940116332 glucose oxidase Drugs 0.000 claims description 6
- 235000019420 glucose oxidase Nutrition 0.000 claims description 6
- 238000003618 dip coating Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003776 cleavage reaction Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 238000003698 laser cutting Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 230000007017 scission Effects 0.000 claims description 4
- 239000008204 material by function Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000008280 blood Substances 0.000 description 10
- 210000004369 blood Anatomy 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 238000012544 monitoring process Methods 0.000 description 7
- 206010012601 diabetes mellitus Diseases 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 208000017667 Chronic Disease Diseases 0.000 description 1
- 208000008960 Diabetic foot Diseases 0.000 description 1
- 208000013016 Hypoglycemia Diseases 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000012491 analyte Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 208000029078 coronary artery disease Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000016097 disease of metabolism Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 201000001421 hyperglycemia Diseases 0.000 description 1
- 230000002218 hypoglycaemic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 208000030159 metabolic disease Diseases 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 208000033808 peripheral neuropathy Diseases 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005180 public health Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3275—Sensing specific biomolecules, e.g. nucleic acid strands, based on an electrode surface reaction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/305—Electrodes, e.g. test electrodes; Half-cells optically transparent or photoresponsive electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Immunology (AREA)
- Electrochemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Pathology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The preparation method of the integrated glucose sensor of the integrated printed circuit board comprises the following steps: drawing a connecting area and a cutting area on a flexible substrate film, drawing a bending origin point on the boundary of the connecting area and the cutting area, drawing a strip-shaped area with the bending origin point as a starting point to serve as a probe area, enabling the probe area to penetrate through the cutting area and extend into the substrate film, respectively printing at least three flexible circuits on the front surface or/and the back surface of the substrate film near the connecting area, attaching at least one chip on the at least three flexible circuits, enabling the endpoints of the at least three flexible circuits to be contacts, and printing working electrodes on the connecting line of the bending origin point of the probe area and at least one contact in the connecting area; printing a reference electrode on the connecting line of the bending origin of the probe area and one of the other contacts; printing a counter electrode on a connection line between a bending origin of the probe region and at least one contact point; and bending the probe region by 90 degrees by taking the bending origin as a bending point to prepare the complete glucose electrode.
Description
Technical Field
The invention relates to the field of continuous glucose monitors, in particular to a glucose sensor, and particularly relates to a preparation method of an integrated glucose sensor of an integrated Printed Circuit Board (PCBA).
Background
Diabetes is a metabolic disease characterized by sustained hyperglycemia and has become a global public health problem. Recent data from the international diabetes consortium shows that 5.37 million diabetics exist worldwide, with almost one diabetic in every ten adults. Diabetes, a chronic disease, can induce various complications such as coronary heart disease, peripheral neuropathy, diabetic foot, etc., has become a large killer for human life and health.
To date, there is no radical cure for diabetes. The most effective clinical approach is to monitor the blood glucose concentration of the patient in real time and continuously and to take positive clinical intervention to maintain the blood glucose concentration in the normal range. The blood sugar monitoring data is the basis for making a treatment scheme for diabetics, is also an important index for evaluating the treatment effect, and can find the hypoglycemia condition of the diabetics in time, thereby preventing the occurrence of acute accidents. Therefore, the development of glucose sensing technology applied to continuous blood glucose monitoring has important significance in the fields of detection, treatment and the like of diseases such as diabetes and the like.
In order to realize continuous monitoring of blood glucose concentration, the adoption of wearable equipment is an optimal solution, and is the design idea of most of the existing continuous blood glucose monitoring products. Such body surface wearable devices are typically manufactured by: firstly, manufacturing a glucose probe with a tiny size (diameter is 0.1-0.4 mm) based on electrochemical or photochemical detection principles, implanting and burying a front working area of the probe under the skin for a long time, connecting a tail end of the probe with a detection unit (such as a PCBA circuit board), applying a test excitation signal to the probe through the circuit board, simultaneously automatically collecting signals, converting the collected signals into blood glucose concentration after the steps of analog-digital conversion, signal amplification, data processing, algorithm calculation and the like, and transmitting the blood glucose concentration to a receiving device, thereby completing continuous and wearable monitoring of the blood glucose concentration. In terms of use, such body surface wearable continuous blood glucose monitoring products generally consist of a needle aid, i.e. responsible for painless implantation of the front end of the probe under the skin, and a transmitter, i.e. a body surface wearable device, responsible for the time of no sense of holding the probe on the body surface for 10-21 days, thereby achieving the purpose of continuous monitoring.
In order to realize painless implantation and painless wearing, solutions of companies are different, and the design mode of the probe, the design mode of the circuit board, the working principle of the base for connecting the two, and the mechanism principle of the needle aid are different and have various characteristics. But all transmitters, all of which do not depart from their own, comprise: the circuit board, the probe and the base are three components, wherein the base is responsible for connecting the circuit board, the probe and the base. In a specific manufacturing method, the probe, the circuit board, and the base are manufactured separately and then assembled into a single emitter.
U.S. patent No. 7602291B2 discloses a method for manufacturing a glucose probe, a circuit board, and a base. The probe is a wire electrode, a sensing film layer of the probe is prepared through processes such as dip coating, the wire electrode is fixed on a circuit board in a mode of extruding the tail end of the wire electrode through a metal clamp, and an interface part is coated through siloxane gel, so that the aim of water resistance is achieved. Therefore, the base is realized by a method of 'clamp+gel', and the defects of the base are that the manufacturing process is complex, the size of the base is tiny, and the base can be realized by a series of precise processes.
Chinese patent CN70461217B discloses an application device for an analyte sensor, which includes a glucose probe, a circuit board, and a base manufacturing method. The probe is a plane electrode, and is prepared by a screen printing process, the working area at the front end of the probe is vertically bent by 90 degrees in use, the tail end of the probe is horizontally fixed in the base, and the three electrodes are connected with contacts made of conductive rubber in the base and then connected with the circuit board. Such a mount is referred to in the patent as a "sensor module". The disadvantage of this base is: the electrode bending, the fixing of the broken needle, the waterproof function between the electrodes and the like are realized at the same time, and materials such as injection molding die pieces, conductive rubber, waterproof rubber and the like are needed, so that the electrode bending, the fixing of the broken needle, the waterproof rubber and the like are often made to be thick, and the final wearable device is thicker.
Chinese patent CN72512420a discloses another method for manufacturing glucose probe, circuit board and base. The probes are also plane electrodes and are also prepared by a screen printing process, and the probes are vertically fixed on the flexible circuit board through a customized base instead of bending, wherein the base consists of 4 metal stamping shrapnel and 1 injection molding piece, and the contacts of the 4 metal shrapnels can be welded on the circuit board. The disadvantage of this approach is: the manufacture of the base is difficult, requires the opening of a precision die, and is costly in terms of time and expense. Meanwhile, the base does not have a waterproof function, and the clamping force of the opposite electrode is not high. Although the clamping force of the electrode is not high, the metal elastic sheet is easy to scratch and damage the film surface at the tail end of the electrode because the width of the metal elastic sheet is too small (0.1 mm).
To sum up, to manufacture a wearable device containing a glucose probe, 3 different components need to be manufactured separately, i.e. 3 problems need to be solved:
1. design and manufacturing issues with probes;
2. circuit board design and manufacturing issues;
3. and the problem of connection of the probes and the circuit board.
These 3 problems are often addressed separately, and the most difficult design and manufacturing is the design and manufacturing of the connection device (commonly called a mount). Because the connection mode of the base determines the application and use modes of the device, the thickness and the appearance of the wearable device are determined, and the use experience is determined. In technical requirements, the base is required to ensure the stability of signal transmission and waterproof function, and meanwhile, the requirements of small volume and convenient operation are also required. Therefore, the method is often realized by a mode of opening a precise die, so that the manufacturing difficulty and the manufacturing cost are high, and the quick technical verification is not facilitated.
Disclosure of Invention
The invention aims to solve the problem that the existing circuit board and electrode connecting piece are difficult to design and manufacture in the improved existing technical process, and provides a preparation method of an integrated glucose sensor of an integrated printed circuit board.
In order to accomplish the object of the present application, the present application adopts the following technical scheme:
the invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps:
first, the probe area and the flexible circuit are manufactured on the same substrate film
Drawing an area on the flexible base film, said area comprising: the connecting area and the cutting area are connected, a bending origin is taken on the boundary between the connecting area and the cutting area, a strip-shaped area is drawn by taking the bending origin as a starting point and is used as a probe area, the probe area penetrates through the cutting area and stretches into the base film, at least three flexible circuits are respectively printed on the front surface or/and the back surface of the base film close to the connecting area, at least one chip is stuck on the at least three flexible circuits, and the endpoints of the at least three flexible circuits are contacts and are close to the connecting area;
(II) connecting the probe region and the flexible circuit together on the base film
Printing a working electrode on the connecting line of the bending origin of the probe area and at least one contact point in the bending origin of the probe area on the front surface and/or the back surface of the substrate film; printing a reference electrode on the connecting line of the bending origin of the probe area and one of the other contacts on the front surface and/or the back surface of the substrate film; on the front and/or back side of the base film; printing a counter electrode on a connection line between a bending origin of the probe region and at least one contact point; an insulating layer is printed among the working electrode, the reference electrode and the counter electrode which are overlapped on the probe area, and the connecting line of the bending origin and any contact is arranged in the connecting area or the substrate film;
(III) cleavage of the probe into a glucose electrode
From the bending original point, the probe area is separated from the substrate film and the cutting area by laser cutting, then the cutting area is cut off, the probe area is bent by 90 degrees by taking the bending original point as a bending point, and functional materials are deposited on the probe area in a dip-coating or brush-coating mode, so that the complete glucose electrode is manufactured.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: only one connecting line between each contact and the bending origin is provided.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: printing a carbon layer on the working electrode; the reference electrode is printed with a carbon layer and an Ag layer; the counter electrode is printed with a carbon layer and an insulating layer.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the number of the working electrodes is 1 or 2.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the number of the pairs of electrodes is 1 or 2.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the substrate film is made of PI or PET materials.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the thickness of the base film is 0 . 1-0.125mm。
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the printing is performed by microelectronic inkjet printing or microelectronic dispensing.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the flexible circuit is a copper wire.
The invention relates to a preparation method of an integrated glucose sensor of an integrated printed circuit board, which comprises the following steps: the functional material is glucose oxidase and a biocompatible outer membrane, and the glucose oxidase and the biocompatible outer membrane are sequentially deposited on the probe region.
The integrated glucose sensor of the integrated printed circuit board is prepared by manufacturing a flexible circuit and a probe on one component. Therefore, the design and the manufacturing process of the base are directly omitted, so that the manufacturing flow of the whole sensor is fewer, the manufacturing cost of the wearable device is greatly reduced, the thickness of the wearable device is further reduced, and the thinness and thinness of the wearable device are ensured.
Drawings
FIG. 1 is a schematic top-down view of an integrated PCBA integrated glucose sensor;
FIG. 2 is a schematic top-down view of another integrated PCBA integrated glucose sensor;
FIG. 3 is a perspective view of an integrated PCBA with a 90 degree bend of the integrated glucose sensor probe;
FIG. 4 is a schematic perspective view of an assembly of an integrated glucose sensor and a lower housing of a wearable device;
fig. 5 is a schematic perspective view of the integrated glucose sensor assembled with the lower housing of the wearable device.
In fig. 1 to 5; reference numeral 1 is a base film; reference numeral 2 is a probe region; reference numeral 3 is a lower case; reference numeral 4 is a connection region; reference numeral 5 is a cutting area; reference numeral 6 is a contact; reference numeral 7 is a bending origin; reference numeral 8 is a chip; reference numeral 9 denotes a flexible circuit.
Detailed Description
The following describes in detail the manner of manufacturing the integrated glucose sensor with reference to the drawings.
Example 1
The preparation method of the integrated glucose sensor of the integrated printed circuit board comprises the following steps:
first, the probe area and the flexible circuit are manufactured on the same substrate film
As shown in fig. 1, a symmetrical area is drawn on the flexible base film 1, and the area includes: the connecting area 4 and the cutting area 5 are connected, a bending origin 7 is taken at the sharp point of the boundary between the connecting area 4 and the cutting area 5, a strip-shaped area is drawn by taking the bending origin 7 as a starting point to serve as a probe area 2, the probe area 2 penetrates through the cutting area 5 to extend into the base film 1, three flexible circuits 9 are respectively printed on the front surface and the back surface of the base film 1 which are close to the connecting area 4, a chip 8 is attached to the three flexible circuits 9, six contacts 6 are arranged at the end points of the three flexible circuits 9 and are close to the connecting area 4, the base film is made of PI or PET material, the thickness of the base film is 0.1-0.125mm, and the flexible circuits 9 are copper wires;
(II) connecting the probe region and the flexible circuit together on the base film
Printing a working electrode on the connecting line of the bending origin 7 of the probe region 2 and one of the contacts 6 on the front surface of the base film 1; printing a reference electrode on the connecting line of the bending origin 7 of the probe region 2 and the other contact 6 on the front surface of the base film 1; on the front side of the base film 1; printing a counter electrode on the connection line between the bending origin 7 of the probe region 2 and the other contact 6; an insulating layer is printed among the working electrode, the reference electrode and the counter electrode which are overlapped on the probe area 2, the connecting lines of the bending origin 7 and any contact 6 are all arranged in the connecting area 4 or the substrate film 1, only one connecting line between each contact 6 and the bending origin 7 exists, and the working electrode is printed with a carbon layer; printing a carbon layer and an Ag layer on the reference electrode; in fig. 1, the number of working electrodes and counter electrodes can be 2, more than 3 electrodes can be arranged on the back surface of the base film 1, and the number of the electrodes, the number of the contacts and the arrangement thereof are designed by those skilled in the art;
(III) cleavage of the probe into a glucose electrode
From the bending origin 7, the probe region 2 is separated from the substrate film 1 and the cutting region 5 by laser cutting, then the cutting region 5 is cut off, the probe region 2 is bent by 90 degrees by taking the bending origin 7 as a bending point, and the probe region 2 is sequentially deposited with glucose oxidase and a biocompatible outer film on the probe region 2 by dip-coating or brush-coating, so that a complete glucose electrode is manufactured.
Printing is by microelectronic inkjet printing or microelectronic dispensing.
As shown in fig. 3 to 5, the electric sensor shown in fig. 1 is sleeved on the lower shell 3, the probe region 2 passes through the lower shell 3, and then an upper cover (not shown in the drawings) is arranged on the lower shell 3, so that the wearable device is manufactured.
Example 2
The preparation method of the integrated glucose sensor of the integrated printed circuit board comprises the following steps:
first, the probe area and the flexible circuit are manufactured on the same substrate film
As shown in fig. 2, a region is drawn on the flexible base film 1, and the region includes: the connecting area 4 and the cutting area 5 are connected, a bending origin 7 is taken on the boundary between the connecting area 4 and the cutting area 5, a strip-shaped area is drawn by taking the bending origin 7 as a starting point to serve as a probe area 2, the probe area 2 penetrates through the cutting area 5 and stretches into the base film 1, five flexible circuits 9 are respectively printed on the front surface of the base film 1 close to the connecting area 4, a chip 8 is attached to the five flexible circuits 9, the end points of the five flexible circuits 9 are five contacts 6 which are close to the connecting area 4, the base film is made of PI or PET material, the thickness of the base film is 0.1-0.125mm, and the flexible circuits 9 are copper wires;
(II) connecting the probe region and the flexible circuit together on the base film
Printing a working electrode on the connecting line of the bending origin 7 of the probe region 2 and two contacts 6 on the front surface of the base film 1; printing a reference electrode on the connecting line of the bending origin 7 of the probe region 2 and the other contact 6 on the front surface of the base film 1; on the front side of the base film 1; printing a counter electrode on a connecting line of a bending origin 7 of the probe region 2 and the other two contacts 6; an insulating layer is printed among the working electrode, the reference electrode and the counter electrode which are overlapped on the probe area 2, the connecting lines of the bending origin 7 and any contact 6 are all arranged in the connecting area 4 or the substrate film 1, and only one or no connecting line of each contact 6 and the bending origin 7 exists, so that the working electrode is printed with a carbon layer; printing a carbon layer and an Ag layer on the reference electrode; printing a carbon layer and an insulating layer on the electrode;
(III) cleavage of the probe into a glucose electrode
From the bending origin 7, the probe region 2 is separated from the base film 1 and the cutting region 5 by laser cutting, then the cutting region 5 is cut off, the probe region 2 is bent by 90 degrees by taking the bending origin 7 as a bending point, and the probe region 2 is sequentially deposited with glucose oxidase and a biocompatible outer film on the probe region 2 by a dip-coating or brush-coating mode, so that a complete glucose electrode is manufactured.
Printing is by microelectronic inkjet printing or microelectronic dispensing.
The electric sensor shown in fig. 2 is sleeved on the corresponding lower shell 3, the probe area 2 passes through the lower shell 3, and then an upper cover (not shown in the figure) is arranged on the lower shell 3, so that the wearable device is manufactured.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explanation of the principles of the present invention and are in no way limiting of the invention. Accordingly, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention should be included in the scope of the present invention. Furthermore, the appended claims are intended to cover all such changes and modifications that fall within the scope and boundary of the appended claims, or equivalents of such scope and boundary.
Claims (10)
1. A preparation method of an integrated glucose sensor of an integrated printed circuit board is characterized by comprising the following steps:
first, the probe area and the flexible circuit are manufactured on the same substrate film
Drawing a region on the flexible base film (1), said region comprising: a connecting area (4) and a cutting area (5) which are connected, a bending origin (7) is taken on the boundary of the connecting area (4) and the cutting area (5), a strip-shaped area is drawn by taking the bending origin (7) as a probe area (2), the probe area (2) penetrates through the cutting area (5) and stretches into a base film (1), at least three flexible circuits (9) are respectively printed on the front surface or/and the back surface of the base film (1) which is close to the connecting area (4), at least one chip (8) is attached on the at least three flexible circuits (9), and the endpoints of the at least three flexible circuits (9) are contacts (6) which are close to the connecting area (4);
(II) connecting the probe region and the flexible circuit together on the base film
Printing a working electrode on the front and/or back of the base film (1) on the connection line of the bending origin (7) of the probe region (2) and at least one contact (6) in the bending origin; printing a reference electrode on the front and/or back of the substrate film (1) on the connecting line of the bending origin (7) of the probe region (2) and the other contact (6); on the front and/or back side of the base film (1); printing a counter electrode on a connection line between a bending origin (7) of the probe region (2) and at least one other contact (6); an insulating layer is printed among the working electrode, the reference electrode and the counter electrode which are overlapped on the probe area (2), and the connecting line of the bending origin (7) and any contact (6) is arranged in the connecting area (4) or the substrate film (1);
(III) cleavage of the probe into a glucose electrode
From a bending origin (7), separating the probe region (2) from the substrate film (1) and the cutting region (5) by laser cutting, cutting off the cutting region (5), bending the probe region (2) by 90 degrees by taking the bending origin (7) as a bending point, and depositing functional materials on the probe region (2) by dip-coating or brush-coating to prepare the complete glucose electrode.
2. The method for manufacturing an integrated glucose sensor of an integrated printed circuit board as set forth in claim 1, wherein: only one connecting line between each contact (6) and the bending origin (7) is provided.
3. The method for manufacturing an integrated glucose sensor of an integrated printed circuit board as set forth in claim 2, wherein: printing a carbon layer on the working electrode; the reference electrode is printed with a carbon layer and an Ag layer; the counter electrode is printed with a carbon layer and an insulating layer.
4. A method of manufacturing an integrated printed circuit board integrated glucose sensor as in claim 3, wherein: the number of the working electrodes is 1 or 2.
5. A method of manufacturing an integrated printed circuit board integrated glucose sensor as in claim 3, wherein: the number of the pairs of electrodes is 1 or 2.
6. A method of manufacturing an integrated printed circuit board integrated glucose sensor as in claim 4 or 5, wherein: the substrate film is made of PI or PET materials.
7. The method for manufacturing an integrated glucose sensor integrated with a printed circuit board as claimed in claim 6, wherein ： The thickness of the base film is 0 . 1-0.125mm。
8. The method for manufacturing an integrated glucose sensor of an integrated printed circuit board as set forth in claim 7, wherein: the printing is performed by microelectronic inkjet printing or microelectronic dispensing.
9. The method for manufacturing the integrated glucose sensor of the integrated printed circuit board as claimed in claim 8, wherein: the flexible circuit (9) is a copper wire.
10. The method for manufacturing an integrated glucose sensor of an integrated printed circuit board as set forth in claim 9, wherein: the functional material is glucose oxidase and a biocompatible outer membrane, and the glucose oxidase and the biocompatible outer membrane are sequentially deposited on the probe region (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311388329.5A CN117434127A (en) | 2023-10-25 | 2023-10-25 | Preparation method of integrated glucose sensor of integrated printed circuit board |
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| CN202311388329.5A CN117434127A (en) | 2023-10-25 | 2023-10-25 | Preparation method of integrated glucose sensor of integrated printed circuit board |
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