CN117428674A - CMP equipment and wafer processing method - Google Patents

CMP equipment and wafer processing method Download PDF

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Publication number
CN117428674A
CN117428674A CN202311608667.5A CN202311608667A CN117428674A CN 117428674 A CN117428674 A CN 117428674A CN 202311608667 A CN202311608667 A CN 202311608667A CN 117428674 A CN117428674 A CN 117428674A
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CN
China
Prior art keywords
cleaning
wafer
grinding
preset direction
cmp apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311608667.5A
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Chinese (zh)
Inventor
王嘉浩
沈凌寒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gmc Semitech Co ltd
Original Assignee
Gmc Semitech Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gmc Semitech Co ltd filed Critical Gmc Semitech Co ltd
Priority to CN202311608667.5A priority Critical patent/CN117428674A/en
Publication of CN117428674A publication Critical patent/CN117428674A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a CMP apparatus and a wafer processing method. The CMP apparatus includes: a feeding device for providing a wafer; the grinding device is used for grinding the wafer; the cleaning device comprises an input carrier and a first cleaning unit, wherein the first cleaning unit comprises at least two first cleaning mechanisms for cleaning wafers, and the input carrier and each first cleaning mechanism are arranged at intervals along a first preset direction; the first conveying device is used for receiving the wafer provided by the feeding device and transferring the received wafer between the grinding device and the input carrier; and the second conveying device is used for grabbing the wafer input on the carrier and conveying the wafer along the first preset direction so as to convey the wafer to each first cleaning mechanism.

Description

CMP equipment and wafer processing method
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to CMP equipment and a wafer processing method.
Background
CMP apparatus (i.e., chemical mechanical polishing apparatus) are commonly used to fabricate high density integrated circuits to planarize or polish a layer of material deposited on a substrate. And the CMP equipment transfers the wafer to a polishing area for polishing, transfers the wafer to a cleaning area for cleaning after polishing, and transfers the wafer out of the equipment after cleaning.
In actual production, different cleaning processes are required to be formulated according to different wafer types, polishing processes or product requirements. However, the CMP apparatus of the prior art cannot meet the needs of various cleaning processes.
Disclosure of Invention
Accordingly, it is desirable to provide a CMP apparatus and a wafer processing method that improve the above-mentioned drawbacks, in order to solve the problem that the CMP apparatus in the prior art cannot meet various cleaning processes.
A CMP apparatus, comprising:
a feeding device for providing a wafer;
the grinding device is used for grinding the wafer;
the cleaning device comprises an input carrier and a first cleaning unit, wherein the first cleaning unit comprises at least two first cleaning mechanisms for cleaning wafers, and the input carrier and each first cleaning mechanism are distributed at intervals along a first preset direction;
a first conveying device for receiving the wafer provided by the feeding device and transferring the received wafer between the grinding device and the input carrier; a kind of electronic device with high-pressure air-conditioning system
And the second conveying device is used for grabbing the wafer on the input carrier and conveying the wafer along the first preset direction so as to convey the wafer to each first cleaning mechanism.
In one embodiment, each of the first cleaning mechanisms is the megasonic cleaning mechanism.
In one embodiment, the cleaning device further comprises a second cleaning unit, the second cleaning unit comprises a second cleaning mechanism for cleaning the wafer, and the second cleaning mechanism and each first cleaning mechanism are arranged along the first preset direction, so that the second conveying device can convey the wafer to each first cleaning mechanism and each second cleaning mechanism.
In one embodiment, the second cleaning mechanism is a roller brush cleaning mechanism.
In one embodiment, the number of the second cleaning mechanisms is at least two, and each second cleaning mechanism is arranged along the first preset direction.
In one embodiment, the feeding device and the grinding device are arranged at intervals along the first preset direction, and the cleaning device is positioned between the feeding device and the grinding device;
the second cleaning unit is located on one side of the first cleaning unit facing the feeding device, the cleaning device further comprises an output carrier arranged on one side of the second cleaning unit facing the feeding device, the output carrier is used for receiving the wafers transferred by the second conveying device, and the feeding device is further used for grabbing and transferring the wafers on the output carrier.
In one embodiment, the number of the first cleaning mechanisms is three, the number of the second cleaning mechanisms is two, the two second cleaning mechanisms are located at one side, away from the grinding device, of the three first cleaning mechanisms, and the input carrier is located between any two adjacent first cleaning mechanisms.
In one embodiment, the cleaning apparatus further comprises a drying mechanism disposed between the output stage and the second cleaning unit for drying the wafer transferred by the second conveyor.
In one embodiment, the feeding device and the grinding device are arranged at intervals along the first preset direction X, the CMP apparatus further comprises a maintenance area, the cleaning device, the first conveying device and the maintenance area are all located between the feeding device and the grinding device, and the cleaning device, the first conveying device and the maintenance area are sequentially arranged along a second preset direction perpendicular to the first preset direction.
A wafer processing method using the CMP apparatus as recited in any of the above embodiments, comprising the steps of:
the feeding device provides a wafer to be processed;
the first conveying device receives the wafer provided by the feeding device and transfers the received wafer to the grinding device;
the grinding device carries out grinding processing on the transferred wafer;
the first conveying device transfers the wafer on the grinding device to the input carrier;
the second conveying device grabs the wafer on the input carrier and conveys the wafer to at least one first cleaning mechanism along the first preset direction for cleaning.
The CMP equipment and the wafer processing method are characterized in that in the actual use process: the feeding device provides a wafer to be subjected to grinding processing. The first conveyor receives the wafer supplied by the supply device and transfers the wafer to the grinding device. The grinding device performs grinding processing on the wafer. After the grinding process is completed, the first conveying device transfers the wafer on the grinding device to the input carrier. The second conveying device grabs the wafer input on the carrier and conveys the wafer along a first preset direction so as to sequentially convey the wafer to each or part of the first cleaning mechanisms for cleaning.
Thus, the CMP equipment in the application is provided with at least two first cleaning mechanisms, namely at least two first cleaning mechanisms are integrally arranged inside the CMP equipment, and one, two or more cleaning processes can be carried out on a wafer, so that two or more different cleaning processes can be formulated, the requirements of various cleaning processes due to different wafer types, polishing processes or product requirements can be better met, the need of using multiple equipment for processing when the processing requirements of the multiple cleaning processes are avoided, the production capacity and the production efficiency of the CMP equipment are improved, and the working space is saved.
Drawings
FIG. 1 is a schematic view showing a structure of a CMP apparatus according to an embodiment of the present invention;
FIG. 2 is a flow chart illustrating steps of a wafer processing method according to an embodiment of the invention.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1, an embodiment of the present invention provides a CMP apparatus, which includes a feeding device 10, a grinding device 20, a cleaning device 30, a first conveying device 40, and a second conveying device 50.
The supply device 10 is used for supplying wafers to be ground. The cleaning device 30 includes an input stage 32 and a first cleaning unit 31. The first cleaning unit 31 includes at least two first cleaning mechanisms 310 for cleaning wafers. The input stage 32 and the respective first cleaning mechanisms 310 are arranged at intervals along the first preset direction X. The first conveyor 40 is used to receive the wafer provided by the feeder 10 and transfer the received wafer between the grinding device 20 and the input carrier 32. The grinding device 20 receives the wafer transferred by the first transfer device 40 and performs grinding processing on the wafer. The second conveying device 50 is used for grabbing the wafer on the input stage 32 and conveying the wafer along the first preset direction X to convey the wafer to each first cleaning mechanism 310.
The CMP equipment is characterized in that in the actual use process: the supply device 10 supplies a wafer to be subjected to grinding processing. The first conveyor 40 receives the wafer supplied from the supply device 10 and transfers the wafer to the grinding device 20. The grinding device 20 performs grinding processing on the wafer. After the grinding process is completed, the first conveyor 40 transfers the wafer on the grinding device 20 to the input stage 32. The second conveying device 50 grabs the wafer on the input stage 32 and conveys the wafer along the first preset direction X, so as to sequentially convey the wafer to each or a part of the first cleaning mechanisms 310 for cleaning.
Thus, the CMP apparatus in the present application, due to the provision of at least two first cleaning mechanisms 310, that is, at least two first cleaning mechanisms 310 are integrally disposed inside the CMP apparatus, and one, two or more cleaning processes can be performed on the wafer, so that two or more different cleaning processes can be formulated, thereby better meeting the requirements of multiple cleaning processes due to different wafer types, polishing processes or product requirements, avoiding the need of using multiple apparatuses for processing when the processing requirements of multiple cleaning processes are met, being beneficial to improving the productivity and the production efficiency of the CMP apparatus, and saving the working space.
Optionally, each first cleaning mechanism 310 is a megasonic cleaning mechanism. Therefore, megasonic cleaning does not generate strong cavitation effect, and damage to the surface of the wafer and pollutant residues in the cleaning process can be avoided. The megasonic cleaning efficiency is high, the time is short, the concentration of the used cleaning agent is low, and the consumption of chemical reagents is low, so that the damage level to the environment is low.
In the embodiment of the present application, the first conveying device 40 includes a conveying mechanism 41 and a carrying mechanism 42. The transfer means 41 are arranged close to the feeding means 10 and the handling means 42 are arranged close to the grinding device 20. The transfer mechanism 41 is configured to receive a wafer supplied from the supply device 10 at the supply device 10 and to transfer the wafer to the transfer mechanism 42. The carrying mechanism 42 is used to grasp the wafer on the transfer mechanism 41 and transfer the wafer to the grinding device 20. After the grinding process is completed on the wafer on the grinding device 20, the handling mechanism 42 is further used to grasp the wafer on the grinding device 20 and transfer the wafer to the input carrier 32. Alternatively, the transfer mechanism 41 may employ a belt conveyor. The handling mechanism 42 may be a robot.
In the embodiment of the present application, the cleaning apparatus 30 further includes a second cleaning unit 33, and the second cleaning unit 33 includes a second cleaning mechanism 330 for cleaning the wafer. The second cleaning mechanism 330 and each of the first cleaning mechanisms 310 are disposed along a first predetermined direction X so that the second conveying device 50 can convey the wafer to each of the first cleaning mechanism 310 and the second cleaning mechanism 330 when conveying the wafer along the first predetermined direction X. In this way, the second conveying device 50 firstly conveys the wafer to part or all of the first cleaning mechanisms 310 for cleaning, and then conveys the wafer to the second cleaning mechanism 330 for cleaning again, so as to improve the cleaning effect on the wafer.
Preferably, the second cleaning mechanism 330 is a roller brush cleaning mechanism. In this way, after the second conveying device 50 transfers the wafer to part or all of the first cleaning mechanisms 310 for megasonic cleaning, the wafer is transferred to the second cleaning mechanisms 330 for rolling brush cleaning, so as to ensure thorough cleaning of the wafer and improve the cleaning effect of the wafer.
In particular, in the embodiment, the number of the second cleaning mechanisms 330 is at least two, and each second cleaning mechanism 330 is disposed along the first preset direction X, so that the second conveying device 50 can convey the wafer to each second cleaning mechanism 330. In this way, in practice, the second conveying device 50 can convey the wafer to a part or all of the second cleaning mechanisms 330 as required, so as to selectively perform at least one rolling brush cleaning process on the wafer.
In the embodiment of the present application, the feeding device 10 and the grinding device 20 are arranged at intervals along the first preset direction X, and the cleaning device 30 is located between the feeding device 10 and the grinding device 20. The second washing unit 33 is located on the side of the first washing unit 31 facing the feeding means 10. The cleaning device 30 further comprises an output stage 34 arranged on the side of the second cleaning unit 33 facing the feeding means 10. The output carrier 34 is used for receiving the wafers transferred by the second conveyor 50, and the supply device 10 is also used for grabbing and transferring the wafers on the output carrier 34. In this way, the second conveying device 50 grabs the wafer on the input carrier 32 and conveys the wafer along the first preset direction X, so that the wafer sequentially reaches part or all of the first cleaning mechanisms 310 for cleaning, then sequentially reaches part or all of the second cleaning mechanisms 330 for cleaning, and finally the second conveying device 50 places the wafer on the output carrier 34. The feeder device 10 then grabs and transfers the wafer on the output carrier 34, thereby effecting the blanking of the wafer.
It should be noted that, each of the first cleaning mechanisms 310 and each of the second cleaning mechanisms 330 are disposed between the feeding device 10 and the grinding device 20 and disposed along the first preset direction X, even if the number of the first cleaning mechanisms 310 is increased, the space between the feeding device 10 and the grinding device 20 is fully utilized, the space occupied by the whole apparatus is not increased, and the modular design and the compact structure are maximally achieved.
In particular, in the embodiment shown in fig. 1, the number of first cleaning mechanisms 310 is three and the number of second cleaning mechanisms 330 is two. Two second cleaning mechanisms 330 are located on the side of the three first cleaning mechanisms 310 facing away from the grinding apparatus 20. The input stage 32 is located between any adjacent two of the first cleaning mechanisms 310. The output carrier 34 is located on the side of the two second cleaning mechanisms 330 adjacent to the feeding means 10. That is, in the direction from the grinding device 20 to the feeding device 10, three first cleaning mechanisms 310, two second cleaning mechanisms 330, and the output stage 34 are sequentially arranged with the input stage 32 being located between any two first cleaning mechanisms 310.
In particular to the embodiment, the cleaning device 30 further comprises a drying mechanism 35 arranged between the output stage 34 and the second cleaning unit 33. The drying mechanism 35 is used for drying the wafer transferred by the second transfer device 50. In this way, under the conveying action of the second conveying device 50, the wafer is subjected to the cleaning by part or all of the first cleaning mechanism 310 and the cleaning by part or all of the second cleaning mechanism 330, then reaches the drying mechanism 35 to be dried, and after the drying is completed, is placed on the output stage 34.
In the embodiment, the second conveying device 50 includes a conveying track (not shown) and a gripping unit (not shown), and the conveying track extends lengthwise along the first preset direction X. The gripping unit is disposed on the conveying rail and movable along the conveying rail. The grabbing unit is used for grabbing the wafer on the input carrier 32 and moving along the conveying track, so as to transfer the grabbed wafer to each first cleaning mechanism 310 for cleaning, each second cleaning mechanism 330 for cleaning and each drying mechanism 35 for drying, and finally, the wafer is placed on the output carrier 34.
In the embodiment of the present application, the CMP apparatus further comprises a maintenance area 60, in which the feeding device 10 and the grinding device 20 are arranged at intervals along the first preset direction X. The cleaning device 30, the first conveyor device 40 and the service area 60 are all located between the feeding device 10 and the grinding device 20, and the cleaning device 30, the first conveyor device 40 and the service area 60 are arranged in sequence along the second preset direction Y. The second preset direction Y is perpendicular to the first preset direction X. In this manner, since each of the first cleaning mechanisms 310, each of the second cleaning mechanisms 330, the drying mechanisms 35, the input stage 32 and the output stage 34 are disposed along the first preset direction X, it is advantageous to increase the space of the maintenance area 60, thereby facilitating the subsequent maintenance of the feeding device 10, the first conveying device 40, the grinding device 20, the cleaning device 30 and the second conveying device 50.
The wafer transfer process in the CMP apparatus of the present application will be described with reference to fig. 1:
first, the transfer mechanism 41 receives a wafer to be ground supplied from the supply device 10 and moves from left to right near the conveyance mechanism 42 until the wafer is transferred to the conveyance mechanism 42.
Then, the carrying mechanism 42 grips the wafer on the transfer mechanism 41, and transfers the gripped wafer to the grinding device 20 on the left side.
Then, after the grinding device 20 grinds the wafer thereon, the carrying mechanism 42 grips the wafer on the grinding device 20 and transfers the gripped wafer onto the input stage 32.
Then, the second transporting device 50 grabs the wafer on the input stage 32 and transports the wafer leftwards or rightwards so that the wafer sequentially reaches a part or all of the first cleaning mechanism 310. When the second transporting device 50 transports the wafer to a certain first cleaning mechanism 310, the first cleaning mechanism 310 cleans the wafer.
Then, the second conveying device 50 conveys the wafer to the left and sequentially reaches each second cleaning mechanism 330, so that each second cleaning mechanism 330 cleans the wafer again.
Then, the second transporting device 50 transports the wafer leftward and reaches the drying mechanism 35, and the drying mechanism 35 dries the wafer.
Then, the second transporting device 50 transports the wafer leftward and reaches the output stage 34, and places the wafer on the output stage 34.
Finally, the feeder device 10 grabs and transfers the wafer on the output carrier 34, thereby achieving the blanking of the wafer.
Based on the above CMP apparatus, the present invention also provides a wafer processing method using the CMP apparatus described in any of the embodiments above. Referring to fig. 1 and 2, the wafer processing method includes the following steps:
s10, a feeding device 10 provides a wafer to be processed.
S20, the first conveying device 40 receives the wafer provided by the feeding device 10, and transfers the received wafer to the grinding device 20. Specifically, the transfer mechanism 41 receives the wafer supplied from the supply device 10, and transfers the wafer to the transfer mechanism 42. The carrying mechanism 42 grabs the wafer on the transfer mechanism 41 and transfers the grabbed wafer to the grinding device 20.
S30, the grinding device 20 performs grinding processing on the wafer transferred by the first transfer device 40.
S40, the first conveying device 40 transfers the wafer on the grinding device 20 to the input stage 32. Specifically, the handling mechanism 42 grips the wafer on the grinding device 20 and transfers the gripped wafer onto the input stage 32.
S50, the second conveying device 50 grabs the wafer on the input carrier 32 and conveys the wafer to at least one first cleaning mechanism 310 along the first preset direction X for cleaning.
Further, the step S50 further includes the following steps:
s60, the second conveying device 50 continues to convey the wafer to the at least one second cleaning mechanism 330 along the first preset direction X for cleaning.
S70, the second conveying device 50 continues to convey the wafer along the first preset direction X to the drying mechanism 35 for drying.
S80, the second conveying device 50 continues to convey the wafer to the output carrier 34 along the first preset direction X.
S90, the feeding device 10 transfers the wafer on the output stage 34 downstream.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. A CMP apparatus, comprising:
a supply device (10) for supplying wafers;
a grinding device (20) for grinding a wafer;
the cleaning device (30) comprises an input carrying table (32) and a first cleaning unit (31), wherein the first cleaning unit (31) comprises at least two first cleaning mechanisms (310) for cleaning wafers, and the input carrying table (32) and the first cleaning mechanisms (310) are arranged at intervals along a first preset direction (X);
a first transporting device (40) for receiving the wafer supplied from the supply device (10) and transferring the received wafer between the grinding device (20) and the input stage (32); a kind of electronic device with high-pressure air-conditioning system
And the second conveying device (50) is used for grabbing the wafer on the input carrier (32) and conveying the wafer along the first preset direction (X) so as to convey the wafer to each first cleaning mechanism (310).
2. The CMP apparatus of claim 1 wherein each of the first cleaning mechanisms (310) is a megasonic cleaning mechanism.
3. CMP apparatus according to claim 1, wherein the cleaning device (30) further comprises a second cleaning unit (33), the second cleaning unit (33) comprising a second cleaning mechanism (330) for cleaning the wafer, the second cleaning mechanism (330) and the respective first cleaning mechanism (310) being arranged along the first preset direction (X) to enable the second conveying device (50) to convey the wafer to the respective first cleaning mechanism (310) and second cleaning mechanism (330).
4. A CMP apparatus as claimed in claim 3, wherein the second cleaning mechanism (330) is a roll brush cleaning mechanism.
5. A CMP apparatus according to claim 3, wherein the number of second cleaning mechanisms (330) is at least two, each second cleaning mechanism (330) being arranged along the first preset direction (X).
6. A CMP apparatus as claimed in claim 3, wherein said feeding means (10) and said grinding means (20) are arranged at intervals along said first preset direction (X), said cleaning means (30) being located between said feeding means (10) and said grinding means (20);
the second cleaning unit (33) is located on one side of the first cleaning unit (31) facing the feeding device (10), the cleaning device (30) further comprises an output carrier (34) arranged on one side of the second cleaning unit (33) facing the feeding device (10), the output carrier (34) is used for receiving the wafers transferred by the second conveying device (50), and the feeding device (10) is further used for grabbing and transferring the wafers on the output carrier (34).
7. The CMP apparatus as set forth in claim 6, wherein the number of said first cleaning mechanisms (310) is three, the number of said second cleaning mechanisms (330) is two, two of said second cleaning mechanisms (330) are located at a side of three of said first cleaning mechanisms (310) facing away from said grinding device (20), and said input stage (32) is located between any adjacent two of said first cleaning mechanisms (310).
8. CMP apparatus according to claim 6, wherein the cleaning device (30) further comprises a drying mechanism (35) arranged between the output carrier (34) and the second cleaning unit (33), the drying mechanism (35) being adapted to dry the wafers transferred by the second conveying device (50).
9. CMP apparatus according to claim 1, wherein the feeding device (10) is arranged at a distance from the grinding device (20) along the first preset direction (X), the CMP apparatus further comprising a service area (60), wherein the cleaning device (30), the first conveying device (40) and the service area (60) are each located between the feeding device (10) and the grinding device (20), and wherein the cleaning device (30), the first conveying device (40) and the service area (60) are arranged sequentially along a second preset direction (Y) perpendicular to the first preset direction (X).
10. A wafer processing method using the CMP apparatus as claimed in any one of claims 1 to 9, comprising the steps of:
the feeding device (10) provides a wafer to be processed;
the first conveying device (40) receives the wafer provided by the feeding device (10) and transfers the received wafer to the grinding device (20);
the grinding device (20) carries out grinding processing on the transferred wafer;
the first conveying device (40) transfers the wafer on the grinding device (20) to the input carrier (32);
the second conveying device (50) grabs the wafer on the input carrier (32) and conveys the wafer to at least one first cleaning mechanism (310) along the first preset direction (X) for cleaning.
CN202311608667.5A 2023-11-28 2023-11-28 CMP equipment and wafer processing method Pending CN117428674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311608667.5A CN117428674A (en) 2023-11-28 2023-11-28 CMP equipment and wafer processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311608667.5A CN117428674A (en) 2023-11-28 2023-11-28 CMP equipment and wafer processing method

Publications (1)

Publication Number Publication Date
CN117428674A true CN117428674A (en) 2024-01-23

Family

ID=89553497

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311608667.5A Pending CN117428674A (en) 2023-11-28 2023-11-28 CMP equipment and wafer processing method

Country Status (1)

Country Link
CN (1) CN117428674A (en)

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