CN117425387A - High-reliability quick-temperature thermoelectric refrigerator and manufacturing method thereof - Google Patents
High-reliability quick-temperature thermoelectric refrigerator and manufacturing method thereof Download PDFInfo
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- CN117425387A CN117425387A CN202311129765.0A CN202311129765A CN117425387A CN 117425387 A CN117425387 A CN 117425387A CN 202311129765 A CN202311129765 A CN 202311129765A CN 117425387 A CN117425387 A CN 117425387A
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- copper sheet
- lower substrate
- substrate
- thermoelectric cooler
- diversion
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 144
- 229910052802 copper Inorganic materials 0.000 claims abstract description 143
- 239000010949 copper Substances 0.000 claims abstract description 143
- 238000005245 sintering Methods 0.000 claims abstract description 24
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 98
- 239000004065 semiconductor Substances 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 50
- 239000000919 ceramic Substances 0.000 claims description 37
- 238000003466 welding Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 7
- 239000011265 semifinished product Substances 0.000 claims description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- 230000008642 heat stress Effects 0.000 abstract 2
- 239000000047 product Substances 0.000 description 22
- 238000005476 soldering Methods 0.000 description 14
- 230000008646 thermal stress Effects 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- 230000004907 flux Effects 0.000 description 8
- 238000005057 refrigeration Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000003801 milling Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/82—Connection of interconnections
Abstract
The invention discloses a fast temperature-variable thermoelectric refrigerator with good reliability and a manufacturing method thereof, which overcome the problem that the thermoelectric refrigerator is easy to be thermally deformed and the reliability of the thermoelectric refrigerator is reduced in the prior art. The heat stress concentration area adopts the mode of gluing the diversion copper sheet, the area needing to ensure the product strength adopts the mode of sintering the copper sheet, and the heat stress concentration area and the copper sheet are combined to achieve the stable balance point of the product, so that the stability of the thermoelectric refrigerator is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a fast temperature-variable thermoelectric refrigerator with good reliability and a manufacturing method thereof.
Background
With the development of PCR and rapid PCR detection instruments in the medical industry, the demands of customers for product performance limits and reliability are increasing, which also brings about an increasingly stringent demand for high reliability of TEC (Thermal-electric refrigerator). Generally, the temperature change rate of the PCR is 3-4 ℃/S, however, the temperature change rate required by the rapid PCR can reach 7-8 ℃/S, and when the TEC is subjected to high-frequency reciprocating temperature change under the use requirement of the temperature change, the requirement of the TEC on thermal deformation resistance and welding effect is more tested.
The cooling principle of TEC is the peltier effect, which is well known. Figure 8 reflects the magnitude of thermal stress in various regions of the product when the TEC is in operation. On the one hand, in the temperature change circulation process, due to the influence of expansion caused by heat and contraction caused by cold, the difference of deformation trend caused by the difference of thermal expansion coefficients of the porcelain sheet and the diversion copper sheet in the substrate, and the difference of binding force between the porcelain sheet and the diversion copper sheet and binding force between the diversion copper sheet and the semiconductor particles, the semiconductor layer and the nickel layer of the semiconductor particles can be separated, so that the semiconductor particles are invalid, thereby reducing the TEC performance and affecting the TEC reliability; on the other hand, the reliability of TEC in operation is directly related to the cross-sectional area of semiconductor particles, the volatilization of soldering flux in solder in the welding process is not well removed, and air holes are formed between semiconductor particles and a diversion copper sheet. The effective contact surface between the semiconductor particles and the diversion copper sheet is reduced due to the air holes, the thermal resistance of the single semiconductor is increased, and the single semiconductor particles burn out and fail under the rapid temperature change condition, so that the TEC reliability is affected. The conventional solution is to replace the substrate (DBC substrate) made by sintering the copper sheet and the ceramic chip with the substrate bonded by glue to reduce the influence of thermal deformation, but with this solution there is still a risk of the separation of the copper sheet and the ceramic chip.
Disclosure of Invention
The invention aims to solve the problem that the reliability of a thermoelectric cooler is reduced due to the fact that the thermoelectric cooler is easy to be thermally deformed in the prior art, and provides a fast temperature thermoelectric cooler with good reliability and a manufacturing method thereof.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a good quick temperature of reliability becomes thermoelectric cooler, includes upper base plate and lower base plate, be equipped with the semiconductor particle between upper base plate and the lower base plate, upper base plate and lower base plate all include the potsherd and set up the water conservancy diversion copper sheet at the potsherd surface, the semiconductor particle welds on the water conservancy diversion copper sheet, the water conservancy diversion copper sheet includes the sintering water conservancy diversion copper sheet of sintering at the potsherd outer lane and glues the gluey gluing water conservancy diversion copper sheet of gluing fixing in the middle of the potsherd.
The outer ring of the ceramic plate is fixedly sintered by the copper sheet, so that the product structure is stable, and the middle part of the ceramic plate is fixedly adhered by the adhesive, so that the thermal stress is released. According to the invention, a ceramic piece adhesive diversion copper sheet is adopted in a region with concentrated thermal stress on the substrate, and a ceramic piece and copper sheet sintering mode is adopted in a region with required product strength on the substrate, so that the ceramic piece and the copper sheet are combined to achieve a stable balance point of the product, and the stability of the thermoelectric refrigerator is improved. Meanwhile, the outer ring ensures the structural strength of the product, the current trend of the inner ring and the distribution of semiconductor particles can be adjusted according to actual demands, the universality of the DBC substrate is improved to the greatest extent, and the die opening cost of the substrate is saved.
Preferably, the guide copper sheet is provided with a groove.
The welding device has the advantages that the grooves are formed in one face of the guide copper sheet welded with the semiconductor particles, so that no part is discharged due to contact extrusion of the semiconductor particles and the guide copper sheet after the soldering flux volatilizes, air holes are avoided, the semiconductor particles and the guide copper sheet are not completely and directly contacted, thermal stress generated by the semiconductor particles in the working process is reduced, the contact area between the semiconductor particles of the thermoelectric refrigerator and the guide copper sheet is reduced, heat transfer resistance is increased, and the risk of thermal short circuit is low.
Preferably, all the diversion copper sheets on the upper substrate and the diversion copper sheets glued on the lower substrate are vertically placed; the sintering guide copper sheets on the left side and the right side of the glued guide copper sheet on the lower substrate are vertically placed, and the sintering guide copper sheets on the upper side and the lower side of the glued guide copper sheet on the lower substrate are transversely placed.
The arrangement modes of the sintering diversion copper sheets on the upper substrate and the lower substrate are different, semiconductor particles are staggered, short circuit is prevented, and current circulation is realized. According to actual needs, the sintering guide copper sheets on the upper substrate and the gluing guide copper sheets are transversely placed, the gluing guide copper sheets on the lower substrate and the sintering guide copper sheets on the upper side and the lower side of the gluing guide copper sheets are transversely placed, and the sintering guide copper sheets on the left side and the right side of the gluing guide copper sheets are longitudinally placed.
Preferably, the sintered diversion copper sheets at the first angle and the second angle on the lower substrate are L-shaped.
Preferably, the ceramic sheet is an aluminum nitride ceramic.
The aluminum nitride ceramic forms the substrate made of aluminum nitride, and the ceramic plate is made of aluminum nitride ceramic, so that the heat stability and the heat transfer efficiency of the thermoelectric refrigerator are enhanced.
A method for manufacturing a fast temperature-variable thermoelectric refrigerator with good reliability comprises the following steps:
s1: sintering and fixing the sintered diversion copper sheet on the outer ring part of the ceramic sheet, and etching the sintered diversion copper sheet to obtain a DBC lower substrate;
s2: bonding the adhesive bonding guide copper sheet to a reserved middle blank area on the DBC lower substrate, and processing to obtain a semi-finished product high-reliability lower substrate;
s3: clamping and fixing the semi-finished high-reliability lower substrate, and processing grooves on the surfaces of the glued and sintered diversion copper sheets to obtain the lower substrate;
s4: and (3) manufacturing an upper substrate in the mode of step S1-S3, welding semiconductor particles on a diversion copper sheet of a lower substrate, covering the upper substrate, and then sending the upper substrate into heating equipment for welding to obtain the thermoelectric refrigerator.
The product outer ring ensures the structural strength of the product, the current trend of the inner ring and the distribution of semiconductor particles can be adjusted according to actual demands, the universality of the DBC substrate is improved to the greatest extent, and the die opening cost of the substrate is saved.
Preferably, the diversion copper sheet is sintered or cut into dumbbell shape in advance.
The contact area of the diversion copper sheet and the ceramic sheet is reduced, the thermal stress generated by semiconductor particles in operation is reduced, the thermal deformation of the diversion copper sheet is reduced, and the reliability of the thermoelectric refrigerator is improved; meanwhile, the middle part of the diversion copper sheet is favorable for discharging soldering paste during welding.
Preferably, the guide copper sheet is nickel-plated before welding.
The guide copper sheet comprises a guide copper sheet welded with the semiconductor particles and a guide copper sheet welded with the lead, and nickel plating treatment is performed in advance to improve the weldability of the guide copper sheet.
Preferably, the vacuum is applied while the semiconductor particles are soldered to the guide copper sheet of the lower substrate.
And in the welding process, volatile gas (mainly generated by soldering flux) is pumped out in a vacuumizing mode, so that no welding air holes are ensured, the welding effect is improved, and the reliability of the product is improved.
Preferably, the welding is carried out in a heating device, and the vacuum is drawn at the same time as the heating process. Vacuum is drawn during the heating process to rapidly draw out the volatilized flux gas in the solder.
Therefore, the invention has the following beneficial effects: the thermoelectric refrigerator adopts the mode of gluing the diversion copper sheet in the area with concentrated thermal stress, adopts the mode of sintering the copper sheet in the area with guaranteed product strength, combines the diversion copper sheet and the copper sheet to achieve a stable balance point of the product, and provides a release space for volatilized soldering flux to the maximum extent by carrying out special treatment on the appearance and the surface state of the diversion copper sheet, thereby preventing the generation of air holes and ensuring good reliability.
Drawings
Fig. 1 is a schematic diagram of an upper substrate structure in a first embodiment.
Fig. 2 is a schematic diagram of the structure of a lower substrate in the first embodiment.
Fig. 3 is a schematic diagram of a structure of a substrate guide copper sheet after milling in the first embodiment.
Fig. 4 is an enlarged schematic view of the milled guide copper sheet in the first embodiment.
FIG. 5 is a schematic view of a flow guiding copper sheet in a second embodiment.
Fig. 6 is a flow chart of steps of three thermoelectric cooler fabrication methods according to embodiments.
Fig. 7 is a schematic diagram of the structure of the thermoelectric cooler in the assembly process of the third embodiment.
Fig. 8 is a thermal stress diagram of the areas where the TEC operates.
In the figure: 1. sintering the diversion copper sheet; 2. glue bonding the diversion copper sheet; 3. a ceramic sheet; 4. a DBC lower substrate; 5. a semi-finished product high-reliability lower substrate; 6. an upper substrate; 7. a semiconductor particle; 8. a groove; 9. a lower substrate; 10. a first corner; 11. and a second angle.
Detailed Description
The present invention is further described in detail below with reference to the accompanying drawings and detailed description, wherein the flow guiding copper sheets are all conventional square:
embodiment one:
the embodiment provides a fast temperature-variable thermoelectric cooler with good reliability, which comprises an upper substrate 6 and a lower substrate 9, wherein semiconductor particles 7 are arranged between the upper substrate and the lower substrate, all the semiconductor particles are connected and fixed in a soldering manner, and volatile gas is pumped out in a vacuumizing manner in a soldering process at the same time, so that no soldering air holes are ensured, the soldering effect is improved, and the reliability of the thermoelectric cooler is improved.
As shown in fig. 1, the upper substrate comprises a ceramic plate 3 and a diversion copper sheet arranged on the surface of the ceramic plate, the semiconductor particles are welded on the diversion copper sheet, the diversion copper sheet on the outer ring of the ceramic plate is a sintered diversion copper sheet 1 which is sintered and fixed, the product structure is stable, and the diversion copper sheet in the middle of the ceramic plate is an adhesive diversion copper sheet 2 which is adhered and fixed by adhesive, and the thermal stress is released. The sintered guide copper sheet and the glued guide copper sheet are both longitudinally placed on the upper substrate.
As shown in fig. 2, the lower substrate comprises a ceramic plate 3 and a diversion copper sheet arranged on the surface of the ceramic plate, the semiconductor particles are welded on the diversion copper sheet, the diversion copper sheet on the outer ring of the ceramic plate is a sintered diversion copper sheet 1 which is sintered and fixed, the product structure is stable, and the diversion copper sheet in the middle of the ceramic plate is an adhesive diversion copper sheet 2 which is adhered and fixed by adhesive, and the thermal stress is released. The lower substrate is glued with the glued diversion copper sheet, the glued diversion copper sheets at the left side and the right side of the glued diversion copper sheet are both placed longitudinally, and the sintered diversion copper sheets at the upper side and the lower side of the glued diversion copper sheet are placed transversely. The sintered guide copper sheets at the first corner 10 and the second corner 11 on the lower substrate are L-shaped, and in this embodiment, the first corner is the lower left corner and the second corner is the lower right corner.
The arrangement modes of the sintering diversion copper sheets on the upper substrate and the lower substrate are different, semiconductor particles are staggered, short circuit is prevented, and current circulation is realized.
In the rapid temperature-rising thermoelectric refrigerator, the guide copper sheets on the outer ring of the ceramic sheet are sintered and fixed, so that the product structure is stable, and the guide copper sheets on the middle part of the ceramic sheet are adhered and fixed, so that the effect of releasing thermal stress is achieved. According to the invention, a ceramic piece adhesive diversion copper sheet is adopted in a region with concentrated thermal stress on the substrate, and a ceramic piece and copper sheet sintering mode is adopted in a region with required product strength on the substrate, so that the ceramic piece and the copper sheet are combined to achieve a stable balance point of the product, and the stability of the thermoelectric refrigerator is improved. Meanwhile, the structural strength of the product is guaranteed by the outer ring of the substrate, the current trend of the inner ring of the substrate and the distribution of semiconductor particles can be adjusted according to actual requirements, the universality of the DBC substrate (comprising the DBC upper substrate and the DBC lower substrate) is improved to the greatest extent, and the die opening cost of the upper substrate and the lower substrate is saved.
In this embodiment, the guiding copper sheet welded with the semiconductor particles participating in refrigeration and the guiding copper sheet welded with the wires are subjected to nickel plating treatment before welding, so as to improve weldability.
When the thermoelectric cooler is assembled, vacuum is pumped while the heating process is performed, so that the volatile soldering flux gas in the solder is rapidly pumped out.
In the embodiment, the ceramic plate is aluminum nitride ceramic, so that the thermal stability and the heat transfer efficiency of the thermoelectric refrigerator are enhanced.
The embodiment has the following beneficial effects:
(1) The rapid temperature-rise thermoelectric refrigerator in the embodiment can simultaneously take the characteristics of any external dimension, high reliability and the like into consideration;
(2) The outer ring of the rapid temperature-rise thermoelectric refrigerator guarantees the structural strength of the product, the current trend of the inner ring and the distribution of semiconductor particles can be adjusted according to actual requirements, the universality of the DBC substrate is improved to the greatest extent, and the die opening cost of the substrate is saved;
(3) The rapid temperature-rise thermoelectric refrigerator in the embodiment is provided with the groove on the diversion copper sheet, the middle area of the semiconductor particles is not in direct contact with the diversion sheet, and the thermal stress generated by the semiconductor particles in operation can be reduced;
(4) The contact area between the semiconductor particles of the rapid temperature-rise thermoelectric cooler and the diversion copper sheet is reduced, the heat transfer resistance is increased, and the risk of thermal short circuit is low.
Embodiment two:
in the first embodiment, on the basis of the first embodiment, a groove 8 is formed in a diversion copper sheet welded with semiconductor particles participating in refrigeration, and as shown in fig. 3 and 4, the groove is set and placed in a milling mode. Through set up the recess on the water conservancy diversion copper sheet, solve on the one hand that the scaling powder volatilizees back and extrude no department because of semiconductor particle and water conservancy diversion copper sheet contact, avoid the gas pocket, on the other hand can make semiconductor particle and water conservancy diversion copper sheet incomplete direct contact, reduce the thermal stress that semiconductor particle produced in the course of the work, and thermoelectric cooler semiconductor particle and water conservancy diversion copper sheet area of contact reduces, and the thermal resistance increases, and thermal short circuit risk is low.
In the embodiment, the flow guiding copper sheet welded with the semiconductor particles participating in refrigeration is dumbbell-shaped, as shown in fig. 5, the contact area of the flow guiding copper sheet, the ceramic sheet and the semiconductor particles is reduced, the thermal deformation of the flow guiding copper sheet is reduced, the thermal stress generated by the semiconductor particles in the working process is reduced, and the reliability of the thermoelectric refrigerator is improved; meanwhile, the middle part of the dumbbell-shaped diversion copper sheet is favorable for discharging soldering paste during welding.
Embodiment III:
the embodiment also provides a method for manufacturing the rapid temperature-variable thermoelectric refrigerator with good reliability, as shown in fig. 6, which comprises the following steps: the method comprises the steps of firstly, sintering and fixing a sintered diversion copper sheet on an outer ring part of a ceramic sheet, and etching the sintered diversion copper sheet to obtain a DBC lower substrate; secondly, adhering the adhesive diversion copper sheet to a reserved middle blank area on the DBC lower substrate, and processing to obtain a semi-finished product high-reliability lower substrate; thirdly, clamping and fixing the semi-finished high-reliability lower substrate, and processing grooves on the surfaces of the glued diversion copper sheet and the sintered diversion copper sheet to obtain the lower substrate; and fourthly, manufacturing an upper substrate in the mode from the first step to the third step, welding the semiconductor particles on the diversion copper sheet of the lower substrate, covering the upper substrate, and then sending the upper substrate into heating equipment for welding to obtain the thermoelectric refrigerator.
Meanwhile, the diversion copper sheet welded with the semiconductor particles participating in refrigeration is sintered or cut into dumbbell shape in advance, as shown in fig. 5, the contact area of the diversion copper sheet and the ceramic sheet is reduced, the thermal deformation of the diversion copper sheet is reduced, and the reliability of the thermoelectric refrigerator is improved. And vacuum-pumping is performed while the semiconductor particles are welded on the guide copper sheet of the lower substrate.
In this embodiment, the guiding copper sheet welded with the semiconductor particles participating in refrigeration and the guiding copper sheet welded with the wires are both nickel-plated in advance before welding, so as to improve weldability.
When the thermoelectric cooler is assembled, vacuum is pumped while the heating process is performed, so that the volatile soldering flux gas in the solder is rapidly pumped out.
The manufacturing process of the upper substrate and the lower substrate is consistent, and the specific process is as follows:
the guide vane is generally copper-based, and whether nickel is lined or not is selected to be plated with gold according to the requirement, and the guide vane copper sheet (other materials can be adopted in other embodiments) is adopted in the embodiment.
As shown in fig. 7:
(1) The sintered diversion copper sheet 1 is connected with the outer ring part of the ceramic sheet through AMB (active brazing process) or DBC (copper foil sintering copper-clad) technology, then etched according to the requirement to form a sintered diversion copper sheet with a customized shape, and then cleaned to obtain a DBC lower substrate 4, as shown in step 1 in fig. 7.
(2) Printing a layer of glue on the reserved middle blank area of the DBC lower substrate, particularly paying attention to the fact that the printed pattern is consistent with the position of a preset diversion copper sheet in the process of designing the substrate, controlling the glue amount, avoiding excessive thermal resistance of the product and reducing heat loss. And (3) attaching the cleaned adhesive diversion copper sheet 2 to the middle blank area of the DBC lower substrate, and performing high-temperature curing and surface oxidation prevention treatment to obtain a semi-finished product high-reliability lower substrate 5, as shown in step 2 in fig. 7.
(3) And clamping and fixing the manufactured semi-finished product high-reliability lower substrate, milling the surface of the glued diversion copper sheet and the sintered diversion copper sheet to form a groove shown in fig. 4, and manufacturing the lower substrate 9 of the high-reliability finished product, wherein the step 3 is shown in fig. 7.
(4) The upper substrate of the high reliability finished product is manufactured in the manner of (1) - (3), a layer of solder paste is printed on the upper substrate and the lower substrate respectively before assembly, and then the semiconductor particles are placed at the corresponding positions of the lower substrate, as shown in step 4 in fig. 7.
(5) Covering the upper substrate, clamping and fixing the thermoelectric refrigerator by using a special jig, and feeding the thermoelectric refrigerator into heating equipment. Particularly, in the heating process, vacuum is required to be pumped out to quickly pump out the volatilized soldering flux gas in the solder, so as to complete the soldering process and realize the connection between the substrate and the semiconductor component. The welded product is then cooled and cleaned, and the thermoelectric cooler in this embodiment is completed, as shown in step 5 of fig. 7.
The above-described embodiment is only a preferred embodiment of the present invention, and is not limited in any way, and other variations and modifications may be made without departing from the technical aspects set forth in the claims.
Claims (10)
1. The utility model provides a good quick warm thermoelectric cooler of reliability, its characterized in that includes upper base plate (6) and lower base plate (9), be equipped with semiconductor particle (7) between upper base plate (6) and the lower base plate, upper base plate (6) and lower base plate all include potsherd (3) and set up the water conservancy diversion copper sheet at the potsherd surface, semiconductor particle (7) welding is on the water conservancy diversion copper sheet, the water conservancy diversion copper sheet is including sintering fixed sintering water conservancy diversion copper sheet (1) at the potsherd outer lane and gluing glue joint fixes gluing water conservancy diversion copper sheet (2) in the middle of the potsherd.
2. A fast temperature-rising thermoelectric cooler with good reliability according to claim 1, characterized in that the guiding copper sheet is provided with grooves (8).
3. A fast temperature thermoelectric cooler with good reliability according to claim 1 or 2, characterized in that all the guiding copper sheets on the upper substrate (6) and the guiding copper sheets (2) glued on the lower substrate (9) are placed vertically; the sintering guide copper sheets (1) on the left side and the right side of the lower substrate (9) are vertically arranged, and the sintering guide copper sheets (1) on the upper side and the lower side of the lower substrate (9) are transversely arranged.
4. A fast temperature-rising thermoelectric cooler with good reliability according to claim 3, characterized in that the sintered guiding copper sheets (1) of the first angle (10) and the second angle (11) on the lower base plate (9) are L-shaped.
5. A reliable rapid temperature thermoelectric cooler according to claim 1 or 2, characterized in that the ceramic plate (3) is an aluminum nitride ceramic.
6. A method for manufacturing a fast temperature thermoelectric refrigerator with good reliability, applied to the fast temperature thermoelectric refrigerator with good reliability according to any one of claims 1 to 5, characterized by comprising the following steps:
s1: sintering and fixing the sintered diversion copper sheet (1) on the outer ring part of the ceramic sheet (3), and etching the sintered diversion copper sheet (1) to obtain a DBC lower substrate (4);
s2: bonding the adhesive diversion copper sheet (2) on a reserved middle blank area on the DBC lower substrate (4) and processing to obtain a semi-finished product high-reliability lower substrate (5);
s3: clamping and fixing a semi-finished product high-reliability lower substrate (5), and processing grooves (8) on the surfaces of the adhesive bonding diversion copper sheet (2) and the sintering diversion copper sheet (1) to obtain a lower substrate (9);
s4: and (3) manufacturing an upper substrate (6) in the mode of step S1-S3, welding semiconductor particles (7) on a diversion copper sheet of a lower substrate (9), covering the upper substrate (6), and then sending the upper substrate into heating equipment for welding to obtain the thermoelectric cooler.
7. The reliable rapid thermal thermoelectric cooler of claim 6 wherein said deflector sheet is pre-sintered or cut into dumbbell shapes.
8. A reliable rapid temperature change thermoelectric cooler according to claim 6 wherein said deflector copper sheet is pre-nickel plated prior to welding.
9. A reliable rapid thermal thermoelectric cooler according to claim 6 or 7 or 8, characterized in that the vacuum is drawn while the semiconductor particles (7) are soldered to the guiding copper sheet of the lower substrate (9).
10. A reliable rapid thermal thermoelectric cooler according to claim 6 or 7 or 8, characterized in that said feeding into the heating device is welded and the evacuation is performed simultaneously with the heating process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311129765.0A CN117425387A (en) | 2023-09-04 | 2023-09-04 | High-reliability quick-temperature thermoelectric refrigerator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311129765.0A CN117425387A (en) | 2023-09-04 | 2023-09-04 | High-reliability quick-temperature thermoelectric refrigerator and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117425387A true CN117425387A (en) | 2024-01-19 |
Family
ID=89521730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311129765.0A Pending CN117425387A (en) | 2023-09-04 | 2023-09-04 | High-reliability quick-temperature thermoelectric refrigerator and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117425387A (en) |
-
2023
- 2023-09-04 CN CN202311129765.0A patent/CN117425387A/en active Pending
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