CN117419698A - Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging - Google Patents
Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging Download PDFInfo
- Publication number
- CN117419698A CN117419698A CN202311483881.2A CN202311483881A CN117419698A CN 117419698 A CN117419698 A CN 117419698A CN 202311483881 A CN202311483881 A CN 202311483881A CN 117419698 A CN117419698 A CN 117419698A
- Authority
- CN
- China
- Prior art keywords
- suction nozzle
- ceramic
- vacuum chamber
- harmonic oscillator
- electric connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009461 vacuum packaging Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims abstract description 71
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 10
- 238000005219 brazing Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 230000009977 dual effect Effects 0.000 claims description 4
- 239000005350 fused silica glass Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 230000005284 excitation Effects 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000009516 primary packaging Methods 0.000 description 1
- 238000009517 secondary packaging Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Abstract
The invention relates to the technical field of hemispherical resonator gyroscopes, in particular to a low-thermal-effect hemispherical resonator gyroscope based on double vacuum packaging. Comprises an inner sealing shell, an inner suction nozzle, an outer sealing shell, an outer suction nozzle, a harmonic oscillator, an electrode seat, a getter, a ceramic electric connector, a flexible connecting plate, an amplifying plate and a spring contact pin. The inner enclosure and the ceramic electrical connector form an inner vacuum chamber, and the outer enclosure and the ceramic electrical connector form an outer vacuum chamber. The inner suction nozzle is connected with the inner vacuum chamber, and the outer suction nozzle is connected with the outer vacuum chamber. The harmonic oscillator and the electrode holder are fixed on a ceramic electric connector in the inner vacuum chamber. The ceramic electric connector is provided with a mounting interface and a spring pin, and is connected with the getter through laser spot welding. The spring contact pin is electrically connected with the electrode seat and the getter, and is electrically connected with the flexible connecting plate and the amplifying plate. The outer air suction nozzle forms a high vacuum environment and keeps stable temperature; the ceramic electric connector realizes the electric conduction between the harmonic oscillator component and the flexible connecting plate and between the harmonic oscillator component and the amplifying plate.
Description
Technical Field
The invention relates to the technical field of hemispherical resonator gyroscopes, in particular to a low-thermal-effect hemispherical resonator gyroscope based on double vacuum packaging.
Background
The Hemispherical Resonator Gyro (HRG) is a vibrating gyro without a high-speed rotor and a movable support, and has the characteristics of high precision, small mass, small volume, short starting time, high overload and high reliability. Is praised as a Ge-type vibrating gyroscope with the most potential. The HRG works based on the physical mechanism of the coriolis effect generated when the hemispherical resonator rotates about the central axis, so that its mode of vibration precesses in the circumferential direction relative to the housing.
The hemispherical resonator gyroscope developed at present generally adopts a two-piece structure, and main parts comprise a harmonic oscillator and an electric electrode seat. Wherein the electrode seat adopts a plane or spherical structure, and both parts are formed by precisely machining fused quartz; then annealing, chemical cleaning, leveling, electrode zone metallization and performance test, then precisely assembling and adjusting the two components, welding the two components together by adopting solder with lower melting point (such as high-purity indium) in a vacuum environment to form a harmonic oscillator assembly, and then packaging, degassing and vacuumizing the shell to enable the harmonic oscillator to work in the high-vacuum environment to form the gauge outfit of the hemispherical resonator gyroscope.
The related literature data show that the hemispherical resonator gyroscope performance is greatly affected by temperature, and how to restrain temperature items is one of the targets pursued by current hemispherical resonator gyroscope engineering.
Disclosure of Invention
First, the technical problem to be solved
The invention mainly aims at the problems and provides a low-thermal-effect hemispherical resonator gyroscope based on double vacuum packaging, which aims to solve the problem that the performance of the hemispherical resonator gyroscope is influenced by the ambient temperature.
(II) technical scheme
In order to achieve the aim, the invention provides a low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging, which comprises an inner enclosure, an inner suction nozzle, an outer enclosure, an outer suction nozzle, a harmonic oscillator, an electrode seat, a getter, a ceramic electric connector, a flexible connecting plate, an amplifying plate and a spring pin, wherein the inner enclosure and the ceramic electric connector are enclosed to form an inner vacuum chamber, the outer enclosure and the ceramic electric connector are enclosed to form an outer vacuum chamber, and the inner suction nozzle is arranged on the inner enclosure, one end of the inner suction nozzle is communicated with the inner vacuum chamber, and the other end of the inner suction nozzle is connected with an air charging and discharging table; the outer air suction nozzle is arranged on the outer enclosure, one end of the outer air suction nozzle is communicated with the outer vacuum chamber, and the other end of the outer air suction nozzle is connected with the air charging and discharging table; the harmonic oscillator and the electrode holder form a harmonic oscillator assembly which is arranged in the inner vacuum chamber and fixedly connected to the ceramic electric connector; the ceramic electric connector comprises a ceramic substrate, wherein the upper surface of the ceramic substrate is provided with a mounting interface, the mounting interface is connected with the getter through laser spot welding, the ceramic substrate is provided with spring pins, two ends of each spring pin penetrate through the ceramic substrate, and the spring pins on one side of the upper surface of the ceramic substrate are electrically connected with the electrode base and the getter; the spring contact pin on one side of the lower surface of the ceramic substrate is electrically connected with the flexible connecting plate and the amplifying plate.
Further, the novel ceramic substrate comprises a shielding cover, wherein the shielding cover is connected to the lower surface of the ceramic substrate and encloses the flexible connecting plate and the amplifying plate.
Further, the harmonic oscillator is formed by precisely machining fused quartz and consists of an inner spherical surface, an outer spherical surface and a supporting rod penetrating through the spherical center, wherein the supporting rod on the outer side is in a T shape, a spherical shell formed by the surfaces is a vibrating part, and the supporting rod is a harmonic oscillator fixing part.
Further, the electrode seat is in a spherical or planar shape, is formed by quartz processing, and is subjected to magnetron sputtering to form a metal film layer, and laser etching to form the excitation and detection electrode.
Further, the ceramic electric connector adopts Al 2 O 3 Is brazed with the spring pin.
Further, a metal film layer required by soldering is arranged on the ceramic electric connector.
Further, the metal film layer is made of Cr and Au.
Further, the inner enclosure and the ceramic electrical connector are sealed together by vacuum brazing; the outer envelope and the ceramic electrical connector are sealed together by vacuum brazing.
(III) beneficial effects
Compared with the prior art, the low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging has the advantages that the shell is packaged in a double-vacuum structure, the first-level vacuum is an inner vacuum chamber formed by the inner shell and the ceramic electric connector, and the vacuum degree of the working environment of the harmonic oscillator is better than 10 through the connection of the inner suction nozzle and the air charging and discharging table -4 Pa, and realizing long-term maintenance of high vacuum degree through the aspirator; the second-stage vacuum is an outer vacuum chamber formed by an outer envelope and a ceramic electric connector, and is connected with an air charging and discharging table through an outer air suction nozzle, so that the vacuum degree of the space working environment is better than 10 -2 Pa, the influence of the external temperature environment change on the performance of the harmonic oscillator is reduced.
Drawings
Fig. 1 is a schematic diagram of a low thermal efficiency hemispherical resonator gyro structure based on dual vacuum packaging.
Fig. 2 is a structural view of a ceramic electrical connector according to the present invention.
FIG. 3 is a schematic diagram of a dual vacuum package according to the present invention.
Reference numerals shown in the drawings: 1. an inner enclosure; 2. an inner suction nozzle; 3. an outer suction nozzle; 4. an outer envelope; 5. a harmonic oscillator; 6. an electrode base; 7. a fixing screw; 8. an aspirator; 9. a ceramic electrical connector; 10. an amplifying plate; 11. a shield; 12. a flexible connection plate; 14. an inner vacuum chamber; 15. an outer vacuum chamber; 9-1, a first metal film layer; 9-2, a second metal film layer; 9-3, spring pins; 9-4, a ceramic substrate; 9-5, mounting interfaces.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-3, the embodiment provides a low-thermal-effect hemispherical resonator gyroscope based on double vacuum packaging, which comprises an inner enclosure 1, an inner suction nozzle 2, an outer enclosure 4, an outer suction nozzle 3, a harmonic oscillator 5, an electrode holder 6, a fixing screw 7, a getter 8, a ceramic electric connector 9, a flexible connecting plate 12, an amplifying plate 10 and a spring contact pin 9-3, wherein the inner enclosure 1 and the ceramic electric connector 9 are enclosed to form an inner vacuum chamber 14, the outer enclosure 4 and the ceramic electric connector 9 are enclosed to form an outer vacuum chamber 15, the inner suction nozzle 2 is arranged on the inner enclosure 1, one end of the inner suction nozzle 2 is communicated with the inner vacuum chamber 14, and the other end of the inner suction nozzle is connected with an air charging and discharging platform; the outer suction nozzle 3 is arranged on the outer envelope 4, one end of the outer suction nozzle is communicated with the outer vacuum chamber 15, and the other end of the outer suction nozzle is connected with the air charging and discharging table; the harmonic oscillator 5 and the electrode holder 6 form a harmonic oscillator assembly, and the harmonic oscillator assembly is arranged in the inner vacuum chamber 14 through the fixing screw 7 and is fixedly connected to the ceramic electric connector 9; the ceramic electric connector 9 comprises a ceramic substrate 9-4, wherein the upper surface of the ceramic substrate 9-4 is provided with a mounting interface 9-5, the mounting interface 9-5 is connected with the getter 8 through laser spot welding, the ceramic substrate 9-4 is provided with a spring contact pin 9-3, two ends of the spring contact pin 9-3 penetrate through the ceramic substrate 9-4, and the spring contact pin 9-3 on one side of the upper surface of the ceramic substrate 9-4 is electrically connected with the electrode seat 6 and the getter 8; the spring pin 9-3 on the side of the lower surface of the ceramic substrate 9-4 is electrically connected with the flexible connecting plate 12 and the amplifying plate 10.
A low-heat-effect hemispherical resonator gyro based on double vacuum packaging is characterized in that the housing of the hemispherical resonator gyro is divided into two layers of vacuum chambers. The primary vacuum chamber is located between the inner enclosure 1 and the ceramic electrical connector 9 and is connected to an inflation and deflation table by an inner suction nozzle 2. This level achieves better than 10 -4 Pa, and a high vacuum is maintained by the getter 8 (which is due to the gas generated by the material itself, by the getter 8 absorbing this gas). The second stage vacuum chamber is located between the outer envelope 4 and the ceramic electrical connector 9 and is connected to the plenum by the outer suction nozzle 3. This level achieves better than 10 -2 The working environment vacuum degree of Pa and the influence of the external temperature environment change on the performance of the harmonic oscillator are reduced.
In this embodiment, a shield 11 is also included, the shield 11 being an additional component of the device, which is attached to the lower surface of the ceramic electrical connector 9 and encloses the flexible connection board 12 and the amplification board 10 inside.
The purpose of the shield 11 is to provide electromagnetic shielding and physical protection. By being connected below the ceramic electrical connector 9, it is possible to block to some extent the influence of external electromagnetic interference on the device. This helps to maintain stability and accuracy of the resonant gyros, as well as to reduce noise or interference caused by electromagnetic radiation. In addition, the shield 11 provides physical protection, wrapping the flexible connection board 12 and the amplification board 10 inside. This helps to protect them from mechanical damage or the external environment while reducing the adverse effects of ambient temperature changes on the device. By providing a physical barrier and isolation layer, the shield 11 helps maintain the stability and performance of the device.
In this embodiment, the harmonic oscillator 5 is formed by precisely machining fused quartz, and is composed of an inner spherical surface, an outer spherical surface and a supporting rod penetrating through the spherical center, wherein the outer supporting rod is in a T shape, a spherical shell formed by the surfaces is a vibrating part, and the supporting rod is a harmonic oscillator fixing part.
In this embodiment, the electrode holder 6 is spherical or planar, and is formed by processing quartz, sputtering a metal film layer by magnetron sputtering, and forming an excitation and detection electrode by laser etching.
In the present embodiment, the ceramic electrical connector 9 is made of a ceramic material with high thermal conductivity, such as Al 2 O 3 The semi-spherical resonance gyroscope is brazed with the spring contact pin 9-3 to realize the electric conduction between the working electrode of the semi-spherical resonance gyroscope and the flexible connecting plate 12 and the amplifying plate 10; according to the soldering requirements, the ceramic electric connector 9 is provided with a metal film layer required by soldering.
Referring to fig. 2, the ceramic electrical connector 9 is composed of a mounting interface 9-5, a ceramic substrate 9-4, a spring pin 9-3, a first metal film 9-1, a second metal film 9-2, and the like. Wherein the ceramic substrate 9-4 is formed by processing ceramic material with good insulating property and high heat conductivity coefficient, and the typical material is Al 2 O 3 The method comprises the steps of carrying out a first treatment on the surface of the The spring contact pin 9-3 is in airtight sealing with the ceramic substrate 9-4 in a brazing mode, and a typical material is 4J33; the first metal film layer 9-1 and the second metal film layer 9-2 are typically Cr, au or other materials which are suitable for being infiltrated with brazing material; the mounting interface 9-5 is laser spot welded with the aspirator, and the structure has the functions of both electrical activation and fixed support.
Preferably, the inner enclosure 1 and the inner air suction nozzle 2 are vacuum brazed together;
preferably, the outer envelope 4 is vacuum brazed with the outer suction nozzle 3; the method comprises the steps of carrying out a first treatment on the surface of the
Preferably, the inner enclosure 1 and the ceramic electrical connector 9 are vacuum soldered together;
preferably, the outer envelope 4 is vacuum soldered to the ceramic electrical connector 9.
Referring to fig. 3, the vacuum chambers of the dual vacuum packaging structure are an inner vacuum chamber 14 and an outer vacuum chamber 15; the inner vacuum chamber 14 consists of a ceramic electric connector 9 and an inner enclosure 1, the ceramic electric connector 9 and the inner enclosure 1 are sealed together through vacuum brazing, the inner air suction nozzle 2 and the inner enclosure 1 are brazed together, and after the hemispherical resonator gyro is assembled and packaged, the inner air suction nozzle 2 is connected with an air charging and discharging table to realize primary packaging with high vacuum degree; the outer vacuum chamber 15 is composed of a ceramic electric connector 9 and an outer envelope 4, the ceramic electric connector 9 and the outer envelope 4 are sealed together through vacuum brazing, the outer suction nozzle 3 and the outer envelope 4 are brazed together, and after primary vacuum packaging is completed, the outer suction nozzle 3 is connected with an air charging and discharging table, so that secondary packaging with high vacuum degree is realized. Through the double-vacuum packaging treatment, the influence of the ambient temperature on the performance of the half-ball resonance gyroscope is effectively reduced, and therefore the working stability and reliability of the gyroscope are improved.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (8)
1. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging is characterized by comprising an inner sealing shell, an inner suction nozzle, an outer sealing shell, an outer suction nozzle, a harmonic oscillator, an electrode holder, a getter, a ceramic electric connector, a flexible connecting plate, an amplifying plate and a spring contact pin, wherein the inner sealing shell and the ceramic electric connector are enclosed to form an inner vacuum chamber, the outer sealing shell and the ceramic electric connector are enclosed to form an outer vacuum chamber, the inner suction nozzle is arranged on the inner sealing shell, one end of the inner suction nozzle is communicated with the inner vacuum chamber, and the other end of the inner suction nozzle is connected with an air charging and discharging table; the outer air suction nozzle is arranged on the outer enclosure, one end of the outer air suction nozzle is communicated with the outer vacuum chamber, and the other end of the outer air suction nozzle is connected with the air charging and discharging table; the harmonic oscillator and the electrode holder form a harmonic oscillator assembly which is arranged in the inner vacuum chamber and fixedly connected to the ceramic electric connector; the ceramic electric connector comprises a ceramic substrate, wherein the upper surface of the ceramic substrate is provided with a mounting interface, the mounting interface is connected with the getter through laser spot welding, the ceramic substrate is provided with spring pins, two ends of each spring pin penetrate through the ceramic substrate, and the spring pins on one side of the upper surface of the ceramic substrate are electrically connected with the electrode base and the getter; the spring contact pin on one side of the lower surface of the ceramic substrate is electrically connected with the flexible connecting plate and the amplifying plate.
2. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 1, further comprising a shielding cover, wherein the shielding cover is connected to the lower surface of the ceramic substrate and encloses the flexible connecting plate and the amplifying plate.
3. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 1, wherein the harmonic oscillator is formed by precisely machining fused quartz and consists of an inner spherical surface, an outer spherical surface and a supporting rod penetrating through the spherical center, wherein the outer supporting rod is in a T shape, a spherical shell formed by the outer supporting rod is a vibrating part, and the supporting rod is a harmonic oscillator fixing part.
4. The low-thermal-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 1, wherein the electrode base is in a spherical or planar shape, is formed by quartz processing, and is formed into an excitation and detection electrode by magnetron sputtering of a metal film layer and laser etching.
5. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 1, wherein the ceramic electrical connector is made of Al 2 O 3 Is brazed with the spring pin.
6. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 1, wherein the ceramic electrical connector is provided with a metal film layer required for brazing.
7. The low-heat-effect hemispherical resonator gyroscope based on double vacuum packaging as claimed in claim 6, wherein the metal film layer is made of Cr and Au.
8. The dual vacuum package based low thermal effect hemispherical resonator gyroscope of claim 1, wherein the inner enclosure and ceramic electrical connector are sealed together by vacuum brazing; the outer envelope and the ceramic electrical connector are sealed together by vacuum brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311483881.2A CN117419698A (en) | 2023-11-07 | 2023-11-07 | Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311483881.2A CN117419698A (en) | 2023-11-07 | 2023-11-07 | Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117419698A true CN117419698A (en) | 2024-01-19 |
Family
ID=89526382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311483881.2A Pending CN117419698A (en) | 2023-11-07 | 2023-11-07 | Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117419698A (en) |
-
2023
- 2023-11-07 CN CN202311483881.2A patent/CN117419698A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6167494B2 (en) | Electronic device container manufacturing method, electronic device manufacturing method, electronic device, electronic apparatus, and mobile device | |
| US20050062368A1 (en) | Tuning-fork type piezo-oscillator piece and mounting method thereof | |
| KR101735579B1 (en) | Gyroscopic sensor | |
| US7759848B2 (en) | Tuning fork type piezoelectric resonator having a node of common mode vibration in constructed part of base | |
| US20060162446A1 (en) | Piezoelectric vibrating gyro element and gyro sensor | |
| JP2009118302A (en) | Tuning fork piezoelectric resonating piece and tuning fork piezoelectric resonator | |
| WO2006069116A1 (en) | Nmr gyroscope | |
| JP2004297198A (en) | Piezoelectric vibrating reed and piezoelectric device, mobile phone device using piezoelectric device, and electronic device using piezoelectric device | |
| EP2071721A1 (en) | Piezoelectric resonator in a small-sized package | |
| JP4555359B2 (en) | Crystal oscillator | |
| CN117419698A (en) | Low-thermal-effect hemispherical resonant gyroscope based on double vacuum packaging | |
| JP2004229255A (en) | Crystal oscillator ceramic package | |
| CN114396925B (en) | Hemispherical resonant gyroscope with spring damping structure | |
| JP2000349181A (en) | Surface-mounting package for electronic components | |
| JP2006196932A (en) | Tuning fork type piezoelectric device manufacturing method and tuning fork type piezoelectric device | |
| CN112379125B (en) | Manufacturing and packaging method of split type differential quartz vibrating beam accelerometer | |
| JP2011250228A (en) | Piezoelectric device and frequency adjusting method of the same | |
| US8525600B1 (en) | Temperature-compensated crystal oscillator assembly | |
| JP2010220152A (en) | Surface-mounted crystal device | |
| JP5387842B2 (en) | Piezoelectric device | |
| CN116026297A (en) | Hemispherical resonator gyroscope and packaging method thereof | |
| JP2012205032A (en) | Crystal vibrator | |
| JP2008057995A (en) | Manufacturing method of vibrator sealing body, vibrator sealing body, and physical quantity sensor | |
| JP2010147854A (en) | Piezoelectric vibrator, and piezoelectric device | |
| JP2010136243A (en) | Vibrator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |