CN117415698B - Edge polishing device for silicon carbide wafer - Google Patents
Edge polishing device for silicon carbide wafer Download PDFInfo
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- CN117415698B CN117415698B CN202311743889.8A CN202311743889A CN117415698B CN 117415698 B CN117415698 B CN 117415698B CN 202311743889 A CN202311743889 A CN 202311743889A CN 117415698 B CN117415698 B CN 117415698B
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- support
- silicon carbide
- carbide wafer
- limit
- polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 103
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 103
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 230000005540 biological transmission Effects 0.000 claims abstract description 59
- 230000008878 coupling Effects 0.000 claims abstract description 15
- 238000010168 coupling process Methods 0.000 claims abstract description 15
- 238000005859 coupling reaction Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims description 33
- 238000007517 polishing process Methods 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 95
- 230000000694 effects Effects 0.000 description 10
- 230000033001 locomotion Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/08—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing combined with fluid systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to the technical field of silicon carbide processing, and particularly relates to a polishing device for the edge of a silicon carbide wafer. Including the support body, the support body rigid coupling has first support and first electric putter and sliding connection have the third support, third support installs driving motor, driving motor's output shaft rigid coupling has first driving medium, first support rigid coupling has the spacing frame that the mirror image was arranged, the mirror image is arranged rotate between the spacing frame and be connected with the transmission shaft, transmission shaft spline connection has complex second driving medium, driving motor's output shaft rigid coupling has the second pivot, second pivot spline connection has the movable rod, the movable rod is provided with the polishing wheel. According to the invention, the transmission ratio of the second transmission piece to the first transmission piece is changed, so that the speed at the edge of the silicon carbide wafer and the speed at the edge of the polishing wheel are always kept corresponding to each other, thereby enhancing the protection of the silicon carbide wafer in the polishing process and improving the polishing quality.
Description
Technical Field
The invention relates to the technical field of silicon carbide processing, in particular to a polishing device for the edge of a silicon carbide wafer.
Background
Silicon carbide wafers are a material used for LED solid illumination and high frequency device fabrication, and the production process of silicon carbide wafers includes steps such as ingot barreling, multi-wire cutting, grinding chamfering, wafer polishing, wafer cleaning, and wafer final inspection, while wafer polishing is one of the most important steps, and the polishing quality directly affects the quality of silicon carbide wafers in subsequent use.
Most of the existing silicon carbide wafer polishing technologies make silicon carbide wafers and polishing wheels rotate in the same direction, and polishing of the silicon carbide wafers is completed by utilizing mutual friction between the silicon carbide wafers and the polishing wheels, but when the silicon carbide wafers with different diameters are polished by the polishing technologies, the edge speeds of the silicon carbide wafers are different, and the problem of poor polishing effect or overheating can be caused by the change of the relative speeds between the edge of the silicon carbide wafer and the polishing wheels, and the silicon carbide wafers are damaged seriously.
Disclosure of Invention
The invention provides a silicon carbide wafer edge polishing device, which aims to overcome the defects that the silicon carbide wafer has poor polishing effect or is overheated and damaged when the silicon carbide wafer is seriously heated due to different edge speeds in the polishing process of the silicon carbide wafer in the conventional silicon carbide wafer polishing technology.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a be used for carborundum wafer edge burnishing device, includes the support body, the support body rigid coupling has first support and first electric putter and sliding connection have the third support, first support rigid coupling has the second support, the second support rotate be connected with first pivot that first support rotates to be connected, first pivot rigid coupling has the hypoplastron, the second support be provided with first gear train that first pivot is connected, the driving motor is installed to the third support, driving motor's output shaft rigid coupling has first driving medium, first support rigid coupling has the spacing frame that the mirror image was arranged, the mirror image is arranged sliding connection between the spacing frame with third support complex movable frame, the mirror image is arranged rotate be connected with first gear train connection and with movable frame sliding connection's transmission shaft, the transmission shaft spline connection have with movable frame with the second driving medium that first driving medium all cooperates, driving motor's output shaft rigid coupling have with third support rotates to be connected with the second driving medium, the second pivot that the driving motor has, the mirror image is arranged is connected with the spacing frame, the second support has the movable shaft, the first telescopic link is provided with the telescopic link, the first telescopic link has.
Preferably, the first transmission member is in a truncated cone shape, and the axis of the transmission shaft and the axis of the second transmission member are parallel to a bus on one side of the first transmission member, which is close to the moving frame.
As one preferable mode, the clamping mechanism comprises a hydraulic push rod, the hydraulic push rod is arranged on the upper side of the frame body, a moving part which is in sliding connection with the frame body is fixedly connected to the telescopic end of the hydraulic push rod, a sliding rod is connected in the moving part in a sliding manner, an elastic element is fixedly connected between the moving part and the sliding rod, and an upper plate is connected to one end, far away from the hydraulic push rod, of the sliding rod in a rotating manner.
Preferably, the moving mechanism comprises a supporting frame, the supporting frame is slidably connected to the frame body, the supporting frame is fixedly connected with a third support, a fixed shell is fixedly connected to one side, close to the hydraulic push rod, of the supporting frame, a guide plate is slidably connected to the fixed shell, a shell is arranged on the guide plate, the shell is rotatably connected with the polishing wheel, and a transmission assembly used for enabling the guide plate to move is arranged on the third support.
Preferably, the transmission assembly comprises a disc, the disc is rotatably connected to one side of the third support, a second gear set is arranged on one side, close to the disc, of the third support, the disc and the second rotating shaft are transmitted through the second gear set, a connecting rod is hinged between the guide plate and the disc, and the hinge joint of the connecting rod and the disc is located at the eccentric position of the disc.
Preferably, the distance between the hinge of the connecting rod and the disc and the axis of the disc is more than half the length of the bus of the polishing wheel.
As a preference, the polishing device further comprises a deflection mechanism for deflecting the shell, wherein the deflection mechanism is arranged on the shell, the guide plate is in sliding connection with the shell, the deflection mechanism comprises limit columns which are arranged in a mirror image mode, the limit columns which are arranged in a mirror image mode are fixedly connected to one side of the shell, a limit plate is fixedly connected to one side, close to the shell, of the fixing shell, a first limit groove and a second limit groove are formed in the limit plate, the first limit groove and the second limit groove are respectively matched with the adjacent limit columns, a universal shaft is fixedly connected between the movable rod and the polishing wheel, and a centering mechanism for centering a to-be-processed object is arranged on the second support.
As one preference, the first limit groove and the second limit groove are composed of limit straight grooves and limit arc grooves arranged in a mirror image mode, and the radian of the first limit groove limit arc grooves is smaller than that of the second limit groove limit arc grooves.
Preferably, the guide plate is an arc plate, and the circle center of the guide plate, the circle center of the first limiting groove limiting arc groove and the circle center of the second limiting groove limiting arc groove are all located on a tangent line of the polishing wheel, which is close to a busbar central point on one side of the second support.
As one preferred, the centering mechanism comprises a second electric push rod, the second electric push rod is installed in the second support, a sliding plate is fixedly connected to the telescopic end of the second electric push rod, the sliding plate is in sliding connection with the first rotating shaft, a limiting part of an annular array is fixedly connected to one side of the sliding plate, which is far away from the first rotating shaft, of the sliding plate, a positioning rod of the annular array is rotatably connected to the second support, a straight limiting groove is formed in the positioning rod, and the limiting part is matched with the straight limiting groove of the adjacent positioning rod.
Compared with the prior art, the invention has the following beneficial effects at least: according to the invention, the transmission ratio of the second transmission piece to the first transmission piece is changed, so that the speed at the edge of the silicon carbide wafer and the speed at the edge of the polishing wheel are always kept corresponding to each other, and the silicon carbide wafer is prevented from being damaged due to the difference between the speed at the edge of the polishing wheel and the speed at the edge of the polishing wheel in the polishing process, thereby enhancing the protection of the silicon carbide wafer in the polishing process and improving the polishing quality; the elastic force generated by deformation of the elastic element is utilized to apply downward pressure to the silicon carbide wafer, so that the silicon carbide wafer is prevented from being damaged when being fixed by using hard force, and the protection of the silicon carbide wafer is improved; the polishing area of the polishing wheel is uniformly contacted with the silicon carbide wafer by enabling the polishing wheel to reciprocate up and down, so that the silicon carbide wafer is prevented from being contacted with the same area of the polishing wheel for a long time to aggravate the abrasion degree of the area, and the service life of the polishing wheel and the polishing effect on the silicon carbide wafer are improved; the adjacent limit posts are limited through the first limit groove and the second limit groove respectively, so that the polishing wheel deflects at the upper edge and the lower edge of the silicon carbide wafer, the upper edge and the lower edge of the silicon carbide wafer are further polished by the polishing wheel, and the situation that the upper edge and the lower edge of the silicon carbide wafer cannot be polished by a motion mode of the polishing wheel in a straight up and down direction is prevented, so that the polishing effect on the silicon carbide wafer is improved; the silicon carbide wafer is centered by utilizing the positioning rods of the annular array, so that uneven polishing of the silicon carbide wafer caused by relative eccentricity between the axis of the silicon carbide wafer and the lower plate is prevented, and the polishing effect on the silicon carbide wafer is improved.
Drawings
FIG. 1 is a schematic perspective view of the whole structure of the present invention;
FIG. 2 is a perspective view of the entire structure of the present invention in half section;
FIG. 3 is a schematic view showing a third bracket of the present invention moving leftwards;
FIG. 4 is an exploded view of the first and third brackets and the parts thereof in a perspective configuration according to the present invention;
FIG. 5 is a schematic perspective view of a deflection mechanism according to the present invention;
FIG. 6 is a schematic perspective view of a movement mechanism and transmission assembly of the present invention;
FIG. 7 is an exploded view of the three-dimensional structure of the movement mechanism and transmission assembly of the present invention;
FIG. 8 is a schematic perspective view of a centering mechanism of the present invention;
fig. 9 is a schematic perspective view of the sliding plate of the present invention when it moves upward.
The reference symbols in the drawings: 1: frame body, 2: first support, 3: second support, 4: first pivot, 5: lower plate, 6: first gear set, 7: third support, 8: driving motor, 9: first transmission member, 10: limit frame, 11: moving rack, 12: transmission shaft, 13: second transmission piece 1401: second spindle, 1402: movable rod, 15: polishing wheel, 16: first electric putter, 17: clamping mechanism, 1701: hydraulic pushrod, 1702: moving member, 1703: slide bar, 1704: elastic element, 1705: upper plate, 18: movement mechanism, 1801: support frame 1802: fixed shell, 1803: guide plate, 1804: a housing, 19: drive assembly, 1901: disc, 1902: second gear set, 1903: connecting rod, 20: deflection mechanism, 2001: limit post, 2002: limiting plate, 2003: first limit groove, 2004: second limit groove, 2005: cardan shaft, 21: centering mechanism, 2101: second electric putter, 2102: slide plate, 2103: limiting piece, 2104: and a positioning rod.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
Example 1: 1-6, including a frame 1, a first support 2 is fixed on the lower part of the left side of the frame 1, a second support 3 is fixed on the upper side of the first support 2, a first rotating shaft 4 is connected with the middle part of the second support 3 in a rotating way, the first rotating shaft 4 is connected with the first support 2 in a rotating way, a lower plate 5 is fixed on the upper end of the first rotating shaft 4, a first gear set 6 is arranged on the right part of the lower side of the second support 3, the first gear set 6 consists of a rotating column, a first straight gear and a second straight gear, the rotating column is connected with the right part of the lower side of the second support 3 in a rotating way, the rotating column is fixedly connected with the first straight gear, the first straight gear is meshed with the second straight gear, the second straight gear of the first gear set 6 is fixedly connected with the first rotating shaft 4, a third support 7 is connected in a sliding way, a driving motor 8 is arranged in the middle of the third support 7, the driving motor 8 is a double-headed motor, the output shaft at the lower side of the driving motor 8 is fixedly connected with a first transmission part 9, the first transmission part 9 is in a round table shape, the diameter of the upper side surface of the first transmission part 9 is larger than that of the lower side surface of the first transmission part 9, the middle part at the right side of the first bracket 2 is fixedly connected with two limit frames 10 which are arranged in a front-back mirror image manner, a movable frame 11 which is in limit fit with the third bracket 7 is slidably connected between the two limit frames 10, the left side of the side surface at the position where the limit frames 10 are matched with the movable frame 11 is higher than the right side, so that when the third bracket 7 moves leftwards, the movable frame 11 is extruded leftwards and upwards, a transmission shaft 12 which is slidably connected with the movable frame 11 is rotatably connected between the two limit frames 10, the transmission shaft 12 is connected with a rotating column of the first gear set 6 through a universal joint, the transmission shaft 12 is in spline connection with a second transmission part 13, the second transmission part 13 is in limit fit with the movable frame 11 and the first transmission part 9, the movable frame 11 drives the second transmission member 13 to move up and down together, the axis of the transmission shaft 12 and the axis of the second transmission member 13 are parallel to a bus on the left side of the first transmission member 9, so that the second transmission member 13 is always matched with the first transmission member 9 in the moving process, an output shaft on the upper side of the driving motor 8 is fixedly connected with a second rotating shaft 1401, the second rotating shaft 1401 is rotatably connected with the third bracket 7, the second rotating shaft 1401 is in spline connection with a movable rod 1402, a polishing wheel 15 is arranged at the upper end of the movable rod 1402, a first electric push rod 16 is arranged at the lower part of the front side of the frame body 1, a telescopic end of the first electric push rod 16 is fixedly connected with the third bracket 7, a clamping mechanism 17 for clamping a workpiece to be processed is arranged on the frame body 1, and the second bracket 3 is provided with a moving mechanism 18 for enabling the polishing wheel 15 to move.
As shown in fig. 1 and 2, the clamping mechanism 17 includes a hydraulic ram 1701, the hydraulic ram 1701 is mounted on the left portion of the upper side of the frame 1, a moving member 1702 slidably connected with the frame 1 is fixedly connected to a telescopic end of the hydraulic ram 1701, a sliding rod 1703 is slidably connected to a middle lower portion in the moving member 1702, an elastic element 1704 is fixedly connected between the moving member 1702 and the sliding rod 1703, the elastic element 1704 is a spring, an upper plate 1705 is rotatably connected to a lower end of the sliding rod 1703, a downward pressure is applied to the silicon carbide wafer by using an elastic force generated by deformation of the elastic element 1704, and damage to the silicon carbide wafer when the silicon carbide wafer is fixed by using a hard force is avoided, so that the protection of the silicon carbide wafer is improved.
As shown in fig. 2 and fig. 5-7, the moving mechanism 18 includes a support frame 1801 fixedly connected with the third support frame 7, the support frame 1801 is slidably connected with the right portion of the lower side to the frame body 1, the upper side of the support frame 1801 is fixedly connected with a fixing shell 1802, the left portion of the fixing shell 1802 is slidably connected with a guide plate 1803, the left portion of the guide plate 1803 is provided with a casing 1804 rotatably connected with the polishing wheel 15, the third support frame 7 is provided with a transmission component 19 for moving the guide plate 1803, and by making the polishing wheel 15 reciprocate up and down, the polishing area of the polishing wheel 15 is uniformly contacted with the silicon carbide wafer, and the silicon carbide wafer is prevented from contacting with the same area of the polishing wheel 15 for a long time, so that the abrasion degree of the area is increased, thereby improving the service life of the polishing wheel 15 and the polishing effect on the silicon carbide wafer.
As shown in fig. 1 and fig. 5-7, the transmission assembly 19 includes a disc 1901, the disc 1901 is rotatably connected to the right portion of the upper side of the third support 7, the upper side of the third support 7 is provided with a second gear set 1902, the second gear set 1902 is composed of a first bevel gear and a second bevel gear which are meshed with each other, the first bevel gear of the second gear set 1902 is fixedly connected with the second rotating shaft 1401, the second bevel gear of the second gear set 1902 is fixedly connected with the disc 1901, the axis of the second bevel gear of the second gear set 1902 coincides with the axis of the disc 1901, a connecting rod 1903 is hinged between the guide plate 1803 and the disc 1901, the hinge position of the connecting rod 1903 and the disc 1901 is located at an eccentric position of the disc 1901, and the distance between the hinge position of the connecting rod 1903 and the disc 1901 and the axis of the disc 1901 is greater than half of the bus length of the polishing wheel 15.
When the device is required to polish the edge of the silicon carbide wafer, a worker places the silicon carbide wafer at the center of the upper side surface of the lower plate 5, then starts the hydraulic push rod 1701, the telescopic end of the hydraulic push rod 1701 starts to move downwards, the telescopic end of the hydraulic push rod 1701 drives the moving part 1702 to move downwards together, the moving part 1702 drives the sliding rod 1703 to move downwards together with the elastic element 1704, the sliding rod 1703 drives the upper plate 1705 to move downwards together, after the upper plate 1705 moves downwards to be in contact with the silicon carbide wafer, the upper plate 1705 and the sliding rod 1703 stop moving downwards, and the elastic element 1704 is continuously moved downwards and extruded by the moving part 1702 along with the continuous downwards movement of the telescopic end of the hydraulic push rod 1701 until the elastic element 1704 is compressed to completely fix the silicon carbide wafer by the upper plate 1705, the lower pressure is applied to the silicon carbide wafer by the elasticity generated by deformation of the elastic element 1704, so that the silicon carbide wafer is prevented from being damaged when the silicon carbide wafer is fixed by hard force, and the protection of the silicon carbide wafer is enhanced.
After the silicon carbide wafer is fixed, a worker starts a first electric push rod 16, the telescopic end of the first electric push rod 16 starts to move leftwards, the telescopic end of the first electric push rod 16 drives a third support 7 to move leftwards together, the third support 7 starts to slide leftwards along a frame body 1, the third support 7 drives a driving motor 8 and a second rotating shaft 1401 to move leftwards together, the driving motor 8 drives a first transmission piece 9 to move leftwards together, the second rotating shaft 1401 drives a moving rod 1402 to move leftwards together, the moving rod 1402 drives a polishing wheel 15 to move leftwards together, the third support 7 presses a moving frame 11 leftwards in the leftward moving process, a limiting frame 10 starts to press the moving frame 11 upwards, the moving frame 11 starts to slide leftwards upwards along the limiting frame 10, the moving frame 11 drives a second transmission piece 13 to move together, the transmission ratio of the second transmission piece 13 and the first transmission piece 9 is increased, until the worker closes the first electric push rod 16 after the polishing wheel 15 moves leftwards to contact with the silicon carbide wafer, the transmission ratio of the second transmission piece 13 to the first transmission piece 9 is changed by adjusting the distance between the silicon carbide wafer and the polishing wheel 15 (namely, the diameter of the silicon carbide wafer), so that the speed at the edge of the silicon carbide wafer and the speed at the edge of the polishing wheel 15 always keep mutually corresponding, the excessive linear speed at the edge of the silicon carbide wafer with large diameter is avoided, the relative friction speed between the silicon carbide wafer and the polishing wheel 15 is increased, excessive heat generation is caused, the damage to the silicon carbide wafer is finally caused, the relative friction speed between the silicon carbide wafer and the polishing wheel 15 is prevented from being reduced due to the excessively small linear speed at the edge of the silicon carbide wafer with small diameter, the uneven polishing phenomenon is caused, the polishing quality is influenced, thereby enhancing the protection of the silicon carbide wafer during polishing and improving the polishing quality.
In the process that the third support 7 moves leftwards, the third support 7 drives the support frame 1801, the disc 1901 and the second gear set 1902 to move leftwards together, the support frame 1801 drives the fixing shell 1802 to move leftwards together, the fixing shell 1802 drives the guide plate 1803 to move leftwards together, the guide plate 1803 and the disc 1901 drive the connecting rod 1903 to move leftwards together, when the polishing wheel 15 moves to be in contact with the silicon carbide wafer, the driving motor 8 is started to work, the output shaft of the driving motor 8 starts to rotate, the output shaft of the driving motor 8 drives the first transmission member 9 and the second rotation shaft 1401 to rotate together, the first transmission member 9 drives the second transmission member 13 to rotate reversely, the second transmission member 13 drives the transmission shaft 12 to rotate together, the transmission shaft 12 drives the rotation column to rotate together through the universal joint, the first straight gear drives the second straight gear to rotate together, the second straight gear drives the first rotation shaft 4 to rotate together, the first rotation shaft 4 drives the lower plate 5 to rotate together, and the lower plate 5 drives the silicon carbide wafer to rotate together, and the silicon carbide wafer drives the upper plate 1705 to rotate together.
In the process of rotating the second rotating shaft 1401, the second rotating shaft 1401 drives the first bevel gear and the moving rod 1402 to rotate together, the moving rod 1402 drives the polishing wheel 15 to rotate together, the rotating polishing wheel 15 starts polishing the silicon carbide wafer, the first bevel gear drives the second bevel gear to rotate reversely, the second bevel gear drives the disc 1901 to rotate together (the disc 1901 rotates clockwise when viewing the direction), the disc 1901 drives the connecting rod 1903 to rotate together, the connecting rod 1903 drives the guide plate 1803 to start to move downwards, the guide plate 1803 slides with the fixed shell 1802 mutually, the guide plate 1803 drives the housing 1804 to move downwards together, the housing 1804 drives the polishing wheel 15 to move downwards together, the polishing wheel 15 drives the moving rod 1402 to move downwards together with the second rotating shaft 1401, after the disc 1901 rotates 90 DEG, the hinge joint of the disc 1901 and the connecting rod 1903 moves to the lowest point, as the disk 1901 continues to rotate, the disk 1901 starts to drive the connecting rod 1903 to move upwards, the connecting rod 1903 drives the guide plate 1803 to move upwards together, the guide plate 1803 drives the housing 1804 to move upwards together, the housing 1804 drives the polishing wheel 15 to move upwards together, the connecting rod 1903 drives the guide plate 1803 to reciprocate up and down through the continuous rotation of the disk 1901, so that the polishing area of the polishing wheel 15 is in uniform contact with the silicon carbide wafer, the silicon carbide wafer is prevented from contacting the same area of the polishing wheel 15 for a long time, the abrasion degree of the area is increased, the service life of the polishing wheel 15 is prolonged, the polishing effect on the silicon carbide wafer is improved, and after polishing of the silicon carbide wafer is completed, a worker turns off the driving motor 8, resets all parts and takes down the silicon carbide wafer.
Example 2: on the basis of embodiment 1, as shown in fig. 5-7, the device further comprises a deflection mechanism 20 for deflecting the housing 1804, the deflection mechanism 20 is arranged on the housing 1804, the guide plate 1803 is in sliding connection with the housing 1804, the deflection mechanism 20 comprises two groups of limit posts 2001 which are arranged in a left-right mirror image manner, each group comprises two limit posts 2001 which are arranged in a front-back mirror image manner, the two limit posts 2001 on the front side and the two limit posts 2001 on the rear side are fixedly connected to the front side and the rear side of the housing 1804 respectively, the left side of the fixing housing 1802 is fixedly connected with two limit plates 2002 which are arranged in a front-back mirror image manner, the limit plates 2002 are provided with a first limit groove 2003 and a second limit groove 2004, the first limit groove 2003 and the second limit groove 2004 are respectively formed by connecting limit straight grooves and two limit arc grooves which are arranged in a top-bottom mirror image manner, the limit straight grooves of the first limit groove 2003 and the limit straight grooves of the second limit grooves 2004 are respectively located between the upper adjacent limit arc grooves and the lower limit grooves, and the radian of the first limit groove 2003 and the second limit groove 2004 is smaller than that of the second limit groove 2004, the first limit groove 2003 and the second limit groove 2004 are respectively matched with the adjacent limit posts 2001 in a limit way, the adjacent limit posts 2001 are extruded by the first limit groove 2003 and the second limit groove 2004 to enable the housing 1804 to deflect up and down, the guide plate 1803 is an arc plate, the circle center of the guide plate 1803, the circle center of the first limit groove 2003 and the circle center of the second limit groove 2004 are all positioned on the tangent line of the center point of the left bus of the polishing wheel 15, a universal shaft 2005 is fixedly connected between the movable rod 1402 and the polishing wheel 15, the second bracket 3 is provided with a centering mechanism 21 for centering the object to be processed, the adjacent limit posts 2001 are respectively limited by the first limit groove 2003 and the second limit groove 2004, the polishing wheel 15 is deflected at the upper edge and the lower edge of the silicon carbide wafer, and further, the polishing wheel 15 polishes the upper and lower edges of the silicon carbide wafer, so that the upper and lower edges of the silicon carbide wafer cannot be polished in a straight up and down motion mode of the polishing wheel 15 is prevented, and the polishing effect on the silicon carbide wafer is improved.
As shown in fig. 1, 8 and 9, the centering mechanism 21 comprises a second electric push rod 2101, the second electric push rod 2101 is mounted at the left part of the lower side of the second bracket 3, a sliding plate 2102 which is in sliding connection with the first rotating shaft 4 is fixedly connected to the telescopic end of the second electric push rod 2101, three limiting pieces 2103 of an annular array are fixedly connected to the outer side of the sliding plate 2102, three positioning rods 2104 of the annular array are rotatably connected to the second bracket 3, soft rubber is arranged on the outer side of each positioning rod 2104 and used for protecting a silicon carbide wafer, the positioning rods 2104 are provided with straight limiting grooves, the limiting pieces 2103 are matched with the straight limiting grooves of the adjacent positioning rods 2104, and the silicon carbide wafer is centered by the three positioning rods 2104, so that uneven polishing of the silicon carbide wafer caused by relative eccentricity between the axis of the silicon carbide wafer and the lower plate 5 is prevented, and the polishing effect on the silicon carbide wafer is improved.
In the process of moving up the housing 1804, the housing 1804 drives the four limit posts 2001 to move up together, the two limit posts 2001 on the same side of the housing 1804 start to slide up in the adjacent first limit groove 2003 and the adjacent second limit groove 2004 respectively, when the two limit posts 2001 on the same side of the housing 1804 slide to enter the limit arc groove on the upper side of the adjacent first limit groove 2003 and the limit arc groove on the upper side of the adjacent second limit groove 2004 respectively, the limit arc groove on the upper side of the first limit groove 2003 and the limit arc groove on the upper side of the second limit groove 2004 start to force the adjacent limit posts 2001 to deflect anticlockwise along with the continuous upward movement of the housing 1804, the four limit posts 2001 drive the housing 1804 to deflect anticlockwise along with the guide plate 1803, the housing 1804 drives the polishing wheel 15 to deflect anticlockwise along with the polishing wheel 15 drives the universal shaft 2005 to start to move up along with the moving rod 1402, and therefore the upper edge of the silicon carbide wafer is polished.
In the process that the housing 1804 moves downwards, the housing 1804 drives the four limit posts 2001 to move downwards together, two limit posts 2001 on the same side of the housing 1804 start to slide downwards in the adjacent first limit groove 2003 and the adjacent second limit groove 2004 respectively, when the two limit posts 2001 on the same side of the housing 1804 slide to enter the limit arc groove on the lower side of the adjacent first limit groove 2003 and the limit arc groove on the lower side of the adjacent second limit groove 2004 respectively, the limit arc groove on the lower side of the first limit groove 2003 and the limit arc groove on the lower side of the second limit groove 2004 start to force the adjacent limit posts 2001 to deflect clockwise, the four limit posts 2001 drive the housing 1804 to deflect clockwise together, the housing 1804 drives the polishing wheel 15 to deflect clockwise together, the universal shaft 2005 starts to move downwards, the universal shaft 2005 drives the moving rod 1402 to move downwards together, so that the lower edge of a silicon carbide wafer is polished, the silicon carbide wafer is polished by the limit arc grooves 2003 and the limit arc grooves on the lower side of the adjacent limit posts 2001, the limit arc grooves on the lower side of the first limit groove 2003 and the limit arc groove 2004 start to force the adjacent limit posts 2001 to deflect clockwise, the polishing wheel 15 deflects clockwise, and the polishing wheel 15 can not move straight down the silicon carbide wafer, and the polishing edge of the silicon carbide wafer is prevented from moving straight down.
When a worker places a silicon carbide wafer on the upper side of the lower plate 5, the worker starts the second electric push rod 2101, the telescopic end of the second electric push rod 2101 starts to move upwards, the telescopic end of the second electric push rod 2101 drives the sliding plate 2102 to move upwards together, the sliding plate 2102 drives the three limiting pieces 2103 to move upwards together, the limiting pieces 2103 start to slide in the straight limiting grooves of the adjacent positioning rods 2104, the limiting pieces 2103 start to press the adjacent positioning rods 2104 upwards, the positioning rods 2104 start to deflect upwards, then the three positioning rods 2104 center the silicon carbide wafer, polishing of the silicon carbide wafer is uneven due to relative eccentricity between the axis of the silicon carbide wafer and the lower plate 5, so that polishing effect on the silicon carbide wafer is improved, when centering and fixing of the silicon carbide wafer are completed, the telescopic end of the second electric push rod 2101 drives the sliding plate 2102 to move downwards together, the sliding plate 2102 drives the three limiting pieces 2103 to move downwards together, the limiting pieces 2103 start to press the adjacent positioning rods 2104 upwards, and the limiting pieces 2104 start to press the adjacent positioning rods 2104 downwards, and after the positioning rods 2104 start to deflect downwards.
The foregoing is merely illustrative and explanatory of the principles of the invention, as various modifications and additions may be made to the specific embodiments described, or similar thereto, by those skilled in the art, without departing from the principles of the invention or beyond the scope of the appended claims.
Claims (6)
1. The utility model provides a be used for carborundum wafer edge burnishing device, its characterized in that, including support body (1), support body (1) rigid coupling has first support (2) and first electric putter (16) and sliding connection have third support (7), first support (2) rigid coupling has second support (3), second support (3) swivelling joint have with first pivot (4) swivelling joint of first support (2), first pivot (4) rigid coupling has hypoplastron (5), second support (3) be provided with first gear train (6) that first pivot (4) are connected, driving motor (8) are installed to third support (7), driving motor's (8) output shaft rigid coupling has first driving medium (9), first support (2) rigid coupling has spacing frame (10) of mirror image arrangement, mirror image arrangement between spacing frame (10) sliding connection have with third support (7) complex movable frame (11), between spacing frame (10) of mirror image arrangement is provided with first gear train (6) and first driving medium (12) and second driving medium (12) are connected with first driving medium (12) and sliding connection, the polishing device is characterized in that a second rotating shaft (1401) which is rotationally connected with the third support (7) is fixedly connected to an output shaft of the driving motor (8), a moving rod (1402) is connected to the second rotating shaft (1401) through a spline, a polishing wheel (15) is arranged on the moving rod (1402), a telescopic end of the first electric push rod (16) is fixedly connected with the third support (7), a clamping mechanism (17) is arranged on the support body (1), and a moving mechanism (18) is arranged on the second support (3);
the clamping mechanism (17) comprises a hydraulic push rod (1701), the hydraulic push rod (1701) is arranged on the upper side of the frame body (1), a moving piece (1702) which is in sliding connection with the frame body (1) is fixedly connected to the telescopic end of the hydraulic push rod (1701), a sliding rod (1703) is connected to the moving piece (1702) in a sliding manner, an elastic element (1704) is fixedly connected between the moving piece (1702) and the sliding rod (1703), and an upper plate (1705) is connected to one end, far away from the hydraulic push rod (1701), of the sliding rod (1703) in a rotating manner;
the moving mechanism (18) comprises a supporting frame (1801), the supporting frame (1801) is slidably connected to the frame body (1), the supporting frame (1801) is fixedly connected with a third support (7), a fixed shell (1802) is fixedly connected to one side, close to the hydraulic push rod (1701), of the supporting frame (1801), a guide plate (1803) is slidably connected to the fixed shell (1802), a shell (1804) is arranged on the guide plate (1803), the shell (1804) is rotatably connected with the polishing wheel (15), and a transmission assembly (19) for enabling the guide plate (1803) to move is arranged on the third support (7);
the transmission assembly (19) comprises a disc (1901), the disc (1901) is rotatably connected to one side of the third bracket (7), a second gear set (1902) is arranged on one side, close to the disc (1901), of the third bracket (7), the disc (1901) and the second rotating shaft (1401) are transmitted through the second gear set (1902), a connecting rod (1903) is hinged between the guide plate (1803) and the disc (1901), and the hinge joint of the connecting rod (1903) and the disc (1901) is located at the eccentric position of the disc (1901);
the polishing device comprises a shell (1804), and is characterized by further comprising a deflection mechanism (20) for deflecting the shell (1804), wherein the deflection mechanism (20) is arranged on the shell (1804), a guide plate (1803) is in sliding connection with the shell (1804), the deflection mechanism (20) comprises limiting columns (2001) which are arranged in a mirror mode, the limiting columns (2001) which are arranged in a mirror mode are fixedly connected to one side of the shell (1804), a limiting plate (2002) is fixedly connected to one side, close to the shell (1804), of the fixing shell (1802), a first limiting groove (2003) and a second limiting groove (2004) are formed in the limiting plate (2002), the first limiting groove (2003) and the second limiting groove (2004) are respectively matched with the adjacent limiting columns (2001), a universal shaft (2005) is fixedly connected between the moving rod (1402) and the polishing wheel (15), and a centering mechanism (21) for centering a to-be-processed object is arranged on the second support (3).
2. A polishing apparatus for silicon carbide wafer edge according to claim 1, wherein the first transmission member (9) has a truncated cone shape, and the axis of the transmission shaft (12) and the axis of the second transmission member (13) are parallel to a bus bar on a side of the first transmission member (9) close to the movable frame (11).
3. A polishing apparatus for silicon carbide wafer edge according to claim 1, wherein the distance between the hinge of the link (1903) to the disk (1901) and the axis of the disk (1901) is greater than half the length of the generatrix of the polishing wheel (15).
4. The edge polishing apparatus for a silicon carbide wafer as claimed in claim 1, wherein the first limit groove (2003) and the second limit groove (2004) are each composed of a limit straight groove and a limit arc groove arranged in mirror image, and an arc of the limit arc groove of the first limit groove (2003) is smaller than an arc of the limit arc groove of the second limit groove (2004).
5. The edge polishing device for the silicon carbide wafer according to claim 1, wherein the guide plate (1803) is an arc plate, and the circle center of the guide plate (1803), the circle center of the first limit groove (2003) and the circle center of the second limit groove (2004) are all located on a tangent line of the polishing wheel (15) near a center point of a bus bar on one side of the second bracket (3).
6. The edge polishing device for the silicon carbide wafer according to claim 1, wherein the centering mechanism (21) comprises a second electric push rod (2101), the second electric push rod (2101) is installed on the second bracket (3), a sliding plate (2102) is fixedly connected to the telescopic end of the second electric push rod (2101), the sliding plate (2102) is slidably connected with the first rotating shaft (4), a limiting piece (2103) of an annular array is fixedly connected to one side, far away from the first rotating shaft (4), of the sliding plate (2102), a positioning rod (2104) of the annular array is rotatably connected to the second bracket (3), a straight limiting groove is formed in the positioning rod (2104), and the limiting piece (2103) is matched with the straight limiting groove of the adjacent positioning rod (2104).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311743889.8A CN117415698B (en) | 2023-12-19 | 2023-12-19 | Edge polishing device for silicon carbide wafer |
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| CN202311743889.8A CN117415698B (en) | 2023-12-19 | 2023-12-19 | Edge polishing device for silicon carbide wafer |
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| JPH01103260A (en) * | 1987-10-14 | 1989-04-20 | Hitachi Ltd | Wafer polishing device |
| US5316620A (en) * | 1992-01-24 | 1994-05-31 | Shin-Etsu Handotai Co., Ltd. | Method and an apparatus for polishing wafer chamfers |
| CN102794687A (en) * | 2012-07-06 | 2012-11-28 | 浙江上城科技有限公司 | Chamfering equipment and chamfering method for sapphire wafers |
| CN203696759U (en) * | 2014-02-14 | 2014-07-09 | 中芯国际集成电路制造(北京)有限公司 | Grinding pad adjuster |
| CN114683128A (en) * | 2022-06-02 | 2022-07-01 | 成都泰美克晶体技术有限公司 | Thin wafer edge polishing equipment |
| CN116394102A (en) * | 2023-04-03 | 2023-07-07 | 广东长信精密设备有限公司 | Edge grinding machine for silicon wafer |
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2023
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01103260A (en) * | 1987-10-14 | 1989-04-20 | Hitachi Ltd | Wafer polishing device |
| US5316620A (en) * | 1992-01-24 | 1994-05-31 | Shin-Etsu Handotai Co., Ltd. | Method and an apparatus for polishing wafer chamfers |
| CN102794687A (en) * | 2012-07-06 | 2012-11-28 | 浙江上城科技有限公司 | Chamfering equipment and chamfering method for sapphire wafers |
| CN203696759U (en) * | 2014-02-14 | 2014-07-09 | 中芯国际集成电路制造(北京)有限公司 | Grinding pad adjuster |
| CN114683128A (en) * | 2022-06-02 | 2022-07-01 | 成都泰美克晶体技术有限公司 | Thin wafer edge polishing equipment |
| CN116394102A (en) * | 2023-04-03 | 2023-07-07 | 广东长信精密设备有限公司 | Edge grinding machine for silicon wafer |
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