CN117395819A - Surface electrothermal deicing structure, device and method and target object - Google Patents
Surface electrothermal deicing structure, device and method and target object Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/03—Electrodes
Abstract
The invention provides a surface electrothermal deicing structure, a device, a method and a target object, relates to the field of object surface deicing, and solves the problem that a low-energy-consumption efficient deicing system in the prior art is complex in structure. The surface electrode and the embedded electrode are used for being respectively connected with two ends of a power supply, and the surface electrode and the embedded electrode can be electrically connected through the icicle to heat the icicle by taking the icicle as a resistor. The invention utilizes the via hole to form the ice column, so that the ice column is heated and vaporized by a simple and easy-to-maintain layered electric heating structure with lower energy consumption after a power supply is connected between the surface electrode and the embedded electrode, and the vaporized ice column impacts the ice layer to cause the ice layer to generate stress cracking and peeling.
Description
Technical Field
The invention relates to the field of object surface deicing, in particular to a surface electrothermal deicing structure, a surface electrothermal deicing device utilizing the surface electrothermal deicing structure, a target object provided with the surface electrothermal deicing device and a method for electrically deicing the surface of the target object by utilizing the surface electrothermal deicing device.
Background
Under the influence of low-temperature climates such as polar regions, cold regions and the like, the hulls, superstructure and various devices of sailing ships and marine equipment can cover a large amount of ice and snow, so that the draft and the gravity center of the ship are changed, and the stability of the ship and the reliability of superstructure structures are reduced; the large amount of ice build up on the equipment can also affect the operation of the equipment, bringing serious safety risks. At present, deicing agents or resistance heating are mostly used for deicing ships and marine equipment, but the deicing efficiency is low in a resistance heating mode, and the energy consumption is high. In the field of aircraft icing and deicing, the existing deicing technology mainly comprises hot air deicing, electric heating deicing prevention, airbag deicing, antifreeze liquid deicing prevention, mechanical deicing and the like. The electric heating deicing mode is a deicing mode with high flexibility, simple structure and little weight increment, and has two working modes of electric heating deicing and electric heating deicing. The electrothermal deicing mode allows a small amount of ice accumulation on the front edge of the wing, melts the small amount of ice accumulation on the front edge of the wing by adopting an intermittent heating strategy, and periodically removes the small amount of ice accumulation on the front edge of the wing, thereby achieving the purpose of maintaining flight safety with lower electricity consumption energy cost. But the heating deicing efficiency of the electrothermal deicing mode is still low.
In order to improve deicing efficiency while reducing energy consumption, some prior art adopts a scheme of combining an electric vortex heater and a striking force generator, and the electric vortex heater and the striking force generator are arranged in a partition manner in the wing spanwise direction, and a sequential strategy is used for sequentially deicing the whole wing area so as to realize efficient deicing with lower energy consumption. In the other prior art, the ultrasonic wave and the electrothermal method are combined with each other, so that the electric energy consumption required by the deicing system can be greatly reduced, and the deicing effect is better.
However, the prior art adopts a deicing scheme mainly based on electric heating and combined with an active deicing technology, belongs to a low-energy-consumption efficient deicing system, and can be used for deicing with low energy consumption, but is relatively complex in system design, and is difficult to consider both structural weight and maintenance cost.
Disclosure of Invention
The invention aims to design a surface electrothermal deicing structure, a device, a method and a target object, which are used for solving the problem that the existing low-energy-consumption efficient deicing system is complex in structure.
The invention is realized by the following technical scheme:
the invention provides a surface electrothermal deicing structure, which comprises an insulating layer, and a surface electrode and a buried electrode which are respectively arranged on the upper surface and the lower surface of the insulating layer; the insulating layer is provided with at least one through hole which penetrates up and down; at least part of the top end orifice of the via hole is exposed to the surface electrode, so that liquid can enter the via hole from the top end orifice of the via hole to be condensed into an ice column; the surface electrode and the embedded electrode are used for being respectively connected with two ends of a power supply, wherein the surface electrode and the embedded electrode can be electrically connected through the icicle to heat the icicle by taking the icicle as a resistor.
When the structure is adopted, in the process of forming the ice layer by freezing the surface layer of the surface electrothermal deicing structure, the through hole is formed in the insulating layer, and the surface electrode does not completely shield the top end orifice of the through hole, so that part of liquid forming the ice layer can enter the through hole to be condensed, and an ice column connected to the bottom of the covering layer of the ice layer is formed. Therefore, the ice column can be used as a connecting resistor to directly connect the surface electrode and the embedded electrode to form a loop, after the surface electrode and the embedded electrode are connected with a power supply, the power supply can apply voltage between the surface electrode and the embedded electrode, and the ice column is used as a resistor to heat the ice column to vaporize. The existence of the via hole enables the icicle in the via hole to be vaporized and expanded along the axial direction after the temperature is raised, the air pressure in the via hole is improved, the covering layer of the icicle is extruded and impacted, the adhesion force between the icicle and the surface layer of the surface electrothermal deicing structure is reduced, the icicle is caused to break at the position of the icicle due to structural stress, and further the icicle is peeled off from the surface layer of the surface electrothermal deicing structure, so that deicing is realized. Therefore, the surface electrothermal deicing structure can only rely on a simple layered electrothermal structure similar to the structure of the traditional electrothermal deicing system, utilizes mechanical stress to deicing, does not depend on an additional force generator and an ultrasonic deicing device, is simpler in structure, has better maintainability, and still has higher deicing efficiency and lower energy consumption in function.
Further, in order to better realize the invention, the following arrangement structure is adopted: the insulating layer is provided as a flexible layer or as a rigid layer and/or the surface electrode and the buried electrode are provided as flexible members.
When the structure is adopted, the insulating layer is a flexible element, and the surface electrode and the embedded electrode are flexible elements, the surface electrothermal deicing structure can be conveniently distributed on any shape in a large range.
Further, in order to better realize the invention, the following arrangement structure is adopted: and the inner wall of the through hole is provided with a conductive layer, the conductive layer is electrically connected with the surface electrode and the embedded electrode, and the conductive layer can serve as a resistor to heat the icicle.
When the structure is adopted, when the fresh water or cloud field ice forms the icicle in the through hole, the existence of the conductive layer can improve the conductivity between the surface electrode and the embedded electrode, and the icicle is heated by utilizing the high resistance of the conductive layer as a resistor, so that the heating efficiency of the icicle is improved, the surface electrothermal deicing structure provided with the conductive layer is suitable for weak conductive media which are frozen into the icicle under the fresh water or cloud field environment, and the surface electrothermal deicing structure used under the environment has good deicing capability.
Further, in order to better realize the invention, the following arrangement structure is adopted: the sum of the cross-sectional areas of all the vias is less than 10% of the upper surface area of the insulating layer.
Further, in order to better realize the invention, the following arrangement structure is adopted: an insulating coating is attached to the upper surface of the surface electrode, and a hydrophobic layer or an icephobic layer is attached to the surface of the insulating coating.
Further, in order to better realize the invention, the following arrangement structure is adopted: the via holes are arranged in a plurality, and all the via holes form a two-dimensional array on the insulating layer.
Further, in order to better realize the invention, the following arrangement structure is adopted: the surface electrode comprises a plurality of strip-shaped upper electrode plates, each upper electrode plate is arranged corresponding to at least one through hole, wherein all the upper electrode plates form a linear array on the upper surface of the insulating layer along the width direction of the upper electrode plates, or grid-shaped electrodes are formed by crisscross.
When the arrangement structure is adopted, the upper polar plate forms a linear array or grid-shaped electrode, so that a smaller area on the insulating layer can be covered on the premise of having corresponding functions, and the dead weight and the structural cost are reduced.
Further, in order to better realize the invention, the following arrangement structure is adopted: the upper surface of the upper polar plate is provided with an air guide groove which is laterally communicated with the top end orifice of the through hole and used for guiding the heated and vaporized part of the icicle to diffuse along the air guide groove to the far distance of the through hole.
By adopting the arrangement structure, after the icicle is vaporized, the air guide groove arranged on the upper surface of the upper polar plate can be expanded and expanded, so that the regional stripping effect is generated on the covering layer of the ice layer in a larger range, the whole adhesive force of the ice layer is reduced, and the deicing effect is improved.
Further, in order to better realize the invention, the following arrangement structure is adopted: the embedded electrode comprises a plurality of strip-shaped lower electrode plates, wherein each lower electrode plate is arranged corresponding to at least one through hole and exposes or at least partially shields the bottom end hole opening of the through hole, and all the lower electrode plates form a linear array on the lower surface of the insulating layer along the width direction of the lower electrode plates or form grid-shaped electrodes in a crisscross manner; or, the embedded electrode is provided as a plate electrode entirely covering the lower surface of the insulating layer.
Further, in order to better realize the invention, the following arrangement structure is adopted: the distance between two adjacent through holes is larger than or equal to four times of the aperture of the through holes.
The invention also provides a surface electrothermal deicing device, which comprises a power supply and the surface electrothermal deicing structure, wherein the power supply is a pulse power supply for providing low-voltage and high-current electric energy; the surface electrode and the embedded electrode of the surface electrothermal deicing structure are respectively connected with two ends of the power supply.
When the structure is adopted, the surface electrothermal deicing structure is heated and gasified in a short time through the surface electrode and the icicles in the embedded electrode, so that the outward diffusion of heat generated by long-time heating is avoided, the heat transfer loss of the structure is reduced, and the energy consumption in deicing is saved.
The invention also provides a target object, wherein the surface electrothermal deicing device is arranged on the target object, and the target object comprises an anti-icing surface with deicing requirements; the anti-icing surface is used as a buried electrode of the surface electrothermal ice removing device, or the buried electrode of the surface electrothermal ice removing device is connected to the anti-icing surface so that the surface electrothermal ice removing device covers the anti-icing surface.
The invention also provides a surface electric deicing method, which comprises the following steps of S1: the electric heating deicing structure is arranged at the position with deicing requirement on the target object; step S2: when an ice layer is formed on the surface of the surface electrothermal ice removing structure and ice is required to be removed, low-voltage and high-current pulses are applied between the surface electrode and the embedded electrode of the surface electrothermal ice removing structure to remove the ice.
The invention has the following advantages and beneficial effects:
in the process of forming the ice layer by icing the surface layer of the surface electrothermal deicing structure, the insulating layer is provided with the through holes, and the surface electrodes incompletely shield the top end openings of the through holes, so that part of liquid forming the ice layer can enter the through holes to be condensed, and an ice column connected to the bottom of the covering layer of the ice layer is formed. Therefore, the ice column can be used as a connecting resistor to directly connect the surface electrode and the embedded electrode to form a loop, after the surface electrode and the embedded electrode are connected with a power supply, the power supply can apply voltage between the surface electrode and the embedded electrode, and the ice column is used as a resistor to heat the ice column to vaporize. The existence of the via hole enables the icicle in the via hole to be vaporized and expanded along the axial direction after the temperature is raised, the air pressure in the via hole is improved, the covering layer of the icicle is extruded and impacted, the adhesion force between the icicle and the surface layer of the surface electrothermal deicing structure is reduced, the icicle is caused to break at the position of the icicle due to structural stress, and further the icicle is peeled off from the surface layer of the surface electrothermal deicing structure, so that deicing is realized. Therefore, the surface electrothermal deicing structure can only rely on a simple layered electrothermal structure similar to the structure of the traditional electrothermal deicing system, utilizes mechanical stress to deicing, does not depend on an additional force generator and an ultrasonic deicing device, is simpler in structure, has better maintainability, and still has higher deicing efficiency and lower energy consumption in function.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural view of a surface electrothermal ice detachment structure;
FIG. 2 shows one positional relationship of the via holes with the upper and lower plates;
fig. 3 is a partial enlarged view of a portion a in fig. 2;
FIG. 4 is a side view of FIG. 2;
FIG. 5 is an enlarged partial view of portion B of FIG. 4, illustrating exemplary connection of the power source to the upper and lower plates;
FIG. 6 illustrates one positional relationship of the bottom plate and the vias, with one bottom plate removed to reveal a row of vias, and with a row of vias fully obscured by the bottom plate revealed in phantom;
FIG. 7 illustrates a surface-covered ice layer structure of a surface electrothermal ice detachment structure;
FIG. 8 is an enlarged view of part C of FIG. 7 showing the structure under the ice layer in phantom;
FIG. 9 is a diagram showing the connection of an ice layer to a surface electrothermal ice detachment structure;
fig. 10 shows a layered structure of an ice layer and a surface electrothermal ice detachment structure.
Marked in the figure as:
1. an upper polar plate; 11. a transverse groove; 12. a longitudinal groove;
2. an insulating layer; 21. a via hole;
3. a lower polar plate;
4. a conductive layer;
5. an ice layer; 51. an ice column;
6. and a power supply.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
In the description of the present invention, it is to be noted that, unless otherwise indicated, the meaning of "plurality" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
In the field of aircraft icing and deicing, the existing deicing technology mainly comprises hot air deicing, electric heating deicing prevention, airbag deicing, antifreeze liquid deicing prevention, mechanical deicing and the like. The electric heating deicing mode is a deicing mode with high flexibility, simple structure and little weight increment, and has two working modes of electric heating deicing and electric heating deicing. The electrothermal deicing mode allows a small amount of ice accumulation on the front edge of the wing, melts the small amount of ice accumulation on the front edge of the wing by adopting an intermittent heating strategy, and periodically removes the small amount of ice accumulation on the front edge of the wing, thereby achieving the purpose of maintaining flight safety with lower electricity consumption energy cost. But the heating deicing efficiency of the electrothermal deicing mode is still low.
The inventor finds that in the related technology, the working mode of electrothermal deicing allows a small amount of ice accumulation on the front edge of the wing, and the electrothermal deicing system periodically removes the small amount of ice accumulation on the front edge of the wing by adopting an intermittent heating strategy, but because of thermal inertia and the existence of heating time allowance, the heated melting water or incoming water drops cannot freeze in a heating area of the front edge of the wing, but ice nodules are formed after overflowing to the rear of the heating area, so that the aerodynamic performance of the wing is reduced, and the flight safety is affected.
In addition, the conventional electric heating method adopts a large-area conductive material to be connected with a power supply, and heats the electric heating device in a manner of generating joule heat, so that a large amount of ineffective heat convection and heat conduction loss are generated relative to the areas such as external air flow, a protective layer, a skin and the like, the energy utilization rate is low, and the heating deicing efficiency is still low.
In one aspect, the present application provides a surface electrothermal ice detachment structure, as shown in fig. 1-10, particularly configured to:
the lower surface of the surface electrothermal deicing structure is used for connection of the load-bearing object to provide deicing function to relevant parts on the load-bearing object, and the upper surface of the surface electrothermal deicing structure is used for direct contact with the environment to form the ice layer 5 to be removed.
As shown in fig. 1 to 6, the surface electrothermal deicing structure includes a surface electrode, an insulating layer 2 and a buried electrode laminated and fixed in this order from top to bottom. The surface electrode and the buried electrode are carried on the upper and lower surfaces of the insulating layer 2, respectively, separated by the insulating layer 2. The surface electrothermal deicing structure can be manufactured by adopting the current mature PCB manufacturing process. The surface electrothermal ice detachment structure is generally fabricated as a thin layer structure.
The insulating layer 2 is provided with at least one via 21, such as one, two or more. The via hole 21 penetrates up and down along the thickness direction of the insulating layer 2, and the hole pattern of the via hole 21 is generally circular, but may be polygonal, such as rectangular, triangular, or the like, or elliptical or irregular holes according to actual needs. The shape of the hole of the through-hole 21 determines the general shape in which the liquid entering the through-hole 21 can be condensed, for example, a generally cylindrical icicle 51 can be formed in the circular through-hole 21.
The surface electrode is attached to the upper surface of the insulating layer 2 while the surface electrode is disposed adjacent to the via hole 21 such that at least part of the top end aperture of the via hole 21 is exposed to the surface electrode. Liquid can enter the through-hole 21 from the top end orifice of the through-hole 21 to be coagulated into the icicle 51 as shown in fig. 9 and 10.
The buried electrode is attached to the lower surface of the insulating layer 2, and at the same time, the buried electrode may shield at least a portion of the bottom end opening of the via hole 21 from the buried electrode, or the buried electrode may completely expose the bottom end opening of the via hole 21, as long as the icicles 51 formed in the via hole 21 can be brought into contact with the buried electrode.
The surface electrothermal deicing structure, when used for deicing, requires that the surface electrode and the buried electrode be connected to both ends of a power source, respectively, to apply a voltage across the surface electrode and the buried electrode located at both ends of the via hole 21. As shown in fig. 10, when the surface of the surface electrothermal deicing structure is frozen to form the ice layer 5, the pillars 51 are formed in the via holes 21, and the surface electrodes and the embedded electrodes can be electrically connected through the pillars 51 to heat the pillars 51 by using the pillars 51 as a resistor.
In this embodiment, in the process of forming the ice layer 5 by freezing the surface layer of the surface electrothermal deicing structure, the insulating layer 2 is provided with the via hole 21, and the surface electrode does not completely cover the top end opening of the via hole 21, so that part of the liquid forming the ice layer 5 can enter into the via hole 21 to be condensed, and the icicle 51 connected to the bottom of the cover layer of the ice layer 5 is formed. In this way, the icicle 51 can be used as a connecting resistor to directly connect the surface electrode and the embedded electrode to form a loop, after the surface electrode and the embedded electrode are connected to the power supply 6, the power supply 6 can apply voltage between the surface electrode and the embedded electrode, and the icicle 51 is used as a resistor to heat the icicle 51 to vaporize. The existence of the through hole 21 enables the ice column 51 in the through hole to be vaporized and expanded along the axial direction after the temperature is raised, the air pressure in the through hole 21 is improved, the covering layer of the ice layer 5 is extruded and impacted, the adhesion force between the ice layer 5 and the surface layer of the surface electrothermal deicing structure is reduced, the ice layer 5 is caused to break at the position of the ice column 51 due to structural stress, and further the ice is peeled off from the surface layer of the surface electrothermal deicing structure, so that deicing is realized.
Therefore, the surface electrothermal deicing structure in the embodiment fully utilizes the advantages of the electrothermal deicing system, such as simple structure and ice control, and utilizes steam pressure to realize impact on the ice layer 5, thereby realizing the purposes of reducing the adhesion force at the bottom of the ice layer 5 and promoting cracking and peeling of the ice layer. The surface electrothermal deicing structure can be deiced by mechanical stress only by means of a simple laminar electrothermal structure similar to the structure of the traditional electrothermal deicing system, is simpler in structure without depending on an additional force generator and an ultrasonic deicing device, has better maintainability, and has higher deicing efficiency and lower energy consumption in function.
According to some alternative embodiments, the insulating layer 2 may be a rigid or flexible layer made of an insulating material such as paper base, glass fiber base, mylar, polyimide, and aluminum-based or copper-based bonding resin, which are commonly used in PCB boards. When the insulating layer 2 is a flexible layer, the surface electrode and the embedded electrode are arranged as flexible members, so that the surface electrothermal deicing structure can be conveniently distributed on any shape in a large range, such as complex curved surfaces of wings, fan blades and the like.
According to some alternative embodiments, the inner walls of the via holes 21 are formed with a thin conductive layer 4 having high resistance characteristics by an electroplating process, and as shown in fig. 5, the conductive layer 4 is exemplarily disposed in some of the via holes 21. Wherein the conductive layer 4 is electrically connected with the surface electrode and the buried electrode.
Aiming at the weak conductive medium of the ice column 51 formed by the fresh water and the cloud and fog fields, the conductive layer 4 is electrically connected with the surface electrode and the embedded electrode, so that the conductivity between the surface electrode and the embedded electrode can be ensured, the high resistance of the conductive layer 4 is utilized to heat the ice column 51 as a resistor, which is equivalent to heating the ice column 51 as a heating cavity, the heating efficiency of the ice column 51 is improved, and the surface electrothermal deicing structure provided with the conductive layer 4 is suitable for the weak conductive medium which is frozen into the ice column 51 in the fresh water and cloud and fog fields environment, so that the surface electrothermal deicing structure used in the environment has good deicing capability.
The conductive layer 4 is typically 50Ω or more.
If the surface electrothermal deicing structure aims at weak conductive media such as icicles 51 formed by sea water and sea ice, the icicles 51 have better conductivity than fresh water and cloud field icing, and the inner wall of the through hole 21 of the insulating layer 2 can be free from being plated with the conductive layer 4.
According to some alternative embodiments, the upper surface of the surface electrode is attached with an insulating coating, and on the sub-basis, a hydrophobic layer or an icephobic layer can be attached on the surface of the insulating coating, so as to enhance the hydrophobicity of the surface electrode to reduce icing, or enhance the icephobic capability of the surface to make the ice layer 5 easily peel off. When the surface electrodes are arranged in a linear array of a plurality of upper plates 1 as shown in fig. 1, an insulating coating covers the upper surface of each upper plate 1.
According to some alternative embodiments, as shown in fig. 1, a plurality of via holes 21 are provided on the insulating layer 2, and all the via holes 21 form a two-dimensional array on the insulating layer 2.
According to some alternative embodiments, all the via holes 21 are formed on the insulating layer 2 in a two-dimensional array, and the surface electrode is regularly arranged on the upper surface of the insulating layer 2, specifically, as shown in fig. 1, the surface electrode includes a plurality of strip-shaped upper electrode plates 1, and each upper electrode plate 1 is tightly fixed on the upper surface of the insulating layer 2 by its lower surface. The surface electrode may be formed by all the upper electrode plates 1 in various structures, for example, as shown in fig. 1, all the upper electrode plates 1 are formed in a linear array on the upper surface of the insulating layer 2 along the width direction of the upper electrode plates 1, for example, all the upper electrode plates 1 are formed in a grid-like electrode in a crisscrossed manner on the upper surface of the insulating layer 2, and the thickness at the crossing node of each upper electrode plate 1 is set to be consistent with the thickness of a single upper electrode plate 1, so that the upper surface of the surface electrode is substantially planar.
In the surface electrode, each upper electrode plate 1 is disposed corresponding to at least one via hole 21, for example, as shown in fig. 1, one upper electrode plate 1 corresponds to a row of nine via holes 21 on the insulating layer 2.
As shown in fig. 3 and 10, the upper plate 1 in a bar shape is offset from the top aperture of the via hole 21 so as to expose the top aperture portion of the via hole 21. Of course, the strip-shaped upper electrode plate 1 may have one side edge tangent to the top end opening edge of the via hole 21, so as to completely expose the top end opening of the via hole 21. Of course, the strip-shaped upper polar plate 1 can also be arranged along a row of through holes 21, and the top end openings of the through holes 21 are completely or partially exposed by forming through holes with a certain aperture on the upper polar plate 1.
In this embodiment, the upper electrode plate 1 is formed into a linear array or grid electrode, so that a smaller area on the insulating layer 2 can be covered on the premise of having corresponding functions, and dead weight and structural cost are reduced.
According to alternative embodiments, all vias 21 are formed in a two-dimensional array on the insulating layer 2, and the buried electrode may be arranged regularly on the lower surface of the insulating layer 2, like the surface electrode formed by a plurality of upper electrode plates 1, in which case the buried electrode comprises a plurality of strip-shaped lower electrode plates 3, each of which lower electrode plates 3 is fixed with its upper surface in close contact to the lower surface of the insulating layer 2, as shown in fig. 2 and 6. The surface electrode may be formed in various structures by all the upper electrode plates 1, for example, as shown in fig. 2, all the lower electrode plates 3 are formed in a linear array on the lower surface of the insulating layer 2 along the width direction of the lower electrode plates 3, and for example, all the lower electrode plates 3 are formed in a grid-like electrode in a crisscrossed manner on the lower surface of the insulating layer 2, and the thickness at the crossing node of each lower electrode plate 3 is set to be consistent with the thickness of a single lower electrode plate 3 so that the lower surface of the embedded electrode is substantially planar for better connection to the surface of the object.
In the buried electrode, each lower plate 3 is disposed corresponding to at least one via 21, such as shown in fig. 2, 3 and 6, and one lower plate 3 corresponds to a row of nine vias 21 on the insulating layer 2.
As shown in fig. 2, 3 and 6, the strip-shaped lower plate 3 completely shields the bottom end opening of the via hole 21. Of course, the strip-shaped lower electrode plate 3 may be offset from the bottom hole of the via hole 21, so as to expose the bottom hole of the via hole 21, as shown in fig. 3, where the upper electrode plate 1 is offset from the top hole of the via hole 21. Of course, the strip-shaped lower polar plate 3 may also have one side edge tangent to the bottom end orifice edge of the via hole 21, so as to completely expose the via hole 21. Of course, the strip-shaped lower polar plate 3 can also be arranged along a row of through holes 21, and the bottom end openings of the through holes 21 are completely or partially exposed by forming through holes with a certain aperture on the lower polar plate 3.
In this embodiment, the lower electrode plate 3 forms a linear array or grid electrode, which can cover a smaller area on the insulating layer 2 on the premise of having corresponding functions, thereby reducing dead weight and structural cost.
According to alternative embodiments, the buried electrode may also be a plate electrode entirely covering the lower surface of the insulating layer 2, so that the buried electrode completely shields the bottom openings of all vias 21. The lower electrode plate 3 is a whole plate electrode, and when the surface electrothermal deicing structure is arranged on the target object, the embedded electrode can be provided on the target object, such as a skin with conductivity on the wing or the fan blade, so that the arrangement of electrode materials can be saved.
According to some alternative embodiments, the upper surface of the upper polar plate 1 is provided with an air guide groove, and the air guide groove is laterally communicated with the top end orifice of the through hole 21, so as to guide the heated and vaporized part of the icicle 51 to diffuse along the air guide groove far away from the through hole 21.
As shown in fig. 3, an air guide groove is exemplarily provided on the upper surfaces of two of the upper plates 1. The air guide grooves include a lateral groove 11 extending in the width direction of the upper plate 1 and a longitudinal groove 12 extending in the length direction of the upper plate 1.
In fig. 3, a longitudinal groove 12 is formed on the upper surface of one of the upper electrode plates 1, and a transverse groove 11 is formed, wherein the transverse groove 11 intersects with the longitudinal groove 12, so that steam can smoothly diffuse between the transverse groove 11 and the longitudinal groove 12. The number of the horizontal grooves 11 and the number of the via holes 21 are 1:1 or 2:1. When the top end orifice of the upper polar plate 1 and the through hole 21 are arranged in a staggered manner or one side edge of the upper polar plate 1 is tangent to the top end orifice of the through hole 21, the transverse grooves 11 are arranged in one-to-one correspondence with the through holes 21. When the upper plate 1 is disposed along a row of via holes 21 and the via holes 21 are completely or partially exposed through the via holes with a certain aperture formed in the upper plate 1, the transverse grooves 11 and the via holes 21 may be disposed in one-to-one correspondence, or one transverse groove 11 may be disposed on each of two opposite sides of one via hole 21 in the radial direction.
In fig. 3, only one longitudinal groove 12 extending along the length direction of the upper plate 1 is formed on the upper surface of the other upper plate 1.
Of course, only the transverse grooves 11 may be formed in the upper surface of the upper plate 1.
Preferably, the longitudinal grooves 12 are configured as through grooves.
Preferably, the lateral grooves 11 are provided as through grooves so that the steam formed by vaporization of the icicles 51 can more easily enter the lateral grooves 11 and spread away.
In this embodiment, after the icicle 51 is vaporized, the air guide groove provided along the upper surface of the upper polar plate 1 can expand, thereby generating an area stripping effect on the cover layer of the larger-range ice layer 5, reducing the overall adhesion of the ice layer 5 and improving the deicing effect.
According to some alternative embodiments, the pitch of two adjacent vias 21 is greater than or equal to four times the aperture of the via 21, and it is preferable if the pitch of two adjacent vias 21 is greater than ten times the aperture of the via 21. Preferably, the sum of the cross-sectional areas of all vias 21 is simultaneously less than 10% of the upper surface area of insulating layer 2. So that the area where the steam is generated by the heating icicle 51 occupies only a small part of the whole surface electrothermal deicing structure, and a punctiform electrothermal deicing mode is formed.
In this embodiment, the minimum dimensions of the upper plate 1 and the lower plate 3 should be made as small as possible on the premise that the icicles 51 are heated smoothly to vaporize and remove ice. For example, the materials of the upper electrode plate 1 and the lower electrode plate 3 can be common corrosion-resistant metals such as copper and aluminum, and high-temperature-resistant conductive materials such as tungsten and graphite. In the case of a low voltage, high current pulse power source connected between the upper plate 1 and the lower plate 3, some parameters of the upper plate 1 may be set as: the thickness of the section is less than or equal to 200um, the width is less than or equal to 1mm, the withstand current is more than or equal to 3A, and the resistance is less than or equal to 10 omega/m; the material of the lower polar plate 3 can be common corrosion-resistant metals such as copper and aluminum, and high-temperature-resistant conductive materials such as tungsten and graphite, and some parameters of the lower polar plate 3 can be set as follows: the thickness of the section is less than or equal to 200um, the width is less than or equal to 1mm, the withstand current is more than or equal to 3A, and the resistance is less than or equal to 10 omega/m; the thickness of the insulating layer 2 is generally less than or equal to 2mm.
In another aspect, the present application provides a surface electrothermal ice detachment apparatus, in particular, using the following arrangement:
the surface electrothermal ice detachment apparatus includes a power source 6 and the surface electrothermal ice detachment structure in any of the embodiments described above. The power supply 6 is arranged as a pulsed power supply providing low voltage, high current power. The surface electrode and the embedded electrode of the surface electrothermal deicing structure are respectively connected with two ends of the power supply 6.
As shown in fig. 5, the surface electrode comprises an upper electrode plate 1, the embedded electrode comprises a lower electrode plate 3, two ends of a power supply 6 are respectively connected with the upper electrode plate 1 and the lower electrode plate 3, and voltage is applied to the upper electrode plate 1 and the lower electrode plate 3. Wherein, in the case that the surface electrode comprises a plurality of upper electrode plates 1, all upper electrode plates 1 are sequentially connected in series or sequentially connected in parallel, and in the case that the embedded electrode comprises a plurality of lower electrode plates 3, all lower electrode plates 3 are sequentially connected in series or sequentially connected in parallel. The surface electrothermal deicing structure is connected with a low-voltage high-current pulse power supply through the surface electrode and the embedded electrode, so that the icicles 51 in the via holes 21 can be heated and vaporized in a short time, the outward diffusion of heat generated by long-time heating is avoided, the heat transfer loss of the structure is reduced, and the energy consumption during deicing is saved.
According to the surface electrothermal deicing device in some embodiments of the application, the upper polar plate 1 and the lower polar plate 3 which are arranged in an array manner on the surface electrothermal deicing structure can be subjected to pulse deicing through a pulse deicing method of the electrothermal array, the advantages of simple structure and ice prevention control of an electrothermal deicing system are fully utilized, pulse deicing is carried out on a local area on the structure of the thin ice layer 5, the ice column 51 is enabled to be quickly vaporized, impact on the ice layer 5 is achieved through steam pressure, and the purposes of reducing adhesion force at the bottom of the ice layer 5 and promoting cracking and peeling of the ice layer 5 are achieved.
In another aspect, the present application provides an object, in particular using the following arrangement:
the object is provided with the surface electrothermal deicing device in the embodiment, and the object can be a wing of an aircraft, and can be a ship body, a superstructure, various devices and the like assembled by ships or maritime works. The target includes an anti-icing surface having deicing requirements. When the anti-icing surface of the object is metal, the anti-icing surface of the object can be used as the embedded electrode of the surface electrothermal ice removing structure in the surface electrothermal ice removing device, and besides, the embedded electrode of the surface electrothermal ice removing structure in the surface electrothermal ice removing device needs to be fixedly connected to the anti-icing surface of the object so that the surface electrothermal ice removing structure of the surface electrothermal ice removing device covers the anti-icing surface.
In another aspect, the present application provides a method of electrically deicing a surface using a surface electrothermal deicing structure to deicing an anti-icing surface having deicing requirements on a target, comprising the steps of:
the surface electrothermal ice removing structure in any embodiment is firstly arranged on the anti-icing surface of the target object, and if the anti-icing surface of the target object is metal, the anti-icing surface can be used as an embedded electrode of the surface electrothermal ice removing structure.
And then the surface electrode and the embedded electrode of the surface electrothermal deicing structure are connected to a power supply 6. The power supply is preferably a low-voltage high-current pulse power supply.
As shown in fig. 7 to 10, when an ice layer 5 is formed on the surface of the surface electrothermal ice removing structure, that is, the surface electrode and the surface of the insulating layer 2 and ice removal is required, the power supply 6 is turned on, and a low-voltage, high-current pulse is applied between the surface electrode and the buried electrode to perform ice removal. The low-voltage and high-current pulse power supply can be controlled by an upper computer, and is combined with a solid-state relay to realize high-current pulse heating of the icicle 51 under a certain voltage so as to reduce the total energy requirement of the system.
In the fresh water or cloud environment, a surface electrothermal deicing structure without a conductive layer 4 in a through hole 21 is adopted, an ice layer 5 formed by fresh water icing is formed on the surface of the surface electrothermal deicing structure, an ice column 51 formed in the through hole 21 in the ice layer 5 is used as a resistor by utilizing the high resistance characteristic of the thin conductive layer 4 in the through hole 21, the ice column 51 is electrically heated, the ice column 51 is quickly vaporized, the ice layer 5 is broken by impacting the ice layer 5 through steam, the adhesion of the ice layer 5 is reduced, and the ice layer 5 is peeled off, so that the deicing purpose is achieved. In the seawater environment, a surface electrothermal deicing structure with a conductive layer 4 arranged in a through hole 21 is adopted, an ice layer 5 formed by seawater freezing is formed on the surface of the surface electrothermal deicing structure, the ice column 51 formed in the through hole 21 in the ice layer 5 is used as a resistor by utilizing the low conductivity characteristic of the ice column 51 in the through hole 21, the ice column 51 is electrically heated, the ice column 51 is quickly vaporized, the ice layer 5 is broken by steam impacting the ice layer 5, the adhesion of the ice layer 5 is reduced, the ice layer 5 is peeled off, and the deicing purpose is achieved.
The icicle 51 is heated by low-voltage and high-current pulses provided by the low-voltage and high-current pulse power supply, so that the icicle 51 can be heated and vaporized in a short time, the overall thermal effect is weak, the structural heat transfer loss is low, and the deicing energy consumption is low.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention.
Claims (10)
1. The utility model provides a surface electric heat deicing structure which characterized in that: comprises an insulating layer (2), and surface electrodes and embedded electrodes which are respectively arranged on the upper surface and the lower surface of the insulating layer (2);
the insulating layer (2) is provided with at least one through hole (21) which penetrates up and down;
at least part of the top end aperture of the via (21) is exposed to the surface electrode such that liquid can enter the via (21) from the top end aperture of the via (21) to condense into an ice column (51);
the surface electrode and the embedded electrode are used for being respectively connected with two ends of a power supply, wherein the surface electrode and the embedded electrode can be electrically connected through the ice column (51) so as to heat the ice column (51) by taking the ice column (51) as a resistor.
2. A surface electrothermal deicing structure as set forth in claim 1, wherein: the insulating layer (2) is provided as a flexible layer or as a rigid layer and/or the surface electrode and the buried electrode are provided as flexible members.
3. A surface electrothermal deicing structure as set forth in claim 1, wherein: the inner wall of the via hole (21) is provided with a conductive layer (4), and the conductive layer (4) is electrically connected with the surface electrode and the embedded electrode so as to be capable of heating the icicle (51) as a resistor;
and/or the sum of the cross-sectional areas of all the vias (21) is less than 10% of the upper surface area of the insulating layer (2);
and/or the upper surface of the surface electrode is attached with an insulating coating, and the surface of the insulating coating is attached with a hydrophobic layer or an icephobic layer.
4. A surface electrothermal deicing structure as set forth in any one of claims 1-3, wherein: the plurality of through holes (21) are arranged, and all the through holes (21) form a two-dimensional array on the insulating layer (2).
5. A surface electrothermal deicing structure as set forth in claim 4, wherein: the surface electrode comprises a plurality of strip-shaped upper electrode plates (1), each upper electrode plate (1) is arranged corresponding to at least one through hole (21), wherein all the upper electrode plates (1) form a linear array on the upper surface of the insulating layer (2) along the width direction of the upper electrode plates (1), or grid-shaped electrodes are formed in a crisscross manner.
6. A surface electrothermal deicing structure as set forth in claim 5, wherein: the upper surface of the upper polar plate (1) is provided with an air guide groove which is laterally communicated with a top end orifice of the through hole (21) and used for guiding the heated and vaporized part of the icicle (51) to diffuse along the air guide groove to the far distance of the through hole (21).
7. A surface electrothermal deicing structure as set forth in claim 4, wherein: the embedded electrode comprises a plurality of strip-shaped lower electrode plates (3), wherein each lower electrode plate (3) is arranged corresponding to at least one through hole (21) and exposes the bottom end opening of the through hole (21) or at least partially shields the bottom end opening of the through hole (21), and all the lower electrode plates (3) form a linear array along the width direction of the lower electrode plates (3) on the lower surface of the insulating layer (2), or form grid-shaped electrodes in a crisscross manner;
or, the embedded electrode is provided as a plate electrode entirely covering the lower surface of the insulating layer (2);
or, the distance between two adjacent through holes (21) is larger than or equal to four times of the aperture of the through holes (21).
8. A surface electrothermal ice detachment apparatus, characterized in that: comprising a power source (6) and a surface electrothermal deicing structure as claimed in any one of claims 1 to 7, said power source (6) being arranged as a pulsed power source providing low voltage, high current electrical energy; the surface electrode and the embedded electrode of the surface electrothermal deicing structure are respectively connected with two ends of the power supply (6).
9. A target object, characterized in that: the surface electrothermal ice detachment apparatus of claim 8 disposed on the target, the target comprising an anti-icing surface having a need for deicing; the anti-icing surface is used as a buried electrode of the surface electrothermal ice removing device, or the buried electrode of the surface electrothermal ice removing device is connected to the anti-icing surface so that the surface electrothermal ice removing device covers the anti-icing surface.
10. A method of electrically deicing a surface, characterized by:
step S1: providing the surface electrothermal deicing structure of claim 1 at a location on a target where deicing is desired;
step S2: when an ice layer (5) is formed on the surface of the surface electrothermal deicing structure and deicing is needed, low-voltage and high-current pulses are applied between the surface electrode and the embedded electrode of the surface electrothermal deicing structure to perform deicing.
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