CN117384221B - Palladium oxalate compound, and preparation method and application thereof - Google Patents
Palladium oxalate compound, and preparation method and application thereof Download PDFInfo
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- CN117384221B CN117384221B CN202311316519.6A CN202311316519A CN117384221B CN 117384221 B CN117384221 B CN 117384221B CN 202311316519 A CN202311316519 A CN 202311316519A CN 117384221 B CN117384221 B CN 117384221B
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- -1 Palladium oxalate compound Chemical class 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 52
- 238000007747 plating Methods 0.000 claims abstract description 25
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000009713 electroplating Methods 0.000 claims abstract description 19
- 239000007787 solid Substances 0.000 claims abstract description 19
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims abstract description 12
- JSYGRUBHOCKMGQ-UHFFFAOYSA-N dichloramine Chemical compound ClNCl JSYGRUBHOCKMGQ-UHFFFAOYSA-N 0.000 claims abstract description 9
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 claims abstract description 7
- 150000001408 amides Chemical class 0.000 claims abstract description 5
- CSIFGMFVGDBOQC-UHFFFAOYSA-N 3-iminobutanenitrile Chemical compound CC(=N)CC#N CSIFGMFVGDBOQC-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000012018 catalyst precursor Substances 0.000 claims abstract description 3
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 4
- WRIRWRKPLXCTFD-UHFFFAOYSA-N malonamide Chemical compound NC(=O)CC(N)=O WRIRWRKPLXCTFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000001291 vacuum drying Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 6
- 230000003197 catalytic effect Effects 0.000 abstract description 4
- 229910052801 chlorine Inorganic materials 0.000 abstract description 2
- 239000003446 ligand Substances 0.000 abstract description 2
- 229910052700 potassium Inorganic materials 0.000 abstract description 2
- 229910052717 sulfur Inorganic materials 0.000 abstract description 2
- 230000002378 acidificating effect Effects 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- 238000009825 accumulation Methods 0.000 abstract 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052794 bromium Inorganic materials 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- YIKSCQDJHCMVMK-UHFFFAOYSA-N Oxamide Chemical compound NC(=O)C(N)=O YIKSCQDJHCMVMK-UHFFFAOYSA-N 0.000 description 4
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000012855 volatile organic compound Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UOPVJNJNEIGZIL-UHFFFAOYSA-N 2,2-dichloropropanediamide Chemical compound NC(=O)C(Cl)(Cl)C(N)=O UOPVJNJNEIGZIL-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 101150003085 Pdcl gene Proteins 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZEYZKQUPVUMZKV-UHFFFAOYSA-N dichloro carbonate Chemical compound ClOC(=O)OCl ZEYZKQUPVUMZKV-UHFFFAOYSA-N 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- ZSLOUCRTVABUPM-UHFFFAOYSA-N n-acetyl-2,2-dichloroacetamide Chemical compound CC(=O)NC(=O)C(Cl)Cl ZSLOUCRTVABUPM-UHFFFAOYSA-N 0.000 description 3
- 150000002940 palladium Chemical class 0.000 description 3
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PZKNFJIOIKQCPA-UHFFFAOYSA-N oxalic acid palladium Chemical compound [Pd].OC(=O)C(O)=O PZKNFJIOIKQCPA-UHFFFAOYSA-N 0.000 description 2
- KHPXUQMNIQBQEV-UHFFFAOYSA-N oxaloacetic acid Chemical compound OC(=O)CC(=O)C(O)=O KHPXUQMNIQBQEV-UHFFFAOYSA-N 0.000 description 2
- 150000002941 palladium compounds Chemical class 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- KKYFNWHDEWXFQV-UHFFFAOYSA-N [C].OC(=O)C(O)=O Chemical compound [C].OC(=O)C(O)=O KKYFNWHDEWXFQV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
- C07F15/0006—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table compounds of the platinum group
- C07F15/006—Palladium compounds
- C07F15/0066—Palladium compounds without a metal-carbon linkage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/86—Catalytic processes
- B01D53/8678—Removing components of undefined structure
- B01D53/8687—Organic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
- B01J23/44—Palladium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/02—Impregnation, coating or precipitation
- B01J37/0201—Impregnation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Catalysts (AREA)
Abstract
The invention discloses an oxalic acid amide palladium compound, a preparation method and application thereof, wherein the compound is [ (CH 2)n(CO)2(H2N)2]Pd(O4C2) or [ (CO) (H 2N)2]Pd(O4C2). The preparation method comprises the steps of taking palladium chloride as an initial raw material, firstly reacting with acetonitrile to obtain a diacetonitrile palladium dichloride solution, continuously adding an amide solution to obtain a dichloro amide palladium solid, and reacting the dichloro amide palladium with potassium oxalate to obtain the oxalic acid amide palladium compound. The present compounds are free of chlorine, bromine, sulfur, potassium, etc., and have several advantages in the use of the compounds in electroplating baths, for example: the acidic ion ligands do not accumulate in the plating bath, and the accumulation of acidic ions often limits the lifetime of the plating bath and affects the performance of the plating. Meanwhile, the compound can be used as a supported palladium catalyst precursor, and has the advantages of moderate pH value, low decomposition temperature, good catalytic activity and the like.
Description
Technical Field
The invention relates to an oxalic acid amide palladium compound, a preparation method and application thereof, and the compound and the preparation method thereof belong to the field of chemistry and chemical engineering.
Background
Palladium and palladium alloys have excellent corrosion resistance, wear resistance and electrical properties, bright surfaces, high thermal and electrical conductivity, and therefore palladium has a variety of applications. Palladium plating has been widely used for electronic parts such as electrical contacts, connectors, IC lead frames, and printed boards, jewelry, and the like. The main salts of the traditional palladium plating are palladium sulfate, palladium chloride, palladium nitrate and the like, which are prepared into Pd(NH3)4Cl2、Pd(NH3)2(NO3)2、Pd(NH3)2Br2、Pd(NH3)4SO4 and other palladium-ammonia complexes with ammonia water and other complexing agents, and most of the palladium plating formulas are ammonia-containing electroplating solutions. Although the synthesis technology of the palladium salt product is simple and low in cost, the following limitations and disadvantages exist: (1) The electroplating method is only suitable for electroplating of low-end products, such as bonding wires, jewelry and other industries, and the electroplating effect cannot meet the electroplating of contact materials of the electronic connector; (2) Due to the inclusion of anions such as Cl -、NO2 -、SO4 2-, the content of salt in the electroplating solution is increased along with the addition of the electroplating salt, the service life of the electroplating solution is shortened, and electroplating equipment is easy to corrode; (3) The high temperature in the electroplating process causes volatilization of ammonia water, and the operation environment is poor.
CN102015744a discloses a process for preparing a palladium (hydro) carbonate complex with an amine ligand, which is capable of moving the deposition potentials of both palladium and nickel metals close enough to form an alloy deposit.
In summary, with further development of palladium plating technology, it is necessary to develop new palladium salts to replace the conventional palladium salts.
Disclosure of Invention
The invention aims to solve the problems that a high-quality electroplated palladium layer cannot be obtained by using the traditional electroplating main salt in the electroplating process, the service life of electroplating solution is short, the electroplating process has a certain harm to the environment and operators, and the like, and provides a novel and environment-friendly electroplated palladium main salt and a simple and economic preparation method thereof.
The oxalic acid amide palladium compound has a molecular formula as follows: [ (CH 2)n(CO)2(H2N)2]Pd(O4C2) or [ (CO) (H 2N)2]Pd(O4C2); the structure is as follows:
The preparation method of the oxalic acid amide palladium compound comprises the following steps:
(1) Weighing a certain amount of acetonitrile solution in a round-bottom flask, then adding palladium chloride solid, and stirring to react to obtain a clear solution containing diacetonitrile palladium dichloride;
(2) Adding an amide solution into the solution obtained in the step (1), stirring at 40 ℃ for reaction for more than 2 hours, cooling, separating out light yellow palladium dichloroamide, filtering, and washing with cold absolute ethyl alcohol for 3 times to obtain light yellow palladium dichloroamide solid;
(3) Weighing dichloro amide palladium solid in a round bottom flask, adding potassium oxalate solution, stirring, reacting for more than 2 hours at 60-70 ℃, cooling, filtering, concentrating to a small volume under reduced pressure, cooling, filtering, washing with absolute ethyl alcohol, and then drying in vacuum for 4 hours at 65 ℃ to obtain the oxalic acid amide palladium compound.
The oxalic acid amide palladium compound is applied to electroplating or electroless palladium plating as main salt.
The oxalic acid amide palladium compound can also be used as a supported palladium catalyst precursor.
The beneficial effects of the invention include:
(1) The palladium compounds of the present invention do not contain Cl, S, P, K plasma.
(2) The palladium compound disclosed by the invention does not contain NO 3 -、NO2 -、SO4 2-、Cl-、NH3 plasma, does not shorten the service life of the electroplating solution along with the electroplating or electroless plating test, does not corrode equipment, and is environment-friendly and operator-friendly.
(3) The oxalic acid amide palladium compound is prepared under mild conditions, meets the requirements of atom economy, green environmental protection and the like, and is suitable for industrial production.
(4) The compound of the invention is used for plating main salt of palladium plating, and has the advantages of high current efficiency, long service life of plating solution, compact plating layer, high hardness and the like, and the performance is superior to that of the traditional palladium plating main salt.
(5) The Pd/Al 2O3 catalyst which is a VOCs purification catalyst prepared by using the palladium oxalate amide as a precursor and adopting an isovolumetric impregnation method has higher catalytic conversion efficiency on toluene, xylene and ethyl acetate than the catalyst prepared by using a palladium nitrate solution as the precursor.
Drawings
Fig. 1: and plating a palladium layer on the Brass Ha-plate.
Fig. 2: and SEM image of the palladium plating layer.
Fig. 3: EDS energy spectrum of the palladium plating layer.
Fig. 4: evaluation of catalytic conversion performance of toluene, isopropanol and ethyl acetate on Pd/Al2O 3-C.
Fig. 5: evaluation chart of catalytic conversion performance of toluene, isopropanol and ethyl acetate on Pd/Al2O 3-N.
Detailed Description
Example 1: preparation of palladium oxalamide
276.5G of acetonitrile is weighed into a round bottom flask, then 100g of PdCl 2 solid is added, stirring is carried out, reaction is carried out until palladium chloride solid is completely dissolved, then 230.3g of malonamide is added, stirring reaction is carried out for 2.5h at 40 ℃, cooling is carried out, light yellow dichloro malonamide palladium is separated out, filtering is carried out, and washing is carried out for 3 times by using cold absolute ethyl alcohol, thus 134.1g of light yellow dichloro malonamide palladium solid is obtained.
176.8G of potassium oxalate is weighed into a round-bottom flask, 800ml of deionized water is added, the mixture is heated to 60 ℃ until the mixture is completely dissolved, 65g of palladium dichloromalonamide solid is added under stirring, the mixture is reacted for 3.5 hours at 70 ℃, the mixture is cooled, filtered, concentrated to a small volume under reduced pressure, cooled, filtered, washed by absolute ethyl alcohol and dried for 4 hours at 65 ℃ under vacuum, and 59.1g of palladium oxalamide is obtained, and the yield is 83.3%.
Elemental analysis: measurement values Pd 35.4%, N9.3%, O32.6% were substantially identical to calculated values Pd 35.9%, N9.4%, O32.4%.
Example 2: preparation of palladium oxaloacetate
276.5G of acetonitrile is weighed into a round bottom flask, then 100g of PdCl 2 solid is added, stirring is carried out, reaction is carried out until palladium chloride solid is completely dissolved, then 199.75g of acetamide is added, stirring reaction is carried out at 40 ℃ for 2.5h, pale yellow palladium dichlorodiacetamide is separated out, filtration is carried out, and washing is carried out 3 times by using cold absolute ethyl alcohol, thus obtaining 140.68g of pale yellow palladium dichlorodiacetamide solid.
176.8G of potassium oxalate is weighed into a round-bottomed flask, 800ml of deionized water is added, the mixture is heated to 60 ℃ until the mixture is completely dissolved, 78g of palladium dichlorodiacetamide solid is added under stirring, the mixture reacts for 3 hours at 65 ℃, the mixture is cooled, filtered, concentrated to a small volume under reduced pressure, cooled and filtered, washed by absolute ethyl alcohol and dried in vacuum for 4 hours at 65 ℃ to obtain 61.88g of palladium oxaloacetate with the yield of 75.4 percent.
Elemental analysis: measurement values Pd 33.5%, N8.8%, O31% were substantially identical to calculated values Pd 34.0%, N9.0%, O30.7%.
Example 3: preparation of palladium oxalate carbonate
276.5G of acetonitrile is weighed into a round bottom flask, then 100g of PdCl 2 solid is added, stirring is carried out, reaction is carried out until palladium chloride solid is completely dissolved, then 134.53g of carbamide is added, stirring reaction is carried out for more than 2 hours at 40 ℃, cooling is carried out, light yellow palladium dichlorocarbonate is separated out, filtering is carried out, and washing is carried out for 3 times by using cold absolute ethyl alcohol, thus obtaining 110.38g of light yellow palladium dichlorocarbonate solid.
176.8G of potassium oxalate is weighed into a round-bottom flask, 800ml of deionized water is added, the mixture is heated to 60 ℃ until the mixture is completely dissolved, 85g of palladium dichlorocarbonate solid is added under stirring, the mixture reacts for 3.5 hours at 65 ℃, the mixture is cooled, filtered, concentrated to a small volume under reduced pressure, cooled, filtered, washed by absolute ethyl alcohol and dried for 4 hours at 65 ℃ in vacuum, and 91.19g of palladium oxalate is obtained, and the yield is 90.0%.
Elemental analysis: measurement Pd 41.3%, N10.7%, O31.8% were substantially identical to calculated 41.8%, N11%, O31.4%.
Example 4: application of oxalic acid carbon amide palladium as palladium plating main salt in palladium plating
The plating solution is alkalescent, and consists of: palladium content 5-12 g/L, cylinder opening agent A80-120 ml/L, additive B5-20 ml/L; adjusting the pH value to 7-8.5 by phosphoric acid and potassium hydroxide, controlling the current to 0.5A, controlling the temperature to 45-55 ℃, and mechanically stirring the anode which is a platinized titanium anode net.
The plating process is used for plating the House's groove, the substrate is a brass Hastelloy plate (65×100 mm, see figure 1), the deposition speed is 0.15 μm/min (0.6A/dm 2), the plating layer is relatively bright and compact, and the hardness of the plating layer is 280HV. SEM images and EDS images of the plating are shown in fig. 2 and 3, respectively.
Example 5: preparation of VOCs (volatile organic compounds) purification catalyst by taking palladium oxalamide as precursor and performance thereof
The Pd/Al 2O3 catalyst is prepared by adopting an immersion method, 5g (containing 2.1g of palladium) of oxalic acid malonamide palladium is weighed into a beaker, 300g of deionized water is added, 200g of alumina powder is slowly added after the oxalic acid malonamide palladium is completely dissolved, stirring is carried out, adsorption reaction is carried out for 1h, then the Pd/Al 2O3 catalyst is obtained after the Pd/Al 2O3 catalyst is put into an oven for drying at 80 ℃ for 4h and baked at 350 ℃ for 1.5h in a muffle furnace, and the Pd/Al 2O3 catalyst is recorded as Pd/Al 2O3 -C.
The same preparation method is adopted, palladium nitrate is used as a precursor to prepare the Pd/Al 2O3 catalyst, which is named as Pd/Al 2O3 -N.
Performing performance evaluation on the Pd/Al 2O3 catalyst, wherein the VOCs probe molecules are mixed gas of toluene, isopropanol and ethyl acetate, and the total concentration is 1000-5000 ppm; the test space velocity is 20000h -1, the test temperature starts to react from 150 ℃, the temperature programming is increased to 300 ℃ to finish the reaction, and the conversion efficiency is recorded. The results of the performance evaluation are shown in fig. 4 and 5.
Table 1 shows T50 and T90 (T50 is the temperature at which the conversion efficiency is 50% and T90 is the temperature at which the conversion efficiency is 90%) for both catalysts.
TABLE1 comparison of the Performance of Pd/Al 2O3 -C and Pd/Al 2O3 -N catalysts
As can be seen from Table 1, the catalyst prepared by using palladium oxalamide as a precursor has relatively good performance.
Claims (10)
1. A palladium oxalate amide compound characterized in that:
the molecular formula of the oxalic acid amide palladium compound is [ (CH 2)n(CO)2(H2N)2]Pd(O4C2), and the structure is
Where n=0, 1,2.
2. A palladium oxalate amide compound characterized in that:
The molecular formula of the oxalic acid amide palladium compound is [ (CO) (H 2N)2]Pd(O4C2), and the structural formula is
。
3. A process for producing a palladium oxalate amide compound according to claim 1 or 2, comprising the steps of:
Weighing a certain amount of acetonitrile solution in a flask, then adding palladium chloride solid, and stirring to react to obtain a clear solution containing diacetonitrile palladium dichloride;
Adding an amide solution into the solution obtained in the step (1), stirring for reaction, cooling, separating out light yellow palladium dichloroamide, filtering, and washing with cold absolute ethyl alcohol for 3 times to obtain light yellow palladium dichloroamide solid;
And (3) weighing palladium dichloroamide solid in a round-bottom flask, adding potassium oxalate solution, stirring for reaction, cooling, filtering, concentrating to a small volume under reduced pressure, cooling, filtering, washing with absolute ethanol, and vacuum drying at 65 ℃ for 4 hours to obtain the palladium oxalate amide compound.
4. A method of preparation according to claim 3, characterized in that:
In the step (1), the molar ratio of palladium chloride to acetonitrile is 1:2-6.
5. A method of preparation according to claim 3, characterized in that:
in the step (2), the amide is one of oxalyl diamine, malonamide and carboamide.
6. A method of preparation according to claim 3, characterized in that:
The molar ratio of the palladium chloride to the amide is 1:1.5-4.5.
7. A method of preparation according to claim 3, characterized in that:
in the step (3), the molar ratio of potassium oxalate to palladium dichloroamide is 1.5-3:1.
8. The method of any one of claims 3-7, wherein:
In the step (2), stirring reaction is carried out for more than 2 hours at 40 ℃;
In the step (3), the stirring reaction is carried out at 60-70 ℃ for more than 2 hours.
9. Use of a palladium oxalate amide compound according to claim 1 or 2 as a primary salt of electroplating or electroless palladium plating.
10. Use of a palladium oxalate amide compound according to claim 1 or 2as a supported palladium catalyst precursor.
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