CN117381644B - Polishing device for circuit board processing - Google Patents
Polishing device for circuit board processing Download PDFInfo
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- CN117381644B CN117381644B CN202311687230.5A CN202311687230A CN117381644B CN 117381644 B CN117381644 B CN 117381644B CN 202311687230 A CN202311687230 A CN 202311687230A CN 117381644 B CN117381644 B CN 117381644B
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- driving
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- chamber
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- 238000005498 polishing Methods 0.000 title claims abstract description 201
- 238000012545 processing Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 230000007306 turnover Effects 0.000 claims abstract description 23
- 230000000903 blocking effect Effects 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 9
- 238000013519 translation Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
- B24B29/06—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for elongated workpieces having uniform cross-section in one main direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing device for circuit board processing, which relates to the technical field of polishing, and discloses a turnover guide mechanism which is rotatably arranged in a polishing chamber, wherein the turnover guide mechanism is arranged between a first conveying belt and a second conveying belt, a circulating belt is rotatably arranged in the polishing chamber, a plurality of polishing mechanisms are fixedly arranged on the circulating belt, the polishing mechanism comprises a mounting frame, a connecting frame is slidably arranged on the mounting frame, a lifting assembly is slidably arranged on the connecting frame, the lifting assembly is used for driving the polishing assembly to lift, the polishing assembly is used for driving a polishing sheet to rotate, the turnover guide mechanism is arranged in the polishing chamber, the circuit board can be conveyed while being turned over, the polishing treatment is conveniently carried out on the two side surfaces of the circuit board, meanwhile, a lifting laminated board positioning mechanism is arranged in the polishing chamber, and the circuit board after the surface polishing can be automatically stacked.
Description
Technical Field
The invention relates to the technical field of polishing, in particular to a polishing device for circuit board processing.
Background
The circuit board has the characteristics of high wiring density, light weight, thin thickness and good flexibility.
The circuit board needs to be subjected to the process steps of cutting, punching, polishing and the like in the production and processing process. When the existing polishing device polishes the circuit board, only one side of the circuit board can be polished, and an operator is required to turn over the circuit board manually to polish the two sides of the circuit board. And after the surface of the circuit board is polished, the side polishing device is also required to polish the side edge of the circuit board, so that the polishing efficiency is not high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a polishing device for processing a circuit board.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the polishing device for circuit board processing comprises a polishing chamber, wherein a first conveying belt and a second conveying belt are rotatably arranged in the polishing chamber;
the overturning guide mechanism is rotatably arranged in the polishing chamber and is arranged between the first conveying belt and the second conveying belt;
the polishing device comprises a polishing chamber, wherein a circulating belt is rotatably arranged in the polishing chamber, a plurality of polishing mechanisms are fixedly arranged on the circulating belt, each polishing mechanism comprises a mounting frame, a connecting frame is slidably arranged on each mounting frame, a lifting assembly is slidably arranged on each connecting frame, each lifting assembly is used for driving the polishing assembly to lift, and each polishing assembly is used for driving a polishing sheet to rotate;
a guide rod is fixedly arranged in the polishing chamber and is in sliding connection with a lamination positioning mechanism;
the polishing detection head is fixedly arranged at the top of the inner wall of the polishing chamber, the display screen is fixedly arranged at the outer wall of the polishing chamber, the polishing detection head comprises a polishing detection module, and the polishing detection module is used for displaying the to-be-replaced sheets on the display screen in a sequence, specifically: the polishing detection module sequentially marks the polishing sheets, detects the diameters of the marked polishing sheets, marks the diameters of the polishing sheets as post-polishing diameters Mz, sets a post-polishing diameter threshold value as Pn, does not mark the polishing sheets with the marks when the post-polishing diameters Mz are larger than or equal to the post-polishing diameter threshold value Pn, marks the polishing sheets with the marks for replacement sheets when the post-polishing diameters Mz are smaller than the post-polishing diameter threshold value Pn, sequentially sorts the for replacement sheets according to the values of the post-polishing diameters Mz from small to large, and sequentially sorts the corresponding marks for the for replacement sheets on the display screen.
Further, a plurality of first conveying rollers are rotatably arranged in the polishing chamber, the plurality of first conveying rollers are in transmission connection through a first conveying belt, a first conveying assembly is fixedly arranged on the outer wall of the polishing chamber, and the first conveying assembly is used for driving the first conveying rollers to rotate.
Further, a plurality of second conveying rollers are rotatably arranged in the polishing chamber, the second conveying rollers are in transmission connection through a second conveying belt, a second conveying assembly is fixedly arranged on the outer wall of the polishing chamber, and the second conveying assembly is used for driving the second conveying rollers to rotate.
Further, the outer wall fixed mounting of polishing room has the flip subassembly, the flip subassembly is used for driving the rotation of upset guiding mechanism, upset guiding mechanism includes the roll-over stand, fixed mounting has two mounts in the roll-over stand, fixed mounting has two adjusting part in the mount, adjusting part one side is provided with the movable block, adjusting part is used for driving the movable block and removes, rotate on the movable block and install the rotary rod, two rotary rods all rotate and connect the alignment jig, rotate on the alignment jig and install guide belt.
Further, a plurality of guide rollers are rotatably arranged on the adjusting frame, the guide rollers are connected through guide belts in a transmission mode, a guide assembly is fixedly arranged on the adjusting frame, and the guide assembly is used for driving the guide rollers to rotate.
Further, four rotating rollers are rotatably arranged in the polishing chamber, the four rotating rollers are in transmission connection through a circulating belt, a circulating assembly is fixedly arranged on the outer wall of the polishing chamber, and the circulating assembly is used for driving the rotating rollers to rotate.
Further, the lamination positioning mechanism comprises a positioning frame, two fixed shells are fixedly arranged on the positioning frame, a positioning assembly is fixedly arranged in the fixed shells, a positioning plate is arranged on one side of the positioning assembly, the positioning assembly is used for driving the positioning plate to move, a jacking assembly is fixedly arranged on the positioning frame, a rotating assembly is arranged on one side of the jacking assembly, the jacking assembly is used for driving the rotating assembly to move, a rotating frame is arranged on one side of the rotating assembly, the rotating assembly is used for driving the rotating frame to rotate, a blocking assembly is fixedly arranged in the rotating frame, a blocking plate is arranged on one side of the blocking assembly, and the blocking assembly is used for driving the blocking plate to move.
Further, the first lead screw is rotatably installed on the installation frame, the first lead screw threaded connection link, installation frame one side fixed mounting has translation subassembly, translation subassembly is used for driving first lead screw rotation, the second lead screw is rotatably installed on the link, second lead screw threaded connection lifting unit, link one side fixed mounting has side shift subassembly, side shift subassembly is used for driving second lead screw rotation.
Further, a third screw is rotatably arranged in the polishing chamber and is in threaded connection with the lamination plate positioning mechanism, a driving assembly is fixedly arranged at the top of the outer wall of the polishing chamber, and the driving assembly is used for driving the third screw to rotate.
Furthermore, a plate inlet is formed in one side of the polishing chamber, and a plate outlet is formed in the top of the polishing chamber.
Compared with the prior art, the invention has the following beneficial effects:
1. the overturning guide mechanism is arranged in the polishing chamber, so that the circuit board can be conveyed while being overturned, the polishing treatment is conveniently carried out on the surfaces of the two sides of the circuit board, meanwhile, the polishing treatment can be carried out on the circuit board while conveying, the lamination positioning mechanism which can be lifted is arranged in the polishing chamber, the circuit board with the polished surface can be automatically stacked, the stacked circuit board can be aligned, the side edge of the circuit board is polished while moving, and the high polishing efficiency of the circuit board is ensured;
2. the polishing detection head is arranged, so that operators can intuitively know which polishing sheets need to be replaced, and the polishing sheets are convenient to replace according to the required sequence.
Drawings
FIG. 1 is a schematic diagram of a polishing apparatus for circuit board processing;
FIG. 2 is an internal structural view of the polishing chamber of the present invention;
FIG. 3 is a schematic diagram of the structure of the turnover guide mechanism of the present invention;
FIG. 4 is an internal structural view of the fixing frame of the present invention;
FIG. 5 is a schematic view of the polishing mechanism of the present invention;
FIG. 6 is a connection view of the stack positioning mechanism of the present invention;
FIG. 7 is a schematic view of the structure of the stack positioning mechanism of the present invention;
FIG. 8 is an internal structural view of the stationary housing of the present invention;
FIG. 9 is an installation view of the rotating frame of the present invention;
fig. 10 is an internal structural view of the rotating frame of the present invention.
100. A polishing chamber; 101. a plate inlet; 102. a first conveyor belt; 103. a first transport assembly; 104. a first conveying roller; 105. a second conveyor belt; 106. a second transport assembly; 107. a second conveying roller; 108. a turnover guide mechanism; 1081. a flip assembly; 109. a roll-over stand; 110. a fixing frame; 111. an adjustment assembly; 112. a moving block; 113. a rotating rod; 114. an adjusting frame; 115. a guide roller; 116. a guide belt; 117. a guide assembly; 118. a plate outlet; 119. polishing the detection head; 120. a display screen; 200. a rotating roller; 201. a circulating belt; 202. a polishing mechanism; 203. a mounting frame; 204. a translation assembly; 205. a connecting frame; 206. a side shifting assembly; 207. a lifting assembly; 208. a polishing assembly; 209. polishing piece; 210. a circulation assembly; 300. a guide rod; 301. a drive assembly; 302. a third lead screw; 303. a lamination positioning mechanism; 304. a positioning frame; 305. a fixed case; 306. a positioning assembly; 307. a positioning plate; 308. a jacking assembly; 309. a rotating assembly; 310. a rotating frame; 311. a blocking assembly; 312. and a blocking plate.
Detailed Description
Referring to fig. 1 to 10, a polishing apparatus for circuit board processing includes a polishing chamber 100, and a first conveyor 102 and a second conveyor 105 are rotatably mounted in the polishing chamber 100. A plurality of first conveying rollers 104 are rotatably installed in the polishing chamber 100, the plurality of first conveying rollers 104 are in transmission connection through a first conveying belt 102, a first conveying assembly 103 is fixedly installed on the outer wall of the polishing chamber 100, the first conveying assembly 103 is a motor in the embodiment, and the first conveying assembly 103 is used for driving the first conveying rollers 104 to rotate. A plurality of second conveying rollers 107 are rotatably installed in the polishing chamber 100, the plurality of second conveying rollers 107 are in transmission connection through a second conveying belt 105, a second conveying assembly 106 is fixedly installed on the outer wall of the polishing chamber 100, the second conveying assembly 106 is a motor in the embodiment, and the second conveying assembly 106 is used for driving the second conveying rollers 107 to rotate. One side of the polishing chamber 100 is provided with a plate inlet 101, and the top of the polishing chamber 100 is provided with a plate outlet 118. A turnover guide mechanism 108 is rotatably installed in the polishing chamber 100, and the turnover guide mechanism 108 is disposed between the first conveyor belt 102 and the second conveyor belt 105. The outer wall of the polishing chamber 100 is fixedly provided with a turnover component 1081, the turnover component 1081 can be a motor, the turnover component 1081 is used for driving the turnover guide mechanism 108 to rotate, the turnover guide mechanism 108 comprises a turnover frame 109, two fixing frames 110 are fixedly arranged in the turnover frame 109, two adjusting components 111 are fixedly arranged in the fixing frames 110, the adjusting components 111 can be air cylinders, one side of each adjusting component 111 is provided with a moving block 112, each adjusting component 111 is used for driving the moving block 112 to move, a rotating rod 113 is rotatably arranged on each moving block 112, each rotating rod 113 is rotatably connected with each adjusting frame 114, and a guide belt 116 is rotatably arranged on each adjusting frame 114. A plurality of guide rollers 115 are rotatably mounted on the adjusting frame 114, the guide rollers 115 are in transmission connection through a guide belt 116, a guide assembly 117 is fixedly mounted on the adjusting frame 114, the guide assembly 117 can be a motor, and the guide assembly 117 is used for driving the guide rollers 115 to rotate. The polishing chamber 100 is rotatably provided with a circulating belt 201, the polishing chamber 100 is rotatably provided with four rotating rollers 200, the four rotating rollers 200 are in transmission connection through the circulating belt 201, the outer wall of the polishing chamber 100 is fixedly provided with a circulating assembly 210, the circulating assembly 210 can be a motor, and the circulating assembly 210 is used for driving the rotating rollers 200 to rotate. A plurality of polishing mechanisms 202 are fixedly mounted on the circulating belt 201, each polishing mechanism 202 comprises a mounting frame 203, a connecting frame 205 is mounted on each mounting frame 203 in a sliding manner, a lifting assembly 207 is mounted on each connecting frame 205 in a sliding manner, each lifting assembly 207 is used for driving each polishing assembly 208 to lift, each polishing assembly 208 can be a motor, and each polishing assembly 208 is used for driving each polishing sheet 209 to rotate. The first lead screw is rotatably mounted on the mounting frame 203, the first lead screw is in threaded connection with the connecting frame 205, the translation component 204 is fixedly mounted on one side of the mounting frame 203, the translation component 204 can be a motor, the translation component 204 is used for driving the first lead screw to rotate, the second lead screw is rotatably mounted on the connecting frame 205, the second lead screw is in threaded connection with the lifting component 207, the lifting component 207 can be an air cylinder, the side of the connecting frame 205 is fixedly mounted with the side shifting component 206, and the side shifting component 206 is used for driving the second lead screw to rotate. The overturning guide mechanism 108 is arranged in the polishing chamber 100, so that the circuit board can be conveyed while overturning, the polishing treatment on the surfaces on two sides of the circuit board is facilitated, and meanwhile, the polishing treatment can be carried out on the circuit board while conveying.
A guide rod 300 is fixedly installed in the polishing chamber 100, and the guide rod 300 is slidably connected with a lamination positioning mechanism 303. A third lead screw 302 is rotatably installed in the polishing chamber 100, the third lead screw 302 is in threaded connection with a stacked plate positioning mechanism 303, a driving assembly 301 is fixedly installed on the top of the outer wall of the polishing chamber 100, the driving assembly 301 can be a motor, and the driving assembly 301 is used for driving the third lead screw 302 to rotate. The stacked plate positioning mechanism 303 comprises a positioning frame 304, two fixing shells 305 are fixedly installed on the positioning frame 304, a positioning component 306 is fixedly installed in the fixing shells 305, the positioning component 306 can be an air cylinder, a positioning plate 307 is arranged on one side of the positioning component 306, the positioning component 306 is used for driving the positioning plate 307 to move, a jacking component 308 is fixedly installed on the positioning frame 304, the jacking component 308 can be an air cylinder, a rotating component 309 is arranged on one side of the jacking component 308, the jacking component 308 is used for driving the rotating component 309 to move, the rotating component 309 can be a motor, a rotating frame 310 is arranged on one side of the rotating component 309 and used for driving the rotating frame 310 to rotate, a blocking component 311 is fixedly installed in the rotating frame 310, a blocking plate 312 is arranged on one side of the blocking component 311, the blocking component 311 can be an air cylinder, and the blocking component 311 is used for driving the blocking plate 312 to move. The polishing chamber 100 is internally provided with the stacking plate positioning mechanism 303 which can be lifted, so that the circuit board with polished surface can be automatically stacked, the stacked circuit board can be aligned, and the side edge of the circuit board is polished while moving, thereby ensuring the high polishing efficiency of the circuit board.
Polishing room 100 inner wall top fixed mounting has polishing detection head 119, and polishing room 100 outer wall fixed mounting has display screen 120, and polishing detection head 119 includes polishing detection module, and polishing detection module is used for waiting to change the piece sequencing and shows on display screen 120 specifically: the polishing detection module sequentially marks polishing sheets 209, such as 6 polishing sheets 209 in the polishing chamber 100, sequentially marks polishing sheets 209 No. 1, 209 No. 2, 209 No. 3, 209 No. 4, 209 No. 5, 209 No. 6, detects the diameters of the polished sheets 209 after marking, marks the diameters of the polished sheets 209 as post-polishing diameters Mz, sets the post-polishing diameter threshold as Pn, does not mark the polished sheets 209 of the marking when the post-polishing diameter Mz is greater than or equal to the post-polishing diameter threshold Pn, marks the polished sheets 209 of the marking to be replaced when the post-polishing diameter Mz is less than the post-polishing diameter threshold Pn, sequentially sorts the values of the diameters Mz after polishing to be replaced from small to large, and sequentially sorts the corresponding marks of the sheets to be replaced on the display screen 120. When the number 1 polishing sheet 209, the number 3 polishing sheet 209, the number 5 polishing sheet 209 are marked as sheets to be replaced, and the post-polishing diameter Mz of the number 1 polishing sheet 209 is smaller than the post-polishing diameter Mz of the number 5 polishing sheet 209 smaller than the post-polishing diameter Mz of the number 3 polishing sheet 209, the number 1 polishing sheet 209, the number 5 polishing sheet 209, the number 3 polishing sheet 209 are sequentially displayed on the display screen 120 in order. The polishing detection head 119 is arranged, so that operators can intuitively know which polishing sheets 209 need to be replaced, and the operators can conveniently replace the polishing sheets 209 according to the required sequence.
Working principle:
placing the circuit board on the first conveying belt 102, the first conveying assembly 103 drives the first conveying roller 104 to rotate, the first conveying roller 104 drives the first conveying belt 102 to rotate, the first conveying belt 102 conveys the circuit board, meanwhile, the circulating assembly 210 drives the rotating roller 200 to rotate, the rotating roller 200 drives the circulating belt 201 to rotate, the circulating belt 201 drives the polishing mechanisms 202 to circularly move, the corresponding polishing mechanisms 202 and the circuit board synchronously move, meanwhile, the translation assembly 204 drives the first lead screw to rotate, the first lead screw drives the connecting frame 205 to horizontally move, the side shifting assembly 206 drives the second lead screw to rotate, the second lead screw drives the lifting assembly 207 to horizontally move, the lifting assembly 207 drives the polishing assembly 208 to descend, the polishing sheet 209 is regulated in the triaxial direction, the polishing assembly 208 drives the polishing sheet 209 to rotate, the polishing sheet 209 polishes the surface of the circuit board, one side surface of the circuit board is conveyed into the overturning guide mechanism 108, the adjusting assembly 111 drives the moving block 112 to move, the rotating rod 113 drives the adjusting frames 114 to move in a corresponding way, the two adjusting frames 114 move in opposite directions, the two guide belts 116 clamp the two guide belts to the two side surfaces 1081, the overturning frame 180 drives the rotating frame 109 to rotate, the second guide frame 109 drives the second guide frame 105 to rotate, the second guide frame 115 rotates the second guide frame 105 to rotate, the second guide frame 105 rotates the second guide frame 105 to rotate, the second guide frame 115 drives the second guide frame 105 to rotate, the second guide frame 105 rotates the second guide frame 105, the second guide frame 105 rotates, the second guide frame 105 rotates the second guide frame 105, and the second guide frame 105 rotates, the subsequent circuit boards are stacked on the rotating frame 310, then the blocking assembly 311 withdraws the blocking plate 312 into the rotating frame 310, the positioning assembly 306 drives the positioning plates 307 to move, the two positioning plates 307 align two sides of the stacked circuit boards, then the rotating assembly 309 drives the rotating frame 310 to rotate, the two positioning plates 307 align the other two sides of the stacked circuit boards, the two positioning plates 307 clamp the stacked circuit boards after alignment, then the driving assembly 301 drives the third lead screw 302 to rotate, the third lead screw 302 drives the stacked plate positioning mechanism 303 to ascend, and the synchronous polishing mechanism 202 performs polishing treatment on the side surfaces of the stacked circuit boards in the ascending process.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to those skilled in the art without departing from the principles of the present invention are intended to be considered as protecting the scope of the present template.
In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (3)
1. The polishing device for circuit board processing comprises a polishing chamber (100), and is characterized in that a first conveying belt (102) and a second conveying belt (105) are rotatably arranged in the polishing chamber (100);
the polishing chamber (100) is rotatably provided with a turnover guide mechanism (108), and the turnover guide mechanism (108) is arranged between the first conveying belt (102) and the second conveying belt (105);
the polishing device comprises a polishing chamber (100), wherein a circulating belt (201) is rotatably installed in the polishing chamber, a plurality of polishing mechanisms (202) are fixedly installed on the circulating belt (201), each polishing mechanism (202) comprises a mounting frame (203), a connecting frame (205) is slidably installed on each mounting frame (203), a lifting assembly (207) is slidably installed on each connecting frame (205), each lifting assembly (207) is used for driving each polishing assembly (208) to lift, and each polishing assembly (208) is used for driving each polishing sheet (209) to rotate;
a guide rod (300) is fixedly arranged in the polishing chamber (100), and the guide rod (300) is connected with a lamination positioning mechanism (303) in a sliding manner;
polishing room (100) inner wall top fixed mounting has polishing detection head (119), polishing room (100) outer wall fixed mounting has display screen (120), and polishing detection head (119) are including polishing detection module, and polishing detection module is used for waiting to change the piece and order and show on display screen (120), specifically: the polishing detection module sequentially marks the polishing sheets (209), detects the diameters of the polishing sheets (209) after marking, marks the diameters of the polishing sheets (209) as post-polishing diameters Mz, sets a post-polishing diameter threshold value as Pn, does not mark the polishing sheets (209) with the marks when the post-polishing diameters Mz are larger than or equal to the post-polishing diameter threshold value Pn, marks the polishing sheets (209) with the marks to be replaced when the post-polishing diameters Mz are smaller than the post-polishing diameter threshold value Pn, sequentially sorts the to-be-replaced sheets according to the values of the post-polishing diameters Mz, and sequentially sorts the corresponding marks of the to-be-replaced sheets on the display screen (120);
a plurality of first conveying rollers (104) are rotatably arranged in the polishing chamber (100), the first conveying rollers (104) are in transmission connection through a first conveying belt (102), a first conveying assembly (103) is fixedly arranged on the outer wall of the polishing chamber (100), and the first conveying assembly (103) is used for driving the first conveying rollers (104) to rotate;
a plurality of second conveying rollers (107) are rotatably arranged in the polishing chamber (100), the plurality of second conveying rollers (107) are in transmission connection through a second conveying belt (105), a second conveying assembly (106) is fixedly arranged on the outer wall of the polishing chamber (100), and the second conveying assembly (106) is used for driving the second conveying rollers (107) to rotate;
the polishing device comprises a polishing chamber (100), wherein a turnover assembly (1081) is fixedly arranged on the outer wall of the polishing chamber, the turnover assembly (1081) is used for driving a turnover guide mechanism (108) to rotate, the turnover guide mechanism (108) comprises a turnover frame (109), two fixing frames (110) are fixedly arranged in the turnover frame (109), two adjusting assemblies (111) are fixedly arranged in the fixing frames (110), a moving block (112) is arranged on one side of each adjusting assembly (111), the adjusting assemblies (111) are used for driving the moving block (112) to move, rotating rods (113) are rotatably arranged on the moving block (112), the two rotating rods (113) are rotatably connected with the adjusting frames (114), and guide belts (116) are rotatably arranged on the adjusting frames (114);
a plurality of guide rollers (115) are rotatably arranged on the adjusting frame (114), the guide rollers (115) are in transmission connection through guide belts (116), a guide assembly (117) is fixedly arranged on the adjusting frame (114), and the guide assembly (117) is used for driving the guide rollers (115) to rotate;
the polishing device is characterized in that four rotating rollers (200) are rotatably arranged in the polishing chamber (100), the four rotating rollers (200) are in transmission connection through a circulating belt (201), a circulating assembly (210) is fixedly arranged on the outer wall of the polishing chamber (100), and the circulating assembly (210) is used for driving the rotating rollers (200) to rotate;
the lamination positioning mechanism (303) comprises a positioning frame (304), two fixed shells (305) are fixedly arranged on the positioning frame (304), a positioning assembly (306) is fixedly arranged in the fixed shells (305), a positioning plate (307) is arranged on one side of the positioning assembly (306), the positioning assembly (306) is used for driving the positioning plate (307) to move, a jacking assembly (308) is fixedly arranged on the positioning frame (304), a rotating assembly (309) is arranged on one side of the jacking assembly (308), the jacking assembly (308) is used for driving the rotating assembly (309) to move, a rotating frame (310) is arranged on one side of the rotating assembly (309), a blocking assembly (311) is fixedly arranged in the rotating frame (310), a blocking plate (312) is arranged on one side of the blocking assembly (311), and the blocking assembly (311) is used for driving the blocking plate (312) to move;
a third lead screw (302) is rotatably mounted in the polishing chamber (100), the third lead screw (302) is in threaded connection with a lamination positioning mechanism (303), a driving assembly (301) is fixedly mounted at the top of the outer wall of the polishing chamber (100), and the driving assembly (301) is used for driving the third lead screw (302) to rotate;
the other two sides of the stacked circuit boards are aligned by the two positioning plates (307), the stacked circuit boards are clamped by the two aligned positioning plates (307), then the driving assembly (301) drives the third screw rod (302) to rotate, the third screw rod (302) drives the stacked plate positioning mechanism (303) to ascend, and the synchronous polishing mechanism (202) carries out polishing treatment on the side surfaces of the stacked circuit boards in the ascending process.
2. The polishing device for circuit board processing according to claim 1, wherein a first screw is rotatably mounted on the mounting frame (203), the first screw is in threaded connection with the connecting frame (205), a translation component (204) is fixedly mounted on one side of the mounting frame (203), the translation component (204) is used for driving the first screw to rotate, a second screw is rotatably mounted on the connecting frame (205), the second screw is in threaded connection with the lifting component (207), a side shifting component (206) is fixedly mounted on one side of the connecting frame (205), and the side shifting component (206) is used for driving the second screw to rotate.
3. The polishing device for circuit board processing according to claim 2, wherein a board inlet (101) is formed on one side of the polishing chamber (100), and a board outlet (118) is formed on the top of the polishing chamber (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311687230.5A CN117381644B (en) | 2023-12-11 | 2023-12-11 | Polishing device for circuit board processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311687230.5A CN117381644B (en) | 2023-12-11 | 2023-12-11 | Polishing device for circuit board processing |
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| CN117381644A CN117381644A (en) | 2024-01-12 |
| CN117381644B true CN117381644B (en) | 2024-04-12 |
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| CN202311687230.5A Active CN117381644B (en) | 2023-12-11 | 2023-12-11 | Polishing device for circuit board processing |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590876A (en) * | 2018-11-20 | 2019-04-09 | 厦门嘉泓裕日用品有限公司 | A kind of multistation polishing machine |
| CN214692005U (en) * | 2021-04-20 | 2021-11-12 | 金华辉煌三联工具实业有限公司 | Automatic polishing production line for saw chain guide plate |
| CN216151899U (en) * | 2021-09-22 | 2022-04-01 | 杭州亿资鑫五金工艺品有限公司 | Sheet metal surface finish device |
| CN116393731A (en) * | 2023-04-23 | 2023-07-07 | 淮安万科液压机械有限公司 | Pump cover perforating device for gear pump processing |
| CN117183021A (en) * | 2023-09-21 | 2023-12-08 | 淮安锦致电路科技有限公司 | Efficient processing equipment for PCB (printed circuit board) |
-
2023
- 2023-12-11 CN CN202311687230.5A patent/CN117381644B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590876A (en) * | 2018-11-20 | 2019-04-09 | 厦门嘉泓裕日用品有限公司 | A kind of multistation polishing machine |
| CN214692005U (en) * | 2021-04-20 | 2021-11-12 | 金华辉煌三联工具实业有限公司 | Automatic polishing production line for saw chain guide plate |
| CN216151899U (en) * | 2021-09-22 | 2022-04-01 | 杭州亿资鑫五金工艺品有限公司 | Sheet metal surface finish device |
| CN116393731A (en) * | 2023-04-23 | 2023-07-07 | 淮安万科液压机械有限公司 | Pump cover perforating device for gear pump processing |
| CN117183021A (en) * | 2023-09-21 | 2023-12-08 | 淮安锦致电路科技有限公司 | Efficient processing equipment for PCB (printed circuit board) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117381644A (en) | 2024-01-12 |
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