CN117377233A - Selective plating hole equipment and electroplating selective plating hole process - Google Patents
Selective plating hole equipment and electroplating selective plating hole process Download PDFInfo
- Publication number
- CN117377233A CN117377233A CN202311516807.6A CN202311516807A CN117377233A CN 117377233 A CN117377233 A CN 117377233A CN 202311516807 A CN202311516807 A CN 202311516807A CN 117377233 A CN117377233 A CN 117377233A
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- Prior art keywords
- pcb
- hole
- base
- holes
- selective plating
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- 238000007747 plating Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000008569 process Effects 0.000 title claims abstract description 25
- 238000009713 electroplating Methods 0.000 title abstract description 5
- 238000011049 filling Methods 0.000 claims abstract description 80
- 239000011347 resin Substances 0.000 claims abstract description 50
- 229920005989 resin Polymers 0.000 claims abstract description 50
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 11
- 238000001125 extrusion Methods 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 51
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- CEOCDNVZRAIOQZ-UHFFFAOYSA-N pentachlorobenzene Chemical compound ClC1=CC(Cl)=C(Cl)C(Cl)=C1Cl CEOCDNVZRAIOQZ-UHFFFAOYSA-N 0.000 claims 8
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 98
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 98
- 238000007599 discharging Methods 0.000 description 6
- 238000011068 loading method Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
The invention relates to the field of PCB processing, in particular to selective hole plating equipment and an electroplating selective hole plating process, which comprise a base, wherein a feeding unit is arranged on the base and used for pushing a PCB onto the base, a stabilizing component is arranged between the feeding unit and the base and used for stabilizing the PCB on the base, and a hole filling unit is arranged above the base and used for filling hole filling resin into holes on the PCB; the feeding unit is also provided with a blanking assembly, and the blanking assembly is used for blanking the PCB after hole filling; compared with the existing semi-automatic operation equipment, the resin hole filling equipment greatly reduces the proportion of manual participation and the input of manpower, so that the hole filling resin process on the PCB is orderly, the efficiency is high, the defective rate is lower, and the full preparation is made for the subsequent selective hole plating of the PCB.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to selective plating equipment and an electroplating selective plating process.
Background
Along with the updating of electronic type products in the market, the requirements on the used PCB are higher and higher, and in order to meet the high-frequency and high-speed effects of electronic products, great changes exist in the aspects of PCB wiring and aperture design, and the design characteristics mainly comprise high hole copper thickness, low line width and line spacing. The common copper electroplating and copper reduction process flow for PCB manufacture cannot meet the manufacturing requirements and tolerance control requirements of the type of products;
therefore, a selective hole plating process is developed in the prior art, the plated surface copper and the hole copper are split, the two copper plating layers are not overlapped, one copper reduction flow is saved, the uniformity of the copper surface is saved, the process variable is reduced, and the subsequent line width and line distance control of a fine line are facilitated; in the selective hole plating process, holes on a PCB (printed circuit board) are required to be filled, resin is filled into the holes, and the existing filling mode has full-automatic operation and semi-automatic operation; semi-automatization operation, manual cooperation equipment collaborative work, and because the structural design's of equipment reason for artifical participation degree proportion is higher than equipment participation degree, and the manpower input is big, influences hole filling efficiency and hole filling quality, and then influences follow-up PCB board selectivity and electroplates the hole step.
Therefore, a selective plating hole device and a selective plating hole plating process are provided for solving the above problems.
Disclosure of Invention
In order to overcome the deficiencies of the prior art, at least one technical problem presented in the background art is solved.
The technical scheme adopted for solving the technical problems is as follows: the invention relates to selective hole plating equipment, which comprises a base, wherein a feeding unit is arranged on the base and used for pushing a PCB (printed circuit board) onto the base, a stabilizing component is arranged between the feeding unit and the base and used for stabilizing the PCB on the base, and a hole filling unit is arranged above the base and used for filling hole filling resin into holes on the PCB; and the feeding unit is also provided with a blanking assembly, and the blanking assembly is used for blanking the PCB after hole filling.
Preferably, the upper surface of the base is provided with a concave part, the lower surface of the base is symmetrically provided with a sliding groove, a sliding rod is arranged in the sliding groove, the lower surface of the sliding rod is provided with a rack, the rack is meshed with a gear arranged below the sliding rod, both ends of the sliding rod are provided with a first plate, the inner side of the first plate is provided with a supporting plate, and a PCB to be processed is placed on the supporting plate;
the hole filling unit comprises a hollow shell, a plurality of overflow holes are formed in the lower surface of the hollow shell, each overflow hole corresponds to a hole in the PCB one by one, a feed pipe is communicated with the upper surface of the hollow shell, and an air cylinder is connected above the hollow shell.
Preferably, the upper end of each overflow hole is in a flaring shape, the lower end of each overflow hole is provided with a convex part made of rubber, and the convex part is arranged around the edge of the lower end of each overflow hole.
Preferably, the stabilizing assembly comprises an extrusion block and an extrusion bar; the base is symmetrically provided with sliding holes, the sliding holes are positioned at two sides of the concave part, a through hole is arranged between the sliding holes and the concave part, and the through hole is arranged close to the end face of the base; the extrusion strip penetrates into the sliding hole, the end part of the extrusion strip is fixedly connected to the first plate, and a plurality of bulges are arranged on the surface, opposite to the through hole, of the extrusion strip; the through hole is connected with the extrusion block in a sliding way, the lower surface of the front end of the extrusion block is provided with an inclined plane, the inclined plane can be extruded on the edge of the PCB, the upper surface and the lower surface of the extrusion block are connected on the inner side wall of the sliding hole through a reset spring, and the rear end face of the extrusion block is extruded on the extrusion strip and the bulge.
Preferably, a rotary groove is formed in the rear end of each extrusion block, a roller body is connected in the rotary groove in a rotary mode, and the roller bodies are attached to the extrusion strips and roll on the surfaces of the protrusions.
Preferably, the blanking assembly is symmetrically and fixedly connected with an electric push rod of a first plate, the end part of the electric push rod is fixedly connected with a push plate, and the push plate is attached to the upper surface of the supporting plate to slide; the both ends of base are equipped with the stock guide, and the stock guide slope downwardly extending sets up, and the lower extreme of stock guide is equipped with the material case, and the material case is used for splendid attire PCB board.
Preferably, the front end face on the push plate is provided with a positioning column, the positioning column is vertically attached to the push plate, and the positioning column is adapted to a positioning groove on the PCB.
Preferably, a plurality of material tanks are arranged in the material tank, ultraviolet lamps are arranged in each material tank, supporting blocks are arranged at the corners of the bottom of the material tank, a screw rod is connected below the supporting blocks in a conveying mode, and threads on the screw rod are symmetrically arranged.
Preferably, inlet chamfers are arranged at two port positions of the concave part.
A selective plating hole process, which is applicable to any one of the selective plating hole devices, comprising the steps of:
s1: punching holes on the PCB, customizing corresponding hollow shells, and drilling overflow holes on the lower surfaces of the hollow shells, wherein the positions of each overflow hole correspond to the holes on the PCB one by one;
s2: feeding, namely warming hole filling resin, injecting the hole filling resin into the hollow shell through the pump body, and then filling the hole filling resin into the hole on the PCB;
s3: grinding, namely grinding redundant hole filling resin on the surface of the PCB;
s4: and then copper plating is carried out on the surface of the PCB.
The invention has the advantages that:
1. compared with the existing semi-automatic operation equipment, the resin hole filling equipment greatly reduces the proportion of manual participation and the input of manpower, so that the hole filling resin process on the PCB is orderly, the efficiency is high, the defective rate is lower, and the full preparation is made for the subsequent selective hole plating of the PCB.
2. The overflow hole position is provided with a convex part made of rubber, after the hollow shell is attached and extruded on the PCB, the convex part is extruded at the hole edge position on the PCB, the convex part is wrapped, the sealing performance between the upper surface of the PCB and the lower surface of the hollow shell is improved, the hole filling resin can be fully injected into the hole on the PCB, the amount of the hole filling resin overflowed on the surface of the PCB is reduced, and the waste amount of the hole filling resin is reduced.
Drawings
FIG. 1 is a perspective view of a selective plating apparatus according to the present invention;
FIG. 2 is a bottom view of the selective plating apparatus of the present invention;
FIG. 3 is a front view of a selective plating apparatus according to the present invention;
FIG. 4 is a perspective view of a base of the present invention;
FIG. 5 is a schematic view showing the engagement of the overflow aperture with the protrusion in the present invention;
FIG. 6 is a perspective view of the protrusion mated with the hollow shell of the present invention;
FIG. 7 is a perspective view showing the fit of the extrusion bar and the extrusion block in the present invention;
FIG. 8 is an enlarged view of a portion of FIG. 7 at A;
FIG. 9 is a flow chart of a selective plating process according to the present invention.
In the figure: 1. a base; 2. a PCB board; 3. a concave portion; 4. a chute; 5. a slide bar; 6. a rack; 7. a gear; 8. a first plate; 9. a supporting plate; 10. a hollow shell; 11. an overflow hole; 12. a feed pipe; 13. a convex portion; 14. extruding a block; 15. extruding the strip; 16. a slide hole; 17. a through hole; 18. a protrusion; 19. resetting the bullet; 20. a spring rotating groove; 21. a roller body; 22. an electric push rod; 23. a push plate; 24. a material guide plate; 25. a material box; 26. positioning columns; 27. a material tank; 28. a support block; 29. a screw rod; 30. and (5) chamfering an inlet.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Referring to fig. 1-9, a selective hole plating device comprises a base 1, wherein a feeding unit is installed on the base 1 and is used for pushing a PCB 2 onto the base 1, a stabilizing component is arranged between the feeding unit and the base 1 and stabilizes the PCB 2 on the base 1, a hole filling unit is arranged above the base 1 and is used for filling hole filling resin into holes on the PCB 2; the feeding unit is also provided with a blanking assembly, and the blanking assembly is used for blanking the PCB 2 after hole filling;
the staff places the PCB board 2 of waiting to process on the material loading unit, the material loading unit pushes the PCB board 2 of waiting to process to the base 1, in the propelling movement in-process, the stable subassembly of material loading unit linkage is with the stability of waiting to process PCB board 2 on the base 1, afterwards carry out the hole filling unit, the hole filling unit fills hole filling resin to waiting to process in the PCB board 2 upper hole, realize the step of resin hole filling on the PCB board 2, afterwards through the unloading subassembly, the unloading subassembly pushes away the PCB board 2 from the base 1, realize the unloading of PCB board 2, the whole in-process of PCB board 2 from last unloading, only the material loading link is artifical the participation, compared current semi-automatization operation equipment, the ratio of significantly reduced manual participation, the input of manpower is reduced for the hole filling resin process on the PCB board 2, well order, high efficiency, the defective percentage is lower, make fully prepare for the selective plating hole of follow-up PCB board 2.
Referring to fig. 1-4, the upper surface of the base 1 is provided with a concave part 3, the lower surface of the base 1 is symmetrically provided with a sliding groove 4, a sliding rod 5 is arranged in the sliding groove 4, the lower surface of the sliding rod 5 is provided with a rack 6, the rack 6 is meshed with a gear 7 arranged below the rack 6, both ends of the sliding rod 5 are provided with a first plate 8, the upper inner side of the first plate 8 is provided with a supporting plate 9, and a PCB 2 to be processed is placed on the supporting plate 9;
the hole filling unit comprises a hollow shell 10, a plurality of overflow holes 11 are formed in the lower surface of the hollow shell 10, each overflow hole 11 corresponds to a hole in the PCB 2 one by one, a feed pipe 12 is communicated with the upper surface of the hollow shell 10, and a cylinder is connected above the hollow shell 10; the gear 7 is fixedly connected with an external driving motor, and the driving motor can drive the gear 7 to rotate forwards and reversely; the gear 7 is meshed with the rack 6, and the movement of the rack 6 drives the slide bar 5 to move back and forth along the slide groove 4; placing the PCB 2 to be processed on a supporting plate 9 horizontally, swinging the position and the angle, driving the supporting plate 9 to move by a driving motor through a sliding rod 5, driving the PCB 2 to the position of a concave part 3 by the supporting plate 9, suspending the driving motor, driving a hole filling unit, enabling the lower surface of the hollow shell 10 to be attached to and extruded on the PCB 2 under the driving force of a cylinder connected with the hollow shell 10 above the hole filling unit, enabling each overflow hole 11 to be aligned with the hole of the PCB 2 one by one, injecting hole filling resin into the hollow shell 10 through an external pump body, extruding and discharging the hole filling resin from the overflow holes 11 into the hole on the PCB 2, realizing filling of the resin, resetting the hole filling unit, and discharging the PCB 2 in the concave part 3 at the moment by a discharging assembly; in the process of filling the hole resin, the PCB 2 to be processed can be prepared on the other supporting plate 9, the PCB 2 to be processed is placed on the supporting plate 9 for preparation of feeding, when the feeding of the last PCB 2 is finished, the supporting plate 9 with the PCB 2 is moved into the concave part 3 by reversing the driving motor, the feeding is realized, and the actions are repeated in the similar way.
Referring to fig. 1-6, the upper end of each overflow hole 11 is flared, the lower end of each overflow hole 11 is provided with a rubber protrusion 13, and the protrusions 13 are arranged around the edge of the lower end of each overflow hole 11; the overflow hole 11 is provided with the protruding part 13 made of rubber, after the hollow shell 10 is attached and extruded on the PCB 2, the protruding part 13 is extruded at the edge of the hole on the PCB 2 to wrap the hole, so that the tightness between the upper surface of the PCB 2 and the lower surface of the hollow shell 10 is improved, hole filling resin can be fully injected into the hole on the PCB 2, the amount of the hole filling resin overflowing on the surface of the PCB 2 is reduced, and the waste amount of the hole filling resin is reduced.
Referring to fig. 1-4, and fig. 7 and 8, the stabilizing assembly includes an extrusion block 14 and an extrusion bar 15; slide holes 16 are symmetrically formed in the base 1, the slide holes 16 are positioned on two sides of the concave part 3, through holes 17 are formed between the slide holes 16 and the concave part 3, and the through holes 17 are arranged close to the end face of the base 1; the extrusion strip 15 penetrates into the sliding hole 16, the end part of the extrusion strip 15 is fixedly connected to the first plate 8, and a plurality of protrusions 18 are arranged on the surface, opposite to the through holes 17, of the extrusion strip 15; the through hole 17 is slidably connected with the extrusion block 14, the lower surface of the front end of the extrusion block 14 is provided with an inclined plane, the inclined plane can be extruded on the edge of the PCB 2, the upper surface and the lower surface of the extrusion block 14 are connected on the inner side wall of the sliding hole 16 through a reset spring 19, and the rear end surface of the extrusion block 14 is extruded on the extrusion strip 15 and the bulge 18; the slide bar 5 drives the extrusion bar 15 to synchronously move through the first plate 8, when the supporting plate 9 drives the PCB 2 to move towards the concave part 3, the bulge 18 on the extrusion bar 15 is gradually close to the extrusion block 14, when the PCB 2 is positioned in the concave part 3, the bulge 18 extrudes the extrusion block 14, pushes the extrusion block 14 out of the through hole 17 and is extruded on the edge of the PCB 2 of the concave part 3, the PCB 2 is extruded and stabilized in the concave part 3, so that the PCB 2 is prevented from being displaced, the later overflow holes 11 can be aligned with holes on the PCB 2 one by one, and the hole alignment accuracy is improved; the protrusions 18 on the extrusion strip 15 are symmetrically arranged, can move in coordination with the back and forth movement of the supporting plate 9, and extrude the extrusion block 14 on the PCB 2.
Referring to fig. 8, a rotary groove 20 is formed at the rear end of each extrusion block 14, a roller body 21 is rotatably connected in the rotary groove 20, and the roller bodies 21 roll on the surfaces of the extrusion bars 15 and the protrusions 18; the roller body 21 is arranged on the extrusion block 14, sliding friction between the bulge 18 and the extrusion block 14 is converted into rolling friction between the roller body 21 and the bulge 18, friction force is reduced, movement of the extrusion strip 15 can be stabilized, movement of the extrusion block 14 is linked, and stable and effective extrusion of the extrusion block 14 on the PCB 2 is ensured.
Referring to fig. 1-3, and fig. 7 and 8, the blanking assembly is symmetrically and fixedly connected to an electric push rod 22 of the first plate 8, a push plate 23 is fixedly connected to the end part of the electric push rod 22, and the push plate 23 is attached to the upper surface of the supporting plate 9 to slide; the two ends of the base 1 are provided with material guide plates 24, the material guide plates 24 are obliquely and downwardly arranged in an extending mode, the lower ends of the material guide plates 24 are provided with material boxes 25, and the material boxes 25 are used for containing the PCB 2; after the resin filling of the PCB 2 in the concave part 3 is finished, the hole filling unit moves upwards for resetting, then the blanking component is driven, the push plate 23 is pushed by the electric push rod 22, the processed PCB 2 on the supporting plate 9 is pushed away from the concave part 3 by the push plate 23 and slides away from the base 1 along the material guide plate 24, finally, the PCB falls into the material box 25 for centralized collection, the blanking of the PCB is realized, then the supporting plate 9 is retracted for resetting, the PCB 2 to be processed is pushed into the concave part 3 by the other supporting plate 9, then, the resin hole filling link is carried out, and the above actions are repeated.
Referring to fig. 1, a positioning column 26 is provided on the front end surface of the push plate 23, the positioning column 26 is vertically attached to the push plate 23, and the positioning column 26 is adapted to a positioning groove on the PCB 2; the push plate 23 is close to the rear edge position of the supporting plate 9, the PCB 2 is placed on the supporting plate 9, and the rear edge of the PCB 2 is provided with a positioning groove, so that after the PCB 2 is placed on the supporting plate 9, the rear edge of the PCB 2 is leaned against the push plate 23, and meanwhile, the positioning groove is aligned with the positioning column 26, so that accurate feeding of the PCB 2 is realized, and after the later-stage PCB 2 is pushed to the concave part 3, the overflow holes 11 can be aligned with the holes of the PCB 2 one by one, and the accuracy is improved.
Referring to fig. 1-3, a plurality of material tanks 27 are arranged in the material tank 25, an ultraviolet lamp is arranged in each material tank 27, a supporting block 28 is arranged at the corner position of the bottom of the material tank 25, a screw rod 29 is connected below the supporting block 28 in a conveying way, and threads on the screw rod 29 are symmetrically arranged; the PCB 2 slides from the material guide plate 24 into the material box 25 and is embedded into the material groove 27, an ultraviolet lamp is arranged in the material groove 27, and the resin is solidified by light rays; after the PCB 2 falls into the material groove 27 every time, the screw rod 29 drives the material boxes 25 to be away from each other by a certain distance, so that the next PCB 2 falling from the material guide plate 24 can accurately fall into the material groove 27.
Referring to fig. 4, the two ends of the concave portion 3 are provided with inlet chamfers 30; the entrance chamfer 30 is arranged, the front side edge of the supporting plate 9 is abutted against the surface of the entrance chamfer 30 when the supporting plate 9 moves towards the concave part 3, the supporting plate 9 is limited, and meanwhile, the position of the PCB 2 is determined, so that the PCB 2 can be accurately pushed into the concave part 3.
Referring to fig. 9, a selective plating hole process, which is applicable to any one of the above selective plating hole apparatuses, includes the steps of:
s1: punching holes on the PCB 2, customizing corresponding hollow shells 10, and drilling overflow holes 11 on the lower surface of the hollow shells 10, wherein the positions of each overflow hole 11 are in one-to-one correspondence with the holes on the PCB 2;
s2: feeding, namely warming hole filling resin, injecting the hole filling resin into the hollow shell 10 through the pump body, and then filling the hole filling resin into the hole on the PCB 2;
s3: grinding, namely grinding redundant hole filling resin on the surface of the PCB 2;
s4: and then copper plating is carried out on the surface of the PCB 2.
Working principle: the staff places the PCB 2 to be processed on the feeding unit, the feeding unit pushes the PCB 2 to be processed onto the base 1, in the pushing process, the feeding unit links the stabilizing component, the stabilizing component stabilizes the PCB 2 to be processed on the base 1, then the hole filling unit is executed, hole filling resin is filled into holes on the PCB 2 to be processed by the hole filling unit, a resin hole filling step on the PCB 2 is realized, then the PCB 2 is pushed away from the base 1 by the feeding component, the blanking of the PCB 2 is realized, only a feeding link is artificial participation in the whole process from feeding to blanking of the PCB 2, compared with the existing semi-automatic operation equipment, the proportion of artificial participation is greatly reduced, the input of manpower is reduced, the hole filling resin process on the PCB 2 is orderly, the efficiency is high, the defective percentage is lower, and the follow-up PCB 2 is fully prepared for selective hole plating;
the gear 7 is fixedly connected with an external driving motor, and the driving motor can drive the gear 7 to rotate forwards and reversely; the gear 7 is meshed with the rack 6, and the movement of the rack 6 drives the slide bar 5 to move back and forth along the slide groove 4; placing the PCB 2 to be processed on a supporting plate 9 horizontally, swinging the position and the angle, driving the supporting plate 9 to move by a driving motor through a sliding rod 5, driving the PCB 2 to the position of a concave part 3 by the supporting plate 9, suspending the driving motor, driving a hole filling unit, enabling the lower surface of the hollow shell 10 to be attached to and extruded on the PCB 2 under the driving force of a cylinder connected with the hollow shell 10 above the hole filling unit, enabling each overflow hole 11 to be aligned with the hole of the PCB 2 one by one, injecting hole filling resin into the hollow shell 10 through an external pump body, extruding and discharging the hole filling resin from the overflow holes 11 into the hole on the PCB 2, realizing filling of the resin, resetting the hole filling unit, and discharging the PCB 2 in the concave part 3 at the moment by a discharging assembly; in the process of filling hole resin, a PCB 2 to be processed can be prepared on the other supporting plate 9, the PCB 2 is placed on the supporting plate 9 for preparation of feeding, when the feeding of the last PCB 2 is finished, the supporting plate 9 with the PCB 2 is moved into the concave part 3 by reversing a driving motor, the feeding is realized, and the actions are repeated in the same way;
after the hollow shell 10 is attached and extruded on the PCB 2, the convex part 13 is extruded on the edge of the hole on the PCB 2 to wrap the hole, so that the tightness between the upper surface of the PCB 2 and the lower surface of the hollow shell 10 is improved, hole filling resin can be fully injected into the hole on the PCB 2, the amount of the hole filling resin overflowed on the surface of the PCB 2 is reduced, and the waste amount of the hole filling resin is reduced;
the slide bar 5 drives the extrusion bar 15 to synchronously move through the first plate 8, when the supporting plate 9 drives the PCB 2 to move towards the concave part 3, the bulge 18 on the extrusion bar 15 is gradually close to the extrusion block 14, when the PCB 2 is positioned in the concave part 3, the bulge 18 extrudes the extrusion block 14, pushes the extrusion block 14 out of the through hole 17 and is extruded on the edge of the PCB 2 of the concave part 3, the PCB 2 is extruded and stabilized in the concave part 3, so that the PCB 2 is prevented from being displaced, the later overflow holes 11 can be aligned with holes on the PCB 2 one by one, and the hole alignment accuracy is improved; the bulges 18 on the extrusion strips 15 are symmetrically arranged, can move in coordination with the back and forth movement of the supporting plate 9, and extrude the extrusion block 14 on the PCB 2;
the roller body 21 is arranged on the extrusion block 14, sliding friction between the bulge 18 and the extrusion block 14 is converted into rolling friction between the roller body 21 and the bulge 18, friction force is reduced, movement of the extrusion strip 15 can be stabilized, movement of the extrusion block 14 is linked, and stable and effective extrusion of the extrusion block 14 on the PCB 2 is ensured;
after resin filling of the PCB 2 in the concave part 3 is finished, the hole filling unit moves upwards for resetting, then the blanking component is driven, the push plate 23 is pushed by the electric push rod 22, the processed PCB 2 on the supporting plate 9 is pushed away from the concave part 3 by the push plate 23 and slides away from the base 1 along the material guide plate 24, finally, the PCB falls into the material box 25 for centralized collection, the blanking of the PCB is realized, then the supporting plate 9 is retracted for resetting, the other supporting plate 9 pushes the PCB 2 to be processed into the concave part 3, then, the resin hole filling link is carried out, and the above-mentioned actions are repeated;
the push plate 23 is close to the rear edge position of the supporting plate 9, the PCB 2 is placed on the supporting plate 9, and the rear edge of the PCB 2 is provided with a positioning groove, so that after the PCB 2 is placed on the supporting plate 9, the rear edge of the PCB 2 is leaned against the push plate 23, and meanwhile, the positioning groove is aligned with the positioning column 26, so that accurate feeding of the PCB 2 is realized, and after the PCB 2 is pushed to the concave part 3 in the later stage, the overflow holes 11 can be aligned with the holes of the PCB 2 one by one, and the accuracy is improved;
the PCB 2 slides from the material guide plate 24 into the material box 25 and is embedded into the material groove 27, an ultraviolet lamp is arranged in the material groove 27, and the resin is solidified by light rays; after the PCB 2 falls into the material groove 27 every time, the screw rod 29 drives the material boxes 25 to be away from each other by a certain distance, so that the next PCB 2 falling from the material guide plate 24 can accurately fall into the material groove 27.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A selective plating hole apparatus, characterized in that: the PCB feeding device comprises a base (1), wherein a feeding unit is arranged on the base (1) and used for pushing a PCB (2) onto the base (1), a stabilizing component is arranged between the feeding unit and the base (1) and stabilizes the PCB (2) on the base (1), a hole filling unit is arranged above the base (1) and used for filling hole filling resin into holes on the PCB (2); and the feeding unit is also provided with a blanking assembly, and the blanking assembly is used for blanking the PCB (2) after hole filling.
2. A selective plating hole apparatus according to claim 1, wherein: the upper surface of the base (1) is provided with a concave part (3), the lower surface of the base (1) is symmetrically provided with a sliding groove (4), a sliding rod (5) is arranged in the sliding groove (4), the lower surface of the sliding rod (5) is provided with a rack (6), the rack (6) is meshed with a gear (7) arranged below the rack, both ends of the sliding rod (5) are provided with a first plate (8), the upper inner side of the first plate (8) is provided with a supporting plate (9), and a PCB (2) to be processed is placed on the supporting plate (9);
the hole filling unit comprises a hollow shell (10), a plurality of overflow holes (11) are formed in the lower surface of the hollow shell (10), each overflow hole (11) corresponds to a hole in the PCB (2) one by one, a feed pipe (12) is communicated with the upper surface of the hollow shell (10), and an air cylinder is connected above the hollow shell (10).
3. A selective plating hole apparatus according to claim 2, wherein: the upper end of each overflow hole (11) is flaring, the lower end of each overflow hole (11) is provided with a rubber convex part (13), and the convex part (13) is arranged around the edge of the lower end of each overflow hole (11).
4. A selective plating hole apparatus according to claim 1, wherein: the stabilizing assembly comprises a squeeze block (14) and a squeeze bar (15); slide holes (16) are symmetrically formed in the base (1), the slide holes (16) are located on two sides of the concave part (3), through holes (17) are formed between the slide holes (16) and the concave part (3), and the through holes (17) are arranged close to the end face of the base (1); the extrusion strip (15) penetrates into the sliding hole (16), the end part of the extrusion strip (15) is fixedly connected to the first plate (8), and a plurality of bulges (18) are arranged on the surface, opposite to the through hole (17), of the extrusion strip (15); the through hole (17) is connected with the extrusion block (14) in a sliding mode, an inclined plane is arranged on the lower surface of the front end of the extrusion block (14), the inclined plane can be extruded on the edge of the PCB (2), the upper surface and the lower surface of the extrusion block (14) are connected onto the inner side wall of the sliding hole (16) through a reset spring (19), and the rear end face of the extrusion block (14) is extruded on the extrusion strip (15) and the bulge (18).
5. A selective plating hole apparatus according to claim 4, wherein: the rear end of each extrusion block (14) is provided with a rotary groove (20), the rotary groove (20) is rotationally connected with a roller body (21), and the roller body (21) is attached to the surfaces of the extrusion strip (15) and the protrusions (18) to roll.
6. A selective plating hole apparatus according to claim 2, wherein: the blanking assembly is symmetrically and fixedly connected with an electric push rod (22) of a first plate (8), a push plate (23) is fixedly connected to the end part of the electric push rod (22), and the push plate (23) is attached to the upper surface of the supporting plate (9) to slide; the PCB is characterized in that the two ends of the base (1) are provided with material guide plates (24), the material guide plates (24) extend downwards in an inclined mode, the lower ends of the material guide plates (24) are provided with material boxes (25), and the material boxes (25) are used for containing the PCB (2).
7. A selective plating hole apparatus according to claim 6, wherein: the front end face on the push plate (23) is provided with a positioning column (26), the positioning column (26) is vertically attached to the push plate (23), and the positioning column (26) is adapted to a positioning groove on the PCB (2).
8. A selective plating hole apparatus according to claim 6, wherein: a plurality of material tanks (27) are arranged in the material tank (25), ultraviolet lamps are arranged in each material tank (27), supporting blocks (28) are arranged at the corners of the bottom of the material tank (25), a screw rod (29) is connected below the supporting blocks (28) in a conveying mode, and threads on the screw rod (29) are symmetrically arranged.
9. A selective plating hole apparatus according to claim 4, wherein: inlet chamfers (30) are arranged at the two ends of the concave part (3).
10. A selective plating hole process, which is applied to the selective plating hole apparatus according to any one of claims 1 to 9, characterized in that: the selective hole plating process comprises the following steps:
s1: punching holes on the PCB (2), customizing corresponding hollow shells (10), and drilling overflow holes (11) on the lower surface of each hollow shell (10), wherein the positions of each overflow hole (11) are in one-to-one correspondence with the holes on the PCB (2);
s2: feeding, namely warming hole filling resin, injecting the hole filling resin into the hollow shell (10) through the pump body, and then filling the hole filling resin into the hole on the PCB (2);
s3: grinding, namely grinding redundant hole filling resin on the surface of the PCB (2) away;
s4: and then copper plating is carried out on the surface of the PCB (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311516807.6A CN117377233B (en) | 2023-11-14 | 2023-11-14 | Selective plating hole equipment and electroplating selective plating hole process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311516807.6A CN117377233B (en) | 2023-11-14 | 2023-11-14 | Selective plating hole equipment and electroplating selective plating hole process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117377233A true CN117377233A (en) | 2024-01-09 |
| CN117377233B CN117377233B (en) | 2024-04-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311516807.6A Active CN117377233B (en) | 2023-11-14 | 2023-11-14 | Selective plating hole equipment and electroplating selective plating hole process |
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| Country | Link |
|---|---|
| CN (1) | CN117377233B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN203805464U (en) * | 2013-07-17 | 2014-09-03 | 昆山双特科技有限公司 | Fully-automatic jack, double-side and screen integrated printing machine |
| CN116217258A (en) * | 2023-01-03 | 2023-06-06 | 东阳东磁自动化科技有限公司 | Full-automatic hole filling equipment for ceramic substrate and implementation method thereof |
-
2023
- 2023-11-14 CN CN202311516807.6A patent/CN117377233B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101711096A (en) * | 2009-11-05 | 2010-05-19 | 惠州中京电子科技股份有限公司 | Micro hole manufacturing process of multilayer HDI circuit board |
| CN203805464U (en) * | 2013-07-17 | 2014-09-03 | 昆山双特科技有限公司 | Fully-automatic jack, double-side and screen integrated printing machine |
| CN116217258A (en) * | 2023-01-03 | 2023-06-06 | 东阳东磁自动化科技有限公司 | Full-automatic hole filling equipment for ceramic substrate and implementation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117377233B (en) | 2024-04-19 |
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