CN117374017A - Chip heat dissipation packaging structure - Google Patents

Chip heat dissipation packaging structure Download PDF

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Publication number
CN117374017A
CN117374017A CN202210764654.6A CN202210764654A CN117374017A CN 117374017 A CN117374017 A CN 117374017A CN 202210764654 A CN202210764654 A CN 202210764654A CN 117374017 A CN117374017 A CN 117374017A
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CN
China
Prior art keywords
heat dissipation
chip
pattern
ring structure
recited
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Pending
Application number
CN202210764654.6A
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Chinese (zh)
Inventor
甘明丰
罗宇轩
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Sanechips Technology Co Ltd
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Sanechips Technology Co Ltd
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Filing date
Publication date
Application filed by Sanechips Technology Co Ltd filed Critical Sanechips Technology Co Ltd
Priority to CN202210764654.6A priority Critical patent/CN117374017A/en
Publication of CN117374017A publication Critical patent/CN117374017A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package

Abstract

The embodiment of the application provides a chip heat dissipation packaging structure, which comprises: the chip 201, the base plate 202, the discrete components 203, the metal heat dissipation layer 204, the reinforcing ring structure 205, the heat dissipation cover plate 206 and the solder balls 207, wherein the solder balls 207 are welded on the lower surface of the 202, the 201 and 203 are arranged on the upper surface of the 202, the 204 covers the top of the 201, the 205 is adhered on the 202, the 206 covers the 205, the ring of the 205 surrounds the laminated structure of the 201 and 204, the lower surface of the ring of the 205 is provided with a concave area for accommodating the 203, the 203 is isolated from the 201 through the inner wall of the ring of the 205, the problem that the BGA chip package in the related art adopts a single heat dissipation cover structure, the heat dissipation performance of the product is poor, the sputtered heat dissipation material can have adverse effects on the edge structure of the chip and the discrete components, the problem of the packaging yield of the chip is reduced, the components are protected from the overflow of the metal material, and the heat dissipation performance of the product is improved.

Description

Chip heat dissipation packaging structure
Technical Field
The embodiment of the application relates to the field of communication, in particular to a chip heat dissipation packaging structure.
Background
Ball grid array packages (Ball Grid Array Package, abbreviated as BGA) are an important form of packaging for current chip package products. The active surface of the chip is connected with the substrate by a solder ball array by adopting a flip chip technology, and a heat dissipation cover is attached to the back surface of the chip.
Fig. 1 is a schematic structural diagram of a BGA chip package according to the related art, and as shown in fig. 1, a chip 101 is flip-chip mounted on top of a substrate 102; discrete components 103 are arranged around the chip in a scattered manner, such as a capacitor, a resistor and the like; a heat-dissipating interface material 104, such as a heat-conducting paste or an indium sheet, is placed on and covers the back surface of the chip; the concave metal heat dissipation cover 105 is adhered to the top of the substrate through an adhesive, and is made of a heat dissipation material with high heat conductivity coefficient, such as copper, aluminum and the like, and is connected with the metal heat dissipation layer and used for protecting the chip and the discrete components from external factors; the bottom of the substrate is soldered with an array of solder balls 106. The packaging structure welds the heat dissipation interface material between the chip and the heat dissipation cover through a high-temperature reflow soldering process, and fixes the adhesive layer structure between the heat dissipation cover and the substrate.
The BGA chip and the heat dissipating cover are generally connected by a heat conductive adhesive (Thermal Interface Material, abbreviated as TIM), and in the scene of increasing the chip size requirement and circuit density in recent years, the power consumption of the chip is higher and higher, and the heat dissipating fins such as Indium (Indium) with better heat dissipating performance have a tendency to replace the organic heat conductive adhesive. However, as the soldering flux has volatility and the melting point of the indium radiating fin is low, the volatilized gas of the soldering flux can squeeze the molten radiating fin in the high-temperature reflow soldering process, so that the radiating fin material overflows, a cavity is formed between the chip and the radiating cover, the radiating performance of a product is affected, and meanwhile, the sputtered radiating material can have adverse effects on the edge structure of the chip and discrete components, and the packaging yield of the chip is reduced.
Aiming at the problems that in the related art, a single radiating cover structure is adopted for BGA chip packaging, the radiating performance of a product is poor, the sputtered radiating material can produce adverse effects on the edge structure of the chip and discrete components, and the packaging yield of the chip is reduced, no solution is proposed yet.
Disclosure of Invention
The embodiment of the application provides a chip heat dissipation packaging structure, which at least solves the problems that in the related art, a single heat dissipation cover structure is adopted for BGA chip package, the heat dissipation performance of a product is poor, the sputtered heat dissipation material can produce adverse effects on a chip edge structure and discrete components, and the packaging yield of the chip is reduced.
In an embodiment of the present application, a chip heat dissipation package structure is provided, including: the chip 201, the substrate 202, the discrete components 203, the metal heat dissipation layer 204, the reinforcing ring structure 205, the heat dissipation cover plate 206 and the solder balls 207, wherein the solder balls 207 are welded on the lower surface of the substrate 202, the chip 201 and the discrete components 203 are arranged on the upper surface of the substrate 202, the metal heat dissipation layer 204 covers the top of the chip 201, the reinforcing ring structure 205 is adhered on the upper side of the substrate 202, the heat dissipation cover plate 206 is covered on the upper side of the reinforcing ring structure 205,
the laminated structure of the chip 201 and the metal heat dissipation layer 204 is enclosed in the ring of the reinforcement ring structure 205, a recessed area for accommodating the discrete component 203 is provided on the ring lower surface of the reinforcement ring structure 205, and the discrete component 203 is isolated from the chip 201 by the inner wall of the ring of the reinforcement ring structure 205.
In an embodiment, a gold-plating area is disposed at the center of the bottom surface of the heat dissipating cover 206 and the back surface of the chip 201, and the gold-plating area is in contact with the metal heat dissipating layer 204, where the gold-plating area includes a first gold-plating layer and a second gold-plating layer.
In one embodiment, the gold-plated area of the heat sink cover 206 is provided with a recess area 208, and the metal heat sink layer 204 is partially or entirely embedded in the recess area 208.
In one embodiment, the bottom surface of the groove region 208 is provided with a plurality of channel sub-regions.
In an embodiment, an inner wall 209 is disposed at the boundary of the inner ring area of the reinforcing ring structure 205, and the inner wall 209 and the reinforcing ring structure 205 are integrally formed or independently disposed, wherein the inner wall 209 is made of glass, rubber, resin or plastic packaging material.
In an embodiment, in the case where the inner wall 209 is rubber, resin, or molding material, the discrete component 203 is embedded in the rubber, the resin, or the molding material.
In an embodiment, the central protruding surface of the heat dissipating cover 206 is a central concave surface, and the central concave surface is matched with the stack height of the chip 201 and the metal heat dissipating layer 204; or alternatively
The central protruding surface of the heat dissipating cover 206 is a central plane, and the central plane is matched with the lamination height of the chip 201 and the metal heat dissipating layer 204; or alternatively
The central protruding surface of the heat dissipating cover 206 is a central convex surface, and the central convex surface is matched with the lamination height of the chip 201 and the metal heat dissipating layer 204.
In one embodiment, the stiffening ring structure 205 includes an outer ring region and an inner ring region;
in the case that the inner wall 209 is not disposed at the boundary of the inner ring region of the reinforcement ring structure 205, the adhesive pattern of the corresponding contact region of the substrate 202 is divided into an outer ring pattern and an inner ring pattern, the adhesive of the outer ring pattern is used for bonding the outer ring region, and the adhesive of the inner ring pattern is used for bonding the inner ring region;
in the case that the inner wall 209 is disposed at the boundary of the inner ring region of the reinforcing ring structure 205 and the inner wall 209 is resin or plastic molding compound, the adhesive pattern of the corresponding contact region of the substrate 202 is an outer ring pattern, and the adhesive of the outer ring pattern is used for bonding the outer ring region;
the stiffener ring structure 205 is attached to the heat spreader lid 206 by a top adhesive.
In an embodiment, the outer ring pattern is of a non-closed-loop structure, and an exhaust channel is preset at a non-closed position of the non-closed-loop structure; the inner ring pattern is of a closed loop structure; the pattern of the top adhesive is a non-closed pattern.
In an embodiment, the plurality of chips 201 are integrated in the same package, the metal heat dissipation layer 204 is disposed above each chip 202, and the metal heat dissipation layer 204 disposed above each chip 202 is in contact with the heat dissipation cover 206.
In an embodiment, a plurality of annular groove subregions are disposed on the bottom surface of the heat dissipating cover 206, where the annular groove subregions do not overlap with each other, one annular groove subregion corresponds to a soldering position of one chip, and a recess depth of each annular groove subregion corresponds to a corresponding chip height.
In one embodiment, the material used for the reinforcing ring structure 205 includes one of the following: copper, stainless steel, composite; and/or the metal heat dissipation layer 204 is an indium sheet; and/or the difference between the coefficient of thermal expansion of the stiffener ring structure 205 and the coefficient of thermal expansion of the substrate 202 is less than a predetermined threshold; and/or the heat sink deck 206 is a high thermal conductivity material.
According to the embodiment of the application, the problem that the packaging yield of the chip is reduced due to the fact that the BGA chip packaging in the related technology adopts a single radiating cover structure and is poor in radiating performance of the product, the sputtered radiating material can produce adverse effects on the chip edge structure and discrete components is solved, the reinforcing ring structure and the radiating cover plate are adopted, the discrete components are contained at the bottom of the reinforcing ring, the components are protected from being influenced by overflow of metal materials, and the radiating performance of the product is improved through the mode that the reinforcing ring structure and the radiating cover plate radiate heat respectively.
Drawings
FIG. 1 is a schematic diagram of a BGA chip package in accordance with the related art;
FIG. 2 is a schematic diagram of a chip heat dissipation package structure according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a chip heat spreader package according to an alternative embodiment of the present application;
FIG. 4 is a second schematic diagram of a chip heat dissipation package structure according to an alternative embodiment of the present application;
FIG. 5 is a schematic diagram III of a chip heat dissipation package structure in accordance with an alternative embodiment of the present application;
FIG. 6 is a schematic illustration of a stiffener ring and heat spreader lid structure according to an alternative embodiment of the present disclosure;
fig. 7 is a second schematic view of a stiffener ring and heat spreader lid structure according to an alternative embodiment of the present disclosure.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings in conjunction with the embodiments.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
In this embodiment, a chip heat dissipation package structure is provided, and fig. 2 is a schematic diagram of the chip heat dissipation package structure according to an embodiment of the present application, as shown in fig. 2, including: the chip 201, the base plate 202, the discrete component 203, the metal heat dissipation layer 204, the reinforcing ring structure 205, the heat dissipation cover plate 206 and the solder balls 207, wherein the solder balls 207 are welded on the lower surface of the base plate 202, the chip 201 and the discrete component 203 are arranged on the upper surface of the base plate 202, the metal heat dissipation layer 204 covers the top of the chip 201, the reinforcing ring structure 205 is adhered on the base plate 202, the heat dissipation cover plate 206 covers the reinforcing ring structure 205, wherein the inner ring of the reinforcing ring structure 205 surrounds the laminated structure of the chip 201 and the metal heat dissipation layer 204, the lower surface of the reinforcing ring structure 205 is provided with a concave area for accommodating the discrete component 203, and the discrete component 203 is isolated from the chip 201 through the inner ring wall of the reinforcing ring structure 205.
Fig. 3 is a schematic diagram of a chip heat dissipation package structure according to an alternative embodiment of the present application, as shown in fig. 3, a gold-plating area is disposed at the center of the bottom surface of the heat dissipation cover 206 and at the back of the chip 201, and is in contact with the metal heat dissipation layer 204, wherein the gold-plating area includes a first gold-plating layer and a second gold-plating layer, i.e. the plated metal material can be divided into two layers, the chemical properties of the first gold-plating layer are relatively stable, the second gold-plating layer is easily infiltrated with the metal heat dissipation layer 204, the gold-plating area is in contact with the metal heat dissipation layer 204, and the non-gold-plating area is not in contact with the metal heat dissipation layer 204. The gold-plated area of the heat sink cover 206 is provided with a recessed area 208, and the metal heat sink layer 204 is partially or entirely embedded in the recessed area 208. Further, the bottom surface of the recess region 208 may be provided with a plurality of channel sub-regions. That is, a recess area 208 may be provided in the center of the heat sink deck 206 in the gold-plated area, such that the metal heat sink layer 204 may be partially or fully embedded in the recess 208. Optionally, the bottom surface of the recess region 208 is divided into a plurality of sub-regions by channels, which serve to reduce the mobility of the metal heat sink layer during high temperature processes.
Fig. 4 is a schematic diagram two of a chip heat dissipation package structure according to an alternative embodiment of the present application, as shown in fig. 4, an inner wall 209 is disposed at a boundary of an inner ring area of the stiffener ring structure 205, and the inner wall 209 and the stiffener ring structure 205 are integrally formed or independently disposed, wherein the inner wall 209 is made of glass, rubber, resin or plastic packaging material.
In an embodiment, in the case that the inner wall 209 is made of rubber, resin or plastic packaging material, the discrete component 203 is embedded in the rubber, resin or plastic packaging material, which has the effect of improving the air tightness and impact resistance of the component.
Fig. 5 is a schematic diagram III of a chip heat dissipation package structure according to an alternative embodiment of the present application, as shown in fig. 5, a central protruding surface of the heat dissipation cover 206 is a central concave surface, and the central concave surface is matched with the stack height of the chip 201 and the metal heat dissipation layer 204; or the central protruding surface of the heat dissipation cover plate 206 is a central plane, and the central plane is matched with the lamination height of the chip 201 and the metal heat dissipation layer 204; or the central protruding surface of the heat dissipating cover 206 is a central convex surface, which is matched with the stack height of the chip 201 and the metal heat dissipating layer 204.
Fig. 6 is a schematic diagram of a stiffener ring and a heat dissipating cover structure according to an alternative embodiment of the present disclosure, as shown in fig. 6, the stiffener ring structure 205 includes an outer ring region and an inner ring region, and in the case that the inner ring region boundary of the stiffener ring structure 205 is not provided with an inner wall 209, an adhesive pattern of a corresponding contact region of the substrate 202 is divided into an outer ring pattern and an inner ring pattern, an adhesive of the outer ring pattern is used for bonding the outer ring region, and an adhesive of the inner ring pattern is used for bonding the inner ring region; in the case that the inner wall 209 is disposed at the boundary of the inner ring region of the reinforcing ring structure 205 and the inner wall 209 is resin or plastic molding compound, the adhesive pattern of the corresponding contact region of the substrate 202 is an outer ring pattern, and the adhesive of the outer ring pattern is used for bonding the outer ring region, since the inner ring is disposed with the inner wall and the inner wall structure is resin, plastic molding compound, etc., bonding is not required; the stiffener ring structure 205 is attached to the heat spreader lid 206 by a top adhesive. Further, the outer ring pattern is of a non-closed-loop structure, and an exhaust channel is preset at a non-closed position of the non-closed-loop structure; the inner ring pattern is a closed loop structure and the pattern of the top adhesive is a non-closed pattern.
Fig. 7 is a schematic diagram of a stiffener ring and heat dissipating cover structure according to an alternative embodiment of the present application, as shown in fig. 7, a plurality of chips 201 are integrated in the same package, the size of the area surrounded by the inner ring area of the stiffener ring structure 205 for arranging the plurality of chips 201 is determined according to the number and the size of the chips 201, a metal heat dissipating layer 204 is disposed above the chips 202, and the metal heat dissipating layer 204 disposed above each chip 202 is in contact with the heat dissipating cover 206. Further, a plurality of annular groove subregions are disposed on the bottom surface of the heat dissipating cover 206, wherein the annular groove subregions are not overlapped with each other, one annular groove subregion corresponds to a soldering position of one chip, and a recess depth of each annular groove subregion corresponds to a corresponding chip height.
For example, a first chip and a second chip (corresponding to the chip 201) are mounted on the substrate 202, the first chip and the second chip are integrated in the same package, a metal heat dissipation layer made of the same material is disposed above the second chip, and the metal heat dissipation layers disposed above the first chip and the second chip are all in contact with the metal heat dissipation cover plate. Further, two annular groove subregions which are not overlapped with each other are manufactured on the bottom surface of the heat dissipation cover plate 206, and correspond to the welding positions of the first chip and the second chip, and the concave depth of each groove corresponds to the height of the corresponding chip.
In this embodiment, the material used for the reinforcing ring structure 205 includes one of the following materials: copper, stainless steel, composite material, i.e. the material used for the reinforcing ring structure 205 may be copper, stainless steel, composite material, etc. with stronger anti-warping property; and/or the metal heat spreader 204 is an indium sheet; and/or the difference between the coefficient of thermal expansion of the stiffener ring structure 205 and the coefficient of thermal expansion of the substrate 202 is less than a predetermined threshold; and/or the heat sink deck 206 is a high thermal conductivity material.
In the embodiment, the bottom of the reinforcing ring accommodates discrete components, the components such as a capacitor and a resistor are protected from being influenced by overflow of metal materials, and meanwhile, the reinforcing ring adopts materials with the thermal expansion coefficient similar to that of the substrate material, so that the warping of a chip caused by temperature change is reduced; the top heat dissipation cover plate provided has the advantages that the indium sheet is pressed, the heat dissipation function is achieved, the exhaust channel is provided at the joint of the cover plate and the top of the reinforcing ring through the arrangement of the adhesive, and the chip exhaust efficiency in the high-temperature reflow soldering process is optimized.
Specific examples in this embodiment may refer to the examples described in the foregoing embodiments and the exemplary implementation, and this embodiment is not described herein.
It will be appreciated by those skilled in the art that the modules or steps of the application described above may be implemented in a general purpose computing device, they may be concentrated on a single computing device, or distributed across a network of computing devices, they may be implemented in program code executable by computing devices, so that they may be stored in a storage device for execution by computing devices, and in some cases, the steps shown or described may be performed in a different order than that shown or described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple modules or steps of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application should be included in the protection scope of the present application.

Claims (12)

1. The utility model provides a chip heat dissipation packaging structure which characterized in that includes: chip (201), base plate (202), discrete components and parts (203), metal heat dissipation layer (204), reinforcing ring structure (205), heat dissipation apron (206) and solder ball (207), solder ball (207) weld in the lower surface of base plate (202), chip (201) and discrete components and parts (203) set up in the upper surface of base plate (202), metal heat dissipation layer (204) cover in chip (201) top, reinforcing ring structure (205) adhere in base plate (202) top, heat dissipation apron (206) lid is located reinforcing ring structure (205) top, wherein,
the laminated structure of the chip (201) and the metal heat dissipation layer (204) is surrounded in the ring of the reinforcing ring structure (205), a concave area for accommodating the discrete components (203) is arranged on the lower surface of the ring of the reinforcing ring structure (205), and the discrete components (203) are isolated from the chip (201) through the inner wall of the ring of the reinforcing ring structure (205).
2. The heat spreader package as recited in claim 1, wherein,
the bottom center of the heat dissipation cover plate (206) and the back of the chip (201) are both provided with a gold-plating area, and the gold-plating area is in contact with the metal heat dissipation layer (204), wherein the gold-plating area comprises a first gold-plating layer and a second gold-plating layer.
3. The heat spreader package as recited in claim 2, wherein,
the gold-plated area of the heat dissipation cover plate (206) is provided with a groove area (208), and the metal heat dissipation layer (204) is partially or completely embedded in the groove area (208).
4. The heat dissipation package as recited in claim 3, wherein,
a plurality of channel sub-regions are arranged on the bottom surface of the groove region (208).
5. The heat spreader package as recited in claim 1, wherein,
the inner ring area boundary of the reinforcing ring structure (205) is provided with an inner wall (209), and the inner wall (209) and the reinforcing ring structure (205) are integrally formed or independently arranged, wherein the inner wall (209) is made of glass, rubber, resin or plastic packaging material.
6. The heat spreader package as recited in claim 5, wherein,
when the inner wall (209) is made of rubber, resin, or plastic, the discrete component (203) is embedded in the rubber, resin, or plastic.
7. The heat spreader package as recited in claim 1, wherein,
the central protruding surface of the heat dissipation cover plate (206) is a central concave surface, and the central concave surface is matched with the lamination height of the chip (201) and the metal heat dissipation layer (204); or alternatively
The central protruding surface of the heat dissipation cover plate (206) is a central plane, and the central plane is matched with the lamination height of the chip (201) and the metal heat dissipation layer (204); or alternatively
The central protruding surface of the heat dissipation cover plate (206) is a central convex surface, and the central convex surface is matched with the lamination height of the chip (201) and the metal heat dissipation layer (204).
8. The heat spreader package as recited in claim 5, wherein,
the reinforcement ring structure (205) comprises an outer ring region and an inner ring region;
in the case that the inner ring region boundary of the reinforcing ring structure (205) is not provided with the inner wall (209), the adhesive pattern of the corresponding contact region of the substrate (202) is divided into an outer ring pattern and an inner ring pattern, the adhesive of the outer ring pattern is used for bonding the outer ring region, and the adhesive of the inner ring pattern is used for bonding the inner ring region;
in the case that the inner wall (209) is disposed at the boundary of the inner ring region of the reinforcing ring structure (205) and the inner wall (209) is resin or plastic molding material, the adhesive pattern of the corresponding contact region of the substrate (202) is an outer ring pattern, and the adhesive of the outer ring pattern is used for bonding the outer ring region;
the reinforcing ring structure (205) is connected with the heat dissipation cover plate (206) through top adhesive.
9. The heat spreader package as recited in claim 8, wherein,
the outer ring pattern is of a non-closed-loop structure, and an exhaust channel is preset at a non-closed position of the non-closed-loop structure; the inner ring pattern is of a closed loop structure; the pattern of the top adhesive is a non-closed pattern.
10. The heat spreader package as recited in claim 1, wherein,
the plurality of chips (201) are integrated in the same package, the metal heat dissipation layers (204) are arranged above each chip (201), and the metal heat dissipation layers (204) arranged above each chip (201) are in contact with the heat dissipation cover plate (206).
11. The heat spreader package as recited in claim 10, wherein,
a plurality of annular groove subregions which are not overlapped with each other are arranged on the bottom surface of the heat radiation cover plate (206), one annular groove subregion corresponds to the welding position of one chip, and the concave depth of each annular groove subregion corresponds to the height of the corresponding chip.
12. The heat dissipation package as recited in any one of claims 1-11, wherein,
the material used for the reinforcing ring structure (205) comprises one of the following materials: copper, stainless steel, composite; and/or
The metal heat dissipation layer (204) is an indium sheet; and/or
The difference between the thermal expansion coefficient of the reinforcement ring structure (205) and the thermal expansion coefficient of the substrate (202) is smaller than a preset threshold value; and/or
The heat sink cover (206) is a high thermal conductivity material.
CN202210764654.6A 2022-06-30 2022-06-30 Chip heat dissipation packaging structure Pending CN117374017A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210764654.6A CN117374017A (en) 2022-06-30 2022-06-30 Chip heat dissipation packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210764654.6A CN117374017A (en) 2022-06-30 2022-06-30 Chip heat dissipation packaging structure

Publications (1)

Publication Number Publication Date
CN117374017A true CN117374017A (en) 2024-01-09

Family

ID=89402725

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210764654.6A Pending CN117374017A (en) 2022-06-30 2022-06-30 Chip heat dissipation packaging structure

Country Status (1)

Country Link
CN (1) CN117374017A (en)

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