CN117374007B - Semiconductor rib cutting forming device with cutter switching function - Google Patents

Semiconductor rib cutting forming device with cutter switching function Download PDF

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Publication number
CN117374007B
CN117374007B CN202311638397.2A CN202311638397A CN117374007B CN 117374007 B CN117374007 B CN 117374007B CN 202311638397 A CN202311638397 A CN 202311638397A CN 117374007 B CN117374007 B CN 117374007B
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extrusion
adjacent
fixedly connected
plate
limiting
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CN117374007A (en
Inventor
钟泽武
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Rongtai Semiconductor Jiangsu Co ltd
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Rongtai Semiconductor Jiangsu Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F1/00—Bending wire other than coiling; Straightening wire
    • B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The invention relates to a semiconductor rib cutting forming device with a cutter switching function, and belongs to the technical field of semiconductor production and processing. Aiming at the problem that the production efficiency is affected by changing the cutter in the processing process of the semiconductor chip. The invention provides a semiconductor rib cutting forming device with a cutter switching function, which comprises a shell, wherein a symmetrically distributed fixed shell is fixedly connected to the upper side of the shell, a first electric push rod is fixedly connected to the fixed shell on one side, a first slide rod is slidingly connected to the fixed shell on the other side, a fixed shaft is fixedly connected to the telescopic end of the first electric push rod and the adjacent first slide rod together, a rotating shaft is rotatably connected to the fixed shaft, a cutter holder is mounted on the rotating shaft, a sliding block is slidingly connected to the fixed shell, and the cutter holder is slidingly connected to the symmetrically distributed sliding block together. According to the invention, through the mutually matched relation among the rotating shaft, the fixed shaft and the tool apron, the two tool apron are mutually converted, and the continuity of the processing process is not affected.

Description

Semiconductor rib cutting forming device with cutter switching function
Technical Field
The invention relates to the technical field of semiconductor production and processing, in particular to a semiconductor rib cutting forming device with a cutter switching function.
Background
The semiconductor chip is a commonly used electronic component, when the semiconductor chip is prepared, a method of directly carrying out plastic package on a lead frame is generally adopted, then a rib cutting forming device is used for cutting the semiconductor chip, the semiconductor chip is independent from the lead frame, but the existing rib cutting forming integrated machine is usually only provided with one group of rib cutting tools, when the rib cutting tools are used for a long time or accidentally collide in the cutting process, the rib cutting tools are seriously ground or broken, the quality of the processed semiconductor chip can be obviously reduced, pins are broken or lost seriously, the chip is directly scrapped, when the quality of the semiconductor chip is problematic, the rib cutting process integrated machine can only be used for replacing the tools, the mode has lower efficiency, the installed tools still can be used after being debugged and calibrated again, the current production line is stopped, and the production efficiency of the semiconductor chip is seriously influenced.
Disclosure of Invention
In order to overcome the defect that the production efficiency is affected by changing a cutter in the processing process of a semiconductor chip, the invention provides a semiconductor rib cutting forming device with a cutter switching function.
The technical implementation scheme of the invention is as follows: the utility model provides a semiconductor cuts muscle forming device with cutter switching function, includes the shell, the rigid coupling has the bearing plate in the shell, the upside rigid coupling of shell has control panel and symmetric distribution's fixed shell, one side the fixed shell rigid coupling has first electric putter, the opposite side the fixed shell sliding connection has first slide bar, the flexible end of first electric putter and adjacent first slide bar common rigid coupling has the fixed axle, the fixed axle rotates and is connected with the axis of rotation, the axis of rotation detachable installs the blade holder, fixed shell sliding connection has the sliding block, symmetric distribution the sliding block common detachable sliding connection has the blade holder, the axis of rotation with adjacent on the sliding block the blade holder cooperation, just on the axis of rotation the blade holder with adjacent and symmetric distribution on the sliding block the blade holder is symmetric distribution, install evenly distributed cuts the muscle sword on the blade holder, the fixed axle is equipped with and is used for switching with the flexible sword mechanism of blade holder that links to each other, be equipped with in the shell and be used for extruding semiconductor lead frame's extrusion mechanism and be used for uninstalling and detecting the chip jointly detachable sliding block, first electric control mechanism with the extrusion mechanism.
The cutter changing mechanism comprises a first limiting ball, the first limiting ball is connected in the adjacent fixed shafts in a sliding mode, springs are fixedly connected between the first limiting ball and the adjacent fixed shafts, the first limiting ball is matched with the adjacent rotating shafts, the rotating shafts are connected with first limiting blocks in a sliding mode, tension springs are fixedly connected between the adjacent first limiting blocks, the fixed shafts are fixedly connected with extrusion rings matched with the adjacent first limiting blocks, cutter holders are provided with grooves matched with the adjacent first limiting blocks, second limiting balls in a sliding mode are connected with opposite sides of the sliding blocks in a sliding mode, springs are fixedly connected between the second limiting balls and the adjacent sliding blocks, grooves matched with the adjacent second limiting balls are formed in the cutter holders, unidirectional gears are mounted on the rotating shafts, and racks matched with the unidirectional gears are arranged on the fixing shells.
According to the preferred technical scheme, the width of one side of the extrusion ring, which faces the tool apron on the sliding block, is minimum, and the width of the extrusion ring is kept unchanged after the minimum position is gradually changed from small to large.
The preferred technical scheme, extrusion mechanism is including the second electric putter, the second electric putter rigid coupling in the shell, and its flexible end face the shell is inboard, the flexible end rigid coupling of second electric putter has first stripper, first stripper sliding connection has the second slide bar of symmetric distribution, the symmetric distribution the second slide bar all runs through the shell, the flexible end rigid coupling of second electric putter has spacing disc, the flexible end of second electric putter has the second stripper through its spacing disc spacing sliding connection, the symmetric distribution the second slide bar all with second stripper rigid coupling is connected, the second stripper rigid coupling has pressure sensor, pressure sensor with the rigid coupling has first elastic component between the first stripper, pressure sensor with the second electric putter all with the control panel electricity is connected.
According to the preferred technical scheme, the lower side of the second extrusion plate is provided with the convex blocks with the width equal to the space between the semiconductor leads, and the convex blocks are used for limiting the leads of the adjacent semiconductor chips.
The preferred technical scheme, shedding mechanism is including the third electric putter, the third electric putter pass through the support rigid coupling in the shell, the third electric putter is located the downside of bearing plate, the flexible end rigid coupling of third electric putter has the movable frame, the downside rotation of bearing plate is connected with the transmission shaft of symmetric distribution, the transmission shaft rigid coupling has evenly distributed's layer board, evenly distributed the transmission shaft all with the movable frame passes through rack and pinion transmission, the bearing plate rigid coupling has symmetric and evenly distributed's limiting plate, the limiting plate with adjacent the layer board cooperation, the shell is connected with symmetric distribution's electric rotating shaft through the support rotation, the shell rigid coupling has the flitch that is, symmetric distribution around being equipped with the net conveyer belt between the electric rotating shaft, the shell is equipped with the letter sorting subassembly that is used for detecting semiconductor chip, letter sorting subassembly third electric putter with electric rotating shaft all with the control panel electricity is connected.
According to the preferred technical scheme, the material-feeding plate is positioned at the lower side of the bearing plate, and the material-feeding plate and the grid conveyor belt are matched to form a cavity with an opening at the upper side for accommodating the semiconductor chip.
The preferable technical scheme, the letter sorting subassembly is including evenly distributed's optical detector, evenly distributed optical detector all set up in the bearing plate towards one side that is the flitch, be the flitch and install evenly distributed's electrically operated gate, the bearing plate has the conveyer belt through support mounting, electrically operated gate with the conveyer belt all with the control panel electricity is connected.
The preferred technical scheme is characterized by further comprising a pin forming mechanism for extruding and bending pins of the semiconductor chip, wherein the pin forming mechanism is arranged on the second extrusion plate, the pin forming mechanism comprises first arc plates which are symmetrically and uniformly distributed, the first arc plates which are symmetrically and uniformly distributed are fixedly connected with adjacent tool holders, the second extrusion plate is in sliding connection with first sliding plates which are symmetrically and uniformly distributed, a second elastic piece is fixedly connected between the first sliding plate and the second extrusion plate through a bracket, the first sliding plate is fixedly connected with adjacent bracket limit fit of the second elastic piece, the first sliding plate is in sliding connection with a first extrusion block through a sliding rod, the width of the first extrusion block is the same as the width of the pins of the semiconductor, a third elastic piece is fixedly connected between the first extrusion block and the adjacent first arc plates, a second sliding plate which is uniformly distributed is fixedly connected with the upper side of the first extrusion block, a limit block, a second extrusion block which is uniformly distributed, a second arc plate which is uniformly distributed, a limit block which is uniformly distributed between the second extrusion block, a second extrusion block which is uniformly distributed, a limit block which is uniformly distributed between the second extrusion block and the second extrusion block are uniformly distributed, a limit block which is fixedly connected with the adjacent arc plates, a limit block which is uniformly distributed between the second extrusion block and the second arc plates, and the adjacent arc plates are uniformly distributed, the limit block which are uniformly distributed between the limit block are connected with the adjacent arc plates, and the limit block are fixedly connected with the adjacent, evenly distributed the backup pad all with the adjacent gag lever post spacing cooperation, the gag lever post rigid coupling has the connecting rod, second stripper plate sliding connection has symmetrical and evenly distributed's third stopper, third stopper and adjacent first stripper block spacing cooperation, symmetrical and evenly distributed all the rigid coupling has the extension spring between third stopper and the adjacent second stripper plate, the connecting rod pierces through adjacent second stripper plate and with adjacent third stopper cooperation, blade holder spacing sliding connection has evenly distributed's third extrusion piece, evenly distributed all the rigid coupling has the spring between third extrusion piece and the adjacent the blade holder, third extrusion piece and adjacent third stopper extrusion cooperation, the limiting plate rigid coupling has the reset lever, evenly distributed the second stopper respectively with adjacent reset lever extrusion cooperation.
The preferred technical scheme still including being used for carrying out the positioning mechanism of semiconductor chip, positioning mechanism set up in the bearing plate, positioning mechanism is including the fourth electric putter of symmetric distribution, the symmetric distribution the fourth electric putter all through the support rigid coupling in the bearing plate, the flexible end rigid coupling of fourth electric putter has electric slide rail, electric slide rail sliding connection has electric slider, the symmetric distribution electric slider joint has the movable frame, electric slide rail rigid coupling has the fourth stopper, the fourth stopper is equipped with and lead frame complex projection, movable frame sliding connection has evenly distributed's expansion piece, mutually be close to expansion piece joint has a slide cylinder, the quantity of slide cylinder is the same with the spacing hole quantity near the lead frame by the cutting, adjacent expansion piece with adjacent the common rigid coupling of slide cylinder has the rubber sleeve, slide cylinder sliding connection has the fourth extrusion piece, fourth extrusion piece with the rigid coupling has the fifth elastic component between the movable frame, the elasticity of fifth elastic component is less than the elastic sleeve the fourth extrusion piece with the fourth extrusion piece is equipped with the equal extrusion piece with the fourth extrusion piece, the fourth extrusion piece is equipped with the blind hole.
Compared with the prior art, the invention has the following beneficial effects at least:
1. according to the invention, through the mutually matched relation among the rotating shaft, the fixed shaft and the tool apron, the device is provided with two groups of rib cutting tools, when the problem of a semiconductor chip is detected, the first electric push rod drives the fixed shaft to move in a machining gap, the tool apron loaded on the first electric push rod is converted, the continuity of the machining process is not affected, and because the replaced tool apron is positioned above the shell, the rib cutting tools on the sliding block can be conveniently checked and replaced by a worker in the machining process.
2. The invention accurately detects the processed and formed semiconductor chips in time through the optical detector, screens unqualified semiconductor chips through the electric door, and assists staff to judge and replace the cutter in time.
3. According to the invention, the first extrusion block and the adjacent second extrusion block extrude the semiconductor pins mutually, pins are fixed when a rib cutting knife performs a rib cutting operation, after the semiconductor chip is cut, the pins between the first extrusion block and the adjacent second extrusion block are extruded through the first extrusion block and the adjacent second extrusion block, and the pins are bent and formed along an arc line, so that the pins are prevented from being damaged due to hard bending.
4. According to the invention, the lead frame is intermittently pulled through the expansion blocks on the movable frame belt, and the adjacent expansion blocks are extruded and expanded to position the positioning holes of the lead frame, so that the device is assisted to accurately operate, and the problems of disqualification of semiconductor chip products and the like caused by skew of the lead frame are avoided.
Drawings
FIG. 1 is a schematic perspective view of the invention;
fig. 2 is a schematic perspective view of an inventive fixed housing, a first electric push rod and a second extrusion plate;
fig. 3 is a schematic perspective view of a first extrusion plate, a second extrusion plate and a second electric putter according to the present invention;
FIG. 4 is a schematic perspective view of the stationary shaft, slider and tool holder of the present invention;
FIG. 5 is a cross-sectional view of the tool holder, stationary shaft and rotating shaft of the invention;
FIG. 6 is a schematic perspective view of the first compression plate, first elastic member and pressure sensor of the present invention;
fig. 7 is a schematic perspective view of a third electric putter, a moving frame and a bearing plate according to the present invention;
FIG. 8 is a schematic perspective view of the inventive pallet, limiting plate and drive shaft;
FIG. 9 is a schematic perspective view of an inventive motorized spindle, grid conveyor belt and conveyor belt;
FIG. 10 is a schematic perspective view of an inventive power door, conveyor belt and optical detector;
FIG. 11 is a schematic perspective view of the tool post, second stripper plate and pallet of the present invention;
FIG. 12 is a cross-sectional view of the first extrusion block, second arcuate plate and pallet of the present invention;
FIG. 13 is a schematic perspective view of an inventive stop lever, support plate and second arcuate plate;
fig. 14 is a schematic perspective view of a fourth electric putter, an electric slide rail and a moving frame according to the present invention;
fig. 15 is a schematic perspective view of a fourth electric putter, a fourth stopper and a moving frame according to the present invention;
fig. 16 is a schematic perspective view of an inventive expansion block, a fourth extrusion block and a moving frame.
In the figure: 1. the device comprises a shell, 2, a bearing plate, 3, a fixed shell, 4, a first electric push rod, 5, a first sliding rod, 6, a fixed shaft, 7, a rotating shaft, 8, a sliding block, 9, a tool apron, 10, a rib cutting, 101, a first limiting ball, 102, a first limiting block, 103, an extrusion ring, 104, a second limiting ball, 105, a unidirectional gear, 201, a second electric push rod, 202, a first extrusion plate, 203, a second sliding rod, 204, a second extrusion plate, 205, a first elastic piece, 206, a pressure sensor, 301, a third electric push rod, 302, a movable frame, 303, a transmission shaft, 3041, a limiting plate, 304, a supporting plate, 305, an electric rotating shaft, 306, a material presenting plate, 307, a grid conveying belt, 308 and an optical detector, 309, electrically operated gate, 310, conveyor belt, 401, first arc plate, 402, first slide plate, 403, second elastic member, 404, first extrusion block, 405, third elastic member, 406, second arc plate, 407, stopper rod, 408, second slide plate, 409, second stopper, 410, second extrusion block, 411, fourth elastic member, 412, support plate, 413, connecting rod, 414, third stopper, 415, third extrusion block, 416, reset lever, 501, fourth electrically operated push rod, 502, electrically operated slide rail, 503, electrically operated slide block, 504, moving frame, 505, fourth stopper, 506, expansion block, 507, slide cylinder, 508, fourth extrusion block, 509, fifth elastic member.
Detailed Description
In order to make the contents of the present invention more easily understood, the technical scheme of the present invention will be further described with reference to the specific embodiments, but the present invention is not limited thereto. All techniques implemented based on the above description of the invention are intended to be included within the scope of the invention. Unless otherwise indicated, the parts and materials used in the examples are commercially available. Specific data not described herein, such as tooling stock, tool or part dimensional strength, are those routinely determinable by one of ordinary skill in the art.
Example 1: the semiconductor rib cutting forming device with the cutter switching function comprises a shell 1, a bearing plate 2 is fixedly connected in the shell 1, a control panel and two groups of fixing shells 3 which are bilaterally symmetrical are fixedly connected on the upper side of the shell 1, each group of two fixing shells 3 are in front-back symmetrical distribution, a first electric push rod 4 which is electrically connected with the control panel is fixedly connected on the front side of the two fixing shells 3, a first slide rod 5 is fixedly connected on the rear side of the two fixing shells 3, a fixed shaft 6 is fixedly connected on the telescopic end of the first electric push rod 4, the fixed shaft 6 is fixedly connected with the adjacent first slide rod 5, a coaxial rotating shaft 7 is rotatably connected on the outer side of the fixed shaft 6, a tool apron 9 is detachably arranged on the rotating shaft 7, the lower side of the tool apron 9 is driven by the rotating shaft 7 to jointly move, the rotating shaft 7 is not contacted with the upper tool apron 9, the two fixed shells 3 which are symmetrically distributed are in limit sliding connection with sliding blocks 8 together, the sliding blocks 8 are in separable sliding connection with knife blocks 9, when the knife blocks 9 on the two sliding blocks 8 which are symmetrically distributed at the front and the back rotate, the sliding blocks 8 are separated from the adjacent knife blocks 9, when the knife blocks 9 on the two sliding blocks 8 which are symmetrically distributed at the front and the back only move up and down, the sliding blocks 8 move along with the connected knife blocks 9, the rotating shaft 7 is matched with the knife blocks 9 on the adjacent sliding blocks 8, after the rotating shaft 7 moves up and rotates 180 degrees, the knife blocks 9 on the upper side and the lower side mutually change positions, the knife blocks 9 on the upper side and the lower side are symmetrically distributed, the knife blocks 9 are provided with knife changing mechanisms which are uniformly distributed, the fixed shaft 6 is provided with a knife changing mechanism which is used for rotating the rotating shaft 7 for 180 degrees and exchanging the knife blocks 9 on the upper side and the lower side, and the shell 1 is internally provided with an extrusion mechanism which is used for extruding and fixing a semiconductor lead frame, the auxiliary rib cutting knife 10 is used for cutting pins of the semiconductor chip, and a discharging mechanism used for collecting and detecting the semiconductor chip and reminding workers of changing the knife is arranged in the shell 1, and the extruding mechanism and the discharging mechanism are electrically connected with the control panel.
As shown in fig. 3-5, the tool changing mechanism comprises a first limiting ball 101, the first limiting ball 101 is slidably connected to the lower side in the adjacent fixed shaft 6, a spring is fixedly connected between the first limiting ball 101 and the adjacent fixed shaft 6, the first limiting ball 101 is extruded by the spring on the first limiting ball to limit the adjacent rotating shaft 7, the rotating shaft 7 is prevented from freely rotating, two groups of first limiting blocks 102 are slidably connected to the upper side and the lower side of the rotating shaft 7, each group comprises two symmetrically distributed first limiting blocks 102, a tension spring is fixedly connected between the adjacent two first limiting blocks 102, two extrusion rings 103 which are distributed front and back are fixedly connected to the fixed shaft 6, the extrusion rings 103 are positioned between the two groups of first limiting blocks 102 which are vertically symmetrical, the extrusion rings 103 are matched with the adjacent first limiting blocks 102 through the width change of the extrusion rings, the width of the upper side of the extrusion rings 103 is minimum, the width of the extrusion rings 103 is gradually changed from the upper side to the lower side, and is kept unchanged after being gradually changed from the upper side to the lower side, the adjacent two first limiting blocks 102 retract into the adjacent rotating shafts 7 when being positioned at the upper sides of the adjacent extrusion rings 103, grooves matched with the adjacent first limiting blocks 102 are formed at the matched positions of the cutter holders 9 and the adjacent rotating shafts 7, the rotating shafts 7 limit the adjacent cutter holders 9 through the first limiting blocks 102 extending out of the surfaces of the rotating shafts, at the moment, the cutter holders 9 and the adjacent rotating shafts 7 synchronously rotate, one side of the sliding block 8 facing the adjacent cutter holders 9 is slidingly connected with two second limiting balls 104 which are bilaterally symmetrical, springs are fixedly connected between the two second limiting balls 104 and the adjacent sliding block 8, grooves matched with the adjacent symmetrical second limiting balls 104 are formed at the matched positions of the upper cutter holders 9 and the lower cutter holders 9 and the sliding block 8, when the second limiting balls 104 are pushed out of the surfaces of the adjacent sliding block 8 by the springs connected with the second limiting balls, the second limiting balls extend into the adjacent grooves on the adjacent cutter holders 9, make blade holder 9 and sliding block 8 remove together, and when the blade holder 9 of downside works, make the blade holder 9 of upside hover in the upper surface of shell 1, make things convenient for the staff to change the rib sword 10 on it, the unidirectional gear 105 is installed to axis of rotation 7, the fixed shell 3 is equipped with adjacent unidirectional gear 105 complex rack, when axis of rotation 7 upwards moves, unidirectional gear 105 meshes with adjacent rack, drive axis of rotation 7 rotatory, when axis of rotation 7 downwardly moving, unidirectional gear 105 still meshes with adjacent rack, but does not drive axis of rotation 7 rotation.
As shown in fig. 3 and 6, the extrusion mechanism includes a second electric push rod 201 electrically connected to the control panel, a fixing portion of the second electric push rod 201 is fixedly connected to the casing 1, and a telescopic end surface of the second electric push rod 201 faces downward, a first extrusion plate 202 is fixedly connected to an upper portion of a telescopic end of the second electric push rod 201, the first extrusion plate 202 is slidably connected with two groups of second slide rods 203 symmetrically distributed around, each group of two second slide rods 203 are symmetrically distributed left and right, four second slide rods 203 penetrate through the casing 1 and are fixedly connected with a second extrusion plate 204 together, a bump with a width equal to a semiconductor pin distance is arranged on a lower side of the second extrusion plate 204, when the second extrusion plate 204 contacts the lead frame, the bump on the second extrusion plate 204 is inserted into a gap between the pins of the semiconductor chip, so as to avoid uneven pin stress in a process of cutting the semiconductor chip, a limit disc is fixedly connected to the telescopic end of the second electric push rod 201, the telescopic end of the second electric push rod 201 is slidably connected with the second extrusion plate 204 through the limit disc, the second extrusion plate 204 is fixedly connected with the control panel 205, and the first extrusion plate 205 is connected with the control panel 205, and the first extrusion plate 206 is contacted with the second extrusion plate 202, and the first extrusion plate is contacted with the second extrusion plate 204, when the first extrusion plate is contacted with the first extrusion plate 204, and the second extrusion plate 204, and the first extrusion plate is contacted with the second extrusion plate 204, and the second extrusion plate is separated from the second extrusion plate 204, and the first extrusion plate and the second extrusion plate 201 is contacted with the second extrusion plate and the second extrusion plate 201, the pressure sensor 206 is used to detect the elastic force of the adjacent first elastic member 205.
As shown in fig. 2 and 6-9, the unloading mechanism comprises a third electric push rod 301 electrically connected with the control panel, the third electric push rod 301 is fixedly connected to the inner side of the casing 1 through a bracket, the third electric push rod 301 is positioned at the lower side of the bearing plate 2, the telescopic end of the third electric push rod 301 faces the bearing plate 2 and is fixedly connected with a movable frame 302, two symmetrical groups of transmission shafts 303 are rotationally connected at the lower side of the bearing plate 2, each group comprises two transmission shafts 303, four transmission shafts 303 are fixedly connected with three supporting plates 304 which are uniformly distributed, the supporting plates 304 on the adjacent transmission shafts 303 are symmetrically distributed and are used for supporting a semiconductor chip, the four transmission shafts 303 are all in transmission with the movable frame 302 through racks and gears, the rotation directions of the adjacent transmission shafts 303 are opposite when the movable frame 302 moves upwards, the two symmetrical supporting plates 304 are opened downwards, so that the semiconductor chip falls, the bearing plate 2 is fixedly connected with a symmetrical and uniformly distributed limiting plate 3041, the limiting plate 3041 is matched with an adjacent supporting plate 304 to limit the supporting plate 304 to prevent the supporting plate 304 from excessively rotating, the shell 1 is rotationally connected with two symmetrical electric rotating shafts 305 electrically connected with a control panel through a bracket, a material-presenting plate 306 is fixedly connected between the bearing plate 2 and a third electric push rod 301 by the shell 1, the movable frame 302 penetrates through the material-presenting plate 306, a grid conveying belt 307 is wound between the two electric rotating shafts 305, the grid conveying belt 307 is a hollow grid bottomless conveying belt, the electric rotating shafts 305 drive the grid conveying belt 307 to intermittently rotate, the material-presenting plate 306 is matched with the grid conveying belt 307 to form a grid cavity with an upper opening for accommodating the falling semiconductor chips, one chip falls into only one single cavity, the shell 1 is provided with a sorting component electrically connected with the control panel and used for detecting the semiconductor chips, and screening the unqualified semiconductor chips.
As shown in fig. 7, 9 and 10, the sorting assembly includes a plurality of optical detectors 308 electrically connected to the control panel, the number of the optical detectors 308 is the same as that of the disposable cut semiconductor chips, the optical detectors 308 are disposed on one side of the loading plate 2 facing the feeding plate 306, the feeding plate 306 is provided with evenly distributed electric gates 309, the number of the electric gates 309 is consistent with that of the optical detectors 308 and the disposable cut semiconductor chips, the electric gates 309 are located below the adjacent optical detectors 308, the loading plate 2 is provided with a conveyor belt 310 electrically connected to the control panel through a bracket, and when the electric gates 309 are opened, the semiconductor chips located on the upper side of the electric gates fall onto the conveyor belt 310 below.
Before the device is used by staff, the lead frame with the chip is firstly put into the device from the right side of the bearing plate 2, the lead frame is indirectly conveyed leftwards by means of the existing positioning conveying mechanism, the pin end of the semiconductor chip is just positioned below the rib cutting knife 10, then the staff inputs the material of the lead frame of the current processing chip to the control panel, the device is assisted to automatically clamp the lead frames of different materials, the lead frames are prevented from being damaged due to overlarge or insufficient clamping force, and the control panel is activated to start working after the input is completed.
When the lead frame is clamped, the control panel firstly controls the telescopic end of the second electric push rod 201 to move downwards, at this time, the telescopic end of the second electric push rod 201 drives the first extrusion plate 202 fixedly connected with the telescopic end to move downwards together, the first extrusion plate 202 pushes the second extrusion plate 204 to move downwards together with the pressure sensor 206 through the first elastic piece 205, in the process of moving the second extrusion plate 204 downwards, the convex block of the second extrusion plate 204 is firstly inserted into the gap of a pin in the lead frame, the front side and the rear side of the pin of the lead frame are fixed, deflection in the rib cutting process is avoided, the finished product is not qualified, then the second extrusion plate 204 contacts with the lead frame, and the whole lead frame is extruded and fixed.
In the process that the second extrusion plate 204 extrudes the semiconductor chip and the lead frame, the telescopic end of the second electric push rod 201 continuously moves downwards after the second extrusion plate 204 contacts the lead frame, at the moment, the second extrusion plate 204 cannot move due to contact with the lead frame, a limiting disc on the telescopic end of the second electric push rod 201 is separated from the cooperation with the second extrusion plate 204 and moves downwards, the first extrusion plate 202 continuously moves downwards along with the telescopic end of the second electric push rod 201, the first elastic piece 205 is compressed and stores the force, the second extrusion plate 204 is continuously extruded by the pressure sensor 206 to clamp the lead frame, the pressure sensor 206 monitors the elastic force of the first elastic piece 205 when the second extrusion plate 204 extrudes the lead frame in real time, data are transmitted into the control panel, the second extrusion plate 204 is monitored to extrude the lead frame, damage caused when the lead frame is subjected to extrusion force excessively, or the extrusion force excessively small influences the rib cutting process, when the second extrusion plate 204 is close to the extrusion force suitable for the lead frame, namely, the data input by workers are comprehensively calculated, the control panel is closed, and the first electric push rod 201 is driven to move downwards, and the first push rod 4 is driven to move downwards.
When the telescopic end of the first electric push rod 4 moves downwards, the telescopic end of the first electric push rod 4 drives the fixed shaft 6 fixedly connected with the telescopic end to move downwards together, at this time, because the two first limiting blocks 102 below are extruded by the extrusion ring 103 on the fixed shaft 6, the two first limiting blocks 102 move away from each other in the front-back direction, and the tension spring between the two limiting blocks is stretched to store force, so the lower tool apron 9 is limited by the two first limiting blocks 102 and moves together with the rotating shaft 7, but at this time, the two first limiting blocks 102 positioned at the upper side of the fixed shaft 6 and with a narrower width part are not extruded by the extrusion ring 103, namely, the two limiting blocks do not extend out of the outer surface of the rotating shaft 7, and meanwhile, because the first limiting balls 101 limit the adjacent rotating shaft 7, the rotating shaft 7 cannot rotate relative to the adjacent fixed shaft 6, namely, the telescopic end of the first electric push rod 4 drives the rotating shaft 7 and the tool apron 9 connected with the first limiting blocks to move downwards together, so that the lower tool apron 9 cuts off pins of a semiconductor chip through the bar cutter 10 arranged on the lower tool apron 9, and then the control panel controls the first electric push rod 4 and parts to reversely reset.
After the chip on the lead frame is cut off by the cutter bar 10 arranged on the lower cutter holder 9, the chip is separated from the lead frame, the chip is placed on the upper sides of the two adjacent supporting plates 304, at the moment, when the first electric push rod 4 drives parts connected with the chip to reset, the control panel starts the third electric push rod 301, the telescopic end of the third electric push rod 301 is controlled to drive the movable frame 302 fixedly connected with the third electric push rod to move upwards, the movable frame 302 drives the four transmission shafts 303 to rotate together through rack and pinion, the transmission shafts 303 drive the adjacent supporting plates 304 to rotate downwards, at the moment, the two supporting plates 304 below the chip are simultaneously opened downwards, the chip falls into a cavity formed by the material plate 306 below and the grid conveying belt 307, the cut chips are not in the same cavity, and after the chip falls, the control panel controls the third electric push rod 301 to drive the parts connected with the third electric push rod to reset.
When the control panel controls the third electric push rod 301 to drive the parts connected with the third electric push rod to reset, the control panel simultaneously starts the two electric rotating shafts 305, so that the two electric rotating shafts 305 drive the grid conveying belt 307 to rotate clockwise intermittently, the rotation frequency of the grid conveying belt 307 is in direct proportion to the interval between the cutting chips of the device, and the chips falling at this time are conveyed to the lower side of the optical detector 308 for finished product inspection when the grid conveying belt 307 rotates every time, and then the device is conveyed out from the right side.
After the control panel controls the first electric push rod 4 and the upper parts thereof to reset, the control panel closes the first electric push rod 4 and starts the second electric push rod 201, so that the telescopic end of the second electric push rod 201 is recovered upwards, at this time, because the first elastic piece 205 is in a compressed state, that is, the first elastic piece 205 is released first, the second extrusion plate 204 remains in situ and is not moved in the release process of the first elastic piece 205, and after the limit disc at the end of the second electric push rod 201 contacts with the second extrusion plate 204, the second extrusion plate 204 is driven to move upwards together, and at this time, the first elastic piece 205 is not released any more.
When the second electric push rod 201 is reset, the positioning and conveying mechanism continues to convey the lead frame with the chip on the left side to the right, and then the device repeats the process.
When the optical detector 308 detects that the current chip has the problems of pin skew, breakage and the like and is unqualified, a signal is transmitted to the control panel, the control panel controls the corresponding electric door 309 to open so that the chip with the upper cavity slides downwards, when the unqualified chip is detected to slide downwards, the control panel controls the conveyor 310 to convey the unqualified chip forwards and leave the device, and then the control panel controls the electric door 309 to be closed.
When the optical detector 308 continuously detects that the current chip has the problems of pin skew fracture and the like and is unqualified, the current rib cutting knife 10 is possibly damaged, and the control panel controls the device to execute the knife changing work:
when the tool changing work is carried out in the process that the first electric push rod 4 drives the upper parts to reset, at the moment, after the control panel controls the telescopic end of the first electric push rod 4 to reset to the original position, the upper tool apron 9 of the rotating shaft 7 continuously moves upwards, at the moment, the upper tool apron 9 of the rotating shaft 7 extrudes and pushes the upper tool apron 9 of the rotating shaft 7 to move upwards together, the upper tool apron 9 drives the sliding block 8 connected with the upper tool apron 9 to move upwards together, when the unidirectional gear 105 on the rotating shaft 7 moves upwards and is meshed with the corresponding racks, the unidirectional gear 105 starts to drive the rotating shaft 7 to rotate together, at the moment, the first limiting ball 101 is extruded by the rotating shaft 7 and is retracted into the fixed shaft 6, a spring connected with the first limiting ball 101 is compressed, and the rotating shaft 7 drives the lower tool apron 9 to rotate together through the upper first limiting block 102.
When the rotating shaft 7 drives the two cutter holders 9 connected with the rotating shaft to rotate together, the two second limiting balls 104 on the sliding block 8 are extruded by the cutter holders 9 on the upper side and retract into the sliding block 8, the springs connected with the sliding block are compressed, the sliding block 8 is still extruded by the rotating shaft 7 to drive the cutter holders 102 on the sliding block to move upwards together, at the moment, the rotating shaft 7 drives the first limiting blocks 102 on the sliding block to rotate together, the first limiting blocks 102 in the two groups on the upper side are extruded by the extrusion rings 103 on the fixed shaft 6, so that the two first limiting blocks 102 of the same group are gradually separated from each other in opposite directions, the springs between the two first limiting blocks 102 which are separated from each other are stretched, and the two first limiting blocks 102 on the upper side are in limiting fit with the cutter holders 9 on the upper side in the gradual rotating process, so that the cutter holders 9 on the upper side move together along with the rotating shaft 7.
When the rotating shaft 7 is driven by the unidirectional gear 105 to rotate 180 degrees, the tool holders 9 on the upper side and the lower side are just exchanged in position, at this time, the control panel controls the telescopic ends of the first electric push rod 4 to stop moving upwards, in the process, the two groups of first limiting blocks 102 which are originally positioned on the lower side and limit the tool holders 9 on the lower side are gradually matched with the narrow part of the extrusion ring 103 and gradually retracted into the rotating shaft 7 due to movement to the upper side, namely, the tool holders 9 on the upper side are transposed to be separated from the matching with the rotating shaft 7, meanwhile, the second limiting balls 104 are pushed out of the outer surface of the sliding block 8 under the reset action of the springs connected with the second limiting balls, are matched with the tool holders 9 on the upper side in a resetting way, limit is carried out on the tool holders 9 on the upper side in a resetting way, the reset action of the first limiting balls 101 are matched with the rotating shaft 7 of 180 degrees again, namely, the fixed shaft 6 is in a limiting fit again on the rotating shaft 7, at this time, the control panel controls the telescopic ends of the first electric push rod 4 to move downwards, although the unidirectional gear 105 is continuously meshed with the adjacent tool holders, at this time, the unidirectional gear 105 does not drive the rotating shaft 7 to rotate, the tool holders 9 on the upper side are transposed to be separated from the matching with the rotating shaft 7, meanwhile, the reset ends of the tool holders 9 on the upper side are matched with the reset action of the reset function under the action of the force of the spring, the reset action of the spring is matched with the reset ends, the first limiting the tool holders 4, the first limiting the telescopic ends are matched with the telescopic ends, and then the first electric push rod 4, and the working on the upper side, and the working process is normally, and the working well, and then the working well and then and the working well and accordingly, and the device is finished.
Because there are other processes such as pushing the semiconductor chip and fixing it when cutting the semiconductor chip each time, and tool changing work motion process is simple, make it not influence the continuity of semiconductor chip cutting the muscle process, the cutter that is put down by the change stays at shell 1 surface, no longer continues to follow axis of rotation 7 and remove together, makes things convenient for the staff to in time inspect the change.
Example 2: on the basis of the above embodiment 1, as shown in fig. 3 and 11-13, the pin forming mechanism is further provided with a pin forming mechanism disposed on the second extrusion plate 204, the pin forming mechanism is used for extruding and bending pins of the semiconductor chip after the rib cutting process is completed, the pin forming mechanism includes a plurality of symmetrical and uniformly distributed first arc plates 401, the first arc plates 401 are provided with arc surfaces, all the first arc plates 401 are fixedly connected to one side of the adjacent blade holder 9 where the rib cutting blade 10 is installed, the number of the first arc plates 401 is equal to the number of the rib cutting blade 10, the second extrusion plate 204 is slidably connected with a plurality of symmetrical and uniformly distributed first sliding plates 402 at the gaps of the bumps thereof, namely, the number of the first sliding plates 402 is equal to the number of pins of the semiconductor chip cut during the first processing, a second elastic member 403 is fixedly connected between the first sliding plates 402 and the second extrusion plate 204 through a bracket, the second elastic member 403 is provided as a tension spring, the first sliding plate 402 is in spacing fit with the bracket of the adjacent second elastic member 403, one side of the first sliding plates 402 facing the adjacent rib cutting blade 9 is fixedly connected with the first extrusion plate 10, the first sliding blocks 404 are uniformly distributed with the first sliding plates 404, the first sliding plates 404 are uniformly distributed uniformly, the first sliding plates 404 are uniformly distributed pins are uniformly distributed on the first sliding plates 404 are more evenly distributed on the first sliding plates 404, and the first sliding plates 404 are uniformly distributed first sliding plates 404 are respectively, and the first sliding plates are uniformly distributed, the first sliding plates 404 are uniformly is matched with the first sliding plates 404, and the first sliding plates are 404 is uniformly is matched with the first sliding rods, and are uniformly is matched with the first sliding plate, the number of the second sliding plates 408 and the number of the second limiting blocks 409 are equal to that of the first sliding plates 402, inclined surfaces are arranged on the lower side surfaces of the second sliding plates 408, inclined surfaces are arranged on the upper and lower surfaces of the second limiting blocks 409, the inclined surfaces of the second sliding plates 408 are matched with the inclined surfaces on the upper sides of the adjacent second limiting blocks 409, the second limiting blocks 409 are in limit fit with the adjacent second sliding plates 408, springs are fixedly connected between the uniformly distributed second limiting blocks 409 and the adjacent supporting plates 304, when the second sliding plates 408 move downwards, the second sliding plates 408 press the inclined surfaces on the upper sides of the adjacent second limiting blocks 409 through the inclined surfaces on the second sliding plates, the springs connected with the second limiting blocks 409 are compressed, after the inclined surfaces of the second sliding plates 408 pass through the inclined surfaces on the upper sides of the adjacent second limiting blocks 409, the springs connected with the second limiting blocks 409 are reset, and limit the second sliding plates 408, the second extrusion block 410 is connected to one side of the second sliding plate 408 facing the adjacent second arc plate 406 in a sliding way through a sliding rod, the width of the second extrusion block 410 is the same as that of the first extrusion block 404, so that the two extrusion blocks are matched with each other to clamp pins of a semiconductor chip up and down, a fourth elastic piece 411 is fixedly connected between the second extrusion block 410 and the adjacent second sliding plate 408, the fourth elastic piece 411 is arranged as a spring, the second extrusion block 410 is matched with the adjacent second arc plate 406 in a sliding way, the second arc plate 406 is connected with a supporting plate 412 in a sliding way, uniformly distributed supporting plates 412 are all connected with the adjacent supporting plates 304 in a sliding way, springs are fixedly connected between the supporting plates 304 and the adjacent supporting plates, the limiting rods 407 are provided with openings matched with the adjacent supporting plates 412, the supporting plates 412 are also provided with openings matched with the adjacent limiting rods 407, the front sides of the limiting rods 407 are fixedly connected with connecting rods 413, the second extrusion plate 204 sliding connection has the third stopper 414 that equals with first sliding plate 402 (first sliding plate 402 quantity equals with first extrusion piece 404 quantity) quantity, third stopper 414 and adjacent first extrusion piece 404 spacing fit, when third stopper 414 carries out spacing to adjacent first extrusion piece 404, all rigid couplings have the spring along with adjacent second extrusion plate 204 in the time of first extrusion piece 204 is followed to first extrusion piece 404, when third stopper 414 releases the spacing to adjacent first extrusion piece 404, first extrusion piece 404 is extruded by adjacent first arc 401, move along the cambered surface of adjacent first arc 401, all third stopper 414 all rigid couplings have the extension spring between the adjacent second extrusion plate 204 of connecting rod 413 penetration its upside, and with adjacent third extrusion piece 414 cooperation, all rigid couplings have the spring between blade holder 9 spacing sliding connection and the adjacent first extrusion piece 404, third stopper 414 is equipped with the inclined plane, third extrusion piece 415 is equipped with the third inclined plane that cooperates with adjacent third extrusion piece 414 when the third extrusion piece 415 moves down, the second inclined plane that is used for releasing the adjacent stopper rod 409, when the third extrusion piece 415 is equipped with the third extrusion piece 415 that moves down, the second extrusion piece that makes the lower limit rod 409 is used for the same time of restoring to move along with the inclined plane, the second extrusion piece 409, the lower limit rod is used for restoring the same time of the adjacent stopper 415, the lower limit rod is moved to the second extrusion piece 415, the lower limit rod is used for restoring the limit plate, the limit setting has the limit to be used for the limit to be the third extrusion 415.
In the semiconductor chip rib cutting process, the device simultaneously performs a pin bending forming process on the semiconductor chip, and the specific operation principle is as follows:
before the telescopic end of the first electric push rod 4 drives the upper parts to move downwards, the protruding blocks of the second extrusion plate 204 are inserted into the gaps of the lead frame chips, the first extrusion blocks 404 on the second extrusion plate 204 are matched with the adjacent second extrusion blocks 410 on the supporting plate 304 for supporting the chips to fix the pins of the chips, so that the rib cutting knife 10 is always in a fixed state at two ends of the pins, which are connected with the lead frame, of the chips in the rib cutting process, and the auxiliary rib cutting knife 10 cuts the pins according to the specific fixing principle as follows:
the third limiting block 414 limits the first extrusion block 404 under the pulling force of the tension spring adjacent to the third limiting block, so that the first extrusion block 404 moves along with the second extrusion block 204, the extrusion force applied by the first extrusion block 404 to the pins is equal to the extrusion force applied by the second extrusion block 204 to the lead frame, the second sliding plate 408 connected with the second extrusion block 410 is limited to the uppermost end of the corresponding chute, the second sliding plate 408 cannot move upwards, the limiting rod 407 and the spring adjacent to the connecting rod 413 fixedly connected with the limiting rod are pulled to always limit the supporting plate 412, the second extrusion block 410 is limited by the adjacent supporting plate 412 and cannot move downwards, namely, at the moment, the second extrusion block 410 is in an non-slidable state, at the moment, the connecting rod 413 penetrates through the adjacent second extrusion block 204 and cooperates with the third limiting block 414 on the upper side of the second extrusion block, namely, until the pins of the semiconductor chip are cut off by the first extrusion block 404 moving along with the second extrusion block 204 and the second extrusion block 410, and the lower side of the pins are fixed on the supporting plate 304.
After the pin of the semiconductor chip is cut off by the rib cutting knife 10 on the lower knife holder 9, the control panel enables the first electric push rod 4 to move downwards continuously, namely the lower knife holder 9 moves downwards continuously, in the process, the third extrusion block 415 on the knife holder 9 firstly extrudes the adjacent third limiting block 414 to move forwards, the third limiting block 414 releases the limiting of the adjacent first arc plate 401, at the moment, the tension spring connected with the third limiting block 414 stretches, the first extrusion block 404 is in a slidable state, the connecting rod 413 is pushed to move forwards by the third limiting block 414 connected with the first extrusion block 404, the connecting rod 413 drives the adjacent limiting rod 407 to move forwards together, the supporting plate 412 is separated from being matched with the adjacent limiting rod 407, namely the second extrusion block 410 is in a slidable state, and then the telescopic end of the first electric push rod 4 drives the knife holder 9 to move downwards continuously, and at the moment, the spring connected with the third extrusion block 415 starts to compress.
After the first extrusion block 404 and the second extrusion block 410 are simultaneously unlocked to be in a slidable state, the tool apron 9 drives the first extrusion block 401 to extrude the adjacent first extrusion block 404 to move downwards in the downward moving process, the first extrusion block 404 extrudes the second extrusion block 410 to move downwards together through extrusion pins, under the action of elastic force of the fourth elastic piece 411, the second extrusion block 410 is always subjected to the force closely attached to the adjacent second extrusion block 406, so that the second extrusion block 410 gradually moves downwards along the cambered surface of the second arc block 406, in the process, the second sliding plate 408 gradually moves downwards together, the fourth elastic piece 411 is compressed, the adjacent first extrusion block 404 is closely attached to the cambered surface of the adjacent first arc block 401 under the action of elastic force of the third elastic piece 405, and in the process that the first arc block 401 extrudes the adjacent first extrusion block 404 downwards, the second sliding plate 408 moves downwards together with the adjacent first extrusion block 404, the third elastic member 405 is compressed, the second extrusion block 410 gradually extrudes the adjacent support plate 412 in the downward moving process, so that the support plate 412 passes through the adjacent limit rod 407 to move downward, at this time, the limit rod 407 is reversely limited by the adjacent support plate 412 until the second extrusion block 410 moves to the bottommost end along the cambered surface of the adjacent second cambered plate 406, at this time, the second sliding plate 408 moves to the bottommost end of the corresponding chute, the inclined surface of the adjacent second limiting block 409 is extruded to compress the spring connected with the second limiting block 409, after the inclined surface of the lower side of the second sliding plate 408 passes through the inclined surface of the adjacent second limiting block 409, the second limiting block 409 pushes out the spring matched with the second limiting block 409 to limit the second sliding plate 408 and the second extrusion block 410 connected with the second limiting block, in this process, the pins extruded by the first extrusion block 404 and the adjacent second extrusion block 410 are also bent along the arc of the adjacent second cambered plate 406, because the bending process is a guiding and bending process, the situation that the pins are cracked or extruded and deformed when the pins are subjected to hard extrusion bending by the grinding tool is avoided.
After the chip pins are extruded and bent, the control panel controls the first electric push rod 4 to shrink through the upper parts thereof, at this time, the third extrusion block 415 and the spring connected with the third extrusion block 415 reset firstly, meanwhile, under the common reset action of the adjacent third elastic piece 405 and the adjacent second elastic piece 403, the first extrusion block 404 moves and resets along the cambered surface of the adjacent first arc plate 401 firstly until the third extrusion block 415 is separated from the cooperation with the adjacent first arc plate 401, the third extrusion block 415 and the parts connected with the third extrusion block 415 reset completely, then the third extrusion block 415 and the spring connected with the third extrusion block 415 reset completely, at this time, except the third limiting block 414 limited by the adjacent connecting rod 413, the third limiting block 414 gradually resets in the upward movement process of the adjacent third extrusion block 415, and the limiting block 414 limited by the adjacent connecting rod 413 restores in the reset process of following the second extrusion plate 204, and the limiting of the connecting rod 413 is separated from the limiting and resets.
After the supporting plate 304 rotates along with the connected transmission shaft 303, so that the chip on the supporting plate 304 is placed on the material-presenting plate 306, the supporting plate 304 continues to rotate and is contacted with the limiting plate 3041, in the process, the reset rod 416 and the second limiting block 409 are matched through an inclined plane, the second limiting block 409 is extruded to release the limit of the second sliding plate 408, at the moment, the part on the supporting plate 304 is reset and pulled by the connected spring reset, and the reverse movement is reset, namely, the second extrusion is restored to a state limited by the supporting plate 412, and then the device repeats the process, so that the pins of the semiconductor chip after each rib cutting are bent and formed.
Example 3: on the basis of the above embodiment 2, as shown in fig. 6 and fig. 14-16, the positioning mechanism is further included to position the lead frame, so as to accurately position the semiconductor chip, the positioning mechanism is disposed on the bearing plate 2, the positioning mechanism includes two fourth electric push rods 501 electrically connected with the control panel, the two fourth electric push rods 501 are symmetrically distributed, the two fourth electric push rods 501 are fixedly connected to two sides of the bearing plate 2 through brackets, the telescopic ends of the fourth electric push rods 501 are fixedly connected with electric slide rails 502 electrically connected with the control panel, opposite sides of the two electric slide rails 502 are slidably connected with electric slide blocks 503, the two electric slide blocks 503 are fixedly connected with a moving frame 504 together, the left sides of the two electric slide rails 502 are fixedly connected with fourth limiting blocks 505, the fourth limiting blocks 505 are provided with protruding columns matched with the lead frame, when the electric slide rails 502 are pushed up by the adjacent fourth electric push rods 501, the fourth limiting block 505 is matched with the lead frame to limit the lead frame, so that the lead frame is ensured to move in the moving frame 504 to avoid accidents such as lateral deviation, and the like, a plurality of expansion blocks 506 are uniformly distributed in sliding connection with the lower side of the moving frame 504, wherein four expansion blocks 506 are combined into a group and are jointly connected with a sliding cylinder 507 in a sliding manner, each group of expansion blocks 506 is fixedly connected with a rubber sleeve in a sliding manner, the rubber sleeves are fixedly connected with adjacent sliding cylinders 507, the number of groups of expansion blocks 506 is the same as the number of positioning holes on the side surface of the lead frame of a semiconductor chip cut by the same group, at least four groups of expansion blocks 506 are provided, the sliding cylinders 507 are in sliding connection with fourth extrusion blocks 508, a fifth elastic member 509 is fixedly connected between the fourth extrusion blocks 508 and the moving frame 504, the fifth elastic member 509 is provided as a tension spring, the upper side of the fourth extrusion blocks 508 is provided as a conical surface, the fourth extrusion blocks 508 are in extrusion fit with the adjacent expansion blocks 506 through the conical surface, the elasticity of the fifth elastic element 509 is smaller than the elasticity of the rubber sleeve, namely the fifth elastic element 509 cannot enable the fourth extrusion block 508 to extrude the adjacent expansion block 506 to move by means of self elasticity, the bearing plate 2 is provided with a plurality of blind holes which are matched with the fourth extrusion block 508 and are uniformly distributed, the number of the blind holes is the same as that of the positioning holes on the side face of the lead frame of the cut semiconductor chip, the blind holes on the bearing plate 2 are matched with the adjacent fourth extrusion block 508, after the fourth extrusion block 508 is contacted with the blind holes of the bearing plate 2, the expansion block 506 continuously moves downwards, at the moment, the expansion block 506 is extruded by the conical surface of the fourth extrusion block 508 to expand circumferentially, the positioning holes of the lead frame are accurately limited, the chip and the pins on the lead frame are conveniently positioned, and the accuracy of the device is improved.
Before cutting the chip, the device also has the functions of intermittent feeding and positioning and centering the lead frame, so that the accuracy of the processing program is ensured, and the specific operation principle is as follows: at the time of the first cutting or the intermittent feeding time after each cutting is completed, the control panel starts the fourth electric push rod 501, so that the fourth electric push rod 501 pushes the electric slide rail 502 to drive the parts connected with the fourth electric push rod to move upwards, the parts such as the expansion block 506 on the moving frame 504 move to be higher than the lead frame in the process of gradually moving upwards along with the electric slide rail 502, namely, the bottom of the fourth extrusion block 508 is higher than the top of the lead frame at the moment, in the process, the fourth extrusion block 508 is not separated from the sliding cylinder 507 to fall because the fifth elastic piece 509 is always tensioned, and the four expansion blocks 506 are kept to be contracted by the rubber sleeves adjacent to the fourth extrusion block 508, so that the fourth extrusion block 508, the sliding cylinder 507 and the expansion block 506 keep a contracted state and move upwards along with the moving frame 504, and meanwhile, the fourth limiting block 505 completes limiting of the lead frame through the upper lug of the limiting block in the process of moving upwards along with the electric slide rail 502, and the lead frame is prevented from moving sideways before the lead frame is moved.
When the bottom of the fourth extrusion block 508 is higher than the top of the lead frame, the control panel closes the fourth electric push rod 501 and controls the electric slide block 503 to move rightwards along the electric slide rail 502, when parts such as the expansion block 506 on the moving frame 504 are aligned with the limiting holes on the lead frame, the control panel controls the electric slide block 503 to stop moving, and the fourth electric push rod 501 drives the parts connected with the electric slide rod to descend by a certain distance through the electric slide rail 502, and is inserted into the limiting holes on the lead frame, at the moment, the lead frame is limited by the sliding cylinder 507, but at the moment, the expansion block 506 is not in limiting fit with the limit Kong Jingzhun, at the same time, the left two fourth limiting blocks 505 are separated from the limit of the lead frame, then the control panel controls the electric slide block 503 to drive the lead frame to move leftwards along the electric slide rail 502 for resetting, and after the electric slide block 503 is completely reset, the control panel controls the electric slide block 503 to stop moving, and the fourth electric push rod 501 drives the electric slide rail 502 and the parts connected with the electric slide rail to descend to the parts to be completely reset.
In the process that the movable frame 504 drives the expansion blocks 506, the sliding cylinder 507 and the fourth extrusion blocks 508 to move downwards for resetting, the fourth extrusion blocks 508 are firstly inserted into corresponding blind holes on the bearing plate 2 and are in contact with the bearing plate 2, at this time, the expansion blocks 506 and the sliding cylinder 507 continue to move downwards, namely, the fourth extrusion blocks 508 and the expansion blocks 506 and the sliding cylinder 507 generate relative motion, in the process, the fourth extrusion blocks 508 move upwards along the sliding cylinder 507 and extrude four expansion blocks 506 which are uniformly distributed, so that the four expansion blocks 506 synchronously expand, meanwhile, the fifth elastic piece 509 contracts, the limit Kong Jingzhun of the lead frame is matched with the limit of the limit, and after the expansion blocks 506 on the movable frame 504 are synchronously expanded, the lead frame is corrected and limited, so that the device is convenient for carrying out the subsequent rib cutting forming process.
When the rib cutting forming process of the current chip is completed and the lead frame needs to be moved leftwards continuously, the control panel operates the fourth electric push rod 501 and the electric slide rail 502 to repeat the above process.
The foregoing description is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, within the scope of the present application, should apply to the present application, and all changes and modifications as fall within the scope of the present application.

Claims (10)

1. The utility model provides a semiconductor cutting bar forming device with cutter switching function, characterized by, including shell (1), rigid coupling has bearing plate (2) in shell (1), the upside rigid coupling of shell (1) has control panel and symmetric distribution's fixed shell (3), one side fixed shell (3) rigid coupling has first electric putter (4), the opposite side fixed shell (3) sliding connection has first slide bar (5), the flexible end of first electric putter (4) and adjacent first slide bar (5) rigid coupling jointly has fixed axle (6), fixed axle (6) rotation is connected with axis of rotation (7), axis of rotation (7) detachable installs blade holder (9), fixed shell (3) sliding connection has slider (8), symmetric distribution's slider (8) jointly detachable sliding connection has blade holder (9), axis of rotation (7) with on the slider (8) that is adjacent blade holder (9) cooperates, and axis of rotation (7) on blade holder (9) and adjacent blade holder (9) rotation and the same profile of adjacent blade holder (8) are equipped with on the fixed axle (9) switching mechanism (9) that is equipped with blade holder (9) and the symmetry is distributed on blade holder (9) and the blade holder (9) that is evenly distributed on the fixed axle (9), the semiconductor chip unloading device is characterized in that an extrusion mechanism for extruding the semiconductor lead frame and a discharging mechanism for unloading and detecting the semiconductor chip are arranged in the shell (1), and the first electric push rod (4), the extrusion mechanism and the discharging mechanism are electrically connected with the control panel.
2. The semiconductor rib cutting forming device with the cutter switching function according to claim 1, characterized in that the cutter changing mechanism comprises a first limiting ball (101), the first limiting ball (101) is slidably connected in the adjacent fixed shaft (6), a spring is fixedly connected between the first limiting ball (101) and the adjacent fixed shaft (6), the first limiting ball (101) is matched with the adjacent rotating shaft (7), a symmetrically distributed first limiting block (102) is slidably connected with the rotating shaft (7), a tension spring is fixedly connected between the adjacent first limiting blocks (102), a pressing ring (103) matched with the adjacent first limiting blocks (102) is fixedly connected with the fixed shaft (6), grooves matched with the adjacent first limiting blocks (102) are formed in the fixed shaft (6), second limiting balls (104) are slidably connected between opposite sides of the symmetrically distributed sliding blocks (8), a spring is fixedly connected between the second limiting balls (104) and the adjacent sliding blocks (8), and a gear (105) is fixedly connected between the second limiting balls (104) and the adjacent sliding blocks (8), and the gear (9) is fixedly connected with the gear (105), and the gear (105) is fixedly connected with the gear (3).
3. A semiconductor rib-cutting forming apparatus with a tool switching function according to claim 2, characterized in that the width of the side of the pressing ring (103) facing the tool holder (9) on the slider (8) is smallest, and the width of the pressing ring (103) is kept unchanged after being gradually increased from the smallest.
4. The semiconductor rib cutting forming device with the cutter switching function according to claim 1, wherein the extruding mechanism comprises a second electric push rod (201), the second electric push rod (201) is fixedly connected to the outer shell (1), the telescopic end of the second electric push rod faces the inner side of the outer shell (1), a first extruding plate (202) is fixedly connected to the telescopic end of the second electric push rod (201), second sliding rods (203) which are symmetrically distributed are slidably connected to the first extruding plate (202), the second sliding rods (203) which are symmetrically distributed penetrate through the outer shell (1), limiting discs are fixedly connected to the telescopic end of the second electric push rod (201) through upper limiting discs, second extruding plates (204) are fixedly connected to the telescopic end of the second electric push rod (201), pressure sensors (206) are fixedly connected to the telescopic end of the second extruding plates (204), the pressure sensors (206) are fixedly connected to the telescopic end of the second extruding plates, the second extruding plates (202) are fixedly connected to the first extruding plates (205), and the second extruding plates (201) are fixedly connected to the second extruding plates (204), and the second extruding plates (204) are fixedly connected to the second extruding plates, and the second extruding plates (204) respectively.
5. The semiconductor rib cutting molding device with the cutter switching function according to claim 4, wherein the lower side of the second extrusion plate (204) is provided with a bump with the width equal to the spacing between the leads of the semiconductor chip for limiting the leads of the adjacent semiconductor chip.
6. According to claim 4, a semiconductor rib cutting forming device with cutter switching function, characterized by, discharge mechanism is including third electric putter (301), third electric putter (301) pass through the support rigid coupling in shell (1), third electric putter (301) are located the downside of bearing plate (2), the flexible end rigid coupling of third electric putter (301) has movable frame (302), the downside rotation of bearing plate (2) is connected with symmetrically distributed's transmission shaft (303), transmission shaft (303) rigid coupling has evenly distributed's layer board (304), evenly distributed's transmission shaft (303) all with movable frame (302) pass through rack and pinion transmission, bearing plate (2) rigid coupling has symmetrical and evenly distributed's limiting plate (3041), limiting plate (3041) with adjacent shell (1) are connected with symmetrically distributed's electric pivot (305) through the support rotation, shell (1) rigid coupling has and is in material board (306), evenly distributed's layer board (305) support plate (304) are connected with electrically by rotation, electric pivot (305) are equipped with between the electric pivot (307) and electric pivot (305) are used for sorting subassembly and the electric control panel (301) are all connected.
7. The semiconductor rib cutting forming device with the cutter switching function according to claim 6, wherein the material feeding plate (306) is located on the lower side of the bearing plate (2), and the material feeding plate (306) and the grid conveyor belt (307) are matched to form a cavity with an upper side opening for accommodating semiconductor chips.
8. The semiconductor rib cutting forming device with the tool switching function according to claim 6, wherein the sorting assembly comprises uniformly distributed optical detectors (308), the uniformly distributed optical detectors (308) are arranged on one side of the bearing plate (2) facing the feeding plate (306), the feeding plate (306) is provided with uniformly distributed electric doors (309), the bearing plate (2) is provided with a conveyor belt (310) through a bracket, and the electric doors (309) and the conveyor belt (310) are electrically connected with the control panel.
9. The semiconductor rib cutting forming device with the cutter switching function according to claim 6, further comprising a pin forming mechanism for extruding and bending pins of a semiconductor chip, wherein the pin forming mechanism is arranged on the second extrusion plate (204), the pin forming mechanism comprises symmetrical and uniformly distributed first arc plates (401), the symmetrical and uniformly distributed first arc plates (401) are fixedly connected to adjacent cutter holders (9), the second extrusion plate (204) is in sliding connection with symmetrical and uniformly distributed first sliding plates (402), a second elastic piece (403) is fixedly connected between the first sliding plates (402) and the second extrusion plate (204) through a bracket, the first sliding plates (402) are in limiting fit with the bracket of the adjacent fixedly connected second elastic piece (403), the first sliding plates (402) are in sliding connection with first extrusion plates (404) through first extrusion plates (304), the widths of the first extrusion plates (404) are the same as the widths of the pins of the semiconductor, the first extrusion plates (402) are fixedly connected with the first extrusion plates (404) through sliding rods (404), and the first extrusion plates (404) are fixedly connected with the first arc plates (404) through the first extrusion plates (404) and the first extrusion plates (404) are fixedly connected with the first extrusion plates (404) through the first extrusion plates and the first extrusion plates (404) and the first extrusion plates and the second extrusion plates and the first extrusion plates are respectively, the second sliding plate (408) and the second limiting block (409) which are uniformly distributed, the second sliding plate (408) and the second limiting block (409) which are uniformly distributed are in limiting fit, springs are fixedly connected between the second limiting block (409) and the adjacent supporting plate (304) which are uniformly distributed, the second sliding plate (408) is connected with a second extrusion block (410) through a sliding rod in a sliding manner, a fourth elastic piece (411) is fixedly connected between the second extrusion block (410) and the adjacent second sliding plate (408), the second extrusion block (410) is in extruding fit with the second arc-shaped plate (406) which is adjacent, the second arc-shaped plate (406) is in sliding connection with a supporting plate (412) which is uniformly distributed, the supporting plate (412) which is uniformly distributed is fixedly connected with the adjacent supporting plate (304) is in sliding connection with the springs, the supporting plate (412) which are uniformly distributed is fixedly connected with the adjacent limiting rod (407) in limiting fit, the limiting block (413) is fixedly connected with the connecting rod (414) which is uniformly distributed, the limiting block (204) which is symmetrically distributed between the second extrusion block (204) and the second extrusion block (404) which is uniformly distributed, the connecting rod (413) penetrates adjacent second extrusion plate (204) and cooperates with adjacent third stopper (414), blade holder (9) spacing sliding connection has evenly distributed's third extrusion piece (415), evenly distributed third extrusion piece (415) with adjacent all the rigid coupling has the spring between blade holder (9), third extrusion piece (415) with adjacent third stopper (414) extrusion cooperation, limiting plate (3041) rigid coupling has reset lever (416), evenly distributed second stopper (409) respectively with adjacent reset lever (416) extrusion cooperation.
10. The semiconductor rib cutting forming device with the cutter switching function according to claim 8, further comprising a positioning mechanism for positioning a semiconductor chip, wherein the positioning mechanism is arranged on the bearing plate (2), the positioning mechanism comprises symmetrically distributed fourth electric push rods (501), the symmetrically distributed fourth electric push rods (501) are fixedly connected with the bearing plate (2) through brackets, the telescopic ends of the fourth electric push rods (501) are fixedly connected with electric slide rails (502), the electric slide rails (502) are in sliding connection with electric slide blocks (503), the symmetrically distributed electric slide blocks (503) are fixedly connected with movable frames (504) in common, the electric slide rails (502) are fixedly connected with fourth limiting blocks (505), the fourth limiting blocks (505) are provided with convex columns matched with lead frames, the movable frames (504) are in sliding connection with uniformly distributed expansion blocks (506), the expansion blocks (506) which are mutually close to each other are in common sliding connection with sliding cylinders (507), the number of the sliding cylinders (507) is the same as that of adjacent limit blocks (508) which are near the lead frames, the number of adjacent expansion blocks (508) is cut by the lead frames, the fourth limiting blocks (508) are fixedly connected with the fourth limiting blocks (507) in common sliding cylinders (507), the elasticity of fifth elastic component (509) is less than the elasticity of rubber sleeve, fourth extrusion piece (508) with adjacent expansion piece (506) extrusion cooperation, bearing plate (2) are equipped with evenly distributed's blind hole, blind hole on bearing plate (2) with adjacent fourth extrusion piece (508) cooperation, fourth electric putter (501) with electric slide rail (502) all with control panel electricity is connected.
CN202311638397.2A 2023-12-04 2023-12-04 Semiconductor rib cutting forming device with cutter switching function Active CN117374007B (en)

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CN116913819A (en) * 2023-08-01 2023-10-20 铜陵市慧智机电有限责任公司 Semiconductor is with cutting muscle equipment

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CN209022124U (en) * 2018-10-24 2019-06-25 江苏东海半导体科技有限公司 A kind of semiconductor bar shearing molding die of quick-replaceable cutter
CN211941071U (en) * 2020-04-13 2020-11-17 郑州财经学院 Automatic cutting machine capable of switching blades
WO2022247237A1 (en) * 2021-05-24 2022-12-01 衢州台威精工机械有限公司 High-speed intelligent cutting machining center and method for replacing knife die plates
CN218693431U (en) * 2022-10-29 2023-03-24 晁禾微电子科技(东莞)有限公司 Rib cutting device for lead frame pins
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