CN117373752A - Integrated carrier, die assembly and wire processing method - Google Patents

Integrated carrier, die assembly and wire processing method Download PDF

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Publication number
CN117373752A
CN117373752A CN202311549778.3A CN202311549778A CN117373752A CN 117373752 A CN117373752 A CN 117373752A CN 202311549778 A CN202311549778 A CN 202311549778A CN 117373752 A CN117373752 A CN 117373752A
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CN
China
Prior art keywords
wire
cover plate
frame
carrier
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311549778.3A
Other languages
Chinese (zh)
Inventor
夏治源
胡志佳
王蒙
金仁宗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lanto Electronic Ltd
Original Assignee
Lanto Electronic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lanto Electronic Ltd filed Critical Lanto Electronic Ltd
Priority to CN202311549778.3A priority Critical patent/CN117373752A/en
Publication of CN117373752A publication Critical patent/CN117373752A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06Insulating conductors or cables
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/2602Mould construction elements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The utility model relates to a processing method of integrated carrier, mould subassembly and wire rod, integrated carrier include the carrier main part, the carrier main part constructs into frame structure and includes along the relative first frame and the second frame that sets up of first direction, first frame has first wire casing, the second frame has the second wire casing, first wire casing with the second wire casing is all followed first direction extends, the carrier main part is a plurality of mould subassembly's die cavity all detachably links to each other. Therefore, the wire can be conveniently positioned and installed, the external integrated carrier has wide visual field when the wire is installed, the operation space is sufficient, and the positioning is more accurate; on the other hand, the wire rod can be detached from the two wire grooves without changing the die assembly every time, so that the wire rod is prevented from being damaged unnecessarily, and the wire rod rate is improved. In addition, can be convenient for set up unidimensional first wire casing and second wire casing according to the wire rod of different models, the commonality is good.

Description

Integrated carrier, die assembly and wire processing method
Technical Field
The application relates to the technical field of wire rod processing, in particular to an integrated carrier, a die assembly and a wire rod processing method.
Background
The branch wire forming comprises inner die injection molding and outer die injection molding, wherein the inner die injection molding is used for isolating two wires at the branch position through insulating materials, and the outer die injection molding is used for injecting a sleeve at the periphery of the wires and the insulating materials, so that the reliability of the cable can be improved on one hand, and the product is more attractive on the other hand.
In the prior art, in order to realize secondary injection molding of the branched wires, operators need to implant the wires into a cavity of an inner mold die because the wires are reserved in front of and behind, and after the wires are installed and positioned, the inner mold is used for injection molding to form an insulating sleeve; and then, taking the wire out of the cavity of the inner die, taking the wire out of the outer die for secondary positioning, and performing injection molding on the sleeve. However, such arrangement results in a small operation space, inconvenience in installation, complicated operation steps, and low processing efficiency.
Disclosure of Invention
The application provides an integrated carrier, a die assembly and a wire processing method, which are used for solving the technical problems of small operation space, inconvenient installation, complex operation steps and low processing efficiency.
In a first aspect, the present application provides an integrated carrier.
In a second aspect, the present application also provides a mold assembly comprising the above-described integrated carrier.
In a third aspect, the present application further provides a method for processing a wire, where the wire is made using the die assembly described above.
The integrated carrier of this application first aspect embodiment, integrated carrier is used for processing the wire rod and is suitable for installing in a plurality of mould subassemblies, and integrated carrier includes the carrier main part, the carrier main part constructs into frame structure and includes along the relative first frame and the second frame that sets up of first direction, first frame has first wire casing, the second frame has the second wire casing, first wire casing with the second wire casing is all followed first direction extends, the carrier main part with a plurality of the die cavity of mould subassembly all detachably links to each other.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
the integrated carrier provided by the embodiment of the application can be convenient for positioning and mounting wires, the external integrated carrier has wide visual field when mounting wires, and the operation space is sufficient, so that the positioning is more accurate; on the other hand, the wire rod can be detached from the two wire grooves without changing the die assembly every time, so that the wire rod is prevented from being damaged unnecessarily, and the wire rod rate is improved. In addition, can be convenient for set up unidimensional first wire casing and second wire casing according to the wire rod of different models, processing is convenient, and the cost is lower, and the generic property is good.
In some embodiments, further comprising: a first cover plate, one end of which is pivotally arranged on the first side frame and is switchable between a first open position and a first closed position, and when the first cover plate is positioned at the first open position, the first wire groove is opened; when the first cover plate is located at a first closing position, the first cover plate and the first wire groove jointly clamp the wire rod.
In some embodiments, the first cover plate is formed with a runner adapted to communicate with a cavity of the mold assembly.
In some embodiments, the flow channel comprises a first sub-flow channel and a second sub-flow channel, the first sub-flow channel and the second sub-flow channel being respectively located on two sides of the first wire slot opposite to each other; the first frame is provided with a communication groove communicated with the first sub-runner and/or the second sub-runner, and one side of the communication groove, which faces the second frame, is opened.
In some embodiments, the other end of the first cover plate is connected with the first frame through a clamping mechanism; and/or the other end of the first cover plate is connected with the first frame through a plug-in mechanism.
In some embodiments, the other end of the first cover plate is connected with the first frame through the clamping mechanism, the clamping mechanism comprises a clamping groove and a buckle, the buckle is provided with a hand-buckling section and a mounting section which are vertically connected, the mounting section is pivotably arranged on the first frame so as to enable the buckle to be switched between a locking position and an unlocking position, one end of the hand-buckling section, which faces the clamping groove, is provided with a clamping part which extends obliquely towards the clamping groove, and the side wall of the clamping groove, which faces one end of the buckle, extends obliquely towards the hand-buckling section; when the buckle is positioned at the locking position, the clamping part is in clamping connection with the side wall of one end of the clamping groove, which is oriented to the buckle, and when the buckle is positioned at the unlocking position, the clamping part is separated from the side wall of one end of the clamping groove, which is oriented to the buckle.
In some embodiments, the carrier body further includes a third frame and a fourth frame disposed opposite along the second direction, the first frame, the third frame, the second frame, and the fourth frame are sequentially connected, at least one of the third frame and the fourth frame is provided with a hand-held portion, the housing of the mold assembly has an opening, and the hand-held portion is adapted to extend from the opening to the outside of the housing.
In some embodiments, further comprising: the second cover plate is pivotally arranged on the second frame and is switched between a second opening position and a second closing position, and when the second cover plate is positioned at the second opening position, the second wire slot is opened; when the second cover plate is located at a second closing position, the second cover plate and the second wire slot jointly clamp the wire rod.
In some embodiments, further comprising: the auxiliary wire arrangement platform is detachably connected with the carrier main body, a third wire groove is formed in the middle of the auxiliary wire arrangement platform, extends along the first direction and is located between the first wire groove and the second wire groove.
A mold assembly according to an embodiment of the second aspect of the present application includes the above-described integrated carrier. The die assembly provided by the embodiment of the application can be convenient for positioning and mounting wires, an external integrated carrier has wide visual field when mounting wires, and the die assembly is sufficient in operation space and more accurate in positioning; on the other hand, the wire rod can be detached from the two wire grooves without changing the die assembly every time, so that the wire rod is prevented from being damaged unnecessarily, and the wire rod rate is improved. In addition, can be convenient for set up unidimensional first wire casing and second wire casing according to the wire rod of different models, processing is convenient, and the cost is lower, and the generic property is good.
A method for processing a wire rod according to an embodiment of the third aspect of the present application, the wire rod being made using a die assembly according to claim, the die assembly being plural and including a first die and a second die, the method comprising the steps of: installing the carrier main body on an auxiliary wire arranging platform of the integrated carrier; opening the first cover plate of the carrier body and the second cover plate of the carrier body; placing a wire to be formed into the first wire groove, a third wire groove of an auxiliary wire arranging platform and the second wire groove, and closing the first cover plate and the second cover plate to limit the wire to be formed into the first wire groove and the second wire groove; separating the carrier main body from the auxiliary wire arranging platform and putting the carrier main body into the first die for processing; and separating the carrier main body from the first die and putting the carrier main body into the second die for processing. According to the wire rod processing method, the wire rod is accurately positioned, operation steps can be simplified, and processing efficiency is improved. In addition, the requirement of taking the wire rod to be formed can be reduced, and the wire rod to be formed is prevented from being damaged, so that the rate of the wire rod is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
Fig. 1 is a perspective view of a carrier body according to an embodiment of the present application.
Fig. 2 is an enlarged view at a of fig. 1.
Fig. 3 is a perspective view of an integrated carrier according to an embodiment of the present application.
Fig. 4 is a perspective view of a first mold according to an embodiment of the present application.
Fig. 5 is a perspective view of a part of a first mold according to an embodiment of the present application.
Reference numerals illustrate:
1. an integrated carrier; 100. a first mold; 101. an opening; 102. a cavity; 200. a wire rod;
10. a carrier body; 11. a first frame; 111. a first wire chase; 112. a communication groove;
12. a second frame; 121. a second wire slot; 13. a third frame; 14. a fourth frame;
20. a first cover plate; 21. a flow passage; 211. a first sub-flow path; 212. a second sub-flow path;
30. a second cover plate;
40. a buckle; 41. a hand-buckling section; 411. a clamping part; 42. a mounting section; 50. a clamping groove;
60. an auxiliary line platform; 61. a third wire chase; 70. a hand-held part.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
The following disclosure provides many different embodiments, or examples, for implementing different structures of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
For ease of description, spatially relative terms, such as "middle," "horizontal," "vertical," "upper," "lower," "front," "rear," "length," "width," "thickness," "inner," "outer," and the like, may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figure experiences a position flip or a change in attitude or a change in state of motion, then the indications of these directivities correspondingly change, for example: an element described as "under" or "beneath" another element or feature would then be oriented "over" or "above" the other element or feature. Thus, the example term "below … …" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein interpreted accordingly. In the description of the present application, the meaning of "plurality" is two or more.
In order to solve the technical problems of small operation space, inconvenient installation, complex operation steps and low processing efficiency in the prior art, the application provides an integrated carrier 1.
The integrated carrier 1 of the embodiment of the present application is described below with reference to the drawings.
Specifically, as shown in fig. 1-5, the integrated carrier 1 is used to process the wire 200, and the wire 200 may be a wire to be formed or may be a wire that has been formed and requires further processing. The integration carrier 1 is adapted to be mounted within a plurality of mold assemblies, the integration carrier comprising: the carrier body 10, the carrier body 10 is configured into a frame structure and comprises a first frame 11 and a second frame 12 which are oppositely arranged along a first direction, the first frame 11 is provided with a first wire groove 111, the second frame 12 is provided with a second wire groove 121, the first wire groove 111 and the second wire groove 121 extend along the first direction, and the carrier body 10 is detachably connected with the cavities 102 of a plurality of die assemblies.
Through setting up first wire casing 111 and second wire casing 121, two wire casings can fix a position and spacing wire rod 200 in wire rod 200's length direction's both sides, because when the wire rod processing, need carry out a lot of processing in a plurality of mould subassemblies, integrated carrier 1 links to each other with the die cavity of a plurality of mould subassemblies all detachably, when installing wire rod 200, can be earlier with integrated carrier 1 external, for example place on the workstation, with wire rod 200 to in first wire casing 111 and the second wire casing 121 in again, place integrated carrier 1 and wire rod 200 are whole inside different mould subassemblies according to the processing step again.
Therefore, compared with the arrangement mode that the installation structure is fixedly arranged in each die assembly, on one hand, the wire 200 can be positioned and installed conveniently, the external integrated carrier 1 has wide visual field when the wire 200 is installed, the operation space is sufficient, and the positioning is more accurate; on the other hand, the wire 200 does not need to be detached from the two wire grooves every time the die assembly is replaced, so that unnecessary damage to the wire 200 is prevented, and the rate of the wire 200 is improved. In addition, the first wire groove 111 and the second wire groove 121 with different sizes can be conveniently arranged according to wires 200 with different types, and the wire winding device is convenient to process, low in cost and good in universality.
In some embodiments, as shown in fig. 1, the integrated carrier may further comprise: a first cover 20, one end of the first cover 20 is pivotally provided to the first frame 11 and is switchable between a first open position and a first closed position, and when the first cover 20 is located at the first open position, the first wire slot 111 is opened; when the first cover plate 20 is located at the first closed position, the first cover plate 20 and the first wire groove 111 clamp the wire 200 together.
In the prior art, the wire is easy to bend and move, so that the cover plate for limiting the wire is arranged in each processed die assembly, the wire can be damaged in the action of opening and closing the cover plate of each die assembly, the operation is complex, and the processing time is long. Also, when a plurality of processes are performed through a plurality of mold assemblies, it is necessary to open and close the cover plate a plurality of times. Through setting up first apron 20 on integrated carrier 1, can carry out spacingly to wire rod 200, wire rod emergence drunkenness when preventing integrated carrier 1 to wire rod drunkenness when can preventing the processing. In addition, in the case of a plurality of processes, there is no need to open and close the first cover plate 20 a plurality of times, preventing the wire 200 from being worn, and improving the rate of the wire 200.
In some embodiments, as shown in fig. 1, the first cover plate 20 is formed with runners 21, the runners 21 being adapted to communicate with the cavities 102 of the mold assembly. In the prior art, the component integrated with the runner is generally used for injection molding of the wire, if injection molding is needed during processing, the component is installed in a cavity of a die assembly, and the component is disassembled after processing, so that the processing step is complex. The operator needs to implant the wire rod into the alignment position behind the mould cavity of the internal mould, cover the front and back pressing plates tightly to fix the wire rod, cover the runner stop bar for forming the internal mould, pull out the runner after the internal mould is formed, take out the product, take out the external mould, and cover the runner stop bar for continuously forming the external mould. In this application embodiment, can be with being used for compressing tightly the first apron 20 and the runner blend stop integration of wire rod 200, if need the processing step of moulding plastics, directly in runner 21 the encapsulating injection molding liquid can, need not to repeatedly get and put runner 21, the simple operation can improve machining precision and wire rod 200's rate of merit, reduces processing cost.
In some embodiments, as shown in fig. 1, the runner 21 includes a first sub-runner 211 and a second sub-runner 212, and the first sub-runner 211 and the second sub-runner 212 are respectively located at two opposite sides of the first wire groove 111, so that injection liquid flows to the periphery of the wire 200, and processing precision of the wire 200 is improved. The first frame 11 has a communication groove 112 communicating with the first sub-flow path 211 and/or the second sub-flow path 212, and one side of the communication groove 112 facing the second frame 12 is opened. For example, the communication groove 112 may be in communication with both the first sub-runner 211 and the second sub-runner 212, and the communication groove 112 may extend in a vertical direction so as to split the injection molding liquid from the communication groove 112 to the first sub-runner 211 and the second sub-runner 212, and the height of the cross sections of the first sub-runner 211 and the second sub-runner 212 in the vertical direction may be greater than the width of the cross sections of the first sub-runner 211 and the second sub-runner 212 in the vertical direction so as to facilitate the injection molding liquid to continue to flow downward into the cavity 102, thereby improving the processing efficiency and the precision.
In some embodiments, the other end of the first cover 20 is connected to the first frame 11 through a clamping mechanism; and/or the other end of the first cover plate 20 is connected with the first frame 11 through a plugging mechanism. For example, the clamping mechanism may be a clamping fit of a clamping hook and a clamping hole or a clamping groove and a clamping buckle, and the plugging mechanism may include a plugging column, a slot or a plugging fit of a plugging column and a jack, which is not limited herein. Thus, one end of the first cover 20 is pivotably provided to the first frame 11, and the other end of the first cover 20 is detachably connected to the first frame 11 to facilitate the installation and removal of the wire 200.
Further, as shown in fig. 2, the other end of the first cover 20 is connected with the first frame 11 through a clamping mechanism, the clamping mechanism comprises a clamping groove 50 and a buckle 40, the buckle 40 is provided with a hand-buckling section 41 and a mounting section 42 which are vertically connected, the mounting section 42 is pivotally arranged on the first frame 11 so as to enable the buckle 40 to switch between a locking position and an unlocking position, one end of the hand-buckling section 41 facing the clamping groove 50 is provided with a clamping part 411 extending obliquely towards the clamping groove 50, and the side wall of the clamping groove 50 facing one end of the buckle 40 extends obliquely towards the hand-buckling section 41; when the latch 40 is in the locked position, the locking portion 411 is connected to a side wall of the latch 50 facing one end of the latch 40 in a locking manner, and when the latch 40 is in the unlocked position, the locking portion 411 is separated from a side wall of the latch 50 facing one end of the latch 40.
Thus, when the operator dials the fastening section 41 in a direction away from the clamping groove 50, the mounting section 42 pivots to press down one end of the fastening section 41 away from the clamping groove 50, so that the clamping portion 411 can be disengaged from the clamping groove 50, and thus, the other end of the first cover 20 can be separated from the first frame 11, so as to facilitate mounting or dismounting of the wire 200. The clamping structure can avoid acting force directly generated in the vertical direction, can reduce pressure generated on the wire 200 when the first cover plate 20 is opened and closed, and improves machining precision and the rate of the wire 200.
In some embodiments, referring to fig. 1 in combination with fig. 4 and 5, the carrier body 10 further includes a third frame 13 and a fourth frame 14 disposed opposite to each other along the second direction, the first frame 11, the third frame 13, the second frame 12, and the fourth frame 14 are sequentially connected, at least one of the third frame 13 and the fourth frame 14 is provided with a hand-holding portion 70, the housing of the mold assembly has an opening 101, and the hand-holding portion 70 is adapted to protrude from the opening 101 to the outside of the housing.
Thus, the hand-hold portion 70 not only can facilitate the transfer and installation of the integrated carrier 1, but also can utilize the opening 101 of the mold assembly, the opening 101 can be an existing clearance structure of the mold assembly in the prior art, and can be a clearance structure for avoiding components integrated with runners or other components, in the present application, when the integrated carrier 1 is installed inside the mold assembly, an operator can also utilize the hand-hold portion 70 that can extend to the outside of the mold assembly to carry out hand-hold, installation, disassembly or other operations, so as to improve the operability and the usability.
In some embodiments, as shown in fig. 1, the integrated carrier 1 further comprises: the second cover plate 30, the second cover plate 30 is pivotally arranged on the second frame 12 and is switched between a second open position and a second closed position, and when the second cover plate 30 is positioned in the second open position, the second wire slot 121 is opened; when the second cover plate 30 is located at the second closed position, the second cover plate 30 and the second wire groove 121 clamp the wire 200 together. In this way, the first cover plate 20 and the second cover plate 30 can clamp the wire 200 together with the first wire groove 111 and the second wire groove 121 in the length direction of the wire 200 at both sides of the length direction of the wire 200, so as to improve the stability of the wire 200 during processing and improve the processing precision.
For example, one end of the second cover 30 may be pivotally disposed on the second frame 12, and the second cover 30 may be fastened to connect the other end of the second cover 30 to the second frame 12 by means of a buckle to facilitate the installation or removal of the wire 200. The clamping structure can avoid acting force from directly generating in the vertical direction, can reduce the pressure on the wire 200 when opening and closing, and improves the machining precision and the rate of the wire 200.
In some embodiments, as shown in fig. 1 and 3, the auxiliary wire arrangement platform 60 is further included, the auxiliary wire arrangement platform 60 is detachably connected to the carrier body 10, a third wire slot 61 is formed in a middle portion of the auxiliary wire arrangement platform 60, and the third wire slot 61 extends along the first direction and is located between the first wire slot 111 and the second wire slot 121. By providing the auxiliary wire feeding platform 60, the wire 200 can be assisted to be mounted on the carrier body 10, so as to further improve the machining precision of the wire 200 and improve the rate of the wire 200. Meanwhile, the auxiliary wire arranging platform 60 is detachably connected with the carrier main body 10, and after the wire 200 is mounted on the carrier main body 10, the auxiliary wire arranging platform 60 can be separated from the carrier main body 10, and the auxiliary wire arranging platform 60 does not occupy the inner space of the die assembly.
For example, one of the auxiliary wire management platform 60 and the carrier body 10 has a plugging block, and the other of the auxiliary wire management platform 60 and the carrier body 10 has a plugging slot or a plugging hole, so that the auxiliary wire management platform 60 is plugged and matched with the carrier body 10, thereby facilitating positioning and detachable connection and preventing the wires 200 from moving when being installed. The plug-in block may include a plurality of spaced apart along the first direction and a plurality of spaced apart along the second direction to further enhance the spacing effect.
A fourth wire groove and a fifth wire groove may be respectively disposed at the corresponding position of the first cover plate 20 and the first wire groove 111 and the corresponding position of the second cover plate 30 and the second wire groove 121, the fourth wire groove and the first wire groove 111 cooperate to clamp the wire 200 together in the up-down direction, and the fifth wire groove and the second wire groove 121 cooperate to clamp the wire 200 together in the up-down direction. At least one of the fourth wire slot and the fifth wire slot can be internally provided with flexible parts such as silica gel parts, so as to further reduce the pressure on the wire 200 and improve the rate of the wire 200.
The embodiment of the application also provides a die assembly, which comprises the integrated carrier 1. The number of mold carriers may be plural, and the integrated carrier 1 may be detachably provided in plural mold assemblies. The die assembly can be convenient for the location installation of wire rod 200, and the field of vision is wide when installing wire rod 200 wire rod, and operating space is sufficient, and the location is also more accurate, and can not dismantle wire rod 200 from two wire casings when changing the die assembly every time to prevent wire rod 200 from producing unnecessary damage, improved wire rod 200's advantage rate. In addition, the processing is convenient, the cost is lower, and the universality is good.
The embodiment of the application also provides a processing method of the wire rod, wherein the wire rod is made of the die assembly, the die assembly is multiple and comprises a first die 100 and a second die, for example, the first die 100 can be an inner die, and the second die can be an outer die. The processing method of the wire rod comprises the following steps:
the carrier body 10 is mounted on the auxiliary wire arranging platform 60 of the integrated carrier 1 so that the wire 200 to be formed is limited by the third wire groove 61, the first wire groove 111 and the second wire groove 121.
The first cover plate 20 of the carrier body 10 and the second cover plate 30 of the carrier body 10 are opened so as to open the first wire groove 111 and the second wire groove 121 to place the wire 200 to be formed.
Placing the wire 200 to be formed into the first wire groove 111, the third wire groove 61 of the auxiliary wire management platform 60, and the second wire groove 121 and closing the first cover plate 20 and the second cover plate 30 to restrict the wire 200 to be formed into the first wire groove 111 and the second wire groove 121;
separating the carrier main body 10 from the auxiliary wire arranging platform 60 and putting the carrier main body into the first die 100 for processing; the carrier main body 10 is separated from the auxiliary wire arranging platform 60, at this time, the wire 200 to be formed is separated from the third wire groove 61, and then the wire is put into the first mold for processing, and when injection molding is required by the first mold 100, the first cover plate 20 of the embodiment of the application integrates the runner 21, so that a component provided with the runner 21 can be not required to be put into the component separately, the processing steps are simplified, and the processing efficiency is improved.
The carrier body 10 is separated from the first mold 100 and put into a second mold for processing. When the wire 200 to be processed needs the second processing step, only the carrier body 10 is required to be detached from the first die together with the wire 200 to be processed and then put into the second die, and compared with the prior art that the cover plate of the first die is integrated on the first die and the cover plate of the second die is integrated on the second die, the method that the cover plate is repeatedly opened is required to detach the wire 200 to be formed. By the arrangement, the operation steps can be further simplified, the processing efficiency is improved, the requirement for taking the wire 200 to be formed can be reduced, the wire 200 to be formed is prevented from being damaged, and the rate of the wire 200 is improved.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is explicitly stated. It should also be appreciated that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (11)

1. An integrated carrier (1) for processing wire (200) and adapted to be mounted within a plurality of die assemblies, comprising:
carrier main part (10), carrier main part (10) constructs frame structure and includes first frame (11) and second frame (12) that set up relatively along first direction, first frame (11) have first wire casing (111), second frame (12) have second wire casing (121), first wire casing (111) with second wire casing (121) are all followed first direction extends, carrier main part (10) with a plurality of die cavity (102) of mould subassembly all detachably links to each other.
2. The integrated carrier of a mold assembly of claim 1, further comprising:
a first cover plate (20), one end of the first cover plate (20) is pivotally arranged on the first side frame (11) and is switchable between a first open position and a first closed position, and when the first cover plate (20) is positioned at the first open position, the first wire slot (111) is opened; when the first cover plate (20) is located at a first closing position, the first cover plate (20) and the first wire groove (111) jointly clamp the wire (200).
3. The integrated carrier (1) of a mould assembly according to claim 2, wherein the first cover plate (20) is formed with a runner (21), the runner (21) being adapted to communicate with a cavity (102) of the mould assembly.
4. An integrated carrier of a mould assembly according to claim 3, characterized in that the runner (21) comprises a first sub-runner (211) and a second sub-runner (212), the first sub-runner (211) and the second sub-runner (212) being located on opposite sides of the first wire slot (111), respectively; the first frame (11) is provided with a communication groove (112) communicated with the first sub-runner (211) and/or the second sub-runner (212), and one side of the communication groove (112) facing the second frame (12) is opened.
5. The integrated carrier of a mold assembly according to claim 2, wherein the other end of the first cover plate (20) is connected to the first frame (11) by a clamping mechanism; and/or the other end of the first cover plate (20) is connected with the first side frame (11) through a plug-in mechanism.
6. The integrated carrier of a mold assembly according to claim 5, wherein the other end of the first cover plate (20) is connected with a first frame (11) through the clamping mechanism, the clamping mechanism comprises a clamping groove (50) and a buckle (40), the buckle (40) is provided with a hand buckling section (41) and a mounting section (42) which are vertically connected, the mounting section (42) is pivotably arranged on the first frame (11) so as to switch the buckle (40) between a locking position and an unlocking position, one end of the hand buckling section (41) facing the clamping groove (50) is provided with a clamping part (411) extending obliquely towards the clamping groove (50), and the side wall of the clamping groove (50) facing one end of the buckle (40) extends obliquely towards the hand buckling section (41);
when the buckle (40) is located at the locking position, the clamping portion (411) is in clamping connection with the side wall of the clamping groove (50) facing one end of the buckle (40), and when the buckle (40) is located at the unlocking position, the clamping portion (411) is separated from the side wall of the clamping groove (50) facing one end of the buckle (40).
7. The integrated carrier of a mould assembly according to claim 1, wherein the carrier body (10) further comprises a third rim (13) and a fourth rim (14) arranged opposite in the second direction, the first rim (11), the third rim (13), the second rim (12) and the fourth rim (14) being connected in sequence, at least one of the third rim (13) and the fourth rim (14) being provided with a hand-held portion (70), the housing of the mould assembly having an opening (101), the hand-held portion (70) being adapted to protrude from the opening (101) outside the housing.
8. The integrated carrier of a mold assembly of claim 1, further comprising: a second cover plate (30), wherein the second cover plate (30) is pivotally arranged on the second frame (12) and is switched between a second open position and a second closed position, and when the second cover plate (30) is positioned in the second open position, the second wire slot (121) is opened; when the second cover plate (30) is located at a second closing position, the second cover plate (30) and the second wire groove (121) jointly clamp the wire (200).
9. The integrated carrier of a mold assembly of claim 1, further comprising: the auxiliary wire arrangement platform (60), auxiliary wire arrangement platform (60) with carrier main part (10) detachably links to each other, the middle part of auxiliary wire arrangement platform (60) is formed with third wire casing (61), third wire casing (61) are followed first direction extension just is located between first wire casing (111) and second wire casing (121).
10. Mould assembly, characterized in that it comprises an integrated carrier (1) according to any one of claims 1-9.
11. A method of processing a wire, the wire being made using a die assembly according to claim 10, the die assembly being a plurality and comprising a first die (100) and a second die, the method comprising the steps of:
-mounting the carrier body (10) to an auxiliary wire management platform (60) of the integrated carrier (1);
-opening a first cover plate (20) of the carrier body (10) and a second cover plate (30) of the carrier body (10);
placing a wire (200) to be formed into the first wire slot (111), a third wire slot (61) of an auxiliary wire management platform (60) and the second wire slot (121) and closing the first cover plate (20) and the second cover plate (30) to limit the wire (200) to be formed into the first wire slot (111) and the second wire slot (121);
separating the carrier main body (10) from the auxiliary wire arranging platform (60) and putting the carrier main body into the first die (100) for processing;
the carrier body (10) is separated from the first mould (100) and placed into the second mould for processing.
CN202311549778.3A 2023-11-20 2023-11-20 Integrated carrier, die assembly and wire processing method Pending CN117373752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311549778.3A CN117373752A (en) 2023-11-20 2023-11-20 Integrated carrier, die assembly and wire processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311549778.3A CN117373752A (en) 2023-11-20 2023-11-20 Integrated carrier, die assembly and wire processing method

Publications (1)

Publication Number Publication Date
CN117373752A true CN117373752A (en) 2024-01-09

Family

ID=89404240

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311549778.3A Pending CN117373752A (en) 2023-11-20 2023-11-20 Integrated carrier, die assembly and wire processing method

Country Status (1)

Country Link
CN (1) CN117373752A (en)

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