CN117362923A - Epoxy resin composition for full encapsulation and preparation method thereof - Google Patents
Epoxy resin composition for full encapsulation and preparation method thereof Download PDFInfo
- Publication number
- CN117362923A CN117362923A CN202210767084.6A CN202210767084A CN117362923A CN 117362923 A CN117362923 A CN 117362923A CN 202210767084 A CN202210767084 A CN 202210767084A CN 117362923 A CN117362923 A CN 117362923A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- weight
- phenolic
- silicon dioxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 158
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 158
- 239000000203 mixture Substances 0.000 title claims abstract description 111
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000005538 encapsulation Methods 0.000 title description 9
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 28
- 239000005011 phenolic resin Substances 0.000 claims abstract description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 25
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 12
- 239000000654 additive Substances 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 68
- 239000000377 silicon dioxide Substances 0.000 claims description 32
- -1 dicyclopentadiene modified phenolic resin Chemical class 0.000 claims description 16
- 235000012239 silicon dioxide Nutrition 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000001993 wax Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 10
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 8
- 239000003063 flame retardant Substances 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 7
- 239000002516 radical scavenger Substances 0.000 claims description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 229910021488 crystalline silicon dioxide Inorganic materials 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 150000003003 phosphines Chemical class 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 claims description 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000004203 carnauba wax Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 2
- 235000021355 Stearic acid Nutrition 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000012170 montan wax Substances 0.000 claims 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims 1
- 239000008117 stearic acid Substances 0.000 claims 1
- 230000032798 delamination Effects 0.000 description 15
- 238000000465 moulding Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 229920006336 epoxy molding compound Polymers 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910002026 crystalline silica Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011812 mixed powder Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 206010017076 Fracture Diseases 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 241000863480 Vinca Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- RGBIPJJZHWFFGE-UHFFFAOYSA-N cyclohexa-2,5-diene-1,4-dione;triphenylphosphane Chemical compound O=C1C=CC(=O)C=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RGBIPJJZHWFFGE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to an epoxy resin composition, wherein the epoxy resin composition comprises, based on the total weight of the epoxy resin composition: (a) 7-14% by weight of an epoxy resin, (b) 2-6% by weight of a phenolic resin, (c) 0.15-0.6% by weight of a curing accelerator, (d) 70-86% by weight of a filler, optionally (e) 1-18% by weight of an additive; wherein the epoxy resin comprises dicyclopentadiene type epoxy resin, and the proportion of dicyclopentadiene type epoxy resin to epoxy resin is 0.3-1, preferably 0.4-0.8 by weight. The invention also relates to a preparation method and application of the epoxy resin composition.
Description
Technical Field
The invention belongs to the technical field of microelectronic packaging materials, and particularly relates to an epoxy resin composition for full encapsulation and a preparation method thereof. The invention also relates to the use of the epoxy resin composition for packaging electronic components.
Background
The epoxy molding compound is widely used as a packaging material of commonly used electronic components and is widely used for packaging power semiconductor devices in the application fields of consumer electronics, industry, automobiles, high-speed rails, power grids, communication and the like, and the electronic components and the components are protected from corrosion and stress damage of the environment. For fully-encapsulated power semiconductor devices, with the use requirements of more and more electronic components for high power such as high voltage and high current, the probability of causing reliability failure in various application scenes in the packaging process is also increased, for example, high-voltage insulation breakdown is caused by surface air holes, and a copper wire or a gold wire is bent to cause short circuit of the devices, delamination leads fall off and the like.
Fully encapsulated power semiconductor devices have relatively high thermal conductivity requirements for the encapsulating material. CN103421275a discloses an epoxy resin composition with high thermal conductivity for packaging high-power devices and a preparation method thereof, crystalline silica with different particle size distribution is selected as an inorganic filler, and the epoxy resin composition has thermal conductivity greater than 2.2W/m-k after curing.
In order to obtain higher and more stable electrical performance reliability of the product, a thin back adhesive (the thickness of the back surface is 0.35-0.45 mm) is adopted to design the packaged product, and the thickness of the front surface (namely the distance from the upper surface of the chip to the upper surface of the device) is increased. Such a design may exacerbate the imbalance in die flow rates up and down during injection molding, resulting in voids such as backside weld marks, which require a better balance of encapsulant viscosity and slit wettability. Meanwhile, in order to meet the rapid curing requirements of Auto-molding dies, the encapsulating material often has a high reaction rate and viscosity value, which is also a relatively great challenge for the anti-wire properties compatible with 0.8-1mil copper wire products.
Disclosure of Invention
In one aspect, the present invention relates to an epoxy resin composition, wherein the epoxy resin composition comprises, based on the total weight of the epoxy resin composition: (a) 7-14% by weight of an epoxy resin, (b) 2-6% by weight of a phenolic resin, (c) 0.15-0.6% by weight of a curing accelerator, (d) 70-86% by weight of a filler, optionally (e) 1-18% by weight of an additive; wherein the epoxy resin comprises dicyclopentadiene type epoxy resin, and the proportion of dicyclopentadiene type epoxy resin to epoxy resin is 0.3-1, preferably 0.4-0.8 by weight.
In another aspect, the present invention relates to a method of preparing the epoxy resin composition of the present invention, comprising the steps of: the components are weighed and mixed in proportion to obtain premixed powder, and the premixed powder is melted, mixed and extruded by an extruder, cooled and crushed to obtain the product.
In yet another aspect, the present invention relates to the use of the epoxy resin composition of the present invention for electronic component packaging.
Detailed Description
General definitions and terms
All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety, if not indicated otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In the event of a conflict, the definitions provided herein will control.
All percentages, parts, ratios, etc. are by weight unless otherwise specified.
When an amount, concentration, or other value or parameter is given as either a range, preferred range or upper and lower limit or a particular value, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. When numerical ranges are recited herein, unless otherwise stated, the stated ranges are meant to include the endpoints thereof, and all integers and fractions within the range. The scope of the invention is not limited to the specific values recited when defining the scope. For example, "1-8" encompasses 1, 2, 3, 4, 5, 6, 7, 8 and any subrange comprised of any two values therein, e.g., 2-6, 3-5.
The terms "about", "about" when used in conjunction with a numerical variable generally refer to the value of the variable and all values of the variable being within experimental error (e.g., within a confidence interval of 95% for the average) or within + -10% of the specified value, or more broadly.
The terms "comprising," "including," "having," "containing," or "involving," and other variations thereof herein, are inclusive or open-ended and do not exclude additional unrecited elements or method steps. Those skilled in the art will appreciate that such terms as "comprising" encompass the meaning of "consisting of …". The expression "consisting of …" excludes any element, step or ingredient not specified. The expression "consisting essentially of …" means that the scope is limited to the specified elements, steps, or components, plus any elements, steps, or components that are optionally present that do not materially affect the basic and novel characteristics of the claimed subject matter. It should be understood that the expression "comprising" encompasses the expressions "consisting essentially of …" and "consisting of …".
The term "selected from …" means that one or more elements in the group listed below are independently selected and may include a combination of two or more elements.
When numerical values or range endpoints are described herein, it is to be understood that the disclosure includes the specific value or endpoint cited.
The terms "one or more" or "at least one" as used herein mean one, two, three, four, five, six, seven, eight, nine or more.
Unless otherwise indicated, the terms "combination thereof" and "mixtures thereof" refer to multicomponent mixtures of the elements, e.g., two, three, four, and up to the maximum possible multicomponent mixtures.
Furthermore, the number of components or groups of components of the present invention not previously indicated is not limiting with respect to the number of occurrences (or existence) of components or groups of components. Thus, the singular forms of a component or a constituent should be interpreted to include one or at least one, and the plural unless the numerical value clearly indicates the singular.
The term "optional" or "optionally" as used herein means that the subsequently described event or circumstance may or may not occur, and that the description includes instances where said event or circumstance occurs and instances where it does not.
When a method, component, or step is described as being identified by letter or number, it is for distinction purposes only and does not limit the order or order in which the methods, components, or steps must be performed. And can be reasonably adjusted by a person skilled in the art.
The term "Room Temperature (RT)" as used herein refers to about 25 ℃.
The term "epoxy molding compound" as used herein, i.e., epoxy molding compound. The epoxy resin composition is used herein as a molding compound, and thus "epoxy molding compound" is also referred to as "epoxy resin composition".
The term "molded package" refers to a semiconductor device formed by molding an epoxy molding compound into a mold cavity by, for example, transfer molding and embedding the chip therein while cross-linking and curing the molding compound. The epoxy molding compound is required to have good operability, sealability and insulation properties, and protect chips and electronic circuits from external cold, hot, moisture, chemical corrosion and the like.
The term "D50 particle size" refers to the particle size value corresponding to a cumulative distribution percentage of 50%, the D50 particle size in the present invention being characterized by a laser particle sizer.
The term "acidity" refers to the milligrams of potassium hydroxide required to neutralize one gram of chemicals.
Unless defined otherwise, all terms used in the disclosure of the present invention, including technical and scientific terms, have the meaning commonly understood by one of ordinary skill in the art to which this invention belongs. By way of further example, term definitions are included herein to better understand the teachings of the present invention.
Each component in the epoxy resin composition of the present invention will be described in detail below.
(a) Epoxy resin
As used herein, an epoxy resin contains two or more epoxy groups per molecule.
The choice of the appropriate type of epoxy resin helps to achieve the desired properties of the product. The epoxy resin of the present invention comprises dicyclopentadiene type epoxy resin to impart excellent delamination resistance, impact linearity, and electrical reliability to the product. In one embodiment, the dicyclopentadiene type epoxy resin is present in a ratio of about 0.3 to about 1, such as about 0.55, by weight of the epoxy resin. When the proportion of dicyclopentadiene type epoxy resin to the epoxy resin is too low, the product cannot obtain desired properties such as stable and excellent delamination resistance and electrical reliability.
The total epoxy resin content should be kept within a certain range to help give the product proper fluidity, wettability, adhesion, water resistance, mechanical properties, etc. The epoxy resin may be present in the epoxy resin composition in an amount of about 7 to 14 weight percent, preferably about 8 to 10 weight percent, for example about 9.6 weight percent, based on the total weight of the epoxy resin composition.
The epoxy resin should have a suitable viscosity, and too low an epoxy resin viscosity would result in too low a viscosity of the epoxy resin composition and a long spiral flow length, increasing the rate difference of the upper and lower mold injection flows and the risk of mold flow air entrainment. While an excessively high epoxy viscosity will result in insufficient flow length of the epoxy composition and excessively low fluidity when the package is filled at a thinner back side (0.35-0.6 mm, preferably 0.35-0.45 mm), resulting in an injection molding unfilled problem. The viscosity of the epoxy resin can be determined, for example, at 150℃using a cone-plate viscometer.
The viscosity of the epoxy resin is affected by the viscosity and the ratio of the constituent resins. In one embodiment, the dicyclopentadiene type epoxy resin used has a viscosity of 0.2 to 1 poise, for example, about 1 poise. In another embodiment, the cresol formaldehyde epoxy has a viscosity of 0.9 to 6 poise. In yet another embodiment, the symmetrical biphenyl epoxy resin has a viscosity of 0.01-0.15 poise.
(b) Phenolic resin
The phenolic resin used in the epoxy resin composition of the present invention contains at least two hydroxyl groups per molecule. The phenolic resin of the invention is mainly used as a curing agent and has a linear chain structure. The hydroxyl groups can react with the epoxy resin to form a crosslinked network structure.
The phenolic resin of the present invention is selected from: novolac resins, phenol aralkyl phenolic resins, dicyclopentadiene modified phenolic resins, and combinations thereof. In a preferred embodiment, the phenolic resin of the present invention is a phenolic novolac resin. The preferred phenolic resin contributes to good electrical insulation, sufficient strength, a suitable coefficient of expansion and resistance to high temperature stress failure of the packaged product.
The phenolic resin content should be kept within a range such that the epoxy resin composition has a sufficient degree of cure, proper fluidity and viscosity. The phenolic resin is present in an amount of about 2 to about 6 weight percent, preferably about 3 to about 5 weight percent, based on the total weight of the epoxy resin composition.
The viscosity of the phenolic resin is kept within a certain range so as to ensure the delamination resistance, the impact linearity and the electrical property reliability of the product and avoid the occurrence of air hole failure. Suitable phenolic resins have a viscosity of about 1.5 to 6.5 poise, preferably about 2 to 6 poise, for example about 5 poise, about 4 poise.
The epoxy resin composition of the present invention contains the epoxy groups of the epoxy resin and the phenolic hydroxyl groups of the phenolic resin in a proper ratio so that the epoxy resin composition prepared attains a proper curing speed, a sufficient degree of crosslinking, a proper viscosity property and excellent electrical properties. In one embodiment, the molar ratio of epoxy groups of the epoxy resin to phenolic hydroxyl groups of the phenolic resin is about 0.7 to 1.4, preferably about 0.8 to 1.2.
(c) Curing accelerator
As used herein, the term "cure accelerator" has the same meaning as "catalyst" that catalyzes or promotes the crosslinking reaction of an epoxy resin with a phenolic resin to form a space network structure without affecting cure performance.
The preferred cure accelerators of the present invention help achieve proper cure rates of the epoxy resin composition to meet the sufficient injection fill time in transfer injection molding processes and to ensure adequate degree of crosslinking and storage modulus of the encapsulated product.
Wherein the imidazole compound comprises, but is not limited to, 2-methylimidazole, 2-ethyl, 4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2, 4-diamino-6- [2 '-methylimidazolyl- (1') ] -ethyl-S-triazine. The organic phosphine compounds include but are not limited to triphenylphosphine, triphenylphosphine-1, 4-benzoquinone adduct.
In another embodiment, the curing accelerator is present in an amount of 0.15 to 0.6 weight percent, preferably about 0.2 to 0.5 weight percent, based on the total weight of the epoxy resin composition.
(d) Packing material
The filler added to the epoxy resin composition contributes to improvement of properties of the epoxy resin composition such as thermal expansion, abrasion resistance, moisture resistance, thermal conductivity, electrical characteristics, and the like. The proper performance of the product can be endowed by changing the type, the content and the size of the filler. In one embodiment, the filler is present in an amount of 70 to 86 weight percent based on the total weight of the epoxy resin composition.
As an important component in the epoxy resin composition, the particle size distribution of the proper silica filler is favorable for wrapping the filler by the mobile phase resin in the epoxy resin composition, so that the epoxy resin composition has proper viscosity and fluidity to meet the appearance requirement of no air holes in the encapsulation of a fully encapsulated product, and is favorable for more fully dispersing the components of the epoxy resin composition and reducing the risk of fracture residue at a glue inlet of the encapsulation body after molding.
In one embodiment, the filler comprises 60 to 85 weight percent silica a and 0 to 12 weight percent silica B, based on the total weight of the epoxy resin composition; wherein the D50 particle diameter of the silicon dioxide A is 14-25 mu m, and the proportion of the part of the silicon dioxide A with the particle diameter of 0-1 mu m in the silicon dioxide A by weight is 12-20%; the D50 particle diameter of the silica B is 5-20 μm, and the proportion of the silica B in the portion having the particle diameter of 0-1 μm is 10-20% by weight.
The morphology of the filler of the present invention provides the epoxy resin composition obtained with sufficient thermal conductivity and flowability. In one embodiment, silica a is crystalline silica and silica B is fused silica sphere. In another embodiment, crystalline silica is used throughout the filler. The silicon dioxide A and the silicon dioxide B are both crystalline silicon dioxide.
In the present invention, the ratio of the silica A and the silica B is in a suitable range as required to impart desired properties to the product. In one embodiment, the weight ratio of silica A to silica B is about 5 to 17, preferably about 7 to 8.
(e) Other additives
The epoxy resin composition of the present invention may optionally further comprise one or more other additives selected from one or more of the following: coupling agents, flame retardants, mold release agents, colorants, ion capturing agents, stress releasing agents, in an amount of 1 to 18 wt%, preferably 1.3 to 10 wt%, based on the total weight of the epoxy resin composition;
the preferred release agent levels and types of the present invention help the epoxy resin composition achieve continuous molding with low smudge problems, good flow and delamination resistance. The release agent is present in an amount of about 0.05 to 1.5 weight percent, preferably 0.2 to 0.9 weight percent, for example about 0.6 weight percent, based on the total weight of the epoxy resin composition. In one embodiment, the mold release agent of the present invention is selected from the group consisting of palm wax, esterified wax, polyethylene wax, amide wax, and combinations thereof, more preferably a combination of esterified wax and polyethylene wax. In another embodiment, the acid value of the release agent of the present invention is 40 mgKOH/g or less.
The flame retardant can endow the epoxy resin composition with anti-combustion performance and certain electrical performance. The flame retardant in the present invention is preferably selected from one or more of the following: organic amines, zinc oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, and phosphine-containing compounds, preferably zinc oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, phosphine-containing compounds, or combinations thereof. The flame retardant is present in an amount of about 0 to 13 weight percent, preferably about 5 to 10 weight percent, for example about 9 weight percent, based on the total weight of the epoxy resin composition.
The coupling agent disclosed by the invention is beneficial to improving the binding force between the epoxy resin composition and various base materials at the application end, and can be used for improving the compatibility between various organic and inorganic components in the epoxy resin composition, improving the strength of the epoxy resin composition and improving the consistency of the die flow during injection molding. In one embodiment, the coupling agent is present in an amount of about 0.1 to3 weight percent, preferably about 0.3 to 1 weight percent, based on the total weight of the epoxy resin composition.
The ion scavenger described in the present invention helps to bind the ability of free ions in the epoxy resin composition to migrate under ambient conditions. In one embodiment, the ion scavenger is selected from the group consisting of metal acid salts, hydrous oxides, and combinations thereof. In one embodiment, the ion scavenger is present in an amount of about 0.05 to3 weight percent, preferably about 0.1 to 1.5 weight percent, for example about 0.5 weight percent, based on the total weight of the epoxy resin composition.
The colorant in the present invention is preferably carbon black. The colorant is preferably present in an amount of 0.1 to 1 weight percent, more preferably 0.2 to 0.5 weight percent, for example about 0.35 weight percent, based on the total weight of the epoxy resin composition.
Epoxy resin composition
The present invention relates to an epoxy resin composition comprising, based on the total weight of the epoxy resin composition
(a) 7 to 14 wt.%, preferably 8 to 10 wt.% of epoxy resin,
(b) 2 to 6% by weight, preferably 3 to 5% by weight, of phenolic resin,
(c) From 0.15 to 0.6% by weight, preferably from 0.2 to 0.5% by weight, of a curing accelerator,
(d) Preferably 70-86% by weight of inorganic filler
Optionally (e) from 1 to 18% by weight, preferably from 1.3 to 10% by weight, of one or more additives selected from the group consisting of: a release agent, a flame retardant, a coupling agent, a colorant, and an ion scavenger.
It will be appreciated that the amounts of the components should be reasonably selected so that the sum of all components in the product is 100%.
Among them, the epoxy resin is preferably a combination of an o-cresol formaldehyde epoxy resin and a dicyclopentadiene type epoxy resin. The phenolic resin is preferably a phenolic novolac resin. The molar ratio of epoxy groups of the epoxy resin to phenolic hydroxyl groups of the phenolic resin is preferably about 0.8 to 1.2.
The curing accelerator is preferably an imidazole compound or a combination of an imidazole compound and an organic phosphine compound.
The inorganic filler is preferably silica. The morphology of the inorganic filler is preferably a combination of crystalline and spherical or crystalline forms are used entirely.
The release agent is preferably a combination of an esterified wax and a polyethylene wax.
The flame retardant is preferably zinc oxide, zinc borate, aluminum hydroxide, magnesium hydroxide, a phosphine-containing compound, or a combination thereof.
The coupling agent is preferably a silane coupling agent, an amine compound, and combinations thereof.
The ion scavenger is preferably a metal acid salt, a hydrous oxide, and combinations thereof.
The colorant is preferably carbon black.
The preferred amounts of each component or combination thereof with a particular component type is advantageous for achieving the desired flowability, curability, continuous molding operability, delamination resistance, and electrical reliability of the epoxy resin composition.
Preparation method
In another aspect, the present invention relates to a method of preparing an epoxy resin composition comprising the steps of:
the components are weighed and mixed in proportion to obtain premixed powder,
the premixed powder was melt kneaded and extruded by an extruder, cooled and pulverized to obtain a product.
The components should be added into the mixing equipment in a certain order during the mixing process. In one embodiment, the inorganic filler is added first, followed by the other components in sequence.
The mixing process should be carried out for a suitable time to thoroughly mix the components and to prevent excessive heat generation from the mixing which could lead to sticking between the epoxy resin composition and the equipment. In one embodiment, the high speed stirrer is used for a mixing time of 20-25 minutes and a circulating water cooling system is used to remove the heat generated by the mixing.
After the components are mixed to obtain a premixed powder, the premixed powder is melt-kneaded, and the temperature and humidity of the environment are controlled during the interval between the two steps to prevent excessive reaction between partial components. In one embodiment, after obtaining the pre-mixed powder, the pre-mixed powder is melt compounded and extruded through an extruder within 6 hours. Too long a separation can result in side reactions between some of the additives that cause the raw materials to agglomerate to form insoluble materials. In another embodiment, the pre-mixed powder enters the extruder while being fed through a feeder with stirring.
The kneading apparatus should be such that the epoxy resin composition is melted and kneaded uniformly while passing through the apparatus. In one embodiment, the compounding device is a twin screw extruder. The temperature of the mixing should be higher than the softening temperature of the epoxy resin and the phenolic resin, but the reaction rate and the reaction degree should be controlled within a certain range. In one embodiment, the temperature of the epoxy resin composition at the location of the extruder throat after melt compounding extrusion of the pre-blended powder through the extruder is from 90 to 125 ℃, preferably from about 105 to 120 ℃.
In one embodiment, the epoxy resin composition helps prevent sticking to equipment during comminution by passing through a cooling belt after extrusion.
The pulverizing process uses a pulverizer to pulverize. The crushed product should be controlled to a certain particle size and in one embodiment the epoxy resin composition is crushed and passed through a 12 mesh screen. In another embodiment, the crushed product is post-mixed using a post-mixer.
Use of epoxy resin composition
In yet another aspect, the present invention relates to the use of an epoxy resin composition for electronic component packaging. In one embodiment, the epoxy resin composition of the present invention is used for thin-back adhesive encapsulation of electronic components. In one embodiment, the thickness of the backsize is from about 0.35 to about 0.6mm, preferably from about 0.35 to about 0.45mm, for example about 0.4mm.
Performance of
Flow properties: the epoxy resin composition has proper flow property, so that the flow and exhaust of the upper die and the lower die reach balance when the product is packaged, and the packaged product is ensured to have enough filling property.
On the one hand, the flow properties can be characterized by the spiral flow length. The spiral flow length can be measured by a spiral flow measuring die under the conditions of 175 ℃ molding temperature, 70kg/cm 2 Injection molding pressure and 90 second cure time. In one embodiment, the epoxy resin composition of the present invention has a spiral flow length of 9 to 14 inches or 20 to 30 inches, preferably about 10 to 13 or 20 to 25 inches, for example about 13 inches, about 10 inches, about 24 inches.
On the other hand, the flow properties are characterized by the viscosity of the epoxy resin composition. The viscosity is measured by a capillary viscometer. The model of the viscometer is CFT-500D. Test conditions: 3g of the powder sample were made into small cakes of a certain diameter, a pressure of 20kg and a capillary temperature of 175 ℃. In one embodiment, the epoxy resin composition of the present invention has a viscosity of 85 to 150Pa.S or 20 to 45Pa.S, for example, about 40Pa.S, about 90Pa.S, about 110Pa.S.
Curing performance: the epoxy resin composition of the present invention has suitable curing properties so that the product is easily demolded after injection molding. The curing properties can be characterized by hot hardness. The epoxy resin composition was cured in the mold under conditions of a molding temperature of 175℃and a curing time of 90 seconds. The cured epoxy molding compound was measured using a shore durometer. In one embodiment, the epoxy resin composition of the present invention has a hot hardness of greater than 70, preferably greater than 78.
Air hole defect: and observing the air hole defect of the packaged product by using a microscope. The back adhesive thickness of the test product is 0.4mm. The judgment standard of no air hole is as follows: 320 samples were tested, with no holes greater than 0.5mm in diameter on both the back and front, and less than 3 holes no greater than 0.5mm per sample.
Delamination resistance: the epoxy resin composition of the present invention has excellent delamination resistance.
On the one hand, the epoxy resin composition has higher cohesive force, so that the epoxy resin composition has good delamination resistance. The adhesion was determined using a universal tester tensile test. The universal tester model used SHIMAZU TCE N300 with a draw rate of 3mm/s. The epoxy resin composition is packaged in an injection mold and wrapped on a copper sheet or nickel-plated copper sheet with a certain size, a cured sample is gradually pulled by applying tension on a clamp, and the tension value of the copper sheet when the nickel-plated copper sheet or looseness is recorded, namely the adhesion value. In one embodiment, the epoxy resin composition has a copper sheet adhesion of 300N or more, a nickel plated copper sheet adhesion of 80N or more, preferably 400N or more, and a nickel plated copper sheet adhesion of 150N or more.
Delamination resistance on the other hand can be characterized by the following method: the electronic component product encapsulated with the epoxy resin composition was post-cured at 175 ℃ for 6 hours, and the interface between the epoxy resin composition and the substrate in the device was observed using an ultrasonic scanner. The frame material is a copper frame with nickel plated pins. And detecting 320 samples, and judging that no layering exists if the number of samples with the delamination failure is 0.
Resistance to wash-out: impact linearity can be characterized by the following method: an electronic component product containing copper leads will be encapsulated with an epoxy resin composition, and the curvature of the copper leads is observed under X-ray. And detecting 40 samples, and judging that no line punching fails if the number of the samples with the copper lead bending radian exceeding 15% is 0.
Reliability of electrical performance: reliability of electrical performance can be verified by high temperature reverse bias test (HTRB, 150 ℃, vgs=80% spec,1000 hours). The electronic component product packaged by the epoxy resin composition is pre-treated by post-curing for 6 hours at 175 ℃, then subjected to a high-temperature reverse bias test, and after the completion of the test, the failure condition is tested by using an electrical testing device. And detecting 77 samples, and if no sample with electrical measurement failure exists, judging that the test passes the electrical performance reliability test.
Advantageous effects
The epoxy resin composition prepared by the invention has the advantages of strong universality, high thermal conductivity, high electrical insulation, low cost, high binding force, good slit wettability and the like; the epoxy resin composition prepared by the invention has the advantages of no air holes, no layering, no wire punching problem, good filling property, no mucosa after continuous molding and the like on the product packaged by the electronic components, and improves the yield of the finished product packaged by the fully-packaged electronic components. The epoxy resin composition prepared by the invention has wide application, is suitable for packaging various fully-encapsulated power electronic devices (such as TO220F, TO3PF, moudule and the like), and is particularly suitable for thin back adhesive packaging.
Examples
The following describes the aspects of the invention in further detail with reference to specific examples.
It should be noted that the following examples are only examples for clearly illustrating the technical solution of the present invention, and are not limiting. Other variations or modifications of the above description will be apparent to those of ordinary skill in the art, and it is not necessary or exhaustive of all embodiments, and obvious variations or modifications of the invention are intended to be within the scope of the invention. The instrumentation and reagent materials used herein are commercially available unless otherwise indicated.
Raw materials
O-cresol formaldehyde epoxy resin: the epoxy equivalent is 190g/eq, purchased from Taiwan vinca resin priority company, china;
dicyclopentadiene type epoxy resin: the epoxy equivalent was 250g/eq, purchased from Japanese ink chemical company.
Phenolic novolac resin: the hydroxyl equivalent was 105g/eq, available from Ming and Corp.
Curing accelerator imidazoles: purchased from SHIKOKU corporation;
curing accelerator organophosphines: triphenylphosphine compound or an adduct of triphenylphosphine compound and p-benzoquinone.
Silica: purchased from Jiangsu-associated New Material Co., ltd.
Coupling agent: available from Dow Corning.
And (3) a release agent: purchased from clariant chemical industry.
Ion scavenger: metal acid salts.
Zinc borate compound: purchased from the united states of america.
Aluminum hydroxide powder, available from japanese Ming and.
Coloring agent: carbon black, available from Orion corporation.
Preparation
As shown in Table 1, the raw materials of the respective components of the epoxy resin compositions in the examples and comparative examples of the present invention were precisely weighed. The raw materials are stirred for 20 minutes by a high-speed stirrer, and premixed powder is obtained after full mixing. The premixed powder was melt-extruded by passing through an extruder at a temperature of 110 to 120 ℃ and rapidly cooled, pulverized and post-mixed to obtain the epoxy resin compositions of examples and comparative examples.
And (3) packaging electronic components: the epoxy resin compositions of the examples and the comparative examples were used for packaging electronic components, and the back adhesive thickness of the packaged products was 0.4mm.
TABLE 1
TABLE 2
As shown in table 2, the electronic components packaged with the epoxy resin compositions of examples 1 to3 were free from voids, delamination failure, and wire punching problems, good in filling property, and reliable in electrical performance of the electronic components were examined. The sample of comparative example 1 used resin with too low a viscosity and had more void failure after encapsulation. The sample of comparative example 2 did not use a suitable coupling agent, and both the air holes and delamination detection after encapsulation performed poorly and had poor flushing. The sample of comparative example 3 did not use the proper resin type and the packaged product had delamination failure, poor line punching, and electrical performance reliability failure. The sample of comparative example 4 had too high a viscosity of the resin and the packaged product exhibited a number of poor line punching failures. The sample of comparative example 5 used a release agent having an excessively high acid value, failed in the entire delamination after encapsulation, and also had poor performance in the detection of pinholes. In comparative example 6, the molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups in the phenolic resin used was too high, and the packaged product had the defect of void failure.
It will be apparent to those skilled in the art that many modifications and variations of the present invention can be made without departing from its spirit and scope. The specific embodiments described herein are offered by way of example only and are not meant to be limiting in any way. The true scope and spirit of the invention is indicated by the following claims, which are exemplary only.
Claims (13)
1. An epoxy resin composition, wherein,
the epoxy resin composition comprises, based on the total weight of the epoxy resin composition:
(a) 7-14% by weight of an epoxy resin,
(b) 2 to 6% by weight of a phenolic resin,
(c) 0.15 to 0.6% by weight of a curing accelerator,
(d) 70-86% by weight of a filler,
optionally (e) 1-18% by weight of an additive; wherein,
the epoxy resin comprises dicyclopentadiene type epoxy resin, and the proportion of dicyclopentadiene type epoxy resin to epoxy resin is 0.3 to 1, preferably 0.4 to 0.8 by weight.
2. The epoxy resin composition according to claim 1, wherein,
the epoxy resin further comprises: a phenolic epoxy resin, a symmetrical biphenyl epoxy resin, or a combination thereof.
3. The epoxy resin composition according to claim 1 or 2, wherein,
the phenolic resin comprises: a phenolic novolac resin, a phenolic aralkyl phenolic resin, a dicyclopentadiene modified phenolic resin, or a combination thereof,
preferably, the phenolic resin is a phenolic novolac resin.
4. The epoxy resin composition according to any one of claim 1 to3, wherein,
the viscosity of the dicyclopentadiene type epoxy resin is 0.2-1 poise; and/or
The viscosity of the cresol formaldehyde epoxy resin is 0.9-6 poise; and/or
The viscosity of the symmetrical biphenyl type epoxy resin is 0.01-0.15 poise; and/or
The viscosity of the phenolic resin is 1.5-6.5 poise.
5. The epoxy resin composition according to any one of claim 1 to 4, wherein,
the molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups in the phenolic resin is 0.7-1.4, preferably 0.8-1.2.
6. The epoxy resin composition according to any one of claim 1 to 5, wherein,
the filler comprises, based on the total weight of the epoxy resin composition: 60-85% by weight of silica A, and 0-12% by weight of silica B;
wherein,
the D50 particle diameter of the silicon dioxide A is 14-25 mu m, and the proportion of the part of the silicon dioxide A with the particle diameter of 0-1 mu m in the silicon dioxide A is 12-20% by weight;
the D50 particle diameter of the silica B is 5-20 μm, and the proportion of the silica B, in which the particle diameter is 0-1 μm, is 10-20% by weight.
7. The epoxy resin composition according to claim 6, wherein,
the weight ratio of silica A to silica B is from 5 to 17, preferably from 7 to 8, by weight.
8. The epoxy resin composition according to claim 6 or 7, wherein,
the silicon dioxide A is crystalline silicon dioxide and the silicon dioxide B is fused spherical silicon dioxide, or
The silicon dioxide A and the silicon dioxide B are both crystalline silicon dioxide.
9. The epoxy resin composition according to any one of claim 1 to 8, wherein,
the curing accelerator is selected from the group consisting of: amine compounds, imidazole compounds, organic phosphine compounds and combinations thereof,
preferably, the curing accelerator is: imidazole compounds or combinations of imidazole compounds and organic phosphine compounds.
10. The epoxy resin composition according to any one of claim 1 to 9, wherein,
the epoxy resin composition further comprises, based on the total weight of the epoxy resin composition, optionally one or more additives selected from the following (e):
0.1-3 wt% of a release agent selected from the group consisting of: lipidated montan wax, acid wax, lipidated stearic acid wax, natural palm wax, polyethylene wax, amide wax, and combinations thereof;
0-13 wt% of a flame retardant selected from the group consisting of: aluminum hydroxide, zinc oxide, zinc borate, magnesium hydroxide, phosphine-containing compounds, organic amine flame retardants, and combinations thereof;
0.1-3 wt% of a coupling agent selected from the group consisting of: silane coupling agents, amine compounds, and combinations thereof;
0.05-3 wt% of an ion scavenger selected from the group consisting of: metal acid salts, hydrous oxides, and combinations thereof;
and 0.1 to 1 weight percent of a colorant which is carbon black; wherein,
the acid value of the release agent is 40 mgKOH/g or less.
11. The epoxy resin composition according to any one of claim 1 to 10, wherein,
the epoxy resin composition possesses one or more of the following properties:
(1) The helical flow length is 9-14 inches or 20-30 inches, preferably 10-13 or 20-25 inches.
(2) The viscosity is 20-45 or 85-150Pa.S.
(3) The hot hardness is greater than 70, preferably greater than 78.
(4) The adhesion to copper sheet is above 300N and the adhesion to nickel plating sheet is above 80N,
preferably, the method comprises the steps of,
the adhesion to copper sheet is above 400N and the adhesion to nickel plating sheet is above 150N.
12. A method of preparing the epoxy resin composition of any one of claims 1-11, comprising the steps of:
the components are weighed and mixed in proportion to obtain premixed powder,
the premixed powder is melted, mixed and extruded by an extruder, cooled and crushed to obtain a product;
preferably, the method comprises the steps of,
after the premixed powder is obtained, the powder is melted, mixed and extruded by the extruder within 6 hours; and/or
In the process of melt mixing extrusion through the extruder, the temperature of the epoxy resin composition at the position of a feed opening of the extruder is 90-125 ℃.
13. Use of the epoxy resin composition according to any one of claims 1 to 11 for electronic component packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210767084.6A CN117362923A (en) | 2022-06-30 | 2022-06-30 | Epoxy resin composition for full encapsulation and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210767084.6A CN117362923A (en) | 2022-06-30 | 2022-06-30 | Epoxy resin composition for full encapsulation and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117362923A true CN117362923A (en) | 2024-01-09 |
Family
ID=89391575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210767084.6A Pending CN117362923A (en) | 2022-06-30 | 2022-06-30 | Epoxy resin composition for full encapsulation and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117362923A (en) |
-
2022
- 2022-06-30 CN CN202210767084.6A patent/CN117362923A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI527854B (en) | Epoxy resin composition and semiconductor device | |
| JP3033445B2 (en) | Inorganic filler for resin and epoxy resin composition | |
| EP1582546B1 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| JPH05148411A (en) | Thermosetting resin composition and semiconductor device | |
| JP2768088B2 (en) | Thermosetting resin composition and semiconductor device | |
| JP5053930B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| CN117362923A (en) | Epoxy resin composition for full encapsulation and preparation method thereof | |
| JP4760785B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| JP3102276B2 (en) | Method for producing epoxy resin composition and epoxy resin composition for semiconductor encapsulation | |
| JP4627208B2 (en) | Pre-kneading composition, epoxy resin composition for semiconductor encapsulation, and semiconductor device | |
| JPH09202850A (en) | Epoxy resin composition for sealing use, semiconductor device using the same, and production of the composition | |
| JP4172065B2 (en) | Epoxy resin composition and electronic component device | |
| JP4032514B2 (en) | Epoxy resin composition and electronic component device | |
| JP2002012654A (en) | Epoxy resin composition for sealing semiconductor | |
| JPH09202851A (en) | Epoxy resin composition for sealing use, semiconductor device using the same, and production of the composition | |
| CN112980137B (en) | Epoxy molding compound and preparation method and application thereof | |
| JP2003327792A (en) | Sealing resin composition and sealed semiconductor device | |
| CN114685935B (en) | Low dielectric constant resin composition and preparation method and application thereof | |
| JP5442929B2 (en) | Epoxy resin composition for sealing and semiconductor device using the same | |
| KR102643484B1 (en) | Granule type resin composition for encapsulating a semiconductor device | |
| JP2006036974A (en) | Epoxy resin composition for sealing semiconductor and semiconductor device by using the same | |
| US7683138B1 (en) | Molding compositions | |
| JP3611002B2 (en) | Epoxy resin composition, method for producing the same, and semiconductor device | |
| JP3309688B2 (en) | Method for producing epoxy resin composition | |
| KR100479853B1 (en) | Method for preparing epoxy resin composition for semiconductor encapsulant and the composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |