CN1173416A - Method for increasing strength of ceramic and metal soldered joint - Google Patents
Method for increasing strength of ceramic and metal soldered joint Download PDFInfo
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- CN1173416A CN1173416A CN 97108649 CN97108649A CN1173416A CN 1173416 A CN1173416 A CN 1173416A CN 97108649 CN97108649 CN 97108649 CN 97108649 A CN97108649 A CN 97108649A CN 1173416 A CN1173416 A CN 1173416A
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Abstract
A method for inereasing the strength and antishock power of soldered interface between ceramic and metal features that a layer of Mo metal net s added to soldered interface between ceramic and metal to divide th soldering material into lattices, which changes the big-area solidifying shrink into small-area one. The reverse stresses between adjacent lattices are cancelled on each other, so greatly decreasing residual stress on whole interface. Its strength can be increased by 50%. After thermal shock at 700 deg. C its residual strength is increased by 130-180%.
Description
The present invention relates to a kind of method that improves ceramic/metal jointing intensity.
Pottery is key technology in the present high-tech sector with being connected of metal, all has broad application prospects in key areas such as space flight and aviation, atomic energy, electric power, chemical industry, electronics, electrovacuum, machinery, military affairs.But because the coefficient of expansion between the two differs greatly, and the contraction of solder when solidifying, cause residual stress very big on the combination interface after the welding, the harm of this residual stress is very serious, the intensity of often making on the joint interface reduces greatly, even generation macroscopic cracking and fracture in pottery, and increase along with the composition surface size, adding up of residual stress also increases thereupon, this just becomes one of difficult point of foreign material large tracts of land welding, also be that pottery is connected the practicability of marching toward with metal as structural member, one of industrialized biggest obstacle.Relevant both at home and abroad at present reduction out-phase interface soldering residual stress has following research method:
1. select for use the close material of the coefficient of expansion to link, this is subjected to using the restriction that needs.
2. between joint face, add one or more layers coefficient of expansion sheet metal of transition gradually, form the gradient type compound interface, this method still is subjected to the restriction of material, whenever adds one deck intermediate plate simultaneously and need add the two sides solder, complex process, the negative effect that brings thus increases thereupon.
3. between faying face, add one deck soft alloy sheet, alleviate residual stress by the plastic deformation of soft alloy, but this method can not satisfy the requirement to the requirement of strength and the serviceability temperature on composition surface, is very limited.
4. low temperature brazing.Carry out soldering with low-temperature brazing filler metal or low temperature process, this is subjected to the very big restriction of instructions for use equally.
Therefore, reduce the residual stress of foreign material junction effectively, improve bonding strength and have great application value and theoretical value.
The objective of the invention is to propose a kind of method that improves strength of ceramic and metal soldered joint, can reduce the residual stress between pottery and solder bonding metal interface, the phenomenon (dimensional effect) of the intensity reduction that improves bond strength, the thermal shock drag at soldering interface and reduce to cause because of the increase of faying face size, it is simple, efficient to have method, does not influence the characteristics to the requirement of connecting piece serviceability.
Feature of the present invention is to add layer of metal net and single face solder between pottery and metal solder face.Fig. 1 is the welding assembly schematic diagram that adds wire netting between pottery and the metal, wherein 1 is welded metal, the 2nd, and wire netting, the 3rd, soldering, the 4th, pottery.Fig. 2 is when not adding wire netting, and the soldering interface is residual stress distribution and big or small schematic diagram in a ceramic side.Wherein on behalf of residual-stress value, ordinate represent with 6.Abscissa is an interface location.Fig. 3 is after adding wire netting, distribution and the big logotype of interface residual stress in a ceramic side.Wherein a, b, c are the boundary positions of adjacent two mesh.The ordinate of this figure is represented residual-stress value, represents with 6.Abscissa is represented the mesh position.
(1) fusing point of wire netting will be higher than the fusing point of solder.As Mo, W etc.;
(2) mesh wire diameter is 0.1 millimeter～0.18 millimeter;
(3) solder should be placed on a nearly ceramic side, and wire netting is placed on nearly metal one side.
(4) apply the pressure of 0.05MPa on the sample that assembles, put into vacuum drying oven then and carry out soldering, specific requirement is as follows:
With reference to Fig. 2, when brazing metal and pottery, if do not add the layer of metal net, then whole solder side is because the overall shrinkage of solder when solidifying then produces very big tension in the edge of faying face.Along with the increase of weld size, the residual stress at the interface edge place also increases thereupon.
With reference to Fig. 3, when after adding the layer of metal net between pottery and the metal interface, wire netting just plays the effect of solid phase skeleton, and the soldering of melting is divided into n little melting zone.After soldering is finished, solder is when solidifying, just become the independent solidification shrinkage in many little melting zones by the large tracts of land overall shrinkage of screening not, because adjacent little melting zone solidification shrinkage direction is opposite, thereby between adjacent mesh, produced reverse tension, thereby produced the effect that shrinkage stress disappears mutually.Simultaneously, because the adding of wire netting, actual solidification zone is cut apart, refinement, so the residual tension amplitude on each border, little melting zone also diminishes.Stress between adjoining cells just reduces on whole faying face after stack greatly.
(1) material is prepared and welding procedure
Pottery is 99%Al with purity
2O
3Powder adds 1% MgO and burns till at 1760 ℃.The purity of Nb is greater than 99%.Solder is Ni51Ti49 (atomic ratio).Before the welding, pottery all polishes through sand paper step by step with metal bond portion.Compound mode is identical with Fig. 1, and solder finally is milled to the thin slice of about 0.3mm through repeat-rolling and annealing.
The sample that combines is put into vacuum drying oven carry out soldering, vacuum is 2～3 * 10
-3Pa, welding temperature is 1270 ℃～1330 ℃, temperature retention time 20min, sample cools to room temperature with the furnace.
Wire netting makes with Mo silk interlacing, and the Mo filament diameter is 0.1～0.18mm, and average mesh area is about 0.64mm
2
(2) performance test:
The i all samples is made the testing shear performance of faying face
The ii thermal shock test is respectively at 250 ℃, and 400 ℃, 550 ℃, 700 ℃ of heating all are incubated 15min, in 20 ℃ the water quenched then.
Iii dimensional effect test faying face diameter D=5mm～13mm.
(3) result of the test
I Al
2O
3The as deposited strength of/Ni-Ti (adding metal M o net)/Nb has improved more than 50%.
The antidetonation drag of ii screening all is higher than the thermal shock drag of screening not and along with the rising of thermal shock temperature, intensity difference is just big more.Improved more than 180% as 700 ℃ of antidetonation drags.
Behind the iii dimensional effect screening, along with the increase of faying face size, it is very little that the reduction of intensity becomes, and screening person not, along with the increase intensity of faying face size descends rapidly.During as solder side diameter D=13mm, the weld strength of screening has improved more than 100%.
(1) material is prepared and technology
The composition of Cu-Ni-Ti: Cu:52.6wt%, Ni:22.5wt%, Ti:24.9wt%
Melted Cu-Ni-Ti soldering ingot is cut into the thin slice of 0.4mm with wire cutting method, be milled to 0.3mm (or be applied to ceramic welding surface with the Cu-Ni-Ti powder) then, apply the external pressure of 0.05MPa on the sample that assembles, put into vacuum drying oven then and carry out soldering, vacuum is 2～3 * 10
-3Pa, welding temperature is 1200 ℃, temperature retention time 20min welds the back sample and cools to room temperature with the furnace.Metal M o net should be placed on nearly metal one side, and soldering is placed on a nearly ceramic side, and the Mo filament diameter is 0.12mm, and the mesh average area is 0.64mm
2
(2) performance test
I packs the sample that welds among the shearing die, makes the shear strength of faying face, contrast postwelding shear strength.
Ii antidetonation drag is respectively at 250 ℃, and 400 ℃, 550 ℃, 700 ℃ of heating, insulation 15min in 20 ℃ the water quenched then, makes shear strength test then.
The cutting performance of faying face diameter D=3mm～12mm various sample is made in the test of iii dimensional effect respectively.
(3) result of the test
I Al
2O
3The as deposited strength of/Cu-Ni-Ti (adding metal M o net)/Nb has improved 60%.
Ii antidetonation drag (400 ℃～700 ℃, hardening) has improved 50～130%.
Iii is when faying face dimension D=7mm, and strength of joint has improved more than 100%.
Claims (4)
1. improve the method for strength of ceramic and metal soldered joint, it is characterized in that, between pottery and metal solder, add one deck refractory metal net and single face solder, put it in the vacuum drying oven then and weld.
2. method according to claim 1 is characterized in that, said wire netting is placed on nearly metal one side, and the opposite side of wire netting is placed solder.
3. according to claim 1,2 described methods, it is characterized in that the fusing point of said wire netting will be higher than solder, its mesh wire diameter is 0.1 millimeter～0.18 millimeter.
4. according to claim 1,2 described methods, it is characterized in that the ceramic/metal assembly of said adding wire netting can apply the pressure about 0.05MPa when putting into vacuum drying oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97108649A CN1061283C (en) | 1997-09-10 | 1997-09-10 | Method for increasing strength of ceramic and metal soldered joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97108649A CN1061283C (en) | 1997-09-10 | 1997-09-10 | Method for increasing strength of ceramic and metal soldered joint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1173416A true CN1173416A (en) | 1998-02-18 |
| CN1061283C CN1061283C (en) | 2001-01-31 |
Family
ID=5170586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97108649A Expired - Fee Related CN1061283C (en) | 1997-09-10 | 1997-09-10 | Method for increasing strength of ceramic and metal soldered joint |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1061283C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672357A (en) * | 2011-02-22 | 2012-09-19 | 通用电气公司 | Constrained metal flanges and methods for making the same |
| CN104853873A (en) * | 2012-12-18 | 2015-08-19 | 陶瓷技术有限责任公司 | Method for pre-soldering metal surfaces onto metallised substrates using metallic gauze, metallised substrates with solder layer which has superficial structure of gauze |
| CN105036784A (en) * | 2015-09-16 | 2015-11-11 | 成都凯赛尔电子有限公司 | Method for reducing sealing stress |
| CN105537793A (en) * | 2016-01-15 | 2016-05-04 | 东南大学 | Soldering lug for welding power module |
| CN106410107A (en) * | 2016-11-29 | 2017-02-15 | 深圳市长盈精密技术股份有限公司 | Power battery cover plate and battery polar post assembly thereof |
| CN108788517A (en) * | 2018-07-05 | 2018-11-13 | 四川广正科技有限公司 | A kind of low-cost and high-performance solder and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS512653A (en) * | 1974-06-25 | 1976-01-10 | Nippon Sheet Glass Co Ltd | YOGYOTAITOKINZOKUTAITONO HANDAZUKEHOHO |
| US4353369A (en) * | 1980-01-17 | 1982-10-12 | Abbott Laboratories | Venipuncture device |
| JPS61215271A (en) * | 1985-03-15 | 1986-09-25 | 株式会社 豪勇 | Method of bonding ceramic and metal |
-
1997
- 1997-09-10 CN CN97108649A patent/CN1061283C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672357A (en) * | 2011-02-22 | 2012-09-19 | 通用电气公司 | Constrained metal flanges and methods for making the same |
| CN102672357B (en) * | 2011-02-22 | 2016-04-20 | 通用电气公司 | Affined metal rim and manufacture method thereof |
| CN104853873A (en) * | 2012-12-18 | 2015-08-19 | 陶瓷技术有限责任公司 | Method for pre-soldering metal surfaces onto metallised substrates using metallic gauze, metallised substrates with solder layer which has superficial structure of gauze |
| CN105036784A (en) * | 2015-09-16 | 2015-11-11 | 成都凯赛尔电子有限公司 | Method for reducing sealing stress |
| CN105036784B (en) * | 2015-09-16 | 2017-09-26 | 成都凯赛尔电子有限公司 | A kind of method for reducing stress of sealing |
| CN105537793A (en) * | 2016-01-15 | 2016-05-04 | 东南大学 | Soldering lug for welding power module |
| CN106410107A (en) * | 2016-11-29 | 2017-02-15 | 深圳市长盈精密技术股份有限公司 | Power battery cover plate and battery polar post assembly thereof |
| CN108788517A (en) * | 2018-07-05 | 2018-11-13 | 四川广正科技有限公司 | A kind of low-cost and high-performance solder and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1061283C (en) | 2001-01-31 |
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