CN117324712B - Soldering equipment for electronic components of computer main board - Google Patents
Soldering equipment for electronic components of computer main board Download PDFInfo
- Publication number
- CN117324712B CN117324712B CN202311488312.7A CN202311488312A CN117324712B CN 117324712 B CN117324712 B CN 117324712B CN 202311488312 A CN202311488312 A CN 202311488312A CN 117324712 B CN117324712 B CN 117324712B
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- Prior art keywords
- sliding
- soldering
- liquid storage
- storage bin
- liquid
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- 238000005476 soldering Methods 0.000 title claims abstract description 57
- 239000007788 liquid Substances 0.000 claims abstract description 128
- 238000003466 welding Methods 0.000 claims abstract description 40
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 238000003860 storage Methods 0.000 claims description 69
- 230000007246 mechanism Effects 0.000 claims description 61
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 21
- 230000001105 regulatory effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000151 deposition Methods 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering device for electronic components of a computer main board, which relates to the technical field of soldering and comprises a soldering machine, wherein a gun head is arranged on the soldering machine, a liquid bin is also arranged on the soldering machine, a conveying pipe is also arranged on the gun head, when the soldering device is in a spot welding state, a passage formed by size difference between a fixed flow plate and a sliding plate can meet consumption of soldering liquid, so that the sliding plate cannot slide due to excessively rapid consumption of the soldering liquid, when the soldering device is in a continuous soldering state, the consumption rate of the soldering liquid can be accelerated, the sliding plate can flow towards a direction close to the gun head, further a sealing block originally inserted into the sliding plate is separated from the sliding plate due to sliding of the sliding plate, the sliding plate originally in a closed state is changed into an unblocked state, the replenishment rate of the soldering liquid is accelerated, and meanwhile, because the sealing blocks are provided with a plurality of sealing blocks, the lengths of the sealing blocks are different, the number of the opening of the sliding plate is in an incremental state instead of directly entering the maximum flow, and the device can be adjusted automatically through the design.
Description
Technical Field
The invention relates to the technical field of soldering, in particular to a soldering device for electronic components of a computer motherboard.
Background
The soldering machine is a mechanical device, is provided with a large-size transparent window, can observe the whole welding process, has very important effect on product research and development and process curve optimization, adopts a high-precision intuitive intelligent controller for temperature control, can realize programmable perfect curve control, has accurate temperature control, and is simple and convenient in parameter setting and easy to operate. And single-sided and double-sided PCB welding of all packaging forms such as CHIP, SOP, PLCC, QFP, BGA can be completed. The work efficiency is extremely high, a welding machine is added with a silk screen printing table and two workers, nearly 100 PCB boards with the largest size can be completed in one day, and the small size can reach thousands of PCB boards. The soldering machine changes the way that the soldering machine can only cool by means of natural cooling or pulling out the PCB outside the soldering machine, so that the reflow soldering process curve is more perfect, and the problems of damage and soldering displacement of surface mount devices are avoided.
In general, soldering is divided into a spot welding process and a continuous welding process, and is used for welding points in different forms, while the existing welding machine can basically meet the requirements of two different welding processes by one machine, in order to meet the high standard requirements of welding precision and welding quality when facing the welding operation of electronic components of a computer main board, a tin welding rod is used in the processing process, and a tin welding liquid is generally used as an auxiliary welding agent so as to improve the welding effect.
Because the design of the existing computer main board is more complex, the use requirements of various welding processes exist on one main board, but the use rates of welding liquid by two different welding processes are different, so that the equipment always adopts a lower standard conveying rate when in operation so as to prevent the welding liquid from being deposited in the conveying equipment, but when the welding processes are switched, the conveying mode always forms a vacuum area with a certain volume in the conveying equipment, thereby leading the liquid spraying gun head to have the phenomenon of air spraying when spraying liquid, further reducing the welding quality and influencing the yield of products.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides the gun head provided with the additional liquid storage bin and the self-adaptive regulating and controlling equipment arranged in the liquid storage bin, so that when a welding mode is switched, self-adaptive material supplementing can be realized, the problem that the welding liquid is deposited in the conveying equipment by adopting a lower standard conveying rate in the prior art is solved, but when the welding process is switched, a certain volume of vacuum area is formed in the conveying equipment by adopting the conveying mode, so that the phenomenon of air spraying of the liquid spraying gun head is caused when liquid spraying is carried out, the welding quality is further reduced, and the yield of products is influenced.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the soldering equipment for the electronic components of the computer main board comprises a tin welding machine, wherein a gun head is arranged on the tin welding machine, a liquid bin is further arranged on the tin welding machine, a conveying pipe is further arranged on the gun head, the gun head is communicated with the liquid bin through the conveying pipe, a liquid storage bin is arranged on the conveying pipe, a regulating mechanism is arranged in the liquid storage bin, and the regulating mechanism is used for regulating the flow rate of tin soldering liquid;
The regulating mechanism comprises a constant flow plate arranged in the liquid storage bin, a sliding plate is further arranged in the liquid storage bin in a sliding mode, a flow hole is formed in the constant flow plate, and a sealing block matched with the flow hole is arranged on the sliding plate.
Preferably, the sliding plate is provided with a plurality of sealing blocks, the lengths of the sealing blocks are different, and the diameters of the sealing blocks gradually decrease from one side to the other side.
Preferably, a sliding mechanism is further arranged in the liquid storage bin, and the sliding plate is slidably arranged in the liquid storage bin through the sliding mechanism;
the sliding mechanism comprises a sliding groove arranged on the liquid storage bin, a sliding block matched with the sliding groove is arranged on the sliding plate, and the sliding block is arranged in the sliding groove in a sliding manner.
Preferably, the sliding block is further provided with an auxiliary mechanism, and the auxiliary mechanism is used for limiting the sliding block;
the auxiliary mechanism comprises a positioning through hole formed in the sliding block, a positioning rod which is mutually matched with the positioning through hole is arranged in the sliding groove, and the sliding block is arranged on the positioning rod in a sliding manner through the positioning through hole.
Preferably, the sliding block is further provided with a trapezoid block, and the trapezoid block is used for picking materials.
Preferably, the liquid storage bin is further provided with a circulation mechanism, and the circulation mechanism is used for liquid circulation;
The circulation mechanism comprises a main body bin arranged on the liquid storage bin, a first circulation pipe is arranged on one side of the main body bin, a second circulation pipe is arranged on the other side of the main body bin, and the main body bin is communicated with the liquid storage bin through the first circulation pipe and the second circulation pipe respectively.
Preferably, a one-way valve is further arranged in the second flow pipe, and the one-way valve prevents backflow.
Preferably, the liquid storage bin is further provided with a positioning block, and the main body bin is slidably arranged on the liquid storage bin through the positioning block
Preferably, the liquid storage bin is further provided with two groups of adjusting mechanisms, and the two positioning blocks are respectively arranged on the two adjusting mechanisms;
The adjusting mechanism comprises an adjusting groove arranged on the liquid storage bin, an adjusting block is slidably arranged in the adjusting groove, and the positioning block is arranged on the adjusting block.
(III) beneficial effects
1. The invention provides a soldering device for electronic components of a computer motherboard, which has the following beneficial effects: when the soldering equipment is in the spot welding state, the consumption of the soldering liquid can be met by the passageway formed by the size difference between the constant flow plate and the sliding plate, so that the sliding plate cannot slide due to the fact that the consumption of the soldering liquid is too fast, when the soldering equipment is in the continuous welding state, the consumption rate of the soldering liquid is accelerated, the sliding plate can flow in the direction close to the gun head, then the sealing block originally inserted into the sliding plate is separated from the sliding plate due to the fact that the sliding of the sliding plate is separated from the sliding plate, the sliding plate originally in the closed state is changed into the unblocked state, the supplementing rate of the soldering liquid is accelerated, meanwhile, the sealing blocks are provided with a plurality of sealing blocks, the lengths of the sealing blocks are different, and therefore the number of the opening of the sliding plate is also in an increasing state instead of directly entering the maximum flow, and therefore the flow adjustment can be automatically carried out through the design, and the adaptability of the device is improved.
2. The invention provides a soldering device for electronic components of a computer motherboard, which has the following beneficial effects: through setting up circulation mechanism, can be when the sliding plate slides to the top of depositing the liquid storehouse, in with unnecessary liquid extrusion circulation mechanism, thereby avoid when the sliding plate slides to depositing liquid storehouse top, result in depositing unnecessary liquid in the liquid storehouse and enter into in carrying, thereby cause carrying and born inside and outside inconsistent pressure simultaneously, and then lead to carrying and take place to damage, simultaneously because the bellows-like design that main part storehouse adopted, can extend, thereby let the main part storehouse can save more liquid, and can be through the mode of manual pressing, let the main part storehouse resume, and then carry back to in the liquid storehouse with the unnecessary tin soldering fluid of its inside storage again.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional view of the present invention.
Fig. 2 is a schematic side view of the overall structure of the present invention.
Fig. 3 is a schematic view of the liquid storage bin and the conveying pipe storage place in three-dimensional view.
Fig. 4 is a schematic side view of the liquid storage bin and the delivery pipe storage of the present invention.
Fig. 5 is a schematic cross-sectional view at A-A in fig. 4.
Fig. 6 is a partial enlarged view at a in fig. 5.
Fig. 7 is a schematic front view of the liquid storage bin and the delivery pipe storage place of the present invention.
Fig. 8 is a schematic cross-sectional view at B-B in fig. 7.
In the figure: 1. a tin welder; 2. a gun head; 3. a liquid storage bin; 4. a delivery tube; 5. a liquid storage bin; 6. a regulating mechanism; 61. a constant flow plate; 62. a sliding plate; 63. a flow hole; 64. a sealing block; 7. a sliding mechanism; 71. a sliding groove; 72. a sliding block; 8. an auxiliary mechanism; 81. positioning the through hole; 82. a positioning rod; 9. a trapezoid block; 10. a circulation mechanism; 101. a main body bin; 102. a first flow tube; 103. a second flow tube; 11. a one-way valve; 12. a positioning block; 13. an adjusting mechanism; 131. an adjustment tank; 132. and an adjusting block.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present invention are within the scope of protection of the present invention.
Example 1
Referring to fig. 1-8, a soldering device for electronic components of a computer motherboard includes a soldering machine 1, a gun head 2 is disposed on the soldering machine 1, the gun head 2 is used for conveying solder liquid, a liquid bin 3 is also disposed on the soldering machine 1, the liquid bin 3 is used for storing a certain amount of solder liquid to supplement the solder liquid, a conveying pipe 4 is also disposed on the gun head 2, the conveying pipe 4 is responsible for communicating the gun head 2 with the liquid bin 3, so that the solder liquid stored in the liquid bin 3 can be conveyed into the gun head 2 through the conveying pipe 4 for use, a liquid storage bin 5 is disposed on the conveying pipe 4, the liquid storage bin 5 is interposed between the conveying pipe 4 and the gun head 2, the liquid storage bin 5 is respectively communicated with the conveying pipe 4 and the gun head 2, a regulating mechanism 6 is disposed in the liquid storage bin 5, and the regulating mechanism 6 is used for regulating the flow rate of the solder liquid;
The regulating mechanism 6 comprises a constant flow plate 61 arranged in the liquid storage bin 5, a sliding plate 62 is also arranged in the liquid storage bin 5 in a sliding manner, the constant flow plate 61 is arranged on one side, close to the conveying pipe 4, of the liquid storage bin 5, the sliding plate 62 is arranged on one side, close to the gun head 2, of the liquid storage bin 5, meanwhile, the length of the sliding plate 62 is smaller than that of the constant flow plate 61, a normal flow channel is formed on the constant flow plate 61, the flow channel is not closed in a normal state due to the size difference between the constant flow plate 61 and the sliding plate 62, a normal flow channel is formed in the liquid storage bin 5 through the cooperation of the normal flow channel and the size gap, so that soldering liquid normally flows in the liquid storage bin 5, the sealing block 64 is prevented from forming a blockage, a plurality of flow holes 63 are formed in the constant flow plate 61, the soldering liquid can flow through a plurality of flow holes 63 formed in the constant flow plate 61, so that the conveying speed is increased, a sealing block 64 matched with the flow holes 63 is arranged on the sliding plate 61, and the flow holes 63 can seal the sealing block 64 so that the conveying speed of soldering liquid is reduced;
Through the above design, when the soldering apparatus is in the spot welding state, the passage formed by the size difference between the constant flow plate 61 and the sliding plate 62 can meet the consumption of the soldering liquid, so that the sliding plate 62 cannot slide due to the excessively fast consumption of the soldering liquid, and when the soldering apparatus is in the continuous welding state, the consumption rate of the soldering liquid is accelerated, so that the sliding plate 62 can flow in the direction close to the gun head 2, and further the sealing block 64 originally inserted in the circulation hole 63 is separated from the circulation hole 63 due to the sliding of the sliding plate 62, so that the circulation hole 63 originally in the closed state is changed into the unblocked state, and the replenishment rate of the soldering liquid is accelerated.
The plurality of seal blocks 64 are provided on the sliding plate 62, and the plurality of seal blocks 64 are different in length, and the diameters of the plurality of seal blocks 64 gradually decrease from one side to the other side.
In this embodiment: the regulation and control mechanism 6 is arranged in the liquid storage bin 5, so that the tin soldering liquid can be self-adaptively supplemented in the welding modes of facing spot welding and continuous welding, the vacuum period generated in the tin soldering liquid conveying process due to switching of the two tin soldering modes in the welding process is avoided, and the tin soldering liquid conveying interruption is caused.
Meanwhile, since the sealing blocks 64 are provided in plurality and the lengths of the sealing blocks 64 are different, the number of the opened flow holes 63 is in an increasing state instead of directly entering the maximum flow, so that the flow adjustment can be automatically performed through the design, and the adaptability of the device is improved.
Example 2
Referring to fig. 1 to 8, the following details are shown: a sliding mechanism 7 is further arranged in the liquid storage bin 5, and a sliding plate 62 is slidably arranged in the liquid storage bin 5 through the sliding mechanism 7;
The sliding mechanism 7 comprises a sliding groove 71 formed in the liquid storage bin 5, a sliding block 72 matched with the sliding groove 71 is arranged on the sliding plate 62, and the sliding block 72 is arranged in the sliding groove 71 in a sliding mode.
The sliding block 72 is also provided with an auxiliary mechanism 8, and the auxiliary mechanism 8 is used for limiting the sliding block 72;
The auxiliary mechanism 8 comprises a positioning through hole 81 formed in the sliding block 72, a positioning rod 82 mutually matched with the positioning through hole 81 is arranged in the sliding groove 71, and the sliding block 72 is slidably arranged on the positioning rod 82 through the positioning through hole 81.
The sliding block 72 is also provided with a trapezoid block 9, and the trapezoid block 9 is used for picking materials.
In this embodiment: by arranging the sliding mechanism 7, the sliding plate 62 can slide adaptively according to the liquid flow change and the liquid volume change in the liquid storage bin 5, the sliding block 72 slides in the sliding groove 71 more stably by the aid of the arranged auxiliary mechanism 8, and the trapezoid block 9 arranged on the sliding block 72 can prevent solder liquid from adhering to the positioning rod 82, so that the sliding of the sliding block 72 is hindered.
Example 3
Referring to fig. 1 to 8, the following details are shown: in order to prevent the tin solder in the original liquid storage bin 5 from being propped into the conveying pipe 4 to cause backflow when the sliding plate 62 slides towards the direction approaching the constant flow plate 61, the liquid storage bin 5 is further provided with a circulation mechanism 10, and the circulation mechanism 10 is used for liquid circulation, so that the liquid enters the circulation mechanism 10 instead of flowing back into the conveying pipe 4;
The circulation mechanism 10 comprises a main body bin 101 arranged on the liquid storage bin 5, the main body bin 101 is of a corrugated pipe structure and can stretch and retract, a first circulation pipe 102 is arranged on one side of the main body bin 101, a second circulation pipe 103 is arranged on the other side of the main body bin 101, the second circulation pipe 103 is located in an area, close to the conveying pipe 4, on the liquid storage bin 5, of the liquid storage bin 5, the first circulation pipe 102 is located in an area, close to the gun head 2, of the liquid storage bin 5, and the main body bin 101 is communicated with the liquid storage bin 5 through the first circulation pipe 102 and the second circulation pipe 103 respectively, so that redundant soldering liquid can enter the main body bin 101 through the first circulation pipe 102, and then the second circulation pipe 103 reenters the liquid storage bin 5, so that waste is avoided.
Meanwhile, a one-way valve 11 is further arranged in the second flow pipe 103, and the one-way valve 11 is used for preventing the molten tin from flowing into the main body bin 101 from the second flow pipe 103 when the molten tin slides up and down on the sliding plate 62.
In this embodiment: through setting up circulation mechanism 10, can be when sliding plate 62 slides to the top of depositing liquid storehouse 5, in circulation mechanism 10 is crowded with unnecessary liquid, thereby avoid when sliding plate 62 slides to depositing liquid storehouse 5 top, result in depositing unnecessary liquid in liquid storehouse 5 to enter into in carrying 4, thereby cause carrying 4 to bear inside and outside inconsistent pressure simultaneously, and then lead to carrying 4 to take place to damage, simultaneously because the bellows-like design that main part storehouse 101 adopted, can extend, thereby let main part storehouse 101 can store more liquid, and can recover through the mode of manual pressing, and then carry back into in the liquid storehouse 5 with the unnecessary tin solder of its inside storage again.
Example 4
Referring to fig. 1 to 8, the following details are shown: the liquid storage bin 5 is also provided with a positioning block 12, and the main body bin 101 is slidably arranged on the liquid storage bin 5 through the positioning block 12.
The liquid storage bin 5 is also provided with an adjusting mechanism 13, the adjusting mechanism 13 is provided with two groups, and the two positioning blocks 12 are respectively arranged on the two adjusting mechanisms 13;
The adjusting mechanism 13 comprises an adjusting groove 131 formed in the liquid storage bin 5, an adjusting block 132 is slidably arranged in the adjusting groove 131, and the positioning block 12 is arranged on the adjusting block 132.
In this embodiment: because the main body bin 101 can expand, in order to adapt to the modeling change of the main body bin 101, the positioning blocks 12 capable of sliding are arranged on the liquid storage bin 5, the two positioning blocks 12 are symmetrical to each other, and the two positioning blocks 12 are respectively arranged on the liquid storage bin 5 in a sliding manner through the two adjusting mechanisms 13, so that the main body bin 101 is fixed and simultaneously the modeling change of the main body bin 101 can be adapted.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a computer motherboard electronic component's tin soldering equipment, includes tin welding machine (1), be provided with rifle head (2) on tin welding machine (1), still be provided with liquid feed bin (3) on tin welding machine (1), still be provided with conveyer pipe (4) on rifle head (2), rifle head (2) are passed through conveyer pipe (4) with liquid feed bin (3) communicate, its characterized in that: a liquid storage bin (5) is arranged on the conveying pipe (4), a regulating mechanism (6) is arranged in the liquid storage bin (5), and the regulating mechanism (6) is used for regulating the flow rate of the tin soldering liquid;
the regulating mechanism (6) comprises a constant flow plate (61) arranged in the liquid storage bin (5), a sliding plate (62) is also arranged in the liquid storage bin (5) in a sliding manner, a flow hole (63) is formed in the constant flow plate (61), and a sealing block (64) which is mutually matched with the flow hole (63) is arranged on the sliding plate (62);
The sliding plate (62) is provided with a plurality of sealing blocks (64), the lengths of the plurality of sealing blocks (64) are different, and the diameters of the plurality of sealing blocks (64) gradually decrease from one side to the other side;
a sliding mechanism (7) is further arranged in the liquid storage bin (5), and the sliding plate (62) is arranged in the liquid storage bin (5) in a sliding manner through the sliding mechanism (7);
the sliding mechanism (7) comprises a sliding groove (71) formed in the liquid storage bin (5), a sliding block (72) mutually matched with the sliding groove (71) is arranged on the sliding plate (62), and the sliding block (72) is arranged in the sliding groove (71) in a sliding manner;
An auxiliary mechanism (8) is further arranged on the sliding block (72), and the auxiliary mechanism (8) is used for limiting the sliding block (72);
The auxiliary mechanism (8) comprises a positioning through hole (81) formed in the sliding block (72), a positioning rod (82) mutually matched with the positioning through hole (81) is arranged in the sliding groove (71), and the sliding block (72) is arranged on the positioning rod (82) in a sliding manner through the positioning through hole (81);
a trapezoid block (9) is further arranged on the sliding block (72), and the trapezoid block (9) is used for picking materials;
The liquid storage bin (5) is also provided with a circulation mechanism (10), and the circulation mechanism (10) is used for liquid circulation;
The circulation mechanism (10) comprises a main body bin (101) arranged on the liquid storage bin (5), a first circulation pipe (102) is arranged on one side of the main body bin (101), a second circulation pipe (103) is arranged on the other side of the main body bin (101), and the main body bin (101) is communicated with the liquid storage bin (5) through the first circulation pipe (102) and the second circulation pipe (103) respectively.
2. The soldering apparatus for electronic components of a computer motherboard according to claim 1, wherein: a one-way valve (11) is further arranged in the second flow pipe (103), and the one-way valve (11) prevents backflow.
3. The soldering apparatus for electronic components of a computer motherboard according to claim 2, wherein: the liquid storage bin (5) is further provided with a positioning block (12), and the main body bin (101) is slidably arranged on the liquid storage bin (5) through the positioning block (12).
4. A soldering apparatus for electronic components of a computer motherboard according to claim 3, wherein: the liquid storage bin (5) is also provided with an adjusting mechanism (13), the adjusting mechanism (13) is provided with two groups, and the two positioning blocks (12) are respectively arranged on the two adjusting mechanisms (13);
The adjusting mechanism (13) comprises an adjusting groove (131) formed in the liquid storage bin (5), an adjusting block (132) is arranged in the adjusting groove (131) in a sliding mode, and the positioning block (12) is installed on the adjusting block (132).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311488312.7A CN117324712B (en) | 2023-11-08 | 2023-11-08 | Soldering equipment for electronic components of computer main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311488312.7A CN117324712B (en) | 2023-11-08 | 2023-11-08 | Soldering equipment for electronic components of computer main board |
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| Publication Number | Publication Date |
|---|---|
| CN117324712A CN117324712A (en) | 2024-01-02 |
| CN117324712B true CN117324712B (en) | 2024-05-10 |
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| CN202311488312.7A Active CN117324712B (en) | 2023-11-08 | 2023-11-08 | Soldering equipment for electronic components of computer main board |
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| CN (1) | CN117324712B (en) |
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| DE4314027A1 (en) * | 1992-05-08 | 1993-11-11 | Helmut Ing Kroes | Soldering head for use in modular positioning systems - comprises at least one soldering iron and solder feed movable on vertical axis and rotatable on same axis by means of adjustment drive motors |
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| KR20120045256A (en) * | 2010-10-29 | 2012-05-09 | 장세호 | The liquid solder a fixed quantity supply a valve of liquid soldering equipment |
| CN105904050A (en) * | 2016-06-13 | 2016-08-31 | 孙玉荣 | Jet welding device adjustable in nozzle width |
| CN107470734A (en) * | 2017-08-04 | 2017-12-15 | 四川建筑职业技术学院 | A kind of precise positioning Soldering machine and control system based on DSP |
| CN110340481A (en) * | 2018-04-02 | 2019-10-18 | 江苏盟星智能科技有限公司 | A kind of Soldering machine tin feeding device and method of controlling air intake |
| CN111715966A (en) * | 2020-06-24 | 2020-09-29 | 深圳市嘉鸿宝科技有限公司 | Soldering bit contact type automatic tin soldering device |
| CN111673227A (en) * | 2020-07-03 | 2020-09-18 | 江西奥普照明有限公司 | Automatic tin supplementing machine for LED lamp strip |
| CN213104981U (en) * | 2020-09-16 | 2021-05-04 | 苏州鸿七威光电科技有限公司 | Feeding device for automatic wire feeding soldering |
| CN218253305U (en) * | 2022-08-29 | 2023-01-10 | 深圳市科谱森精密技术有限公司 | Automatic tin liquid level stabilizing device |
| CN116140740A (en) * | 2023-04-07 | 2023-05-23 | 宝应浚丰电子有限公司 | Electronic product tin soldering machine capable of avoiding tin piling |
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