CN117320418A - Heat radiation structure and protective housing - Google Patents

Heat radiation structure and protective housing Download PDF

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Publication number
CN117320418A
CN117320418A CN202311598877.0A CN202311598877A CN117320418A CN 117320418 A CN117320418 A CN 117320418A CN 202311598877 A CN202311598877 A CN 202311598877A CN 117320418 A CN117320418 A CN 117320418A
Authority
CN
China
Prior art keywords
substrate
heat dissipation
electrodes
fluid
flow channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311598877.0A
Other languages
Chinese (zh)
Inventor
李文栋
张泽武
汪东林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Magic Cube Digital Technology Co ltd
Original Assignee
Shenzhen Magic Cube Digital Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Magic Cube Digital Technology Co ltd filed Critical Shenzhen Magic Cube Digital Technology Co ltd
Priority to CN202311598877.0A priority Critical patent/CN117320418A/en
Publication of CN117320418A publication Critical patent/CN117320418A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/21—Combinations with auxiliary equipment, e.g. with clocks or memoranda pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat radiation structure and a protective shell, wherein the heat radiation structure comprises a heat radiation substrate provided with a flow channel, fluid which is contained in the flow channel and can circularly flow in the flow channel, a magnetic part which is arranged on the heat radiation substrate and can generate a magnetic field, and a conductive element which is arranged on the heat radiation substrate, wherein the fluid passes through the magnetic field, and the conductive element is contacted with the fluid. When the conductive element is electrified, the current is transferred to the fluid, and the fluid can flow through the magnetic field generated by the magnetic element, so that ampere force can be formed under the action of the magnetic field to drive the fluid to circularly flow in the flow channel. The heat radiation structure drives fluid by utilizing ampere force generated by the matching of the conductive element, the magnetic element and the fluid, and a pump is not needed to be used for providing power.

Description

Heat radiation structure and protective housing
Technical Field
The invention relates to the technical field of mobile phone accessories, in particular to a connecting structure and an electronic equipment bracket.
Background
With the continuous development of chip technology, the size of the chip is smaller and smaller, the computing power and performance of the chip are larger and larger, and the high-computing power and high-performance chip can easily generate a large amount of heat during working, and the computing power and performance of the chip can be influenced under a high-temperature environment and can possibly cause damage to the chip after working under the high-temperature environment for a long time, so that the heat dissipation of the chip is particularly important.
In electronic devices with larger volumes such as computers, a fan is generally arranged to radiate heat of a chip, and for better radiating effect, a water cooling radiating system is developed, a pump is utilized to drive water in the radiating system to circularly flow, heat can be taken away in the flowing process of the water, and the fan is used for radiating the heat of the water, so that the effect of reducing the temperature of the chip is achieved.
However, the fan and the water cooling heat dissipation system are relatively large in volume and are usually used for electronic equipment with relatively large volume such as a computer, and for electronic equipment or accessories with relatively small volume such as a mobile phone, a mobile power supply and a wireless charger, elements for heat dissipation such as a fan and a water pump are limited in volume, are difficult to integrate inside, and have obvious limitations in use occasions.
Disclosure of Invention
In view of the above, the present invention is directed to an improved heat dissipation structure and a protection shell, so as to solve the problem that the use of heat dissipation elements such as fans and water pumps has obvious limitations.
In one aspect, the present application provides a heat dissipation structure, including:
a heat dissipation substrate provided with a flow channel;
a fluid received in the flow channel and capable of circulating in the flow channel;
the magnetic piece is arranged on the radiating base body and can generate a magnetic field, and the fluid passes through the magnetic field;
and the conductive element is arranged on the heat dissipation substrate and is in contact with the fluid.
In some embodiments, the conductive element comprises two electrodes of opposite polarity, the two electrodes being spaced apart opposite and both in contact with the fluid.
In some embodiments, two of the electrodes are located outside of the flow channel, the flow channel passing between the two electrodes.
In some embodiments, two opposite sides of the heat dissipation substrate are respectively provided with a mounting groove communicated with the flow channel, and two electrodes are respectively mounted in the two mounting grooves and are in sealing fit with the heat dissipation substrate.
In some embodiments, the inner wall of the mounting groove is provided with a protruding part, and the electrode is connected with the protruding part and positioned at one side of the protruding part away from the flow channel.
In some embodiments, a power supply is arranged on the heat dissipation substrate, and the two electrodes are respectively and electrically connected with the positive electrode and the negative electrode of the power supply; or alternatively
And a wireless receiving coil is arranged in the heat dissipation base body, and the two electrodes are respectively and electrically connected with the wireless receiving coil.
In some embodiments, the number of the magnetic pieces is two, the two magnetic pieces are oppositely arranged at intervals, the magnetism of two sides, which are close to each other, of the two magnetic pieces is opposite, and the magnetic field is formed between the two magnetic pieces.
In some embodiments, the conductive element includes two electrodes with opposite polarities and arranged at intervals, the two electrodes are located between the two magnetic pieces, and the interval direction of the two electrodes is perpendicular to the interval direction of the two magnetic pieces.
In some embodiments, the heat dissipation substrate comprises a first substrate and a second substrate which are arranged in a stacked manner, and the flow channel is arranged on one side of the first substrate facing the second substrate and/or one side of the second substrate facing the first substrate.
On the other hand, the application also provides a protective housing, including the backplate with the backplate encloses the frame that closes and form accommodation space, the backplate is heat radiation structure as above, perhaps, be equipped with heat radiation structure as above on the backplate.
According to the heat dissipation structure provided by the invention, when the conductive element is electrified, the current is transferred to the fluid, and the fluid can flow through the magnetic field generated by the magnetic element, so that ampere force can be formed under the action of the magnetic field, and the ampere force drives the fluid to circularly flow in the flow channel. In the flowing process of the fluid, the heat of the area with relatively high temperature can be driven to the area with relatively low temperature, so that the effect of balancing the whole temperature is realized, the temperature of the high-temperature area is reduced, the heat of the high-temperature area is transferred to the low-temperature area, and the heat dissipation area can be increased, so that the heat dissipation effect is enhanced. Meanwhile, the heat dissipation structure drives fluid by utilizing ampere force generated by the cooperation of the conductive element, the magnetic element and the fluid, a pump is not needed to be used for providing power, the magnetic element and the conductive element are simpler in structure and smaller in volume, the heat dissipation structure is applicable to a scene with smaller installation space, and the applicable scene of the heat dissipation structure is widened.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the invention;
FIG. 2 is an exploded schematic view of the heat dissipating structure shown in FIG. 1;
FIG. 3 is a cross-sectional view of the heat dissipating structure shown in FIG. 1;
fig. 4 is a schematic structural diagram of a protective case according to an embodiment of the invention.
In the figure: 10. a heat dissipation structure; 12. a heat-dissipating substrate; 14. a magnetic member; 18. a flow passage; 20. a first substrate; 22. a second substrate; 24. an electrode; 26. a mounting groove; 28. a protruding portion; 30. a power supply; 31. a receiving groove; 32. a protective shell; 34. a frame; 36. an accommodating space.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
It should be noted that, in the embodiments of the present invention, all directional indicators (such as up, down, left, right, front, back, inner, outer, top, bottom … …) are merely used to explain the relative positional relationship between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators correspondingly change.
It will also be understood that when an element is referred to as being "fixed" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Referring to fig. 1 to 3, a heat dissipation structure 10 according to an embodiment of the invention is used for electronic equipment accessories such as a protection shell and a mobile power supply, and the heat dissipation structure 10 includes a heat dissipation substrate 12, a fluid (not shown), a magnetic member 14 and a conductive element.
The heat dissipation substrate 12 is provided with a flow channel 18, fluid is contained in the flow channel 18 and can circulate in the flow channel 18, and the fluid has the effects of electric conduction and heat conduction, namely, the fluid is electric conduction and heat conduction fluid, when flowing in the flow channel 18, the temperature of a region with relatively high temperature of the heat dissipation structure 10 can be transferred to a region with relatively low temperature, the effect of uniform temperature is realized, the temperature of a high temperature region is reduced, and meanwhile, the heat dissipation area is increased, so that the heat dissipation effect is enhanced.
The specific shape of the heat dissipation substrate 12 is not limited, and in this embodiment, the heat dissipation substrate 12 has a plate-like structure, and its outer surface is planar so as to be in contact with a heat source.
The specific kind of the fluid is not limited as long as it can perform the functions of electric conduction and heat conduction, such as water.
In this embodiment, the heat dissipation substrate 12 includes a first substrate 20 and a second substrate 22, where the first substrate 20 and the second substrate 22 are stacked and sealed, and the side of the first substrate 20 facing the second substrate 22 and the side of the second substrate 22 facing the first substrate 20 are both provided with the channels 18, that is, the side of the first substrate 20 facing the second substrate 22 is provided with the partial channels 18, the side of the second substrate 22 facing the first substrate 20 is also provided with the partial channels 18, and the partial channels 18 on the first substrate 20 and the partial channels 18 on the second substrate 22 are identical in structure, and when the first substrate 20 and the second substrate 22 are stacked together, the partial channels 18 on the first substrate 20 and the partial channels 18 on the second substrate 22 are mutually communicated and spliced to form the complete channels 18. The heat dissipation substrate 12 is divided into the first substrate 20 and the second substrate 22, a part of the flow channel 18 can be processed on the first substrate 20 and the second substrate 22, and then the first substrate 20 and the second substrate 22 are assembled together to form a complete flow channel 18, so that the difficulty of processing the flow channel 18 in the heat dissipation substrate 12 can be reduced.
In another embodiment, the flow channel may be disposed on a side of the first substrate facing the second substrate, or may be disposed on a side of the second substrate facing the first substrate.
The flow channel 18 extends at least partially in a serpentine shape to increase the length of the flow channel 18 and to increase the area through which it flows through the heat dissipating structure 10 to enhance the heat dissipation.
The magnetic element 14 is mounted on the heat dissipating substrate 12 and is capable of generating a magnetic field through which fluid passes, i.e., the magnetic field generated by the magnetic element 14 as the fluid circulates in the flow channel 18. A conductive element is mounted to the heat dissipating substrate 12 and is positioned within the magnetic field, the conductive element being in contact with the fluid. When the conductive element is energized, current will pass along the conductive element to the fluid, and because the fluid portion is within the magnetic field created by the magnetic element 14, the current will create an ampere force when flowing within the magnetic field, which will push the fluid to flow within the flow channel 18. The magnetic element 14 and the conductive element have simpler structure and smaller volume compared with the mode of driving by using a pump by using the conductive element, the magnetic element 14 and the fluid matched with each other as power, and the heat dissipation structure 10 can be suitable for scenes with smaller installation space, such as a mobile phone, a mobile phone shell, a mobile power supply 30, a wireless charger and the like, and the use scene of the heat dissipation structure 10 is widened.
The specific type of the conductive element is not limited, and may be a wire or the electrode 24. In this embodiment, the conductive element comprises two electrodes 24 of opposite polarity, the two electrodes 24 being spaced apart opposite and both in contact with the fluid. During the flow of current from one electrode 24 to the other electrode 24, the electrically and thermally conductive element acts as a conductor, so that current flows in the fluid in a direction that is not in the same direction as the magnetic field, and so an ampere force is generated under the action of the magnetic field to drive the fluid to flow in the flow channel 18.
It will be appreciated that the two electrodes 24 may be located inside the flow channel 18 or outside the flow channel 18, as long as the fluid is able to contact the two electrodes 24. In this embodiment, the two electrodes 24 are located outside the flow channel 18, and the flow channel 18 passes between the two electrodes 24.
The opposite sides of the heat dissipation substrate 12 are respectively provided with a mounting groove 26 communicated with the flow channel 18, and the two electrodes 24 are respectively arranged in the two mounting grooves 26 and are in sealing fit with the heat dissipation substrate 12. The mounting groove 26 is recessed from the surface of the heat dissipating substrate 12 into communication with the flow channel 18 so that the electrode 24 can be mounted into the mounting groove 26 from the outside of the heat dissipating substrate 12 during assembly, facilitating the mounting of the electrode 24.
Specifically, the first substrate 20 and the second substrate 22 are provided with mounting grooves 26 in a penetrating manner, one electrode 24 is mounted in the mounting groove 26 of the first substrate 20 and is in sealing fit with the first substrate 20, and the other electrode 24 is mounted in the mounting groove 26 of the second substrate 22 and is in sealing fit with the second substrate 22.
The sealing method between the electrode 24 and the heat dissipation substrate 12 is not limited, and for example, the electrode 24 may be fixed to the heat dissipation substrate 12 by waterproof adhesive, so as to form a sealing effect.
The inner wall of the mounting groove 26 is provided with a protrusion 28, and the electrode 24 is connected to the protrusion 28 and located on a side of the protrusion 28 away from the flow channel 18. When the electrode 24 is mounted to the mounting groove 26 from the outside of the heat dissipation substrate 12, the electrode 24 will contact with the protruding portion 28, and the protruding portion 28 can play a role in supporting the electrode 24, and meanwhile, the contact area with the electrode 24 is increased, so that the fixing operation is facilitated.
Specifically, the opposite inner walls of each mounting groove 26 are provided with protrusions 28, respectively, and the protrusions 28 extend toward each other and are spaced apart a distance so that the electrodes 24 can be brought into contact with the fluid in the flow channels 18.
The specific manner of supplying power to the heat dissipation structure 10 is not limited, and may be through a built-in power supply assembly or through an external power supply. In the present embodiment, the power source 30 is mounted on the heat dissipation substrate 12, and the two electrodes 24 are electrically connected to the positive and negative electrodes of the power source 30, respectively, so that the polarities of the two electrodes 24 are opposite.
In another embodiment, when the heat dissipation structure is used for electronic equipment accessories such as a mobile phone shell, a wireless receiving coil can be installed in the heat dissipation base body, so that the two electrodes are respectively and electrically connected with the wireless receiving coil, and the wireless receiving coil in the heat dissipation base body is matched with a wireless transmitting coil in the electronic equipment, so that the electronic equipment is utilized to supply power to the heat dissipation structure.
The specific number of magnetic members 14 is not limited, for example, one or more, as long as a magnetic field can be formed. In this embodiment, the number of the magnetic members 14 is two, the two magnetic members 14 are disposed opposite to each other at a distance, the two magnetic members 14 are opposite to each other, a magnetic field is formed between the two magnetic members 14, and fluid passes through between the two magnetic members 14. The two sides of the two magnetic pieces 14 close to each other are opposite in magnetism, so that the directions of magnetic fields generated by the two magnetic pieces 14 in the area between the two magnetic pieces are the same, the magnetic field strength is increased, and therefore when fluid passes through the space between the two magnetic pieces 14, larger ampere force can be generated to drive the fluid to flow at a faster speed, the flow speed of the fluid is increased, and the heat dissipation effect is improved.
The two oppositely polarized electrodes 24 are positioned between the two magnetic elements 14 such that the direction of separation of the two electrodes 24 is perpendicular to the direction of separation of the two magnetic elements 14, and thus, when a current flows from one electrode 24 to the other electrode 24 through the fluid, the direction of flow of the current is perpendicular to the direction of the magnetic field generated by the magnetic elements 14, thereby generating an ampere force perpendicular to both the direction of the magnetic field and the direction of the current to drive the fluid to flow forward.
In the present embodiment, the heat dissipation base 12 is provided with a receiving groove 31, and the magnetic member 14 is received in the receiving groove 31. Specifically, the heat dissipation substrate 12 is provided with two receiving grooves 31 spaced apart from each other, each receiving groove 31 is provided with a magnetic member 14 therein, and the flow passage 18 passes through between the two receiving grooves 31 and is spaced apart from the two receiving grooves 31.
As shown in fig. 1 and fig. 4, the present invention further provides a protective case 32, which includes a back plate and a frame 34, wherein the back plate and the frame 34 enclose to form an accommodating space 36 for accommodating electronic devices, such as a mobile phone, a tablet, etc., and the back plate is the heat dissipation structure 10, that is, the heat dissipation substrate 12 of the heat dissipation structure 10 and the frame 34 enclose to form the accommodating space 36. When the electronic device is stored in the storage space 36, during the operation of the electronic device, a large amount of heat is generated at the chip position, such as the middle part, and relatively little or no heat is generated at the other parts, such as the top and the bottom, the electronic device transfers the generated heat to the heat dissipation structure 10, and causes the heat dissipation substrate 12 to have a relatively higher temperature near the electronic device chip, while the rest parts have a relatively lower temperature, the heat dissipation structure 10 drives fluid to flow in the flow channel 18 through the ampere force generated by the cooperation of the magnetic element 14, the conductive element and the conductive element, and the fluid can transfer the heat at the relatively higher temperature region on the heat dissipation substrate 12 to the relatively lower temperature region in the flowing process, so that the effect of uniform temperature of the back plate is realized, the temperature of the relatively higher temperature region of the back plate is reduced, and the heat dissipation area of the back plate is increased, so that the heat dissipation effect is improved.
In another embodiment, the heat dissipation structure may be mounted on the back plate, and heat generated in the working process of the electronic device is transferred to the back plate first, and then transferred to the heat dissipation substrate of the heat dissipation structure by the back plate, so that the effect of uniform temperature and heat dissipation improvement can be achieved.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.

Claims (10)

1. A heat dissipation structure, comprising:
a heat dissipation substrate provided with a flow channel;
a fluid received in the flow channel and capable of circulating in the flow channel;
the magnetic piece is arranged on the radiating base body and can generate a magnetic field, and the fluid passes through the magnetic field;
and the conductive element is arranged on the heat dissipation substrate and is in contact with the fluid.
2. The heat dissipating structure of claim 1, wherein said conductive element comprises two electrodes of opposite polarity, said electrodes being spaced apart opposite and both in contact with said fluid.
3. The heat dissipating structure of claim 2, wherein two of said electrodes are located outside of said flow channel, said flow channel passing between two of said electrodes.
4. A heat dissipating structure according to claim 3, wherein said heat dissipating substrate is provided with mounting grooves communicating with said flow passages on opposite sides thereof, and said electrodes are mounted in said mounting grooves and are in sealing engagement with said heat dissipating substrate.
5. The heat dissipating structure of claim 4, wherein the inner wall of the mounting groove is provided with a protrusion, and the electrode is connected to the protrusion and located on a side of the protrusion away from the flow path.
6. The heat dissipation structure as defined in claim 2, wherein a power supply is provided on the heat dissipation substrate, and two electrodes are electrically connected to a positive electrode and a negative electrode of the power supply, respectively; or alternatively
And a wireless receiving coil is arranged in the heat dissipation base body, and the two electrodes are respectively and electrically connected with the wireless receiving coil.
7. The heat dissipation structure according to claim 1, wherein the number of the magnetic pieces is two, the two magnetic pieces are arranged oppositely at intervals, the two sides of the two magnetic pieces, which are close to each other, are opposite in magnetism, and the magnetic field is formed between the two magnetic pieces.
8. The heat dissipating structure of claim 7, wherein said conductive element comprises two electrodes of opposite polarity and disposed in spaced opposition, said two electrodes being disposed between said two magnetic members with a spacing direction of said two electrodes being perpendicular to a spacing direction of said two magnetic members.
9. The heat dissipating structure of claim 1, wherein the heat dissipating substrate comprises a first substrate and a second substrate that are stacked, and the flow channel is provided on a side of the first substrate facing the second substrate and/or a side of the second substrate facing the first substrate.
10. A protective housing, which is characterized by comprising a back plate and a frame surrounding the back plate to form a containing space, wherein the back plate is a heat dissipation structure as claimed in any one of claims 1-9, or the back plate is provided with the heat dissipation structure as claimed in any one of claims 1-9.
CN202311598877.0A 2023-11-28 2023-11-28 Heat radiation structure and protective housing Pending CN117320418A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311598877.0A CN117320418A (en) 2023-11-28 2023-11-28 Heat radiation structure and protective housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311598877.0A CN117320418A (en) 2023-11-28 2023-11-28 Heat radiation structure and protective housing

Publications (1)

Publication Number Publication Date
CN117320418A true CN117320418A (en) 2023-12-29

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CN202311598877.0A Pending CN117320418A (en) 2023-11-28 2023-11-28 Heat radiation structure and protective housing

Country Status (1)

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CN (1) CN117320418A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009137158A1 (en) * 2008-05-06 2009-11-12 Rockwell Collins, Inc. System and method for liquid cooling of components
CN101771127A (en) * 2008-12-30 2010-07-07 中国科学院理化技术研究所 LED light-emitting module with liquid metal heat dispersion heat sink
CN113009752A (en) * 2021-03-31 2021-06-22 峰米(北京)科技有限公司 Magnetomotive flexible circulating heat dissipation system and heat dissipation device
CN113438868A (en) * 2021-06-29 2021-09-24 云南靖创液态金属热控技术研发有限公司 Ultrathin heat dissipation device and heat dissipation method
CN217160339U (en) * 2022-04-02 2022-08-09 维沃移动通信有限公司 Cooling device and electronic apparatus
CN219536643U (en) * 2022-11-18 2023-08-15 阳光电源股份有限公司 Liquid cooling plate, chassis and electric equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009137158A1 (en) * 2008-05-06 2009-11-12 Rockwell Collins, Inc. System and method for liquid cooling of components
CN101771127A (en) * 2008-12-30 2010-07-07 中国科学院理化技术研究所 LED light-emitting module with liquid metal heat dispersion heat sink
CN113009752A (en) * 2021-03-31 2021-06-22 峰米(北京)科技有限公司 Magnetomotive flexible circulating heat dissipation system and heat dissipation device
CN113438868A (en) * 2021-06-29 2021-09-24 云南靖创液态金属热控技术研发有限公司 Ultrathin heat dissipation device and heat dissipation method
CN217160339U (en) * 2022-04-02 2022-08-09 维沃移动通信有限公司 Cooling device and electronic apparatus
CN219536643U (en) * 2022-11-18 2023-08-15 阳光电源股份有限公司 Liquid cooling plate, chassis and electric equipment

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